CN117260792A - Manipulator and equipment with clamp splice - Google Patents
Manipulator and equipment with clamp splice Download PDFInfo
- Publication number
- CN117260792A CN117260792A CN202311533161.2A CN202311533161A CN117260792A CN 117260792 A CN117260792 A CN 117260792A CN 202311533161 A CN202311533161 A CN 202311533161A CN 117260792 A CN117260792 A CN 117260792A
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- finger
- stop
- block
- height
- robot
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- 235000012431 wafers Nutrition 0.000 claims description 63
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000012864 cross contamination Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/08—Gripping heads and other end effectors having finger members
Abstract
The disclosure discloses a manipulator and equipment with clamp splice, the manipulator includes: a first finger, wherein a first stop block and a second stop block are arranged at a first end of the first finger, and a first cushion block and a second cushion block are arranged at a second end opposite to the first end; the at least two second fingers are arranged on two sides of the first finger, and each of the at least two second fingers comprises a third stop block and a fourth stop block which are arranged at the first end, and a third cushion block and a fourth cushion block which are arranged at the second end; and at least one clamping block disposed at the second end of the first finger and movable relative to the first finger.
Description
Technical Field
The present disclosure relates to the field of semiconductor manufacturing, and more particularly, to a robot for transporting wafers and a semiconductor processing apparatus.
Background
In the prior art, in order to grasp the dirty and clean pieces in the wafer, it is often necessary to design different robots. For example, a robot is used to grasp the dirty piece and then perform cleaning. And the other robot is used to re-grasp and place the clean wafer to the desired location.
While two independent manipulators can prevent pollution of dirty sheets to clean sheets, the structure of the manipulator is complex and is not beneficial to efficient treatment.
Disclosure of Invention
The present disclosure is directed to solving at least one of the above-mentioned problems and disadvantages of the prior art, namely, at least being capable of improving the transfer efficiency of a semiconductor processing apparatus and reducing the number of robots. In view of this technical problem, the present disclosure proposes a new type of robot for transporting wafers based on how the robot is reused.
Specifically, the present disclosure proposes a robot for transferring wafers, the robot comprising:
a first finger, wherein a first stop block and a second stop block are arranged at a first end of the first finger, and a first cushion block and a second cushion block are arranged at a second end opposite to the first end;
the at least two second fingers are arranged on two sides of the first finger, and each of the at least two second fingers comprises a third stop block and a fourth stop block which are arranged at the first end, and a third cushion block and a fourth cushion block which are arranged at the second end; and
at least one clamping block is disposed at the second end of the first finger and is movable relative to the first finger.
In this way, the manipulator according to the present disclosure can utilize different parts set on the first finger and the second finger to achieve grabbing of the dirty piece and the clean piece by means of cooperation of different stoppers and cushion blocks and action of the clamp blocks, and different parts on the manipulator are adopted, so that the dirty piece and the clean piece can be contacted by adopting different parts under the condition of multiplexing the same manipulator, thereby avoiding pollution of the dirty piece to the clean piece, and in addition, the manipulator according to the present disclosure achieves multiplexing, thereby reducing the number of the manipulator. In addition, the number of the mechanical arms is reduced, so that the space of a process cavity can be saved, the cost of mechanical equipment can be reduced, or the use of high-precision mechanical arms can be reduced.
In one exemplary embodiment according to the present disclosure, the first and second stops, the first and second pads, the third and fourth stops, and the third and fourth pads are axisymmetric about a longitudinal axis of the first finger. In this way, a robot in accordance with the present disclosure can be enabled to grasp a wafer more firmly.
In one exemplary embodiment according to the present disclosure, the at least one clamping block is axisymmetric about the longitudinal axis of the first finger. In this way, the clamping of the clamping blocks can be uniformly stressed for the wafer, so that the wafer is not damaged.
In one exemplary embodiment according to the present disclosure, the robot further includes:
a first drive means arranged to move the first finger relative to the second finger to switch between a first relative position and a second relative position, wherein in the first relative position the first stop, the second stop, the third pad and the fourth pad are located on the same circumference, and wherein in the second relative position the third stop, the fourth stop, the first pad and the second pad are located on the same circumference.
Adjustment of the relative positions of the first finger and the second finger is achieved in this way.
In one exemplary embodiment according to the present disclosure, the robot further includes:
and a second drive means arranged to move the at least one clamping block relative to the first finger.
By means of the second driving device according to the disclosure, the clamping blocks according to the disclosure can clamp the wafer to be grabbed well, so that grabbing is more stable.
Preferably, in one exemplary embodiment according to the present disclosure, the at least one clamping block is directed towards the circumferential center with respect to a moving direction of the first finger. In this way, the wafer stress during clamping is more uniform, thereby improving the quality stability of the wafer.
Preferably, in one exemplary embodiment according to the present disclosure, at the first relative position, a circumference in which the first stopper, the second stopper, the third pad, and the fourth pad are located is at a first height, and wherein, at the second relative position, a circumference in which the third stopper, the fourth stopper, the first pad, and the second pad are located is at a second height.
More preferably, in one exemplary embodiment according to the present disclosure, the first height and the second height are the same, and the robot includes a first clamping block and a second clamping block, wherein the first clamping block is for clamping a wafer at the first height, and wherein the second clamping block is for clamping a wafer at the second height.
In one exemplary embodiment according to the present disclosure, the first height and the second height are different, the gripper block included in the robot has two bosses, wherein a first boss is used to clamp the wafer at the first height, and wherein the second boss is used to clamp the wafer at the second height.
Furthermore, a second aspect according to the present disclosure proposes a semiconductor processing apparatus comprising a robot as proposed according to the first aspect of the present disclosure.
In one exemplary embodiment according to the present disclosure, the semiconductor processing apparatus includes at least two robots, the at least two robots being in different layers.
In summary, among the manipulators according to the present disclosure, the manipulators according to the present disclosure can utilize different parts set on the first finger and the second finger to grasp the dirty piece and the clean piece by means of the cooperation of different stoppers and pads and the function of the clamping blocks, and adopt different parts on the manipulators, so that the dirty piece and the clean piece can be contacted by different parts under the condition of multiplexing the same manipulator, thereby avoiding the pollution of the dirty piece to the clean piece. In addition, the number of the mechanical arms is reduced, so that the space of a process cavity can be saved, the cost of mechanical equipment can be reduced, or the use of high-precision mechanical arms can be reduced.
Drawings
Features, advantages, and other aspects of embodiments of the disclosure will become more apparent upon reference to the following detailed description, taken in conjunction with the accompanying drawings, wherein several embodiments of the disclosure are shown by way of illustration, and not limitation, in which:
FIG. 1 shows a schematic view of a robot for transporting wafers in a first position according to the present disclosure;
FIG. 2 shows a schematic view of a robot for transporting wafers in a second position according to the present disclosure; and
fig. 3 illustrates a side view of another embodiment of a robot for a semiconductor processing apparatus in accordance with the present disclosure.
Detailed Description
The technical scheme of the invention is further specifically described below through examples and with reference to the accompanying drawings. In the specification, the same or similar reference numerals denote the same or similar components. The following description of embodiments of the present invention with reference to the accompanying drawings is intended to illustrate the general inventive concept and should not be taken as limiting the invention.
The terms "comprising," including, "and similar terms used herein should be interpreted as open-ended terms, i.e., including, but not limited to," meaning that other elements may also be included. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment," and so forth.
As described above, the present disclosure is directed to solving at least one of the above-mentioned problems and disadvantages of the related art, which is at least capable of improving the transfer efficiency of a semiconductor processing apparatus and reducing the number of robots. In view of this technical problem, the present disclosure proposes a new type of robot for transporting wafers based on how the robot is reused.
In summary, the present disclosure proposes a robot for transporting wafers, the robot comprising: a first finger, wherein a first stop block and a second stop block are arranged at a first end of the first finger, and a first cushion block and a second cushion block are arranged at a second end opposite to the first end; the at least two second fingers are arranged on two sides of the first finger, and each of the at least two second fingers comprises a third stop block and a fourth stop block which are arranged at the first end, and a third cushion block and a fourth cushion block which are arranged at the second end; and at least one clamping block disposed at the second end of the first finger and movable relative to the first finger. In this way, the manipulator according to the present disclosure can utilize different parts set on the first finger and the second finger to achieve grabbing of the dirty piece and the clean piece by means of cooperation of different stoppers and cushion blocks and action of the clamp blocks, and different parts on the manipulator are adopted, so that the dirty piece and the clean piece can be contacted by adopting different parts under the condition of multiplexing the same manipulator, thereby avoiding pollution of the dirty piece to the clean piece, and in addition, the manipulator according to the present disclosure achieves multiplexing, thereby reducing the number of the manipulator. In addition, the number of the mechanical arms is reduced, so that the space of a process cavity can be saved, the cost of mechanical equipment can be reduced, or the use of high-precision mechanical arms can be reduced.
The robot for transferring wafers of the present disclosure is described below with reference to fig. 1 to 3. Wherein fig. 1 shows a schematic view of a robot for transferring wafers according to the present disclosure in a first position, fig. 2 shows a schematic view of a robot for transferring wafers according to the present disclosure in a second position, and fig. 3 shows a side view of another embodiment of a robot for a semiconductor processing apparatus according to the present disclosure.
As can be seen from fig. 1, the robot for transferring wafers according to the present disclosure includes: a first finger 1, a first stop 3.1, a second stop 3.2 are arranged on a first end (for example, the left end) of the first finger 1, and a first cushion block 4.3 and a second cushion block 4.4 are arranged on a second end (for example, the right end) opposite to the first end; at least two second fingers 2 (e.g. on the upper and lower sides of fig. 1, respectively), the at least two second fingers 2 being arranged on both sides of the first finger 1, the at least two second fingers 2 comprising a third stop 3.3 and a fourth stop 3.4, respectively, arranged at the first end (e.g. left end), and a third pad 4.1 and a fourth pad 4.2, respectively, arranged at the second end (e.g. right end); and at least one clamping block (including reference numerals 5 and 6) provided at the second end (e.g., right end) of the first finger 1 and movable with respect to the first finger 1. In this way, the manipulator according to the present disclosure is able to achieve the gripping of dirty sheets and clean sheets by means of the cooperation of the different stops 3.1, 3.2, 3.3 or 3.4 and the pads 4.1, 4.2, 4.3 and 4.4 and the effect of the clamping blocks 5 and 6, with the different parts provided on the first finger 1 and the second finger 2, which use the different parts of the manipulator, so that the dirty sheets and clean sheets can be contacted with the different parts in case of multiplexing the same manipulator, whereby contamination of the dirty sheets to the clean sheets can be avoided, and furthermore the manipulator according to the present disclosure is reduced in number due to the multiplexing achieved.
As shown in fig. 1, the stops 3.3 and 3.4 and the pads 4.3 and 4.4 together support a wafer. Furthermore, the portions 6 of the clamping blocks 5 and 6 clamp the illustrated wafer, and thereby stably grip the wafer.
As can be seen from fig. 2, the robot for transferring wafers according to the present disclosure includes: a first finger 1, a first stop 3.1, a second stop 3.2 are arranged on a first end (for example, the left end) of the first finger 1, and a first cushion block 4.3 and a second cushion block 4.4 are arranged on a second end (for example, the right end) opposite to the first end; at least two second fingers 2 (e.g. on the upper and lower sides of fig. 1, respectively), the at least two second fingers 2 being arranged on both sides of the first finger 1, the at least two second fingers 2 comprising a third stop 3.3 and a fourth stop 3.4, respectively, arranged at the first end (e.g. left end), and a third pad 4.1 and a fourth pad 4.2, respectively, arranged at the second end (e.g. right end); and at least one clamping block (including reference numerals 5 and 6) provided at the second end (e.g., right end) of the first finger 1 and movable with respect to the first finger 1. In this way, the manipulator according to the present disclosure is able to achieve the gripping of dirty sheets and clean sheets by means of the cooperation of the different stops 3.1, 3.2, 3.3 or 3.4 and the pads 4.1, 4.2, 4.3 and 4.4 and the effect of the clamping blocks 5 and 6, with the different parts provided on the first finger 1 and the second finger 2, which use the different parts of the manipulator, so that the dirty sheets and clean sheets can be contacted with the different parts in case of multiplexing the same manipulator, whereby contamination of the dirty sheets to the clean sheets can be avoided, and furthermore the manipulator according to the present disclosure is reduced in number due to the multiplexing achieved.
In comparison to fig. 1, in fig. 2, the first finger 1 is moved, for example, to the right in the illustration, after which the stops 3.1 and 3.2 and the pads 4.1 and 4.2 together support a wafer. Furthermore, the portions 5 of the clamping blocks 5 and 6 clamp the illustrated wafer, and thereby stably grip the wafer.
Here, the first finger 1 is driven by a pneumatic cylinder or an electric cylinder, and is relatively displaceable with respect to the second finger 2. Different stoppers and cushion blocks are arranged on the first finger 1 and the second finger 2, and two different clamping blocks 5 and 6 are arranged at the right end of the finger and are driven by different air cylinders or electric cylinders respectively. By moving the first finger 1 to two different positions (for example the positions shown in fig. 1 and 2) the wafer can be contacted by different stops and pads and different clamping blocks, respectively, to achieve the prevention of cross contamination, and this has the advantage that: the wafer can be self-centering after clamping, and can be transmitted at high speed, etc. Preferably, in one exemplary embodiment according to the present disclosure, the at least one clamping block is directed towards the circumferential center with respect to a moving direction of the first finger. In this way, the wafer stress during clamping is more uniform, thereby improving the quality stability of the wafer.
Under state 1 of the robot arm according to the present disclosure, when the first finger 1 moves to the illustrated position, the parts of the first finger and the second finger contacting the wafer are: stop 3.1, stop 3.2, spacer 4.1, spacer 4.2, and clamping block 5. The clamping block 5 is driven by an air cylinder or an electric cylinder to perform horizontal movement in the drawing, the wafer is clamped when moving to the left, and the wafer is unclamped when moving to the right. Under state 2 of the robot arm according to the present disclosure, when the first finger 1 moves to the illustrated position, the parts of the finger contacting the wafer are: the check block 3.3, the check block 3.4, the cushion block 4.3, the cushion block 4.4 and the clamping block are driven by an air cylinder or an electric cylinder to do horizontal movement in a drawing, the wafer is clamped when the clamping block is moved to the left, and the wafer is unclamped when the clamping block is moved to the right. Here, in one exemplary embodiment according to the present disclosure, the first and second stoppers, the first and second pads, the third and fourth stoppers, and the third and fourth pads are axisymmetric about a longitudinal axis of the first finger. The masked manner enables the robot in accordance with the present disclosure to more firmly grasp the wafer. In one exemplary embodiment according to the present disclosure, the at least one clamping block is axisymmetric about the longitudinal axis of the first finger. In this way, the clamping of the clamping blocks can be uniformly stressed for the wafer, so that the wafer is not damaged. Here, in one exemplary embodiment according to the present disclosure, the robot further includes: a first drive means arranged to move the first finger relative to the second finger to switch between a first relative position and a second relative position, wherein in the first relative position the first stop, the second stop, the third pad and the fourth pad are located on the same circumference, and wherein in the second relative position the third stop, the fourth stop, the first pad and the second pad are located on the same circumference. Adjustment of the relative positions of the first finger and the second finger is achieved in this way. Preferably, in one exemplary embodiment according to the present disclosure, the robot further includes: and a second drive means arranged to move the at least one clamping block relative to the first finger. By means of the second driving device according to the disclosure, the clamping blocks according to the disclosure can clamp the wafer to be grabbed well, so that grabbing is more stable.
The solution provided by the present disclosure may contact the wafers by different components to transport the wafers, preventing cross-contamination between the wafers. In addition, the solution provided by the disclosure adopts a clamping design on the basis of distinguishing contact, and has the advantages of firm clamping, difficulty in dropping the wafer, self centering of the clamped wafer, high-speed transmission and the like.
In addition, as shown in fig. 3, the scheme can be expanded to design of multiple layers of fingers 301, 302, 303, 304 and 305, and the same moving parts with different layers can be driven by the same or different cylinders and electric cylinders. In addition, the front stop block and the rear cushion block of the scheme can be arranged at different heights, namely, the height of the wafer is 1 when the stop block 3.1, the stop block 3.2, the cushion block 4.1 and the cushion block 4.2 are contacted with the wafer, and the height of the wafer is 2 when the stop block 3.3, the stop block 3.4, the cushion block 4.3 and the cushion block 4.4 are contacted with the wafer. At this time, the clamping blocks 5 and 6 can be deformed into different height regions of the same clamping block, and the different regions of the same clamping block are respectively contacted with the wafers in the two states. In summary, it is preferred in one exemplary embodiment according to the present disclosure that at the first relative position, the circumferences at which the first stop, the second stop, the third pad and the fourth pad are located are at a first height, and wherein at the second relative position, the circumferences at which the third stop, the fourth stop, the first pad and the second pad are located are at a second height. More preferably, in one exemplary embodiment according to the present disclosure, the first height and the second height are the same, and the robot includes a first clamping block and a second clamping block, wherein the first clamping block is for clamping a wafer at the first height, and wherein the second clamping block is for clamping a wafer at the second height. In one exemplary embodiment according to the present disclosure, the first height and the second height are different, the gripper block included in the robot has two bosses, wherein a first boss is used to clamp the wafer at the first height, and wherein the second boss is used to clamp the wafer at the second height.
Furthermore, a second aspect according to the present disclosure proposes a semiconductor processing apparatus comprising a robot as proposed according to the first aspect of the present disclosure. Preferably, in one exemplary embodiment according to the present disclosure, the semiconductor processing apparatus includes at least two robots, the at least two robots being in different layers.
In summary, among the manipulators according to the present disclosure, the manipulators according to the present disclosure can utilize different parts set on the first finger and the second finger to grasp the dirty piece and the clean piece by means of the cooperation of different stoppers and pads and the function of the clamping blocks, and adopt different parts on the manipulators, so that the dirty piece and the clean piece can be contacted by different parts under the condition of multiplexing the same manipulator, thereby avoiding the pollution of the dirty piece to the clean piece. In addition, the number of the mechanical arms is reduced, so that the space of a process cavity can be saved, the cost of mechanical equipment can be reduced, or the use of high-precision mechanical arms can be reduced.
The above is merely an optional embodiment of the present disclosure, and is not intended to limit the embodiments of the present disclosure, and various modifications and variations may be possible to the embodiments of the present disclosure for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present disclosure are intended to be included within the scope of the embodiments of the present disclosure.
Although embodiments of the present disclosure have been described with reference to a number of specific embodiments, it should be understood that embodiments of the present disclosure are not limited to the specific embodiments disclosed. The embodiments of the disclosure are intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
Claims (10)
1. A robot for transporting wafers, the robot comprising:
a first finger, wherein a first stop block and a second stop block are arranged at a first end of the first finger, and a first cushion block and a second cushion block are arranged at a second end opposite to the first end;
the at least two second fingers are arranged on two sides of the first finger, and each of the at least two second fingers comprises a third stop block and a fourth stop block which are arranged at the first end, and a third cushion block and a fourth cushion block which are arranged at the second end;
at least one clamping block disposed at the second end of the first finger and movable relative to the first finger; and
a first drive means arranged to move the first finger relative to the second finger to switch between a first relative position and a second relative position, wherein in the first relative position the first stop, the second stop, the third pad and the fourth pad are located on the same circumference, and wherein in the second relative position the third stop, the fourth stop, the first pad and the second pad are located on the same circumference.
2. The manipulator of claim 1, wherein the first and second stops, the first and second blocks, the third and fourth stops, and the third and fourth blocks are axisymmetric about a longitudinal axis of the first finger.
3. The manipulator of claim 1 or 2, wherein the at least one clamping block is axisymmetric about a longitudinal axis of the first finger.
4. The manipulator of claim 1, further comprising:
and a second drive means arranged to move the at least one clamping block relative to the first finger.
5. The manipulator of claim 1 or 4, wherein the direction of movement of the at least one clamp block relative to the first finger is toward the circumferential center.
6. The robot of claim 1, wherein in the first relative position, the circumference in which the first stop, the second stop, the third pad, and the fourth pad are located is at a first height, and wherein in the second relative position, the circumference in which the third stop, the fourth stop, the first pad, and the second pad are located is at a second height.
7. The robot of claim 6, wherein the first height and the second height are the same, the robot comprising a first clamp block and a second clamp block, wherein the first clamp block is configured to clamp a wafer at the first height, and wherein the second clamp block is configured to clamp a wafer at the second height.
8. The robot of claim 6, wherein the first height and the second height are different, the gripper comprising two bosses, wherein a first boss is used to clamp a wafer at the first height, and wherein the second boss is used to clamp a wafer at the second height.
9. A semiconductor processing apparatus, characterized in that it comprises at least one robot according to any one of claims 1 to 8.
10. The semiconductor processing apparatus of claim 9, wherein the semiconductor processing apparatus comprises at least two robots, the at least two robots being in different layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311533161.2A CN117260792B (en) | 2023-11-17 | 2023-11-17 | Manipulator and equipment with clamp splice |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311533161.2A CN117260792B (en) | 2023-11-17 | 2023-11-17 | Manipulator and equipment with clamp splice |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117260792A true CN117260792A (en) | 2023-12-22 |
| CN117260792B CN117260792B (en) | 2024-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311533161.2A Active CN117260792B (en) | 2023-11-17 | 2023-11-17 | Manipulator and equipment with clamp splice |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117260792B (en) |
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| JPH0687531A (en) * | 1992-09-09 | 1994-03-29 | Hitachi Ltd | Delivery jig and device |
| JP2010206042A (en) * | 2009-03-05 | 2010-09-16 | Dainippon Screen Mfg Co Ltd | Substrate conveyance apparatus |
| CN103688348A (en) * | 2011-08-10 | 2014-03-26 | 川崎重工业株式会社 | End-effector device and substrate transport robot provided with said end-effector device |
| CN208179574U (en) * | 2018-04-19 | 2018-12-04 | 北京锐洁机器人科技有限公司 | A kind of clipping semiconductor mechanical hand end effector |
| CN114559453A (en) * | 2022-02-28 | 2022-05-31 | 上海普达特半导体设备有限公司 | Manipulator and semiconductor device |
| CN115136295A (en) * | 2020-02-17 | 2022-09-30 | 捷普有限公司 | Devices, systems, and methods for providing self-extracting grip for an end effector |
| CN115122369A (en) * | 2022-08-31 | 2022-09-30 | 上海果纳半导体技术有限公司武汉分公司 | End effector, manipulator and wafer transmission device |
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2023
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| JPH0687531A (en) * | 1992-09-09 | 1994-03-29 | Hitachi Ltd | Delivery jig and device |
| JP2010206042A (en) * | 2009-03-05 | 2010-09-16 | Dainippon Screen Mfg Co Ltd | Substrate conveyance apparatus |
| CN103688348A (en) * | 2011-08-10 | 2014-03-26 | 川崎重工业株式会社 | End-effector device and substrate transport robot provided with said end-effector device |
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| CN115136295A (en) * | 2020-02-17 | 2022-09-30 | 捷普有限公司 | Devices, systems, and methods for providing self-extracting grip for an end effector |
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| CN117260792B (en) | 2024-02-27 |
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