CN117283451A - Lithium niobate chip non-accompanying chip mounting method - Google Patents
Lithium niobate chip non-accompanying chip mounting method Download PDFInfo
- Publication number
- CN117283451A CN117283451A CN202311080894.5A CN202311080894A CN117283451A CN 117283451 A CN117283451 A CN 117283451A CN 202311080894 A CN202311080894 A CN 202311080894A CN 117283451 A CN117283451 A CN 117283451A
- Authority
- CN
- China
- Prior art keywords
- chip
- accompanying
- sheet
- lithium niobate
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 18
- 238000004528 spin coating Methods 0.000 claims abstract description 10
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002253 acid Substances 0.000 claims abstract description 6
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 6
- 238000011068 loading method Methods 0.000 claims description 19
- 238000000227 grinding Methods 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 5
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000000306 component Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008832 photodamage Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Abstract
The invention discloses a lithium niobate chip non-accompanying chip mounting method, which comprises the following steps: preparing a companion abrasive disc and a companion abrasive disc, and respectively adhering the input end and the output end of the companion abrasive disc to obtain a companion abrasive disc assembly; preparing a lithium niobate chip; clamping the accompanying abrasive disc, the accompanying abrasive disc assembly and the lithium acid chip to obtain a chip assembly; and spin-coating glue on four sides of the chip assembly and curing. The lithium niobate chip without accompanying sheets can be ground, so that the reliability and performance of the lithium niobate device are improved.
Description
Technical Field
The invention belongs to the technical field of integrated optical devices, and particularly relates to a lithium niobate chip non-accompanying chip loading method.
Background
When the lithium niobate chip is used for producing a high-speed electro-optic modulator, the modulator has the advantages of small chirp, small transmission loss, large extinction ratio, good stability and strong light damage resistance, and can realize broadband modulation. High-speed electro-optic modulator devices have therefore been widely used and there is a great deal of room for development, and for such applications, they are the most promising dielectric materials, so broadband lithium niobate electro-optic modulators are currently used in many microwave photonics systems as the core device for electro-optic conversion. The lithium niobate chip is a core component, the input end and the output end of the chip produced at present are all in a accompanying sheet structure, the accompanying sheet is 1mm x 2mm in size, and the accompanying sheet in size frequently falls off or lacks adhesive under the accompanying sheet after being polished, so that the reliability of the lithium niobate chip is seriously influenced.
Disclosure of Invention
The invention solves the technical problems that: the defect of the prior art is overcome, and the lithium niobate chip card loading method without accompanying sheets is provided, so that the lithium niobate chip without accompanying sheets can be ground, and further the reliability and the performance of a lithium niobate device are improved.
The invention aims at realizing the following technical scheme: a lithium niobate chip no-accompanying-chip clamping method comprises the following steps: preparing a companion abrasive disc and a companion abrasive disc, and respectively adhering the input end and the output end of the companion abrasive disc to obtain a companion abrasive disc assembly; preparing a lithium niobate chip; clamping the accompanying abrasive disc, the accompanying abrasive disc assembly and the lithium acid chip to obtain a chip assembly; and spin-coating glue on four sides of the chip assembly and curing.
In the method for loading the lithium niobate chip without accompanying sheets, the accompanying sheet component comprises accompanying sheets and two accompanying sheets; wherein, the input end of the accompanying and wearing piece is adhered with one accompanying and wearing piece, and the output end of the accompanying and wearing piece is adhered with another accompanying and wearing piece; the edge of the accompanying sheet is aligned with the edge of the accompanying sheet.
In the method for clamping the lithium niobate chip without accompanying sheets, the adhesive is silicon rubber, and the adhesive is heated for solidification after being adhered; wherein the curing condition is 80 ℃ and the duration time is 1h.
In the above-mentioned lithium niobate chip no accompanying sheet card loading method, preparing the lithium niobate chip includes: and (3) cutting the lithium niobate chip by a cutting machine, cleaning, spin-coating a photoresist layer on the surface, and curing at normal temperature for later use.
In the above-mentioned lithium niobate chip does not have a chip dress card method, carry out the dress card with accompanying abrasive disc, accompanying abrasive disc subassembly and lithium acid chip and obtain the chip assembly including: and (3) preparing a chip bonding platform, cleaning dirt on the surface of the bonding platform, and then starting bonding, wherein the first chip is a partner chip, the second chip is a partner chip assembly, the third chip is a lithium niobate chip, the fourth chip is a partner chip assembly, and the fifth chip is a partner chip assembly, so as to obtain the chip assembly.
In the method for mounting the lithium niobate chip without accompanying sheets, the upper side surface, the lower side surface, the left side surface and the right side surface of the chip assembly are coated with UV glue in a spin mode and then solidified; wherein the curing is carried out for 2min by the irradiation of a surface light source.
In the method for clamping the lithium niobate chip without accompanying sheets, the accompanying sheets and the lithium niobate chip have the same size.
In the method for clamping the lithium niobate chip without accompanying sheets, the width of the accompanying sheets is 2mm, the thickness of the accompanying sheets is 0.5mm, and the thickness of the accompanying sheets is 1mm.
In the method for mounting the lithium niobate chip without accompanying sheets, the thickness of the lithium niobate chip is 1mm, the curing condition of the photoresist is normal temperature curing, and the thickness of the spin-on photoresist is 50-100 mu m.
In the method for loading the lithium niobate chip without accompanying sheets, the width of the accompanying sheets is equal to the length of the accompanying sheets.
Compared with the prior art, the invention has the following beneficial effects:
(1) The input end and the output end of the lithium niobate chip ground by the invention are not bonded by accompanying sheets.
(2) The length consistency and the verticality consistency of the lithium niobate chip ground by the method are better than those of the accompanying chip mounting and clamping process.
(3) The surface of the lithium niobate chip without the accompanying sheet ground by the invention has no stress on the chip caused by the accompanying sheet adhesive, thereby improving the overall performance of the lithium niobate chip.
(4) The lithium niobate chip without the accompanying sheet ground by the invention is easier to clean.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
FIG. 1 is a schematic view of a card loading base according to an embodiment of the present invention;
fig. 2 is a schematic view of a companion sheet provided in an embodiment of the present invention;
fig. 3 is a schematic diagram of a cosheet provided in an embodiment of the present invention;
fig. 4 is a schematic diagram of a lithium niobate chip provided in an embodiment of the present invention;
fig. 5 is an overall structure diagram of a chip after mounting a card according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
The embodiment provides a lithium niobate chip non-accompanying-sheet clamping method, which comprises the following steps:
preparing a companion abrasive disc and a companion abrasive disc, and respectively adhering the input end and the output end of the companion abrasive disc to obtain a companion abrasive disc assembly;
preparing a lithium niobate chip;
clamping the accompanying abrasive disc, the accompanying abrasive disc assembly and the lithium acid chip to obtain a chip assembly;
and spin-coating glue on four sides of the chip assembly and curing.
Specifically, the preparation of adhesive: the lithium niobate chip no-accompanying-piece card-mounting process needs 3 glue, one glue is used for bonding the chips, and the glue is UV glue; the other glue is silicon rubber, and the glue is used for bonding the accompanying sheet and the accompanying sheet; the last glue is photoresist and is used for protecting the surface pattern of the formal chip. The UV glue is a removable UV glue and is resistant to grinding.
Preparation of accompanying grinding sheets: and (3) bonding the input end and the output end of the cut accompanying and cutting sheet (the size of the accompanying and cutting sheet is consistent with that of a formal lithium niobate chip) with the cut accompanying and cutting sheet respectively to obtain an accompanying and cutting sheet assembly, wherein the bonding adhesive is silicon rubber, and heating and curing are performed after bonding. The width of accompanying sheet is 2mm, and the thickness of accompanying sheet is 0.5mm, and the thickness of accompanying abrasive disc is 1mm. The accompanying and grinding sheet assembly comprises an accompanying and grinding sheet and two accompanying and grinding sheets; wherein, the input end of the accompanying and wearing piece is adhered with one accompanying and wearing piece, and the output end of the accompanying and wearing piece is adhered with another accompanying and wearing piece; the edge of the accompanying sheet is aligned with the edge of the accompanying sheet.
Preparing a lithium niobate chip: and (3) cutting the lithium niobate chip by a cutting machine, cleaning, spin-coating a photoresist layer on the surface, and curing at normal temperature for later use. The thickness of the lithium niobate chip is 1mm, the curing condition of the photoresist is normal temperature curing, and the spin coating thickness is 50 μm-100 μm.
And (3) chip card loading: the chip bonding platform is prepared, bonding is started after dirt on the surface of the bonding platform is cleaned, the first chip is a partner chip without a partner chip, the second chip is a partner chip with the partner chip, namely a partner chip assembly, the third chip is a lithium niobate chip without the partner chip, the fourth chip is a partner chip with the partner chip, namely a partner chip assembly, and the like, the partner chip and the formal chip are bonded alternately, and the last chip is a partner chip without the partner chip.
And (3) after chip card loading, curing: after the formal chip and the accompanying grinding sheets are placed, the upper end face and the lower end face are respectively coated with UV glue in a spin mode, and irradiation curing is conducted through a surface light source. The curing time of the UV adhesive is 2min, and meanwhile, the side surface of the whole assembly is also required to be coated with the UV adhesive in a spin mode, so that cracking during grinding is prevented.
As shown in fig. 1, a schematic diagram of a card loading base for placing chips according to the present invention is shown, and it can be seen that there are two main application planes of the card loading base, one is a chip back rest surface 1, and the other is a chip supporting surface 2.
After the base is ready, the preparation of the accompanying sheet component is carried out, the accompanying sheet component mainly comprises the accompanying sheet of fig. 2 and the accompanying sheet of fig. 3, the input end 3 and the output end 4 of the accompanying sheet are respectively bonded with the accompanying sheet by silicon rubber, the edge of the accompanying sheet is confirmed to be aligned with the edge of the accompanying sheet before solidification, the accompanying sheet component bonded with the accompanying sheet is solidified at high temperature after the alignment is confirmed, and the solidifying condition is 80 ℃ for 1h.
After the accompanying and grinding sheet assembly is prepared, a lithium niobate chip is prepared as shown in fig. 4, a photoresist layer is coated on the surface of the diced lithium niobate chip in a spin mode, and the lithium niobate chip is cured for 24 hours at normal temperature after the photoresist layer is coated in a spin mode.
After the accompanying and accompanied chip assembly and the lithium niobate chip are prepared, the chip assembly is assembled and clamped. Firstly, placing a piece of accompanying grinding sheet without accompanying sheets, and attaching a limiting surface 1 of a card base to the back of the accompanying grinding sheet; secondly, placing a piece of accompanying abrasive disc with accompanying sheets, and attaching the accompanying abrasive disc on the back surface; thirdly, placing a lithium niobate chip, wherein an input end and an output end are respectively aligned with the upper and lower accompanying sheets; fourthly, placing a piece of accompanying sheet, wherein the accompanying sheet on the front surface is aligned with the upper surface and the lower surface of the lithium niobate chip; fifthly, placing a piece of accompanying abrasive disc without accompanying sheets, wherein the back surface of the accompanying abrasive disc is vertically aligned with the upper accompanying abrasive disc; and step six, respectively spin-coating a layer of UV glue on the upper side, the lower side, the left side and the right side of the combined chip assembly as shown in fig. 5, and irradiating the surface light source up and down for 2min after spin-coating the UV glue.
The input end and the output end of the lithium niobate chip ground by the invention are not bonded by accompanying sheets. The length consistency and the verticality consistency of the lithium niobate chip ground by the method are better than those of the accompanying chip mounting and clamping process. The surface of the lithium niobate chip without the accompanying sheet ground by the invention has no stress on the chip caused by the accompanying sheet adhesive, thereby improving the overall performance of the lithium niobate chip. The lithium niobate chip without the accompanying sheet ground by the invention is easier to clean.
Although the present invention has been described in terms of the preferred embodiments, it is not intended to be limited to the embodiments, and any person skilled in the art can make any possible variations and modifications to the technical solution of the present invention by using the methods and technical matters disclosed above without departing from the spirit and scope of the present invention, so any simple modifications, equivalent variations and modifications to the embodiments described above according to the technical matters of the present invention are within the scope of the technical matters of the present invention.
Claims (10)
1. The lithium niobate chip no-accompanying-sheet clamping method is characterized by comprising the following steps of:
preparing a companion abrasive disc and a companion abrasive disc, and respectively adhering the input end and the output end of the companion abrasive disc to obtain a companion abrasive disc assembly;
preparing a lithium niobate chip;
clamping the accompanying abrasive disc, the accompanying abrasive disc assembly and the lithium acid chip to obtain a chip assembly;
and spin-coating glue on four sides of the chip assembly and curing.
2. The lithium niobate chip no-accompanying-sheet loading method according to claim 1, wherein: the accompanying sheet assembly comprises an accompanying sheet and two accompanying sheets; wherein,
the input end of the accompanying grinding sheet is adhered with one accompanying sheet, and the output end of the accompanying grinding sheet is adhered with the other accompanying sheet;
the edge of the accompanying sheet is aligned with the edge of the accompanying sheet.
3. The lithium niobate chip no-accompanying-sheet loading method according to claim 2, wherein: the adhesive is silicon rubber, and is heated for solidification after bonding; wherein the curing condition is 80 ℃ and the duration time is 1h.
4. The lithium niobate chip no-accompanying-sheet loading method according to claim 1, wherein: the preparation of the lithium niobate chip includes:
and (3) cutting the lithium niobate chip by a cutting machine, cleaning, spin-coating a photoresist layer on the surface, and curing at normal temperature for later use.
5. The lithium niobate chip no-accompanying-sheet loading method according to claim 1, wherein: clamping the accompanying sheet, the accompanying sheet component and the lithium acid chip to obtain a chip assembly comprises the following steps:
and (3) preparing a chip bonding platform, cleaning dirt on the surface of the bonding platform, and then starting bonding, wherein the first chip is a partner chip, the second chip is a partner chip assembly, the third chip is a lithium niobate chip, the fourth chip is a partner chip assembly, and the fifth chip is a partner chip assembly, so as to obtain the chip assembly.
6. The lithium niobate chip no-accompanying-sheet loading method according to claim 1, wherein: the upper side, the lower side, the left side and the right side of the chip assembly are coated with UV glue in a spin mode and then cured; wherein the curing is carried out for 2min by the irradiation of a surface light source.
7. The lithium niobate chip no-accompanying-sheet loading method according to claim 1, wherein: the accompanying and wearing piece and the lithium niobate chip are equal in size.
8. The lithium niobate chip no-accompanying-sheet loading method according to claim 1, wherein: the width of accompanying sheet is 2mm, the thickness of accompanying sheet is 0.5mm, and the thickness of accompanying sheet is 1mm.
9. The lithium niobate chip no-accompanying-sheet loading method according to claim 4, wherein: the thickness of the lithium niobate chip is 1mm, the curing condition of the photoresist is normal temperature curing, and the thickness of the spin-on photoresist is 50-100 mu m.
10. The lithium niobate chip no-accompanying-sheet loading method according to claim 1, wherein: the width of the accompanying sheet is equal to the length of the accompanying sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311080894.5A CN117283451A (en) | 2023-08-25 | 2023-08-25 | Lithium niobate chip non-accompanying chip mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311080894.5A CN117283451A (en) | 2023-08-25 | 2023-08-25 | Lithium niobate chip non-accompanying chip mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117283451A true CN117283451A (en) | 2023-12-26 |
Family
ID=89243440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311080894.5A Pending CN117283451A (en) | 2023-08-25 | 2023-08-25 | Lithium niobate chip non-accompanying chip mounting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117283451A (en) |
-
2023
- 2023-08-25 CN CN202311080894.5A patent/CN117283451A/en active Pending
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