CN117295297A - Leakless data center heat management system and refrigeration method - Google Patents

Leakless data center heat management system and refrigeration method Download PDF

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Publication number
CN117295297A
CN117295297A CN202311148522.1A CN202311148522A CN117295297A CN 117295297 A CN117295297 A CN 117295297A CN 202311148522 A CN202311148522 A CN 202311148522A CN 117295297 A CN117295297 A CN 117295297A
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China
Prior art keywords
tank body
heat dissipation
liquid
valve
data center
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CN202311148522.1A
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Chinese (zh)
Inventor
连加俤
蔡非凡
邱霖
谢杭清
许静
许生军
兰正宇
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Hangzhou University Of Electronic Science And Technology Tiantai Digital Industry Research Institute Co ltd
China Jiliang University
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Hangzhou University Of Electronic Science And Technology Tiantai Digital Industry Research Institute Co ltd
China Jiliang University
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Priority to CN202311148522.1A priority Critical patent/CN117295297A/en
Publication of CN117295297A publication Critical patent/CN117295297A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836Thermal management, e.g. server temperature control
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a heat management system and a refrigeration method of a leak-free data center, comprising a box body, wherein a heat dissipation pipeline is arranged in the box body; the heat dissipation pipeline is connected with at least two tank bodies through the liquid inlet pipe and the liquid outlet pipe, the tank bodies are connected with the air pump, the air pump is composed of the vacuum pump and the pressure air pump and used for vacuumizing or pressurizing the tank bodies, negative pressure or positive pressure is alternately generated by controlling each tank body through the air pump, cooling liquid in the tank bodies is enabled to exchange heat with the tank bodies through the liquid inlet pipe under the action of gravity and positive pressure, and the cooling liquid after heat exchange flows back into the tank bodies under the action of negative pressure, so that the circulating flow of the cooling liquid is realized. According to the invention, not only can heat dissipation of the data center be realized, but also cooling water is sucked up through negative pressure type vacuum, and when the pipeline is split, atmospheric pressure can act on the position of the split, so that water cannot flow out through the split, the risk is greatly reduced, and the use safety and reliability of the whole heat dissipation system are improved.

Description

Leakless data center heat management system and refrigeration method
Technical Field
The invention relates to a leakage-free data center heat management system and a refrigeration method.
Background
In a common heat dissipation system of a data center server, a high-density heat source such as a server CPU (Central processing Unit) adopts a liquid cooling channel to dissipate heat, namely liquid fluid absorbs heat through isolation contact with a main heating chip of the server, 70% -80% of total heat productivity of the server is taken away, and the rest 20% -30% of the heat of the server is taken away through an air cooling channel.
The patent publication No. CN106852088B discloses a single-stage serial-type liquid-gas dual-channel natural cooling data center heat dissipation system, which comprises a liquid cooling module, an air cooling device and a natural heat dissipation device, wherein an outlet of the liquid cooling module is communicated with an inlet of the natural heat dissipation device, an outlet of the natural heat dissipation device is communicated with an inlet of the air cooling device, and an outlet of the air cooling device is communicated with an inlet of the liquid cooling module. The air cooling device and the liquid cooling module in the patent jointly utilize the natural heat dissipation device to dissipate heat, so that the natural cold source is fully utilized, the running and maintenance cost of the compressor and other parts in mechanical refrigeration is reduced, the energy consumption is greatly reduced, and the energy is saved. However, a water pump is arranged at the outlet of the natural heat radiator, and the heat exchange is carried out through the water pump.
Therefore, the cooling liquid required by the cooling is pushed up by the water pump, the pressure is required by the liquid pump for conveying, the leakage risk exists when the system pipeline runs for a long time, the cooling liquid flows out to damage the data center, and a certain risk exists.
Disclosure of Invention
The invention aims to provide a technical scheme of a leakage-free data center thermal management system and a refrigeration method, which aims at overcoming the defects of the prior art, not only can realize heat dissipation of a data center, but also can suck cooling liquid through negative pressure type vacuum, when a pipeline is split, atmospheric pressure can act on the position of the crack, so that water can not flow out through the crack and is not easy to leak, the heat dissipation system can work, the risk is greatly reduced, the service life of the heat dissipation system is prolonged, the replacement maintenance cost of the pipeline is reduced, the refrigeration method is simple in steps, the aim of rapidly dissipating heat of the data center can be achieved, leakage can be prevented, and the use safety and reliability of the whole heat dissipation system are improved.
In order to solve the technical problems, the invention adopts the following technical scheme:
a leak-free data center thermal management system, comprising
The box body is internally provided with at least one group of heat dissipation pipelines along the vertical direction;
the method is characterized in that:
the heat dissipation pipeline is connected with at least two tank bodies through the liquid inlet pipe and the liquid outlet pipe, the tank bodies are connected with the air pump, the air pump is composed of a vacuum pump and a pressure air pump and is used for vacuumizing or pressurizing the tank bodies, negative pressure or positive pressure is alternately generated by controlling each tank body through the air pump, the air pressure in each tank body is regulated, cooling liquid in the tank bodies is input into the heat dissipation pipeline through the liquid inlet pipe under the action of gravity and positive pressure to exchange heat of the tank bodies, the cooling liquid after heat exchange flows back into the tank bodies under the action of negative pressure, the circulating flow of the cooling liquid is realized, and the cooling liquid is prevented from leaking to a data center due to rupture of the cooling pipeline; through the design of above-mentioned structure, not only can realize dispelling the heat to data center, can inhale the coolant liquid through the negative pressure formula vacuum moreover, when the pipeline splits, atmospheric pressure can act on cracked position, makes water can not flow out through the crack, is difficult to leak, can work, greatly reduced the risk, owing to adopt the negative pressure to inhale water, has coolant liquid and air in the heat exchange pipeline simultaneously, consequently heat exchange pipeline's water inlet end and water outlet end can not have great fall.
Further, the heat dissipation pipeline is the echelonment and distributes in the box, and the heat dissipation pipeline includes flat pipe and spiral pipe, and flat pipe and spiral pipe are connected in turn, and the water inlet end height of heat dissipation pipeline is less than the water outlet end height, follows under the negative pressure effect the heat dissipation pipeline ladder climbs and carries out the heat transfer, finally warp the drain pipe gets into the jar body realizes negative pressure heat dissipation, can be with the light follow water inlet end of coolant liquid and carry to the water outlet end through echelonment distribution, prolongs cooling system's life, reduces the change maintenance cost of pipeline, is favorable to air and coolant liquid to flow, improves heat exchange efficiency.
Further, the flat tube comprises a flat part and a round tube joint part, the round tube joint part and the flat part are integrally formed and are arranged on two sides of the flat part, the heat radiating area can be increased through the design of the flat part, the heat radiating efficiency can be greatly improved through matching with the spiral round tube, and the round tube joint part is convenient for connecting the flat tube with the spiral round tube.
Further, each tank body is provided with a cooling mechanism, the cooling mechanism comprises an evaporator, a condenser, a compressor and a pressure reducer, the evaporator is arranged in the tank body and is respectively connected with the compressor and the pressure reducer through pipelines, the condenser is connected with the compressor and the pressure reducer and is used for absorbing heat of cooling liquid in the tank body and guaranteeing circulating refrigeration of the management system.
Further, one end of the liquid inlet pipe, which is close to the box body, is provided with an electric valve for controlling the conveying amount of cooling liquid entering the heat dissipation pipelines, and because the height positions of each heat dissipation pipeline in the box body are different, the cooling liquid is conveyed through the liquid inlet pipe under the action of gravity and positive pressure, and the different heights lead to different flow of the heat dissipation pipelines from top to bottom, the flow can be controlled through the electric valve, so that the overall heat dissipation is more balanced.
Further, one end of the liquid inlet pipe, which is close to the tank body, is provided with a third valve for controlling the output quantity of the cooling liquid in the tank body.
Further, one end of the liquid outlet pipe, which is close to the tank body, is provided with a second valve for controlling a switch between the liquid outlet pipe and the tank body, so that negative pressure or positive pressure is formed in the tank body.
Further, all be equipped with first valve between jar body and the input and the output of air pump for the flow of gas between each jar body satisfies each jar body and produces negative pressure or malleation in turn.
Further, be equipped with fan and optic fibre temperature sensor on the box, the fan is used for the circulation of box internal air, and optic fibre temperature sensor is used for detecting the temperature in the box.
The refrigerating method of the leakage-free data center heat management system is characterized by comprising the following steps:
s1, firstly, respectively accommodating cooling liquid in each tank body to a set liquid level height according to the size of the tank body, and switching on an air pump, an electric valve, a first valve, a second valve, a third valve, a fan and an optical fiber temperature sensor;
s2, performing temperature acquisition on the tank body through an optical fiber temperature sensor, starting an air pump, opening a first valve connected with the tank body to be vacuumized, vacuumizing the tank body, generating negative pressure by the tank body, sucking cooling liquid subjected to heat exchange in a heat dissipation pipeline in the tank body into the tank body, simultaneously opening the first valve connected with the tank body to be discharged, inputting air pressure into the tank body through the air pump, opening a second valve and a third valve, and simultaneously starting an electric valve, so that cooling liquid in the tank body to be discharged enters the heat dissipation pipeline of the tank body through a liquid inlet pipe under the action of gravity and positive pressure, and meanwhile, climbing air and cooling liquid in the heat dissipation pipeline through steps and performing heat exchange;
s3, the cooling liquid and air subjected to heat exchange flow back into the tank body through the liquid outlet pipe, and the heat of the cooling liquid in the tank body is absorbed through the cooling mechanism, so that the circulation refrigeration of the management system is ensured;
s4, starting a fan, wherein the fan is used for promoting the flow of air in the box body and feeding back to the central control system to control the first valve, the electric valve and the fan.
The refrigerating method has simple steps, can not only play a role in rapidly radiating heat for the data center, but also prevent leakage, and improves the use safety and reliability of the whole radiating system.
Due to the adoption of the technical scheme, the invention has the following beneficial effects:
1. according to the invention, not only can heat dissipation of the data center be realized, but also cooling liquid can be sucked up through negative pressure type vacuum, when the pipeline is split, atmospheric pressure can act on the position of the split, so that water cannot flow out through the split, leakage is not easy, the heat exchange pipeline can work, the risk is greatly reduced, and meanwhile, due to the fact that negative pressure water absorption is adopted, cooling liquid and air exist in the heat exchange pipeline, and therefore, a larger drop cannot exist between the water inlet end and the water outlet end of the heat exchange pipeline.
2. The cooling liquid can be easily conveyed from the water inlet end to the water outlet end through the stepped distribution, the service life of the heat dissipation system is prolonged, and the replacement and maintenance cost of the pipeline is reduced.
3. The refrigerating method has simple steps, can not only play a role in rapidly radiating the data center, but also prevent leakage, and improves the use safety and reliability of the whole radiating system.
Description of the drawings:
the invention is further described below with reference to the accompanying drawings:
FIG. 1 is a schematic diagram of a heat dissipation system in a leak-free data center thermal management system and a refrigeration method according to the present invention;
FIG. 2 is a schematic diagram of a heat dissipation pipe according to the present invention;
FIG. 3 is a schematic diagram showing the distribution of heat dissipation pipes according to the present invention;
FIG. 4 is a schematic illustration of the connection of the flat portion and the tubular interface portion of the present invention;
FIG. 5 is a schematic view of a fan according to the present invention;
FIG. 6 is a schematic diagram of the installation of a fiber optic temperature sensor according to the present invention;
FIG. 7 is a circuit control diagram of the present invention;
FIG. 8 is a schematic view of the cooling mechanism of the present invention;
fig. 9 is a flow chart of the refrigeration method of the present invention.
In the figure: 1-a box body; 2-an electric valve; 3-flat tube; 301-flat part; 302-round tube interface; 4-a spiral round tube; 5-an air pump; 6-a first valve; 7-a tank body; 8-a liquid outlet pipe; 9-a second valve; 10-a liquid inlet pipe; 11-a third valve; 12-a fan; 13-an optical fiber temperature sensor; 14-a cooling mechanism; 1401-an evaporator; 1402-condenser; 1403-compressor; 1404-a buck converter.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, shall fall within the scope of the invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
1-8, the heat management system of the invention comprises a box 1, wherein at least one group of heat dissipation pipelines are distributed in the box 1 along the vertical direction; the application adopts two sets of radiating pipes arranged along a vertical plane as an example to improve the radiating efficiency of the data center. The box 1 is provided with a fan 12 and an optical fiber temperature sensor 13, the fan 12 is used for circulating air in the box 1, and the optical fiber temperature sensor 13 is used for detecting the temperature in the box 1. The fans 12 of this application are distributed on two opposite sides of the box 1, and the heat dissipation pipeline is located between the fans 12 of both sides, in order to improve the accuracy of temperature monitoring, the optical fiber temperature sensor 13 adopts 3, and is located between fan 12 and the heat dissipation pipeline, between two adjacent heat dissipation pipelines respectively, but not limited to above-mentioned distribution mode.
The heat dissipation pipeline is the echelonment and distributes in box 1, and heat dissipation pipeline's water inlet end height is less than water outlet end height, is favorable to air and coolant liquid to flow, improves heat exchange efficiency.
The heat dissipation pipeline comprises flat pipes 3 and spiral round pipes 4, the flat pipes 3 are alternately connected with the spiral round pipes 4, the flat pipes 3 comprise flat parts 301 and round pipe joint parts 302, the round pipe joint parts 302 and the flat parts 301 are integrally formed, two sides of the flat parts 301 are provided with the round pipe joint parts 302, the heat dissipation area can be increased through the design of the flat parts 301, the heat dissipation efficiency can be greatly improved through matching with the spiral round pipes 4, and the round pipe joint parts 302 are convenient to connect the flat pipes 3 with the spiral round pipes 4. The water storage part is formed from the water outlet end of the flat pipe 3 positioned at the left side to the middle of the spiral circular pipe 4 positioned at the adjacent right side, so that cooling liquid and air can climb along the step shape. Fins can be arranged on the flat tube 3 according to the requirement, so that the heat dissipation efficiency is improved.
The cooling pipeline passes through feed liquor pipe 10 and drain pipe 8 and connects two at least jar body 7, this application adopts 3 jar body 7 to be exemplified, the one end that is close to box 1 on the feed liquor pipe 10 is equipped with motorised valve 2 for control coolant liquid gets into the delivery capacity of cooling pipeline, because the high position that every cooling pipeline set up in box 1 is different, the coolant liquid is carried through feed liquor pipe 10 under the action of gravity, the flow that the different height leads to cooling pipeline from the top down is different, can control the flow through motorised valve 2, it is more balanced to make holistic heat dissipation. A third valve 11 is arranged at one end of the liquid inlet pipe 10, which is close to the tank body 7, and is used for controlling the output quantity of the cooling liquid in the tank body 7. One end of the liquid outlet pipe 8, which is close to the tank body 7, is provided with a second valve 9 for controlling the switch between the liquid outlet pipe 8 and the tank body 7, so that negative pressure or positive pressure is formed in the tank body 7.
The air pump 5 is connected to the jar body 7, and the air pump 5 comprises vacuum pump and pressure air pump for carry out evacuation or pressurization to jar body 7, all be equipped with first valve 6 between jar body 7 and the input and the output of air pump 5 for the flow of gas between each jar body 7 is controlled, satisfies each jar body 7 and produces negative pressure or malleation in turn. The vacuum pump is connected with three first valves therein, the pressure air pump is connected with the other three first valves, and the bottom of the tank body can be provided with a vent valve for exhausting air. In the initial state, one of the fillers of the three tank bodies is air, and the other two are cooling liquid. When the refrigeration work starts, the vacuum pump pumps out the gas in the tank body filled with air through the connected pipeline, and simultaneously pumps the gas into the tank body filled with cooling liquid through the pressure air pump, and meanwhile, the emptying valve at the bottom of the tank body starts to work. The cooling liquid flows into the heat dissipation system under the action of the negative pressure of the tank body filled with air, the gravity of the cooling liquid and the positive pressure provided by the pressure air pump, and flows back into the tank body after exchanging heat with the tank body, so that the circulating flow is realized.
The air pump 5 controls each tank body 7 to alternately generate negative pressure or positive pressure, the air pressure in each tank body 7 is regulated, so that cooling liquid in the tank body 7 is input into the cooling pipeline through the liquid inlet pipe 10 to exchange heat with the tank body 1 under the action of gravity and positive pressure, the cooling liquid after heat exchange flows back into the tank body 7 under the action of negative pressure, the circulating flow of the cooling liquid is realized, and the cooling liquid is prevented from leaking to the data center due to the cracking of the cooling pipeline. Through the design of above-mentioned structure, not only can realize dispelling the heat to data center, can inhale the coolant liquid through the negative pressure formula vacuum moreover, when the pipeline splits, atmospheric pressure can act on cracked position, makes water can not flow out through the crack, is difficult to leak, can work, greatly reduced the risk, owing to adopt the negative pressure to inhale water, has coolant liquid and air in the heat exchange pipeline simultaneously, consequently heat exchange pipeline's water inlet end and water outlet end can not have great fall.
Each tank 7 is provided with a cooling mechanism 14, the cooling mechanism 14 comprises an evaporator 1401, a condenser 1402, a compressor 1403 and a pressure reducer 1404, the evaporator 1401 is arranged in the tank 7, the evaporator 1401 is respectively connected with the compressor 1403 and the pressure reducer 1404 through pipelines, the condenser 1402 is connected with the compressor 1403 and the pressure reducer 1404 and is used for absorbing heat of cooling liquid in the tank 7 and guaranteeing circulation refrigeration of a management system. The refrigerant is converted into high-temperature high-pressure liquid through the external compressor 1403, flows through the condenser 1402, is converted into low-temperature high-pressure liquid through heat exchange with air, is converted into low-temperature low-pressure liquid through the pressure reducer 1404, continuously flows through the evaporator 1401 in the tank 7 through a pipeline, is converted into gas, simultaneously absorbs heat of cooling liquid in the tank 7, and finally flows out of the tank 7 through the pipeline to enter the compressor 1403 for next circulation refrigeration.
The box body 1 can be provided with a central control system, and the electric valve 2, the air pump 5, the first valve 6, the second valve 9, the third valve 11, the fan 12 and the optical fiber temperature sensor 13 are all connected with the central control system on the box body 1 in an electric connection mode.
The cooling method of the leak-free data center heat management system as described above, as shown in fig. 9, comprises the following steps:
s1, firstly, respectively accommodating cooling liquid to a set liquid level height in each tank body 7 according to the size of the tank body 7, and switching on the air pump 5, the electric valve 2, the first valve 6, the second valve 9, the third valve 11, the fan 12 and the optical fiber temperature sensor 13;
s2, performing temperature acquisition on the box body 1 through an optical fiber temperature sensor 13, starting an air pump 5, opening a first valve 6 connected with a tank body 7 needing vacuumizing, vacuumizing the tank body 7, sucking cooling liquid subjected to heat exchange in a heat dissipation pipeline inside the box body 1 into the tank body 7 after negative pressure is generated by the tank body 7, simultaneously opening the first valve 6 connected with the tank body 7 needing liquid discharge, inputting air pressure into the tank body 7 through the air pump 5, opening a second valve 9 and a third valve 11, simultaneously starting an electric valve 2, enabling the cooling liquid in the tank body 7 needing liquid discharge to enter a heat dissipation pipeline of the box body 1 through a liquid inlet pipe 10 under the action of gravity and positive pressure, and enabling air and the cooling liquid in the heat dissipation pipeline to climb in a stepped mode and perform heat exchange;
s3, the cooling liquid and air after heat exchange flow back into the tank body 7 through the liquid outlet pipe 8, and the heat of the cooling liquid in the tank body 7 is absorbed through the cooling mechanism 14, so that the circulation refrigeration of the management system is ensured;
s4, starting the fan 12 through the central control system, wherein the fan 12 is used for promoting the flow of air in the box body 1, the optical fiber temperature sensor 13 is used for detecting the temperature in the box body 1 and feeding back to the central control system, and when the temperature is reduced to the set temperature, the first valve 6, the electric valve 2 and the fan 12 are controlled.
The refrigerating method has simple steps, can not only play a role in rapidly radiating heat for the data center, but also prevent leakage, and improves the use safety and reliability of the whole radiating system.
The above is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions or modifications made on the basis of the present invention to achieve substantially the same technical effects are included in the scope of the present invention.

Claims (10)

1. A leak-free data center thermal management system, comprising
The box body is internally provided with at least one group of heat dissipation pipelines along the vertical direction;
the method is characterized in that:
the cooling pipeline is connected with at least two tank bodies through the liquid inlet pipe and the liquid outlet pipe, the tank bodies are connected with the air pump, the air pump is composed of a vacuum pump and a pressure air pump and is used for vacuumizing or pressurizing the tank bodies, the tank bodies are controlled by the air pump to alternately generate negative pressure or positive pressure, the air pressure in the tank bodies is regulated, cooling liquid in the tank bodies is input into the tank bodies through the liquid inlet pipe under the action of gravity and positive pressure to exchange heat with the tank bodies, the cooling liquid after heat exchange flows back into the tank bodies under the action of negative pressure, the circulation flow of the cooling liquid is realized, and the cooling liquid leakage to a data center caused by cracking of the cooling pipeline is prevented.
2. The leak-free data center thermal management system of claim 1, wherein: the heat dissipation pipeline is in the echelonment distribute in the box, the heat dissipation pipeline includes flat pipe and spiral pipe, flat pipe with spiral pipe connects in turn, the water inlet end height of heat dissipation pipeline is less than the water outlet end height, follows under the negative pressure effect heat dissipation pipeline ladder climbs and carries out heat transfer, finally gets into through the drain pipe the jar body realizes negative pressure heat dissipation.
3. The leak-free data center thermal management system of claim 2, wherein: the flat tube comprises a flat part and a circular tube connector part, wherein the circular tube connector part and the flat part are integrally formed and arranged on two sides of the flat part.
4. The leak-free data center thermal management system of claim 1, wherein: every the jar body all is equipped with cooling body, cooling body includes evaporimeter, condenser, compressor and step-down transformer, the evaporimeter is located in the jar body, the evaporimeter passes through the pipeline and connects respectively the compressor with the step-down transformer, the condenser connect in the compressor with the step-down transformer is used for absorbing the heat of the internal coolant liquid of jar guarantees management system circulation refrigeration.
5. The leak-free data center thermal management system of claim 1, wherein: and an electric valve is arranged at one end of the liquid inlet pipe, which is close to the box body, and is used for controlling the conveying quantity of the cooling liquid entering the heat dissipation pipeline.
6. The leak-free data center thermal management system of claim 1, wherein: and a third valve is arranged at one end of the liquid inlet pipe, which is close to the tank body, and is used for controlling the output quantity of the cooling liquid in the tank body.
7. The leak-free data center thermal management system of claim 1, wherein: and a second valve is arranged at one end, close to the tank body, of the liquid outlet pipe and is used for controlling a switch between the liquid outlet pipe and the tank body, so that negative pressure or positive pressure is formed in the tank body conveniently.
8. The leak-free data center thermal management system of claim 1, wherein: and a first valve is arranged between the tank body and the input end and the output end of the air pump and used for controlling the flow of air between the tank bodies, so that the tank bodies alternately generate negative pressure or positive pressure.
9. The leak-free data center thermal management system of claim 1, wherein: the box body is provided with a fan and an optical fiber temperature sensor, the fan is used for circulating air in the box body, and the optical fiber temperature sensor is used for detecting the temperature in the box body.
10. A method of cooling a leak-free data center thermal management system according to any one of claims 1 to 9, comprising the steps of:
s1, firstly, respectively accommodating cooling liquid in each tank body to a set liquid level height according to the size of the tank body, and switching on an air pump, an electric valve, a first valve, a second valve, a third valve, a fan and an optical fiber temperature sensor;
s2, performing temperature acquisition on the tank body through an optical fiber temperature sensor, starting an air pump, opening a first valve connected with the tank body to be vacuumized, vacuumizing the tank body, generating negative pressure by the tank body, sucking cooling liquid subjected to heat exchange in a heat dissipation pipeline in the tank body into the tank body, simultaneously opening the first valve connected with the tank body to be discharged, inputting air pressure into the tank body through the air pump, opening a second valve and a third valve, and simultaneously starting an electric valve, so that cooling liquid in the tank body to be discharged enters the heat dissipation pipeline of the tank body through a liquid inlet pipe under the action of gravity and positive pressure, and meanwhile, climbing air and cooling liquid in the heat dissipation pipeline through steps and performing heat exchange;
s3, the cooling liquid and air subjected to heat exchange flow back into the tank body through the liquid outlet pipe, and the heat of the cooling liquid in the tank body is absorbed through the cooling mechanism, so that the circulation refrigeration of the management system is ensured;
s4, starting a fan, wherein the fan is used for promoting the flow of air in the box body and feeding back to the central control system to control the first valve, the electric valve and the fan.
CN202311148522.1A 2023-09-06 2023-09-06 Leakless data center heat management system and refrigeration method Pending CN117295297A (en)

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CN202311148522.1A CN117295297A (en) 2023-09-06 2023-09-06 Leakless data center heat management system and refrigeration method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311148522.1A CN117295297A (en) 2023-09-06 2023-09-06 Leakless data center heat management system and refrigeration method

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CN117295297A true CN117295297A (en) 2023-12-26

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