CN117308905B - Hemispherical harmonic oscillator with windowing structure for gyroscope and manufacturing method - Google Patents
Hemispherical harmonic oscillator with windowing structure for gyroscope and manufacturing method Download PDFInfo
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- CN117308905B CN117308905B CN202311620784.3A CN202311620784A CN117308905B CN 117308905 B CN117308905 B CN 117308905B CN 202311620784 A CN202311620784 A CN 202311620784A CN 117308905 B CN117308905 B CN 117308905B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000012986 modification Methods 0.000 claims abstract description 12
- 230000004048 modification Effects 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 16
- 238000005260 corrosion Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 230000007797 corrosion Effects 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims description 3
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 2
- 239000011324 bead Substances 0.000 claims 3
- 230000005540 biological transmission Effects 0.000 abstract description 10
- 238000009966 trimming Methods 0.000 abstract description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000010884 ion-beam technique Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
- G01C19/5691—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional vibrators, e.g. wine glass-type vibrators
Abstract
The invention provides a hemispherical resonator with a windowing structure for a gyroscope and a manufacturing method thereof, belonging to the technical field of precision manufacturing of resonant gyroscopes, and comprising a hemispherical shell, wherein an inner column is arranged in the center of the hemispherical shell, the edge of the end part of the hemispherical shell is a lip edge, the inner wall of the hemispherical shell is an inner spherical surface, an inner corner is arranged at the intersection of the inner spherical surface and the inner column, and the windowing structure is arranged on the connecting area of the lip edge and the inner column; and vibration connecting strips are arranged between adjacent windowing structures, and adjacent annular spherical shells on the lip edges are mass sensitive rings. In the aspect of manufacturing a windowing structure, ultrafast laser is adopted to carry out local modification treatment on a windowing area. According to the invention, a windowing structure is designed in the connection area between the hemispherical harmonic oscillator lip edge and the inner column in a mode of cutting off the vibration energy transmission path, so that the transmission of energy to the whole supporting rod is reduced, the supporting loss is reduced, the accuracy of the gyroscope is improved, the influence of unbalanced mass on the supporting loss is reduced, the subsequent trimming difficulty is reduced, and the mass production is easy to realize.
Description
Technical Field
The invention belongs to the technical field of precision manufacturing of resonant gyroscopes, and particularly relates to a hemispherical resonator with a windowing structure for a gyroscope and a manufacturing method thereof.
Background
Hemispherical resonators are the core sensitive components of hemispherical resonator gyroscopes, typically made of non-conductive fused silica glass SiO 2 Ultra-precisely processing. The four-wave vibration of the working mode of the resonant gyroscope needs to be completed by a hemispherical resonator with a perfect symmetrical spherical shell, however, the spherical shell of the formed resonator is difficult to achieve 100% perfect symmetry due to the limitation of processing precision, and the imperfect symmetry is actually unbalanced mass.
During vibration of the hemispherical resonator, the presence of the unbalanced mass causes the vibrational energy of the hemispherical shell to be transferred through the inner post to the base, thereby causing support loss. When the hemispherical harmonic oscillator generates bending vibration, internal stress and internal moment are generated in the anchor point support, and the energy of the hemispherical harmonic oscillator is transmitted to the anchor point support due to the fact that the internal stress and the internal moment do work, and then part of energy is further transmitted to the base through the anchor point support to cause loss. The support loss is mainly affected by the 1-3 harmonic mass error in the mass unbalance, and as the relative mass error increases, the support loss increases, and the quality factor decreases, which is embodied as the coupled vibration of the support bar (including the inner column and the outer column).
In order to reduce the support loss of the gyroscope, the unbalanced mass is removed for 1-3 times by adopting an ion beam or laser trimming technology, so that the equivalent perfect symmetry of the hemispherical shell is realized, and the high-precision resonant gyroscope is further obtained. However, the current 1-3 times of harmonic trimming is not mature, lacks related theoretical guidance, has low detection precision and long trimming period, and related theory and technology implementation still need to be explored and researched, so that the support loss of the resonant gyroscope is larger, and the precision of the resonant gyroscope is difficult to improve. Meanwhile, the efficiency of the 1-3 times resonance mass unbalance removal process based on the laser/ion beam is low, and the process becomes a technical bottleneck for research and development, manufacturing and mass production of the resonance gyro, and the existing laser/ion beam leveling technology is difficult to support high-precision and future mass production application of the resonance gyro.
It is found that the mass unbalance near the hemispherical shell lip edge caused by imperfect symmetry has a great influence on the hemispherical resonator supporting loss because the hemispherical resonator has a complex thin-wall spherical shell structure. During vibration, vibration caused by unbalanced mass near the lip edge is transmitted to the inner column through the inner spherical surface and the inner fillets, and the further the inner spherical surface is away from the lip edge, the smaller the vibration transmission caused by the unbalanced mass is.
In order to solve the problems, the invention provides a method for repairing and adjusting the hemispherical resonator by cutting off the energy dissipation transmission path in the structural design and manufacturing stage of the hemispherical resonator starting from the vibration transmission path.
Disclosure of Invention
The invention aims to solve the problem of providing a hemispherical resonator with a windowing structure for a gyroscope and a manufacturing method thereof, wherein a vibration energy transmission path is cut off as an entry point, the windowing structure is designed in a connection area between the lip edge of the hemispherical resonator and an inner column, and the windowing structure is designed and manufactured, so that the transmission of energy to the whole supporting rod is reduced, the purpose of reducing supporting loss is achieved, and further the low-loss vibration resonator is obtained.
In order to solve the technical problems, the invention adopts the following technical scheme: the hemispherical resonator with the windowing structure for the gyroscope comprises a hemispherical shell, wherein an inner column is arranged in the center of the hemispherical shell, the edge of the end part of the hemispherical shell is a lip edge, the inner wall of the hemispherical shell is an inner spherical surface, and an inner fillet is arranged at the intersection of the inner spherical surface and the inner column; a window opening structure is arranged on the connection area of the lip edge and the inner column; the shape of the windowing structure is a quadrilateral area surrounded by two wefts which are separated by a certain angle and two warps with different heights, vibration connecting strips are arranged between every two adjacent windowing structures, the adjacent annular spherical shells are provided with lips, the arc length of each mass sensitive ring along the weft direction is the width of each mass sensitive ring, the joint of each lip edge and the inner spherical surface is taken as an initial line, and the width of each mass sensitive ring extends along the radial line of the spherical surface to the direction of the inner round angle.
Further, the outer wall of the hemispherical shell is an outer spherical surface, a bullnose is arranged at the intersection of the outer spherical surface and the inner column, and the connecting area comprises the fillet, the bullnose and the hemispherical shell.
Further, the windowing structures are symmetrically and equidistantly distributed around the axis of the hemispherical shell, and the number of the windowing structures is set to be an odd number.
Further, the window opening structure is divided into a full-opening window structure and a half-opening window structure, wherein the full-opening window structure is formed by completely removing thick materials on the inner wall of a quadrangular region surrounded by two wefts with a certain angle and two warps with different heights on the hemispherical shell; the semi-open window structure is characterized in that thick materials on the inner wall of a quadrilateral area surrounded by two wefts with a certain angle and two warps with different heights on the hemispherical shell are thinned.
Further, for the half-open window structure, a continuous circular cutting belt is formed when the thickness of the vibration connecting strip is consistent with the thickness of the half-open window structure.
Further, the wall thickness form of the connection region is divided into an equal wall thickness structure and a variable wall thickness structure; when the connecting area is of a variable wall thickness structure, the wall thickness at the junction of the inner spherical surface and the fillet is the thinnest; when the connecting area is of an equal wall thickness structure, the wall thickness of the hemispherical shell is consistent, and the wall thickness of the inner corners and the outer corners is larger than that of the hemispherical shell.
Further, the initial warp of the windowing structure is the boundary line between the hemispherical shell and the fillet, and the final warp of the windowing structure is the final warp of the mass-sensitive ring.
Further, the radius of the inner spherical surface is 7-15 mm; the numerical value of the width of the mass sensitive ring is distributed between the radial arc length of the 1/4 inner spherical surface and the radial arc length of the 3/4 inner spherical surface; the wall thickness of the connecting area is distributed between 0.5 and 1mm; the included angle of two boundary wefts of the vibration connecting strip in the plane of the lip edge is 5-30 degrees; the wall thickness of the hemispherical shell is distributed between 0.3 and 1mm.
The invention also provides a manufacturing method of the hemispherical resonator with the windowing structure for the gyroscope, which comprises the following steps:
s1, placing a hemispherical harmonic oscillator in a windowing mold;
s2, selecting a material which can be removed and solidified to fill the hemispherical shell of the hemispherical resonator;
s3, modifying the window structure by using ultra-fast laser, wherein when the ultra-fast laser locally modifies the window area, the laser modification starts from the outer spherical surface;
s4, corroding the modified area, and carrying out corrosion treatment in an acid solution under the action of ultrasonic waves;
s5, taking out the windowing mold from the acid solution, rapidly cleaning the windowing part of the hemispherical resonator and the windowing mold, and removing residual corrosive liquid;
s6, dissolving the filler in the windowing mould;
s7, taking out the hemispherical harmonic oscillator, and carrying out ultrasonic cleaning on the hemispherical harmonic oscillator.
Further, in step S1, the material of the windowing mold is a corrosion-resistant organic material, the windowing mold includes a first mold cavity and a second mold cavity, the first mold cavity is located above the second mold cavity, the first mold cavity and the second mold cavity are coaxially arranged, the height of the windowing mold is at least 5mm greater than the height of the harmonic oscillator, the diameter of the first mold cavity is at least 10mm greater than the outer diameter of the hemispherical harmonic oscillator, the diameter of the second mold cavity is smaller than the diameter of the first mold cavity, the first mold cavity and the second mold cavity form a cavity with a T-shaped section, the diameter and the height of the second mold cavity are determined by the size and the position of the windowing structure, and the hemispherical harmonic oscillator is erected at a boss at the intersection position of the first mold cavity and the second mold cavity.
By adopting the technical scheme, the invention has the following beneficial effects:
according to the invention, a windowing structure is designed in the connection area of the lip edge of the hemispherical resonator and the inner column in a mode of cutting off the vibration energy transmission path, so that the transmission of energy to the whole supporting rod is reduced, the supporting loss is reduced, and the purposes of improving the Q value (quality factor) of the hemispherical resonator and the accuracy of the gyroscope are achieved.
The invention breaks away from the traditional mode of adjusting by means of ion beams or laser near the lip edge, and reduces the supporting loss from the structural design angle. Aiming at the mass unbalance generated in the precise grinding and polishing manufacturing process, the ultra-fast laser modification etching technology is adopted for manufacturing the windowing structure on the hemispherical resonator spherical shell for the first time, so that the vibration loss of the hemispherical resonator gyroscope is reduced, and the manufacturing efficiency of the gyroscope is improved. The invention not only reduces the influence of unbalanced mass on supporting loss and reduces the difficulty of subsequent trimming, but also is easy to realize batch production.
Drawings
The advantages and the manner of carrying out the invention will become more apparent from the following detailed description, taken in conjunction with the accompanying drawings, in which the content shown is meant to illustrate, but not to limit, the invention in any sense, and wherein:
FIG. 1 is a schematic diagram of the characteristic parameters of the hemispherical resonator with equal wall thickness.
Fig. 2 is a schematic diagram of characteristic parameters of a hemispherical resonator with variable wall thickness.
Fig. 3 is a schematic diagram of a hemispherical resonator windowing structure based on a change in width of a mass sensitive ring.
Fig. 4 is a top view of fig. 3 in accordance with the present invention.
Fig. 5 is a schematic diagram of a hemispherical resonator windowing structure based on vibration connection bar width variation.
Fig. 6 is a top view of fig. 5 in accordance with the present invention.
Fig. 7 is a schematic diagram of a half-open window structure of a hemispherical resonator based on thickness variation.
Fig. 8 is a top view of fig. 7 in accordance with the present invention.
Fig. 9 is a schematic diagram of a window opening structure of a hemispherical resonator in a high impact vibration environment according to the present invention.
Fig. 10 is a top view of fig. 9 in accordance with the present invention.
Fig. 11 is a schematic structural view of a windowing mold according to the present invention.
Fig. 12 is a schematic structural diagram of the hemispherical resonator of the present invention after filling in a windowing mold.
Fig. 13 is a schematic diagram of a process of laser modification treatment of hemispherical resonators according to the present invention.
Fig. 14 is a schematic diagram of a hemispherical resonator formed into a half-windowed structure after the etching process of the present invention.
In the figure:
1. a lip edge; 2. an inner column; 3. an inner spherical surface; 4. a fillet; 5. a hemispherical shell; 6. a windowing structure; 7. an outer spherical surface; 8. a bullnose; 9. vibrating the connecting bar; 10. a windowing mold; 11. a first mold cavity; 12. a second mold cavity; 13. a mass sensitive ring.
Detailed Description
As shown in fig. 1 to 10, the hemispherical resonator with a windowing structure for a gyroscope comprises a hemispherical shell 5, wherein an inner column 2 is arranged in the center of the hemispherical shell 5, the edge of the end part of the hemispherical shell 5 is provided with a lip edge 1, the inner wall of the hemispherical shell 5 is provided with an inner spherical surface 3 (the radius of the inner spherical surface 3 is 7-15 mm), and the intersection part of the inner spherical surface 3 and the inner column 2 is provided with an inner fillet 4; the outer wall of the hemispherical shell 5 is provided with an outer spherical surface 7, and the intersection of the outer spherical surface 7 and the inner column 2 is provided with an outer fillet 8;
the inner corners 4, the outer fillets 8 and the hemispherical shells 5 are the connection areas of the lip edges 1 and the inner columns 2, and the connection areas are provided with windowing structures 6;
the shape of the windowing structure 6 is a quadrilateral area surrounded by two wefts which are separated by a certain angle and two warps with different heights, the windowing structures 6 are symmetrically and equidistantly distributed around the axis of the hemispherical shell 5, vibration connecting strips 9 are arranged between adjacent windowing structures 6, and the number of the windowing structures 6 is odd;
the window structure 6 is divided into a full-open window structure and a half-open window structure, wherein the full-open window structure is formed by completely removing thick materials on the inner wall of a quadrangular region surrounded by two wefts which are arranged on the hemispherical shell 5 and are at a certain angle and two warps with different heights; the semi-windowing structure is formed by thinning a thick material on the inner wall of a quadrangular area surrounded by two wefts which are arranged on the hemispherical shell 5 and are at a certain angle and two warps with different heights; in the half-open window structure, if the thickness of the vibration connecting strip 9 is reduced to be consistent with the half-open window structure, a continuous circular cutting belt is formed.
The intersection point of the lip edge 1 and the inner spherical surface 3 is a; the intersection point of the inner sphere 3 and the fillet 4 is b; the intersection point of the inner column 2 and the fillet 4 is c; the radial arc length of the inner sphere 3 is L ab The method comprises the steps of carrying out a first treatment on the surface of the The radial arc length of the fillet 4 is L cb 。
In the working process of the resonance gyro, the hemispherical harmonic oscillator is always in a four-amplitude vibration state, and the part 1 of the lip edge is the area with the largest amplitude and is most sensitive to mass unbalance;
when the mass non-uniformity takes the lip edge 1 as a starting point and extends along the spherical radial line to the point b of the direction of the inner round angle 4, the sensitivity of the hemispherical harmonic oscillator to the mass non-balance is reduced, so that 1-3 times of harmonic trimming is usually carried out near the lip edge 1, the annular spherical shell near the lip edge 1 of the hemispherical harmonic oscillator is called a mass sensitive ring 13, the circular arc length of the mass sensitive ring 13 along the weft direction is defined as the width m of the mass sensitive ring 13, the width m of the mass sensitive ring 13 takes the joint of the lip edge 1 and the inner spherical surface 3 as a starting line, the point b along the spherical radial line to the direction of the inner round angle extends, and the designed minimum value of the width m of the mass sensitive ring 13 is 1/4L ab The value of m can be distributed in (1/4~3/4) L ab 。
If there is no window structure 6, the value of m is L ab 。
The thickness of the hemispherical harmonic oscillator after precise grinding and polishing is generally distributed between 0.5 and 1mm, and the thickness form is divided into an equal-thickness structure and a variable-thickness structure.
As shown in fig. 2, for a variable wall thickness hemispherical resonator structure, an inner sphere L ab The wall thickness of the hemispherical shell 5 at the point b at the junction of the section and the fillet is the thinnest; as shown in fig. 1, for a hemispherical resonator structure of equal wall thickness structure, L ab The wall thickness of the segment hemispherical shell 5 is uniform. While the wall thickness of the hemispherical shell 5 at the fillet 4 and bullnose 8 is generally greater than L ab The wall thickness of the segment hemispherical shell 5.
Thus, as shown in fig. 3 and 4 (a in fig. 4 is a top view of a in fig. 3, b in fig. 4 is a top view of b in fig. 3), in order to reduce excessive removal of the mass sensitive ring 13 during etching of the fenestration 6, the starting meridian of the quadrangular fenestration 6 is designed as the boundary line between the hemispherical shell 5 and the fillet 4, and the boundary point is point b; the ending warp of the quadrangular windowing structure 6 is (1/4~3/4) L of the mass-sensitive ring 13 ab The starting warp and the ending warp of the quadrangular windowing structure 6 form two warps with different heights of the quadrangular windowing structure,
as shown in fig. 5 and 6, due to the existence of the windowing structure 6, the inner corners 4 of the hemispherical resonators are connected with the inner columns 2 through the vibration connecting strips 9 and the mass sensitive rings 13, the included angles of the vibration connecting strips 9 are represented by θ, θ is the included angle of two boundary wefts of the vibration connecting strips 9 in the plane of the lip edge 1, the area between two adjacent vibration connecting strips 9 belongs to the windowing structure 6, the boundary wefts on two adjacent vibration connecting strips 9 mutually close to each other belong to two wefts of the windowing structure 6 on the hemispherical shell 5, which are separated by a certain angle, and the value of θ ranges from 5 ° to 30 °, preferably from 10 ° to 15 °. If the value of theta is too small, the width of the vibration connecting strip 9 is too thin near the fillet 4, so that the problem of fracture is easy to occur, and the impact vibration reliability is poor; if the value θ is too large, the vibration transmission area increases, resulting in an increase in vibration loss.
The number of the vibration connecting strips 9 is set to be n, and the n vibration connecting strips 9 divide the spherical surface of 360 degrees into n rows along the spherical surface meridian in a circumferential equally dividing way. An odd number of vibration connection bars 9 (n is an odd number) with a certain width theta are used for connecting the mass sensitive ring 13 with the fillets 4. n can be odd number, and n can be 3, 5, 7, 9 and 11.
The wall thickness of the hemispherical shell 5 is set to d. For hemispherical harmonic oscillator with equal wall thickness, L ab The wall thickness of the segment hemispheric shell 5 is defined as d; for a hemispherical harmonic oscillator with variable wall thickness, L ab The wall thickness of the hemispherical shell 5 at point b where the segment meets the fillet 4, i.e. the wall thickness at the thinnest point, is defined as d. The value of d is generally distributed between 0.3 and 1mm.
As shown in fig. 7 and 8 (a in fig. 8 is a top view of a fig. 7, b in fig. 8 is a top view of b in fig. 7), the thickness of the windowing structure is defined as t, and according to the different value of t, the windowing structure can be divided into a full-windowing structure and a half-windowing structure, for the full-windowing structure, that is, the inner wall thick material of a quadrangular region surrounded by two wefts with a certain angle and two warps with different heights on the hemispherical shell 5 is removed completely, and the thickness t=0 of the windowing structure; for the half-windowing structure, namely, the thick material of the inner wall of a quadrangular area surrounded by two wefts with a certain angle and two warps with different heights on the half-spherical shell 5 is thinned, the thickness t= (0.1-0.8) d of the half-windowing structure is reduced.
In the half-cut structure, if the thickness of the vibration connecting bar 9 is reduced to be identical to the half-cut structure, a continuous annular cutting band is formed, and the half-cut structure of the annular cutting band is formed to have a thickness t= (0.1 to 0.5) d.
As shown in fig. 9 and 10, for high impact vibration environments, hemispherical harmonicsThe strength of the vibrator structure is particularly important, the initial warp design of the quadrilateral windowing structure 6 can be far away from the boundary line between the hemispherical shell 5 and the inner corner 4, far away from the boundary point b and move towards the lip of the hemispherical shell 5 along the direction of the point a of the 1, and the final warp of the quadrilateral windowing structure 6 is (1/4~3/4) L of the mass sensitive ring 13 ab The starting warp and the ending warp of the quadrangular fenestration structure 6 constitute two warp threads of different heights of the quadrangular fenestration structure. It is also possible to design a half-open window structure with reference to fig. 7 and 8.
In terms of manufacturing the windowing structure 6, the ultrafast laser is adopted to carry out local modification treatment on the windowing region, the chemical corrosion rate is high due to the fact that the damage of the modified region is large, and then the chemical corrosion method is utilized to realize rapid removal of materials in the modified region.
When the ultrafast laser carries out local modification treatment on the windowed area, the ultrafast laser is picosecond or femtosecond laser, and the focal length of the laser is adjusted to realize the modification treatment of quartz glass from the outside to the inside. For the fully-opened window structure, modifying the fully-opened window structure along the boundary line of the pattern of the fully-opened window structure by adopting laser, and then completely removing materials by adopting chemical corrosion treatment to form the fully-opened window structure; for the half-open window structure, laser is adopted to carry out surface scanning type modification along the pattern of the half-open window structure, the whole wall thickness direction is partially modified, and then chemical corrosion treatment is adopted to reduce the wall thickness of the pattern area, so that the half-open window structure is formed.
As shown in fig. 11 to 14, the present invention further provides a method for manufacturing a hemispherical resonator with a windowed structure for a gyroscope, including the steps of:
s1, as shown in fig. 11, a hemispherical resonator is placed in a windowing mold 10, a material of the windowing mold 10 is made of corrosion-resistant organic materials such as polytetrafluoroethylene, the windowing mold 10 comprises a first mold cavity 11 and a second mold cavity 12, the first mold cavity 11 is located above the second mold cavity 12, the first mold cavity 11 and the second mold cavity 12 are coaxially arranged, and parameters of the windowing mold 10 are as follows: height h of fenestration mold 10 1 At least 5mm greater than the height of the resonator, the diameter phi of the first mould cavity 11 f1 At least 10mm greater than the outer diameter of the hemispherical resonator, the diameter phi of the second mould cavity 12 f2 Smaller than the diameter of the first mould cavity 11φ f1 The first die cavity 11 and the second die cavity 12 form a cavity with a T-shaped section, and the diameter phi of the second die cavity 12 f2 And height h 2 The value of (2) depends on the size and position of the fenestration 6, i.e. the hemispherical resonator is mounted at the boss where the first cavity 11 and the second cavity 12 meet.
S2, as shown in FIG. 12, selecting an organic adhesive, paraffin or epoxy resin which can be removed and cured to fill the hemispherical shell 5 of the hemispherical resonator, preventing hydrofluoric acid from corroding an unpatterned area on the hemispherical shell, wherein the filling mode is that the inner part of the hemispherical shell 5 is completely filled, the outer part of the hemispherical shell is partially filled, the filling area of the outer part of the hemispherical shell depends on the windowing position, namely the first die cavity 11 and the inner part of the hemispherical resonator are completely filled, and the crystal glue 509 is recommended by filling materials preferentially.
S3, as shown in FIG. 13, modifying the window structure (a full-window structure or a half-window structure) by using ultra-fast laser, wherein when the ultra-fast laser locally modifies the window area, the ultra-fast laser is picosecond or femtosecond laser, and the femtosecond laser is recommended preferentially. The laser modification starts from the outer sphere 7, instead of the inner sphere 3,
for the full-open window structure, the thickness t=0 of the open window structure 6 is modified by ultrafast laser along the boundary line of the pattern of the open window structure 6, the focus of the laser in the thickness direction of the hemispherical resonator is controlled, the hemispherical resonator surface layer is scanned and focused layer by layer towards the inside of glass, and the step pitch is 0.05-0.1 mm;
for the half-open window structure, the ultra-fast laser is adopted to carry out area scanning type modification along the pattern of the open window structure 6, the whole wall thickness direction is partially modified, and the unmodified thickness t= (0.1-0.8) d.
S4, as shown in FIG. 14, the modified area is corroded, the corrosion treatment is carried out in 1% -10% hydrofluoric acid under the action of ultrasonic waves at the temperature of 30-60 ℃, the chemical corrosion rate of the area after laser induction is high, and a windowing or half-windowing structure can be formed rapidly, wherein the ultrasonic frequency is 80KHz;
and for the full-open window structure, under the action of hydrofluoric acid, the boundary line of the window structure pattern modified by the ultrafast laser is rapidly corroded to form the window structure.
And for the half-open window structure, under the action of hydrofluoric acid, rapidly corroding the pattern area of the half-open window structure modified by the ultrafast laser, and reducing the wall thickness of the pattern area of the half-open window structure to form the half-open window structure.
S5, taking out the windowing mold 10 from the hydrofluoric acid solution, and rapidly cleaning.
And (3) rapidly flushing the windowing part of the hemispherical resonator and the windowing die 10 by using flowing deionized water, removing residual corrosive liquid and preventing over-corrosion.
S6, dissolving the filler in the windowing mold 10.
If the filler is crystal glue 509, acetone is used for dissolution.
S7, taking out the hemispherical harmonic oscillator, and respectively ultrasonically cleaning the hemispherical harmonic oscillator in acetone, ethanol and deionized water for 15min.
The foregoing describes the embodiments of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by this patent.
Claims (10)
1. A hemispherical resonator with a windowed structure for a gyroscope, characterized in that: the inner wall of the hemispherical shell is an inner spherical surface, and the intersection of the inner spherical surface and the inner column is provided with a fillet; a window opening structure is arranged on the connection area of the lip edge and the inner column; the shape of the windowing structure is a quadrilateral area surrounded by two wefts which are separated by a certain angle and two warps with different heights, vibration connecting strips are arranged between every two adjacent windowing structures, the adjacent annular spherical shells are provided with lips, the arc length of each mass sensitive ring along the weft direction is the width of each mass sensitive ring, the joint of each lip edge and the inner spherical surface is taken as an initial line, and the width of each mass sensitive ring extends along the radial line of the spherical surface to the direction of the inner round angle.
2. The hemispherical resonator with a windowed structure for a gyroscope of claim 1, wherein: the outer wall of the hemispherical shell is an outer spherical surface, an outer circular bead is arranged at the intersection of the outer spherical surface and the inner column, and the connecting area comprises the inner circular bead, the outer circular bead and the hemispherical shell.
3. The hemispherical resonator with a windowed structure for a gyroscope of claim 1, wherein: the window structures are symmetrically distributed around the axis of the hemispherical shell at equal intervals, and the number of the window structures is set to be odd.
4. The hemispherical resonator with a windowed structure for a gyroscope of claim 1, wherein: the window structure is divided into a full-open window structure and a half-open window structure, and the full-open window structure is formed by completely removing thick materials on the inner wall of a quadrangular region surrounded by two wefts with a certain angle and two warps with different heights on a hemispherical shell; the semi-open window structure is characterized in that thick materials on the inner wall of a quadrilateral area surrounded by two wefts with a certain angle and two warps with different heights on the hemispherical shell are thinned.
5. The hemispherical resonator with a windowed structure for a gyroscope of claim 4, wherein: and when the thickness of the vibration connecting strip is consistent with that of the half-open window structure, a continuous circular cutting belt is formed.
6. The hemispherical resonator with a windowed structure for a gyroscope of claim 1, wherein: the wall thickness form of the connecting area is divided into a structure with equal wall thickness and a structure with variable wall thickness; when the connecting area is of a variable wall thickness structure, the wall thickness at the junction of the inner spherical surface and the fillet is the thinnest; when the connecting area is of an equal wall thickness structure, the wall thickness of the hemispherical shell is consistent, and the wall thickness of the inner corners and the outer corners is larger than that of the hemispherical shell.
7. The hemispherical resonator with a windowed structure for a gyroscope of claim 1, wherein: the initial warp of the windowing structure is the boundary line between the hemispherical shell and the inner corner, and the final warp of the windowing structure is the final warp of the quality sensitive ring.
8. The hemispherical resonator with a windowed structure for a gyroscope of claim 1, wherein: the radius of the inner spherical surface is 7-15 mm; the numerical value of the width of the mass sensitive ring is distributed between the radial arc length of the 1/4 inner spherical surface and the radial arc length of the 3/4 inner spherical surface; the wall thickness of the connecting area is 0.5-1 mm; the included angle of two boundary wefts of the vibration connecting strip in the plane of the lip edge is 5-30 degrees; the wall thickness of the hemispherical shell is 0.3-1 mm.
9. A method for manufacturing a hemispherical resonator with a windowed structure for a gyroscope, for realizing the hemispherical resonator with a windowed structure for a gyroscope according to any one of claims 1 to 8, characterized by: the method comprises the following steps:
s1, placing a hemispherical harmonic oscillator in a windowing mold;
s2, selecting a material which can be removed and solidified to fill the hemispherical shell of the hemispherical resonator;
s3, modifying the windowing structure by using ultra-fast laser, wherein laser modification is started from an outer spherical surface;
s4, corroding the modified area, and carrying out corrosion treatment in an acid solution under the action of ultrasonic waves;
s5, taking out the windowing mold from the acid solution, rapidly cleaning the windowing part of the hemispherical resonator and the windowing mold, and removing residual corrosive liquid;
s6, dissolving the filler in the windowing mould;
s7, taking out the hemispherical harmonic oscillator, and carrying out ultrasonic cleaning on the hemispherical harmonic oscillator.
10. The method for manufacturing a hemispherical resonator with a windowed structure for a gyroscope according to claim 9, wherein: in step S1, the material of the windowing mold is a corrosion-resistant organic material, the windowing mold comprises a first mold cavity and a second mold cavity, the first mold cavity is located above the second mold cavity, the first mold cavity and the second mold cavity are coaxially arranged, the height of the windowing mold is at least 5mm larger than the height of the harmonic oscillator, the diameter of the first mold cavity is at least 10mm larger than the outer diameter of the hemispherical harmonic oscillator, the diameter of the second mold cavity is smaller than the diameter of the first mold cavity, the first mold cavity and the second mold cavity form a cavity with a T-shaped section, the diameter and the height of the second mold cavity are determined by the size and the position of the windowing structure, and the hemispherical harmonic oscillator is erected at the boss of the intersection position of the first mold cavity and the second mold cavity.
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