CN117270192A - MEMS micro-mirror structure and preparation method thereof - Google Patents
MEMS micro-mirror structure and preparation method thereof Download PDFInfo
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- CN117270192A CN117270192A CN202311557836.7A CN202311557836A CN117270192A CN 117270192 A CN117270192 A CN 117270192A CN 202311557836 A CN202311557836 A CN 202311557836A CN 117270192 A CN117270192 A CN 117270192A
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
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- 238000000151 deposition Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
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- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 6
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
Abstract
The invention provides a MEMS micro-mirror structure and a preparation method thereof, comprising the following steps: the first wafer is provided with a plurality of static comb teeth at intervals on the surface; the second wafer is bonded with the first wafer and comprises a main body part and two connecting parts arranged on two sides of the main body part, wherein a plurality of movable comb teeth and reinforcing ribs are arranged in the main body part at intervals, one end of the connecting part is connected with the main body part, and the other end of the connecting part is far away from the static comb teeth and protrudes out of the main body part; the mirror surface is connected to the reinforcing rib at the outermost side of the main body part through the anchor post, and the mirror surface and the movable comb teeth have a height difference. The MEMS micro-mirror structure fundamentally solves the problem that the micro-mirror can obtain a larger deflection angle under larger driving voltage, and effectively solves the contradiction between the mirror surface size, the movable comb tooth size and the deflection angle of the micro-mirror, so that the MEMS micro-mirror has the remarkable advantages of small driving voltage, large mirror surface size, large deflection angle and the like.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a MEMS micro-mirror structure and a preparation method thereof.
Background
The MEMS micro-mirror is a micro-optical device capable of moving or deflecting under external driving, and the driving modes mainly include electrostatic driving, electromagnetic driving, electrothermal driving and piezoelectric driving, wherein the electrostatic driving and electromagnetic driving modes are most widely used. The electromagnetic driving mode can provide larger driving force, but often solves the problems of shielding, packaging and the like of the system, so that the process is complex. The electrostatic driving mode has the obvious advantage of simple structural principle, but the application range of the MEMS micro-mirror based on electrostatic driving is limited to a certain extent because of the small electrostatic force.
The conventional MEMS micro-mirror is mostly prepared based on a bulk micro-processing technology, and the MEMS micro-mirror structure based on a mirror surface torsion working principle mainly comprises movable comb teeth, static comb teeth, a mirror surface and a torsion beam, wherein the movable comb teeth and the mirror surface are prepared from the same piece of SOI wafer, the movable comb teeth are distributed around the mirror surface, and then the mirror surface is deflected along the torsion beam under the action of electrostatic force between the movable comb teeth and the static comb teeth, so that the working process is completed, and the specific structure is shown in the figure 1. The MEMS micro-mirror based on the electrostatic driving principle has simple structure and principle, but the arrangement structure of the comb teeth and the deflection angle of the mirror surface are influenced because the mirror surface and the movable comb teeth are on the same working plane. Such as: under the drive of the same voltage, the longer the comb teeth are, the larger electrostatic force can be provided, so that the micromirror has a larger deflection angle, but the longer the comb teeth can limit the deflection angle of the micromirror; under the same deflection displacement condition, the smaller the total length of the movable comb teeth and the mirror surface is, the larger the deflection angle of the micro mirror is, but the shorter comb teeth cannot pass through enough large electrostatic force, so that the mirror surface size and the movable comb teeth size are mutually restricted by the traditional micro mirror structure which designs the movable comb teeth and the mirror surface on the same working plane, and the application field of the micro mirror is greatly limited. The method comprises the following steps: the larger the mirror surface size of the micromirror is, the wider the application of the micromirror in the optical field is, but the larger mirror surface size requires longer comb teeth to provide enough electrostatic force, which causes the overall size of the micromirror to be oversized, so that the deflection angle of the micromirror is severely limited, and the application range of the micromirror is further affected. In contrast, if the micromirror has a larger deflection angle, the overall size of the movable comb teeth or the mirror surface needs to be properly reduced, so that the size structures of the movable comb teeth and the mirror surface are mutually restricted contradictors, and the conventional MEMS micromirror cannot have a better application range and deflection angle.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to overcome the problem that the prior MEMS micro mirror cannot have a better application range and deflection angle due to the fact that the micro mirror surface and the movable comb teeth are positioned on the same working plane in the prior art, and provide the MEMS micro mirror structure and the preparation method thereof.
In order to solve the above technical problems, the present invention provides a MEMS micro-mirror structure, which includes: the device comprises a first wafer, a second wafer and a third wafer, wherein a plurality of static comb teeth are arranged on the surface of the first wafer at intervals; the second wafer is bonded with the first wafer and comprises a main body part and at least two anchor posts, wherein the main body part comprises a reinforcing rib and a plurality of movable comb teeth which are connected with the reinforcing rib at intervals, and the anchor posts are fixedly connected to the surface of the main body part and protrude out of the main body part in a direction away from the static comb teeth; the mirror surface is connected to the main body part through an anchor post, and the mirror surface and the movable comb teeth have a height difference.
In one embodiment of the invention, the movable comb teeth are arranged in a hollow structure with intervals in the same extending direction as the static comb teeth, and a vertical comb tooth structure is formed between the movable comb teeth and the static comb teeth.
In one embodiment of the present invention, the second wafer further includes two connection portions disposed on opposite sides of the main body portion, any of the connection portions includes a torsion beam and an anchor point, one end of the torsion beam is connected to the main body portion, the other end of the torsion beam is connected to the anchor point, and the main body portion deflects around the axis of the torsion beam.
In one embodiment of the present invention, the second wafer includes a plurality of anchor studs, and the plurality of anchor studs are uniformly spaced along the edge of the second wafer on the surface thereof.
In order to solve the technical problems, the invention also provides a preparation method of the MEMS micro-mirror structure, which is used for preparing the MEMS micro-mirror structure and specifically comprises the following steps: s1, etching an isolation groove and a plurality of static comb teeth on a first SOI wafer at intervals to obtain a first wafer;
s2, etching a micro-gap on the second SOI wafer and bonding the micro-gap with the first wafer;
s3, etching a main body part on the second SOI sheet to enable the main body part to comprise reinforcing ribs and a plurality of movable comb teeth which are connected with the reinforcing ribs at intervals, so as to obtain a second wafer;
s4, depositing a sacrificial layer with a through hole on the surface of the second wafer, and preparing anchor posts in the through hole;
and S5, removing the sacrificial layer after preparing a mirror surface on the surface of the sacrificial layer to obtain the MEMS micro-mirror structure.
In one embodiment of the present invention, step S3 further comprises the steps of: and etching connecting parts on the second SOI sheet, wherein any connecting part comprises a torsion beam and an anchor point.
In one embodiment of the present invention, in step S4, the mirror surface is etched before the sacrificial layer is removed, so as to obtain at least two mirror surfaces that are independent of each other.
In one embodiment of the invention, the mirror surface comprises a stress adjustment layer and a reflective layer deposited sequentially after etching the through holes on the surface of the sacrificial layer.
In one embodiment of the invention, the stress adjustment layer is a silicon oxide and/or silicon nitride layer.
In one embodiment of the present invention, the reflective layer is one or more of a metal layer such as a gold layer, an aluminum layer, or a titanium layer.
Compared with the prior art, the technical scheme of the invention has the following advantages:
in the MEMS micro-mirror structure, the height difference exists between the movable comb teeth and the mirror surface, and the movable comb teeth and the mirror surface are respectively arranged in different working planes, so that the problem that the micro-mirror can obtain a larger deflection angle under a larger driving voltage is fundamentally solved, the contradiction among the mirror surface size, the movable comb teeth size and the micro-mirror deflection angle is effectively solved, the MEMS micro-mirror can have the remarkable advantages of small driving voltage, large mirror surface size, large deflection angle and the like, and meanwhile, the mirror surface is stably connected to the surface of the movable comb teeth through a surface micro-processing technology and synchronously moves along with the movable comb teeth.
Drawings
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings.
FIG. 1 is a schematic diagram of a structure of a conventional MEMS micromirror;
FIG. 2 is a schematic perspective view of a MEMS micromirror mechanism in a preferred embodiment of the invention;
FIG. 3 is a schematic diagram of the structure of a first wafer and a second wafer in the MEMS micro-mirror mechanism shown in FIG. 2;
FIG. 4 is a schematic layer structure of anchor posts in the MEMS micromirror mechanism of FIG. 2;
FIG. 5 is a side view of a MEMS micromirror mechanism in another embodiment of the invention.
Description of the specification reference numerals: 100. a first wafer; 110. static comb teeth; 120. a first section; 130. a second section; 200. a second wafer; 210. a main body portion; 211. moving comb teeth; 212. reinforcing ribs; 220. a connection part; 221. a torsion beam; 222. an anchor point; 230. a stress adjustment layer; 231. a silicon nitride layer; 232. a silicon oxide layer; 240. a reflective layer; 250. an anchor post; 300. a mirror surface.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
Example 1
The present embodiment provides a MEMS micro-mirror structure, which includes: a plurality of static comb teeth 110 are arranged on the surface of the first wafer 100 at intervals; a second wafer 200 bonded to the first wafer 100, where the second wafer 200 includes a main body 210 and at least two anchor posts 250, the main body 210 includes a reinforcing rib 212 and a plurality of movable comb teeth 211 connected to the reinforcing rib 212 at intervals, and the anchor posts 250 are fixedly connected to the surface of the main body 210 and protrude from the main body 210 in a direction away from the static comb teeth 110; the mirror 300, the mirror 300 is connected to the main body 210 through the anchor post 250, and there is a height difference between the mirror and the movable comb teeth 211.
In the MEMS micro-mirror structure, the height difference exists between the movable comb teeth 211 and the mirror surface 300, and the movable comb teeth 211 and the mirror surface 300 are respectively arranged in different working planes, so that the problem that the electrostatic force and the deflection angle required by the micro-mirror are mutually restricted is fundamentally solved, the contradiction among the size of the micro-mirror surface 300, the size of the movable comb teeth 211 and the deflection angle of the micro-mirror is effectively solved, and the MEMS micro-mirror can have the remarkable advantages of small driving voltage, large size of the mirror surface 300, large deflection angle and the like.
Referring to fig. 2 to 4, the MEMS micro-mirror structure includes a first wafer 100, a second wafer 200, and a mirror 300 sequentially disposed from bottom to top, where the first wafer 100, the second wafer 200, and the mirror 300 are preferably regular octagon flat elements, and the symmetrical structure can make the stress of the MEMS micro-mirror structure uniform and stable during the working process, and in other embodiments, the first wafer 100, the second wafer 200, and the micro-mirror may be disposed as other shape elements with symmetry, which is not limited in the present invention. Specifically, in the present embodiment, the mirror 300 is connected to the upper surface of the second wafer 200 through the surface micromachining process, and the first wafer 100 and the second wafer 200 are bonded to each other.
In this embodiment, the plurality of static teeth 110 on the surface of the first wafer 100 extend along the same direction, and on the upper surface of the first wafer 100, the spacing distances between two adjacent static teeth 110 are the same, and accordingly, the movable teeth 211 are arranged to have a hollow structure with the same spacing as the extending direction of the static teeth 110, and a vertical teeth structure is formed between the movable teeth 211 and the static teeth 110, and specifically, the vertical teeth structure can provide a deflection driving force for the second wafer 200 by means of the cooperation between the movable teeth 211 and the static teeth 110 with a plurality of pairs of height differences in the vertical direction.
Referring to fig. 3, the second wafer 200 includes a plurality of anchor posts 250, and the anchor posts 250 are uniformly spaced along the edge of the second wafer 200 on the surface thereof. In this embodiment, the anchor posts 250 are fixedly connected to the second wafer 200, and the above structure can support the mirror 300 on one hand, so as to achieve the purpose of having a height difference between the mirror 300 and the movable comb teeth 211, and can uniformly disperse the supporting force of the mirror 300 on the other hand, so as to stabilize the structure of the present invention. Therefore, the MEMS micro-mirror structure in this embodiment can be applied to a large-sized mirror 300 or an mxn mirror 300, and in other embodiments, other numbers of anchor points 222 may be set according to practical requirements, and the anchor points 222 may also be connected to other positions of the second wafer 200, which is not limited in this disclosure.
In this embodiment, the reinforcing ribs 212 are configured as a plurality of concentric ring structures with the shape matching with the second wafer 200, which are used to increase the overall supporting strength of the second wafer 200 and increase the connection stability between the plurality of movable comb teeth 211, and further, in this embodiment, the anchor posts 250 are all disposed on the surface of the outermost reinforcing rib 212. Based on the above structure, in this embodiment, a micro gap of about 0.1 μm exists between the region provided with the movable comb teeth 211 and the region provided with the static comb teeth 110, and further, the micro gap is between 0.05 μm and 0.30 μm, so that the problem of comb teeth breakage caused by mutual extrusion of the movable comb teeth and the static comb teeth can be avoided, and the bonding strength of the MEMS micro mirror structure is not affected.
Referring to fig. 3, the second wafer 200 further includes two connection portions 220 disposed on opposite sides of the main body 210, the two connection portions 220 are symmetrically disposed on a central axis of the second wafer 200 and are disposed on opposite sides of the second wafer 200, in this embodiment, a cavity for disposing the connection portions 220 is disposed inside the second wafer 200, any cavity extends relatively from the periphery to the inside along the central axis of the second wafer 200, the two cavities are not communicated, one connection portion 220 is correspondingly disposed in one cavity and is consistent with the extending direction of the cavity, further, the connection portion 220 includes a torsion beam 221 and an anchor point 222, one end of the torsion beam 221 is connected to the main body 210, the other end is connected to the anchor point 222, the main body 210 deflects around the axis of the torsion beam 221, the anchor point 222 is connected to the other end of the torsion beam 221, and the anchor post 250 protruding from the surface of the main body 210 is used for supporting the mirror 300. In this embodiment, the upper surface of the torsion beam 221 and the upper surface of the second wafer 200 are located in the same plane, and the lower surface of the torsion beam 221 and the lower surface of the second wafer 200 may be located in the same plane or higher than the lower surface of the second wafer 200. Anchor points 222 are each connected perpendicularly to one end of a respective torsion beam 221.
In this embodiment, the mirror 300 and the anchor post 250 are integrally disposed, and both include the stress adjustment layer 230 and the reflective layer 240 which are connected to each other, wherein the stress adjustment layer 230 includes the silicon nitride layer 231 and the silicon oxide layer 232 sequentially connected to the outer surface of the reflective layer 240, and the reflective layer 240 is preferably an aluminum layer. Referring to fig. 4, in this embodiment, the anchor posts 250 are all configured as barrel-shaped structures with large upper openings and small lower openings, and this structural design can ensure stable supporting effect, and simultaneously make each layer structure have higher uniformity and flatness during preparation, so as to further improve the connection effect between the anchor posts 250 and the mirror surface 300.
In the conventional micro-mirror structure, in order to avoid the micro-mirror from blocking the first wafer 100 when the micro-mirror rotates, a micro-mirror cavity needs to be arranged in the center of the first wafer 100, and in the present application, the micro-mirror structure is arranged to enable the height difference between the mirror surface 300 and the first wafer 100 to be naturally formed, so that smooth deflection of the micro-mirror structure can be automatically and always ensured, and compared with the conventional micro-mirror structure, the present invention can prepare more static comb teeth 110 for the first wafer 100, and further provide larger electrostatic force. Further, the MEMS micro-mirror structure further includes an isolation groove, through which the first wafer 100 and the second wafer 200 are electrically isolated, and in this embodiment, the first wafer 100 further includes a first portion 120 and a second portion 130 disposed along an extending direction of the first wafer at intervals, and a portion of the isolation groove is located between the first portion 120 and the second portion 130.
In summary, in the MEMS micro-mirror structure, the height difference exists between the movable comb teeth 211 and the mirror surface 300, and the movable comb teeth 211 and the mirror surface 300 are respectively arranged in different working planes, so that the problem that the electrostatic force and the deflection angle required by the micro-mirror are mutually restricted is fundamentally solved, the contradiction between the size of the mirror surface 300 of the micro-mirror, the size of the movable comb teeth 211 and the deflection angle of the micro-mirror is effectively solved, and the MEMS micro-mirror can have the remarkable advantages of small driving voltage, large size of the mirror surface 300, large deflection angle and the like.
Example two
The embodiment provides a method for preparing a MEMS micro-mirror structure, which is used for preparing the MEMS micro-mirror structure in the first embodiment, and specifically comprises the following steps:
s1, etching isolation grooves and a plurality of static comb teeth 110 on a first SOI wafer at intervals to obtain a first wafer 100; further, in other embodiments, the micro-mirror cavity and the isolation groove may be etched on the center of the first SOI wafer according to the actual requirement, so as to realize the electrical isolation of the MEMS micro-mirror structure and provide a condition for deflection of the mirror 300.
S2, bonding the etched micro-gap on the second SOI wafer with the first wafer 100; specifically, in this embodiment, the micro gap is 0.1 μm, and further, in this embodiment, it is also necessary to etch the connection portion 220 on the second SOI wafer, and make any connection portion 220 include the torsion beam 221 and the anchor point 222.
S3, etching the main body 210 on the second SOI wafer, so that the main body 210 comprises a reinforcing rib 212 and a plurality of movable comb teeth 211 connected with the reinforcing rib 212 at intervals to obtain a second wafer 200;
s4, etching a through hole after depositing a sacrificial layer on the surface of the second wafer 200, and preparing an anchor post 250 in the through hole; in this embodiment, the deposited layer is preferably a Polyimide (PI) layer, and further, the thickness of the sacrificial layer applied is related to the required torsion angle of the micromirror, so that the actual preparation process can be adjusted according to the actual application requirement, specifically, the thicker the applied sacrificial layer, the larger the deflection angle range of the micromirror, and vice versa. In this embodiment, the mirror 300 and the anchor stud 250 are substantially simultaneously fabricated, and the two materials are the same, when in fabrication, a through hole needs to be etched on the surface of the sacrificial layer, then the stress adjustment layer 230 and the reflective layer 240 are sequentially deposited thereon, wherein the stress adjustment layer 230 and the reflective layer 240 deposited on the through hole form the anchor stud 250, and the rest of the deposited materials are uniformly laid on the surface of the sacrificial layer to form the mirror 300, specifically, before the sacrificial layer is deposited, the second wafer 200 needs to be thinned until the device layer is exposed, and in this embodiment, chemical Mechanical Polishing (CMP) and etching processes are used. Specifically, in this embodiment, the stress adjustment layer 230 includes a silicon nitride layer 231 and a silicon oxide layer 232 sequentially connected to the outer surface of the reflective layer 240, and the reflective layer 240 is preferably a gold layer. In other embodiments, the reflective layer 240 may be provided as one or more of a metal layer such as a gold layer, an aluminum layer, or a titanium layer, and the stress adjustment layer 230 may be provided as one or more of a silicon oxide or a silicon nitride. In this embodiment, after the above processing, the mirror 300 needs to be etched to obtain a plurality of independent mirrors 300.
And S5, removing the sacrificial layer after preparing the mirror surface 300 on the surface of the sacrificial layer to obtain the MEMS micro-mirror structure. Further, the process of removing the sacrificial layer in this embodiment specifically includes: the sacrificial layer is corroded through oxygen plasma under the high-temperature vacuum condition, and derivatives are carried out through air flow transportation, so that the sacrificial layer at the bottom of the mirror surface 300 can be completely removed by setting proper process conditions, and the target MEMS micro-mirror structure with the mirror surface 300 and the movable comb teeth 211 not located in the same plane is obtained.
In summary, the method for manufacturing the MEMS micro-mirror structure enables the mirror surface 300 to be stably connected to the surface of the reinforcing rib 212 through a surface micro-machining technology and synchronously move along with the surface of the reinforcing rib, so that the method is a novel MEMS micro-mirror processing method with wide application prospect.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.
Claims (10)
1. A MEMS micro-mirror structure, characterized by: comprising the following steps:
the device comprises a first wafer, a second wafer and a third wafer, wherein a plurality of static comb teeth are arranged on the surface of the first wafer at intervals;
the second wafer is bonded with the first wafer and comprises a main body part and at least two anchor posts, wherein the main body part comprises a reinforcing rib and a plurality of movable comb teeth which are connected with the reinforcing rib at intervals, and the anchor posts are fixedly connected to the surface of the main body part and protrude out of the main body part in a direction away from the static comb teeth;
the mirror surface is connected to the main body part through an anchor post, and the mirror surface and the movable comb teeth have a height difference.
2. The MEMS micro-mirror structure of claim 1, wherein: the movable comb teeth are arranged to be hollow structures at intervals with the same extending direction as the static comb teeth, and a vertical comb tooth structure is formed between the movable comb teeth and the static comb teeth.
3. The MEMS micro-mirror structure of claim 1, wherein: the second wafer further comprises two connecting portions arranged on two opposite sides of the main body portion, any connecting portions comprise torsion beams and anchor points, one ends of the torsion beams are connected to the main body portion, the other ends of the torsion beams are connected to the anchor points, and the main body portion deflects around the axis of the torsion beams.
4. The MEMS micro-mirror structure of claim 1, wherein: the second wafer comprises a plurality of anchor posts, and the anchor posts are uniformly arranged on the surface of the second wafer at intervals along the edge of the second wafer.
5. A preparation method of an MEMS micro-mirror structure is characterized by comprising the following steps: the method for preparing the MEMS micro-mirror structure according to any one of claims 1-4 specifically comprises the following steps:
s1, etching an isolation groove and a plurality of static comb teeth on a first SOI wafer at intervals to obtain a first wafer;
s2, etching a micro-gap on the second SOI wafer and bonding the micro-gap with the first wafer;
s3, etching a main body part on the second SOI sheet to enable the main body part to comprise reinforcing ribs and a plurality of movable comb teeth which are connected with the reinforcing ribs at intervals, so as to obtain a second wafer;
s4, etching a through hole after depositing a sacrificial layer on the surface of the second wafer, and preparing an anchor post in the through hole;
and S5, removing the sacrificial layer after preparing a mirror surface on the surface of the sacrificial layer to obtain the MEMS micro-mirror structure.
6. The method for fabricating a MEMS micro-mirror structure according to claim 5, wherein: step S3 further comprises the steps of: and etching connecting parts on the second SOI sheet, wherein any connecting part comprises a torsion beam and an anchor point.
7. The method for fabricating a MEMS micro-mirror structure according to claim 5, wherein: in step S4, etching the mirror surface before removing the sacrificial layer, to obtain at least two mirror surfaces that are independent of each other.
8. The method for fabricating a MEMS micro-mirror structure according to claim 5, wherein: the mirror surface comprises a stress adjusting layer and a reflecting layer which are sequentially deposited after the through holes are etched on the surface of the sacrificial layer.
9. The method of fabricating a MEMS micro-mirror structure according to claim 8, wherein: the stress adjustment layer is a silicon oxide and/or silicon nitride layer.
10. The method of fabricating a MEMS micro-mirror structure according to claim 8, wherein: the reflecting layer is one or more of metal layers such as a gold layer, an aluminum layer or a titanium layer.
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| CN116953918A (en) * | 2023-09-15 | 2023-10-27 | 苏州亿波达光电子科技有限公司 | MEMS micro-mirror array preparation method and micro-mirrors |
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| KR20020042779A (en) * | 2002-05-03 | 2002-06-07 | 김순택 | Optical scanner |
| US6686639B1 (en) * | 2002-09-30 | 2004-02-03 | Innovative Technology Licensing, Llc | High performance MEMS device fabricatable with high yield |
| US20040184132A1 (en) * | 2003-03-22 | 2004-09-23 | Novotny Vlad J. | Spatial light modulator with hidden comb actuator |
| JP2005341788A (en) * | 2004-04-26 | 2005-12-08 | Matsushita Electric Ind Co Ltd | Microactuator |
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