CN117268279B - Strain optical fiber sensor, manufacturing method thereof and integrated waveguide sensor - Google Patents

Strain optical fiber sensor, manufacturing method thereof and integrated waveguide sensor Download PDF

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CN117268279B
CN117268279B CN202311180057.XA CN202311180057A CN117268279B CN 117268279 B CN117268279 B CN 117268279B CN 202311180057 A CN202311180057 A CN 202311180057A CN 117268279 B CN117268279 B CN 117268279B
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optical fiber
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strain
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CN117268279A (en
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杨小娟
王兴泉
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Beijing Cnten Smart Technology Co ltd
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Abstract

The invention provides a strain optical fiber sensor, a manufacturing method thereof and an integrated waveguide sensor, wherein different effective thermal expansion and contraction and Young modulus coefficients of different areas of an optical fiber are designed, optical responses caused by strain and temperature can be distinguished, a strain signal can be well obtained, strain parameters can be well extracted, the size and the complexity of the sensor are reduced, and the optical fiber strain sensor with a compact structure is manufactured.

Description

Strain optical fiber sensor, manufacturing method thereof and integrated waveguide sensor
Technical Field
The invention relates to the technical field of photons and photoelectrons, in particular to a strain optical fiber sensor, a manufacturing method thereof and an integrated waveguide sensor.
Background
The optical fiber stress sensor has the outstanding advantages of high resolution, compact structure, light weight, miniaturization, corrosion resistance, electromagnetic interference resistance and the like. In particular, distributed sensing can be achieved based on optical fiber low loss transmission. Based on the advantages, the method can be used for various scenes such as various pipelines, large-scale buildings, geological engineering, railway engineering and the like. At present, an optical fiber stress sensor is mainly based on a Mach-Zehnder (MZ) filter, a Fabry-Perot (FP) interferometer, an optical fiber grating, an optical fiber micro-nano structure, a micro-mirror at the end face of the optical fiber and other structures.
In particular, the MZ structure requires the fabrication of a fiber-optic dual-arm structure, one of which is the sense arm and the other of which is the reference arm. The sensor arm is used for stress response. Due to the action of stress, the optical path of the optical fiber on the sensing arm is changed, so that the interference peak is changed. This solution requires the reference arm to remain well stable. The FP interference structure may employ a single mode-multimode-single mode fiber structure, and because the effective refractive indices of the single mode and multimode are different, FP resonance is formed. The FP resonance peak changes due to the deformation of the FP cavity caused by the stress. The optical fiber micro-nano structure is formed by etching the micro-nano structure on the surface of the optical fiber, and the mode volume of the optical fiber is changed due to strain, so that the transmitted optical power is changed. In addition, fiber Bragg gratings are also a widely used stress sensor solution. The stress causes the deformation of the optical fiber, so that the reflection peak of the fiber Bragg grating is changed, and the strain is obtained by detecting the change of the wavelength.
The working principle of the optical fiber stress sensor is based on deformation so as to change the optical response of the optical fiber sensor. And the stress sensing parameters are extracted by detecting the change of parameters such as optical power, wavelength and the like. However, the effect of stress and temperature on the fiber sensor is deformation, so that it is difficult to directly distinguish whether the change of the optical parameter is from temperature or stress, i.e. temperature stress cross-sensitivity problem in the sensor. Special packaging is generally required for manufacturing the optical fiber stress sensor, so that the temperature influence is avoided. Or simultaneously measuring temperature and stress. But these solutions also lead to a complex sensor structure and increase the manufacturing costs.
Disclosure of Invention
The present invention aims to provide a strained optical fiber sensor and a method of manufacturing the same, an integrated waveguide sensor, which overcomes or at least partially solves the above-mentioned problems.
In order to achieve the above purpose, the technical scheme of the invention is specifically realized as follows:
One aspect of the present invention provides a strained fiber sensor comprising: the method comprises the steps that at least three cascading groove structures are arranged on the surface of an optical fiber, the depth and the width of each groove structure are different, and the groove structures are filled with media with different heat expansion and cold contraction and Young modulus parameters; and each test end corresponds to one groove structure and is used for determining stress and temperature parameters according to the change of the resonant wavelength interval of the groove structure.
Wherein the optical fiber comprises: plastic optical fibers and photonic crystal fibers.
Wherein the medium comprises: curing glue or plating dielectric film.
Wherein the curing glue comprises epoxy resin, glue or mixture of the epoxy resin and the glue according to different proportions.
Wherein, the dielectric coating film includes: silicon oxide, aluminum nitride, and aluminum oxide.
Another aspect of the invention provides an integrated waveguide sensor that replaces the optical fiber described above with a waveguide.
Wherein the integrated waveguide sensor further comprises: a tunable laser broadband light source chip; the tunable laser broadband light source chip and the waveguide sensing area detector of the integrated waveguide sensor are integrated on a carrier.
In yet another aspect, the present invention provides a method of manufacturing a strained fiber optic sensor, comprising: placing an optical fiber in a V-shaped groove of quartz or a silicon wafer for fixation, designing a photoetching plate according to the preset groove width, exposing, developing, baking at high temperature, and solidifying photoresist with patterns; determining a groove structure and the types of filled media, and manufacturing at least three cascaded groove structures, wherein the depth and the width of each groove structure are different, and the parameters of expansion and contraction and Young modulus of the media filled in each groove structure are different; etching a groove structure by utilizing hydrofluoric acid, and filling a medium at the groove; optical fiber strain sensors of different operating wavelengths are arranged at different positions of the optical fiber.
Wherein, the etching the preset groove structure by using hydrofluoric acid comprises: determining the depth of the corroded groove by controlling the corrosion time or adjusting the concentration of hydrofluoric acid; or a high-power laser is adopted for surface ablation, grooves are manufactured, and the depth of the grooves is determined through optical power and time.
Wherein the method further comprises: keeping the temperature constant, changing the stress of the optical fiber, measuring the Young modulus coefficient E eff according to the structural parameters and the change of the tested FP resonance peak, and establishing data curves of different groove structures, medium types and Young modulus coefficient E eff; and (3) no external stress exists, the environment temperature is changed, the effective thermal expansion coefficient alpha eff is measured according to structural parameters and through the change of a test FP resonance peak, and data curves of different groove structures and medium types and the effective thermal expansion coefficient alpha eff are established.
Therefore, by designing different effective thermal expansion and contraction and Young modulus coefficients of different areas of the optical fiber, the strain optical fiber sensor, the manufacturing method thereof and the integrated waveguide sensor can distinguish optical responses caused by strain and temperature, can well obtain strain signals, can well extract strain parameters, simultaneously reduce the size and complexity of the sensor, and can manufacture the optical fiber strain sensor with compact structure.
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In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic illustration of a single trench fill cure cement provided in an embodiment of the present invention;
Fig. 2 is a schematic diagram of a cascade structure of a three-groove filling curing adhesive according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of transmission spectrum of a three-groove filling cured adhesive cascade structure according to an embodiment of the present invention;
FIG. 4 is a graph showing the variation of Δλ 12 with stress and temperature according to an embodiment of the present invention
FIG. 5 is a graph showing the variation of Δλ 23 with stress and temperature according to an embodiment of the present invention
FIG. 6 is a graph showing the variation of Deltalambda 12 with stress and temperature in accordance with an embodiment of the present invention;
Fig. 7 is a flowchart of a method for manufacturing a strain fiber sensor according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Fig. 1 shows a schematic diagram of a single-groove filling curing glue structure provided by an embodiment of the present invention, fig. 2 shows a schematic diagram of a three-groove filling curing glue cascade structure provided by an embodiment of the present invention, and referring to fig. 1 and fig. 2, a strain optical fiber sensor provided by an embodiment of the present invention includes:
The surface of the optical fiber is provided with at least three cascade groove structures, the depth and the width of each groove structure are different, and the groove structures are filled with different mediums with heat expansion and cold contraction and Young modulus parameters;
And each test end corresponds to one groove structure and is used for determining stress and temperature parameters according to the change amount of the resonant wavelength interval of the test groove structure.
Specifically, as shown in fig. 1, a groove structure is provided at the cladding of the optical fiber and filled with a medium so that the portion forms a deformation region. The invention can design the parameters E of the effective expansion with heat and contraction with cold alpha and Young modulus.
In specific implementation, as shown in fig. 1, a single trench is filled with a curing adhesive, and the trench is etched on the surface of the optical fiber, and has a width w and a depth d, and is filled with the curing adhesive. The thermal expansion coefficient alpha and the Young modulus coefficient E of the cured adhesive are different from those of the optical fiber material. Therefore, the effective thermal barrier cold shrinkage and Young modulus coefficient in the deformation area and the thermal expansion and cold shrinkage coefficient and Young modulus coefficient and the depth and width of the groove of the curing adhesive are related. The effective expansion coefficient alpha eff and Young's modulus coefficient E eff can be obtained by filling different parameters alpha and E and w and d. The correspondence of specific parameters (α, E, w, d) to α eff and E eff can be obtained experimentally. Specifically, the ambient temperature is kept unchanged, so that the values of (alpha, E, w and d) are changed, and external stress is applied to the two ends of the optical fiber. Since the refractive index of the cured glue is different from that of the optical fiber material, reflection is formed at the interfaces at the two sides of the groove, so that an FP resonance effect is formed. When external stress changes, FP resonance peak changes due to small variations in trench width w. The corresponding E eff is obtained through the variation of the resonance peak value. Or, the external stress is not exerted, so that the values of (alpha, E, w and d) are changed, the ambient temperature is changed, and the corresponding alpha eff is obtained through the change of the FP resonance peak. And storing relevant parameters, and selecting required optimized data in the subsequent optical fiber strain sensor design.
As shown in fig. 2, the fiber surface of the fiber strain sensor provided by the embodiment of the invention is provided with more than three cascading groove structures. The depth and width of the groove structure are different, and the groove structure is filled with media (curing glue or dielectric coating) with different parameters of thermal expansion, cold contraction and Young modulus. The stress and temperature parameters were determined by testing the amount of change corresponding to the three groove resonance wavelength intervals (2 wavelength interval amounts).
In specific implementation, as shown in fig. 2, a three-groove filling curing adhesive cascade structure is designed. Based on the effective thermal expansion and contraction and Young modulus parameter design method. Different alpha eff and E eff parameters of deformation regions corresponding to the three grooves are designed. In addition, here, since three grooves form three basic FP cavity structures, the transmission spectrum shown in fig. 3 can be obtained. Lambda 12 and lambda 3 in the test wavelength range correspond to the transmission spectra of the resonant cavities of deformation zone 1, deformation zone 2 and deformation zone 3. Wherein Δλ 12=λ21;Δλ23=λ32.
If the outside ambient temperature is unchanged, the stress is applied to the two ends of the optical fiber. At this time, the three deformed regions are different Eeff in terms of the amount of change in the width of the groove region. It is known from the fundamental principle of optical resonance that the amounts of change in the resonance peaks λ1, λ2 and λ3 of the three deformation regions are different. Therefore, if there is stress in the environment at a constant temperature, stress detection data can be obtained by changing the amounts Δλ1, Δλ2, and Δλ3 according to each wavelength.
If no stress is applied to the two ends of the optical fiber, the environment is changed. At this time, the three deformation regions also have different amounts of width change of the groove region due to the different αeff. It is known from the fundamental principle of optical resonance that the amounts of change in the resonance peaks λ1, λ2 and λ3 of the three deformation regions are different. Therefore, if the ambient temperature is changed without applying stress to both ends of the optical fiber, temperature detection data can be obtained from the amounts of change Δλ1, Δλ2 and Δλ3 for each wavelength.
In both cases, separate stress or temperature sensing can be well achieved. But the fiber structure exhibits a special optical response when the ambient temperature is changed and stress is applied across the fiber. Specifically, because of the different α eff and E eff, the thermal expansion and contraction of each deformation region is different from the wavelength change caused by the deformation, and the wavelength change is also different from deformation region to deformation region. The amount of change in wavelength is different due to the different amounts of structural deformation caused by temperature and stress. By varying the ambient temperature (T) and the stress (σ), the amounts of Δλ 12 and Δλ 23 were tested, resulting in a one-to-one relationship, i.e., Δλ 12=f(T,σ);Δλ23 =g (T, σ). The relevant data is tested for a specific fiber optic stress sensor, so that the stress parameters applied to the fiber optic sensor can be obtained by testing the amounts of Δλ 12 and Δλ 23. To further illustrate this problem, the test case is more specific. As shown in fig. 4, first, Δλ 12 and a temperature change curve T and Δλ 12 and a stress change σ curve are measured. It can be seen that the variation delta of delta lambda 12 (delta lambda 12) corresponds to a possible temperature variation deltat and also a possible strain variation deltasigma. At this time, the temperature and strain cannot be determined from one wavelength interval Δλ 12 or Δλ 23. However, as shown in fig. 5, since the three grooves α eff and E eff are different in parameter, the variation curve of Δλ 23 with respect to temperature and stress is different from that of Δλ 12. Therefore, as shown in fig. 6, the variation δ (Δλ 12) of Δλ 12 and the variation ΔΔt and Δσ of Δλ 23 and δ (Δλ 23) correspond to different variations. Thus, by measuring changes in Δλ 12 and Δλ 23 simultaneously, Δt and Δσ can be uniquely determined.
As an alternative implementation of the embodiment of the present invention, the optical fiber includes: plastic optical fibers and photonic crystal fibers. Specifically, the strain fiber sensor provided by the embodiment of the invention can be used for manufacturing a groove structure and filling glue on a plastic fiber and a photonic crystal fiber, so that the fiber strain sensor and the distributed sensing are realized.
As an alternative implementation of the embodiment of the present invention, the medium includes: curing glue or plating dielectric film. The curing glue comprises epoxy resin and glue or is prepared by mixing the epoxy resin and the glue according to different proportions. The dielectric coating comprises: silicon oxide, aluminum nitride, and aluminum oxide. Specifically, the grooves may be filled with EPO-TEK brand UV353nd epoxy, japanese NTT6001 glue, and mixtures thereof in different proportions; dielectric films such as silicon oxide, aluminum nitride, aluminum oxide and the like can be plated in the groove to replace the curing glue. The types of the plating films in different grooves are different, and the material compositions of the films can also be different.
As another embodiment of the present invention, the present invention provides an integrated waveguide sensor that replaces the optical fiber in the strained optical fiber sensor described above with a waveguide. Distributed sensing of the waveguide sensor may also be implemented.
As an alternative implementation of the embodiment of the present invention, the integrated waveguide sensor further includes: a tunable laser broadband light source chip; the tunable laser broadband light source chip and the waveguide sensing area detector of the integrated waveguide sensor are integrated on a carrier. Specifically, the tunable laser broadband light source chip, the integrated waveguide sensing function and the detector are integrated on a carrier, so that a miniaturized sensor module can be realized.
Specifically, based on the principle of the invention, grooves and glue filling can be manufactured on the integrated waveguide, so that the stress and temperature sensing are integrated. Specifically, waveguide structures with different widths and depths can be etched on the waveguide, and different curing adhesives are filled, so that the microminiature strain and temperature sensor is realized. Another advantage of the waveguide integrated chip is that the broadband light source chip, the waveguide sensing region and the detector can be integrated on one carrier, thereby realizing a sensor module with miniaturized structure.
Based on the principle of the invention, different dielectric films such as silicon oxide, aluminum nitride and the like can be plated in the optical fiber groove area. The dielectric films of different materials have different thermal expansion coefficients and Young's moduli, and the effective thermal expansion coefficients and Young's modulus values can be regulated and controlled by combining parameters such as the thickness of the coating film and the like with the groove structure. Particularly for integrated waveguide sensors, the coating process is compatible with the waveguide micro-nano process.
Therefore, the strain optical fiber sensor provided by the embodiment of the invention has the advantage that more than three groove structures are manufactured on the surface of the optical fiber. Each trench is different in width and depth and filled with a cured paste of different coefficient of thermal expansion and young's modulus. By adjusting the width and depth of the grooves, and the different cured gels filled, it is possible to achieve adjustment of the effective coefficient of thermal expansion and effective Young's modulus parameters in the area of the optical fiber having the grooves. The grooves filled with the curing glue form fabry-perot optical resonances. The fabry-perot (FP) resonance peak may change due to the strain of the fiber and the temperature resulting in groove deformation. However, since the effective thermal expansion coefficient and young's modulus parameters of each filled trench fiber region are different, the wavelength of the resonance peak is also different, so that the extraction of temperature and stress can be realized. The invention avoids the difficulty that the sensing quantity cannot be directly distinguished from temperature and strain in the traditional optical fiber strain sensing based on the Fabry-Perot resonance, thereby reducing the requirement on the packaging of the optical fiber sensor and realizing the low-cost sensing application.
The strain optical fiber sensor provided by the embodiment of the invention has compact structure and high sensitivity, and can be used for the fields of point measurement of strain, distributed sensing, internet of things and the like in the aspects of pipelines, buildings, machinery and the like.
Fig. 7 shows a flowchart of a method for manufacturing a strained optical fiber sensor according to an embodiment of the present invention, by which the strained optical fiber sensing area described above may be manufactured, and referring to fig. 7, the method for manufacturing a strained optical fiber sensor according to an embodiment of the present invention includes:
S1, placing an optical fiber in a V-shaped groove of quartz or a silicon wafer for fixation, designing a photoetching plate according to the preset groove width, exposing, developing, baking at a high temperature, and solidifying photoresist with patterns.
Specifically, the groove manufacturing is carried out on the surface of the optical fiber in the step:
And placing the optical fiber in a V-shaped groove of quartz or a silicon wafer for fixing, designing a photoetching plate for the required groove width, exposing, developing, baking at high temperature, and firmly fixing the photoresist with the pattern.
S2, determining the groove structures and the types of the filled media, and manufacturing at least three cascaded groove structures, wherein the depth and the width of each groove structure are different, and the parameters of expansion and contraction and Young modulus of the filled media in each groove structure are different.
Specifically, a proper groove structure and a filled glue type are selected, and a cascade structure of at least three grooves is manufactured, wherein parameters of each groove are different, so that curves of delta lambda 12 and delta lambda 23 with respect to different temperatures and stresses are ensured. And establishing delta lambda 12 and delta lambda 23 change curves and databases of simultaneous temperature and stress changes. From these data, the back-extrapolated temperature and stress parameters of Δλ 12 and Δλ 23, etc., obtained when the temperature and stress to be measured are changed, can be determined.
And S3, corroding the groove structure by utilizing hydrofluoric acid, and filling a medium at the groove.
As an optional implementation manner provided by the embodiment of the present invention, etching the preset trench structure with hydrofluoric acid includes: determining the depth of the corroded groove by controlling the corrosion time or adjusting the concentration of hydrofluoric acid; or a high-power laser is adopted for surface ablation, grooves are manufactured, and the depth of the grooves is determined through optical power and time.
Specifically, hydrofluoric acid is used to etch out the trench structure. The depth of the etched trench is determined by controlling the etching time or adjusting the hydrofluoric acid concentration. High power lasers may also be used for surface ablation to create grooves. Depth is determined by optical power and time.
Specifically, after determining the trench structure and the type of medium to be filled, a dispensing operation may be performed, and a suitable curing glue, specifically such as UV353nd epoxy of EPO-TEK brand, may be selected, and a dispensing process may be performed in the trench. And determining the glue dispensing time under the control of the glue amount. If the ultraviolet curing glue is cured by ultraviolet light, curing the glue at high temperature, and baking at high temperature for curing. Depending on the glue chosen.
S4, arranging optical fiber strain sensors with different working wavelengths at different positions of the optical fiber.
Specifically, optical fiber strain sensors of different operating wavelengths are fabricated at different locations of the optical fiber, thereby forming a distributed sensor.
As an optional implementation manner provided by the embodiment of the present invention, the method for manufacturing a strained optical fiber sensor provided by the embodiment of the present invention further includes: keeping the temperature constant, changing the stress of the optical fiber, measuring the Young modulus coefficient E eff according to the structural parameters and the change of the tested FP resonance peak, and establishing data curves of different groove structures, medium types and Young modulus coefficient E eff; and (3) no external stress exists, the environment temperature is changed, the effective thermal expansion coefficient alpha eff is measured according to structural parameters and through the change of a test FP resonance peak, and data curves of different groove structures and medium types and the effective thermal expansion coefficient alpha eff are established.
Specifically, the α eff and E eff parameters were determined for different trench structures and paste fill conditions.
Different groove structures and filled glue types are designed, the steps are repeated, the temperature is kept constant, the stress of the optical fiber is changed, E eff is measured according to structural parameters and through the change of a test FP resonance peak, and accordingly data curves of the different groove structures, the glue types and E eff are established.
Different groove structures and filled glue types are designed, the steps are repeated, the external stress is avoided, the environment temperature is changed, alpha eff is measured according to structural parameters and through the change of a test FP resonance peak, and accordingly data curves of the different groove structures, the glue types and alpha eff are established.
Therefore, the manufacturing method of the strain optical fiber sensor provided by the embodiment of the invention can manufacture the strain optical fiber sensor which has compact structure and high sensitivity and can be used for realizing the point measurement of strain in the aspects of pipelines, buildings, machinery and the like, and the fields of distributed sensing, the Internet of things and the like.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.

Claims (10)

1. A strain fiber optic sensor, comprising:
At least three cascade groove structures are arranged on the surface of the optical fiber, the depth and the width of each groove structure are different, and the medium with different expansion and contraction parameters and Young modulus parameters is filled in each groove structure;
And each test end corresponds to one groove structure and is used for determining stress and temperature parameters according to the change of the resonant wavelength interval of the groove structure.
2. The strain fiber optic sensor of claim 1, wherein the optical fiber is: plastic optical fibers or photonic crystal optical fibers.
3. The strain fiber optic sensor of claim 1, wherein the medium is: curing glue or plating dielectric film.
4. A strain fiber optic sensor according to claim 3, wherein the cured glue is epoxy.
5. A strained optical fiber sensor according to claim 3, wherein the dielectric coating is: silicon oxide, aluminum nitride or aluminum oxide.
6. An integrated waveguide sensor, characterized in that the optical fiber of any of claims 1 to 5 is replaced with a waveguide.
7. The integrated waveguide sensor of claim 6, further comprising: a tunable laser broadband light source chip;
The tunable laser broadband light source chip and the waveguide sensing area detector of the integrated waveguide sensor are integrated on a carrier.
8. A method of manufacturing a strained fiber optic sensor, comprising:
placing an optical fiber in a V-shaped groove of quartz or a silicon wafer for fixation, designing a photoetching plate according to the preset groove width, exposing, developing, baking at high temperature, and solidifying photoresist with patterns;
Determining a groove structure and the types of filled media, and manufacturing at least three cascaded groove structures, wherein the depth and the width of each groove structure are different, and the expansion and contraction parameters and the Young modulus parameters of the media filled in each groove structure are different;
etching a groove structure by utilizing hydrofluoric acid, and filling a medium at the groove;
optical fiber strain sensors of different operating wavelengths are arranged at different positions of the optical fiber.
9. The method of claim 8, wherein etching the trench structure with hydrofluoric acid comprises:
determining the depth of the corroded groove by controlling the corrosion time or adjusting the concentration of hydrofluoric acid; or alternatively
And (3) carrying out surface ablation by adopting a high-power laser, manufacturing a groove, and determining the depth of the groove through optical power and time.
10. The method as recited in claim 8, further comprising:
Keeping the temperature constant, changing the stress of the optical fiber, measuring Young modulus parameters E eff according to the structural parameters and the change of the tested FP resonance peak, and establishing data curves of different groove structures, medium types and Young modulus parameters E eff;
And (3) no external stress exists, the environment temperature is changed, the effective thermal expansion and contraction parameter alpha eff is measured according to the structural parameters and the change of the tested FP resonance peak, and data curves of different groove structures, medium types and the effective thermal expansion and contraction parameter alpha eff are established.
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