CN117268597A - MEMS friction sensor for measuring friction of rough surface and manufacturing and designing method thereof - Google Patents
MEMS friction sensor for measuring friction of rough surface and manufacturing and designing method thereof Download PDFInfo
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Abstract
The invention belongs to the technical field of micro-electromechanical systems, and discloses a MEMS friction sensor for measuring friction of a rough surface and a manufacturing and designing method thereof. The MEMS friction sensor is divided into a floating element, a silicon microstructure, an electrode substrate, an interface circuit and a packaging tube shell, and is respectively processed and assembled. The manufacturing method comprises a micro-assembly device and a micro-assembly method. The design method comprises mechanical analysis, mechanical calculation, process design and displacement calculation. The MEMS friction sensor for measuring the friction of the rough surface and the manufacturing and design method thereof realize the complex environment measurement capability of the MEMS friction sensor, the measurement range is 0-100 Pa, the resolution is 0.1Pa, the measurement bandwidth is 0-200 Hz, and the MEMS friction sensor has the characteristics of small volume, good temperature stability, high reliability and the like, and can accurately measure the surface friction resistance of complex aerodynamic shapes.
Description
Technical Field
The invention belongs to the technical field of micro-electromechanical systems, and particularly relates to a MEMS friction sensor for measuring friction of a rough surface and a manufacturing and designing method thereof.
Background
The MEMS friction sensor is mainly used for testing the surface friction resistance of the aircraft, so as to determine the magnitude and distribution of the surface friction resistance of the aircraft, and has important significance for aircraft design. The traditional surface friction resistance testing device is mainly a micro strain type friction resistance balance, but is limited by factors such as sensitivity, temperature, volume and cost, and is difficult to widely apply in the field of aircraft design. MEMS friction sensor based on micro-electromechanical system technology has the outstanding advantages of small volume, low cost, high reliability and the like, and can be widely applied to the fields of aircraft design and the like.
At present, MEMS friction sensors are divided into comb tooth capacitive type and piezoresistive type, and are mainly applied to surface friction resistance measurement tests of low-speed wind tunnels. In 2001, jiang Zhe et al [ A MEMS device for measurement of skin friction with capacitive sensing, microelectromechanical Systems Conference, 24-26 August,2001[ C ] designed a cantilever beam supported flat differential capacitive MEMS friction sensor with a range of only 0.1-2 Pa, which is suitable for low-speed wind tunnels. In 2011, jessa Meloy et al [ Experimental verification of a MEMS based skin friction sensor for quantitative wall shear stress measurement,41st AIAA Fluid Dynamics Conference and Exhibit,27-30 June 2011,Honolulu,Hawaii[C ] designed a four-beam supported comb-tooth capacitive MEMS friction sensor with a range of 0.1-5 Pa, and in order not to damage the flow field, the floating element and comb-tooth capacitance must be exposed in the wind tunnel flow field, and the sensor is only suitable for low-speed wind tunnels with higher gas purity.
However, many applications require surface frictional resistance testing in hypersonic wind tunnel flow fields, and at present, conventional micro frictional resistance balances are used for testing the model surface frictional resistance in hypersonic wind tunnel flow fields. In 2010, joseph a. Schetz et al [ Direct measurement of skin friction in complex flows,48th AIAA Aerospace Sciences Meeting Including the New Horizons Forum and Aerospace Exposition 4-7January 2010,Orlando,Florida[C ] developed a strain type micro frictional resistance balance, which was tested for measuring frictional resistance of a model surface in a hypersonic wind tunnel flow field with ma=4, but the micro balance was low in sensitivity, poor in temperature stability, large in volume, and could not be used for precisely measuring the distribution of frictional resistance of an aircraft surface. Moreover, the normal load in the hypersonic wind tunnel flow field is larger, and higher requirements are put forward on the design and development of the MEMS friction resistance sensor.
In 2014, the Chinese patent literature library discloses a micromechanical friction resistance sensor and a manufacturing method thereof (ZL201418003582. X), wherein a floating element of the micromechanical friction resistance sensor is connected with an elastic beam structure with a sensitive capacitance element through a supporting rod, the surface friction resistance sensed by the floating element is transmitted to the elastic beam structure through the supporting rod, sensitive capacitance vibrating polar plates at two sides of the elastic beam are driven to deflect, and the measured surface friction resistance can be calculated through the difference of sensitive capacitances at two sides; the results of the static calibration and hypersonic wind tunnel verification test of the prototype show that the MEMS friction sensor has high sensitivity and good stability, and the gauge head structure and the packaging form are suitable for hypersonic wind tunnel test environments [ Fabry, calibration and proof experiments in hypersonic wind tunnel for a novel MEMS skin friction sensor, microsystem Technologies, vol.23, no.8,2017[ J ] ].
In 2022, the Chinese patent literature library discloses a high-frequency response and wide-range MEMS friction sensor (ZL 202210154250.5) which is suitable for shock tunnels of operation time millisecond and high-temperature arc tunnels of operation time second, and has a measurement bandwidth of more than 3000Hz and a measurement range of 0-1500 Pa, wherein the resolution is better than 2 Pa.
With the rapid development of hypersonic technology, the pneumatic appearance and heat-proof structure of the engineering aircraft are increasingly complex, most of the surfaces to be measured of the aircraft are not simple smooth surfaces, but have a certain rough texture, and the surfaces to be measured of the MEMS friction sensor are smooth surfaces (201418003582. X; ZL202210154250.5, which cannot meet the requirement of accurate measurement).
Currently, there is a need to develop a MEMS friction sensor suitable for measuring the surface friction resistance of rough texture materials in hypersonic wind tunnel flow fields, and a manufacturing method and a design method thereof.
Disclosure of Invention
The invention aims to provide a MEMS friction sensor for measuring friction of a rough surface, and aims to provide a manufacturing method of the MEMS friction sensor for measuring friction of the rough surface, and further aims to provide a design method of the MEMS friction sensor for measuring friction of the rough surface, which is used for overcoming the defects of the existing MEMS friction sensor.
The invention relates to an MEMS friction sensor for measuring friction of a rough surface, which is characterized by comprising a packaging cover plate, a gauge outfit structure, an interface circuit and a packaging tube shell;
the packaging tube shell comprises a packaging cover plate and a packaging tube seat which are sequentially stacked from top to bottom; the packaging tube seat is cylindrical, and the surface of the packaging tube seat is provided with a groove; the upper surface of the packaging tube seat is provided with a packaging positioning boss along the periphery of the groove, the packaging positioning boss is sleeved with a circular adapter, the adapter is sleeved with a stepped round tube-shaped packaging cover plate, the diameter of the bottom surface of the packaging cover plate is equal to that of the top surface of the packaging tube seat, and the diameter of the top surface of the packaging cover plate is smaller than that of the top surface of the packaging tube seat; a gauge outfit structure and an interface circuit are arranged in a step cylindrical central cavity of the packaging cover plate;
the gauge head structure comprises a floating element, a silicon microstructure and an electrode substrate, and is used for sensing friction resistance of the surface of the aircraft model and converting the friction resistance into a differential capacitance signal; the floating element comprises a centrally symmetrical disc-shaped measuring head, a supporting rod and a positioning step which are sequentially connected from top to bottom; the measuring head and the packaging cover plate are flush with the surface of the aircraft model, the surfaces of the measuring head and the packaging cover plate are provided with coherent surface textures, annular gaps are arranged between the measuring head and the packaging cover plate, the measuring head senses the friction resistance of the surface of the aircraft model, and the supporting rod converts the friction resistance into friction resistance moment and transmits the friction resistance moment to the silicon microstructure through the positioning step; the positioning step is used for determining the position of the floating element in the vertical direction of the silicon microstructure;
the silicon microstructure comprises an elastic beam, a vibrating polar plate and a supporting frame body; the supporting frame body is a square flat plate, uninterrupted cutting is carried out on the supporting frame body, and a middle-shaped component is obtained at the central position; the left and right extending parts of the middle-shaped component are left and right symmetrical elastic beams, the elastic beams are two-end clamped beams, the torsional rigidity of the elastic beams is smaller than the normal rigidity, and torsional deformation is mainly generated when frictional resistance is induced; the middle part of the middle-shaped component is a vibrating polar plate which is vertically symmetrical relative to the elastic beam; the center of the vibration polar plate is provided with a through hole corresponding to the positioning step; the upper surface of the supporting frame body is provided with a measuring head installation alignment line; the support frame body supports the vibrating polar plate and the floating element through the elastic beam;
the electrode substrate comprises a lead electrode, a glass boss and a gold electrode; two gold electrodes which are vertically symmetrical and correspond to the vibrating electrode plates are arranged on the upper surface of the electrode substrate, each gold electrode extends leftwards and rightwards respectively, a lead electrode is formed at the extending part, and a glass boss is arranged in the remaining area of the upper surface of the electrode substrate; the gold electrode and the vibrating plate of the silicon microstructure jointly form a sensitive capacitance element; the glass boss is bonded with the supporting frame body of the silicon microstructure in an anode mode, and the height of the glass boss is a capacitance gap h for forming a sensitive capacitor 0 The method comprises the steps of carrying out a first treatment on the surface of the An alignment line I and an alignment line II are carved on the upper surface of the electrode substrate;
the interface circuit comprises a circuit substrate, wherein the circuit substrate is arranged in a groove of the packaging tube seat, a plurality of electronic elements are arranged on the circuit substrate, and bonding pads are also arranged on the circuit substrate and are used for being connected with lead electrodes of the electrode substrate; the upper surface of the circuit substrate is carved with a silicon capacitor mounting alignment line corresponding to an alignment line I of the electrode substrate and a floating element mounting alignment line corresponding to an alignment line II of the electrode substrate.
Further, one processing mode of the coherent surface textures on the surfaces of the measuring head and the packaging cover plate is to fix the measuring head and the packaging cover plate on the same processing surface by using the adapter for synchronous engraving, and the other processing mode is to paste a material layer consistent with the surface material of the aircraft model on the surfaces of the measuring head and the packaging cover plate.
Further, the silicon microstructure is processed by adopting a deep reactive ion etching technology of monocrystalline silicon material; the electrode substrate is manufactured by adopting a Pyrex glass wet etching and metal deposition technology; the interface circuit is manufactured by adopting a ceramic-based precise micro-strip circuit technology; the floating element is machined by adopting a hard aluminum material precision instrument lathe, and the packaging tube shell is machined by adopting a hard aluminum material precision machine;
the ceramic-based precise microstrip circuit technology adopts a ceramic-based precise circuit substrate and is manufactured by utilizing a precise ceramic microstrip circuit technology, wherein the precise ceramic microstrip circuit technology comprises substrate cutting, double-sided metal sputtering, electroplated metal thickening and photoetching corrosion.
Further, the alignment line I is aligned with the silicon capacitor mounting alignment line, and the alignment line II is aligned with the floating element mounting alignment line, so that after the mounting, the surface textures of the measuring head and the packaging cover plate are consistent.
Further, the plurality of electronic elements arranged on the interface circuit comprise a capacitance detection chip AD7747, a singlechip C8051F411, an FPC (flexible printed circuit) seat and a peripheral circuit; the capacitance detection chip AD7747 converts the differential capacitance signal into a digital signal; the singlechip C8051F411 controls the working state of the AD7747, receives the capacitance value acquired by the AD7747 in real time, and sends the capacitance value to the upper computer for subsequent processing; the upper computer adopts Labwindows CVI programming; the data acquisition update rate of the interface circuit is 20Hz, and the capacitance resolution is 4.99 multiplied by 10 ～4 pF。
The manufacturing method of the MEMS friction sensor for measuring friction of the rough surface comprises the following steps:
s11, optimizing the design of each part and the circuit design of the MEMS friction sensor by adopting CFD software according to the design index of the MEMS friction sensor;
s12, respectively processing all parts in the MEMS friction sensor;
s13, assembling a silicon microstructure and an electrode substrate;
under the precision vision equipment, an interface circuit is fixed at a position I on a three-degree-of-freedom micro-operation alignment platform; aligning an alignment line I of the electrode substrate with a silicon capacitor mounting alignment line on the interface circuit, aligning an alignment line II of the electrode substrate with a floating element mounting alignment line on the interface circuit, and fixing the electrode substrate on the interface circuit by using epoxy resin; aligning the silicon microstructure with the electrode substrate, and fixing the silicon microstructure on the electrode substrate by adopting epoxy resin;
s14, assembling the floating element;
under the precision vision equipment, inserting the positioning step of the floating element into the through hole of the vibration polar plate of the silicon microstructure, rotating the texture direction of the measuring head to the measuring head mounting alignment line on the upper surface of the supporting frame body of the silicon microstructure, and finally adopting epoxy resin to paste and fix the positioning step to obtain an assembly;
s15, fixing a packaging tube seat;
fixing the packaging tube seat at a position II of the three-degree-of-freedom micro-operation alignment platform;
s16, identifying the mounting position of the packaging cover plate;
the packaging cover plate is sleeved on the packaging tube seat, so that no step is formed on the side surface of the packaging cover plate sleeved on the packaging tube seat; photographing the packaging cover plate by using a vision precision positioning system of precision vision equipment, and identifying the position of a round hole on the surface of the packaging cover plate by using an image identification system;
s17, assembling the assembly;
the packaging cover plate is taken down, an interface circuit of the assembly is placed in a groove of the packaging tube seat, the assembly is clamped by the vacuum suction head, the assembly is moved in the groove by utilizing the vision precision positioning system and the vacuum suction head, the alignment of the measuring head and a round hole on the surface of the packaging cover plate is realized, and the assembly is fixed on the packaging tube seat by adopting epoxy resin;
s18, welding a circuit;
welding a lead between the lead electrode and the bonding pad by spot welding;
s19, assembling a packaging cover plate;
and sleeving the adapter on a packaging positioning boss of the packaging tube seat, sleeving the packaging cover plate on the adapter, determining that the packaging cover plate is coaxial with the measuring head, and completing the assembly of the MEMS friction sensor.
The design method of the MEMS friction sensor for measuring friction of the rough surface comprises the following steps:
s21, mechanical analysis;
the probe senses frictional resistance f which is proportional to the surface area A and is perpendicular to the x-axis direction s The strut will have a friction resistance f s Is converted into friction resistance moment T s Friction resistance moment T s The elastic beams fixedly supported at the two ends generate torsional deformation, the vibration polar plates rigidly connected with the elastic beams generate a torsional angle theta around the y axis, and the sensitive capacitors C at the two sides of the elastic beams 1 And a sensitive capacitor C 2 A change is generated; calculating sensitive capacitance C on two sides of elastic beam through difference 1 And a sensitive capacitor C 2 The variation delta C of the probe is calculated to further calculate the friction resistance f sensed by the probe s ；
S22, mechanical calculation;
the surface friction resistance sensed by the measuring head is proportional to the area, and the surface friction resistance f s Can be expressed as:
f s ＝τ w A (1)
wherein A is the surface area of the probe, τ w The friction resistance is applied to a unit area;
frictional resistance moment T transmitted to elastic beam s ：
T s ＝f s ×h 2 ＝τ w Ah 2 (2)
Wherein h is 2 Is the distance between the upper surface of the measuring head and the center line of the torsion shaft;
torsional elasticity coefficient K of elastic beam:
wherein G is the shear elastic modulus of monocrystalline silicon; i p Is the polar moment of inertia of the cross section of the elastic beam, I p ＝βwh 3 ，w、h、l 1 The width, thickness and length of the elastic beam are respectively, beta is the torsion coefficient of the rectangular section,
the vibration polar plate is arranged at the friction resistance moment T s A certain torsion angle theta is generated under the action:
it can be seen that the torsion angle θ and the frictional resistance f s Proportional to the ratio;
differential detection capacitance delta C after torsion angle theta is generated by the vibrating polar plate:
wherein h is 0 An initial gap for the sensitive capacitance; w (w) 1 The distance between the vibrating polar plate and the elastic beam; w (w) 2 For the width of the vibrating plate epsilon 0 Epsilon is the dielectric constant or permittivity of air 0 ＝8.85×10 -12 F/m; e is tensile and compressive elastic modulus, and v is Poisson's ratio;
it can be seen that the differential detection capacitance Δc is related to the torsion angle θ of the vibrating plate, and has better linearity when the torsion angle θ is smaller;
s23, designing a process;
s231, adjusting the height of the measuring head by adopting the adapter piece, so that the upper surfaces of the measuring head and the packaging cover plate are positioned on the same plane, and the measuring head and the packaging cover plate are conveniently fixed on the same processing surface for synchronous engraving or material layers are adhered, so that the surfaces of the measuring head and the packaging cover plate have coherent surface textures during processing;
s232, positioning by adopting alignment lines, and realizing alignment installation of the electrode substrate and the interface circuit through corresponding alignment lines arranged on the electrode substrate and the interface circuit; the upper surface of the supporting frame body is provided with a measuring head mounting alignment line, so that the surface of the assembled measuring head and the surface of the packaging cover plate have coherent surface textures;
s233, optimizing the design of each part and the circuit design of the MEMS friction sensor by adopting CFD software;
s234, performing MEMS friction sensor assembly by adopting a visual precise positioning system, a three-degree-of-freedom micro-operation alignment platform, a vacuum suction head and an image identification system;
s24, calculating displacement;
s241, typical dimensions of the MEMS friction sensor are given;
s242, giving a typical load of the MEMS friction sensor;
s243, determining the maximum width of an annular gap between the measuring head and the packaging cover plate through ANSYS simulation calculation on the premise of not changing the flow characteristic of the surface of the aircraft model; under the typical load of verification, determining the maximum motion displacement of the measuring head along the x axis through ANSYS simulation calculation, and simultaneously determining the capacitance gap h of the sensitive capacitance element 0 。
The MEMS friction sensor for measuring the friction of the rough surface is divided into a floating element, a silicon microstructure, an electrode substrate, an interface circuit and a packaging tube shell, and is respectively processed and assembled; the silicon microstructure is processed by adopting a deep reactive ion etching technology of monocrystalline silicon material, the electrode substrate is manufactured by adopting a Pyrex glass wet etching and metal deposition technology, the interface circuit is manufactured by adopting a ceramic-based precise micro-strip circuit technology, the floating element is processed by adopting a hard aluminum material precise instrument lathe, and the packaging tube shell is precisely machined by adopting a hard aluminum material.
The MEMS friction sensor for measuring the friction of the rough surface adopts a special manufacturing method, and the manufacturing method comprises micro-assembly equipment and a micro-assembly method; the micro-assembly equipment consists of a vision precise positioning system, a three-degree-of-freedom micro-operation alignment platform, a vacuum suction head and an image identification system; the silicon microstructure is rigidly connected with the electrode substrate through an anodic bonding technology, and the floating element is rigidly connected with the vibrating polar plate of the silicon microstructure by adopting a boss positioning and epoxy resin pasting method to form a gauge head structure of the MEMS friction sensor; the gauge outfit structure adopts a manufacturing method of visual precise positioning and micro-operation alignment, and is fixed on the surface of the interface circuit through epoxy resin; the gauge outfit structure and the interface circuit adopt a manufacturing method of visual precise positioning and micro-operation alignment, and are fixed in the packaging tube seat through epoxy resin, so that the MEMS friction sensor is assembled.
The MEMS friction sensor for measuring friction of the rough surface adopts a three-dimensional MEMS gauge outfit structure and a plate capacitance differential detection measurement method, wherein the floating element is flush with the surface of an aircraft model to be measured, and the signal output microstructure is isolated from a wind tunnel flow field.
The MEMS friction sensor for measuring the friction of the rough surface adopts the rough texture surface, realizes the complex environment measurement capability of the MEMS friction sensor, has the measurement range of 0-100 Pa, the resolution of 0.1Pa and the measurement bandwidth of 0-200 Hz, has the characteristics of small volume, good temperature stability, high reliability and the like, and can accurately measure the surface friction resistance of complex aerodynamic shapes.
Drawings
FIG. 1 is a schematic diagram showing the overall structure of a MEMS friction sensor for measuring friction of a rough surface according to the present invention;
FIG. 2 is an exploded view of the overall structure of the MEMS friction sensor for measuring friction of rough surface according to the present invention;
FIG. 3 is a schematic view showing the structure of a floating element in the MEMS friction sensor for measuring friction of rough surface according to the present invention;
FIG. 4 is a schematic view of the microstructure of silicon in the MEMS friction sensor for measuring rough surface friction of the present invention;
FIG. 5 is a schematic view showing the structure of an electrode substrate in the MEMS friction sensor for measuring friction of a rough surface according to the present invention;
FIG. 6 is a schematic view of a "silicon-glass" bonding structure established between a silicon microstructure and an electrode substrate in a MEMS friction sensor for measuring rough surface friction according to the present invention;
FIG. 7 is a schematic diagram showing the structure of a gauge head in the MEMS friction sensor for measuring friction of a rough surface according to the present invention;
FIG. 8 is an exploded view of the installation of the adaptor, floating element and package housing in the MEMS friction sensor of the present invention for measuring rough surface friction;
FIG. 9 is a schematic circuit diagram of a MEMS friction sensor for measuring friction of rough surface according to the present invention;
fig. 10 is a schematic diagram of the working principle of the MEMS friction sensor for measuring friction of a rough surface according to the present invention.
In the figure, 1, a packaging cover plate; 2. a floating element; 3. a silicon microstructure; 4. an electrode substrate; 5. an interface circuit; 6. packaging the tube seat; 7. a bonding pad; 8. packaging and positioning the boss; 9. measuring head; 10. a support rod; 11. positioning the step; 12. a support frame; 13. an elastic beam; 14. vibrating the polar plate; 15. a lead electrode; 16. a glass boss; 17. a gold electrode; 18. a sensitive capacitive element; 19. an adapter; 20. a silicon capacitor mounting alignment line; 21. the floating element mounts an alignment wire.
Detailed Description
The invention is described in detail below with reference to the drawings and examples.
Example 1:
the MEMS friction sensor structure of the embodiment is shown in fig. 1 and 2, and is decomposed into a package cover plate 1, a floating element 2, a silicon microstructure 3, an electrode substrate 4, an interface circuit 5 and a package stem 6, which are processed and then assembled respectively, and the package stem 6 includes a package positioning boss 8. Wherein the floating element 2 comprises a measuring head 9, a supporting rod 10 and a positioning step 11, as shown in fig. 3; the silicon microstructure 3 comprises a supporting frame 12, a torsion beam 13 and a vibrating polar plate 14, as shown in fig. 4; the electrode substrate 4 includes a lead electrode 15, a glass boss 16, and a gold electrode 17, as shown in fig. 5; the vibrating polar plate 14 of the silicon microstructure 3 and the gold electrode 17 of the electrode substrate 4 form a differential sensitive capacitance element 18 to realize differential capacitance detection, as shown in fig. 6; the floating element 2, the silicon microstructure 3 and the electrode substrate 4 together constitute the gauge head structure of the MEMS friction sensor, as shown in fig. 7.
Working principle of MEMS friction sensor: the probe 9 senses a frictional resistance f proportional to the surface area A and perpendicular to the x-axis direction s The strut 10 will have a frictional resistance f s Is converted into friction moment T s Friction moment T s The elastic beam 13 fixed at two ends generates torsion deformation, the vibration polar plate 14 rigidly connected with the elastic beam 13 generates torsion angle theta around the y axis, and the sensitive capacitors C at two sides of the elastic beam 13 1 And a sensitive capacitor C 2 A certain change is produced as shown in fig. 8. The change delta C of the sensitive capacitance at the two sides of the elastic beam 13 is calculated through difference, and then the friction resistance f sensed by the measuring head 9 is calculated s 。
Numerical modeling is carried out on the real material, proper rough textures are designed, the measuring head 9 and the packaging cover plate 1 are fixed on the same processing surface by using the adapter 19 for integral engraving, and the consistency of engraving textures of the measuring head 9 and the packaging cover plate 1 can be ensured, as shown in fig. 9; in order to facilitate accurate alignment assembly of the chip, the floating element 2 and the electrode substrate 4, an alignment line I and an alignment line II are carved on the upper surface of the electrode substrate 4, and the layout device, the on-board fixed resistor, the capacitor and the bonding wires are optimized through CFD software, as shown in FIG. 10;
the surface friction resistance sensed by the probe 9 is proportional to the area, the surface friction resistance f s Can be expressed as:
f s ＝τ w A (1)
wherein A is the area of the measuring head 9, τ w The friction resistance is applied to a unit area;
frictional resistance moment T transmitted to elastic beam 13 s ：
T s ＝f s ×h 2 ＝τ w Ah 2 (2)
Wherein h is 2 Is the distance between the upper surface of the measuring head 9 and the center line of the torsion shaft;
torsional elastic coefficient K of elastic beam 13:
wherein G is the shear elastic modulus of monocrystalline silicon; i p Is the polar moment of inertia of the cross section of the elastic beam 13, I p ＝βwh 3 ，w、h、l 1 The width, thickness and length of the elastic beam 13, respectively, beta is the torsion coefficient of the rectangular section,
the vibrating polar plate 14 is under friction resistance moment T s A certain torsion angle theta is generated under the action:
it can be seen that the torsion angle θ and the frictional resistance f s Proportional to the ratio;
the vibrating plate 14 generates a differential detection capacitance Δc after the torsion angle θ:
wherein h is 0 An initial gap for the sensitive capacitance; w (w) 1 Is the distance between the vibrating polar plate 14 and the elastic beam 13; w (w) 2 To vibrate the width of the plate 14 ε 0 Epsilon is the dielectric constant or permittivity of air 0 ＝8.85×10 -12 F/m; e is tensile and compressive elastic modulus, and v is Poisson's ratio.
(4) The angular displacement theta and the frictional resistance f s Proportional to the ratio; (5) The equation shows that the differential detection capacitance deltac is related to the rotation angle theta of the vibrating plate 14 and has a good linearity when theta is small. Typical dimensions of the spring beam 13 of this embodiment are 2000 microns×130 microns×500 microns, the area of the capacitor plate 14 is 2050 microns×4000 microns, and the initial gap h of the sensitive capacitor element 18 0 Is 10 microns. The measuring range of the MEMS friction sensor is 0-100 Pa, the resolution is 0.5Pa, and the resolution of the corresponding differential detection capacitor is about 10fF (currently, the detection resolution under the weak capacitor stable condition is 5 fF). When the frictional resistance of the unit area to be measured is 100Pa, ANSYS simulation results show that the maximum normal displacement of the vibrating plate 14 is about 2.3 micrometers; ANSYS simulation results showed that the overall normal movement of vibrating plate 14 was about 0.2 microns, much less than the initial capacitance gap h of sensing capacitive element 18, when a normal load of 2000Pa was applied simultaneously 0 And the normal displacement of the vibrating plate 14 caused by friction resistance has little influence on the differential detection capacitance.
In order not to alter the flow characteristics of the air stream at the surface of the aircraft model, the upper surface of the probe 9 must be flush with the surface of the aircraft model. The embodiment is realized by a packaging tube, the upper surface of the packaging cover plate 1 is flush with the surface of the aircraft model, and is flush with the upper surface of the measuring head 9. The upper surface of the probe 9 senses the frictional resistance along the x-axis direction, is transferred to the elastic beam 13 through the supporting rod 10, and causes the probe 9 to twist around the y-axis (fig. 10), and a certain movement gap must be maintained between the probe 9 and the encapsulation cover plate 1 (fig. 1). ANSYS simulation results show that the maximum motion displacement of the probe 9 along the x-axis is about 10 microns; the CFD simulation results show that the annular gap between the probe 9 and the encapsulation cover plate 1 is not greater than 150 microns without changing the flow characteristics of the aircraft model surface. Therefore, the gap between the gauge head 9 and the package cover plate 1 is designed to be 100 micrometers, which is achieved by a visual alignment technique.
The MEMS friction sensor with the rough texture surface is innovated in the design of the rough texture surface, the processing and assembling process method of the MEMS friction sensor is innovated, the processing and assembling precision of the MEMS friction sensor is improved, the precision of measuring the friction resistance of the surface of an aircraft model in a hypersonic wind tunnel flow field is further improved, the complex surface measuring capability of the MEMS friction sensor is realized, the measuring range is 0-100 Pa, the resolution is 0.5Pa, the measuring bandwidth is 0-200 Hz, and the MEMS friction sensor has the characteristics of small volume, good temperature stability, high reliability and the like, and can be used for measuring the surface friction resistance of the complex surface of the aircraft model in the hypersonic wind tunnel flow field.
The foregoing examples merely represent exemplary embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
The foregoing examples merely represent exemplary embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (7)
1. The MEMS friction sensor for measuring the friction of the rough surface is characterized by comprising a packaging cover plate (1), a gauge outfit structure, an interface circuit (5) and a packaging tube shell;
the packaging tube shell comprises a packaging cover plate (1) and a packaging tube seat (6) which are sequentially stacked from top to bottom; the packaging tube seat (6) is cylindrical, and the surface of the packaging tube seat is provided with a groove; a packaging positioning boss (8) is arranged on the upper surface of the packaging tube seat (6) along the periphery of the groove, a circular adapter (19) is sleeved on the packaging positioning boss (8), a stepped round tube-shaped packaging cover plate (1) is sleeved outside the adapter (19), the bottom surface diameter of the packaging cover plate (1) is equal to the top surface diameter of the packaging tube seat (6), and the top surface diameter of the packaging cover plate (1) is smaller than the top surface diameter of the packaging tube seat (6); a meter head structure and an interface circuit (5) are arranged in a step cylindrical central cavity of the packaging cover plate (1);
the gauge head structure comprises a floating element (2), a silicon microstructure (3) and an electrode substrate (4), and is used for sensing friction resistance of the surface of the aircraft model and converting the friction resistance into a differential capacitance signal; the floating element (2) comprises a centrally symmetrical disc-shaped measuring head (9), a supporting rod (10) and a positioning step (11) which are sequentially connected from top to bottom; the measuring head (9) and the packaging cover plate (1) are flush with the surface of the aircraft model, the surfaces of the measuring head (9) and the packaging cover plate (1) are provided with coherent surface textures, annular gaps are arranged between the measuring head (9) and the packaging cover plate (1), the measuring head (9) senses the friction resistance of the surface of the aircraft model, and the supporting rod (10) converts the friction resistance into friction resistance moment and transmits the friction resistance moment to the silicon microstructure (3) through the positioning step (11); the positioning step (11) is used for determining the position of the floating element (2) in the vertical direction of the silicon microstructure (3);
the silicon microstructure (3) comprises an elastic beam (13), a vibrating polar plate (14) and a supporting frame body (12); the supporting frame body (12) is a square flat plate, uninterrupted cutting is carried out on the supporting frame body (12), and a middle-shaped component is obtained at the central position; the parts extending out of the left end and the right end of the middle-shaped component are left-right symmetrical elastic beams (13), the elastic beams (13) are two-end clamped beams, the torsional rigidity of the elastic beams (13) is smaller than the normal rigidity, and torsional deformation is mainly generated when frictional resistance is induced; the middle part of the medium-shaped component is provided with a vibrating polar plate (14) which is vertically symmetrical relative to the elastic beam (13); the center of the vibrating polar plate (14) is provided with a through hole corresponding to the positioning step (11); the upper surface of the supporting frame body (12) is provided with a measuring head (9) mounting alignment line; the support frame body (12) supports the vibrating polar plate (14) and the floating element (2) through the elastic beam (13);
the electrode substrate (4) comprises a lead electrode (15), a glass boss (16) and a gold electrode (17); two gold electrodes (17) which are vertically symmetrical and correspond to the vibrating electrode plates (14) are arranged on the upper surface of the electrode substrate (4), each gold electrode (17) extends leftwards and rightwards respectively, a lead electrode (15) is formed at the extending part, and a glass boss (16) is arranged in the residual area of the upper surface of the electrode substrate (4); the gold electrode (17) and the vibrating polar plate (14) of the silicon microstructure (3) form a sensitive capacitance element (18) together; the glass boss (16) is bonded with the supporting frame body (12) of the silicon microstructure (3) in an anode mode, and the height of the glass boss (16) is a capacitance gap h for forming a sensitive capacitor (18) 0 The method comprises the steps of carrying out a first treatment on the surface of the An alignment line I and an alignment line II are carved on the upper surface of the electrode substrate (4);
the interface circuit (5) comprises a circuit substrate, a plurality of electronic elements and a bonding pad (7), wherein the circuit substrate is arranged in a groove of the packaging tube seat (6), the circuit substrate is provided with the electronic elements, and the bonding pad (7) is used for being connected with a lead electrode (15) of the electrode substrate (4); a silicon capacitor mounting alignment line (20) corresponding to the alignment line I of the electrode substrate (4) and a floating element mounting alignment line (21) corresponding to the alignment line II of the electrode substrate (4) are engraved on the upper surface of the circuit substrate.
2. The MEMS friction sensor for measuring rough surface friction according to claim 1, wherein one processing mode of the coherent surface texture on the surfaces of the probe head (9) and the encapsulation cover plate (1) is to fix the probe head (9) and the encapsulation cover plate (1) on the same processing surface by using an adapter piece (19) for synchronous engraving, and the other processing mode is to paste a material layer consistent with the surface material of the aircraft model on the surfaces of the probe head (9) and the encapsulation cover plate (1).
3. The MEMS friction sensor for measuring friction on a rough surface according to claim 1, wherein the silicon microstructure (3) is fabricated by deep reactive ion etching of monocrystalline silicon material; the electrode substrate (4) is manufactured by adopting a Pyrex glass wet etching and metal deposition technology; the interface circuit (5) is manufactured by adopting a ceramic-based precise micro-strip circuit technology; the floating element (2) is machined by adopting a hard aluminum material precision instrument lathe, and the packaging tube shell is machined by adopting a hard aluminum material precision machine;
the ceramic-based precise microstrip circuit technology adopts a ceramic-based precise circuit substrate and is manufactured by utilizing a precise ceramic microstrip circuit technology, wherein the precise ceramic microstrip circuit technology comprises substrate cutting, double-sided metal sputtering, electroplated metal thickening and photoetching corrosion.
4. The MEMS friction sensor for measuring rough surface friction according to claim 1, wherein the alignment line i is aligned with the silicon capacitor mounting alignment line (20), and the alignment line ii is aligned with the floating element mounting alignment line (21), ensuring that the surface texture of the probe head (9) and the package cover plate (1) are consistent after mounting.
5. The MEMS friction sensor for measuring friction on a rough surface according to claim 1, wherein the plurality of electronic components arranged on the interface circuit (5) comprises a capacitance detection chip AD7747, a single chip microcomputer C8051F411, an FPC holder, and a peripheral circuit; the capacitance detection chip AD7747 converts the differential capacitance signal into a digital signal; the singlechip C8051F411 controls the working state of the AD7747, receives the capacitance value acquired by the AD7747 in real time, and sends the capacitance value to the upper computer for subsequent processing; the upper computer adopts Labwindows CVI programming; the data acquisition update rate of the interface circuit (5) is 20Hz, and the capacitance resolution is 4.99X10 ～4 pF。
6. A method for manufacturing a MEMS friction sensor for measuring friction of a rough surface, which is used for manufacturing the MEMS friction sensor for measuring friction of a rough surface according to any one of claims 1 to 5, characterized by comprising the steps of:
s11, optimizing the design of each part and the circuit design of the MEMS friction sensor by adopting CFD software according to the design index of the MEMS friction sensor;
s12, respectively processing all parts in the MEMS friction sensor;
s13, assembling the silicon microstructure (3) and the electrode substrate (4);
under the precision vision equipment, an interface circuit (5) is fixed at a position I on a three-degree-of-freedom micro-operation alignment platform; aligning an alignment line I of the electrode substrate (4) with a silicon capacitor mounting alignment line (20) on the interface circuit (5), aligning an alignment line II of the electrode substrate (4) with a floating element mounting alignment line (21) on the interface circuit (5), and fixing the electrode substrate (4) on the interface circuit (5) by adopting epoxy resin; aligning the silicon microstructure (3) with the electrode substrate (4), and fixing the silicon microstructure (3) on the electrode substrate (4) by adopting epoxy resin;
s14, assembling the floating element (2);
under precision vision equipment, inserting a positioning step (11) of a floating element (2) into a through hole of a vibrating polar plate (14) of a silicon microstructure (3), rotating the texture direction of a measuring head (9) to an alignment line for mounting the measuring head (9) on the upper surface of a supporting frame body (12) of the silicon microstructure (3), and finally adopting epoxy resin to paste and fix the positioning step (11) to obtain an assembly;
s15, fixing a packaging tube seat (6);
fixing the packaging tube seat (6) at a position II of a three-degree-of-freedom micro-operation alignment platform;
s16, identifying the mounting position of the packaging cover plate (1);
the packaging cover plate (1) is sleeved on the packaging tube seat (6), so that no step is formed on the side surface of the packaging tube seat (6) when the packaging cover plate (1) is sleeved on the packaging tube seat; photographing the packaging cover plate (1) by utilizing a vision precision positioning system of precision vision equipment, and identifying the position of a round hole on the surface of the packaging cover plate (1) through an image identification system;
s17, assembling the assembly;
the packaging cover plate (1) is taken down, an interface circuit (5) of the assembly is placed in a groove of the packaging tube seat (6), the assembly is clamped by a vacuum suction head, the assembly is moved in the groove by utilizing a vision precision positioning system and the vacuum suction head, the alignment of a measuring head (9) with a round hole on the surface of the packaging cover plate (1) is realized, and the assembly is fixed on the packaging tube seat (6) by adopting epoxy resin;
s18, welding a circuit;
welding a lead between the lead electrode (15) and the bonding pad (7) by spot welding;
s19, assembling a packaging cover plate (1);
and sleeving the adaptor (19) on the packaging positioning boss (8) of the packaging tube seat (6), sleeving the packaging cover plate (1) on the adaptor (19), and determining that the packaging cover plate (1) is coaxial with the measuring head (9) so as to complete the assembly of the MEMS friction sensor.
7. A method for designing a MEMS friction sensor for measuring friction of a rough surface, which is used for designing the MEMS friction sensor for measuring friction of a rough surface according to any one of claims 1 to 5, characterized by comprising the steps of:
s21, mechanical analysis;
the measuring head (9) senses the frictional resistance f which is proportional to the surface area A and is perpendicular to the x-axis direction s The strut (10) applies frictional resistance f s Is converted into friction resistance moment T s Friction resistance moment T s The elastic beam (13) with two ends fixedly supported generates torsion deformation, the vibration polar plate (14) rigidly connected with the elastic beam (13) generates torsion angle theta around the y axis, and the sensitive capacitor C at two sides of the elastic beam (13) 1 And a sensitive capacitor C 2 A change is generated; calculating the sensitive capacitance C at two sides of the elastic beam (13) through difference 1 And a sensitive capacitor C 2 Further calculates the frictional resistance f sensed by the probe (9) s ；
S22, mechanical calculation;
the surface friction resistance sensed by the measuring head (9) is proportional to the area, and the surface friction resistance f s Can be expressed as:
f s ＝τ w A (1)
wherein A is the surface area of the measuring head (9), τ w The friction resistance is applied to a unit area;
frictional resistance moment T transmitted to elastic beam (13) s ：
T s ＝f s ×h 2 ＝τ w Ah 2 (2)
Wherein h is 2 Is the distance between the upper surface of the measuring head (9) and the center line of the torsion shaft;
torsional elasticity coefficient K of elastic beam (13):
wherein G is the shear elastic modulus of monocrystalline silicon; i p Is the polar moment of inertia of the cross section of the elastic beam (13), I p ＝βwh 3 ，w、h、l 1 The width, thickness and length of the elastic beam (13) are respectively, beta is the torsion coefficient of the rectangular section,
the vibration polar plate (14) is arranged at the friction resistance moment T s A certain torsion angle theta is generated under the action:
it can be seen that the torsion angle θ and the frictional resistance f s Proportional to the ratio;
a differential detection capacitance delta C after the torsion angle theta is generated by the vibrating polar plate (14):
wherein h is 0 An initial gap for the sensitive capacitance; w (w) 1 Is a vibrating polar plate (14) and elasticThe distance between the beams (13); w (w) 2 For the width of the vibrating plate (14), epsilon 0 Epsilon is the dielectric constant or permittivity of air 0 ＝8.85×10 -12 F/m; e is tensile and compressive elastic modulus, and v is Poisson's ratio;
it can be seen that the differential detection capacitance deltac is related to the torsion angle theta of the vibrating plate (14) and has a good linearity when the torsion angle theta is small;
s23, designing a process;
s231, adjusting the height of the measuring head (9) by adopting the adapter piece (19) so that the upper surfaces of the measuring head (9) and the packaging cover plate (1) are positioned on the same plane, and facilitating the fixing of the measuring head (9) and the packaging cover plate (1) on the same processing surface for synchronous engraving or pasting of a material layer, thereby realizing that the surfaces of the measuring head (9) and the packaging cover plate (1) have coherent surface textures during processing;
s232, positioning by adopting alignment lines, and realizing alignment installation of the electrode substrate (4) and the interface circuit (5) through corresponding alignment lines arranged on the electrode substrate (4) and the interface circuit (5); the upper surface of the supporting frame body (12) is provided with a measuring head (9) mounting alignment line, so that the surfaces of the measuring head (9) and the packaging cover plate (1) after assembly have coherent surface textures;
s233, optimizing the design of each part and the circuit design of the MEMS friction sensor by adopting CFD software;
s234, performing MEMS friction sensor assembly by adopting a visual precise positioning system, a three-degree-of-freedom micro-operation alignment platform, a vacuum suction head and an image identification system;
s24, calculating displacement;
s241, typical dimensions of the MEMS friction sensor are given;
s242, giving a typical load of the MEMS friction sensor;
s243, determining the maximum width of an annular gap between the measuring head (9) and the packaging cover plate (1) through ANSYS simulation calculation on the premise of not changing the flow characteristic of the surface of the aircraft model; under the typical load of verification, the maximum motion displacement of the measuring head (9) along the x axis is determined through ANSYS simulation calculation, and meanwhile, the capacitance gap h of the sensitive capacitance element (18) is determined 0 。
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