CN117255536A - Cooling component, cooling system and control method - Google Patents

Abstract

The application discloses cooling components and parts can be used to finance field, and cooling components and parts laminating is on the CPU of server, include: the cold plate is attached to the outer surface of the CPU, and a refrigerant inlet and a refrigerant outlet are respectively arranged on two sides of the cold plate; the atomizing nozzle is arranged at the refrigerant inlet; wherein, be provided with a plurality of fin groups in the cold plate, every fin group includes two fin, and two fin are close to each other gradually from the refrigerant entry to the refrigerant outlet. According to the cooling component, through set up the fin group in the cold plate and can increase heat radiating area, atomize refrigerant through atomizer, can make full use of evaporation heat absorption is greater than the unidirectional heat absorption of liquid's principle, increase total heat absorption to the fin is from the refrigerant entry to the arrangement that the refrigerant export is close to each other gradually, and resistance when can reduce gas flow accelerates gas discharge, prevents that gas from stagnating in the cold plate.

Description

Cooling component, cooling system and control method

Technical Field

The application relates to the technical field of servers, and can be used in the financial field, in particular to a cooling component, a cooling system and a control method.

Background

Because data center consumption is bigger and bigger, in order to realize the green energy-conserving demand of data center, reduce data center operation cost, data center begins to adopt the liquid cooling technique gradually to refrigerate for the server, the liquid cooling technique is mainly divided into cold plate type liquid cooling and immersion liquid cooling at present, to cold plate type liquid cooling, through the heat dissipation cold plate of deployment on server CPU, utilize non-conductive water or fluoride liquid to take away the heat that CPU released, this kind of mode takes away the limited server that is only applicable to less power of heat, the server of more power needs to adopt the immersion liquid cooling, and immersion liquid cooling investment cost is higher, and have certain requirement to the bearing of rack.

Disclosure of Invention

The present application aims to solve at least one of the technical problems existing in the prior art.

Therefore, a first object of the present application is to provide a cooling device, which maximizes the heat absorption capacity of the refrigerant by utilizing the principle that the amount of latent heat of vaporization absorbed by the evaporation heat absorption of the refrigerant is much larger than the amount of heat development absorbed by the single-phase heat absorption of the refrigerant;

the second object of the present application is to provide a cooling system for a server, which includes the above cooling component, fully utilizes resources, maximally improves the refrigerating capacity, and can also reduce the running cost of the cooling system.

A third object of the present application is to provide a control method for a cooling system of a server, which performs intelligent regulation control on the cooling system.

According to the cooling component in the embodiment of the application, the cooling component is attached to the CPU of the server, and comprises: the cold plate is attached to the outer surface of the CPU, and a refrigerant inlet and a refrigerant outlet are respectively arranged on two sides of the cold plate; the atomizing nozzle is arranged at the refrigerant inlet; the cooling plate is internally provided with a plurality of cooling fin groups, each cooling fin group comprises two cooling fins, and the two cooling fins gradually approach each other from the refrigerant inlet to the refrigerant outlet.

According to the cooling component, through set up the fin group in the cold plate and can increase heat radiating area, atomize refrigerant through atomizer, can make full use of evaporation heat absorption is greater than the unidirectional heat absorption of liquid's principle, increase total heat absorption to the fin is from the refrigerant entry to the arrangement that the refrigerant export is close to each other gradually, and resistance when can reduce gas flow accelerates gas discharge, prevents that gas from stagnating in the cold plate.

Further, the refrigerant inlet and the refrigerant outlet are opposite to each other and are arranged on the central axis of the cold plate in the length direction, and two cooling fins in each cooling fin group are symmetrically arranged on the central axis.

Further, the heat sink is fixed to an inner surface of the side of the cold plate close to the CPU.

Further, the width of the cooling fin is less than one half of the thickness of the cold plate.

Further, the heat sink is gradually inclined from the bottom to the top toward the central axis or away from the central axis.

According to the cooling system for a server in an embodiment of the present application, a cabinet of the server is placed on a floor, and a plurality of CPUs are arranged up and down in the cabinet, including: the wind circulation refrigeration unit, wind circulation refrigeration unit sets up in the rack is located the top of rack or the bottom of rack includes: the refrigerating fan is arranged between the cabinet cold channel and the cabinet hot channel and is used for sucking air in the cabinet hot channel; the cooling coil is arranged between the cabinet cold channel and the cabinet hot channel, is filled with cooling liquid, is connected with the water pump through a first pipeline and is used for cooling air in the cabinet hot channel; the gas-liquid circulation refrigerating unit, the gas-liquid circulation refrigerating unit sets up in the rack or the outer floor below of rack includes: the cooling component is attached to the CPU of the server; the cooling device comprises a liquid storage tank, a refrigerant pump, a gas-liquid heat exchange device and a refrigerant fan which are sequentially connected through a second pipeline, wherein the liquid storage tank, the refrigerant pump, the gas-liquid heat exchange device and the refrigerant fan are arranged in a cabinet or below a floor outside the cabinet, the refrigerant fan is communicated with a refrigerant outlet of a cooling component through the second pipeline, and the liquid storage tank is communicated with a refrigerant inlet of the cooling component through the second pipeline.

Further, the air circulation refrigerating unit further comprises a blind plate, and the blind plate is arranged between two adjacent CPUs.

Further, a partition plate is further arranged in the cabinet, and the partition plate is arranged at the bottom of the cabinet so as to separate the air circulation refrigerating unit from the gas-liquid circulation refrigerating unit.

Further, the refrigeration fan is arranged next to the refrigeration coil.

Further, the refrigeration coil is disposed on a downstream side of the refrigeration fan.

Further, the method further comprises the following steps: and the controller is electrically connected with the air circulation refrigeration unit and the gas-liquid circulation refrigeration unit.

According to the control method for the cooling system of the server in the embodiment of the application, the method comprises the following steps:

acquiring the current power and the current temperature of a server;

predicting future temperature according to the current power, and adjusting the opening of a cold water inlet valve of the refrigeration coil according to the predicted future temperature; and

and adjusting the rotating speed of the fan according to the current temperature.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

Other objects and advantages of the present disclosure will become apparent from the following description of the present disclosure with reference to the accompanying drawings, and may assist in a comprehensive understanding of the present disclosure.

FIG. 1 is an internal block diagram of a cooling component according to an embodiment of the present application;

FIG. 2 is a cross-sectional view of a CPU mated with a cooling component in accordance with an embodiment of the present application;

FIG. 3 is a schematic diagram of airflow direction when the air circulation refrigeration unit is at the top of the cabinet according to an embodiment of the present application;

fig. 4 is a schematic diagram of airflow direction when the air circulation refrigeration unit is located at the bottom of the cabinet according to an embodiment of the present application.

It is noted that the dimensions of structures or regions may be exaggerated or reduced in the drawings for describing embodiments of the present disclosure for clarity, i.e., the drawings are not drawn to actual scale.

Reference numerals:

cooling element 100, refrigerant inlet 101, refrigerant outlet 102, cold plate 110, atomizer 120, heat sink 130,

CPU 200，

cabinet 300, cabinet cold aisle 301, cabinet hot aisle 302, blind flange 310, baffle 320,

the refrigeration fan 410, refrigeration coil 420, first conduit 430, water pump 440,

a liquid storage tank 510, a refrigerant pump 520, a gas-liquid heat exchange device 530, a refrigerant fan 540 and a second pipeline 550.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.

Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items.

In this document, unless specifically stated otherwise, directional terms such as "upper," "lower," "left," "right," "inner," "outer," and the like are used to denote orientations or positional relationships shown based on the drawings, and are merely used to facilitate the description of the present disclosure, rather than to indicate or imply that the devices, elements, or components referred to must have a particular orientation, be configured or operated in a particular orientation. It should be understood that when the absolute positions of the described objects are changed, the relative positional relationship they represent may also be changed accordingly. Accordingly, these directional terms should not be construed to limit the present disclosure.

Because data center consumption is bigger and bigger, in order to realize the green energy-conserving demand of data center, reduce data center operation cost, data center begins to adopt the liquid cooling technique gradually to refrigerate for the server, the liquid cooling technique is mainly divided into cold plate type liquid cooling and immersion liquid cooling at present, to cold plate type liquid cooling, through the heat dissipation cold plate of deployment on server CPU, utilize non-conductive water or fluoridize liquid to take away the heat that CPU released, this kind of mode takes away the limited server that is only applicable to less power, for example 15 kW's server, and more than 15kW belongs to the server of higher power, the server of higher power needs to adopt immersion liquid cooling, and immersion liquid cooling investment cost is higher, and have certain requirement to the bearing of rack.

Currently, PUE (Power Usage Effectiveness) value is generally adopted as an evaluation index when evaluating the energy efficiency of a data center, and the PUE is the ratio of all energy consumed by the data center to the energy consumed by an IT load.

The application provides a cooling component and a cooling system with the cooling component, which utilize the principle that the vaporization latent heat quantity absorbed by the evaporation heat absorption of a refrigerant is far greater than the heat development quantity absorbed by the single-phase heat absorption of the refrigerant, and maximally realize the heat absorption capacity of the refrigerant; the cooling system can fully utilize the existing cabinet without special design or reinforcement, thereby increasing the availability and reducing the construction cost.

A cooling component 100 according to an embodiment of the present application is described below with reference to fig. 1-2. It should be noted that the present application is an improvement of a cooling system of a data center server in a bank, and may be used in the financial field, and may also be used in a machine with a cooling system in other technical fields, and the present application does not limit the technical fields.

According to the cooling component 100 in the embodiment of the application, the cooling component 100 is attached to the CPU 200 of the server, and includes: a cold plate 110, the cold plate 110 is attached to the outer surface of the CPU 200, and both sides of the cold plate 110 are respectively provided with a refrigerant inlet 101 and a refrigerant outlet 102; an atomizer 120, the atomizer 120 being disposed at the refrigerant inlet 101. A plurality of fin groups are provided in the cold plate 110, each fin group including two fins 130, the two fins 130 gradually approaching each other from the refrigerant inlet 101 toward the refrigerant outlet 102.

The cold plate 110 can cool the surface of the CPU 200 by heat transfer, and the atomizer 120 atomizes the refrigerant liquid, i.e. the refrigerant entering the cold plate 110 is atomized and not liquid. The atomized refrigerant, after encountering the heat sink 130 during the floating process, adheres to the surface of the heat sink 130 in the form of droplets, evaporates after absorbing the heat of the CPU 200, and flows out of the refrigerant outlet 102 in the form of gas.

Two openings are defined in each fin group, the opening towards the refrigerant inlet 101 is larger, the opening towards the refrigerant outlet 102 is smaller, the larger opening is easier for atomized refrigerant to adhere to the fins 130, and then the smaller opening is beneficial to outflow of gas, namely, the arrangement of the inclined refrigerant outlet 102 can realize the fastest discharge of gas, and reduce resistance and gas retention.

According to the cooling component 100 of the application, the heat dissipation area can be increased by arranging the heat dissipation fin group in the cold plate 110, the refrigerant is atomized by the atomization nozzle 120, the principle that the evaporation heat absorption capacity is larger than the unidirectional liquid heat absorption capacity can be fully utilized, the total heat absorption capacity is increased, the heat dissipation fins 130 are gradually arranged from the refrigerant inlet 101 to the refrigerant outlet 102 in a mutually approaching way, the resistance in the process of gas flow can be reduced, the gas discharge is accelerated, and the gas stagnation in the cold plate 110 is prevented.

According to one embodiment of the present application, the refrigerant inlet 101 and the refrigerant outlet 102 are opposite to each other and open on the central axis of the cold plate 110 in the length direction, and the two fins 130 in each fin group are symmetrically arranged on the central axis.

The refrigerant inlet 101 and the refrigerant outlet 102 are opposite to facilitate the flow of the air flow, and the heat dissipation rate can be increased. The heat sinks 130 are symmetrically arranged with the central axis as a symmetry axis, as shown in fig. 1, the heat sink group is splayed, the refrigerant inlet 101 is the position of the heat sinks 130 in the heat sink group, which is farthest from each other, the refrigerant outlet 102 is the position of the heat sinks 130 in the heat sink group, which is closest to each other, and the middle gaps of the two heat sinks 130 in each heat sink group are opposite to the refrigerant inlet 101 and the refrigerant outlet 102, so that a passage through which air flows can be formed, and the flow of the air flow is facilitated.

According to one embodiment of the present application, the heat sink 130 is fixed to the inner surface of the side of the cold plate 110 near the CPU 200. The heat sink 130 is disposed close to the CPU 200, so that heat transfer from the CPU 200 to the heat sink 130 can be accelerated, that is, heat transfer from the CPU 200 to air emitted from the heat sink 130 through the cold plate 110 can be accelerated, and heat transfer from solid heat transferred from the CPU 200 to the heat sink 130 directly through the cold plate 110 can be accelerated, and efficiency is higher.

According to one embodiment of the present application, the width of the heat sink 130 is less than one-half the thickness of the cold plate 110.

Referring to fig. 2, the refrigerant inlet 101 and the refrigerant outlet 102 are on the central axis of the cold plate 110, that is, at one half of the height of the cold plate 110, and the width distance of the fin 130 from the bottom upward is less than one half of the height of the cold plate 110 in the sectional view of the present embodiment. In this way, in the facing direction of the refrigerant inlet 101 and the refrigerant outlet 102, the air flow can flow rapidly without the obstruction of the heat sink 130, so that the air can flow in and out rapidly.

According to one embodiment of the present application, the heat sink 130 is gradually inclined toward the central axis or away from the central axis from the bottom toward the top. That is, the heat sink 130 is inclined from the side close to the CPU 200 to the side far from the CPU 200, and may be gradually inclined toward the central axis, or may be inclined away from the central axis, so that when the relative height of the heat sink 130 to the cold sink is unchanged, the inclination may increase the width of the heat sink 130, that is, the area of the heat sink 130 may be increased with the same length of the heat sink 130, and the amount of heat dissipation of the CPU 200 may be increased due to the liquid adhering to the heat sink 130.

According to the cooling component 100, a set of dual-drive cooling system is provided for cooling the servers, as shown in fig. 3 and 4, the inside of the cabinet 300 is subjected to modularized design, and the cooling component is applicable to servers with various powers, wherein one cooling unit is an air circulation cooling unit, the other cooling unit is a gas-liquid circulation cooling unit, and the two cooling units are not crossed with each other, can be used independently, and can also be used simultaneously.

For cooling the inside of the server cabinet 300, the air circulation cooling unit performs heat exchange by air and cooling for heat sources other than the CPU 200 or parts or substances carrying heat in the cabinet 300. For example, when the gas-liquid circulation refrigeration unit is located in the cabinet 300, the liquid storage tank 510, the refrigerant pump 520, the gas-liquid heat exchange device 530, the refrigerant fan 540, and the like of the gas-liquid circulation refrigeration unit must be used as a heat source to generate a certain amount of heat, and the heat dissipates into hot air, and the air circulation refrigeration unit dissipates the heat; for another example, the main heating elements on the main board are a CPU, a GPU and the like, the heating power of the main board accounts for 60% -70% of the total heating power, and other heating elements on the main board account for 30% -40% of the total heating power. The gas-liquid circulation refrigeration unit is used for radiating heat generated by the CPU 200 in the cabinet 300 by attaching the cooling component 100 to the CPU 200 of the server and adopting the principle of two changes of gas and liquid.

Specifically, in the cooling system for a server according to the embodiment of the present application, a cabinet 300 with a server placed on a floor is provided, and a plurality of CPUs 200 are arranged up and down in the cabinet 300, including: the air circulation refrigerating unit and the gas-liquid circulation refrigerating unit are arranged in the cabinet 300, and are positioned at the top of the cabinet 300 or at the bottom of the cabinet 300; the gas-liquid circulation refrigeration unit is disposed under the floor inside the cabinet 300 or outside the cabinet 300.

It can be understood that the air circulation refrigeration unit and the gas-liquid circulation refrigeration unit are subjected to modularized treatment, the number can be increased or decreased as required, and the installation position can be changed, namely, the modularized distributed refrigeration deployment mode can be used for increasing the refrigeration modules and changing the arrangement positions as required, so that the air circulation refrigeration unit and the gas-liquid circulation refrigeration unit are flexibly expanded, and the defect of inconvenience in expanding a centralized refrigeration system in the prior art is overcome.

The air-circulation refrigerating unit includes: a refrigeration fan 410 and a refrigeration coil 420, the refrigeration fan 410 being disposed between the cabinet cold aisle 301 and the cabinet hot aisle 302 for drawing air into the cabinet hot aisle 302. A refrigeration coil 420 is disposed between the cabinet cold aisle 301 and the cabinet hot aisle 302, the refrigeration coil 420 containing a cooling fluid coupled to a water pump 440 via a first conduit 430 for cooling air within the cabinet hot aisle 302.

The cabinet 300 is fully enclosed, and the cooling fan 410 and the cooling coil 420 are arranged in the cabinet 300 to separate the cabinet and form a cabinet cold channel 301 on one side and a cabinet hot channel 302 on the other side. It will be appreciated that, while the air in the cabinet hot aisle 302 is sucked by the cooling fan 410, since a portion of the air in the closed environment (the air in the cabinet hot aisle 302) flows, the air in the cabinet cold aisle 301 also flows automatically to complement the air in the hot aisle, so as to form a wind cycle, and then the cooling air is output into the cabinet cold aisle 301 after the cooling liquid of the cooling coil 420 exchanges heat through the heat exchange process of the cooling coil 420.

The gas-liquid circulation refrigeration unit includes: the cooling component 100 and the liquid storage tank 510, the refrigerant pump 520, the gas-liquid heat exchange device 530 and the refrigerant fan 540 which are sequentially connected through the second pipeline 550, wherein the cooling component 100 is attached to the CPU 200 of the server, the liquid storage tank 510, the refrigerant pump 520, the gas-liquid heat exchange device 530 and the refrigerant fan 540 are arranged in the cabinet 300 or below the floor outside the cabinet 300, the refrigerant fan 540 is communicated with the refrigerant outlet 102 of the cooling component 100 through the second pipeline 550, and the liquid storage tank 510 is communicated with the refrigerant inlet 101 of the cooling component 100 through the second pipeline 550.

The refrigerant pump 520 sends the low-temperature liquid refrigerant in the liquid storage tank 510 to the refrigerant inlet 101 of the cooling component 100 through the second pipeline 550, the CPU 200 in the server is cooled by the cooling component 100, the atomized refrigerant adheres to the surface of the cooling fin 130 to absorb the heat of the CPU 200 and becomes gas, the gas is sent to the gas-liquid heat exchange device 530 through the refrigerant fan 540, the liquid refrigerant is cooled and becomes liquid, and the liquid refrigerant enters the liquid storage tank 510, and then the next circulation is performed through the refrigerant pump 520.

Referring to fig. 3 and 4, schematic diagrams of two embodiments in which both the gas-liquid circulation refrigeration unit is disposed at the bottom of the cabinet 300 and the air circulation refrigeration unit is disposed at the top of the cabinet 300 in fig. 3 and at the bottom of the cabinet 300 in fig. 4 are shown.

In fig. 3, since the water pump 440 is disposed at the bottom of the cabinet 300 and the cooling coil 420 connected to the water pump 440 is disposed at the top of the cabinet 300 with a long distance, the water pump 440 needs to consume a relatively high amount of energy and generate a relatively high water pressure to send the cooling liquid into the cooling coil 420, and in this embodiment, since the cooling coil 420 is disposed at the top of the cabinet 300 and below the cooling coil 420 is the CPU 200 of the server, if the first pipe 430 or the cooling coil 420 bursts or leaks, the server will be affected. However, in the embodiment, referring to the air circulation flow direction in fig. 3, the cold air passing through the refrigeration coil 420 and the refrigeration fan 410 will flow downward along the cabinet cold channel 301, and the heated hot air will flow upward along the cabinet hot channel 302, which makes full use of the natural phenomena of natural upward hot air flow and natural downward cold air flow, so as to reduce the energy consumption of the refrigeration fan 410.

In fig. 4, the water pump 440 and the cooling coil 420 connected to the water pump 440 of the present embodiment are disposed at the bottom of the cabinet 300, so that the first pipe 430 or the cooling coil 420 will not affect the server when burst or leak water, and the energy consumption of the water pump 440 can be reduced due to the closer distance between the water pump 440 and the cooling coil 420, i.e. the disadvantage of the previous embodiment is solved. However, in the present embodiment, referring to the air circulation flow direction in fig. 4, the cold air passing through the cooling coil 420 and the cooling fan 410 flows upward along the cabinet cold aisle 301, and the heated hot air flows downward along the cabinet hot aisle 302, so that the energy consumption of the cooling fan 410 of the present embodiment is increased compared to the previous embodiment due to the contrary to the natural phenomena of the natural upward hot air flow and the natural downward cold air flow.

According to one embodiment of the present application, the air circulation cooling unit further includes a blind plate 310, and the blind plate 310 is disposed between two adjacent CPUs 200.

The CPUs 200 are disposed in the totally enclosed cabinet 300, and referring to fig. 3 and 4, a row of the CPUs 200 are shown arranged up and down, and a blind plate 310 is disposed between the upper and lower adjacent CPUs 200, the blind plate 310 being for separating hot air from cold air to prevent the air from flowing between the adjacent two CPUs 200, and mixing the cold and hot air.

It will be appreciated that the cabinet cold aisle 301 and the cabinet hot aisle 302 are in communication, only with the cooling fan 410 and the cooling coil 420 being separated, the air not passing through the CPU 200 is considered to be cold air in the cabinet cold aisle 301 at the downstream side of the cooling coil 420, and is considered to be hot air in the cabinet hot aisle 302 at the upstream side of the cooling coil 420 after passing through the CPU 200, and the communication position between the cabinet cold aisle 301 and the cabinet hot aisle 302 varies according to the position of the cooling coil 420 in the cabinet 300. For example, the refrigeration coil 420 in fig. 3 is disposed at the top of the cabinet 300, and then the cabinet cold aisle 301 communicates with the cabinet hot aisle 302 at the bottom of the cabinet 300; the refrigeration coil 420 in fig. 4 is disposed at the bottom of the cabinet 300, and then the cabinet cold aisle 301 communicates with the cabinet hot aisle 302 at the top of the cabinet 300.

In accordance with one embodiment of the present application, a partition 320 is further provided in the cabinet 300, and the partition 320 is provided at the bottom of the cabinet 300 to separate the air circulation cooling unit from the gas-liquid circulation cooling unit.

In order to enhance the exchange of the cold and hot air, a partition 320 is provided at the bottom of the cabinet 300, the partition 320 is provided with a part which is irrelevant to the circulation of air and the refrigeration of air on one side, and the CPU 200 is not arranged on one side of the partition 320 because the circulation of air and the refrigeration of air are irrelevant; while the parts related to the ventilation and the cooling of the air are provided on the other side, the other side of the partition 320 is provided with the CPU 200.

Referring to fig. 3 and 4, by distinguishing the specific actions in the above description, the partition 320 sets the liquid storage tank 510, the refrigerant pump 520, the gas-liquid heat exchange device 530, the refrigerant fan 540 and the water pump 440 on one side of the partition 320, and sets the refrigeration fan 410 and the refrigeration coil 420 on the other side of the partition 320, so after setting, only the refrigeration fan 410 and the refrigeration coil 420 are provided in the cabinet cold channel 301 and the cabinet hot channel 302, the refrigeration fan 410 sucks the air in the cabinet hot channel 302, and cools the air in the cabinet hot channel 302 through the refrigeration coil 420, which is beneficial to the flow of the air, and reduces the flow resistance of the air caused by other unnecessary components.

According to one embodiment of the present application, the refrigeration fan 410 and the refrigeration coil 420 are disposed immediately adjacent.

It will be appreciated that in this embodiment, the cooling fan 410 and the cooling coil 420 may be disposed next to each other, where the cooling fan 410 acts on the hot air in the cabinet heat channel 302, and has a strong suction force on the hot air in the cabinet heat channel 302, and the air surrounding the cooling fan 410 will necessarily flow at a relatively fast speed relative to other locations, so that the cooling coil 420 is disposed next to the cooling fan 410 to facilitate heat exchange of the air.

According to one embodiment of the present application, a refrigeration coil 420 is disposed on the downstream side of the refrigeration unit 410.

The cooling fan 410 incorporates a motor, which is also one of the heat sources other than the CPU 200. The refrigeration coil 420 is disposed at the downstream side of the refrigeration fan 410 so that heat generated by the refrigeration fan 410 can be cooled in time, and cold air passing through the refrigeration coil 420 can act on other heat sources at more distant locations.

According to one embodiment of the present application, the cooling system further comprises: and the controller is electrically connected with the air circulation refrigeration unit and the gas-liquid circulation refrigeration unit.

The cooling system of the present application may be an automatically controlled cooling system, and may be specifically referred to the following control method of the air circulation refrigeration unit in the cooling system according to the temperature of the server in the cabinet 300 and the power of the server.

It should be noted that, the controller may not only act on the air circulation refrigeration unit, but also act on the gas-liquid circulation refrigeration unit, and the controller controls the water output of the refrigerant pump 520, the heat exchange speed of the gas-liquid heat exchange device 530, and the rotation speed of the refrigerant fan 540 in the gas-liquid circulation refrigeration unit according to the temperature of the server in the cabinet 300 and the power of the server, so as to adjust the refrigeration capacity of the CPU 200.

According to the cooling system, the application also discloses a control method of the stroke cycle refrigeration unit in the cooling system, which specifically comprises the following steps:

in step S110, the current power and the current temperature of the server are acquired.

It will be appreciated that the temperature within the cabinet of the server is obtained by locating a temperature sensor within the cabinet and the current power of the server is obtained by locating a power meter within the cabinet.

In step S120, a future temperature is predicted based on the current power, and the opening of the cold water inlet valve of the refrigeration coil is adjusted based on the predicted future temperature.

The current power may reflect temperature changes in future cabinets. For example, when the current power is high, the temperature in the power cabinet is expected to gradually rise according to the power; at lower current power, the temperature within the cabinet is expected to drop gradually as a function of this power. Of course, the temperature rise or fall is determined by comparing the power of the previous time period, that is, the current power is higher than the power of the previous time period, the temperature rise is necessarily caused if the power is higher, and the temperature fall is necessarily caused if the power is lower.

It will be appreciated that the heat is derived from the time multiplied by the power in the heat equation, i.e. in the case of a time period determination, the power and heat are positively correlated, and the power increase, i.e. the heat, is increased and the power decrease, i.e. the heat, is decreased. The opening of the water inlet valve is positively correlated with the flow rate of the refrigerant, and the opening of the water valve is adjusted so that the flow rate of cold water of the refrigeration coil is increased or decreased. Therefore, when the future heat quantity is predicted to be increased, the opening degree of the cold water inlet valve of the refrigeration coil pipe is adjusted to increase the cold water flow rate, and when the future heat quantity is predicted to be reduced, the opening degree of the cold water inlet valve of the refrigeration coil pipe is adjusted to decrease the cold water flow rate.

In step S130, the fan speed is adjusted according to the current temperature.

After the adjustment in step S120, the current temperature still exceeds the set temperature range and does not meet the safety requirement, and the air flow speed in the hot channel and the cold channel of the cabinet can be accelerated by adjusting the rotation speed of the fan, so as to accelerate the cooling in the cabinet.

As can be seen from the above steps, step S120 is a temperature control process performed in advance after predicting the future temperature, and step S130 is a temperature control process performed on the current temperature. The energy consumption of the air circulation refrigerating unit in the refrigerating system is coordinated through the cooperative adjustment of the two steps on the temperature, so that the requirement of the PUE of the data center is met, and the energy consumption and the investment running cost of the refrigerating system are reduced.

In the description of the present specification, a description referring to the terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although a few embodiments of the present general inventive concept have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the claims and their equivalents.

Claims (12)

1. A cooling component attached to a CPU of a server, comprising:

the cold plate is attached to the outer surface of the CPU, and a refrigerant inlet and a refrigerant outlet are respectively arranged on two sides of the cold plate;

the atomizing nozzle is arranged at the refrigerant inlet;

the cooling plate is internally provided with a plurality of cooling fin groups, each cooling fin group comprises two cooling fins, and the two cooling fins gradually approach each other from the refrigerant inlet to the refrigerant outlet.

2. The cooling component according to claim 1, wherein the refrigerant inlet and the refrigerant outlet are opposite to each other and open on a central axis of the cold plate in a longitudinal direction, and two fins in each fin group are symmetrically arranged with respect to the central axis.

3. The cooling component of claim 2, wherein the heat sink is secured to an inner surface of the cold plate on a side adjacent the CPU.

4. A cooling element according to claim 3, wherein the width of the heat sink is less than one half the thickness of the cold plate.

5. The cooling component of claim 4, wherein the fins taper from bottom to top toward or away from the central axis.

6. A cooling system for a server, a cabinet on which the server is placed on a floor, a plurality of CPUs arranged up and down in the cabinet, comprising:

the wind circulation refrigeration unit, wind circulation refrigeration unit sets up in the rack is located the top of rack or the bottom of rack includes:

the refrigerating fan is arranged between the cabinet cold channel and the cabinet hot channel and is used for sucking air in the cabinet hot channel;

the cooling coil is arranged between the cabinet cold channel and the cabinet hot channel, is filled with cooling liquid, is connected with the water pump through a first pipeline and is used for cooling air in the cabinet hot channel;

the gas-liquid circulation refrigerating unit, the gas-liquid circulation refrigerating unit sets up in the rack or the outer floor below of rack includes:

the cooling component of any one of claims 1-5 attached to the CPU;

the liquid storage tank, the refrigerant pump, the gas-liquid heat exchange device and the refrigerant fan are sequentially connected through a second pipeline, the liquid storage tank, the refrigerant pump, the gas-liquid heat exchange device and the refrigerant fan are arranged below the floor inside or outside the cabinet,

the cooling medium fan is communicated with a cooling medium outlet of the cooling component through the second pipeline, and the liquid storage tank is communicated with a cooling medium inlet of the cooling component through the second pipeline.

7. The cooling system of claim 6, wherein the air circulation refrigeration unit further comprises a blind plate disposed between two adjacent CPUs.

8. The cooling system of claim 6, wherein a baffle is further disposed within the cabinet,

the partition plate is arranged at the bottom of the cabinet to separate the air circulation refrigerating unit from the gas-liquid circulation refrigerating unit.

9. The cooling system of claim 6, wherein the refrigeration fan is disposed immediately adjacent to the refrigeration coil.

10. The cooling system of claim 9, wherein the refrigeration coil is disposed on a downstream side of the refrigeration fan.

11. The cooling system of claim 6, further comprising: and the controller is electrically connected with the air circulation refrigeration unit and the gas-liquid circulation refrigeration unit.

12. A control method for a cooling system of a server, comprising the steps of:

acquiring the current power and the current temperature of a server;

predicting future temperature according to the current power, and adjusting the opening of a cold water inlet valve of the refrigeration coil according to the predicted future temperature; and

and adjusting the rotating speed of the fan according to the current temperature.