CN117301191A - Punching equipment compatible with double-panel and multi-layer board for encapsulation machine - Google Patents
Punching equipment compatible with double-panel and multi-layer board for encapsulation machine Download PDFInfo
- Publication number
- CN117301191A CN117301191A CN202311046042.4A CN202311046042A CN117301191A CN 117301191 A CN117301191 A CN 117301191A CN 202311046042 A CN202311046042 A CN 202311046042A CN 117301191 A CN117301191 A CN 117301191A
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- Prior art keywords
- positioning
- double
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- layer board
- drilling
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- 238000004080 punching Methods 0.000 title claims abstract description 36
- 238000005538 encapsulation Methods 0.000 title claims abstract description 22
- 238000005553 drilling Methods 0.000 claims abstract description 52
- 238000001514 detection method Methods 0.000 claims description 23
- 230000000903 blocking effect Effects 0.000 claims description 6
- 238000010073 coating (rubber) Methods 0.000 claims description 5
- 230000009977 dual effect Effects 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000003475 lamination Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1845—Means for removing cut-out material or waste by non mechanical means
- B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses punching equipment compatible with a double-sided board and a multi-layer board for an encapsulation machine, which comprises a punching mechanism, wherein the punching mechanism comprises a fixing mechanism, a positioning mechanism, a drilling mechanism and a drilling platform, the drilling mechanism comprises an electric drill, the double-sided board is fixed on the drilling platform through the fixing mechanism, and the positioning mechanism positions the punching point of the double-sided board right above or right below the electric drill. The encapsulation machine production line of the multilayer board increases punching equipment of the double-panel, and two products can share other production lines, so that one set of equipment can finish production of two types of products of the double-panel and the multilayer board.
Description
Technical Field
The application relates to the field of PCB processing equipment, in particular to a full-automatic PCB encapsulation line.
Background
A high-speed PIN beating encapsulation machine is generally characterized in that a production line can only manufacture double-sided boards or multi-layer boards, the utilization rate of single equipment for producing products is low, and the speed of manufacturing the multi-layer boards is limited. The number of products produced per unit time is limited.
Disclosure of Invention
The technical problem to be solved by the application is as follows: the problem of single type of the produced products.
For solving above-mentioned technical problem, this application embodiment provides the equipment of punching of compatible biplate and multiply wood for rubber coating machine, including punching the mechanism, punching the mechanism and including fixed establishment, positioning mechanism, drilling mechanism and drilling platform, drilling mechanism includes the electric drill, and the biplate is used for being fixed in on the drilling platform through fixed establishment, and positioning mechanism is located the drilling point of biplate directly over or under the electric drill.
The beneficial effects of this application and the contrast of prior art include:
the encapsulation machine production line of the multilayer board increases punching equipment of the double-panel, and two products can share other production lines, so that one set of equipment can finish production of two types of products of the double-panel and the multilayer board.
In some embodiments, the drill is located at the bottom of the double panel.
The electric drill is positioned at the bottom of the double-sided board. Saving the space on the upper surface and enabling the structure to be more compact.
In some embodiments, a CCD detection positioning mechanism is also included for positioning the multiwall sheet or multiwall sheet and the double sided sheet.
The CCD detection positioning mechanism is used for positioning, so that the subsequent process is convenient.
In some embodiments, the CCD detection positioning mechanism further comprises a gear mechanism disposed longitudinally along the CCD detection positioning mechanism for blocking the double-sided board or the double-sided board and the multi-layer board.
The gear mechanism is longitudinally arranged along the CCD detection positioning mechanism and is used for blocking the double-sided board or the double-sided board and the multi-layer board, and because the double-sided board needs to be precisely positioned in the next procedure, the positioning time is saved through simple positioning, the positioning efficiency is improved, and the purpose of rough positioning is achieved.
In some embodiments, the positioning mechanism comprises a clapper positioning mechanism driven by a second servo motor, the clapper positioning mechanism comprising a transverse clapper mechanism and a longitudinal clapper mechanism.
Accurate positioning can be performed.
In some embodiments, the punching mechanism further comprises a positioning pin mechanism, the positioning pin mechanism is fixed on the drilling platform, the positioning pin mechanism comprises a first positioning pin, a first motor, a second positioning pin and a second motor, the first positioning pin moves up and down through the first motor, the second positioning pin moves up and down through the second motor, a first positioning hole and a second positioning hole are formed in the corresponding multilayer board, the first positioning pin and the second positioning pin are used for penetrating through the first positioning hole and the second positioning hole of the multilayer board respectively, and the drilling platform is used for placing the multilayer board.
The locating nails can accurately locate the multi-layer board and provide for the next working procedure. Meanwhile, due to the fact that the compatible double-sided board punching mechanism for the encapsulation machine is added, the punching mechanism can be used for stacking the multi-layer boards, time for stacking the multi-layer boards on the PIN punching machine is saved, the speed that only 6 boards can be produced in one minute originally is increased to the speed that 8 boards can be produced in one minute, and production efficiency is improved.
In some embodiments, the fixing mechanism comprises a cylinder, and a piston rod of the cylinder is used for propping against the upper surface of the double-sided board.
The piston rod of cylinder is used for fixing the double-sided board, guarantees the precision of punching.
In some embodiments, the punching mechanism further comprises a first suction nozzle, a first pump body, a second suction nozzle and a second pump body, wherein the first suction nozzle is communicated with a first cavity at the bottom of the air cylinder, and the second suction nozzle is communicated with a second cavity at the bottom of the double-sided board for accommodating an electric drill; the first suction nozzle is connected with the first pump body, and the second suction nozzle is connected with the second pump body.
The first suction nozzle and the second suction nozzle respectively suck the waste chips drilled by the electric drill. The production is affected with free scraps.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a high speed Pin encapsulation machine compatible with double and multi-layer boards;
FIG. 2 is a schematic view of a stacked plate drilling mechanism and a clapping plate mechanism according to an embodiment of the present application;
FIG. 3 is an enlarged view of the pack drilling mechanism A of the embodiment of the present application in FIG. 2;
FIG. 4 is a schematic diagram of a CCD detecting and positioning mechanism according to an embodiment of the present application;
FIG. 5 is a schematic view of a gear mechanism of a CCD detection positioning mechanism according to an embodiment of the present application;
FIG. 6 is a schematic view of a transverse clapping plate mechanism of a positioning mechanism of a double-sided and multi-layer board compatible punching device for a prior art encapsulation machine of the present application;
FIG. 7 is a schematic view of a positioning pin mechanism of a positioning mechanism of a dual-panel and multi-layer board compatible punching device for a prior art encapsulation machine of the present application;
FIG. 8 is a schematic view of a stacked plate drilling mechanism and dowel mechanism according to an embodiment of the present application;
FIG. 9 is an enlarged view of the stacked plate drilling mechanism and dowel mechanism B of the embodiment of the present application of FIG. 8;
reference numerals illustrate:
1. a positioning mechanism; 2. a punching mechanism; 3. a cylinder; 41. a first suction nozzle; 42. a second suction nozzle; 5. a drilling mechanism; 6. a clapping plate positioning mechanism; 7. a gear mechanism; 8. a positioning nail mechanism; 9. and positioning nails.
Detailed Description
Embodiments of the present application are described in further detail below with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the present application and not to limit the scope of the application, which may be embodied in many different forms and not limited to the specific embodiments disclosed herein, but rather to include all technical solutions falling within the scope of the claims.
These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments should be construed as exemplary only and not limiting unless otherwise specifically stated.
In the description of the present application, unless otherwise indicated, the meaning of "plurality" is greater than or equal to two; the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or positional relationship merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present application. When the absolute position of the object to be described is changed, the relative positional relationship may be changed accordingly.
Furthermore, the terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The "vertical" is not strictly vertical but is within the allowable error range. "parallel" is not strictly parallel but is within the tolerance of the error. The word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements.
It should also be noted that, in the description of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the present application can be understood as appropriate by one of ordinary skill in the art. When a particular device is described as being located between a first device and a second device, there may or may not be an intervening device between the particular device and either the first device or the second device.
All terms used herein have the same meaning as understood by one of ordinary skill in the art to which this application pertains, unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and apparatus should be considered part of the specification.
As shown in fig. 1 and 4, the production process of the punching equipment for the double-panel and multi-layer board compatible for the encapsulation machine and the included mechanism are as follows: including punching mechanism 2 and CCD detection positioning mechanism, as shown in fig. 2, fig. 3, fig. 8 and fig. 9 punching mechanism 2 includes fixed establishment, positioning mechanism 1, drilling mechanism 5 and drilling platform, and drilling mechanism 5 includes the electric drill, and the electric drill includes motor and drill bit, and motor drive drill bit reciprocates and do rotary motion, can bore the hole for the double-sided board, realizes the purpose that the double-sided board was punched. The double-sided board, also called copper board, is fixed to the drilling platform by a fixing mechanism, and a positioning mechanism 1 positions the drilling point of the double-sided board directly above or directly below the electric drill. The electric drill is positioned right below the bottom of the double-sided board. The fixing mechanism comprises a cylinder 3, the cylinder 3 is driven by compressed air, the cylinder 3 is positioned right above the electric drill and on the upper surface of the double-sided board, and a piston rod of the cylinder 3 is propped against the upper surface of the double-sided board. The piston rod is used for pressing and fastening the double-sided board on the drill bit of the electric drill, so that the positioned double-sided board is firmly contacted with the drill bit, and drilling of the electric drill is facilitated. As shown in fig. 5, the CCD detecting and positioning mechanism further includes a gear mechanism 7, and the gear mechanism 7 is disposed along the longitudinal direction of the CCD detecting and positioning mechanism and is used for blocking the double-sided board. The double-sided board is initially positioned. For accurate positioning of the double-sided board, as shown in fig. 2 and 6, the positioning mechanism 1 includes a clapper positioning mechanism 6 driven by a second servo motor, and the clapper positioning mechanism 6 includes a transverse clapper mechanism and a longitudinal clapper mechanism. The transverse clapping mechanism comprises two pairs of opposite clapping blocks which are transversely placed, the clapping blocks are driven by a second servo motor, the longitudinal clapping mechanism comprises two pairs of opposite clapping blocks which are longitudinally placed, the clapping blocks are driven by the second servo motor, the existing transverse clapping mechanism and the longitudinal clapping mechanism can accurately position the double-sided board, the longitudinal clapping mechanism can accurately position the double-sided board above an electric drill, and the electric drill drills holes on the double-sided board at a certain distance from the edge, such as 5MM, 10MM and 15MM. The clapping plate positioning mechanism 6 can accurately position the double-sided board. The punching mechanism 2 further comprises a first suction nozzle 41, a first pump body, a second suction nozzle 42 and a second pump body, wherein the first suction nozzle 41 is communicated with a first cavity at the bottom of the air cylinder 3, the first cavity surrounds the space at the bottom of the air cylinder and the upper part of the double-sided board, the first cavity forms a closed space, and the second suction nozzle 42 is communicated with a second cavity at the bottom of the double-sided board for accommodating an electric drill; the second cavity encloses the space at the bottom of the double-sided board, and a through hole for a drill bit to pass through the electric drill is left at the bottom of the second cavity. The second cavity forms a closed space, the first suction nozzle 41 is connected with the first pump body, and the second suction nozzle 42 is connected with the second pump body. The first pump body is connected with the second pump body, and the motor drives the first suction nozzle and the second suction nozzle to generate negative pressure, and the first suction nozzle 41 and the second suction nozzle 42 respectively absorb waste scraps generated by drilling of an electric drill.
The rubber coating machine further comprises a mechanism comprising an upper base plate mechanism 5, a base plate drilling mechanism 4 and a manipulator, wherein the upper base plate mechanism 5 loads the upper base plate, the base plate drilling mechanism 4 comprises a base plate fixing mechanism, a base plate positioning mechanism, a drilling mechanism and a drilling platform, the drilling mechanism comprises an electric drill, the base plate is fixed on the drilling platform through the base plate fixing mechanism, and the base plate positioning mechanism positions the punching point of the base plate right above or right below the electric drill. In some embodiments, the drill is located directly below the bottom of the backing plate. The base plate positioning mechanism is used for positioning the base plate, the base plate positioning mechanism comprises a clapping plate positioning mechanism driven by a servo motor, and the clapping plate positioning mechanism comprises a transverse clapping plate mechanism and a longitudinal clapping plate mechanism. The existing transverse clapping mechanism and the longitudinal clapping mechanism can accurately position the base plate, and the longitudinal clapping mechanism can accurately position the base plate right above the electric drill, so that the electric drill drills holes on the base plate at a certain distance from the edge. The backing plate fixing mechanism comprises an air cylinder, the air cylinder is positioned right above the electric drill and on the upper surface of the backing plate, and a piston rod of the air cylinder is propped against the upper surface of the backing plate. The piston rod is used for pressing and fastening the backing plate on a drill bit of an electric drill, the drilling mechanism is used for drilling the backing plate, and after the backing plate is drilled, the manipulator is used for grabbing the backing plate and moving the backing plate to a PIN punching station.
The CCD detection positioning mechanism is also used for positioning the multilayer board. The CCD detection positioning mechanism is used for positioning the multilayer board, the multilayer board is also called a copper plate, the positioning method is that the CCD detection positioning mechanism comprises a CCD detector and a positioning needle mechanism, the positioning needle mechanism comprises a first servo motor and two positioning needles, the CCD detector and the two positioning needle mechanism are respectively located in the vertical direction of the assembly line direction, positioning holes are respectively formed in the two longitudinal sides of the multilayer board, the two CCD detectors respectively detect the positions of the two positioning holes and respectively drive the positioning needles to move to the positioning holes to be inserted into the positioning holes according to the positions of the positioning holes calculated by the first servo motor, and then the first servo motor drives the multilayer board to move to the fixed position centered by the CCD detection mechanism to complete the positioning process. The CCD detection mechanism can accurately position the multilayer board. As shown in fig. 7, the punching mechanism 2 further includes a positioning pin mechanism 8, the positioning pin mechanism 8 is fixed on a drilling platform, the positioning pin mechanism 8 includes a first positioning pin 9, a first motor, a second positioning pin and a second motor, the first positioning pin 9 moves up and down through the first motor, the second positioning pin moves up and down through the second motor, the corresponding two sides of the multi-layer board are respectively provided with a first positioning hole and a second positioning hole, the first positioning pin 9 and the second positioning pin are respectively arranged in the first positioning hole and the second positioning hole of the multi-layer board in a penetrating manner, and the drilling platform is used for placing the multi-layer board. The locating pin mechanism is used for locating the stacked multi-layer boards. After the multilayer board is accurately positioned by the CCD detection positioning mechanism, the multilayer board is grabbed onto the punching mechanism 2 for many times by the manipulator, a first positioning hole and a second positioning hole on the multilayer board are respectively fixed on the first positioning nail 9 and the second positioning nail, a displacement sensor is fixed on the drilling platform, when the multilayer board is not sleeved on the first positioning nail 9 or the second positioning nail, the corresponding displacement sensor cannot sense a reflected detection signal, the controller cannot receive a relevant signal, and the controller drives an alarm to alarm. After the multi-layer board lamination is completed, the multi-layer board lamination is grabbed to a PIN punching station by a manipulator. And performing PIN typing operation.
Still including last aluminum sheet mechanism 12, aluminum sheet mechanism 7 and encapsulation mechanism 13 that punches a hole, go up aluminum sheet mechanism 12 loading and go up aluminum sheet, the aluminum sheet snatchs to aluminum sheet mechanism 7 that punches a hole through the manipulator, aluminum sheet mechanism 7 that punches a hole includes aluminum sheet positioning mechanism and mechanism that punches a hole, snatchs the aluminum sheet that will punch the hole through the manipulator and puts on the copper that PIN station has been beaten to the PIN, then claps the board location, is transplanted No. 2 platforms by the lower and moves the encapsulation position. The lamination rubber coating, firstly wrap the short side, then take the board to rotate by transplanting No. 3 platforms down and wrap the long side, later move the board of packing well glue to the code printing position and code, snatch the board by unloading robot after the upset and put down the material of lamination receipts.
In some embodiments, the CCD detection positioning mechanism is used for positioning the multi-layer board and the double-layer board, and the gear mechanism 7 is placed along the longitudinal direction of the CCD detection positioning mechanism and is used for blocking the double-layer board and the multi-layer board.
Example two
The utility model provides a compatible two-sided board and multiply wood's drilling equipment for rubber coating machine, includes drilling mechanism 2, drilling mechanism 2 includes fixed establishment, positioning mechanism 1, drilling mechanism 5 and drilling platform, and drilling mechanism 5 includes the electric drill, and the two-sided board is used for being fixed in on the drilling platform through fixed establishment, and positioning mechanism 1 is used for locating the drilling point of two-sided board directly over or under the electric drill.
In some embodiments, the number of the electric drills is two, and the two electric drills are respectively arranged at the front side and the rear side of the longitudinal direction of the double-sided board.
In some embodiments, the drill is located at the bottom of the double panel.
In some embodiments, a CCD detection positioning mechanism is also included for positioning the multiwall sheet or multiwall sheet and the double sided sheet.
In some embodiments, the CCD detection positioning mechanism further comprises a gear mechanism 7, wherein the gear mechanism 7 is arranged along the longitudinal direction of the CCD detection positioning mechanism and is used for blocking the double-sided board or the double-sided board and the multi-layer board.
In some embodiments, the positioning mechanism 1 comprises a clapper positioning mechanism 6 driven by a second servo motor, the clapper positioning mechanism 6 comprising a transverse clapper mechanism and a longitudinal clapper mechanism.
In some embodiments, the punching mechanism 2 further includes a positioning pin mechanism 8, the positioning pin mechanism 8 is fixed on a drilling platform, the positioning pin mechanism 8 includes a first positioning pin 9, a first motor, a second positioning pin and a second motor, the first positioning pin 9 moves up and down through the first motor, the second positioning pin moves up and down through the second motor, the multi-layer board is provided with a first positioning hole and a second positioning hole, the first positioning pin 9 and the second positioning pin are used for respectively penetrating into the first positioning hole and the second positioning hole of the multi-layer board, and the drilling platform is used for placing the multi-layer board.
In some embodiments, the fixing mechanism comprises two cylinders 3, and piston rods of the two cylinders 3 are respectively used for propping against the upper surfaces of the front side and the rear side of the longitudinal direction of the double-sided board.
In some embodiments, the punching mechanism 2 further comprises a first suction nozzle 41, a first pump body, a second suction nozzle 42 and a second pump body, wherein the first suction nozzle 41 is communicated with a first cavity at the bottom of the air cylinder 3, and the second suction nozzle 42 is communicated with a second cavity at the bottom of the double-sided board for accommodating an electric drill; the first suction nozzle 41 is connected to the first pump body and the second suction nozzle 42 is connected to the second pump body.
Example III
One difference from the embodiment is that: the locating pin mechanism 8 comprises a first locating pin 9, a first cylinder, a second locating pin and a second cylinder, wherein the first locating pin 9 moves up and down through the first cylinder, the second locating pin moves up and down through the second cylinder, a first locating hole and a second locating hole are respectively formed in the upper side and the lower side of the multilayer board, the first locating pin 9 and the second locating pin penetrate through the first locating hole and the second locating hole of the multilayer board respectively, and the drilling platform is used for placing the multilayer board.
Thus, various embodiments of the present application have been described in detail. In order to avoid obscuring the concepts of the present application, some details known in the art are not described. How to implement the solutions disclosed herein will be fully apparent to those skilled in the art from the above description.
Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It will be understood by those skilled in the art that the foregoing embodiments may be modified and equivalents substituted for elements thereof without departing from the scope and spirit of the present application. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict.
Claims (9)
1. Punching equipment compatible with double-sided board and multi-layer board for rubber coating machine, and is characterized in that: including punching mechanism (2), punching mechanism (2) include fixed establishment, positioning mechanism (1), drilling mechanism (5) and drilling platform, and drilling mechanism (5) include the electric drill, and the double faced board is used for being fixed in on the drilling platform through fixed establishment, and positioning mechanism (1) are used for locating the drilling point of double faced board directly over or under the electric drill.
2. The dual panel and multi-layer board compatible perforating apparatus for an encapsulation machine of claim 1, wherein: the two electric drills are respectively positioned at the front side and the rear side of the double-sided board in the longitudinal direction.
3. The dual panel and multi-layer board compatible perforating apparatus for an encapsulation machine of claim 1 or 2, wherein: the electric drill is positioned at the bottom of the double-sided board.
4. The dual panel and multi-layer board compatible perforating apparatus for an encapsulation machine of claim 3, wherein: the device also comprises a CCD detection and positioning mechanism, wherein the CCD detection and positioning mechanism is used for positioning the multi-layer board or the multi-layer board and the double-sided board.
5. The dual panel and multi-layer board compatible perforating apparatus for an encapsulation machine of claim 4, wherein: the CCD detection positioning mechanism further comprises a gear mechanism (7), and the gear mechanism (7) is arranged along the longitudinal direction of the CCD detection positioning mechanism and is used for blocking the double-sided board or the double-sided board and the multi-layer board.
6. The dual panel and multi-layer board compatible perforating apparatus for an encapsulation machine of claim 1 or 2, wherein: the positioning mechanism (1) comprises a clapping plate positioning mechanism (6) driven by a second servo motor, and the clapping plate positioning mechanism (6) comprises a transverse clapping plate mechanism and a longitudinal clapping plate mechanism.
7. The dual panel and multi-layer board compatible perforating apparatus for an encapsulation machine of claim 5, wherein: the punching mechanism (2) further comprises a positioning nail mechanism (8), the positioning nail mechanism (8) is fixed on the drilling platform, the positioning nail mechanism (8) comprises a first positioning nail (9), a first motor, a second positioning nail and a second motor, the first positioning nail (9) moves up and down through the first motor, the second positioning nail moves up and down through the second motor, a first positioning hole and a second positioning hole are formed in a corresponding multilayer board, the first positioning nail (9) and the second positioning nail are used for being respectively penetrated into the first positioning hole and the second positioning hole of the multilayer board, and the drilling platform is used for placing the multilayer board.
8. The dual panel and multi-layer board compatible perforating apparatus for an encapsulation machine of claim 1 or 2, wherein: the fixing mechanism comprises two air cylinders (3), and piston rods of the two air cylinders (3) are respectively used for propping against the upper surfaces of the front side and the rear side of the longitudinal direction of the double-sided board.
9. The dual panel and multi-layer board compatible perforating apparatus for an encapsulation machine of claim 7, wherein: the punching mechanism (2) further comprises a first suction nozzle (41), a first pump body, a second suction nozzle (42) and a second pump body, wherein the first suction nozzle (41) is communicated with a first cavity at the bottom of the air cylinder (3), and the second suction nozzle (42) is communicated with a second cavity which is positioned at the bottom of the double-sided board and used for accommodating an electric drill; the first suction nozzle (41) is connected with the first pump body, and the second suction nozzle (42) is connected with the second pump body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311046042.4A CN117301191A (en) | 2023-08-18 | 2023-08-18 | Punching equipment compatible with double-panel and multi-layer board for encapsulation machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311046042.4A CN117301191A (en) | 2023-08-18 | 2023-08-18 | Punching equipment compatible with double-panel and multi-layer board for encapsulation machine |
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| CN117301191A true CN117301191A (en) | 2023-12-29 |
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| CN202311046042.4A Pending CN117301191A (en) | 2023-08-18 | 2023-08-18 | Punching equipment compatible with double-panel and multi-layer board for encapsulation machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117682327A (en) * | 2024-02-02 | 2024-03-12 | 昆山惠裕威电子科技有限公司 | PIN rubber coating machine in full-automatic intelligence |
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2023
- 2023-08-18 CN CN202311046042.4A patent/CN117301191A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117682327A (en) * | 2024-02-02 | 2024-03-12 | 昆山惠裕威电子科技有限公司 | PIN rubber coating machine in full-automatic intelligence |
| CN117682327B (en) * | 2024-02-02 | 2024-04-16 | 昆山惠裕威电子科技有限公司 | PIN rubber coating machine in full-automatic intelligence |
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