CN117255837A - Silicone composition for forming release cured coating and release sheet - Google Patents
Silicone composition for forming release cured coating and release sheet Download PDFInfo
- Publication number
- CN117255837A CN117255837A CN202280030940.8A CN202280030940A CN117255837A CN 117255837 A CN117255837 A CN 117255837A CN 202280030940 A CN202280030940 A CN 202280030940A CN 117255837 A CN117255837 A CN 117255837A
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- CN
- China
- Prior art keywords
- component
- release
- cured film
- forming
- viscosity
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 80
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 31
- 238000000576 coating method Methods 0.000 title claims abstract description 14
- 239000011248 coating agent Substances 0.000 title claims abstract description 13
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 50
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 20
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 19
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 19
- 239000003054 catalyst Substances 0.000 claims abstract description 15
- 230000003197 catalytic effect Effects 0.000 claims abstract description 3
- 125000006038 hexenyl group Chemical group 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 5
- 239000002683 reaction inhibitor Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 30
- 230000001070 adhesive effect Effects 0.000 abstract description 30
- 239000000126 substance Substances 0.000 abstract description 25
- 230000008859 change Effects 0.000 abstract description 10
- -1 methylvinylsiloxane units Chemical group 0.000 description 41
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 20
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 18
- 229910052710 silicon Inorganic materials 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 229920001577 copolymer Polymers 0.000 description 15
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 14
- 238000001723 curing Methods 0.000 description 13
- 229910052697 platinum Inorganic materials 0.000 description 9
- 239000000123 paper Substances 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000005012 migration Effects 0.000 description 5
- 238000013508 migration Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- NTPLXRHDUXRPNE-UHFFFAOYSA-N 4-methoxyacetophenone Chemical compound COC1=CC=C(C(C)=O)C=C1 NTPLXRHDUXRPNE-UHFFFAOYSA-N 0.000 description 4
- 101710137710 Thioesterase 1/protease 1/lysophospholipase L1 Proteins 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 description 2
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 2
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- GNKZMNRKLCTJAY-UHFFFAOYSA-N 4'-Methylacetophenone Chemical compound CC(=O)C1=CC=C(C)C=C1 GNKZMNRKLCTJAY-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- VMFJVWPCRCAWBS-UHFFFAOYSA-N (3-methoxyphenyl)-phenylmethanone Chemical compound COC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1 VMFJVWPCRCAWBS-UHFFFAOYSA-N 0.000 description 1
- KKVBXYFFCPVJIV-UHFFFAOYSA-N (4-benzyl-4-chlorocyclohexa-1,5-dien-1-yl)-phenylmethanone Chemical compound C1C=C(C(=O)C=2C=CC=CC=2)C=CC1(Cl)CC1=CC=CC=C1 KKVBXYFFCPVJIV-UHFFFAOYSA-N 0.000 description 1
- XLYMOEINVGRTEX-ONEGZZNKSA-N (e)-4-ethoxy-4-oxobut-2-enoic acid Chemical compound CCOC(=O)\C=C\C(O)=O XLYMOEINVGRTEX-ONEGZZNKSA-N 0.000 description 1
- KNIBYEXSDVPWDA-ARJAWSKDSA-N (z)-4-(1-methoxypropan-2-yloxy)-4-oxobut-2-enoic acid Chemical compound COCC(C)OC(=O)\C=C/C(O)=O KNIBYEXSDVPWDA-ARJAWSKDSA-N 0.000 description 1
- IQBLWPLYPNOTJC-FPLPWBNLSA-N (z)-4-(2-ethylhexoxy)-4-oxobut-2-enoic acid Chemical compound CCCCC(CC)COC(=O)\C=C/C(O)=O IQBLWPLYPNOTJC-FPLPWBNLSA-N 0.000 description 1
- FDNBQVCBHKEDOJ-FPLPWBNLSA-N (z)-4-(6-methylheptoxy)-4-oxobut-2-enoic acid Chemical compound CC(C)CCCCCOC(=O)\C=C/C(O)=O FDNBQVCBHKEDOJ-FPLPWBNLSA-N 0.000 description 1
- SXPRVMIZFRCAGC-UHFFFAOYSA-N 1,2,3,4,5-pentafluoro-6-methylbenzene Chemical compound CC1=C(F)C(F)=C(F)C(F)=C1F SXPRVMIZFRCAGC-UHFFFAOYSA-N 0.000 description 1
- SJBBXFLOLUTGCW-UHFFFAOYSA-N 1,3-bis(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=CC(C(F)(F)F)=C1 SJBBXFLOLUTGCW-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- JYAQYXOVOHJRCS-UHFFFAOYSA-N 1-(3-bromophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(Br)=C1 JYAQYXOVOHJRCS-UHFFFAOYSA-N 0.000 description 1
- SKBBQSLSGRSQAJ-UHFFFAOYSA-N 1-(4-acetylphenyl)ethanone Chemical compound CC(=O)C1=CC=C(C(C)=O)C=C1 SKBBQSLSGRSQAJ-UHFFFAOYSA-N 0.000 description 1
- HDMHXSCNTJQYOS-UHFFFAOYSA-N 1-(4-prop-2-enylphenyl)ethanone Chemical compound CC(=O)C1=CC=C(CC=C)C=C1 HDMHXSCNTJQYOS-UHFFFAOYSA-N 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- DKFHWNGVMWFBJE-UHFFFAOYSA-N 1-ethynylcyclohexene Chemical compound C#CC1=CCCCC1 DKFHWNGVMWFBJE-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KLAMVBJBHNQYSB-UHFFFAOYSA-N 2-ethyl-1-phenylbutan-1-one Chemical compound CCC(CC)C(=O)C1=CC=CC=C1 KLAMVBJBHNQYSB-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- ZCTILCZSUSTVHT-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-yloxy(trimethyl)silane Chemical compound CC(C)CC(C)(C#C)O[Si](C)(C)C ZCTILCZSUSTVHT-UHFFFAOYSA-N 0.000 description 1
- HMVBQEAJQVQOTI-UHFFFAOYSA-N 3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)C=C(C)C#C HMVBQEAJQVQOTI-UHFFFAOYSA-N 0.000 description 1
- LEUJIOLEGDAICX-UHFFFAOYSA-N 3-chloroxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=C(Cl)C=C3OC2=C1 LEUJIOLEGDAICX-UHFFFAOYSA-N 0.000 description 1
- KMSYDDGPKBBSNA-UHFFFAOYSA-N 3-ethyl-1-phenylpentan-1-one Chemical compound CCC(CC)CC(=O)C1=CC=CC=C1 KMSYDDGPKBBSNA-UHFFFAOYSA-N 0.000 description 1
- KYOGSVAQRNIVQL-UHFFFAOYSA-N 3-methylhex-3-en-1-yne Chemical compound CCC=C(C)C#C KYOGSVAQRNIVQL-UHFFFAOYSA-N 0.000 description 1
- LAKYCCVWZNCNIO-UHFFFAOYSA-N 3-methylidenepent-1-yne Chemical compound CCC(=C)C#C LAKYCCVWZNCNIO-UHFFFAOYSA-N 0.000 description 1
- GRGVQLWQXHFRHO-UHFFFAOYSA-N 3-methylpent-3-en-1-yne Chemical compound CC=C(C)C#C GRGVQLWQXHFRHO-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 1
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
- XJBGJIHHXFXOFJ-UHFFFAOYSA-N 5-methyl-3-methylidenehex-1-yne Chemical compound CC(C)CC(=C)C#C XJBGJIHHXFXOFJ-UHFFFAOYSA-N 0.000 description 1
- BPMGYFSWCJZSBA-UHFFFAOYSA-N C[SiH](C)O[SiH3] Chemical compound C[SiH](C)O[SiH3] BPMGYFSWCJZSBA-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- XMSXQFUHVRWGNA-UHFFFAOYSA-N Decamethylcyclopentasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 XMSXQFUHVRWGNA-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- NRTJGTSOTDBPDE-UHFFFAOYSA-N [dimethyl(methylsilyloxy)silyl]oxy-dimethyl-trimethylsilyloxysilane Chemical compound C[SiH2]O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C NRTJGTSOTDBPDE-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- RSLWZZXJRRZAOD-UHFFFAOYSA-N but-1-en-3-yn-2-ylbenzene Chemical compound C#CC(=C)C1=CC=CC=C1 RSLWZZXJRRZAOD-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- DDJSWKLBKSLAAZ-UHFFFAOYSA-N cyclotetrasiloxane Chemical compound O1[SiH2]O[SiH2]O[SiH2]O[SiH2]1 DDJSWKLBKSLAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- IEPRKVQEAMIZSS-AATRIKPKSA-N diethyl fumarate Chemical compound CCOC(=O)\C=C\C(=O)OCC IEPRKVQEAMIZSS-AATRIKPKSA-N 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- RWGWWFFEIPJXAN-UHFFFAOYSA-N dimethyl-bis(3-methylbut-1-ynoxy)silane Chemical compound CC(C)C#CO[Si](C)(C)OC#CC(C)C RWGWWFFEIPJXAN-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-L fumarate(2-) Chemical compound [O-]C(=O)\C=C\C([O-])=O VZCYOOQTPOCHFL-OWOJBTEDSA-L 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000004687 hexahydrates Chemical class 0.000 description 1
- HTDJPCNNEPUOOQ-UHFFFAOYSA-N hexamethylcyclotrisiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O1 HTDJPCNNEPUOOQ-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N isopropyl alcohol Natural products CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002649 leather substitute Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229940074369 monoethyl fumarate Drugs 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- JNRUXZIXAXHXTN-UHFFFAOYSA-N trimethyl(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C)C JNRUXZIXAXHXTN-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a silicone composition for forming a release cured coating, comprising: (A) A chain polyorganosiloxane having a viscosity of more than 100000 mPas at 25 ℃ and having at least two alkenyl groups having 2 to 12 carbon atoms in a side chain of only a molecular chain in one molecule; (B) A chain polyorganosiloxane having a viscosity of 1000 to 100000 mPas at 25 ℃ and having at least two alkenyl groups having 2 to 12 carbon atoms in only a side chain of a molecular chain in one molecule, the alkenyl group content being 0.0018 to 0.0148 mol/100 g; (C) A polyorganosiloxane having at least two silicon-bonded hydrogen atoms in one molecule; and (D) a catalytic amount of a hydrosilylation catalyst. The composition can form a release cured film which exhibits a light release resistance to an adhesive substance, and which has a small change with time, and further suppresses a decrease in the residual adhesion rate of the adhesive substance.
Description
Technical Field
The present invention relates to a silicone composition for forming a releasable cured film and a release sheet having a releasable cured film obtained by curing the composition.
Background
The silicone composition for forming a releasable cured film is used for forming a cured film that exhibits moderate release properties for an adhesive substance. As such an organosilicon composition for forming a releasable cured film, for example, patent document 1 discloses a composition comprising an organosilicon having a viscosity of 500000 centistokes or more and containing at least 0.1 mol% of methylvinylsiloxane units and having hydroxyl groups or vinyl groups at the molecular chain ends, an organosilicon having a viscosity of 10 to 100000 centistokes or less and having vinyl groups at the molecular chain ends at 25 ℃, an organosilicon having at least three silicon atoms bonded to hydrogen atoms in one molecule, and a hydrosilylation catalyst, patent document 2 discloses a composition comprising an organosilicon having a viscosity of 50 to 10000cps in one molecule and having at least two vinyl groups in the molecular chain side chain and having a content of 0.5 to 10 mol% of at least one of them, an organosilicon having a viscosity of 100000 or more and having a content of vinyl groups less than that of the aforementioned organosilicon, an organosilicon having at least two silicon atoms bonded to hydrogen atoms in one molecule, a hydrosilylation catalyst having at least two silicon atoms bonded to hydrogen atoms in one molecule, and a hydrosilylation inhibitor having at least one silicon atom in one molecule and having a hydrosilylation catalyst having at least one silicon atom in the molecular chain of 8, and a hydrosilylation inhibitor having at least one silicon atom in the hydrosilylation catalyst.
However, the composition of patent document 1 uses a polyorganosiloxane having a viscosity of 10 to 100000 centistokes at 25 ℃ and a vinyl group at the terminal of the molecular chain, and the composition of patent document 2 uses a polyorganosiloxane having a viscosity of 50 to 10000cps at 25 ℃ and a large vinyl group content, but the following problems are all present: it is difficult to form a peel-off cured film having a light peel resistance, and the peel resistance changes with time. On the other hand, in the composition of patent document 3, since a polyorganosiloxane having no alkenyl group and no silicon atom-bonded hydrogen atom in one molecule is used, a release-curable film having a light release resistance can be formed, but there is a technical problem that the residual adhesion rate of an adhesive substance is significantly reduced.
On the other hand, patent document 4 discloses a composition comprising a 30 wt% toluene solution of a dimeric organosiloxane having a viscosity of 500 centistokes or more at 25 ℃ and having an alkenyl group having 4 to 8 carbon atoms in a side chain of a molecular chain and a terminal end of the molecular chain being blocked with a hydroxyl group, an alkenyl group, or an alkyl group, a 30 wt% toluene solution of a dimeric organosiloxane having a viscosity of 500 centistokes or more at 25 ℃ and a terminal end of the molecular chain being blocked with a hydroxyl group, an alkenyl group, or an alkyl group and having at least one alkenyl group in one molecule, a polyorganosiloxane having a viscosity of 1 to 1000 centistokes at 25 ℃ and having at least three silicon atoms in one molecule, a catalyst for hydrosilylation reaction, a hydrosilylation reaction inhibitor, and an organic solvent. However, the composition of patent document 4 has a problem in that the composition has a high viscosity, lacks coatability, and has handling workability (handleability) because two types of high molecular weight polyorganosiloxane are blended.
Further, patent document 5 discloses a composition comprising a polyorganosiloxane having a viscosity of 1.5 to 70pa·s at 25 ℃ and a molecular chain end capped with an alkenyl group in a 30 wt% toluene solution, a polyorganosiloxane having a viscosity of 0.1 to 500pa·s at 25 ℃ and an alkenyl group in a molecular chain side chain and a content of alkenyl groups 0.2 to 5 times that of the polyorganosiloxane, a polyorganosiloxane having at least three silicon-bonded hydrogen atoms in one molecule, a catalyst for hydrosilylation reaction, and an organic solvent. However, the composition of patent document 5 has a problem that although the coatability and handling workability (handleability) are improved, the problem of forming a cured film with a low peel resistance cannot be sufficiently solved.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 50-025644
Patent document 2: japanese patent laid-open No. 61-159480
Patent document 3: japanese patent laid-open No. 02-145650
Patent document 4: japanese patent laid-open No. 09-125004
Patent document 5: japanese patent application laid-open No. 2004-190202
Disclosure of Invention
Problems to be solved by the invention
The purpose of the present invention is to provide a silicone composition for forming a release cured film, which is capable of forming a release cured film that exhibits a low release resistance to an adhesive substance and that has little change over time, and further suppresses the decrease in the residual adhesion rate of the adhesive substance. Another object of the present invention is to provide a release sheet which exhibits a low release resistance to an adhesive substance and which is less susceptible to change with time, and further suppresses a decrease in the residual adhesion rate of the adhesive substance.
Solution for solving the problem
The silicone composition for forming a release cured coating of the present invention comprises:
(A) A chain polyorganosiloxane having a viscosity of more than 100000 mPas at 25 ℃ and having at least two alkenyl groups having 2 to 12 carbon atoms in a side chain of only a molecular chain in one molecule;
(B) A chain polyorganosiloxane [ (A) component/(B) component } having a viscosity of 1000 to 100000 mPas and having at least two alkenyl groups having 2 to 12 carbon atoms in only side chains of a molecular chain in one molecule, the alkenyl group content being 0.0018 to 0.0148 mol/100 g ] in a mass ratio of { (A) component/(B) component } of 10/90 to 90/10;
(C) A polyorganosiloxane having at least two silicon-bonded hydrogen atoms in one molecule { an amount of 0.5 to 5 moles of silicon-bonded hydrogen atoms in component (C) relative to 1 mole of the total of alkenyl groups in component (a) and component (B) }; and
(D) A catalytic amount of a hydrosilylation catalyst.
Preferably, in the present composition, the alkenyl group in component (a) is hexenyl.
In the present composition, the mass ratio of the component (A) to the component (B) { (component A/(component B)) is preferably 40/60 to 80/20.
Preferably, the present composition further comprises (E) a hydrosilylation reaction inhibitor.
Preferably, the present composition further comprises (F) an organic solvent.
The release sheet of the present invention is characterized by comprising a release cured film obtained by curing the silicone composition for forming a release cured film.
Effects of the invention
The silicone composition for forming a release cured coating of the present invention has the following characteristics: a releasable cured film exhibiting a light peel resistance to an adhesive substance, which is less susceptible to change over time, and which further suppresses a decrease in the residual adhesion rate of the adhesive substance, can be formed. In addition, the release sheet of the present invention has the following features: exhibits a low peel resistance to an adhesive substance, and is less susceptible to change over time, thereby further suppressing a decrease in the residual adhesion rate of the adhesive substance.
Detailed Description
< definition of terms >
The term "viscosity" as used in the present specification means a viscosity obtained by using a viscosity-controlling agent according to JIS K7117-1: 1999 "Plastic-liquid, opaque or dispersible resin-value at 25℃measured by a B-type rotational viscometer specified in Brookfield (Brookfield) method of measuring apparent viscosity of a rotational viscometer" (unit: mPas or Pa.s).
The term "plasticity" as used in the present specification means a composition according to JIS K6249: 2003 "test method for uncured and cured Silicone rubber" values (unit: mm) when a load of 1kgf was applied to 4.2g of the spherical sample for 3 minutes.
< Silicone composition for Forming Release curable film >
The silicone composition for forming a release cured film of the present invention will be described in detail.
(A) The component (C) is a chain polyorganosiloxane having at least two alkenyl groups having 2 to 12 carbon atoms in one molecule only in the side chain of the molecular chain. Examples of the alkenyl group in the component (a) include: vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, preferably hexenyl. Such alkenyl groups need to be present only in the side chains of the molecular chain and not at the ends of the molecular chain. Examples of the group bonded to a silicon atom other than the alkenyl group in the component (a) include: alkyl groups having 1 to 12 carbon atoms such as methyl, ethyl, propyl, butyl, pentyl, hexyl and heptyl; aryl groups having 6 to 12 carbon atoms such as phenyl, tolyl, xylyl, and the like; aralkyl groups having 7 to 12 carbon atoms such as benzyl and phenethyl; fluoroalkyl groups having 3 to 12 carbon atoms such as 3, 3-trifluoropropyl group, 4,4,4,3,3-pentafluorobutyl group, 5,4, 3-heptafluoropentyl group, 6,6,6,5,5,4,4,3,3-nonafluorohexyl group, 7,7,7,6,6,5,5,4,4,3,3-undecylfluoroheptyl group, and the like are preferably methyl groups. In the component (A), an alkoxy group having 1 to 3 carbon atoms such as a hydroxyl group, a methoxy group, an ethoxy group or the like may be bonded to a silicon atom in a small amount within a range that does not impair the object of the present invention.
(A) The alkenyl group content of the component (a) is not limited, and is preferably in the range of 0.0185 to 0.1110 mol/100 g, or in the range of 0.0185 to 0.0739 mol/100 g. This is because, if the content of the alkenyl group of the component (a) is not less than the lower limit of the above range, the present composition is sufficiently cured, migration of the silicone component to the adhesive substance of the obtained release cured film is suppressed, and the decrease in the residual adhesive rate of the adhesive substance can be suppressed, whereas if the content of the alkenyl group of the component (a) is not more than the upper limit of the above range, the obtained release cured film has a moderately light release resistance.
(A) The component (C) was a polyorganosiloxane having a high polymerization degree and a viscosity of more than 100000 mPas at 25 ℃, and if the polymerization degree was increased, the resultant rubber-like product had a viscosity which could not be measured by a rotational viscometer. When the component (A) is rubbery, the plasticity is preferably 3.0mm or less, or 0.5 to 3.0mm.
(A) The molecular structure of the component is substantially linear, but a part of the molecular chain may be branched. Examples of such a component (a) include: dimethylsiloxane-methylhexenyl siloxane copolymers having both molecular chain ends terminated with trimethylsiloxy groups, dimethylsiloxane-methylhexenyl siloxane copolymers having molecular chain ends substantially terminated with trimethylsiloxy groups and a portion of molecular chain ends terminated with dimethylhydroxysiloxy groups.
(B) The component (C) is a chain polyorganosiloxane having at least two alkenyl groups having 2 to 12 carbon atoms in one molecule only in the side chain of the molecular chain. The alkenyl group in the component (B) is preferably a vinyl group, and the alkenyl group is the same as that in the component (a). Such alkenyl groups need to be present only in the side chains of the molecular chain and not at the ends of the molecular chain. Examples of the group bonded to a silicon atom other than the alkenyl group in the component (B) include the same groups as those in the component (a), and methyl groups are preferable. In the component (B), an alkoxy group having 1 to 3 carbon atoms such as a hydroxyl group, a methoxy group, an ethoxy group, etc. may be bonded to a silicon atom in a small amount within a range that does not impair the object of the present invention.
(B) The viscosity of the components at 25℃is in the range from 1000 to 100000 mPas, preferably in the range from 1000 to 70000 mPas, in the range from 2000 to 50000 mPas or in the range from 3000 to 50000 mPas. This is because, if the viscosity of the component (B) is equal to or higher than the lower limit of the above range, the curability of the present composition can be improved, and if the viscosity of the component (B) is equal to or lower than the upper limit of the above range, a peelable cured film having a low peeling resistance and a small change with time can be formed.
(B) The alkenyl group content of the component (B) is in the range of 0.0018 to 0.0148 mol/100 g, preferably in the range of 0.0026 to 0.0148 mol/100 g when the viscosity is 1000 mPas or more and 10000 mPas or less, in the range of 0.0018 to 0.0111 mol/100 g when the viscosity exceeds 10000 mPas and 100000 mPas or less, or in the range of 0.0037 to 0.0148 mol/100 g when the viscosity is 1000 mPas or more and 10000 mPas or less, and in the range of 0.0018 to 0.0074 mol/100 g when the viscosity exceeds 10000 mPas or less. This is because, if the content of the alkenyl group of the component (B) is not less than the lower limit of the above range, the present composition is sufficiently cured, migration of the silicone component to the adhesive substance of the resulting release cured film is suppressed, and the decrease in the residual adhesive rate of the adhesive substance can be suppressed, whereas if the content of the alkenyl group of the component (B) is not more than the upper limit of the above range, the resulting release cured film can have a moderately light release resistance and the change with time is small.
The reason why the content of the alkenyl group varies depending on the viscosity of the component (B) is as follows. When the viscosity of the component (B) is low, the molecular weight becomes low, and therefore the number of alkenyl groups in one molecule becomes small even if the content of alkenyl groups is the same. Since the reactivity of the component (B) is low, migration of the silicone component to the adhesive substance of the release cured film is likely to occur. This is because, in order to suppress this, it is preferable to increase the alkenyl group content of the component (B). On the other hand, when the viscosity of the component (B) is high, the molecular weight becomes high, and therefore the number of alkenyl groups in one molecule becomes large even if the content of alkenyl groups is the same. Since the component (B) has high reactivity, it is rarely locally present on the surface of the release cured film. In general, unreacted silicon-bonded hydrogen atoms may remain on the surface of the release cured film, or react with moisture to generate silicon-bonded hydroxyl groups, which is considered to be the cause of the increase in the interaction between the release cured film and the adhesive substance over time. This is because, in order to suppress the residual of silicon atom-bonded hydrogen atoms on the surface of the releasable cured film, it is necessary to promote the localized presence of the component (B) on the surface of the cured film and to make the relative reactivity with the component (a) different, and therefore, when the viscosity of the component (B) is high, it is preferable to reduce the alkenyl group content of the component (B).
In the present composition, the content of the component (B) is an amount in the range of 10/90 to 90/10, preferably 30/70 to 90/10, or 40/60 to 80/20 in terms of the mass ratio of the component (A) to the component (B) { (A/(B) component). This is because, if the mass ratio of the component (a) to the component (B) { (a)/(B) is equal to or more than the lower limit of the above range, the curability of the present composition, particularly the curability at a low temperature of about 100 ℃, can be improved, and the strength of the resulting cured film can be improved, whereas if the mass ratio of the component (a) to the component (B) { (a)/(B) is equal to or less than the upper limit of the above range, a release-type cured film having a low release resistance can be formed. In the present composition, the component (B) is blended in a specific ratio with respect to the component (a), and therefore, a release cured film in which the decrease in the residual adhesive rate of the adhesive substance is suppressed can be formed with a low release resistance.
(C) The component (c) is a polyorganosiloxane having at least two silicon-bonded hydrogen atoms in one molecule, and is a crosslinking agent of the present composition. (C) The bonding position of the silicon atom to the hydrogen atom in the component is not limited, and examples thereof include a molecular chain end and/or a molecular chain side chain. Examples of the group bonded to a silicon atom other than a hydrogen atom in the component (C) include: alkyl groups having 1 to 12 carbon atoms such as methyl, ethyl, propyl, butyl, pentyl, hexyl and heptyl; aryl groups having 6 to 12 carbon atoms such as phenyl, tolyl, xylyl, and the like; aralkyl groups having 7 to 12 carbon atoms such as benzyl and phenethyl; fluoroalkyl groups having 3 to 12 carbon atoms such as 3, 3-trifluoropropyl group, 4,4,4,3,3-pentafluorobutyl group, 5,4, 3-heptafluoropentyl group, 6,6,6,5,5,4,4,3,3-nonafluorohexyl group, 7,7,7,6,6,5,5,4,4,3,3-undecylfluoroheptyl group, and the like are preferably methyl groups. In the component (C), an alkoxy group having 1 to 3 carbon atoms such as a hydroxyl group, a methoxy group, an ethoxy group, etc. may be bonded to a silicon atom in a small amount within a range that does not impair the object of the present invention.
(C) The viscosity of the component at 25℃is not limited, but is preferably in the range of 1 to 1000 mPas, or in the range of 5 to 500 mPas. This is because, if the viscosity of the component (C) is not less than the lower limit of the above range, volatilization of the component from the composition is suppressed, and the composition is stable, while if the viscosity of the component (C) is not more than the upper limit of the above range, curability of the composition is promoted.
The molecular structure of the component (C) is not limited, and examples thereof include:linear, linear with partial branching, branched, cyclic, or resinous. Examples of such a component (C) include: trimethylsiloxy-terminated dimethylsiloxane-methylhydrosiloxane copolymer at both molecular chain ends, dimethylsiloxy-terminated dimethylsiloxane-methylhydrosiloxane copolymer at both molecular chain ends, dimethylhydrosiloxy-terminated dimethylpolysiloxane at both molecular chain ends, trimethylsiloxy-terminated methylhydrosiloxane at both molecular chain ends, cyclic methylhydrosiloxane-dimethylsiloxane copolymer, and a copolymer represented by the formula: h (CH) 3 ) 2 SiO 1/2 The siloxane units represented are of the formula: siO (SiO) 4/2 A copolymer of the indicated siloxane units and having the formula: (CH) 3 ) 3 SiO 1/2 The siloxane units represented are of the formula: h (CH) 3 ) 2 SiO 1/2 The siloxane units represented are of the formula: siO (SiO) 4/2 The indicated copolymers of siloxane units.
In the present composition, the content of the component (C) is 1 mol based on the total of the alkenyl groups in the component (A) and the component (B), and the amount of the silicon atom-bonded hydrogen atom in the component (C) is in the range of 0.5 to 5 mol, preferably in the range of 0.6 to 3.0, or in the range of 0.7 to 1.5. This is because, if the content of the component (C) is not less than the lower limit of the above range, the present composition is sufficiently cured, and if the content of the component (C) is not more than the upper limit of the above range, the resulting release cured film can have a moderately light release resistance and also has little change with time.
(D) The component (c) is a hydrosilylation catalyst for promoting the hydrosilylation reaction of the present composition. Examples of such a component (D) include: platinum-based catalysts, palladium-based catalysts, and rhodium-based catalysts are preferable. The platinum-based catalyst may be exemplified by: chloroplatinic acid, chloroplatinic acid hexahydrate, platinum dichloride, alcohol-modified chloroplatinic acid, olefin complexes of platinum, carbonyl complexes of platinum, alkenylsiloxane complexes of platinum, diketone complexes of platinum. In addition, in the alkenylsiloxane complex of platinum, examples of alkenylsiloxane include: 1, 3-divinyl tetramethyl disiloxane, 1, 3-tetravinyl dimethyl disiloxane, dimethyl vinyl siloxy terminated methyl (3, 3-trifluoropropyl) siloxane oligomer.
(D) The content of the component (A) is a catalyst amount for promoting the hydrosilylation reaction of the present composition, specifically, an amount in the range of 0.1 to 1000ppm, an amount in the range of 0.1 to 500ppm, an amount in the range of 5 to 500ppm, an amount in the range of 0.1 to 300ppm, or an amount in the range of 5 to 300ppm in terms of mass unit with respect to the total amount of the components (A) to (C). This is because, if the content of the component (D) is not less than the lower limit of the above range, the curing of the present composition is promoted, whereas if the content of the component (D) is not more than the upper limit of the above range, the resulting release cured film is less likely to suffer from problems such as coloration.
In addition, the present composition may contain (E) a hydrosilylation reaction inhibitor for adjusting the curing rate. Examples of such a component (E) include: alkyne alcohols such as 2-methyl-3-butyn-2-ol, 3, 5-dimethyl-1-hexyn-3-ol, 3-methyl-1-pentyn-3-ol, 2-phenyl-3-butyn-2-ol, 1-ethynyl-1-cyclohexanol, 2-ethynyl isopropanol, and 2-ethynyl butane-2-ol; silylated alkynols such as trimethyl (3, 5-dimethyl-1-hexyne-3-yloxy) silane, dimethyl bis (3-methyl-1-butynyloxy) silane, methylvinylbis (3-methyl-1-butynyl-3-oxy) silane and [ (1, 1-dimethyl-2-propynyl) oxy ] trimethylsilane; eneyne compounds such as 2-isobutyl-1-butene-3-yne, 3, 5-dimethyl-3-hexene-1-yne, 3-methyl-3-pentene-1-yne, 3-methyl-3-hexene-1-yne, 1-ethynyl cyclohexene, 3-ethyl-3-butene-1-yne, and 3-phenyl-3-butene-1-yne; unsaturated carboxylic acid esters such as diallyl maleate, dimethyl maleate, diethyl fumarate, diallyl fumarate, bis-2-methoxy-1-methylethyl maleate, monooctyl maleate, monoisooctyl maleate, monoallyl maleate, monomethyl maleate, monoethyl fumarate, monoallyl fumarate, and 2-methoxy-1-methylethyl maleate; alkenyl siloxanes such as 1,3,5, 7-tetramethyl-1, 3,5, 7-tetravinyl cyclotetrasiloxane and 1,3,5, 7-tetramethyl-1, 3,5, 7-tetrahexenyl cyclotetrasiloxane; and benzotriazole.
The content of the component (E) in the present composition is not limited, but is preferably 5 parts by mass or less or 3 parts by mass or less based on 100 parts by mass of the total of the component (a) and the component (B), and on the other hand, the lower limit of the content of the component (E) is 0.001 parts by mass or more, 0.01 parts by mass or more or 0.1 parts by mass or more.
The present composition may contain (F) an organic solvent for improving the coatability and handling workability (handleability). Examples of such a component (F) include: aromatic hydrocarbon solvents such as toluene and xylene; aliphatic hydrocarbon solvents such as hexane, octane, isoparaffin, etc.; ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; ester solvents such as ethyl acetate and isobutyl acetate; ether solvents such as diisopropyl ether and 1, 4-dioxane; cyclic siloxanes having a degree of polymerization of 3 to 6, such as hexamethylcyclotrisiloxane, octamethyltetrasiloxane, decamethylcyclopentasiloxane, etc.; halogenated hydrocarbons such as trichloroethylene, perchloroethylene, trifluoromethylbenzene, 1, 3-bis (trifluoromethyl) benzene, and methylpentafluorobenzene. (F) The content of the component (c) is arbitrary and may be appropriately determined in order to adjust the film thickness when the composition is applied to a substrate.
Further, since the obtained releasable cured film is excellent in physical properties and releasability, it is preferable to cure the present composition by irradiation with energy rays such as ultraviolet rays and electron beams, particularly ultraviolet rays. In this case, the curing with ultraviolet rays may be performed by ultraviolet ray curing alone or by a combination of ultraviolet ray curing and heat curing. The curing time of the present composition can be appropriately adjusted depending on the curing conditions used. In order to impart good ultraviolet curability to the present composition, it is preferable to further add a photopolymerization initiator to the present composition. The photopolymerization initiator is a component imparting ultraviolet curability to the present composition, and has the following advantages: by using both heat curing and ultraviolet curing by hydrosilylation, damage to the plastic film base material having low heat resistance due to heat can be reduced, and the adhesion of the resulting release cured film to the plastic film can be improved. Furthermore, there is an advantage in that the migration of the silicone can be further reduced.
As the photopolymerization initiator, a known compound that generates a radical by irradiation with ultraviolet rays can be used, and for example, it can be appropriately selected from organic peroxides, carbonyl compounds, organic sulfur compounds, azo compounds, and the like. Specifically, examples are shown as follows: acetophenone, propiophenone, benzophenone, xanthol (xanthol), fluorene, benzaldehyde, anthraquinone, triphenylamine, 4-methylacetophenone, 3-pentylacetophenone, 4-methoxyacetophenone, 3-bromoacetophenone, 4-allylacetophenone, p-diacetylbenzene, 3-methoxybenzophenone, 4-methylbenzophenone, 4-chlorobenzophenone, 4-dimethoxybenzophenone, 4-chloro-4-benzylbenzophenone, 3-chloroxanthone, 3, 9-dichloroxanthone, 3-chloro-8-nonyloxyxanthone, benzoin methyl ether, benzoin butyl ether, bis (4-dimethylaminophenyl) ketone, benzylmethoxy ketal, 2-chlorothioxanthone, diethyl acetophenone, 1-hydroxycyclohexylphenyl ketone, 2-methyl [4- (methylthio) phenyl ] 2-morpholino-1-propanone, 2-dimethoxy-2-phenyl acetophenone. In the case of curing the present composition with ultraviolet rays, benzophenone, 4-methoxyacetophenone, 4-methylbenzophenone, diethoxyacetophenone and 1-hydroxycyclohexyl phenyl ketone are preferable, and diethoxyacetophenone and 1-hydroxycyclohexyl phenyl ketone are particularly preferable.
One kind of such photopolymerization initiator may be used alone, or two or more kinds may be used in combination. The content thereof is not particularly limited, but is preferably in the range of 0.01 to 10 parts by mass, or in the range of 0.01 to 2.5 parts by mass, relative to 100 parts by mass of the component (a). This is because, when the content of the photopolymerization initiator is within the above range, the migration of the silicone of the release cured film obtained by curing the present composition is improved, and the release cured film having excellent physical properties such as strength is obtained.
The composition may contain, as other optional components: adhesion promoters such as 3-glycidoxypropyl trimethoxysilane and 3-methacryloxypropyl trimethoxysilane; antioxidants such as phenols, quinones, amines, phosphorus, phosphoric acid esters, sulfur and sulfides; light stabilizers such as triazole-based and benzophenone-based; flame retardants such as phosphate, halogen, phosphorus, and antimony; surfactants such as cationic surfactants, anionic surfactants, and nonionic surfactants; known additives such as antistatic agents, heat-resistant agents, dyes, pigments, and the like.
The composition can be prepared by uniformly mixing the components (A) to (D), and further the component (E), the component (F), and any other components. The order of addition of the components is not limited, and in the case where the present composition is not used immediately after preparation, it is preferable to store the mixture of the component (a), the component (B) and the component (C) and the component (D) separately and mix them immediately before use. In addition, in the composition containing the component (A) to the component (D), any component (F) and other components, the crosslinking may be performed by heating without crosslinking at normal temperature by adjusting the type and content of the component (E).
< Release sheet >
Next, the release sheet of the present invention will be described in detail.
The release sheet of the present invention is characterized by comprising a release cured film obtained by curing the silicone composition for forming a release cured film. Specifically, the present release sheet is used for the following purposes: the surface of the base material has a releasable cured film, and the adhesive substance adheres to the releasable cured film, and then the adhesive substance is released with a light release resistance.
The base material of the present release sheet is not limited, and examples thereof include: polyesters such as polyethylene terephthalate and polyethylene naphthalate; polyolefins such as polypropylene and polymethylpentene; a polycarbonate; polyimide; films formed of plastics such as polyvinyl acetate; papers such as paper, cardboard, corrugated paper, cellophane, clay coated paper, polyolefin laminated paper, polyethylene laminated paper, and synthetic paper; cloth such as natural fiber cloth, synthetic fiber cloth, and artificial leather cloth; glass wool and metal foil. The film may be a single layer or may be composed of two or more layers containing plastics of the same kind or different kinds. The substrate is preferably a plastic film, particularly preferably a polyester film, further preferably a polyethylene terephthalate film, and particularly preferably a biaxially stretched polyethylene terephthalate film. The polyethylene terephthalate film is less prone to dust generation during processing, use, and the like. Therefore, the coating failure of the adhesive substance due to dust or the like on the release sheet can be effectively prevented. Further, the antistatic treatment is performed on the polyethylene terephthalate film, and the antistatic treatment is used as a base material, whereby occurrence of coating failure or the like of an adhesive substance can be prevented.
The thickness of the base material of the release sheet is not limited, and is usually in the range of 10 to 300. Mu.m, preferably 15 to 200. Mu.m, or 20 to 125. Mu.m.
The method for producing the release sheet is not limited, and examples thereof include the following methods: the composition is applied to a substrate by a known coating method such as gravure coating, bar coating, spray coating, spin coating, doctor blade coating, roll coating, or die coating, and then cured. The thickness of the releasable cured film on the substrate is not limited, but is preferably in the range of 0.01 to 3 μm, or in the range of 0.03 to 1 μm. This is because, if the thickness of the releasable cured film is equal to or greater than the lower limit of the above range, the adhesive substance is likely to be released, while if the thickness of the releasable cured film is equal to or less than the upper limit of the above range, the occurrence of blocking can be suppressed when the obtained release sheet is wound into a roll.
Examples
The silicone composition for forming a release cured film and the release sheet according to the present invention will be described in further detail with reference to examples, but the present invention is not limited to these examples. Further, the viscosity and the plasticity in examples are values at 25℃respectively, and the viscosity is used in accordance with JIS K7117-1: 1999 "plastic-liquid, opaque or dispersed resin-method for measuring apparent viscosity by means of Brookfield rotary viscometer" specified in digital display type B rotary viscometer (model VISMETRON VDA2 manufactured by Zhima systems Co., ltd.) the plasticity is determined in accordance with JIS K6249: 2003 "test method for uncured and cured Silicone rubber" values (unit: mm) when a load of 1kgf was applied to 4.2g of the spherical sample for 3 minutes.
The release sheet was produced and evaluated as follows.
< method for producing Release sheet >
The silicone composition for forming a releasable cured film was prepared by using a Meyer bar (Mayer bar) to a concentration of 0.6g/m in terms of the solid content after removal of the solvent 2 The coating was applied to the surface of a polyester film (biaxially oriented polyester film manufactured by Mitsubishi Chemical Co., ltd.) having a thickness of 38. Mu.m. After coating, the composition on the polyester film was cured by heating in a hot air circulating oven at 120 ℃ for 30 seconds. Thereafter, the mixture was allowed to stand in air at 23℃and 60% humidity for 72 hours to prepare a release sheet.
< resistance to peeling >
An adhesive tape (TESA 7475 tape) made by TESA was adhered to the surface of the release sheet produced as described above, and 20gf/cm was applied 2 Is allowed to stand in air at 23℃and a humidity of 60% for 24 hours. Thereafter, a tensile tester [ Co., ltd. A ] was used&Universal tester for D-system TENSILON]The tape was stretched at an angle of 180℃and a peeling speed of 0.3 m/min, and peeling resistance (mN/25 mm) was measured.
Further, an adhesive tape (TESA 7475 tape) made by TESA was adhered to the surface of the release sheet manufactured as described above, and 20gf/cm was applied 2 Is placed in a hot air circulation oven at 70 ℃ for 24 hours. Thereafter, the mixture was cooled to 23℃and a tensile tester [ Co., ltd., A ] was used&Universal tester for D-system TENSILON]The tape was stretched at an angle of 180℃and a peeling speed of 0.3 m/min, and peeling resistance (mN/25 mm) was measured. In tables 1 and 2, the peel resistance value when left to stand in air at 23 ℃ and 60% humidity for 24 hours, the peel resistance value when left to stand at 70 ℃ for 24 hours, and the difference between these values are shown.
< residual adhesion Rate >
The above-mentioned method is performedIs applied with 20gf/cm by adhering a tape No.31B made by Nito electric company 2 Is placed in a hot air circulation oven at 70 ℃ for 20 hours. Then, the tape was peeled off, and the peeled tape was adhered to a stainless steel plate, and 20g/cm of the adhesive tape was applied 2 Is allowed to stand in air at 23℃and a humidity of 60% for 30 minutes, and then a tensile tester [ Co., ltd., A ] is used&Universal tester for D-system TENSILON]The tape was stretched at an angle of 180 degrees at a peeling speed of 0.3 m/min, and the force (gf 1) required for peeling was measured. As a blank test, the adhesive tape was attached to a TEFLON (registered trademark) sheet in the same manner as described above, and the force (gf 2) required for peeling off the adhesive tape was measured in the same manner as described above. From these values, the residual adhesion (%) was calculated according to the following formula.
Residual adhesion (%) = (gf 1/gf 2) ×100
< examples 1 to 4, comparative examples 1 to 5>
The following components were uniformly mixed so as to have the compositions shown in tables 1 and 2, and silicone compositions for forming a release cured film were prepared. In tables 1 and 2, the content of the component (D) was such that the total amount of platinum in the component (D) relative to the components (a) to (C) was 200ppm in terms of mass unit. In tables 1 and 2, "SiH/alkenyl" represents the number of moles of silicon atom-bonded hydrogen atoms in the component (C) to 1 mole of the total of alkenyl groups in the components (a) and (B). The properties of a release sheet produced using the silicone composition for forming a release cured film thus prepared were measured, and the results are shown in tables 1 and 2.
As the component (a), the following components were used.
(a-1): a viscosity exceeding 100000 mpa.s, a plasticity of 1.15, and a dimethylsiloxane-methylhexenyl siloxane copolymer (hexenyl content=0.0296 mol/100 g) terminated at both molecular chain ends by trimethylsiloxy groups.
(a-2): a viscosity of more than 100000 mpa.s, a plasticity of 1.15, and a dimethylsiloxane-methylhexenyl siloxane copolymer (hexenyl content=0.0185 mol/100 g) terminated at both molecular chain ends by trimethylsiloxy groups.
As the component (B), the following components were used.
(b-1): dimethylsiloxane-methylvinylsiloxane copolymer having a viscosity of 5000 mpa.s and having both molecular chain ends terminated by trimethylsiloxy groups (vinyl content=0.0055 mol/100 g).
(b-2): dimethylsiloxane-methylvinylsiloxane copolymer having a viscosity of 40000 mpa.s and having both molecular chain ends terminated by trimethylsiloxy groups (content of vinyl groups=0.0055 mol/100 g).
In addition, for comparison of the component (B), the following components were used.
(b-3): dimethylsiloxane-methylvinylsiloxane copolymer having a viscosity of 35000 mpa.s and terminated at both molecular chain ends by trimethylsiloxy groups (content of vinyl groups=0.0185 mol/100 g).
(b-4): a dimethylpolysiloxane having a viscosity of 2000 mpa.s and a molecular chain terminated at both ends by dimethylvinylsiloxy groups (vinyl content=0.0085 mol/100 g).
(b-5): dimethylsiloxane-methylvinylsiloxane copolymer having a viscosity of 350 mpa.s and having both molecular chain ends terminated by trimethylsiloxy groups (vinyl content= 0.0462 mol/100 g).
(b-6): a dimethylpolysiloxane having a viscosity of 5000 mPas and having both molecular chain ends terminated by trimethylsiloxy groups.
As the component (C), the following components were used.
(c-1): methyl hydrogen polysiloxane having a viscosity of 20mpa·s and having both molecular chain ends terminated with trimethylsiloxy groups (content of silicon atom-bonded hydrogen atom=1.56 mol/100 g).
(c-2): dimethylsiloxane-methylhydrosiloxane copolymers having a viscosity of 55 mpa.s and having both molecular chain ends terminated by trimethylsiloxy groups (content of silicon atom-bonded hydrogen atoms=0.99 mol/100 g).
As the component (D), the following components were used.
(d-1): 1, 3-Divinyltetramethyldisiloxane solution of platinum 1, 3-Divinyltetramethyldisiloxane Complex (platinum content 4000 ppm).
As the component (E), the following components were used.
(e-1): 2-methyl-3-butyn-2-ol.
As the component (F), the following components were used.
(f-1): toluene.
TABLE 1
TABLE 2
/>
From the results shown in tables 1 and 2, it is found that when a polyorganosiloxane having an alkenyl group at the end of the molecular chain (comparative example 1) and a polyorganosiloxane having an alkenyl group at the end of the molecular chain (comparative example 2) are used as the component (B) and the content of alkenyl groups in terms of vinyl groups exceeds 0.0148 mol/100 g, the difference between the peeling resistance when left standing at 23 ℃ and the peeling resistance when left standing at 70 ℃ is large, and thus there is a possibility that the peeling resistance may vary with time. It is also found that when a polyorganosiloxane having a viscosity of less than 1000mpa·s is used as the component (B) (comparative example 3), the peeling resistance at 23 ℃ can be reduced, but the difference between the peeling resistance when left to stand at 23 ℃ and the peeling resistance when left to stand at 70 ℃ is large, and thus there is a possibility that the peeling resistance changes with time. It was also found that when a polyorganosiloxane having no alkenyl group was used as the component (B) (comparative example 5), the peeling resistance was reduced, but the residual adhesive ratio was significantly reduced. On the other hand, in the present invention (examples 1 to 4), the peeling resistance was small, the change in the peeling resistance with time was small, and the residual adhesive ratio was not lowered.
Industrial applicability
The silicone composition for forming a release cured film of the present invention is suitable as a release cured film-forming material for producing a release paper for use in a process of producing an optical member such as a liquid crystal panel, a plasma display, a polarizing plate, and a retardation plate, or a printed circuit board, an IC, a transistor, a capacitor, or other electrical/electronic parts, which requires a relatively light release resistance, because it has a light release resistance and little change in release resistance with time, and does not reduce the residual adhesion rate of an adhesive substance.
Claims (6)
1. A silicone composition for forming a release cured coating, comprising:
a: a chain polyorganosiloxane having a viscosity of more than 100000 mPas at 25 ℃ and having at least two alkenyl groups having 2 to 12 carbon atoms in a side chain of only a molecular chain in one molecule;
b: a chain polyorganosiloxane having a viscosity of 1000 to 100000 mPas at 25 ℃ and having at least two alkenyl groups having 2 to 12 carbon atoms in only a side chain of a molecular chain in one molecule, the alkenyl group content being 0.0018 to 0.0148 mol/100 g, wherein the mass ratio of component A to component B is 10/90 to 90/10;
c: a polyorganosiloxane having at least two silicon-bonded hydrogen atoms in one molecule, wherein the amount of the silicon-bonded hydrogen atoms in the component C is 0.5 to 5 moles relative to 1 mole of the total of the alkenyl groups in the component A and the component B; and
d: a catalytic amount of a hydrosilylation catalyst.
2. The silicone composition for forming a release cured film according to claim 1, wherein,
alkenyl in component A is hexenyl.
3. The silicone composition for forming a release cured film according to claim 1, wherein,
the mass ratio of the component A to the component B, namely the component A/component B, is 40/60-80/20.
4. The silicone composition for forming a release cured film according to claim 1, wherein,
the silicone composition for forming a release cured film further contains an E hydrosilylation reaction inhibitor.
5. The silicone composition for forming a release cured film according to claim 1, wherein,
the silicone composition for forming a releasable cured coating further contains an F organic solvent.
6. A release sheet comprising a release cured film obtained by curing the silicone composition for forming a release cured film according to any one of claims 1 to 5.
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JPS61159480A (en) * | 1984-12-29 | 1986-07-19 | Shin Etsu Chem Co Ltd | Silicone composition for release paper |
JP2915778B2 (en) * | 1994-03-23 | 1999-07-05 | 信越化学工業株式会社 | Silicone composition for release paper |
JP3945398B2 (en) * | 2002-12-13 | 2007-07-18 | 信越化学工業株式会社 | Solvent-type silicone composition for release paper |
JP5377846B2 (en) * | 2007-11-09 | 2013-12-25 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Thermosetting silicone rubber composition |
KR20220122681A (en) * | 2019-12-25 | 2022-09-02 | 다우 도레이 캄파니 리미티드 | Curable organopolysiloxane composition, release coating agent and laminate comprising same |
-
2022
- 2022-05-16 TW TW111118203A patent/TW202311446A/en unknown
- 2022-05-27 CN CN202280030940.8A patent/CN117255837A/en active Pending
- 2022-05-27 JP JP2023524237A patent/JPWO2022250125A1/ja active Pending
- 2022-05-27 WO PCT/JP2022/021671 patent/WO2022250125A1/en active Application Filing
- 2022-05-27 KR KR1020237043402A patent/KR20240013762A/en unknown
Also Published As
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TW202311446A (en) | 2023-03-16 |
WO2022250125A1 (en) | 2022-12-01 |
JPWO2022250125A1 (en) | 2022-12-01 |
KR20240013762A (en) | 2024-01-30 |
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