CN117279358A - Suction nozzle structure of automatic chip mounter - Google Patents
Suction nozzle structure of automatic chip mounter Download PDFInfo
- Publication number
- CN117279358A CN117279358A CN202311440520.XA CN202311440520A CN117279358A CN 117279358 A CN117279358 A CN 117279358A CN 202311440520 A CN202311440520 A CN 202311440520A CN 117279358 A CN117279358 A CN 117279358A
- Authority
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- China
- Prior art keywords
- negative pressure
- suction nozzle
- air
- groove
- sliding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 210000003437 trachea Anatomy 0.000 claims abstract description 5
- 238000007664 blowing Methods 0.000 abstract description 13
- 238000001179 sorption measurement Methods 0.000 abstract description 10
- 239000012535 impurity Substances 0.000 abstract description 8
- 239000002245 particle Substances 0.000 abstract description 5
- 238000004146 energy storage Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 239000000428 dust Substances 0.000 description 5
- 230000003749 cleanliness Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000011001 backwashing Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
- B01D46/106—Ring-shaped filtering elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
Abstract
The application discloses suction nozzle structure of automatic chip mounter, through offer the annular and slip has cup jointed the filter ring in the casing inside, utilize and connect gliding slider at the trachea can guarantee certain leakproofness, pressure release when avoiding the negative pressure to can utilize the filter ring to filter the air when carrying out negative pressure and inhale, avoid impurity particle to enter into inside the negative pressure generator, guarantee the stability of vacuum, improve stability on the whole; the negative pressure groove is formed in the top of the air cavity, the negative pressure groove is internally provided with a negative pressure suction pipe matched with the suction nozzle and used for blowing air, the negative pressure spring energy storage is moved and compressed by the sliding plate in the negative pressure groove when the negative pressure suction pipe is used for driving the sliding plate in the negative pressure groove to move, then the negative pressure is stabilized by the sliding plate and the negative pressure groove after the follow-up adsorption of components, the negative pressure generator is not required to work all the time, the air pressure can be shared through the sliding plate and the negative pressure groove when the air is blown, the components can be stably placed on the PCB, and the patch precision is guaranteed.
Description
Technical Field
The application relates to the technical field of chip mounters, in particular to a suction nozzle structure of an automatic chip mounter.
Background
The chip mounter is also called a mounter, and the surface mounting components are accurately placed on a PCB (printed circuit board) pad by moving a mounting head, wherein the components are mainly taken and placed by using a suction nozzle, namely a suction component arranged on the mounting head, the suction nozzle is used for generating negative pressure on the suction nozzle through a negative pressure system to suck the components and move the components to a required position, then the negative pressure is canceled, so that the components can be placed at a proper position on the PCB, the existing suction nozzle has a simple structure and various types, but certain problems exist in actual use:
firstly, the current suction nozzle mainly utilizes the adsorption effect of vacuum to suck components, and uses blowing to place components adsorbed on the suction nozzle on the coordinate position of a circuit board, but in the long-term use process, the vacuum suction nozzle is easy to suck to cause the vacuum degree to be reduced in the vacuum generator due to dust accumulation, and the traditional filter element adding mode is easy to block the filter element, so that the subsequent negative pressure suction is influenced, the application range of the suction nozzle is limited, and the suction nozzle cannot be ensured to realize stable adsorption of components;
secondly, current suction nozzle is in order to guarantee to reduce the buffering when adsorbing the components and parts, but general suction nozzle head is scalable slip and cup joints the spring, and such structure is simple to play the cushioning effect, but its one side has influenced the leakproofness of suction nozzle, because slip can not guarantee absolute leakproofness, lead to the negative pressure unstable very easily to cause the components and parts to drop, on the other hand, need guarantee to inhale with vacuum negative pressure ware always after the suction nozzle adsorbs components and parts to guarantee the vacuum degree, and cause the sudden air current too big to make the components appear certain rocking when placing when follow-up blowing easily, lead to the paster precision to appear problem, also can influence the effect and the quality of paster.
Disclosure of Invention
The application provides a suction nozzle structure of automatic chip mounter, possesses the advantage that adsorption stability is high, effectual for solve the problem that the background art proposed.
In order to achieve the above purpose, the present application adopts the following technical scheme: the utility model provides an automatic change suction nozzle structure of chip mounter, includes the casing, the negative pressure mouth has been seted up at the top of casing, the spout has been seted up to the bottom of casing, the inside slip of spout has cup jointed the slider, the bottom fixedly connected with suction nozzle head of slider, the outer lane fixed mounting of suction nozzle head has the annular plate, fixedly connected with buffer spring between the bottom surface of the top of annular plate and casing, the air cavity has been seted up at the top position that the casing is inside to be located the spout, fixedly connected with trachea between slider and the air cavity, and the inner chamber and the air cavity of trachea intercommunication slider, the annular has been seted up in the inside outer lane position that is close to, evenly spaced between negative pressure mouth and the annular is equipped with the air vent, evenly spaced between annular and the air cavity is equipped with the air vent, the annular inner wall has slidingly cup jointed the filter ring, the inside fixed mounting of air vent has first automatically controlled valve, fixedly connected with reset spring between the top and the annular roof of filter ring.
Further, an upper limit ring is fixedly arranged on the upper half part of the inner wall of the annular groove, a lower limit ring is fixedly arranged on the lower half part of the inner wall of the annular groove, electromagnetic switches are symmetrically arranged at the bottom of the upper limit ring and the top of the lower limit ring, and a threaded shaft is sleeved on the side wall of the bottom of the annular groove in a threaded manner.
Further, the first electric control valve is in a normally open state, and is closed when the electromagnetic switch on the upper limiting ring is pressed, and is opened again when the electromagnetic switch on the lower limiting ring is pressed.
Further, the negative pressure groove is formed in the shell and is communicated with the air cavity, the sliding plate is sleeved in the negative pressure groove in a sliding mode, a corrugated pipe is fixedly connected between the top of the sliding plate and the top wall of the negative pressure groove, a negative pressure spring is fixedly connected between the bottom of the sliding plate and the bottom wall of the negative pressure groove, and an air outlet hole communicated with a negative pressure port is formed in the top wall of the negative pressure groove.
Further, a through hole is formed in the middle of the sliding plate, a first one-way valve is fixedly arranged in the sliding plate, a second one-way valve is fixedly arranged at the bottom position in the air outlet hole, and a second electric control valve is fixedly arranged at the top position in the air outlet hole.
Further, the first one-way valve and the second one-way valve allow the air to flow upwards in one way, and the second electric control valve is closed in the suction nozzle negative pressure stage and is in an open state in the rest of time.
Compared with the prior art, the suction nozzle structure of the automatic chip mounter has the advantages that the annular groove is formed in the shell, the filter ring is sleeved in the shell in a sliding manner, the sliding block connected with the air pipe is utilized to ensure certain tightness, pressure release during negative pressure is avoided, the filter ring can be utilized to filter air during negative pressure suction, impurity particles are prevented from entering the negative pressure generator, stability of vacuum degree is guaranteed, and meanwhile, filtered impurities cannot be carried out during blowing, so that effective filtering effect can be achieved according to movement of the filter ring in the negative pressure and blowing process, work of the suction nozzle is not influenced, and stability is improved as a whole;
through seting up the negative pressure groove in the top department of air cavity to negative pressure inslot portion is provided with the negative pressure of slide cooperation suction nozzle and inhales and blow, compared in prior art, utilize to drive the inside slide of negative pressure groove and remove and compress negative pressure spring energy storage when the negative pressure is inhaled, then can utilize slide and negative pressure groove to carry out the negative pressure stability after follow-up absorption components and parts, need not negative pressure generator work always, can also share the air pressure through slide and negative pressure groove simultaneously when blowing, guarantee that components and parts can be stable place to the PCB board on, guarantee the paster precision.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description, serve to explain the principles of the disclosure.
The disclosure may be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a top plan view of the overall structure of the present invention;
FIG. 3 is an overall elevation view of the structure of the present invention;
FIG. 4 is a partial cross-sectional view of the entire structure of the present invention;
FIG. 5 is a cross-sectional view taken along line A-A of FIG. 2;
FIG. 6 is a cross-sectional view B-B of FIG. 3;
fig. 7 is an enlarged view of fig. 4 at C.
Wherein: 1. a housing; 101. a negative pressure port; 102. a chute; 103. an air cavity; 104. a ring groove; 105. a vent hole; 106. an air guide hole; 107. a negative pressure tank; 108. an air outlet hole; 2. a ring plate; 3. a slide block; 4. a suction nozzle head; 5. a buffer spring; 6. an air pipe; 7. a filter ring; 8. a first electrically controlled valve; 9. an upper limit ring; 10. a lower limit ring; 11. an electromagnetic switch; 12. a return spring; 13. a threaded shaft; 14. a slide plate; 15. a bellows; 16. a negative pressure spring; 17. a first one-way valve; 18. a second one-way valve; 19. and a second electrically controlled valve.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
Referring to fig. 1-6, a suction nozzle structure of an automatic chip mounter comprises a housing 1, a negative pressure port 101 is formed at the top of the housing 1, a chute 102 is formed at the bottom of the housing 1, a sliding block 3 is sleeved in the chute 102 in a sliding manner, a suction nozzle head 4 is fixedly connected at the bottom of the sliding block 3, an annular rubber pad is arranged at the bottom of the suction nozzle head 4, the tightness of component adsorption is ensured, a ring plate 2 is fixedly arranged on the outer ring of the suction nozzle head 4, a buffer spring 5 is fixedly connected between the top of the ring plate 2 and the bottom surface of the housing 1, an air cavity 103 is formed at the top position of the chute 102 inside the housing 1, an air pipe 6 is fixedly connected between the sliding block 3 and the air cavity 103, the air pipe 6 is communicated with an inner cavity of the sliding block 3 and the air cavity 103, an annular groove 104 is formed at the position, close to the outer ring, ventilation holes 105 are uniformly spaced between the negative pressure port 101 and the annular groove 104, and the air cavity 103 are uniformly provided with air vents 106 at intervals, the negative pressure generator is communicated with the suction nozzle head 4 through the negative pressure port 101, the vent hole 105, the ring groove 104, the air vent hole 106, the air cavity 103, the air pipe 6 and the sliding block 3, thereby realizing the negative pressure adsorption effect and the blowing effect, the inner wall of the ring groove 104 is slidingly sleeved with the filter ring 7, the first electric control valve 8 is fixedly arranged in the air vent hole 106, the reset spring 12 is fixedly connected between the top of the filter ring 7 and the top wall of the ring groove 104, the reset spring 12 has the reset effect, the initial position can be restored after the displacement change of the filter ring 7 is ensured, and when no air pressure influence exists, the filter ring 7 is positioned above the air vent hole 106 and the top is spaced from the upper limit ring 9, the upper half part of the inner wall of the ring groove 104 is fixedly provided with the upper limit ring 9, the lower half part of the inner wall of the ring groove 104 is fixedly provided with the lower limit ring 10, the electromagnetic switch 11 is symmetrically arranged at the bottom of the upper limit ring 9 and the top of the lower limit ring 10, the filter ring 7 is limited by the upper limit ring 9 and the lower limit ring 10, so that larger displacement is prevented when the filter ring 7 slides up and down, and the filter ring 7 cannot be reset later, the electromagnetic switch 11 is triggered when the filter ring 7 slides up and down to the maximum position, thereby realizing the switch control of the first electric control valve 8, further adjusting the position of the filter ring 7 and the direction of the air pressure acting on the filter ring 7 according to the pressure, realizing the filtering and backwashing effects, the threaded shaft 13 is sleeved on the side wall of the bottom of the ring groove 104, the threaded shaft 13 can be opened, dust impurities inside the ring groove 104 can be conveniently cleaned, the bottom of the ring groove 104 is an inclined surface, the dust of the impurities can be accumulated to the outermost side, the first electric control valve 8 is in a normally open state, when the electromagnetic switch 11 on the upper limit ring 9 is pressed, the first electric control valve 8 is closed, when the electromagnetic switch 11 on the lower limit ring 10 is pressed, the first electric control valve 8 is opened again, when negative pressure is sucked, air enters the annular groove 104 through the air guide hole 106, at the moment, pressure acts on the bottom of the filter ring 7, thereby driving the filter ring 7 to move upwards and compressing the return spring 12, until the negative pressure drives the filter ring 7 to press against the electromagnetic switch 11, and then the first electric control valve 8 is closed, at the moment, the negative pressure can be disconnected, then when the air is blown, firstly, the air flow on the top of the annular groove 104 drives the filter ring 7 to move downwards to the position of the lower limit ring 10, the first electric control valve 8 is opened again to enable the air flow to enter the air cavity 103 from the air guide hole 106, and finally the suction nozzle head 4 is blown out, so that components can fall, and the air flow does not need to be filtered through the filter ring 7 in the blowing process, so that impurity particles on the filter ring 7 are not carried out, and meanwhile, due to the recoil force action received by the filter ring 7 in the blowing process, some particle impurities adsorbed at the bottom of the filter ring fall to the bottom of the ring groove 104, and the threaded shaft 13 can be opened for convenient discharge.
Referring to fig. 4-7, a negative pressure tank 107 is provided above the air cavity 103 in the housing 1, the negative pressure tank 107 is communicated with the air cavity 103, a filter screen is further provided at the communication part between the air cavity 103 and the negative pressure tank 107 to ensure the cleanliness of the air entering the negative pressure tank 107, since the air enters the negative pressure port 101 subsequently, it is necessary to filter the air, a sliding plate 14 is slidingly sleeved in the negative pressure tank 107, a bellows 15 is fixedly connected between the top of the sliding plate 14 and the top wall of the negative pressure tank 107, a negative pressure spring 16 is fixedly connected between the bottom of the sliding plate 14 and the bottom wall of the negative pressure tank 107, the sliding plate 14 cooperates with the negative pressure tank 107 to ensure that a stable effect is achieved in the process of negative pressure adsorption and blowing, thereby ensuring that components do not drop or unstably place, the top wall of the negative pressure tank 107 is provided with an air outlet 108 communicated with the negative pressure port 101, the negative pressure groove 107 is communicated with the negative pressure port 101 through the air outlet hole 108, but the negative pressure groove 107 is internally provided with the sliding plate 14 and the corrugated pipe 15, so that the air in the negative pressure groove 107 can enter the negative pressure port 101 only when the subsequent second electric control valve 19 is opened, and the end part communicated to the negative pressure port 101 adopts a flat transverse opening, so that the influence of difficult exhaust caused by air pressure can be avoided, the middle part of the sliding plate 14 is provided with a through hole, the inside of the sliding plate is fixedly provided with the first one-way valve 17, the bottom position of the inside of the air outlet hole 108 is fixedly provided with the second one-way valve 18, the top position of the inside of the air outlet hole 108 is fixedly provided with the second electric control valve 19, the air can only flow from the air cavity 103 to the negative pressure port 101 in one direction through the arrangement of the first one-way valve 17 and the second one-way valve 18, and the air is also required to be controlled by the second electric control valve 19, the first check valve 17 and the second check valve 18 allow the air to flow upwards in one direction, the second electric control valve 19 is closed at the suction nozzle negative pressure stage, and is in an open state in the rest time, suction is carried out through the negative pressure port 101 when negative pressure suction is carried out, therefore, part of suction is carried out from the suction nozzle head 4 through the air cavity 103 and components are sucked, the other part of suction is carried out through the bottom of the negative pressure groove 107 to drive the sliding plate 14 to move downwards, the negative pressure spring 16 is compressed, after the first electric control valve 8 is closed, the negative pressure port 101 is not required to provide negative pressure, at the moment, the sliding plate 14 has a tendency to move upwards under the action of the elasticity of the negative pressure spring 16, the tendency can be used for guaranteeing the state of negative pressure in the air cavity 103, namely stable adsorption of the components is realized, when the air blowing is carried out, the air pressure of the suction nozzle after the first electric control valve 8 is opened suddenly increases, at the moment, the negative pressure spring 16 has elasticity, part of the air pressure enters the negative pressure groove 107 to reset the sliding plate 14, the air flow blown out through the negative pressure groove 4 is small, the effect is avoided, and the components can be placed stably at the specified position of the PCB.
Working principle: when the device works, the mounting head is driven to move the driving shell 1 to a place where components are placed, then the driving shell is aligned to the components to move downwards until the bottom of the suction nozzle head 4 is propped against the components, the suction nozzle head 4 is pressed to drive the sliding block 3 to slide into the sliding groove 102, meanwhile, a buffer spring 5 is utilized to buffer the components to a certain extent, meanwhile, a negative pressure generator is used for pumping air through the negative pressure port 101 to generate negative pressure, the negative pressure is generated to the suction nozzle head 4 through the communication of the vent hole 105, the annular groove 104, the air vent hole 106, the air cavity 103, the air pipe 6 and the sliding block 3, the adsorption of the components is realized, the suction is also carried out through the negative pressure groove 107 in the negative pressure process, the sliding plate 14 is pressed down and the negative pressure spring 16 is compressed, and meanwhile, the air enters the corrugated pipe 15 through the first one-way valve 17;
after the components are adsorbed, the negative pressure gas is filtered by the filter ring 7 after entering the annular groove 104 from the air cavity 103, and the negative pressure gas flow drives the filter ring 7 to move upwards and prop against the upper limit ring 9, so that the first electric control valve 8 is closed by pressing the lower electromagnetic switch 11, then the negative pressure generator is not required to work all the time in the process of moving the suction nozzle, at the moment, the second electric control valve 19 is opened, the sliding plate 14 is driven to move upwards under the elastic force of the negative pressure spring 16, so that negative pressure is generated at the bottom of the negative pressure groove 107, namely, negative pressure is generated on the air cavity 103, and the suction nozzle head 4 is ensured to have negative pressure all the time so that the components are adsorbed;
when the components are driven to a proper position on the PCB, air is blown through the negative pressure generator, air enters the annular groove 104 through the negative pressure port 101 and the vent holes 105, the filter ring 7 is driven to move downwards, meanwhile, dust particles at the bottom of the back-blown air flow also fall to the bottom of the annular groove 104, the air blowing pressure enables the filter ring 7 to move to the position of the lower limiting ring 10 to be pressed against the electromagnetic switch 11, then the first electric control valve 8 is opened, at the moment, air pressure enters the air cavity 103 through the air guide holes 106, part of the air flow is utilized by the negative pressure groove 107, the sliding plate 14 is reset by matching with the negative pressure spring 16, the air in the corrugated pipe 15 is discharged from the second one-way valve 18 and the second electric control valve 19 to the negative pressure port 101 when the sliding plate 14 is reset, meanwhile, the air flow blown to the suction nozzle head 4 is smaller and stable, the situation that the components are unstable due to the air flow is driven is avoided, and accurate installation is ensured;
when the components and parts are placed, the blowing process is also finished, the filter ring 7 is restored to the original position again through the elasticity of the reset spring 12, the next adsorption is convenient, and meanwhile, when dust and impurities accumulated at the bottom of the annular groove 104 are excessive, the threaded shaft 13 is opened for cleaning, so that the cleanliness is ensured.
Claims (6)
1. The utility model provides an automatic change suction nozzle structure of chip mounter, its characterized in that, including casing (1), negative pressure mouth (101) have been seted up at the top of casing (1), spout (102) have been seted up to the bottom of casing (1), inside slip of spout (102) has cup jointed slider (3), the bottom fixedly connected with suction nozzle head (4) of slider (3), the outer lane fixed mounting of suction nozzle head (4) has annular plate (2), fixedly connected with buffer spring (5) between the bottom of top and casing (1) of annular plate (2), air cavity (103) have been seted up at the top position that is located spout (102) inside casing (1), fixedly connected with trachea (6) between slider (3) and air cavity (103), and the inner chamber and air cavity (103) of trachea (6) intercommunication slider (3), annular (104) have been seted up near the outer lane position in casing (1), evenly spaced apart between negative pressure mouth (101) and annular groove (104) be equipped with air vent (105), evenly be equipped with air vent (106) between annular groove (104) and air cavity (103), air vent (106) are cup jointed to the inside air vent (8) of a filter valve (8), a return spring (12) is fixedly connected between the top of the filter ring (7) and the top wall of the ring groove (104).
2. The suction nozzle structure of the automatic chip mounter according to claim 1, wherein an upper limit ring (9) is fixedly installed on the upper half portion of the inner wall of the annular groove (104), a lower limit ring (10) is fixedly installed on the lower half portion of the inner wall of the annular groove (104), electromagnetic switches (11) are symmetrically installed at the bottoms of the upper limit ring (9) and the tops of the lower limit ring (10), and a threaded shaft (13) is sleeved on the side wall threads at the bottom of the annular groove (104).
3. The suction nozzle structure of the automatic chip mounter according to claim 2, wherein the first electric control valve (8) is in a normally open state, and when the electromagnetic switch (11) on the upper limit ring (9) is pressed, the first electric control valve (8) is closed, and when the electromagnetic switch (11) on the lower limit ring (10) is pressed, the first electric control valve (8) is opened again.
4. The suction nozzle structure of the automatic chip mounter according to claim 1, wherein a negative pressure groove (107) is formed in the shell (1) above the air cavity (103), the negative pressure groove (107) is communicated with the air cavity (103), a sliding plate (14) is sleeved in the negative pressure groove (107) in a sliding manner, a corrugated pipe (15) is fixedly connected between the top of the sliding plate (14) and the top wall of the negative pressure groove (107), a negative pressure spring (16) is fixedly connected between the bottom of the sliding plate (14) and the bottom wall of the negative pressure groove (107), and an air outlet hole (108) communicated with the negative pressure port (101) is formed in the top wall of the negative pressure groove (107).
5. The suction nozzle structure of the automatic chip mounter according to claim 4, wherein a through hole is formed in the middle of the sliding plate (14), a first one-way valve (17) is fixedly installed inside the sliding plate, a second one-way valve (18) is fixedly installed at the bottom position inside the air outlet hole (108), and a second electric control valve (19) is fixedly installed at the top position inside the air outlet hole (108).
6. The suction nozzle structure of an automatic chip mounter according to claim 5, wherein said first check valve (17) and said second check valve (18) allow upward flow of gas in one direction, and said second electrically controlled valve (19) is closed at suction nozzle negative pressure stage and is opened at the rest of time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311440520.XA CN117279358A (en) | 2023-11-01 | 2023-11-01 | Suction nozzle structure of automatic chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311440520.XA CN117279358A (en) | 2023-11-01 | 2023-11-01 | Suction nozzle structure of automatic chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117279358A true CN117279358A (en) | 2023-12-22 |
Family
ID=89206394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311440520.XA Pending CN117279358A (en) | 2023-11-01 | 2023-11-01 | Suction nozzle structure of automatic chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117279358A (en) |
-
2023
- 2023-11-01 CN CN202311440520.XA patent/CN117279358A/en active Pending
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