CN117264374B - White plastic package material for high-current ceramic substrate package and preparation method and application thereof - Google Patents
White plastic package material for high-current ceramic substrate package and preparation method and application thereof Download PDFInfo
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- CN117264374B CN117264374B CN202311573312.7A CN202311573312A CN117264374B CN 117264374 B CN117264374 B CN 117264374B CN 202311573312 A CN202311573312 A CN 202311573312A CN 117264374 B CN117264374 B CN 117264374B
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- epoxy resin
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- ceramic substrate
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- 239000004033 plastic Substances 0.000 title claims abstract description 45
- 229920003023 plastic Polymers 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- 239000000919 ceramic Substances 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 title claims abstract description 22
- 239000000463 material Substances 0.000 title claims description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000003822 epoxy resin Substances 0.000 claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 33
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 29
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000000843 powder Substances 0.000 claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 17
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 17
- 239000005022 packaging material Substances 0.000 claims abstract description 16
- 239000001038 titanium pigment Substances 0.000 claims abstract description 14
- 239000004593 Epoxy Substances 0.000 claims abstract description 12
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 11
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 11
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims abstract description 9
- 229920003986 novolac Polymers 0.000 claims abstract description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 7
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical group CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000005011 phenolic resin Substances 0.000 claims abstract description 5
- 239000011863 silicon-based powder Substances 0.000 claims abstract description 5
- 239000004209 oxidized polyethylene wax Substances 0.000 claims description 8
- 235000013873 oxidized polyethylene wax Nutrition 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 239000004594 Masterbatch (MB) Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 6
- 238000010298 pulverizing process Methods 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000012467 final product Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000004898 kneading Methods 0.000 claims description 3
- 238000007873 sieving Methods 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000004200 microcrystalline wax Substances 0.000 claims description 2
- 235000019808 microcrystalline wax Nutrition 0.000 claims description 2
- 239000012170 montan wax Substances 0.000 claims description 2
- -1 polyethylene Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 239000001993 wax Substances 0.000 claims description 2
- 238000010924 continuous production Methods 0.000 abstract description 5
- 239000000047 product Substances 0.000 description 23
- 235000010215 titanium dioxide Nutrition 0.000 description 10
- 230000009477 glass transition Effects 0.000 description 7
- 238000002310 reflectometry Methods 0.000 description 7
- 238000011056 performance test Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 239000005007 epoxy-phenolic resin Substances 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 230000001050 lubricating effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- H01L33/56—
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the technical field of epoxy resin plastic packaging materials, in particular to a white plastic packaging material for packaging a high-current ceramic substrate, and a preparation method and application thereof, wherein the preparation raw materials at least comprise epoxy resin, a curing agent, a catalyst, a release agent, spherical silica powder, titanium pigment and a silane coupling agent; the epoxy resin is trifunctional epoxy resin; the curing agent is linear phenolic resin; the ratio of the hydroxyl number of the phenolic novolac resin to the epoxy number of the trifunctional epoxy resin is 0.7-1; the addition amount of the titanium dioxide is 15-30% based on the total weight of the white plastic packaging material preparation raw materials; the total addition amount of the spherical silica powder and the titanium pigment is 80-88% based on the total weight of the white plastic packaging material preparation raw materials; the grain diameter of the spherical silicon powder is 8-15 mu m; the catalyst is heptadecylimidazole, the product reliability is high, the high fluidity requirement of EMC plane large-size packaging is met, and the molding property of continuous production is good.
Description
Technical Field
The invention relates to the technical field of epoxy resin plastic packaging materials, in particular to a white plastic packaging material for packaging a high-current ceramic substrate, and a preparation method and application thereof.
Background
At present, most of electronic plastic packaging materials in the market are combined systems of epoxy resin and phenolic resin, and inorganic filler and other auxiliary agents are introduced into the systems to prepare the plastic packaging material meeting the electronic packaging requirements, however, along with the enhancement of diversification trend of electronic packaging, the conventional plastic packaging material cannot meet the plane large-size packaging requirements of 5-10A large-current ceramic substrates of automobile lamps, because the current of the conventional plastic packaging material in practical application is generally controlled to be 1-2A, and the high-current use condition of 5-10A has higher requirements on the reliability of products.
The Chinese patent application (issued publication No. CN 111117540B) discloses a high-strength high-heat-resistance epoxy plastic package material for organic bentonite modified semiconductor packaging and a preparation method thereof, wherein the reliability of a product is improved mainly by introducing modified nano bentonite into an epoxy resin system, but the flowability of the product is poor and the plane large-size packaging requirement cannot be met.
Disclosure of Invention
In order to solve the problems, the invention provides the white plastic package material for the package of the high-current ceramic substrate and the preparation method thereof, and the formula and the preparation process of the plastic package material effectively improve the reliability of products, meet the high-fluidity requirement of EMC plane large-size package, have good molding property in continuous production and have high market popularization and application values.
The invention provides a white plastic package material for packaging a high-current ceramic substrate, which is prepared from the following raw materials of at least epoxy resin, a curing agent, a catalyst, a release agent, spherical silica powder, titanium pigment and a silane coupling agent; the epoxy resin is at least one of trifunctional epoxy resins; the curing agent is at least one of phenolic novolac resins.
As a preferred embodiment, the epoxy equivalent of the trifunctional epoxy resin is 180-250g/eq, preferably 205-215 g/eq.
As a preferred embodiment, the hydroxyl equivalent weight of the phenolic novolac resin is 90-120g/eq, preferably 104-108g/eq.
As a preferable technical scheme, the total addition amount of the trifunctional epoxy resin and the linear phenolic resin is 10-15%, preferably 11-14% based on the total weight of the white plastic package material preparation raw materials.
Preferably, the ratio of the hydroxyl number of the phenolic novolac resin to the epoxy number of the trifunctional epoxy resin is in the range of 0.5 to 1.2, preferably 0.7 to 1.0.
As a preferable technical scheme, the addition amount of the titanium dioxide is 15-30% based on the total weight of the white plastic package material preparation raw materials; preferably, the particle size of the titanium dioxide is 0.1-0.5 μm, preferably 0.18-0.22 μm.
As a preferable technical scheme, the total addition amount of the spherical silica powder and the titanium pigment is 80-88% based on the total weight of the white plastic package material preparation raw materials; preferably, the particle diameter (D50) of the spherical silicon powder is 8-15 μm, preferably 10-12 μm.
In order to ensure that the provided plastic packaging material meets the reliability requirement of 5-10A high current, the glass transition temperature, the reflectivity and the low shrinkage performance of the plastic packaging material are comprehensively coordinated. The inventor finds that the ratio of hydroxyl number of the linear phenolic resin to epoxy number of the trifunctional epoxy resin in the system is controlled to be 0.7-1.0, and simultaneously the amount of introduced titanium dioxide is controlled to be 15-30%, so that the prepared plastic package material has high glass transition temperature and high reflectivity, the reflectivity of the product at 460nm is between 85% and 95%, the glass transition temperature is about 175 ℃, and the reliability of the product is greatly improved. The inventors analyzed the cause may be: under the condition that the addition amount of the titanium dioxide and the hydroxyl number/epoxy number are adopted, the glass transition temperature and the reflectivity of the product are effectively balanced, and the excessive hydroxyl number/epoxy number or the excessive addition amount of the titanium dioxide can reduce the reflectivity of the product, so that the light attenuation is obvious, and the reliability of the product is affected; too small a hydroxyl number/epoxy number can result in a product with reduced glass transition temperature and can also affect product reliability.
Further, the inventor introduces spherical silica powder with the particle size (D50) of 10-12 mu m on the basis of introducing titanium dioxide with the particle size of 0.18-0.22 mu m, and particularly when the total addition amount of the spherical silica powder and the titanium dioxide is 80-88%, the provided product has high fluidity and continuous moldability, and meets the EMC plane large-size packaging requirement. The inventor analyzes that the reason is probably that under the addition amount, the titanium white powder and the high-fluidity spherical silicon powder with the particle size (D50) of 10-12 mu m are introduced in a matched way, so that the spiral flow length of the product is 40-60inch, the gel time is 25-40s, the hot hardness of 175 ℃ is more than 85, and the product has low shrinkage performance of 10-18 ppm/DEGC.
As a preferable technical scheme, the addition amount of the catalyst is 0.1-0.3%, preferably 0.13-0.21% based on the total weight of the white plastic molding material preparation raw material; the catalyst is heptadecylimidazole or a phosphorus catalyst, preferably heptadecylimidazole.
Heptadecylimidazole is introduced into the epoxy resin and phenolic resin curing speed and curing capacity are increased, and the gel time and spiral flow length of the product are further ensured to be in proper ranges.
As a preferable technical scheme, the addition amount of the release agent is 0.4-0.6%, preferably 0.44-0.56% based on the total weight of the raw materials for preparing the white plastic package material; the release agent is at least one of polyethylene wax, microcrystalline wax, oxidized polyethylene wax and montan wax, and is preferably oxidized polyethylene wax; preferably, the oxidized polyethylene wax is a linear oxidized polyethylene wax, and the drop point is 100-120 ℃.
According to the plastic packaging material provided by the invention, 0.44-0.56% of linear oxidized polyethylene wax with a dropping point of 100-120 ℃ is introduced as a release agent, so that the composition is endowed with excellent internal and external lubricating performance, can be separated out to the surface of a die during solidification and can be free from oxidation for a long time, and automatic stripping after continuous production of modulus for about 500 times can be realized.
As a preferable technical scheme, the addition amount of the silane coupling agent is 0.05-0.15% based on the total weight of the spherical silica powder and the titanium pigment.
According to the plastic package material provided by the invention, the silane coupling agent accounting for 0.05-0.15% is introduced, so that the fluidity of spherical silica powder and titanium pigment in a system is increased, and meanwhile, the infiltration and the adhesive force of the plastic package material to a frame are improved.
The invention also provides a preparation method of the white plastic package material for packaging the high-current ceramic substrate, which at least comprises the following steps:
(1) Pulverizing and sieving epoxy resin or curing agent and release agent, mixing 1/4 formula amount of epoxy resin or 1/4 formula amount of curing agent and all release agent, and adding into a pulverizer for dispersion to obtain pre-dispersion masterbatch;
(2) Adding the rest epoxy resin, the rest curing agent, the pre-dispersed masterbatch, all the catalyst, the spherical silica powder, the titanium pigment and the silane coupling agent into a high-speed mixer for mixing, adding the high-speed mixed material into an extruder, heating and kneading the material into a melt through the extruder, extruding the melt into sheets through a calender, cutting the sheet into a size convenient to be added into a pulverizer, pulverizing the sheet through the pulverizer, and finally adding into a cake making machine for making cakes according to the required size to obtain a final product.
Advantageous effects
1. The invention provides a white plastic package material for packaging a high-current ceramic substrate, which effectively improves the reliability of products through a plastic package material formula and a preparation process, meets the high-fluidity requirement of EMC plane large-size packaging, has good molding property in continuous production, and has high market popularization and application values.
2. The ratio of hydroxyl number of the linear phenolic resin to epoxy number of the trifunctional epoxy resin in the system is controlled to be 0.7-1.0, and meanwhile, the amount of introduced titanium pigment is controlled to be 15-30%, so that the prepared plastic package material has high glass transition temperature and high reflectivity, the reflectivity of the product at 460nm is 85% -95%, the glass transition temperature is about 175 ℃, and the reliability of the product is greatly improved.
3. The composition provided by the invention is characterized in that spherical silica powder with the particle size (D50) of 10-12 mu m is jointly introduced on the basis of introducing titanium dioxide with the particle size of 0.18-0.22 mu m, and particularly when the total addition amount of the spherical silica powder and the titanium dioxide is 80-88%, the provided product has high fluidity and continuous moldability, and meets the EMC plane large-size packaging requirement.
4. According to the plastic packaging material provided by the invention, 0.44-0.56% of linear oxidized polyethylene wax with a dropping point of 100-120 ℃ is introduced as a release agent, so that the composition is endowed with excellent internal and external lubricating performance, can be separated out to the surface of a die during solidification and can be free from oxidation for a long time, and automatic stripping after continuous production of modulus for about 500 times can be realized.
5. According to the plastic package material provided by the invention, the silane coupling agent accounting for 0.05-0.15% is introduced, so that the fluidity of spherical silica powder and titanium pigment in a system is increased, and meanwhile, the infiltration and the adhesive force of the plastic package material to a frame are improved.
Detailed Description
Examples 1 to 6
In one aspect, embodiments 1-6 of the present invention provide a white molding compound for packaging a high-current ceramic substrate, and the preparation raw materials are shown in table 1.
TABLE 1
The embodiments 1-6 of the present invention on the other hand provide a preparation method of a white molding compound for packaging a high-current ceramic substrate, which comprises the following steps:
(1) Pulverizing epoxy resin and a release agent, sieving with a 60-mesh sieve, mixing 1/4 of the formula amount of the epoxy resin and all the release agent, and then putting into a pulverizer for dispersion to obtain pre-dispersion masterbatch;
(2) Adding the rest epoxy resin, all curing agents, pre-dispersed masterbatch, all catalysts, spherical silica powder, titanium pigment and silane coupling agents into a high-speed mixer for mixing, adding the high-speed mixed materials into an extruder, heating and kneading the materials into melt through the extruder, extruding the melt into sheets through a calender, cutting the materials into the size convenient to be added into a pulverizer, pulverizing the materials through the pulverizer, and finally adding into a cake making machine for making cakes according to the required size to obtain a final product.
Comparative examples 1 to 8
Comparative examples 1-8 of the present invention provide a white molding compound for high-current ceramic substrate encapsulation and a preparation method thereof, wherein the preparation raw materials are shown in table 2, and the preparation method is the same as examples 1-6.
TABLE 2
Performance test method
The following performance tests, test items and test results are shown in tables 3 and 4, wherein the modeling judgment criteria are as follows: if the molded product has a flat appearance, no defects, no bubbles, no wire drawing adhesion, no warpage and easy demolding, the molded product is marked as 'qualified', and if the molded product has one of uneven appearance, defects, bubbles, wire drawing adhesion, warpage and difficult demolding, the molded product is marked as 'unqualified'.
Table 3, examples 1-6 Performance test items and test results
Table 4, comparative examples 1-8 Performance test items and test results
Claims (10)
1. The white plastic package material for packaging the high-current ceramic substrate is characterized in that the preparation raw materials at least comprise epoxy resin, a curing agent, a catalyst, a release agent, spherical silica powder, titanium pigment and a silane coupling agent; the epoxy resin is trifunctional epoxy resin; the curing agent is linear phenolic resin; the ratio of the hydroxyl number of the phenolic novolac resin to the epoxy number of the trifunctional epoxy resin is 0.7-1; the addition amount of the titanium dioxide is 15-30% based on the total weight of the white plastic packaging material preparation raw materials; the total addition amount of the spherical silica powder and the titanium pigment is 80-88% based on the total weight of the white plastic packaging material preparation raw materials; the grain diameter of the spherical silicon powder is 8-15 mu m; the catalyst is heptadecylimidazole.
2. The white molding compound for packaging a high-current ceramic substrate according to claim 1, wherein the epoxy equivalent of the trifunctional epoxy resin is 180-250g/eq; the hydroxyl equivalent of the phenolic novolac resin is 90-120g/eq.
3. The white molding compound for packaging a high-current ceramic substrate according to claim 2, wherein the epoxy equivalent of the trifunctional epoxy resin is 205-215g/eq; the hydroxyl equivalent of the phenolic novolac resin is 104-108g/eq.
4. The white plastic package material for high-current ceramic substrate packaging according to claim 3, wherein the total addition amount of the trifunctional epoxy resin and the phenolic novolac resin is 10-15% based on the total weight of the raw materials for preparing the white plastic package material.
5. The white plastic package material for packaging a high-current ceramic substrate according to claim 4, wherein the particle size of the spherical silicon powder is 10-12 μm.
6. The white plastic package material for packaging the high-current ceramic substrate according to claim 5, wherein the addition amount of the release agent is 0.4-0.6% based on the total weight of the raw materials for preparing the white plastic package material, and the release agent is at least one of polyethylene wax, microcrystalline wax, oxidized polyethylene wax and montan wax.
7. The white plastic package material for packaging a high-current ceramic substrate according to claim 6, wherein the release agent is oxidized polyethylene wax.
8. The white plastic package material for packaging a high-current ceramic substrate according to claim 7, wherein the catalyst is added in an amount of 0.1-0.3% based on the total weight of the raw materials for preparing the white plastic package material.
9. The white plastic package material for packaging the high-current ceramic substrate according to claim 8, wherein the addition amount of the silane coupling agent is 0.05-0.15% based on the total weight of the spherical silica powder and the titanium pigment.
10. A method for preparing a white molding compound for packaging a high-current ceramic substrate according to any one of claims 1 to 9, comprising at least the following steps:
(1) Pulverizing and sieving epoxy resin or curing agent and release agent, mixing 1/4 formula amount of epoxy resin or 1/4 formula amount of curing agent and all release agent, and adding into a pulverizer for dispersion to obtain pre-dispersion masterbatch;
(2) Adding the rest epoxy resin, the rest curing agent, the pre-dispersed masterbatch, all the catalyst, the spherical silica powder, the titanium pigment and the silane coupling agent into a high-speed mixer for mixing, adding the high-speed mixed material into an extruder, heating and kneading the material into a melt through the extruder, extruding the melt into sheets through a calender, cutting the sheet into a size convenient to be added into a pulverizer, pulverizing the sheet through the pulverizer, and finally adding into a cake making machine for making cakes according to the required size to obtain a final product.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311573312.7A CN117264374B (en) | 2023-11-23 | 2023-11-23 | White plastic package material for high-current ceramic substrate package and preparation method and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311573312.7A CN117264374B (en) | 2023-11-23 | 2023-11-23 | White plastic package material for high-current ceramic substrate package and preparation method and application thereof |
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| CN117264374B true CN117264374B (en) | 2024-02-20 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003192875A (en) * | 2001-12-27 | 2003-07-09 | Nitto Denko Corp | Epoxy resin composition |
| KR20110020382A (en) * | 2009-08-24 | 2011-03-03 | 세미텍 주식회사 | Epoxy resin molding compound with superior marking resolution |
| CN108017879A (en) * | 2016-11-04 | 2018-05-11 | 无锡创达新材料股份有限公司 | A kind of preparation of high-power LED encapsulation white epoxy moulding compound |
| CN115418082A (en) * | 2022-11-03 | 2022-12-02 | 天津德高化成新材料股份有限公司 | High-self-release composition for tantalum capacitor packaging and preparation method thereof |
-
2023
- 2023-11-23 CN CN202311573312.7A patent/CN117264374B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003192875A (en) * | 2001-12-27 | 2003-07-09 | Nitto Denko Corp | Epoxy resin composition |
| KR20110020382A (en) * | 2009-08-24 | 2011-03-03 | 세미텍 주식회사 | Epoxy resin molding compound with superior marking resolution |
| CN108017879A (en) * | 2016-11-04 | 2018-05-11 | 无锡创达新材料股份有限公司 | A kind of preparation of high-power LED encapsulation white epoxy moulding compound |
| CN115418082A (en) * | 2022-11-03 | 2022-12-02 | 天津德高化成新材料股份有限公司 | High-self-release composition for tantalum capacitor packaging and preparation method thereof |
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| CN117264374A (en) | 2023-12-22 |
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