CN117291378B - RTD dispatch system and visual analysis system thereof - Google Patents

RTD dispatch system and visual analysis system thereof Download PDF

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CN117291378B
CN117291378B CN202311264062.9A CN202311264062A CN117291378B CN 117291378 B CN117291378 B CN 117291378B CN 202311264062 A CN202311264062 A CN 202311264062A CN 117291378 B CN117291378 B CN 117291378B
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batch
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wafer
production
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CN117291378A (en
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张晓鹏
曹旭东
赵家丰
金毅
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Jiangsu Daoda Intelligent Technology Co ltd
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Abstract

The invention discloses an RTD dispatching system and a visual analysis system thereof, which are used for solving the problems that a set of fixed evaluation standard is generally used when corresponding production batches cannot be automatically generated according to a production plan and the production progress is monitored in real time in the field of automatic dispatching of wafer production, the evaluation standard has no adaptability and the like. The invention has the following characteristics: through the cooperative interaction of the production task issuing module and the automatic dispatching module, the system can automatically find out the optimal distribution batch and the optimal processing procedure according to the task issued by the staff, thereby saving the processing time of the wafer and the manual calculation cost; by setting the overtime judging rule of the visual analysis system, when the possible hysteresis situation occurs, the visual monitoring system rapidly calculates the predicted hysteresis time, and the predicted hysteresis time is displayed to the staff through the visual large screen, so that the staff can intuitively know the current working procedure situation.

Description

RTD dispatch system and visual analysis system thereof
Technical Field
The invention relates to the field of automatic dispatch specially suitable for wafer production, in particular to an RTD dispatch system and a visual analysis system thereof.
Background
RTD (Real Time Dispatch) a real-time dispatch system is a system for real-time dispatch and scheduling that can schedule production tasks and resource allocation based on real-time data and preset rules. Although the existing RTD real-time dispatch system can automatically allocate tasks and resources, the existing RTD real-time dispatch system does not directly generate production lots.
The real-time dispatch system (Real Time Dispatch, RTD) typically requires manual input of lot information, including product type, quantity of production, lot number of production, etc., which is then automatically assigned to the corresponding machine for production. Current RTD systems suffer from a number of disadvantages:
1. the corresponding production lot cannot be automatically generated according to the production plan: the information maintenance of the production batch of the existing RTD system is manually set by a worker, so that the information such as the number of batches, the number of wafers produced by the batch and the like is basically judged empirically by the worker, and the number of wafers in each production batch influences the overall progress of production; the workload of the staff for manually maintaining the production batch is high, so that the waste of human resources is caused;
2. when monitoring the production progress in real time, a set of fixed evaluation standards is generally used, and the evaluation standards have no adaptability. Existing RTD systems evaluate the current production schedule based on existing specified production lots and actual production conditions. However, this way of evaluation has a problem in that it simply compares the actual progress with the ideal progress. The ideal progress is based on past experience only, and lacks scientific basis.
Disclosure of Invention
The invention aims to provide an RTD dispatching system and a visual analysis system thereof, which are used for solving the problems that in the field of automatic dispatching of wafer production, a set of fixed evaluation standards are generally used when corresponding production batches cannot be automatically generated according to a production plan and the production progress is monitored in real time, and the evaluation standards have no adaptability and the like. The whole idea of the invention is as follows: setting a batch generation strategy, so that batch combinations meeting the conditions can be automatically generated according to the number of wafers of the wafer production task, wherein each batch comprises wafer types and wafer numbers required to be produced; setting a process generation strategy to generate batches meeting the conditions; and comparing the final end time of the working procedures, and finally finding the working procedure with the least time for use as the final working procedure, wherein the batch corresponding to the working procedure is the optimal distribution batch, and controlling the wafer production line according to the final working procedure and the optimal distribution batch. The starting time of the batch currently processed by the machine, the number of wafers which are finished and the time currently processed by the machine are monitored through the visual monitoring system, whether the current working procedure is possibly lagged is judged according to the overtime judging rule, when the situation of the possible lagging occurs, the predicted lagging time is rapidly calculated through the visual monitoring system, and the predicted lagging time is displayed to the staff through the visual large screen, so that the staff can intuitively know the situation of the current working procedure.
In order to achieve the above object, the present invention provides an RTD dispatch system, including: the system comprises a production flow making module, a production task issuing module, a procedure generating module and an automatic dispatching module: wherein,
and the production flow making module is used for: the method is used for making a production flow by production management personnel, and the specific content of the production flow comprises the following steps: after a production manager formulates a production flow by using a production flow designating module, the production flow formulating module transmits the production flow to a procedure generating module;
and the production task issuing module comprises the following steps: the method is used for making production tasks by production management personnel, and the specific contents of the production tasks include: after the production task is formulated by a production manager, the production task is transmitted to the procedure generation module by the production flow formulation module;
the procedure generating module: the production process and the production task transmitted by the module are formulated according to the production process, the production task transmitted by the module is issued, a final process is generated through a process generation strategy, and the final process is transmitted to the automatic dispatching module;
and the automatic dispatching module is used for: the method is used for dispatching the wafer processing site according to the final procedure of the procedure generation module transmission, and comprises the following steps: and controlling the conveying device to convey the wafers of the corresponding batch to the corresponding machine platform before the process starting time of each batch, and conveying the wafers of the corresponding batch from the machine platform of the process ending to the machine platform of the next process after the process of each batch is actually finished.
In a further improvement of the present invention, the process generation module includes:
a batch generation unit: the batch generation unit is used for generating batch combinations according to the production tasks transmitted by the production task issuing module through a batch generation strategy, wherein the contents of the batch combinations comprise batch numbers, wafer types and batch wafer numbers, and after the batch combinations are generated, the batch generation unit transmits the batch combinations to the process unit;
a process generation unit: the process for generating the production wafer according to the batch combination transmitted by the batch generation unit and the production flow transmitted by the production flow formulation module through the process generation strategy comprises the following steps: the process generating unit transmits the process to the time comparing unit after the process generating unit generates the process for producing the wafer;
a time comparison unit: and the time comparison unit is used for comparing the final end time of the process transmitted by the process generation unit, selecting the process with the earliest final end time as the final process, and transmitting the final process to the automatic dispatch module after the final process is generated by the time comparison unit.
The invention is further improved in that the specific steps of the batch generation strategy are as follows:
generating batches according to the wafer types and the wafer numbers in the production tasks transmitted by the production task issuing module, wherein the specific generation rules are as follows:
number of wafers in lot N for generating wafers in lot c c ，N c The following two conditions are satisfied:
condition one:
wherein,indicating the minimum lot number of wafers of type u, i.e. how many, if any, wafers of type u are processed in a lot>Indicating the maximum lot number of wafers of type u, i.e., how many, N, wafers of type u are processed up to one lot c Indicating batch cThe number of wafers in a lot of wafers;
condition II:
wherein c u A lot set representing wafers of type u, i.e., lots in the set all produce wafers of type u,the number of wafers of wafer type u in the production task is represented.
The invention further improves the process generation strategy, which comprises the following specific steps:
s1: the processing time of each process of each batch is calculated, and the specific formula is as follows:
wherein T is c,i The processing time of the c-th wafer in the i-th process is represented by CEIL () with the sign of upward rounding, and the upward rounding operation is represented by: CEIL (3.5) =4, n c Indicating the number of wafers processed in the c th batch, N u,i The maximum processing wafer number of the machine table of the ith procedure of the wafer with the model u is represented, the maximum number of the wafers which can be processed by the machine table at one time is represented, a fixed value which is preset by a manager is obtained, and T u,i The processing time of the wafer with the model u in the ith procedure is a fixed value preset by a manager,the transportation time of the wafer with the model u in the ith procedure is represented, and the transportation time comprises the transportation time before processing and the transportation time after processing, which are fixed values prepared in advance for management staff;
s2: calculating the estimated start time of each process of each batchThe specific formula is as follows:
wherein,indicating the expected start time of the c-th wafer in the i-th process, i.e. the expected start time of the c-th wafer in the i-th process, k is any integer from 1 to i-1, T c,k Representing the processing time of the c-th wafer in the k-th process;
s3: calculating the expected end time of each process of each batchThe specific formula is as follows:
wherein,indicating the expected end time of the c-th wafer in the i-th process, i.e. the c-th wafer is expected to end in the i-th process at the time point, k is any integer from 1 to i, T c,k Representing the processing time of the c-th wafer in the k-th process;
s4: listing the time interval of the procedure: interval for predicted start time and predicted end time of each process of each batch
S5: after the time intervals of the working procedures are listed, the intervals which are overlapped and are the same with the machines used in the working procedures are found, the time interval which is positioned before is preferentially processed, the number of the overlapped time intervals is compared with the number of the machines which can be used in the time, and when the number of the overlapped time intervals is smaller than or equal to the number of the machines which can be used in the time interval, a batch is allocated to each machine for processing; the number of the overlapped time intervals is larger than the number of the machines which can be used in the time interval, each machine is firstly allocated with a batch for processing, the time interval of the process of the batch of the rest unassigned machines is delayed, and when idle machines exist, the time interval is calculated;
s6: after processing one overlapping time interval, continuing to process the subsequent time interval until all time intervals are processed, thereby obtaining the time interval of working procedure processing and the machine serial number of processing of each batch.
The invention further improves, and provides a visual analysis system for visually analyzing the dispatching situation of a wafer processing site, wherein the visual analysis system comprises a machine monitoring module, a timeout judging module and a prompting module, after a procedure generating module of an RTD dispatching system generates a final procedure, the procedure generating module transmits the final procedure to the timeout judging module, and the purposes of the machine monitoring module, the timeout judging module and the prompting module are as follows:
the machine monitoring module: the device comprises a time-out judging module, a time-out judging module and a time-out judging module, wherein the time-out judging module is used for monitoring the actual starting time of a batch currently processed by a machine, the number of wafers which are finished by the batch currently processed by the machine, the time of the batch currently processed by the machine, and the time of the batch currently processed by the machine;
and a timeout judging module: the method is used for judging through overtime judging rules according to the final procedure transmitted by the procedure generating module, the actual starting time of the batch currently processed by the machine transmitted by the machine monitoring module, the number of wafers which are finished by the batch currently processed by the machine and the time currently processed by the machine: if it isThe overtime judging module generates a current process hysteresis signal and transmits the current process hysteresis signal to the prompt moduleWherein->Representing the actual starting time of the c-th wafer in the i-th process, wherein alpha represents the reserved weight, represents the reserved time of which the corresponding proportion alpha-1 needs to be increased in the actual operation, and is a fixed value +.>Indicating the number of wafers produced in the c-th lot in the final process, ">Indicating the number of wafers which are finished in the c-th batch and are currently processed by the machine and monitored by the machine monitoring module, < + >>Indicating the time the machine has been currently working, +.>Indicating the expected end time of the c-th wafer in the i-th process, wherein the expected end time is the data in the final process; if it isThe overtime judging module generates a normal signal of the current working procedure and transmits the normal signal to the prompting module.
The prompting module is used for: the visual large screen is used for controlling the visual large screen to prompt the staff according to the current process lag signal transmitted by the timeout judging module, and the specific mode is that the information of the lag process is displayed on the visual large screen, and the information of the lag process comprises: processing batch number c, currently ongoing process number i and predicted lag timeThe calculation formula is as follows:wherein (1)>Indicating the predicted lag time of the ith process of the c-th batch;
the visual large screen is used for controlling the visual large screen to prompt the staff according to the current process normal signal transmitted by the timeout judging module, and the specific mode is to display the information of the normal process on the visual large screen, wherein the information of the normal process comprises the following steps: processing batch number c, currently ongoing process number i, and information currently in a normal state.
Further, the time point when the machine monitoring module monitors the number of wafers of the batch currently processed by the machine and the time when the machine is currently processed is the time point when the machine is finished with the wafers currently processed.
In summary, compared with the prior art, the invention has the following beneficial effects:
1. through the production flow making module, a worker can make a production flow of the wafer and can change the production flow according to the actual production condition, so that the flexibility is high;
2. through the cooperative interaction of the production task issuing module and the automatic dispatching module, the system can automatically find out the optimal distribution batch and the optimal processing procedure according to the task issued by the staff, thereby saving the processing time of the wafer and the manual calculation cost;
3. the method comprises the steps of monitoring the batch starting time of the current machining of the machine, the number of wafers which are finished and the current machining time of the machine through a visual monitoring system, judging whether the current working procedure is possibly lagged according to a timeout judging rule, and rapidly calculating the expected lagging time when the possible lagging occurs through the visual monitoring system, and displaying the expected lagging time to a worker through a visual large screen, so that the worker can intuitively know the condition of the current working procedure.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
FIG. 1 is a schematic diagram of the architecture of the present invention.
Fig. 2 is a flowchart of the process generation strategy of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1 and 2, the present invention provides several embodiments:
example 1
The embodiment provides an RTD dispatch system: the system comprises a production flow making module, a production task issuing module, a procedure generating module and an automatic dispatching module, wherein,
and the production flow making module is used for: the method is used for making a production flow by production management personnel, and the specific content of the production flow comprises the following steps: wafer model, processing procedure machine type, processing time, and transport time, as shown in the following table:
after a production manager formulates a production flow by using a production flow designating module, the production flow formulating module transmits the production flow to a procedure generating module;
and the production task issuing module comprises the following steps: the method is used for making production tasks by production management personnel, and the specific contents of the production tasks include: wafer type and wafer number are shown in the following table:
wafer model 1 2
Number of wafers 200 400
After a production manager formulates a production task, the production process formulation module transmits the production task to the process generation module;
the procedure generating module: the production process and the production task transmitted by the module are formulated according to the production process, the production task transmitted by the module is issued, a final process is generated through a process generation strategy, and the final process is transmitted to the automatic dispatching module;
and the automatic dispatching module is used for: the method is used for dispatching the wafer processing site according to the final procedure of the procedure generation module transmission, and comprises the following steps: and controlling the conveying device to convey the wafers of the corresponding batch to the corresponding machine platform before the process starting time of each batch, and conveying the wafers of the corresponding batch from the machine platform of the process ending to the machine platform of the next process after the process of each batch is actually finished.
The transfer device is a device for transferring a wafer in a wafer processing site, and in this example, includes a crown block, a conveyor belt, and other components. Its main function is to transfer wafers sequentially from one location to another.
The crown block is used as a part of the conveying device, and the crown block can move in the vertical and horizontal directions by adopting a combined design of a lifting mechanism and a moving mechanism. It is capable of carrying and handling wafers and moving them from one location to another. The lifting mechanism of the crown block can realize the lifting and placing operation of the wafer in a motor, a hydraulic mechanism or a pneumatic mechanism and the like. The travelling mechanism of the crown block can realize linear or curved motion through rails, tracks or other guiding devices so as to adapt to different operation requirements.
Conveyor belts are another important component of conveyor devices, and are typically composed of conveyor belts, drives, and transmission mechanisms. The wafer is placed on a conveyor belt and a drive mechanism drives the conveyor belt to move by means of a motor, hydraulic mechanism or other power means so that the wafer is transported along a specific path to a target location. The transport mechanism may be configured to provide smooth movement of the conveyor belt and stable transfer of the wafers by rollers, chains, or other actuators.
Wherein, the process generation module comprises:
a batch generation unit: the batch generation unit is used for generating batch combinations according to the production tasks transmitted by the production task issuing module through a batch generation strategy, wherein the contents of the batch combinations comprise batch numbers, production wafer types and batch wafer numbers, and after the batch combinations are generated, the batch generation unit transmits the batch combinations to the process unit;
a process generation unit: the process for generating the production wafer according to the batch combination transmitted by the batch generation unit and the production flow transmitted by the production flow formulation module through the process generation strategy comprises the following steps: the process generating unit transmits the process to the time comparing unit after the process generating unit generates the process for producing the wafer;
a time comparison unit: and the time comparison unit is used for comparing the final end time of the process transmitted by the process generation unit, selecting the process with the earliest final end time as the final process, and transmitting the final process to the automatic dispatch module after the final process is generated by the time comparison unit.
Example 2
The embodiment discloses a batch generation strategy, which comprises the following steps:
the batch generation unit generates batches according to the wafer types and the wafer numbers in the production tasks transmitted by the production task issuing module, and the specific generation rules are as follows:
number of wafers in lot N for generating wafers in lot c c ，N c The following two conditions are satisfied:
condition one:
wherein,indicating the minimum lot number of wafers of type u, i.e. how many, if any, wafers of type u are processed in a lot>Indicating the maximum lot number of wafers of type u, i.e., how many, N, wafers of type u are processed up to one lot c The number of wafers in the batch of wafers in the c-th batch is represented;
condition II:
wherein c u A lot set representing wafers of type u, i.e., lots in the set all produce wafers of type u,the number of wafers of wafer type u in the production task is represented.
In this embodiment, the number of wafers of the wafer type 3 in the production task is 100, the minimum lot processing number of the wafer of the type 3 is 20, and the maximum lot processing number is 25, and the lot generated by the lot generating unit is shown in the following table:
example 3
The example discloses specific steps of a process for producing wafers by a process generation strategy according to a batch combination transmitted by a batch generation unit.
S1: the processing time of each process of each batch is calculated as follows:
wherein T is c,i The processing time of the c-th wafer in the i-th process is represented by CEIL () with the sign of upward rounding, and the upward rounding operation is represented by: CEIL (3.5) =4, n c Indicating the number of wafers processed in the c th batch, N u,i The maximum processing wafer number of the machine table of the ith procedure of the wafer with the model u is represented, the maximum number of the wafers which can be processed by the machine table at one time is represented, a fixed value which is preset by a manager is obtained, and T u,i The processing time of the wafer with the model u in the ith procedure is a fixed value preset by a manager,the transport time of the wafer with the model u in the ith procedure, including the transport time before processing and the transport time after processing, is a fixed value preset by a manager.
In this embodiment, the number N of wafers processed at the machine stage of the ith process is the maximum number N of wafers processed at the type 1 wafer u,i Processing time T u,i Delivery timeThe following table shows:
work serial number Machine table Maximum number of wafers processed Processing time Transit time
1 Polishing machine 4 90 10
2 Photoetching machine 50 60 15
3 Wafer etching equipment 20 75 10
4 Vapor deposition furnace 10 80 15
5 Test machine 50 20 10
In this embodiment, the processing time of each process for each batch is as follows:
s2: calculating the starting time of the ith procedure of the c-th waferThe specific formula is as follows:
wherein,for the start time of the ith wafer in the ith process, i.e. the start time of the ith wafer in the ith process, k is any integer from 1 to i-1, T c,k Representing the processing time of the c-th wafer in the k-th process;
s3: calculating the ending time of the c-th wafer in the i-th processThe specific formula is as follows:
s4: listing the time interval of the procedure: in the present embodiment, the interval between the expected start time and the expected end time of each process is set for each batchThe method comprises the following steps:
s5: after the time intervals of the process are listed, the time interval before which the same machine is used in the process is preferentially processed is found, and in this embodiment, the priority processing is: (0,910) the treatment method is as follows: comparing the number of the overlapped time intervals with the number of the machines which can be used in the time, and when the number of the overlapped time intervals is smaller than or equal to the number of the machines which can be used in the time intervals, distributing a batch for each machine to process; the number of the overlapped time intervals is larger than the number of the available machines in the time interval, each machine is firstly allocated with one batch for processing, the time interval of the process of the batches of the rest unassigned machines is delayed, and when idle machines exist, the time interval is calculated. According to the allocation rule, a plurality of allocation results will appear, and in this embodiment, the machine and the number of machines in each process are shown in the following table:
work serial number Machine table Quantity of
1 Polishing machine 6
2 Photoetching machine 2
3 Wafer etching equipment 2
4 Vapor deposition furnace 4
5 Test machine 5
The present embodiment prioritizes: (0,910) the overlapping time interval is 5, and the number of usable machines is 6, so that each machine is allocated one batch for processing.
S6: after processing a coincident time interval, continuing to process a subsequent time interval until all time intervals are processed:
the present embodiment then processes: (910,985) the overlapping time interval is 5, and the number of usable machines in the time interval is 2, so that the machines can be reassigned only according to the assignment rule, and the assignment result is:
the present embodiment then processes: (985,1145) the overlapping time interval is 2, and the number of usable machines in the time interval is 2, so that each machine is allocated one batch for processing.
The present embodiment then processes: (1060,1220) the overlapping time zone is 2, and the number of usable machines is 0, so that when there is an idle machine after the time zone of the process of the batch of unassigned machines, the time zone is calculated:
the present embodiment then processes: (1135,1295) the overlapping time interval is 1, and the number of usable machines in the time interval is 0, so that when there is an idle machine after the time interval of the process of the lot of unassigned machines, the time interval is calculated:
the present embodiment then processes: (1145,1200) the overlapping time interval is 2, and the number of usable machines in the time interval is 4, so that each machine is allocated one batch for processing.
The present embodiment then processes: (1305,1360) the overlapping time interval is 2, and the number of usable machines in the time interval is 4, so that each machine is allocated one batch for processing.
The present embodiment then processes: (1465,1520) the overlapping time interval is 1, and the number of usable machines in the time interval is 4, so that each machine is allocated one batch for processing.
The present embodiment then processes: (1200,1230) the overlapping time interval is 2, and the number of usable machines in the time interval is 5, so that each machine is allocated one batch for processing.
The present embodiment then processes: (1390,1420) the overlapping time interval is 2, and the number of usable machines in the time interval is 5, so that each machine is allocated one batch for processing.
The present embodiment then processes: (1520,1550) the overlapping time interval is 1, and the number of usable machines in the time interval is 5, so that each machine is allocated one batch for processing.
Thus, the time interval of process processing of each batch and the machine number of processing are obtained:
after the process generating unit generates the process of producing the wafer, the process comprises the following steps: the batch number, each process time interval set of each batch number use the machine set, the process generating unit transmits the process to the time comparing unit;
the time comparing unit selects the final end time of the latest process as the final end time according to the process transmitted by the process generating unit, and the final end time of the process in this embodiment is 1550min, which is worth to be noted that, in this embodiment, only a specific step description of process generation is made for one batch combination generated by the batch generating unit, the batch generating unit will generate a plurality of batch combinations, and the plurality of batch combinations will generate corresponding processes, the time comparing unit compares the final end time of the process transmitted by the process generating unit, selects the process with the earliest final end time as the final process, and transmits the final process to the automatic dispatch module;
the automatic dispatching module dispatches the wafer processing site according to the final procedure transmitted by the time comparison unit, and the specific method comprises the following steps: and controlling the conveying device to convey the wafers of the corresponding batch to the corresponding machine platform before the process starting time of each batch, and conveying the wafers of the corresponding batch from the machine platform of the process ending to the machine platform of the next process after the process of each batch is actually finished.
Example 4
The embodiment provides a specific step that the time comparison unit compares the final end time of the process transmitted by the process generation unit, wherein the final end time of 10 processes transmitted by the process generation unit is 1445min, 1490min, 1520min, 1550min, 1580min, 1610min, 1655min, 1715min, 1740min and 1850min, and the time comparison unit selects the process with the earliest final end time as the final process, namely selects the process with the final end time of 1445min as the final process.
Example 5
The embodiment provides a visual analysis system, carries out visual analysis to the dispatch condition of wafer processing scene, visual analysis system includes board monitoring module, overtime judgement module and suggestion module, and after the process generation module of RTD dispatch system generated final process, the process generation module transmitted final process to overtime judgement module, and the use of board monitoring module, overtime judgement module and suggestion module is as follows:
the machine monitoring module: the device comprises a time-out judging module, a time-out judging module and a time-out judging module, wherein the time-out judging module is used for monitoring the actual starting time of a batch processed by the machine currently, the number of wafers processed by the machine currently and the time processed by the machine currently;
and a timeout judging module: the method is used for judging through overtime judging rules according to the final procedure transmitted by the procedure generating module, the actual starting time of the batch currently processed by the machine transmitted by the machine monitoring module, the number of wafers which are finished by the batch currently processed by the machine and the time currently processed by the machine: if it isThe overtime judging module generates a current process hysteresis signal and transmits the current process hysteresis signal to the prompting module, wherein ∈>Representing the actual starting time of the c-th wafer in the i-th process, wherein alpha represents the reserved weight, represents the reserved time of which the corresponding proportion alpha-1 needs to be increased in the actual operation, and is a fixed value +.>Indicating the number of wafers produced in the c-th lot in the final process, ">Indicating the number of wafers which are finished in the c-th batch and are currently processed by the machine and monitored by the machine monitoring module, < + >>Indicating the time the machine has been currently working, +.>Indicating the expected end time of the c-th wafer in the i-th process, wherein the expected end time is the data in the final process; if it isThe overtime judging module generates a normal signal of the current working procedure and transmits the normal signal to the prompting module. />
The prompting module is used for: the visual large screen is used for controlling the visual large screen to prompt the staff according to the current process lag signal transmitted by the timeout judging module, and the specific mode is that the information of the lag process is displayed on the visual large screen, and the information of the lag process comprises: processing batch number c, currently ongoing process number i and predicted lag timeThe calculation formula is as follows:wherein (1)>Indicating the predicted hysteresis of the ith process of the c-th batchA compartment;
the visual large screen is used for controlling the visual large screen to prompt the staff according to the current process normal signal transmitted by the timeout judging module, and the specific mode is to display the information of the normal process on the visual large screen, wherein the information of the normal process comprises the following steps: processing batch number c, currently ongoing process number i, and information currently in a normal state.
Example 6
The embodiment provides the actual operation steps of a visual analysis system:
s7: the machine monitoring module monitors the actual start time 984min of the batch (batch 1) currently processed by the etching equipment 1, calculates the actual start time according to the time after the start of processing, monitors the number of the batch (batch 1) currently processed by the wafer etching equipment 1 and the number of the completed wafers, which is 20, monitors the time currently processed by the wafer etching equipment 1, which is 75min, and transmits the number of the completed wafers of the batch currently processed by the etching equipment 1 and the time currently processed by the etching equipment 1 to the overtime judging module;
s8: the overtime judging module judges according to the final procedure transmitted by the procedure generating module, the actual starting time of the batch currently processed by the machine transmitted by the machine monitoring module, the number of wafers of the batch currently processed by the machine and the time of the current processed by the machine through an overtime judging rule: if it isThe overtime judging module generates a current process hysteresis signal and transmits the current process hysteresis signal to the prompting module, wherein ∈>The actual starting time of the c-th wafer in the i-th process is represented, alpha represents the reserved weight, the reserved time of the corresponding proportion alpha-1 needs to be increased in the actual operation, the reserved time is a fixed value,indicating the number of wafers produced in the c-th lot in the final process, ">Indicating the number of wafers which are finished in the c-th batch and are currently processed by the machine and monitored by the machine monitoring module, < + >>Indicating the time the machine has been currently working, +.>Indicating the expected end time of the c-th wafer in the i-th process, wherein the expected end time is the data in the final process; if->The overtime judging module generates a normal signal of the current working procedure and transmits the normal signal to the prompting module. In this embodiment, <' > a->The actual start time of the 3 rd process for the 1 st wafer lot is 984min, α is 1.1,/day>The number of wafers produced in the final step 1 is 40, < >>For the number of wafers completed in the 1 st lot of the wafer etching apparatus 1 currently processed, the number of wafers completed in the 1 st lot is 20, and it is worth to be noted that, the time point when the machine monitoring module monitors the number of wafers completed in the 1 st lot of the wafer etching apparatus and the time when the machine currently processed is the time point when the machine completes the wafer currently being processed, in this embodiment, the machine monitoring module monitors the number of wafers completed in the 1 st lot of the wafer etching apparatus and the time when the machine currently processed after the wafer currently processed is completed, the machine monitoring module monitors the number of wafers completed in the 1 st lot of the wafer etching apparatus and the time when the machine currently processed is the same>For the time that the wafer etching device 1 has been currently being processed, 75min,/h>The estimated end time of the 1 st wafer in the 3 rd process is 1145min, and the estimated end time is calculated according to the time from the time point when the processing starts, and then: />The overtime judging module generates a current process hysteresis signal and transmits the current process hysteresis signal to the prompting module;
s9: the prompting module controls the visualized large screen to prompt the staff according to the current process hysteresis signal transmitted by the timeout judging module, and the specific mode is to display the information of the hysteresis process on the visualized large screen, wherein the information of the hysteresis process comprises the following steps: processing batch number c, currently ongoing process number i and predicted lag timeThe calculation formula is as follows:wherein (1)>Indicating the predicted lag time of the ith process of the c-th batch; in this example, the lag time is +.>The 1 st run, 3 rd run, would therefore be displayed on the visualization large screen with an expected lag of 4 minutes. />

Claims (5)

1. An RTD dispatch system comprising: the system comprises a production flow making module, a production task issuing module, a procedure generating module and an automatic dispatching module: wherein,
and the production flow making module is used for: the method is used for making a production flow by production management personnel, and the specific content of the production flow comprises the following steps: after a production manager formulates a production flow by using a production flow designating module, the production flow formulating module transmits the production flow to a procedure generating module;
and the production task issuing module comprises the following steps: the method is used for making production tasks by production management personnel, and the specific contents of the production tasks include: after the production task is formulated by a production manager, the production task is transmitted to the procedure generation module by the production flow formulation module;
the procedure generating module: the production process and the production task transmitted by the module are formulated according to the production process, the production task transmitted by the module is issued, a final process is generated through a process generation strategy, and the final process is transmitted to the automatic dispatching module;
and the automatic dispatching module is used for: the method is used for dispatching the wafer processing site according to the final procedure of the procedure generation module transmission, and comprises the following steps: controlling a conveying device to convey the wafers of the corresponding batch to the corresponding machine platform before the process starting time of each batch, and conveying the wafers of the corresponding batch from the machine platform of the ending process to the machine platform of the next process after the process of each batch is actually finished;
the process generation strategy comprises the following specific steps:
s1: the processing time of each process of each batch is calculated, and the specific formula is as follows:
wherein T is c,i Representing the processing time of the c-th wafer in the i-th process, CEIL () is an upward rounding symbol, representing the upward rounding operation, N c Indicating the number of wafers processed in the c th batch, N u,i The maximum processing wafer number of the machine table of the ith procedure of the wafer with the model u is represented, the maximum number of the wafers which can be processed by the machine table at one time is represented, a fixed value which is preset by a manager is obtained, and T u,i The processing time of the wafer with the model u in the ith procedure is expressed to be managedThe fixed value which is established in advance by the personnel,the transportation time of the wafer with the model u in the ith procedure is represented, and the transportation time comprises the transportation time before processing and the transportation time after processing, which are fixed values prepared in advance for management staff;
s2: calculating the estimated start time of each process of each batchThe specific formula is as follows:
wherein,indicating the expected start time of the c-th wafer in the i-th process, i.e. the expected start time of the c-th wafer in the i-th process, k is any integer from 1 to i-1, T c,k Representing the processing time of the c-th wafer in the k-th process;
s3: calculating the expected end time of each process of each batchThe specific formula is as follows:
wherein,indicating the expected end time of the c-th wafer in the i-th process, i.e. the c-th wafer is expected to end in the i-th process at the time point, k is any integer from 1 to i, T c,k Representing the processing time of the c-th wafer in the k-th process;
s4: listing time intervals of the processInterval for predicted start time and predicted end time of each process of each batch
S5: after the time intervals of the working procedures are listed, the intervals which are overlapped and are the same with the machines used in the working procedures are found, the time interval which is positioned before is preferentially processed, the number of the overlapped time intervals is compared with the number of the machines which can be used in the time, and when the number of the overlapped time intervals is smaller than or equal to the number of the machines which can be used in the time interval, a batch is allocated to each machine for processing; the number of the overlapped time intervals is larger than the number of the machines which can be used in the time interval, each machine is firstly allocated with a batch for processing, the time interval of the process of the batch of the rest unassigned machines is delayed, and when idle machines exist, the time interval is calculated;
s6: after processing one overlapping time interval, continuing to process the subsequent time interval until all time intervals are processed, thereby obtaining the time interval of working procedure processing and the machine serial number of processing of each batch.
2. The RTD dispatch system of claim 1, wherein the process generation module comprises:
a batch generation unit: the batch generation unit is used for generating batch combinations according to the production tasks transmitted by the production task issuing module through a batch generation strategy, wherein the contents of the batch combinations comprise batch numbers, wafer types and batch wafer numbers, and after the batch combinations are generated, the batch generation unit transmits the batch combinations to the process unit;
a process generation unit: the process for generating the production wafer according to the batch combination transmitted by the batch generation unit and the production flow transmitted by the production flow formulation module through the process generation strategy comprises the following steps: the process generating unit transmits the process to the time comparing unit after the process generating unit generates the process for producing the wafer;
a time comparison unit: and the time comparison unit is used for comparing the final end time of the process transmitted by the process generation unit, selecting the process with the earliest final end time as the final process, and transmitting the final process to the automatic dispatch module after the final process is generated by the time comparison unit.
3. The RTD dispatch system of claim 2, wherein the batch generation strategy specifically comprises the steps of:
generating batches according to the wafer types and the wafer numbers in the production tasks transmitted by the production task issuing module, wherein the specific generation rules are as follows:
number of wafers in lot N for generating wafers in lot c c ，N c The following two conditions are satisfied:
condition one:
wherein,indicating the minimum lot number of wafers of type u, i.e. how many, if any, wafers of type u are processed in a lot>Indicating the maximum lot number of wafers of type u, i.e., how many, N, wafers of type u are processed up to one lot c The number of wafers in the batch of wafers in the c-th batch is represented;
condition II:
wherein c u A lot set representing wafers of type u, i.e., lots in the set all produce wafers of type u,wafer representing wafer type u in production taskThe number of circles.
4. The visual RTD dispatching analysis system based on the RTD dispatching system of claim 1, wherein the visual RTD dispatching analysis system comprises a machine monitoring module, a timeout judging module and a prompting module, the visual RTD dispatching analysis system is connected with the RTD dispatching system in a network manner, and after a process generating module of the RTD dispatching system generates a final process, the process generating module transmits the final process to the timeout judging module, wherein the machine monitoring module, the timeout judging module and the prompting module have the following purposes:
the machine monitoring module: the device comprises a time-out judging module, a time-out judging module and a time-out judging module, wherein the time-out judging module is used for monitoring the actual starting time of the batch processed by the machine, the number of wafers processed by the machine, the time processed by the machine, the actual starting time of the batch processed by the machine, the number of wafers processed by the machine and the time processed by the machine;
and a timeout judging module: the method is used for judging through overtime judging rules according to the final procedure transmitted by the procedure generating module, the actual starting time of the batch currently processed by the machine transmitted by the machine monitoring module, the number of wafers which are finished by the batch currently processed by the machine and the time currently processed by the machine: if it isThe overtime judging module generates a current process hysteresis signal and transmits the current process hysteresis signal to the prompting module, wherein ∈>The actual starting time of the c-th wafer in the i-th process is represented, alpha represents the reserved weight, the reserved time of the corresponding proportion alpha-1 needs to be increased in the actual operation, the reserved time is a fixed value,indicating the number of wafers produced in the c-th lot in the final process, ">Indicating the number of wafers which are finished in the c-th batch and are currently processed by the machine and monitored by the machine monitoring module, < + >>Indicating the time the machine has been currently working, +.>Indicating the expected end time of the c-th wafer in the i-th process, wherein the expected end time is the data in the final process; if it isThe overtime judging module generates a normal signal of the current working procedure and transmits the normal signal to the prompting module;
the prompting module is used for: the visual large screen is used for controlling the visual large screen to prompt the staff according to the current process lag signal transmitted by the timeout judging module, and the specific mode is that the information of the lag process is displayed on the visual large screen, and the information of the lag process comprises: processing batch number c, currently ongoing process number i and predicted lag timeThe calculation formula is as follows:wherein (1)>Indicating the predicted lag time of the ith process of the c-th batch;
the visual large screen is used for controlling the visual large screen to prompt the staff according to the current process normal signal transmitted by the timeout judging module, and the specific mode is to display the information of the normal process on the visual large screen, wherein the information of the normal process comprises the following steps: processing batch number c, currently ongoing process number i, and information currently in a normal state.
5. The RTD dispatch visualization analysis system of claim 4, wherein a time point at which the tool monitoring module monitors a number of wafers currently processed in a lot that have been completed by the tool and a time at which the tool has been currently processed is a time point at which the tool has completed wafers currently being processed.
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