CN117259973A - Laser power supply circuit board processing and welding equipment and welding method thereof - Google Patents
Laser power supply circuit board processing and welding equipment and welding method thereof Download PDFInfo
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- CN117259973A CN117259973A CN202311227997.XA CN202311227997A CN117259973A CN 117259973 A CN117259973 A CN 117259973A CN 202311227997 A CN202311227997 A CN 202311227997A CN 117259973 A CN117259973 A CN 117259973A
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- 238000003466 welding Methods 0.000 title claims abstract description 149
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 230000008569 process Effects 0.000 claims abstract description 27
- 239000007921 spray Substances 0.000 claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims description 46
- 238000007789 sealing Methods 0.000 claims description 46
- 230000001360 synchronised effect Effects 0.000 claims description 23
- 239000011261 inert gas Substances 0.000 claims description 12
- 238000011282 treatment Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000002893 slag Substances 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims 5
- 235000017491 Bambusa tulda Nutrition 0.000 claims 5
- 241001330002 Bambuseae Species 0.000 claims 5
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims 5
- 239000011425 bamboo Substances 0.000 claims 5
- 239000000463 material Substances 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 238000002955 isolation Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 12
- 239000007789 gas Substances 0.000 description 6
- 238000005096 rolling process Methods 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of circuit board welding processing, in particular to laser power supply circuit board processing and welding equipment and a welding method thereof. The four corners department to the circuit board is fixed simultaneously and locks from top to bottom, avoid the welding process to appear vibrations, further promote welded stability, annular cooling about the welding area in the welding process, avoid the material around the circuit board to take place to desoldew, warp or burn out scheduling problem, promote the solder joint to cool off fast and solidify after the welding is accomplished, accelerate whole welded efficiency, and the circuit board is welded in the vacuum state, annular sprays the further isolation of impure gas simultaneously, ensure best welding effect when guaranteeing welding efficiency, make the circuit board after the welding have higher stability and better performance.
Description
Technical Field
The invention relates to the technical field of circuit board welding processing, in particular to laser power supply circuit board processing welding equipment and a welding method thereof.
Background
A circuit board is a base material for supporting and connecting electronic components, which are generally made of an insulating material such as a glass fiber reinforced board and on which conductive layers and circuit patterns are laid, and electronic components such as integrated circuits, resistors, capacitors, connectors, etc. are fixed to the circuit board by soldering and connected together by wires and metal etching lines, so that in order to ensure higher accuracy, degree of automation and processing speed of soldering the circuit board, it is necessary to solder the electronic components to the circuit board using a laser power source in order to provide better soldering quality and production efficiency, so that the soldered circuit board has higher stability and better performance.
The existing laser power supply is used for processing and welding a circuit board, firstly ensuring that a working area is clean and tidy, then setting proper laser welding parameters according to the requirements of welded elements and the circuit board, placing the circuit board to be welded on a workbench, opening laser equipment to weld a position to be welded, and checking welding quality after the welding is finished, wherein the automatic degree of the welding of the existing laser power supply is high, but the following defects exist: in the process of processing and welding a laser power supply circuit board, the heat affected area is overlarge, so that the heat generated in the laser welding process can cause the problems of desoldering, deformation or burning of materials around the circuit board, and the stability and performance of the circuit board are affected; laser welding equipment generally needs to use inert gas to reduce interference of oxygen to the welding process, but the gas quality is still impure in practical application, and still can lead to the reduction of welding quality; and when the circuit board is welded by the laser equipment, the circuit board may vibrate slightly to cause poor contact of welding spots or poor quality of the welding spots, so that the reliability of the welding spots is reduced, and the normal operation of the circuit board is affected.
Therefore, in order to ensure that the welded circuit board has higher stability and better performance, the invention provides laser power supply circuit board processing and welding equipment and a welding method thereof.
Disclosure of Invention
In order to solve the technical problems, the invention provides a laser power supply circuit board processing and welding device and a welding method thereof, which are achieved by the following specific technical means:
the utility model provides a laser power supply circuit board processing welding equipment, includes the fuselage, the up end fixed mounting of fuselage has sealed shell, sealed shell left end face middle section is provided with electronic sealed lid, just be provided with the counterpoint fixed establishment of counterpoint and fixed circuit board on the fuselage in sealed shell.
The alignment fixing mechanism comprises an alignment part fixedly arranged in the machine body, and the alignment part is provided with a fixing part for lifting and fixing the circuit board.
An evacuation mechanism for maintaining vacuum during soldering of the circuit board is provided on the sealed housing.
And the evacuating mechanism and the sealing shell are jointly provided with a synchronous cooling mechanism which is used for synchronously cooling welding spots up and down and protecting welding quality.
The synchronous cooling mechanism comprises a synchronous part fixedly arranged on the evacuating mechanism and following welding, and a cooling part for providing cooling inert gas for the synchronous part is fixedly arranged on the sealing shell.
As a preferable technical scheme of the invention, the aligning part comprises a chute, a screw rod, a motor, a shaft rod, a sliding block and an aligning tray frame, wherein the upper end face of the machine body is provided with the chute at the diagonal line of the machine body, the chute penetrates through the upper end face of the machine body, the screw rod is rotatably arranged below the chute in the machine body through a supporting plate arranged in the machine body, the bevel gears are fixedly sleeved at one ends of the screw rods, which are close to each other, the motor is fixedly arranged in the machine body, the output end of the motor is rotatably arranged with the shaft rod, the shaft rod is fixedly sleeved with a gear ring, the gear ring is in meshed connection with the bevel gears, the sliding block is slidably arranged in the chute, the sliding block comprises square holes and screw grooves which are arranged from top to bottom, the screw grooves are in threaded connection with the screw rod, the aligning tray frame is fixedly arranged at the upper end face of the sliding block, and the right-angle limiting plates for clamping four corners of a circuit board are arranged at the upper end face of the aligning tray frame.
As a preferable technical scheme of the invention, the fixing part comprises a guide plate, a push rod, springs and guide wheels, wherein the guide plate is fixedly arranged in the chute and penetrates through the square holes, the guide plate comprises a straight plate, an inclined plate and a flat plate which are arranged from outside to inside, the push rod is slidably arranged on the alignment tray frame and near the right-angle limiting plate in a penetrating manner, the upper end faces of the push rod are all arranged in rubber, the springs are arranged between the lower ends of the push rod and the alignment tray frame, and the lower end faces of the push rod are rotatably provided with the guide wheels which slide on the guide plate.
As a preferable technical scheme of the invention, the evacuation mechanism comprises an air pump, a connecting cylinder, a double-layer cylinder, a round rubber plate, rolling balls, a mechanical arm and a laser welding head, wherein the air pump is fixedly arranged at the front end of the machine body, the connecting cylinder penetrating through a sealing shell is fixedly connected with the extraction end of the air pump, the double-layer cylinder is fixedly arranged at the center of the upper end face of the sealing shell, the double-layer cylinder consists of the inner cylinder and the outer cylinder, a cavity is formed between the inner cylinder and the outer cylinder, the round rubber plate is arranged at the center of the upper end of the double-layer cylinder and in the cavity, the radius of the round rubber plate is larger than that of the upper end of the double-layer cylinder, a circle of rubber strips are arranged on one side wall of the upper ends of the inner cylinder and the outer cylinder, which are close to the round rubber plate, a plurality of rolling balls which are convenient for sliding in the cavity are rotatably arranged on the inner cylinder in a circumferential array mode, the mechanical arm is fixedly arranged on the sealing shell, and the center of the round rubber plate penetrates through the center of the round rubber plate and is fixedly connected with the mechanical arm, and the laser welding head is fixedly arranged on the lower end face of the mechanical arm.
As a preferable technical scheme of the invention, the synchronous part comprises a U-shaped frame, a circular air pipe, a connecting inclined frame, a fixing ring and bolts, wherein the connecting inclined frame is fixedly arranged on the mechanical arm and in the sealing shell, the U-shaped frame is fixedly arranged at the lower end of the connecting inclined frame, the circular air pipe is fixedly arranged at the upper end and the lower end of the U-shaped frame and at the outer side of the laser welding head, the fixing ring is fixedly arranged above the circular air pipe through a supporting rod, and a plurality of bolts for fixing the U-shaped frame on the laser welding head are in threaded connection with the fixing ring in a circumferential array mode.
As a preferable technical scheme of the invention, the cooling part comprises a cooler, an air inlet pipe, a pressure pump, a telescopic pipe, connecting pipes and spray heads, wherein the cooler is fixedly arranged on the front end face of the machine body, the air inlet pipe is fixedly arranged at the air inlet end of the cooler, the pressure pump is fixedly arranged on the front end face of the machine body, the air outlet end of the cooler is fixedly connected with the extraction end of the pressure pump, the telescopic pipe penetrating through the sealing shell is fixedly arranged at the output end of the pressure pump, the other end of the telescopic pipe is fixedly arranged on a U-shaped frame, a plurality of spray heads are fixedly arranged on one side wall, which is mutually close to the annular air pipes, in a circumferential array mode, the spray heads are inclined towards the laser welding heads, the connecting pipes which are communicated with the corresponding annular air pipes are fixedly arranged on the U-shaped frame, and the upper connecting pipes and the lower connecting pipes are communicated with the telescopic pipe.
As a preferable technical scheme of the invention, the invention also provides a welding method for performing specific work by adopting the laser power supply circuit board processing welding equipment, and the specific welding method comprises the following steps of:
s1: preparation: and opening the electric sealing cover, and placing the circuit board to be welded to the central position of the machine body.
S2: evacuation equipment: closing the electric sealing cover, and pumping out the air in the sealing shell through the evacuation mechanism, so that the welding process is always in a vacuum state.
S3: positioning and fixing: the circuit board is aligned and lifted for a certain distance through the alignment fixing mechanism to be fixed again, so that the stability of the circuit board in the welding process is ensured.
S4: laser welding: the to-be-welded area on the circuit board is welded through the evacuation mechanism, and the synchronous cooling mechanism carries out synchronous cooling and protection treatment on the circuit board up and down along with the welding position, so that the welding quality is improved while the welding efficiency is ensured.
S5: and (3) subsequent treatment: and opening the electric sealing cover again to take out the welded circuit board, checking the welding quality, and carrying out subsequent treatment on the welding area according to the requirement, such as cleaning, removing welding slag and carrying out surface treatment operation.
Compared with the prior art, the invention has the following beneficial effects:
1. this laser power supply circuit board processing welding equipment uses through the counterpoint fixed establishment that sets up, fixes the four corners department of circuit board simultaneously to lock to its upper and lower face dies, avoids the circuit board to appear vertical or horizontal vibrations in the welding process, thereby can avoid solder joint poor contact or solder joint quality not good, makes the problem of solder joint's reliability decline, further promotes the stability and the performance of circuit board.
2. The laser power supply circuit board processing welding equipment is used by the arranged synchronous cooling mechanism, can move along with the laser welding head in the welding process, and is used for cooling the periphery of a welding area in an up-down annular manner in the welding process, so that the problems of welding off, deformation or burning and the like of materials around the circuit board due to heat generated in the laser welding process are avoided, welding spots are promoted to be rapidly cooled and solidified after the welding is completed, and the whole welding efficiency is accelerated.
3. The laser power supply circuit board processing welding equipment is used through the set evacuation mechanism, so that the whole process of laser welding the circuit board is carried out in a vacuum state, atmosphere pollution in the welding process can be eliminated, the welding quality is improved, good insulating performance can be provided by vacuum, arc discharge and spark generation are reduced, and arc perforation is prevented and electronic elements on the circuit board are protected.
4. This laser power supply circuit board processing welding equipment uses through the mutual cooperation of synchronous cooling mechanism and the mechanism that evacuates that sets up, and the inert gas that sprays through the annular is with the impure gas that exists in the welding position further isolated, reduces impurity and the existence of oxygen in the atmosphere to this protects welded quality, through reducing oxidation reaction and metal surface's oxidation phenomenon, further promotes the welded quality to the circuit board.
5. This laser power supply circuit board processing welding equipment uses through the mutual cooperation of counterpoint fixed establishment, synchronous cooling mechanism and the mechanism of evacuating that sets up, ensures best welding effect when guaranteeing welding efficiency to guarantee that the circuit board after the welding has higher stability and better performance.
Drawings
Fig. 1 is a schematic perspective view of a fuselage of the present invention.
Fig. 2 is a schematic view of the internal perspective structure of the fuselage of the present invention.
Fig. 3 is a schematic internal perspective view of the seal housing of the present invention.
Fig. 4 is a schematic perspective view of an alignment and fixing mechanism according to the present invention.
Fig. 5 is an enlarged schematic view of the structure at a in fig. 4.
Fig. 6 is an enlarged schematic view of the structure at B in fig. 2.
Fig. 7 is a schematic perspective view of the synchronous cooling mechanism of the present invention.
Fig. 8 is an enlarged schematic view of the structure at C in fig. 7.
In the figure: 1. a body; 2. a sealed housing; 3. an electric sealing cover; 4. an alignment fixing mechanism; 41. an alignment part; 411. a chute; 412. a screw; 413. a motor; 414. a shaft lever; 415. a slide block; 416. aligning the disc rack; 42. a fixing part; 421. a guide plate; 422. a push rod; 423. a spring; 424. a guide wheel; 5. an evacuation mechanism; 501. an air extracting pump; 502. a connecting cylinder; 503. a double-layer cylinder; 504. a round rubber plate; 505. a rolling ball; 506. a mechanical arm; 507. a laser welding head; 6. a synchronous cooling mechanism; 61. a synchronization section; 611. a U-shaped frame; 612. a circular air pipe; 613. connecting an inclined frame; 614. a fixing ring; 615. a bolt; 62. a cooling unit; 621. a cooler; 622. an air inlet pipe; 623. a pressurizing pump; 624. a telescopic tube; 625. a connecting pipe; 626. a spray head.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, 2, 3, 4 and 5, a laser power supply circuit board processing and welding device comprises a machine body 1, wherein a sealing shell 2 is fixedly arranged on the upper end surface of the machine body 1, an electric sealing cover 3 is arranged in the middle of the left end surface of the sealing shell 2, and an alignment fixing mechanism 4 for aligning and fixing the circuit board is arranged on the machine body 1 and in the sealing shell 2.
The alignment fixing mechanism 4 includes an alignment portion 41 fixedly installed in the body 1, and the alignment portion 41 is provided with a fixing portion 42 for lifting and fixing the circuit board.
Referring to fig. 1, 2, 3, 6 and 7, an evacuation mechanism 5 for maintaining vacuum during soldering of the circuit board is provided on the hermetic case 2.
Referring to fig. 1, 2, 3, 4, 7 and 8, the evacuation mechanism 5 and the seal housing 2 are provided with a synchronous cooling mechanism 6 for synchronizing the annular cooling spot and the welding spot and protecting the welding quality.
The synchronous cooling mechanism 6 includes a synchronous portion 61 fixedly installed on the evacuation mechanism 5 following welding, and a cooling portion 62 fixedly installed on the sealed housing 2 for supplying cooling inert gas to the synchronous portion 61.
Referring to fig. 3, 6 and 7, the evacuation mechanism 5 includes an air pump 501, a connecting cylinder 502, a double-layer cylinder 503, a round rubber plate 504, a rolling ball 505, a mechanical arm 506 and a laser welding head 507, the front end of the machine body 1 is fixedly connected with the air pump 501, the extracting end of the air pump 501 is fixedly connected with the connecting cylinder 502 penetrating through the sealing shell 2, the double-layer cylinder 503 is fixedly installed at the center of the upper end face of the sealing shell 2, the double-layer cylinder 503 is composed of an inner cylinder and an outer cylinder, a cavity is formed between the inner cylinder and the outer cylinder, the round rubber plate 504 is placed at the center of the upper end of the double-layer cylinder 503 in the cavity, the radius of the round rubber plate 504 is larger than that of the upper end of the double-layer cylinder 503, a circle of rubber strips are arranged on one side wall of the upper ends of the inner cylinder and the outer cylinder, which are close to the round rubber plate 504, a plurality of rolling balls 505 which are convenient for the round rubber plate 504 to slide in the cavity are rotatably installed on the inner cylinder in a circumferential array mode, the mechanical arm 506 is fixedly installed on the sealing shell 2, the mechanical arm 506 penetrates the center of the round rubber plate 504 and is fixedly connected with the sealing shell, and the lower end face of the mechanical arm 506 is fixedly installed with the laser welding head 507.
When the circuit board is required to be welded, the electric sealing cover 3 is firstly opened, then the circuit board to be welded is placed at the center of the machine body 1, and then the electric sealing cover 3 is closed, so that the electric sealing cover 3 firstly closes the sealing shell 2, and then the air sucking pump 501 can be started to suck out the air in the machine body 1 and the sealing shell 2 through the connecting cylinder 502, so that the laser welding head 507 is always in a vacuum state in the process of welding the circuit board.
When the mechanical arm 506 moves with the laser welding head 507, the circular rubber plate 504 moves along with the mechanical arm 506 on the upper end surface of the double-layer cylinder 503, and the redundant circular rubber plate 504 stretches into the cavity, so that the mechanical arm 506 moves to any position no matter in the upper end surface of the double-layer cylinder 503 due to the radius of the circular rubber plate 504 being larger than the upper end surface of the double-layer cylinder 503, and the circular rubber plate 504 always covers the double-layer cylinder 503, so that the mechanical arm 506 is in the moving process, and the circular rubber plate 504 prevents a large amount of air from entering the sealing shell 2.
And the rolling ball 505 on the inner cylinder can make the round rubber plate 504 smooth when moving, and simultaneously the rubber strips on the inner cylinder and the outer cylinder can further avoid a large amount of air to enter the sealed shell 2, so that a relatively vacuum welding space can be formed in the sealed shell 2 under the condition that the air pump 501 always operates, the whole process of laser welding the circuit board is performed in a vacuum state, the atmosphere pollution in the welding process can be eliminated, the welding quality is improved, and the vacuum can provide good insulating performance, reduce the generation of arc discharge and spark, prevent arc perforation and protect electronic elements on the circuit board.
Referring to fig. 3 and 4, the alignment part 41 includes a chute 411, a screw rod 412, a motor 413, a shaft 414, a slider 415 and an alignment tray 416, the upper end surface of the machine body 1 is provided with the chute 411 at the diagonal line, the chute 411 penetrates through the upper end surface of the machine body 1, the screw rod 412 is rotatably installed below the chute 411 and in the machine body 1 through a supporting plate, one end of the screw rod 412, which is close to each other, is fixedly sleeved with a bevel gear, the motor 413 is fixedly installed in the machine body 1, the output end of the motor 413 is rotatably installed with the shaft 414, the shaft 414 is fixedly sleeved with a gear ring, the gear ring is in meshed connection with the bevel gear, the slider 415 is slidably installed in the chute 411, the slider 415 includes square holes and screw grooves which are arranged from top to bottom, the screw grooves are in threaded connection with the screw rod 412, the upper end surface of the slider 415 is fixedly installed with the alignment tray 416, and the upper end surface of the alignment tray 416 is provided with right-angle limiting plates for clamping four corners of a circuit board.
When the vacuum pump is specifically operated, after the vacuum pump mechanism 5 pumps vacuum in the sealed shell 2, the motor 413 can be started to rotate with the shaft rod 414, and through the mutual matching of the gear ring and the bevel gear, the screw 412 with four corners starts to rotate at the same speed, at the moment, the screw 412 can gradually approach the circuit board at the same speed in the sliding groove 411 through the sliding block 415 with four corners, and finally the alignment tray frame 416 with four corners can calibrate the position of the placed circuit board firstly with the right-angle limiting plate, and the alignment tray frame 416 is horizontally fixed when continuously moving, and at the moment, the motor 413 can be stopped.
Referring to fig. 4 and 5, the fixing portion 42 includes a guide plate 421, a push rod 422, a spring 423 and a guide wheel 424, the guide plate 421 is fixedly installed in the chute 411 and penetrates through the square hole, the guide plate 421 includes a straight plate, a sloping plate and a flat plate, the push rod 422 is slidably installed on the alignment tray frame 416 and near the right angle limiting plate, the upper end surface of the push rod 422 is rubber, the spring 423 is provided between the lower end of the push rod 422 and the alignment tray frame 416, and the guide wheel 424 sliding on the guide plate 421 is rotatably installed on the lower end surface of the push rod 422.
During concrete work, the guide plate 421 passes through the square hole of the guide plate 415 in the moving process, at this moment, the spring 423 always presses the guide wheel 424 on the guide plate 421, when the right-angle limiting plate performs calibration and then moves to the circuit board position, at this moment, the guide wheel 424 moves to the position of the inclined plate, the ejector rods 422 at four corners can lift upwards under the action of the inclined plate of the guide plate 421, so that the ejector rods 422 lift the circuit board upwards on the right-angle limiting plate and fix the circuit board horizontally on the right-angle limiting plate, at this moment, the guide wheel 424 moves to the flat plate, so that the ejector rods 422 at four corners lock the upper surface and the lower surface of the circuit board, and the circuit board is all-round fixed, thereby avoiding vertical or horizontal vibration of the circuit board in the welding process, avoiding poor contact of welding points or poor quality of welding points, reducing the reliability of the welding points, and further improving the stability and performance of the circuit board.
Referring to fig. 7 and 8, the synchronization part 61 includes a U-shaped frame 611, a ring air pipe 612, a connecting inclined frame 613, a fixing ring 614 and bolts 615, the connecting inclined frame 613 is fixedly mounted on the mechanical arm 506 and in the sealing shell 2, the U-shaped frame 611 is fixedly mounted at the lower end of the connecting inclined frame 613, the ring air pipe 612 is fixedly mounted at the upper and lower ends of the U-shaped frame 611 and outside the laser welding head 507, the fixing ring 614 is fixedly mounted above the upper ring air pipe 612 through a support rod, and a plurality of bolts 615 for fixing the U-shaped frame 611 on the laser welding head 507 are screwed on the fixing ring 614 in a circumferential array manner.
Referring to fig. 3, 4, 7 and 8, the cooling portion 62 includes a cooler 621, an air inlet pipe 622, a pressurizing pump 623, a telescopic pipe 624, a connecting pipe 625 and a nozzle 626, the front end surface of the machine body 1 is fixedly provided with the cooler 621, the air inlet end of the cooler 621 is fixedly provided with the air inlet pipe 622, the front end surface of the machine body 1 is fixedly provided with the pressurizing pump 623, the air outlet end of the cooler 621 is fixedly connected with the extracting end of the pressurizing pump 623, the output end of the pressurizing pump 623 is fixedly provided with the telescopic pipe 624 penetrating through the sealing shell 2, the other end of the telescopic pipe 624 is fixedly arranged on the U-shaped frame 611, a side wall, which is mutually close to the upper and lower annular pipes 612, is fixedly provided with a plurality of nozzles 626 in a circumferential array manner, the upper and lower nozzles 626 are inclined towards the laser welding heads 507, the upper and lower ends of the U-shaped frame 611 are fixedly provided with connecting pipes 625 communicated with the corresponding annular pipes 612, and the upper and lower connecting pipes 625 are communicated with the telescopic pipe 624.
When the circuit board is fixed by the positioning and fixing mechanism 4, the mechanical arm 506 and the laser welding head 507 can be started, the circuit board is firstly positioned between the upper end and the lower end of the U-shaped frame 611 through the mechanical arm 506, the welding of the to-be-welded area on the circuit board can be started, the pressurizing pump 623 is started simultaneously, inert gas is pumped into the cooler 621 through the gas inlet pipe 622, the cooler 621 is used for cooling the inert gas, the cooled inert gas is discharged into the telescopic pipe 624, and finally the cooled inert gas is led into the circular gas pipe 612 through the connecting pipe 625.
In the process, the mechanical arm 506 moves along with the U-shaped frame 611 through the connecting inclined frame 613, at this time, the upper and lower annular air pipes 612 of the U-shaped frame 611 are respectively arranged above and below the welding point of the circuit board, the positions of the upper annular air pipes 612 are limited near the welding point of the laser welding head 507 to the circuit board by the bolts 615 and the fixed rings 614, and meanwhile, the spray heads 626 incline towards the laser welding head 507, so that cooled inert gas in the upper and lower annular air pipes 612 sprays upwards and downwards from the spray heads 626 to the welding point at this time, the problems that the materials around the circuit board are heated by heat generated in the laser welding process, the materials are subjected to desoldering, deformation or burning and the like are avoided, and after the welding is finished, the welding point is promoted to be rapidly cooled and solidified, and the whole welding efficiency is accelerated.
Meanwhile, the inert gas sprayed by the annular spray head 626 further isolates the impure gas existing in the welding position, reduces the impurities and oxygen existing in the atmosphere, protects the welding quality, and further improves the welding quality of the circuit board by reducing oxidation reaction and oxidation phenomena of the metal surface.
In addition, the invention also provides a welding method for performing specific work by adopting the laser power supply circuit board processing welding equipment, and the specific welding method comprises the following steps:
s1: preparation: the motor-driven sealing cover 3 is opened, and the circuit board to be soldered is placed in the center of the body 1.
S2: evacuation equipment: closing the electric sealing cover 3 closes the sealing shell 2, and then starting the air pump 501 to pump out the air in the machine body 1 and the sealing shell 2, so as to achieve the vacuum state all the time in the process of welding the circuit board.
S3: positioning and fixing: after the evacuation mechanism 5 draws vacuum in the sealed shell 2, the motor 413 can be started to horizontally fix the circuit board through the alignment part 41, and when the circuit board is horizontally fixed, the fixing part 42 locks the upper surface and the lower surface of the circuit board, so that the circuit board is completely and comprehensively fixed, and at the moment, the motor 413 can be stopped to ensure the stability of the circuit board in the welding process.
S4: laser welding: after the alignment fixing mechanism 4 is used for fixing the circuit board, the mechanical arm 506 and the laser welding head 507 can be started, the circuit board is firstly positioned between the upper end and the lower end of the U-shaped frame 611 through the mechanical arm 506, the area to be welded on the circuit board can be welded, the pressurizing pump 623 is started at the same time, the pressurizing pump is enabled to spray up and down to the welding point through the mutual matching of the synchronous part 61 and the cooling part 62, the welding point is enabled to be rapidly cooled and solidified, the whole welding efficiency is accelerated, meanwhile, the inert gas sprayed through the annular nozzle 626 further isolates the impure gas existing in the welding position, and the quality of the welding of the circuit board is improved.
S5: and (3) subsequent treatment: the electric sealing cover 3 is opened again to take out the soldered circuit board, and the soldering quality is checked, including the form of the soldered joint, the soldering strength, whether or not a soldering defect occurs during the soldering process, etc., and then the soldering area is subjected to subsequent treatments such as cleaning, removing soldering slag, and performing surface treatment operations as needed, so as to ensure the cleanliness of the soldering area and the reliability of the electrical connection.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. Laser power supply circuit board processing welding equipment, including fuselage (1), its characterized in that: the upper end face of the machine body (1) is fixedly provided with a sealing shell (2), the middle section of the left end face of the sealing shell (2) is provided with an electric sealing cover (3), and an alignment fixing mechanism (4) for aligning and fixing a circuit board is arranged on the machine body (1) and in the sealing shell (2);
the alignment fixing mechanism (4) comprises an alignment part (41) fixedly arranged in the machine body (1), and the alignment part (41) is provided with a fixing part (42) for lifting and fixing the circuit board;
an evacuating mechanism (5) for maintaining vacuum in the process of welding the circuit board is arranged on the sealing shell (2);
the evacuating mechanism (5) and the sealing shell (2) are provided with a synchronous cooling mechanism (6) which is used for synchronously cooling welding spots up and down and protecting welding quality;
the synchronous cooling mechanism (6) comprises a synchronous part (61) fixedly arranged on the evacuating mechanism (5) and following welding, and a cooling part (62) for providing cooling inert gas for the synchronous part (61) is fixedly arranged on the sealing shell (2).
2. The laser power circuit board processing and welding device according to claim 1, wherein: the utility model provides a right angle clamping device, including frame (416) of counterpoint portion (41), including spout (411), screw rod (412), motor (413), axostylus axostyle (414), slider (415) and counterpoint, spout (411) have all been seted up in the up end of fuselage (1) and in its diagonal department, and spout (411) run through the up end of fuselage (1), screw rod (412) are installed in the below of spout (411) and all rotate through the backup pad that sets up in fuselage (1), and the equal fixed cover of one end that screw rod (412) are close to each other is equipped with the bevel gear, fixed mounting has motor (413) in fuselage (1), the output rotation of motor (413) is installed axostylus axostyle (414), and fixed cover is equipped with the ring gear on axostylus axostyle (414), ring gear and bevel gear all mesh connection, equal slidable mounting has slider (415) in spout (411), and slider (415) all include square hole and the helicoid groove that set up, helicoid groove and screw rod (412) threaded connection, the up end of slider (415) all fixedly installs counterpoint frame (416), and the right angle clamping device's top end face (416) has the limit plate of circuit board.
3. The laser power circuit board processing and welding device according to claim 2, wherein: fixed part (42) are including deflector (421), ejector pin (422), spring (423) and leading wheel (424), just run through equal fixed mounting in square hole in spout (411) and have deflector (421), and deflector (421) all include from outer straight board, swash plate and the dull and stereotyped that set up in to, on counterpoint dish frame (416) and be close to right angle limiting plate department and all run through its slidable mounting and have ejector pin (422), and the up end of ejector pin (422) is the rubber setting, all be provided with spring (423) between the lower extreme of ejector pin (422) and counterpoint dish frame (416), lower terminal surface rotation of ejector pin (422) is installed gliding leading wheel (424) on deflector (421).
4. The laser power circuit board processing and welding device according to claim 1, wherein: the utility model provides a mechanism (5) of evacuating, including aspiration pump (501), connecting cylinder (502), double-deck section of thick bamboo (503), round rubber plate (504), spin (505), arm (506) and laser bonding tool (507), the front end of fuselage (1) is fixed with aspiration pump (501), the extraction end fixedly connected with of aspiration pump (501) runs through connecting cylinder (502) of seal shell (2), the up end center department of seal shell (2) fixedly mounted has double-deck section of thick bamboo (503), and double-deck section of thick bamboo (503) comprises inner tube and urceolus, and forms the cavity between inner tube and the urceolus, the upper end center department of double-deck section of thick bamboo (503) and place round rubber plate (504) in the cavity, and the radius of round rubber plate (504) is greater than double-deck section of thick bamboo (503) upper end, and the upper end of urceolus is close to round rubber plate (504) one side wall all is provided with the round rubber strip, on with the circumference array mode rotation install a plurality of spin (505) of be convenient for round rubber plate (504) in cavity internal gliding spin (505), seal shell (2) upper end face center department of fixing arm (506) and fixed with arm (506) and fixed end face of laser bonding tool (506).
5. The laser power circuit board processing and welding device according to claim 4, wherein: the synchronous part (61) comprises a U-shaped frame (611), a circular air pipe (612), a connecting inclined frame (613), a fixing ring (614) and bolts (615), wherein the connecting inclined frame (613) is fixedly arranged on the mechanical arm (506) and in the sealing shell (2), the U-shaped frame (611) is fixedly arranged at the lower end of the connecting inclined frame (613), the circular air pipe (612) is fixedly arranged at the upper end and the lower end of the U-shaped frame (611) and outside the laser welding head (507), the fixing ring (614) is fixedly arranged above the circular air pipe (612) through a supporting rod, and a plurality of bolts (615) for fixing the U-shaped frame (611) on the laser welding head (507) are in threaded connection with a circumferential array mode.
6. The laser power circuit board processing and welding device according to claim 5, wherein: the cooling part (62) comprises a cooler (621), an air inlet pipe (622), a pressurizing pump (623), a telescopic pipe (624), a connecting pipe (625) and spray heads (626), wherein the cooler (621) is fixedly arranged on the front end face of the machine body (1), the air inlet pipe (622) is fixedly arranged at the air inlet end of the cooler (621), the pressurizing pump (623) is fixedly arranged on the front end face of the machine body (1), the air outlet end of the cooler (621) is fixedly connected with the extraction end of the pressurizing pump (623), the telescopic pipe (624) penetrating through the sealing shell (2) is fixedly arranged at the output end of the pressurizing pump (623), the other end of the telescopic pipe (624) is fixedly arranged on the U-shaped frame (611), a plurality of spray heads (626) are fixedly arranged on one side wall, close to each other, of the upper side wall and the lower side wall of the annular pipe (612) are fixedly arranged in a circumferential array mode, the spray heads (626) are inclined towards the laser (507), the upper side and the lower side of the U-shaped frame (611) are fixedly provided with connecting pipes (625) which are communicated with the corresponding annular pipe (612), and the upper connecting pipe (625) and the lower connecting pipe (624) are fixedly arranged.
7. The laser power circuit board processing and welding device according to claim 1, wherein: the invention also provides a welding method for the specific work of the laser power supply circuit board processing welding equipment, which comprises the following steps:
s1: preparation: opening an electric sealing cover (3) and placing a circuit board to be welded at the center of the machine body (1);
s2: evacuation equipment: closing the electric sealing cover (3), and pumping out the air in the sealing shell (2) through the pumping-out mechanism (5) to ensure that the welding process is always in a vacuum state;
s3: positioning and fixing: the circuit board is aligned and lifted for a certain distance through the alignment fixing mechanism (4) and then fixed, so that the stability of the circuit board in the welding process is ensured;
s4: laser welding: welding an area to be welded on the circuit board through the evacuation mechanism (5), and synchronously cooling and protecting the circuit board up and down along with the welding position by the synchronous cooling mechanism (6), so that the welding quality is improved while the welding efficiency is ensured;
s5: and (3) subsequent treatment: and opening the electric sealing cover (3) again to take out the welded circuit board, checking the welding quality, and carrying out subsequent treatment on the welding area according to the requirement, such as cleaning, removing welding slag and carrying out surface treatment operation.
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| CN202311227997.XA CN117259973B (en) | 2023-09-22 | 2023-09-22 | Laser power supply circuit board processing and welding equipment and welding method thereof |
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| CN207402243U (en) * | 2017-11-15 | 2018-05-25 | 成都固联科技有限公司 | A kind of workpiece keeps the temperature vacuum brazing furnace |
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