CN117270644A

CN117270644A - Heat abstractor and server

Info

Publication number: CN117270644A
Application number: CN202311159713.8A
Authority: CN
Inventors: 张鹏; 陈彦; 崔新涛; 李兰兰
Original assignee: Dawning Data Infrastructure Innovation Technology Beijing Co ltd
Current assignee: Dawning Data Infrastructure Innovation Technology Beijing Co ltd
Priority date: 2023-09-08
Filing date: 2023-09-08
Publication date: 2023-12-22

Abstract

The application relates to a heat abstractor and a server. The heat dissipation device is used for a server, the server comprises a plurality of memories, the heat dissipation device comprises a first liquid cooling piece, heat conduction structural parts and a plurality of clamping pieces, a first flow channel for cooling medium to flow is arranged in the first liquid cooling piece, the heat conduction structural parts are arranged in one-to-one correspondence with the memories, each heat conduction structural part is attached to two opposite sides of the corresponding memory, the plurality of clamping pieces are respectively arranged in correspondence with the plurality of heat conduction structural parts, the clamping pieces are clamped on the outer sides of the corresponding heat conduction structural parts, and the heat conduction structural parts are connected with the first liquid cooling pieces so as to transfer heat generated by the corresponding memories to the first liquid cooling pieces to exchange heat with the cooling medium. According to the heat dissipation device, the heat conduction structural members and the memories are arranged in one-to-one correspondence, so that the installation position of any one heat conduction structural member cannot influence the installation positions of other memories when the installation position of any one heat conduction structural member is deviated, and the requirement on the installation precision of the heat dissipation device is reduced.

Description

Heat abstractor and server

Technical Field

The application relates to the technical field of server heat dissipation equipment, in particular to a heat dissipation device and a server.

Background

With the development of information communication technology (ICT, information and Communication Technology), the integration level of a server, which is a basic constituent unit of a data center, is higher and higher, and the memory power consumption of the server is increased, so that the heat dissipation capacity is increased. For this reason, a heat dissipating device is provided in the related art, in which a plurality of memories are inserted into the heat dissipating device, so that heat of the plurality of memories is transferred to the heat dissipating device to facilitate heat dissipation.

However, the mounting requirements for the heat sink in the related art are high.

Disclosure of Invention

Accordingly, it is necessary to provide a heat sink and a server capable of reducing the mounting requirement of the heat sink, in order to solve the problem of the high mounting requirement of the heat sink in the related art.

According to one aspect of the present application, there is provided a heat dissipating device for a server, the server including a plurality of memories, the heat dissipating device including:

the first liquid cooling piece is internally provided with a first flow passage for cooling medium to flow;

the heat conduction structural members are arranged in one-to-one correspondence with the memories, and each heat conduction structural member is attached to two opposite side surfaces of the corresponding memory; and

the clamping pieces are respectively arranged corresponding to the heat conduction structural members and are clamped on the outer sides of the corresponding heat conduction structural members;

The heat conduction structural member is connected with the first liquid cooling member so as to transfer heat generated by the corresponding memory to the first liquid cooling member to exchange heat with the cooling medium.

Above-mentioned heat abstractor sets up the clamping piece, makes heat conduction structure and memory closely laminate, and the heat that the memory produced can be transferred to on the first liquid cooling spare through heat conduction structure to utilize the cooling medium in the first liquid cooling spare to take away the heat. And because the heat conduction structural members are arranged in one-to-one correspondence with the memories, the mounting position of any one of the heat conduction structural members cannot influence the mounting positions of other memories when the mounting position of the heat conduction structural member is deviated, so that the requirement on the mounting precision of the heat dissipation device is reduced.

In one embodiment, each heat conducting structural member comprises two heat conducting members respectively attached to two side surfaces of the memory, and two attaching parts respectively located at two opposite ends of the heat conducting members in the longitudinal direction, wherein the attaching parts are connected with the first liquid cooling member;

the clamping pieces are clamped on the outer sides of the two corresponding heat conducting pieces of the heat conducting structural piece.

In one embodiment, the heat dissipating device further includes a memory support connected to the first liquid cooling member, and each of the attaching portions is attached to the memory support, so that heat generated by the memory is transferred to the first liquid cooling member by means of the memory support.

In one embodiment, the heat dissipating device further includes a plurality of connection assemblies corresponding to the plurality of fitting portions, respectively;

the connecting component is used for pressing and fastening the corresponding fitting part on the memory bracket.

In one embodiment, each connecting assembly comprises a first connecting piece and a first elastic piece which are in one-to-one correspondence with the fitting parts;

the first connecting piece comprises a first rod body respectively penetrating through the attaching part and the memory support, and a first head part arranged at one end of the first rod body extending out of the attaching part;

the first elastic piece is sleeved on the first rod body and connected between the first head and the attaching part, and the first elastic piece is configured to provide elastic force for enabling the corresponding attaching part to move towards one side close to the memory support.

In one embodiment, the connecting assembly comprises pressing pieces respectively corresponding to the plurality of fitting parts and second elastic pieces corresponding to the fitting parts one by one;

each pressing piece is arranged on one side of the corresponding plurality of attaching parts, which is far away from the memory support, and is detachably connected with the memory support;

Each second elastic piece is connected between the corresponding attaching portion and the pressing piece, and the second elastic piece is configured to provide elastic force for enabling the corresponding attaching portion to move towards one side close to the memory support.

In one embodiment, the pressing member extends lengthwise along an arrangement direction of the corresponding plurality of attaching portions, one end of the pressing member extends out of the corresponding plurality of attaching portions and is rotatably connected with the memory support, and the other end of the pressing member extends out of the corresponding plurality of attaching portions and is detachably connected with the memory support.

In one embodiment, the two heat conducting members include a first heat conducting member and a second heat conducting member; opposite ends of the first heat conduction piece in the longitudinal direction are respectively connected with the two attaching parts; the corresponding internal memories extend out of the two opposite ends of the second heat conduction piece in the longitudinal direction and are respectively attached to the two attaching parts;

an adhesive layer is arranged between the second heat conduction piece and the corresponding memory and the lamination part;

the clamping piece is clamped on the outer sides of the corresponding first heat conduction piece and the corresponding second heat conduction piece and is configured to provide elastic force for enabling the first heat conduction piece to be tightly attached to the corresponding memory.

In one embodiment, the two heat conducting members include a first heat conducting member and a second heat conducting member; opposite ends of the first heat conduction piece in the longitudinal direction are respectively connected with the two attaching parts; the second heat conduction piece comprises a first plate body and a second plate body which are opposite to each other and are arranged at intervals, the side edges of the same side of the first plate body and the side edges of the same side of the second plate body are connected with each other, the first plate body is attached to the corresponding side surface, far away from the first heat conduction piece, of the memory, and the second plate body is attached to the corresponding side surface, far away from the memory, of the first heat conduction piece;

a first bonding layer is arranged between the first plate body and the corresponding memory, and a second bonding layer is arranged between the second plate body and the corresponding first heat conduction piece;

the clamping piece is clamped on the outer sides of the first plate body and the second plate body, and the clamping piece is configured to provide elastic force for enabling the first heat conducting piece to be tightly attached to the corresponding memory.

In one embodiment, the first heat conducting member includes a metal plate, a heat pipe, or a temperature equalizing plate.

In one embodiment, the heat dissipating device further includes a heat conducting module connected to the memory support and the first liquid cooling member, respectively, and the heat conducting module is configured to transfer heat of the memory support to the first liquid cooling member; and/or

The heat dissipation device further comprises a second liquid cooling piece arranged between the memory brackets, and a second flow passage communicated with the first flow passage is arranged in the second liquid cooling piece so that the cooling medium flows in the second flow passage.

According to another aspect of the present application, there is provided a server including a heat dissipating device according to any one of the embodiments above, the server further including:

a circuit board and a plurality of memories;

the plug-in structures are arranged on the circuit board and are arranged in one-to-one correspondence with the memories;

and one side of the memory protruding out of the heat conduction structural member passes through the corresponding plug-in structure and is connected with the circuit board.

In one embodiment, each of the plugging structures includes a plugging member connected to the circuit board and used for allowing the corresponding memory to pass through, and two fasteners respectively located at two opposite ends of the plugging member in the longitudinal direction, wherein the two fasteners are used for fixing the corresponding memory relative to the circuit board.

In one embodiment, the heat dissipating device further includes operation pieces corresponding to the attaching portions one by one;

the operation piece is arranged on the corresponding attaching part in a penetrating manner along the direction of the corresponding attaching part pointing to the circuit board, and is configured to move towards one side close to the circuit board in an operable manner relative to the corresponding attaching part so as to be abutted to the buckle, so that the buckle can unlock the memory.

In one embodiment, the operation piece includes a second rod body penetrating through the corresponding attaching portion, and a second head portion disposed on a side, extending out of the attaching portion, of the second rod body away from the plugging structure, where one end, away from the second head portion, of the second rod body can abut against the corresponding buckle;

the heat dissipation device further comprises limiting pieces and third elastic pieces, wherein the limiting pieces and the attaching portions are in one-to-one correspondence, the limiting pieces are sleeved on the portion, which extends out of the second rod body, of the attaching portion, the portion, which is close to one side of the plug-in structure, is configured to be abutted against one side, which is close to the plug-in structure, of the attaching portion, and the third elastic pieces are connected between the second head portion and the attaching portion and are configured to provide elastic force for enabling the second head portion to move towards one side, which is far away from the attaching portion, of the second head portion.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present application.

Fig. 2 is a schematic partial view of the heat dissipating device in the embodiment shown in fig. 1.

Fig. 3 is an exploded view of the memory, thermally conductive structure and clamping member of the embodiment of fig. 1.

Fig. 4 is an assembly schematic diagram of the first heat conducting member, the second heat conducting member and the memory in the embodiment shown in fig. 1.

Fig. 5 is an assembly schematic diagram of the first heat conducting member, the second heat conducting member and the memory according to another embodiment of the present application.

Fig. 6 is a schematic structural diagram of a first heat conducting member according to an embodiment of the present application.

Fig. 7 is a schematic structural diagram of a first heat conducting member according to another embodiment of the present application.

Fig. 8 is a schematic structural view of a first heat conducting member according to another embodiment of the present application.

Fig. 9 is a partial schematic view of a heat dissipating device according to another embodiment of the present application.

Fig. 10 is a schematic partial view of a heat dissipating device according to another embodiment of the present application.

Fig. 11 is an assembly schematic diagram of a memory and a circuit board according to an embodiment of the present application.

Reference numerals illustrate:

100. a heat sink;

10. a first liquid cooling member;

20. a thermally conductive structural member; 21. a heat conductive member; 211. a first heat conductive member; 2111. a first heat pipe; 2112. a second heat pipe; 2113. a vacuum chamber; 212. a second heat conductive member; 2121. a first plate body; 2122. a second plate body; 22. a bonding part; 23. a first thermally conductive pad;

30. a clamping member;

40. a memory support;

50. a connection assembly; 51. a first connector; 511. a first rod body; 512. a first head; 53. a pressing member; 54. a second elastic member; 55. a third connecting member;

60. an operating member; 61. a second rod body; 62. a second head;

70. A limiting piece;

80. a third elastic member;

90. a heat conduction module; 91. a first connection portion; 92. a second connecting portion; 93. a third heat pipe;

110. a second liquid cooling member;

120. a second thermally conductive pad;

130. a first connection pipe;

140. a second connection pipe;

200. a memory;

300. a circuit board;

400. a plug-in structure; 410. a plug-in component; 420. a buckle.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., these terms refer to the orientation or positional relationship based on the drawings, which are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In this application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

In order to dissipate heat of the memory of the server, a heat dissipating device is provided in the related art, the heat dissipating device is mounted on a circuit board for plugging the memory, when the memory is plugged, a plurality of memories are plugged into the heat dissipating device respectively, and one side of each memory extending out of the heat dissipating device is plugged into the circuit board, so that the side surface of the memory is attached to the heat dissipating device, and heat generated by the memory is transferred to the heat dissipating device, thereby facilitating heat dissipation. However, the mounting requirements for the heat sink in the related art are high.

The inventor of the present application has found through research and analysis that the reason for the occurrence of the above problem is that in the related art, the heat dissipating device needs to be installed on the circuit board first, and then the plurality of memories are respectively inserted into the heat dissipating device and connected with the circuit board, so when there is a deviation in the installation position of the heat dissipating device, the installation positions of the plurality of memories are all deviated, which easily results in an increase in the difficulty of inserting and extracting the memories.

Accordingly, it is necessary to provide a heat sink and a server that can reduce the mounting requirements for the heat sink.

FIG. 1 is a schematic diagram of a heat dissipating device according to an embodiment of the present disclosure; FIG. 2 is a schematic view of a portion of the heat dissipating device of the embodiment shown in FIG. 1; fig. 3 is an exploded view of the memory, thermally conductive structure and clamping member of the embodiment of fig. 1.

Referring to fig. 1-3, a heat dissipating device 100 according to an embodiment of the present application is used for a server, where the server includes a plurality of memories 200, and the heat dissipating device 100 includes a first liquid cooling member 10, a heat conducting structural member 20, and a plurality of clamping members 30.

The first liquid cooling member 10 is provided with a first flow channel (not shown in the figure) for flowing a cooling medium, the heat conducting structural members 20 are arranged in a one-to-one correspondence with the memories 200, each heat conducting structural member 20 is attached to two opposite sides of the corresponding memory 200, the plurality of clamping members 30 are respectively arranged corresponding to the plurality of heat conducting structural members 20, and the clamping members 30 are clamped on the outer sides of the corresponding heat conducting structural members 20. The heat conducting structural member 20 is connected with the first liquid cooling member 10 to transfer heat generated by the corresponding memory 200 to the first liquid cooling member 10 for heat exchange with the cooling medium.

In the heat dissipating device 100, the heat conducting structural member 20 is attached to two sides of the corresponding memory 200, and the clamping member 30 is clamped on the outer side of the corresponding heat conducting structural member 20, so that the heat conducting structural member 20 is tightly attached to the side of the corresponding memory 200, and the heat generated by the memory 200 is transferred to the heat conducting structural member 20. By arranging the heat conduction structural member 20 to be connected with the first liquid cooling member 10, heat generated by the memory 200 can be transferred to the first liquid cooling member 10 through the heat conduction structural member 20 so as to exchange heat with a cooling medium in the first liquid cooling member 10. And because the heat-conducting structural members 20 and the internal memories 200 are arranged in a one-to-one correspondence manner, when the internal memories 200 are plugged in the corresponding positions on the server, the internal memories 200 and the corresponding heat-conducting structural members 20 and the clamping pieces 30 are plugged as a whole, and even if the mounting position of one internal memory 200 is deviated, the mounting positions of the other internal memories 200 cannot be influenced, so that the situation that the mounting positions of a plurality of internal memories 200 are deviated when the mounting positions of the heat dissipation device are deviated in the related art is avoided, and the requirement on the mounting precision of the heat dissipation device 100 is reduced. And because the memory 200 and the corresponding heat-conducting structural member 20 are integrally inserted when the memory 200 is inserted and pulled out, namely, when the memory 200 is inserted and pulled out from the corresponding position on the server, no relative movement occurs between the memory 200 and the heat-conducting structural member 20, the insertion and pulling difficulty of the memory 200 when the memory 200 is shifted in position is reduced, and the damage caused by larger insertion and pulling difficulty can be reduced.

Through setting up heat conduction structure 20 and memory 200 one-to-one, still make different heat conduction structure 20 can adopt different settings respectively to be applicable to memory 200 of different models, for example, can set up the heat conduction structure 20 and be used for the distance between the part of laminating with two opposite sides of memory 200 according to the thickness of corresponding memory 200, consequently improved the commonality of heat abstractor 100 to memory 200 of different models, be favorable to reducing the heat dissipation cost of server.

In the actual assembly process, the heat-conducting structural member 20 is installed on the outer side of the memory 200, then the clamping member 30 is clamped on the outer side of the heat-conducting structural member 20, and then the memory 200, the heat-conducting structural member 20 and the clamping member 30 are integrally inserted in corresponding positions of the server. Because the memories 200 can be plugged and unplugged independently, the requirement for the installation precision of each memory 200 and the corresponding heat conducting structural member 20 is reduced. And when the memory 200 or the heat conduction structural member 20 needs to be replaced, only the heat conduction structural member 20 corresponding to the single memory 200 needs to be replaced, so that the replacement and maintenance are convenient, and the cost is reduced.

It should be appreciated that the clamping members 30 are clamped on the outer sides of the corresponding heat conductive structural members 20, so that the heat conductive structural members 20 can be fixed relative to the memory 200, thereby facilitating the operation of inserting and extracting the memory 200, the heat conductive structural members 20 and the clamping members 30 as a whole. And since the clamping member 30 is clamped on the outer side of the heat conducting structural member 20, when the clamping member 30 needs to be assembled and disassembled on the outer side of the heat conducting member 21 so as to assemble or separate the memory 200 from the heat conducting structural member 20, the memory 200 is not damaged under the protection of the heat conducting structural member 20.

Optionally, the clamping members 30 are disposed in a one-to-one correspondence with the heat conductive structural members 20 (not shown).

In other embodiments, as shown in fig. 3, each heat conducting structure 20 corresponds to a plurality of clamping members 30, and the clamping members 30 corresponding to the same heat conducting structure 20 are spaced apart from each other along the longitudinal direction of the heat conducting structure 20, so that the heat conducting structure 20 is more reliably attached to the side of the corresponding memory 200. For example, as shown in fig. 3, each heat conducting structure 20 corresponds to two clamping members 30, and in other embodiments, the number of clamping members 30 corresponding to each heat conducting structure 20 may be other according to the use requirement, which is not limited herein.

Alternatively, the clamping member 30 may employ a snap fit.

Specifically, as shown in fig. 3, the heat-conducting structural member 20 extends along the longitudinal direction of the corresponding memory 200, so as to increase the contact area between the heat-conducting structural member 20 and the memory 200, thereby improving the heat transfer efficiency.

In some embodiments, as shown in fig. 2 and 3, each heat-conducting structure 20 includes two heat-conducting members 21 respectively attached to two sides of the internal memory 200, and two attaching portions 22 respectively located at opposite ends of the heat-conducting members 21 in the longitudinal direction, and the attaching portions 22 are connected to the first liquid-cooling member 10. The clamping members 30 are clamped on the outer sides of the two heat conducting members 21 of the corresponding heat conducting structural member 20. In this way, by providing the bonding portions 22, the heat generated by the memory 200 can be transferred to the two bonding portions 22 through the two corresponding heat conductive members 21, and then transferred to the first liquid cooling member 10 through the two bonding portions 22. It should be noted that, since the distance between the side surfaces of the two adjacent memories 200 is smaller, the two attaching portions 22 are disposed at the opposite ends of the heat conducting member 21 in the longitudinal direction, so as to meet the space requirement.

In some embodiments, as shown in fig. 4, the two heat conducting members 21 include a first heat conducting member 211 and a second heat conducting member 212, opposite ends of the first heat conducting member 211 in the longitudinal direction are respectively connected to the two attaching portions 22, opposite ends of the second heat conducting member 212 in the longitudinal direction extend out of the corresponding memories 200 and are respectively attached to the two attaching portions 22, and an adhesive layer (not shown) is disposed between the second heat conducting member 212 and the corresponding memories 200. As shown in fig. 3, the clamping member 30 is clamped at the outer sides of the corresponding first and second heat conductive members 211 and 212, and is configured to provide an elastic force for tightly fitting the first heat conductive member 211 to the corresponding memory 200. In this way, by providing the second heat conductive member 212 with the corresponding memory 200 extending from the opposite ends of the longitudinal direction, the second heat conductive member 212 transfers the heat of the side surface of the memory 200 attached thereto to the attaching portion 22. By arranging the second heat conducting element 212 to be connected with the memory 200 through the bonding layer, the second heat conducting element 212 is fixed relative to the memory 200, and the second heat conducting element 212 is attached to the corresponding memory 200 through the bonding layer, so that heat of the memory 200 can be transferred to the second heat conducting element 212. And through setting up the adhesive linkage, still be favorable to further reducing the thickness of second heat conduction spare 212 to be favorable to further reducing the whole thickness after heat conduction structure 20 and the corresponding memory 200 assembly. The clamping member 30 is configured to provide an elastic force for tightly fitting the first heat conductive member 211 to the corresponding memory 200, so that the first heat conductive member 211 can be fixed with respect to the corresponding memory 200, and the contact thermal resistance between the first heat conductive member 211 and the corresponding memory 200 is reduced.

Alternatively, the adhesive layer may be double-sided tape.

In other embodiments, as shown in fig. 5, the two heat conducting members 21 include a first heat conducting member 211 and a second heat conducting member 212, and opposite ends of the first heat conducting member 211 in the longitudinal direction are respectively connected to the two attaching portions 22. The second heat conductive member 212 includes a first plate 2121 and a second plate 2122 opposite to each other and disposed at intervals, sides of the same sides of the first plate 2121 and the second plate 2122 are connected to each other, the first plate 2121 is attached to a side of the corresponding memory 200 away from the first heat conductive member 211, and the second plate 2122 is attached to a side of the corresponding first heat conductive member 211 away from the memory 200. A first adhesive layer is disposed between the first plate 2121 and the memory 200, and a second adhesive layer (not shown) is disposed between the second plate 2122 and the corresponding first heat conductive member 211. The clamping member 30 (see fig. 3) is clamped to the outer sides of the first plate 2121 and the second plate 2122, and the clamping member 30 is configured to provide an elastic force for closely fitting the first heat conductive member 211 to the corresponding memory 200. In this way, the second heat conducting member 212 includes the first plate 2121 and the second plate 2122, so that the heat of the side surface of the memory 200 attached to the first plate 2121 is transferred to the second plate 2122, and then the heat is transferred to the side surface of the first heat conducting member 211 away from the memory 200 through the second plate 2122, so that the heat is transferred to the two attaching portions 22 through the first heat conducting member 211. The first plate 2121 is fixed to the memory 200 by providing the first adhesive layer, the first plate 2121 is bonded to the memory 200 by the first adhesive layer to transfer heat, the second plate 2122 is fixed to the first heat conductive member 211 by providing the second adhesive layer, and the second plate 2122 is bonded to the first heat conductive member 211 by the second adhesive layer to transfer heat. The bonding connection is realized by using the first bonding layer and the second bonding layer, which is beneficial to further reducing the thickness of the second heat conducting piece 212, thereby being beneficial to further reducing the overall thickness of the heat conducting structural member 20 after being assembled with the corresponding memory 200. The clamping member 20 is configured to provide an elastic force for tightly fitting the first heat conductive member 211 to the corresponding memory 200, so that the first heat conductive member 211 can be fixed with respect to the corresponding memory 200, and the contact thermal resistance between the first heat conductive member 211 and the corresponding memory 200 is reduced.

Alternatively, both the first adhesive layer and the second adhesive layer may use double-sided tape.

Alternatively, the second heat conductive member 212 may employ an insulating graphite sheet, so as to more effectively transfer heat of the side surface of the memory 200, which is bonded to the second heat conductive member 212, to the bonding portion 22 by utilizing the advantage of high thermal conductivity in the plane of the insulating graphite sheet. And, since the insulating graphite sheet also has the advantage of high flexibility, the second heat conductive member 212 may extend out of the memory 200 along the longitudinal direction thereof and be respectively bonded to the two bonding portions 22, and the second heat conductive member 212 may also include a first plate 2121 and a second plate 2122 disposed opposite to each other.

In other embodiments, the second heat conducting member 212 may also be made of sheet metal, so as to provide the second heat conducting member 212 with higher heat conductivity and allow the second heat conducting member 212 to have a smaller thickness.

It should be noted that, since the memory 200 can transfer part of the heat of one side of the memory 200, which is attached to the second heat-conducting member 212, to the other side, when the power of the memory 200 is low, the second heat-conducting member 212 may be made of other materials with low heat conductivity, so long as the second heat-conducting member 212 has a small thickness and can provide protection for the memory 200.

It should be noted that, the structure of the first heat conductive member 211 may be set according to the power consumption of the memory 200, so that the heat conductivity coefficient of the first heat conductive member 211 is suitable for the heat dissipation requirement of the memory 200. In actual use, the first heat conductive member 211 of one heat conductive structure 20 and the second heat conductive member 212 of the other heat conductive structure 20 face each other in the two adjacent heat conductive structures 20, so as to allow the first heat conductive member 211 to adopt a structure with a higher heat conductivity and to allow a smaller space between the sides of the two adjacent memories 200 in design.

In some embodiments, as shown in fig. 6, the first heat conductive member 211 includes a metal plate. Alternatively, the material of the first heat conductive member 211 may be a material with a high thermal conductivity such as copper or aluminum.

In other embodiments, as shown in fig. 7, the first heat conductive member 211 includes a heat pipe.

Alternatively, each of the first heat conductive members 211 may include one or more heat pipes. In one embodiment, as shown in fig. 7, each first heat conductive member 211 includes a first heat pipe 2111 and a second heat pipe 2112.

In other embodiments, as shown in fig. 8, the first heat conductive member 211 includes a temperature equalizing plate. Specifically, the first heat conductive member 211 is provided with a vacuum chamber 2113 therein.

The first heat conductive member 211 may have other structures as long as it can meet the heat conductive requirement and the space requirement, and is not limited herein.

In some embodiments, as shown in fig. 3, the thermally conductive structure 20 further includes a first thermally conductive pad 23 disposed between the first thermally conductive members 211. In this way, the first heat conducting member 211 is in contact with the side surface of the memory 200 more fully by means of the first heat conducting pad 23, so that the heat generated by the memory 200 is transferred to the first heat conducting member 211 through the first heat conducting pad 23, and the heat transfer effect is improved. It should be appreciated that when the clamping member 30 is clamped to the outside of the thermally conductive structure 20, the clamping member 30 is capable of providing a compressive force to the first thermally conductive pad 23 to closely conform the memory 200 and the first thermally conductive member 211, respectively, to the first thermally conductive pad 23.

Therefore, in the heat dissipating device 100, the heat of the two opposite sides of the memory 200 is transferred to the bonding portion 22 through the first heat conducting member 211 and the second heat conducting member 212, and then transferred to the first liquid cooling member 10 through the bonding portion 22, so as to dissipate heat.

In some embodiments, the first liquid cooling member 10 may be a CPU cooler, and is used to dissipate heat from a central processing unit (CPU, central Processing Unit) (not shown). In this way, the heat conduction structural member 20 is connected with the first liquid cooling member 10, so that the first liquid cooling member 10 can respectively radiate heat to the central processing unit and the internal memory 200, and the design of a water channel for radiating heat to the internal memory 200 can be reduced, so that the design of the heat radiating device 100 is simpler, and the reliability is high.

Specifically, the first liquid cooling member 10 is used for being attached to the central processing unit.

Alternatively, the first liquid cooling member 10 may employ a cold plate.

In some embodiments, as shown in fig. 2, the heat dissipating device 100 further includes a memory support 40 connected to the first liquid cooling member 10, and each fitting portion 22 is fitted to the memory support 40 to transfer heat generated by the memory 200 to the first liquid cooling member 10 by means of the memory support 40. In this way, the heat-conducting structural member 20 is connected with the first liquid cooling member 10 by means of the memory bracket 40, so that a certain distance can be kept between the heat-conducting structural member 20 and the first liquid cooling member 10, so as to meet the requirement of the relative positions of the memory 200 and the first liquid cooling member 10.

Alternatively, the memory support 40 may be a metal plate, a heat pipe, a temperature equalizing plate, or the like having a high thermal conductivity.

In some embodiments, as shown in fig. 2, the memory support 40 includes two attaching portions 22 of the same heat-conductive structural member 20 attached to two memory supports 40, respectively, and the two attaching portions are disposed at intervals along the longitudinal direction of the memory 200.

In some embodiments, as shown in fig. 2, the heat dissipating device 100 further includes a plurality of connection assemblies 50 corresponding to the plurality of attaching portions 22, and the connection assemblies 50 are used for pressing and fixing the corresponding attaching portions 22 to the memory support 40, so that the attaching portions 22 are tightly attached to the memory support 40, and the heat transfer effect is improved.

In the actual use process, when the memory 200 needs to be disassembled, only the connecting assembly 50 needs to be disassembled, the memory 200, the heat conduction structural member 20 and the clamping member 30 can be integrally plugged and unplugged, so that the memory 200 is convenient to disassemble and assemble.

In some embodiments, as shown in fig. 9, each connecting assembly 50 includes a first connecting member 51 and a first elastic member (not shown) corresponding to the attaching portion 22 one by one, and the first connecting member 51 includes a first rod 511 penetrating the attaching portion 22 and the memory support 40, and a first head 512 disposed at an end of the first rod 511 extending out of the attaching portion 22. The first elastic member is sleeved on the first rod 511 and connected between the first head 512 and the attaching portion 22, and the first elastic member is configured to provide an elastic force for moving the corresponding attaching portion 22 toward a side close to the memory support 40 (see fig. 2). In this way, the first connecting piece 51 is provided to fix the attaching portion 22 relative to the memory support 40, and the first elastic piece is provided to compress and attach the attaching portion 22 to the memory support 40 by using the elastic force of the first elastic piece, so as to improve the heat transfer effect.

It should be noted that the plurality of first elastic members are configured to provide the same elastic force to each fitting portion 22. Specifically, the elastic force provided by the first elastic member to the fitting portion 22 is set by the compression stroke and the elastic coefficient of the first elastic member.

In the actual use process, when a single memory 200 needs to be plugged and unplugged, only the two first connectors 51 corresponding to the single memory 200 need to be removed, so that the memory 200 can be plugged and unplugged, and the operation is simple.

In other embodiments, as shown in fig. 2, the connection assembly 50 includes pressing members 53 corresponding to the plurality of engaging portions 22, respectively, and second elastic members 54 corresponding to the engaging portions 22 one by one. Each pressing member 53 is disposed on a side of the corresponding plurality of attaching portions 22 away from the memory support 40, and is detachably connected to the memory support 40. Each of the second elastic members 54 is connected between the corresponding fitting portion 22 and the pressing member 53, and the second elastic members 54 are configured to be able to provide an elastic force that moves the corresponding fitting portion 22 toward a side close to the memory support 40. In this way, the pressing piece 53 detachably connected with the memory support 40 is provided, so that the attaching portion 22 between the pressing piece 53 and the memory support 40 is fixed relative to the memory support 40, and the second elastic piece 54 is provided to connect between the attaching portion 22 and the pressing piece 53, so that the attaching portion 22 is pressed and attached to the memory support 40 by using the elastic force of the second elastic piece 54, thereby improving the heat transfer effect.

It should be noted that the plurality of second elastic members 54 are configured to provide the same elastic force to each fitting portion 22. Specifically, the elastic force provided by the second elastic member 54 to the fitting portion 22 is controlled by the compression stroke and the elastic coefficient of the second elastic member 54.

In some embodiments, as shown in fig. 2, the pressing member 53 extends lengthwise along the arrangement direction of the corresponding plurality of attaching portions 22, one end of the pressing member 53 extends out of the corresponding plurality of attaching portions 22 and is rotatably connected to the memory support 40, and the other end of the pressing member 53 extends out of the corresponding plurality of attaching portions 22 and is detachably connected to the memory support 40. Thus, when the memory 200 needs to be plugged, only the detachable end of the pressing piece 53 and the memory support 40 needs to be removed, and then the pressing piece 53 rotates around the other end of the pressing piece relative to the memory support 40, so that the memory 200 can be plugged, and the operation is further facilitated.

Optionally, as shown in fig. 2, the connection assembly 50 further includes third connection members 55 corresponding to the plurality of compression members 53, and each third connection member 55 is respectively disposed through one end of the corresponding compression member 53 and the memory support 40, so that one end of the compression member 53 is detachably connected to the memory support 40. In the actual use process, when the memory 200 needs to be plugged and unplugged, the plug operation can be performed on the memory 200 only by detaching the third connecting piece 55 on the corresponding pressing piece 53 and rotating the corresponding pressing piece 53 relative to the memory bracket 40.

In some embodiments, as shown in fig. 2, the heat dissipation device 100 further includes a plurality of second heat conductive pads 120 corresponding to the plurality of bonding portions 22, and the second heat conductive pads 120 are disposed between the corresponding plurality of bonding portions 22 and the memory support 40, so that the bonding portions 22 are in contact with the memory support 40 more fully by means of the second heat conductive pads 120.

It will be appreciated that the connection assembly 50 is provided to compress the fitting portion 22 against the memory support 40, so as to provide a greater compressive force to the second thermal pad 120, thereby reducing the thermal contact resistance between the fitting portion 22 and the memory support 40. Specifically, the compressive force may be provided to the second thermally conductive pad 120 by the first elastic member or the second elastic member 54.

In other embodiments, as shown in fig. 9, a first connecting member 51 and a first elastic member are disposed at one of the attaching portions 22 of the same memory 200, and a pressing member 53 and a second elastic member 54 are disposed at the other attaching portion 22 of the same memory 200.

In other embodiments, the connection assembly 50 may be provided in other arrangements, so long as the fitting portion 22 can be pressed and fixed to the memory support 40, which is not limited herein.

In some embodiments, as shown in fig. 2, the heat dissipating device 100 further includes a heat conducting module 90 connected to the memory support 40 and the first liquid cooling member 10, and the heat conducting module 90 is used for transferring heat of the memory support 40 to the first liquid cooling member 10.

Optionally, as shown in fig. 2, the heat conducting module 90 is detachably connected to the memory support 40, so as to separate the heat conducting module 90 from the memory support 40, thereby separating the first liquid cooling member 10 from the memory 200, and further facilitating independent disassembly and maintenance of components. For example, when the first liquid cooling member 10 is used for cooling a cpu, the cpu and the memory 200 can be independently assembled and disassembled by releasing the fixing of the heat conducting module 90 with respect to the memory bracket 40.

Specifically, the heat conduction module 90 may be detachably connected to the memory support 40 by fasteners such as screws.

In some embodiments, as shown in fig. 2, one end of the heat conduction module 90 is connected to the memory support 40, and the other end of the heat conduction module 90 is attached to one side surface of the first liquid cooling member 10, and the other side surface of the first liquid cooling member 10 is used to attach to the cpu.

Alternatively, the heat conduction module 90 may include a metal plate, a heat pipe, or a temperature equalizing plate.

In some embodiments, as shown in fig. 2, the heat conducting module 90 includes a first connecting portion 91 and a second connecting portion 92 respectively disposed at two ends thereof, and a third heat pipe 93 connected between the first connecting portion 91 and the second connecting portion 92, where the first connecting portion 91 is attached to the memory support 40 and fixed relative to the memory support 40, and the second connecting portion 92 is attached to the first liquid cooling member 10 and fixed relative to the memory support 40. In this way, the first connection portion 91 and the second connection portion 92 are provided, so that the heat conduction module 90 is fixed to the memory support 40 and the first liquid cooling member 10 respectively, and the heat of the first connection portion 91 is transferred to the second connection portion 92 by using the high heat conductivity coefficient of the third heat pipe 93, so that the heat of the memory support 40 is transferred to the first liquid cooling member 10.

Alternatively, the first connection portion 91 and the second connection portion 92 may be made of a metal plate, a metal block or a temperature equalizing plate, so as to increase the heat dissipation area of the first connection portion 91 and the memory support 40, and increase the heat dissipation area of the second connection portion 92 and the first liquid cooling member 10. It is understood that the structures of the first connection portion 91 and the second connection portion 92 may be selected according to the power consumption of the memory 200.

In other embodiments, as shown in fig. 10, the heat dissipating device 100 further includes a second liquid cooling member 110 disposed between the memory holders 40, and a second flow channel (not shown) is disposed in the second liquid cooling member 110 and is in communication with the first flow channel for the cooling medium to flow in the second flow channel. Therefore, the cooling medium flowing through the second flow channel takes away the heat of the second liquid cooling element 110, so as to achieve the heat dissipation purpose.

Optionally, the second liquid cooling member 110 is detachably connected to the memory support 40, so as to separate the second liquid cooling member 110 from the memory support 40, thereby facilitating independent maintenance and installation of the cpu and the memory 200.

Specifically, the second liquid cooling member 110 may employ a fastener such as a screw.

In some embodiments, as shown in fig. 10, the heat dissipating device 100 further includes a first connection pipe 130 connected between the first liquid cooling member 10 and the second liquid cooling member 110, and two ends of the first connection pipe 130 are respectively connected to the first flow channel and the second flow channel to connect the second liquid cooling member 110 in series with the first liquid cooling member 10.

In some embodiments, as shown in fig. 1, the heat dissipating device 100 further includes a second connection pipe 140 having one end connected to the first liquid cooling member 10, and a heat dissipating mechanism (not shown) connected to the other end of the second connection pipe 140. One end of the second connection pipe 140 communicates with the first flow passage to enable the cooling medium to flow from the first liquid cooling member 10 to the heat dissipation mechanism through the second connection pipe 140 to cool the cooling medium by the heat dissipation mechanism.

According to the heat dissipating device 100, in the actual use process, heat generated by the memory 200 is transferred to the memory support 40 through the attaching parts 22 at two ends of the heat conducting structural member 20, the attaching parts 22 are tightly attached to the memory support 40 by means of the second heat conducting gaskets 120, and then the heat is transferred to the first liquid cooling member 10 by the heat conducting module 90 arranged on the memory support 40, or the heat is taken away by the cooling medium in the second liquid cooling member 110 arranged on the memory support 40, so that the heat dissipating purpose is achieved.

According to another aspect of the present application, a server is provided, including the heat dissipating device 100 according to any of the above embodiments, as shown in fig. 11, and further includes a circuit board 300, a plurality of memories 200, and a plurality of socket structures 400. The plugging structures 400 are arranged on the circuit board 300 and are arranged in one-to-one correspondence with the memories 200, and one side of the memories 200 protruding out of the heat conducting structural member 20 passes through the corresponding plugging structure 400 and is connected with the circuit board 300.

In some embodiments, as shown in fig. 11, each socket structure 400 includes a socket 410 connected to the circuit board 300 and used for allowing the corresponding memory 200 to pass through, and two fasteners 420 respectively located at two opposite ends of the socket 410 in the longitudinal direction, where the two fasteners 420 are used for fixing the corresponding memory 200 relative to the circuit board 300.

In some embodiments, as shown in fig. 11, the heat dissipating device 100 further includes an operation member 60 in one-to-one correspondence with the attaching portion 22. The operation piece 60 is penetrated through the corresponding attaching portion 22 along the direction that the corresponding attaching portion 22 points to the circuit board 300, and the operation piece 60 is configured to operatively move towards one side close to the circuit board 300 relative to the corresponding attaching portion 22 so as to abut against the buckle 420, so that the buckle 420 releases the lock of the memory 200. It should be noted that, because the adjacent two memories 200 are closely spaced, it is inconvenient to press the two fasteners 420 respectively located at two ends of the memories 200 by hand or a tool. Therefore, by providing the operation member 60 penetrating the attaching portion 22, when the memory 200 is detached, the operation member 60 can be moved toward the side close to the fastener 420 relative to the attaching portion 22 by pressing the other end of the operation member 60 away from the fastener 420, so as to press against the fastener 420, thereby unlocking the fastener 420 to the memory 200, and enabling the memory 200 to be detached from the circuit board 300. Thus, the buckle 420 is easy to open, and the operation of inserting and extracting the memory 200 is simplified.

In some embodiments, as shown in fig. 11, the operation piece 60 includes a second rod 61 penetrating through the corresponding attaching portion 22, and a second head 62 disposed on a side of the second rod 61 extending out of the attaching portion 22 away from the plugging structure 400, where an end of the second rod 61 away from the second head 62 can abut against the corresponding buckle 420. The heat dissipating device 100 further includes a limiting member 70 and a third elastic member 80, which are in one-to-one correspondence with the attaching portion 22, where the limiting member 70 is sleeved on a portion of the second rod 61 extending out of one side of the attaching portion 22 near the inserting structure 400, and configured to be able to abut against one side of the attaching portion 22 near the inserting structure 400, and the third elastic member 80 is connected between the second head 62 and the attaching portion 22, and configured to be able to provide an elastic force for moving the second head 62 toward one side far from the attaching portion 22. In this way, the third elastic member 80 and the limiting member 70 are disposed, so that the second head 62 has a tendency to move toward the side away from the attaching portion 22 by using the elastic force of the third elastic member 80, and the limiting member 70 abuts against the side of the attaching portion 22 away from the second head 62, so as to avoid the operating member 60 from being separated from the corresponding attaching portion 22.

In actual use, the second head 62 is pressed toward the side close to the attaching portion 22, so that the second rod 61 extends out of the attaching portion 22 toward the side close to the buckle 420, and abuts against the buckle 420, so that the buckle 420 is opened. When the second head 62 is not pressed any more, the elastic force of the third elastic member 80 pushes the second head 62 away from the attaching portion 22 until the limiting member 70 abuts against the side of the attaching portion 22 away from the second head 62, so as to reset the operating member 60.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims

1. A heat sink for a server, the server comprising a plurality of memories, the heat sink comprising:

2. The heat dissipating device of claim 1, wherein each of said heat conducting structures comprises two heat conducting members respectively attached to two sides of said memory, and two attaching portions respectively located at opposite ends of said heat conducting members in a longitudinal direction, said attaching portions being connected to said first liquid cooling member;

3. The heat sink of claim 2 further comprising a memory support coupled to the first liquid cooling member, each of the engaging portions engaging the memory support to transfer heat generated by the memory to the first liquid cooling member via the memory support.

4. The heat sink of claim 3, further comprising a plurality of connection assemblies corresponding to a plurality of the fitting portions, respectively;

5. The heat dissipating device of claim 4, wherein each of said connection assemblies comprises a first connection member and a first elastic member in one-to-one correspondence with said attachment portion;

6. The heat dissipating device of claim 4, wherein said connecting assembly comprises compression members respectively corresponding to a plurality of said engaging portions, and second elastic members respectively corresponding to said engaging portions one to one;

7. The heat dissipating device of claim 6, wherein the pressing member extends lengthwise along an arrangement direction of the corresponding plurality of engaging portions, one end of the pressing member extends out of the corresponding plurality of engaging portions and is rotatably connected to the memory support, and the other end of the pressing member extends out of the corresponding plurality of engaging portions and is detachably connected to the memory support.

8. The heat dissipating device of claim 2, wherein the two thermally conductive members comprise a first thermally conductive member and a second thermally conductive member; opposite ends of the first heat conduction piece in the longitudinal direction are respectively connected with the two attaching parts; the corresponding internal memories extend out of the two opposite ends of the second heat conduction piece in the longitudinal direction and are respectively attached to the two attaching parts;

9. The heat dissipating device of claim 2, wherein the two thermally conductive members comprise a first thermally conductive member and a second thermally conductive member; opposite ends of the first heat conduction piece in the longitudinal direction are respectively connected with the two attaching parts; the second heat conduction piece comprises a first plate body and a second plate body which are opposite to each other and are arranged at intervals, the side edges of the same side of the first plate body and the side edges of the same side of the second plate body are connected with each other, the first plate body is attached to the corresponding side surface, far away from the first heat conduction piece, of the memory, and the second plate body is attached to the corresponding side surface, far away from the memory, of the first heat conduction piece;

10. The heat sink of claim 8 or 9, wherein the first heat conducting member comprises a metal plate, a heat pipe, or a temperature equalizing plate.

11. The heat dissipating device of any one of claims 2 to 9, further comprising a heat conducting module connected to the memory support and the first liquid cooling member, respectively, the heat conducting module being configured to transfer heat from the memory support to the first liquid cooling member; and/or

12. A server comprising the heat sink according to any one of claims 1 to 11, the server further comprising:

A circuit board and a plurality of memories;

13. The server according to claim 12, wherein each of the plugging structures includes a plugging member connected to the circuit board and adapted to be passed through by the corresponding memory, and two buckles respectively located at opposite ends of the plugging member in a longitudinal direction, the two buckles being adapted to fix the corresponding memory with respect to the circuit board.

14. The server according to claim 13, wherein the heat dissipating device further includes operation pieces in one-to-one correspondence with the fitting portions;

15. The heat dissipating device according to claim 14, wherein the operation member includes a second rod penetrating through the corresponding attaching portion, and a second head disposed on a side of the second rod extending out of the attaching portion and away from the plugging structure, and an end of the second rod away from the second head is capable of abutting against the corresponding buckle;