CN117251034A - Server module and spraying control method - Google Patents

Abstract

The invention relates to a server module and a spray control method, wherein the server module comprises: a circuit board; the heating modules are arranged on the circuit board; the cooling module comprises a plurality of spraying units, wherein the spraying units are in one-to-one correspondence with the heating modules, each spraying unit is used for spraying cooling liquid to the corresponding heating module, and each spraying unit is used for providing the cooling liquid in a mode that the corresponding heating module and the circuit board form a liquid film. According to the invention, cooling liquid with different flow rates can be distributed to the corresponding spraying units according to the heating condition of the heating module, so that excessive cooling liquid is prevented from participating in heat exchange, and a thin cooling liquid film is formed on the surfaces of the heating module and the circuit board in the heat exchange process, so that the thermal resistance can be reduced, and the heat exchange efficiency can be improved. And the momentum of the cooling liquid sprayed on the surface of the heating module and gravity are combined to accelerate the flow of the liquid film, so that the cooling liquid after absorbing heat can be quickly separated from the surface of the heating module, and the heat exchange effect is improved.

Description

Server module and spraying control method

Technical Field

The invention relates to the technical field of servers, in particular to a server module and a spraying control method.

Background

The artificial intelligence, cloud computing and big data are all labels of the new age of human society, the server is used as an important component part of the industry, the integration level and the processing capacity of the server are gradually improved, more energy consumption is required for the strong development of the server, and the heat dissipation problem of electronic devices in the server becomes a technical problem to be solved in the industry. In the related art, the heat dissipation modes of the server include air cooling type, cold plate type, spray type, immersion type and the like, the immersion type heat dissipation fluorinated liquid is large in consumption, resource waste and uneconomical, the air cooling type and the cold plate type heat dissipation modes are all indirect contact heat dissipation modes, the problem of large total heat resistance exists in the heat transfer process, and therefore the heat exchange efficiency is low, the immersion type heat dissipation device has the defects that the consumption of cooling liquid is large, the resource waste is high, a large amount of heat generated by the server cannot be timely taken away due to low heat conductivity of the cooling liquid, the existing spray type heat dissipation device has the defects that the heat exchange element is large in surface area liquid thick heat resistance, the liquid film flows slowly, the heat exchange efficiency is low and the like.

Disclosure of Invention

In order to overcome the problem of low heat dissipation efficiency of electronic components in a server in the related art, the invention provides a server module, which comprises:

A circuit board;

the heating modules are arranged on the circuit board;

the cooling module comprises a plurality of spraying units, wherein the spraying units are in one-to-one correspondence with the heating modules, each spraying unit is used for spraying cooling liquid to the corresponding heating module, and each spraying unit is used for providing the cooling liquid in a mode that the corresponding heating module and the circuit board form a liquid film.

In some embodiments, each of the spray units is designed to have a spray configuration that accommodates its corresponding heat generating module.

In some embodiments, each of the spray units has a spray direction, spray position, and spray area that are adapted to the heat generating module.

In some embodiments, the plurality of heat generating modules includes a first heat generating module including a hard disk group including a plurality of hard disks arranged at intervals along a first direction, the first direction being perpendicular to the circuit board;

the plurality of spraying units comprise a first spraying unit, the first spraying unit comprises a plurality of first spraying plates, the plurality of first spraying plates are arranged along the first direction at intervals, the hard disk is arranged between every two adjacent first spraying plates, the first spraying plates are provided with first spraying cavities, one side of each first spraying plate, facing the hard disk, is provided with a plurality of first spraying holes, and the first spraying holes are communicated with the first spraying cavities.

In some embodiments, the first spray unit further comprises a first liquid distribution pipe, the first liquid distribution pipe communicates the first spray cavities of the plurality of first spray plates, and the first liquid distribution pipe is provided with a first liquid inlet.

In some embodiments, the plurality of hard disk groups are arranged side by side along a second direction, the second direction is parallel to a side edge of the circuit board, and each hard disk of the hard disk groups is arranged between two adjacent first heating modules.

In some embodiments, the plurality of heat generating modules includes a second heat generating module including a power source;

the plurality of spraying units comprise a second spraying unit, the second spraying unit comprises a second spraying plate, the second spraying plate is arranged opposite to the power supply, the second spraying plate is provided with a second spraying cavity, one side of the second spraying plate facing the power supply is provided with a plurality of second spraying holes, the second spraying holes are communicated with the second spraying cavity, and the second spraying plate is further provided with a second liquid inlet.

In some embodiments, the first spraying plate includes a first spraying area and a second spraying area, a vertical projection of the first spraying area on the circuit board coincides with a vertical projection of the hard disk on the circuit board, the second spraying area is surrounded around the first spraying area, a spraying angle of the first spraying hole located in the first spraying area is perpendicular to the hard disk, and a spraying angle of the first spraying hole located in the second spraying area is inclined towards a direction approaching to the hard disk;

And/or the second spraying plate comprises a third spraying area and a fourth spraying area, the vertical projection of the third spraying area on the circuit board coincides with the vertical projection of the power supply on the circuit board, the fourth spraying area is arranged around the third spraying area, the spraying angle of the second spraying hole in the third spraying area is perpendicular to the power supply, and the spraying angle of the second spraying hole in the fourth spraying area is inclined towards the direction close to the power supply.

In some embodiments, the plurality of heat generating modules includes a third heat generating module including a bank of memory banks including a plurality of memory banks arranged at intervals along the second direction;

the plurality of spraying units comprise a third spraying unit, the third spraying unit comprises a third spraying plate group, the third spraying plate group comprises a plurality of third spraying plates, the third spraying plates are arranged along the second direction at intervals, the memory strip is positioned between two adjacent third spraying plates, the third spraying plates comprise a third spraying cavity, one side of the third spraying plate, which faces the memory strip, is provided with a third spraying hole, and the third spraying hole is communicated with the third spraying cavity.

In some embodiments, the memory stripe groups are arranged at intervals along the second direction, the third spraying plate groups are arranged at intervals, and the third spraying plate groups are in one-to-one correspondence with the memory stripe groups.

In some embodiments, the plurality of heating modules includes a fourth heating module, the fourth heating module includes a plurality of central processing units, the plurality of central processing units are respectively located between two adjacent memory bank groups, the central processing units include a CPU and a plurality of heat exchange fins arranged on the CPU, and the plurality of heat exchange fins are arranged at intervals along the second direction;

the plurality of spray units comprise a fourth spray unit, the fourth spray unit comprises a plurality of fourth spray plate groups, the fourth spray plate groups are in one-to-one correspondence with the central processor module, the fourth spray plate groups comprise a plurality of fourth spray plates, the fourth spray plates are arranged along the second direction at intervals, the heat exchange fins are located between two adjacent fourth spray plates, the fourth spray plates comprise fourth spray cavities, the fourth spray plates are provided with fourth spray holes towards one side of the heat exchange fins, and the fourth spray holes are communicated with the fourth spray cavities.

In some embodiments, the cooling module further includes a second liquid separation pipeline, the second liquid separation pipeline extends along the second direction, the second liquid separation pipeline includes a plurality of first liquid separation areas and a plurality of second liquid separation areas, the first liquid separation areas are in one-to-one correspondence with the third spraying plate sets, the second liquid separation areas are in one-to-one correspondence with the fourth spraying plate sets, the first liquid separation areas include a plurality of first liquid separation holes, the second liquid separation areas include a plurality of second liquid separation holes, the first liquid separation holes are in one-to-one communication with the third spraying plates, the second liquid separation holes are in one-to-one communication with the fourth spraying plates, and the second liquid separation pipeline is further provided with third liquid inlets.

In some embodiments, the ratio of the flow areas of each of the first and second liquid partitions is the ratio of the heat generation amounts at the rated power of each of the memory bank groups and each of the cpu modules.

In some embodiments, the cooling module further includes a housing, the circuit board is disposed in the housing, a plurality of independent accommodating cavities are enclosed between the housing and the circuit board, and at least one heating module and at least one spraying unit corresponding to the at least one heating module are disposed in each accommodating cavity.

In some embodiments, the housing includes a first housing portion and a second housing portion, the first housing portion and the second housing portion are disposed side by side along a third direction, the third direction is perpendicular to the second direction, the first housing portion and the circuit board are enclosed to form a first cavity, the second housing portion and the circuit board are enclosed to form a second cavity, the first cavity and the second cavity are independent of each other, the first spraying unit and the second spraying unit are disposed in the first cavity, the third spraying unit and the fourth spraying unit are disposed in the second cavity, a first opening and a second opening are disposed at positions of the first housing corresponding to the first liquid inlet and the second liquid inlet, a third opening is disposed at positions of the second housing portion corresponding to the third liquid inlet, the first liquid inlet extends from the second opening to the first housing portion, the third liquid inlet extends from the third opening to the second housing portion;

the first shell part is provided with a first liquid outlet, the second shell part is provided with a second liquid outlet, the first liquid outlet is communicated with the first cavity, and the second liquid outlet is communicated with the second cavity.

In some embodiments, the server module further comprises a diversion unit in communication with the plurality of spray units for distributing different flows of cooling liquid to the plurality of spray units.

In some embodiments, the server module further comprises a temperature detection module, wherein the temperature detection module comprises a plurality of temperature sensors, and the temperature sensors are in one-to-one correspondence with the heating modules and are used for detecting the temperature of the heating modules.

The second aspect of the present invention proposes a spray control method for a server module, which is applied to any one of the server modules provided in the first aspect of the present invention, and the spray control method includes:

acquiring the temperature of each heating module;

determining the total heating value of each heating module according to the temperature of each heating module;

determining the flow of the cooling liquid required by each heating module according to the total heating value of each heating module and the mass flow of the cooling liquid required by the unit heat of each heating module;

and distributing cooling liquid to the spraying units according to the cooling liquid flow required by each heating module.

The technical scheme of the invention can have the following beneficial effects: according to the invention, the plurality of spraying units are arranged and correspond to the heating modules one by one, so that cooling liquid with different flow rates can be distributed to the corresponding spraying units according to the heating condition of the heating modules, excessive cooling liquid is prevented from participating in heat exchange, and a thin cooling liquid film is formed on the surface of the heating modules and the circuit board in the heat exchange process, so that the heat resistance can be reduced, and the heat exchange efficiency can be improved. And the momentum of the cooling liquid sprayed on the surface of the heating module and gravity are combined to accelerate the flow of the liquid film, so that the cooling liquid after absorbing heat can rapidly leave the surface of the heating module, and the heat exchange effect is further improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic diagram illustrating a distribution of a plurality of heat generating modules on a circuit board according to an exemplary embodiment.

FIG. 2 is a schematic diagram illustrating a distribution of a plurality of spray units in a cooling module according to an exemplary embodiment.

Fig. 3 is a block diagram of a server module shown according to an exemplary embodiment.

Fig. 4 is a block diagram of a cooling module shown according to an exemplary embodiment.

Fig. 5 is a block diagram of a shower plate according to an exemplary embodiment.

Fig. 6 is a state diagram of spray cooling liquid of the second spray holes shown according to an exemplary embodiment.

FIG. 7 is a block diagram of a second liquid separation circuit, according to an example embodiment.

Fig. 8 is a flowchart illustrating a spray control method of a server module according to an exemplary embodiment.

Wherein: 1. a circuit board; 2. a first heating module; 21. a hard disk group; 211. a hard disk; 3. a second heat generating module; 4. a third heat generating module; 41. a memory bank; 411. a memory bank; 5. a fourth heat generating module; 51. a central processing unit module; 511. a heat exchange rib; 512. a CPU; 6. a first spray unit; 61. a first shower plate; 62. a first liquid separation pipe; 63. a first liquid inlet; 7. a second spray unit; 71. a second shower plate; 72. a second liquid inlet; 8. a third spray unit; 81. a third shower plate set; 811. a third shower plate; 9. a fourth spray unit; 91. a fourth shower plate set; 911. a fourth shower plate; 10. a second liquid separation pipe; 101. a first liquid separation zone; 1011. a first liquid separation hole; 102. a second liquid separation zone; 1021. a second liquid separation hole; 103. a third liquid inlet; 11. a housing; 1101. a first housing portion; 1102. a second housing portion; 1103. a first liquid outlet; 1104. a second liquid outlet; 12. a spray plate; 121. and spraying holes.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the invention. Rather, they are merely examples of apparatus and methods consistent with aspects of the invention as detailed in the accompanying claims.

The present embodiment will be described in detail below with reference to the attached drawings, and the following embodiments and examples may be combined with each other without conflict.

According to an exemplary embodiment, as shown in fig. 1-7, the present embodiment proposes a server module, which includes a circuit board 1 and a plurality of heat generating modules disposed on the circuit board 1. The plurality of heat generating modules include one or more of a hard disk 211, a power supply, a CPU512, and a memory bank 411. The layout of the plurality of heat generating modules on the circuit board 1 is not limited, and can be adjusted according to the requirements. The server module further comprises a cooling module, the cooling module comprises a plurality of spraying units, the spraying units are arranged in one-to-one correspondence with the heating modules, each spraying unit is used for spraying cooling liquid to the corresponding heating module, and each spraying unit is used for providing the cooling liquid in a mode that the corresponding heating module and the circuit board 1 form a liquid film, and the cooling liquid is water or fluoridized liquid. The spraying unit can have various structures, and comprises a spraying plate for example, and sprays cooling liquid to the corresponding heating module through spray holes on the spraying plate. In other realizable modes, a spray pipe structure, a reciprocating spray structure or a rotary spray structure is arranged on the surface of the heating module. The structures of the spraying units can be identical or different, and the spraying units can be flexibly designed according to the arrangement positions of the heating modules and the structures of the heating modules.

According to the embodiment, the plurality of spraying units are arranged and correspond to the plurality of heating modules one by one, cooling liquid with different flow rates can be distributed to the corresponding spraying units according to the heating condition of the heating modules, excessive cooling liquid is prevented from participating in heat exchange, a thin cooling liquid film is formed on the surface of the heating module in the heat exchange process, and therefore heat resistance can be reduced, and heat exchange efficiency can be improved. Under the suspension state, the momentum of the cooling liquid sprayed on the surface of the heating module is combined with gravity to accelerate the flow of the liquid film, so that the cooling liquid after absorbing heat can rapidly leave the surface of the heating module, and the heat exchange effect is further improved.

In an example, each spraying unit is designed to have a spraying structure adapted to the corresponding heating module, and/or each spraying unit has a spraying direction, a spraying position and a spraying area adapted to the heating module, so as to achieve the best cooling effect, so that the corresponding heating module is in the best working temperature range, and the working performance of the heating module is ensured.

In some embodiments, as shown in fig. 1 to 3, the plurality of heat generating modules includes a first heat generating module 2, the first heat generating module 2 includes a hard disk group 21, and the number of the hard disk groups 21 is not limited, and may be flexibly designed according to the performance of the server. In an example, as shown in fig. 1, the first heat generating module 2 includes a plurality of hard disk groups 21, and the plurality of hard disk groups 21 are arranged side by side along a second direction, which is parallel to one side of the circuit board 1 and refers to a direction shown by an X-axis in fig. 3. The hard disk group 21 includes a plurality of hard disks 211, and the plurality of hard disks 211 are arranged at intervals along a first direction, which is perpendicular to the circuit board 1 and which is referred to a direction shown by a Z-axis in fig. 3. The plurality of spray units include first spray unit 6, first spray unit 6 includes a plurality of first spray plates 61, a plurality of first spray plates 61 are arranged along first direction interval, first direction perpendicular to circuit board 1, hard disk 211 sets up between two adjacent first spray plates 61, first spray plate 61 has first spray chamber, spray chamber and outside coolant conveying pipeline intercommunication, first spray plate 61 is equipped with a plurality of first spray holes towards one side of hard disk 211, first spray hole and first spray chamber intercommunication. When the hard disks 211 are disposed on both sides of the first shower plate 61, first shower holes are disposed on both sides of the shower plate opposite to the hard disks 211. The spraying angle of the first spraying hole may be perpendicular to the hard disk 211 or may be a certain angle with the hard disk 211. In an example, the first spraying plate 61 includes a first spraying area and a second spraying area, the vertical projection of the first spraying area on the circuit board 1 coincides with the vertical projection of the hard disk 211 on the circuit board 1, the second spraying area is surrounded around the first spraying area, that is, the length and width of the first spraying plate 61 are larger than the length and width of the hard disk 211, the spraying angle of the first spraying hole in the first spraying area is perpendicular to the hard disk 211, and the spraying angle of the first spraying hole in the second spraying area is inclined towards the direction close to the hard disk 211, so as to spray and cool the side edges around the hard disk 211, and the spraying angle of the first spraying hole in the second spraying area refers to the spraying angle of the spraying hole in fig. 6. When a plurality of hard disk groups 21 are provided, the hard disk 211 of each hard disk group 21 is located between two adjacent first shower plates 61.

In one example, the plurality of first shower plates 61 are independent of each other, and each of the first shower plates 61 communicates with an external coolant delivery pipe. In another example, as shown in fig. 2, the first spraying unit 6 further includes a first liquid dividing pipe 62, the first liquid dividing pipe 62 communicates the first spraying chambers of the plurality of first spraying plates 61, the first liquid dividing pipe 62 is provided with a first liquid inlet 63, the first liquid inlet 63 communicates with an external coolant conveying line, and the coolant entering from the first liquid inlet 63 is divided to the plurality of first spraying plates 61 through the first liquid dividing pipe 62.

In some embodiments, as shown in fig. 1-3, the plurality of heating modules includes a second heating module 3, the second heating module 3 includes a power supply, the plurality of spraying units includes a second spraying unit 7, the second spraying unit 7 includes a second spraying plate 71, the second spraying plate 71 is disposed opposite to the power supply, the second spraying plate 71 has a second spraying cavity, a plurality of second spraying holes are disposed on a side of the second spraying plate 71 facing the power supply, the second spraying holes are communicated with the second spraying cavity, the second spraying plate 71 is further provided with a second liquid inlet 72, and the second liquid inlet 72 is communicated with an external coolant pipeline. In an example, the second spraying plate 71 includes a third spraying area and a fourth spraying area, the vertical projection of the third spraying area on the circuit board 1 coincides with the vertical projection of the power supply on the circuit board 1, the fourth spraying area is surrounded around the third spraying area, that is, the length and width of the second spraying plate 71 are larger than the length and width of the power supply, the spraying angle of the second spraying hole located in the third spraying area is perpendicular to the power supply, and the spraying angle of the second spraying hole located in the fourth spraying area is inclined towards the direction close to the power supply, so as to spray and cool the side around the power supply, and the spraying angle of the second spraying hole located in the fourth spraying area refers to the spraying angle of the spraying hole in fig. 6.

In some embodiments, as shown in fig. 1-3, the plurality of heat generating modules includes a third heat generating module 4, the third heat generating module 4 includes a memory bank group 41, and the number of the memory bank groups 41 is not limited, and in an example, as shown in fig. 1, the third heat generating module 4 includes a plurality of memory bank groups 41, and the plurality of memory bank groups 41 are arranged at intervals along the second direction. The memory bank 41 includes a plurality of memory banks 411, and a plurality of memory banks 411 are arranged along the second direction interval, and a plurality of spraying units include third spraying unit 8, and third spraying unit 8 includes third spraying board group 81, and third spraying board group 81 includes a plurality of third spraying boards 811, and a plurality of third spraying boards 811 are arranged along the second direction interval, and memory banks 411 are located between two adjacent third spraying boards 811, and third spraying board 811 includes the third and sprays the chamber, and the third sprays chamber and outside coolant liquid pipeline intercommunication. A third spraying hole is formed in one side of the third spraying plate 811 facing the memory bank 411, and the third spraying hole is communicated with the third spraying cavity. When the third heating module 4 includes a plurality of memory bank groups 41, the third spraying unit 8 includes a plurality of third spraying plate groups 81, and the third spraying plate groups 81 are in one-to-one correspondence with the memory bank groups 41. Each third shower plate group 81 may be independent of each other, that is, each third shower plate 811 communicates with an external coolant line, respectively. The plurality of third shower plate groups 81 may also communicate through third liquid dividing pipes (not shown in the drawings), and the third shower plates 811 communicate with external coolant pipes, delivering coolant to the third shower plates 811 of the respective third shower plate groups 81.

In some embodiments, as shown in fig. 1-3, the plurality of heating modules includes a fourth heating module 5, the fourth heating module 5 includes a plurality of central processing units 51, the plurality of central processing units 51 are respectively located between two adjacent memory banks 41, the central processing units 51 include a CPU512 and a plurality of heat exchanging fins 511 disposed on the CPU512, the plurality of heat exchanging fins 511 are arranged at intervals along the second direction, and the heat exchanging fins 511 are used for dissipating heat of the CPU 512. The plurality of spraying units comprise a fourth spraying unit 9, the fourth spraying unit 9 comprises a plurality of fourth spraying plate groups 91, the fourth spraying plate groups 91 are in one-to-one correspondence with the CPU module 51, the fourth spraying plate groups 91 comprise a plurality of fourth spraying plates 911, the plurality of fourth spraying plates 911 are distributed at intervals along the second direction, the heat exchange fins 511 are located between two adjacent fourth spraying plates 911, and cooling liquid sprayed by the fourth spraying plates 911 cools the heat exchange fins 511 so as to ensure the cooling effect of the heat exchange fins 511 on the CPU512 and ensure the stable operation of the CPU 512. The fourth spraying plate 911 comprises a fourth spraying cavity, and a fourth spraying hole is formed in one side of the fourth spraying plate 911 facing the heat exchange rib 511 and is communicated with the fourth spraying cavity. Each fourth shower plate group 91 may be independent of each other, i.e., each fourth shower plate 911 communicates with an external coolant line, respectively. The plurality of fourth shower plate groups 91 may also communicate through fourth liquid distribution pipes (not shown in the drawing), and the fourth shower plates 911 communicate with external coolant pipes, delivering coolant to the fourth shower plates 911 of the respective fourth shower plate groups 91.

In an example, the third spray unit 8 and the fourth spray unit 9 are independent from each other, i.e. the third spray unit 8 and the fourth spray unit 9 are in communication with an external coolant line, respectively. In another example, as shown in fig. 2, 3 and 7, the cooling module further includes a second liquid distribution pipe 10, the second liquid distribution pipe 10 extends along the second direction, the second liquid distribution pipe 10 includes a plurality of first liquid distribution areas 101 and a plurality of second liquid distribution areas 102, the first liquid distribution areas 101 are in one-to-one correspondence with the third spray plate group 81, the second liquid distribution areas 102 are in one-to-one correspondence with the fourth spray plate group 91, the first liquid distribution areas 101 include a plurality of first liquid distribution holes 1011, the second liquid distribution areas 102 include a plurality of second liquid distribution holes 1021, the first liquid distribution holes 1011 are in one-to-one correspondence with the third spray plate 811, the second liquid distribution holes 1021 are in one-to-one correspondence with the fourth spray plate 911, the second liquid distribution pipe 10 is further provided with a third liquid inlet 103, the third liquid inlet 103 is in communication with an external cooling liquid pipe, and the cooling liquid entering the second liquid distribution pipe 10 flows into the third spray plate 811 and the fourth spray plate 911 through the first liquid distribution holes 1011 and the third liquid distribution holes respectively.

In some embodiments, as shown in fig. 7, the ratio of the flow areas of each first liquid partition 101 and each second liquid partition 102 is the ratio of the heating values under the rated power of each first memory bank 41 and each central processing unit module 51, so as to realize the flow distribution of different third spray plate sets 81 and different fourth spray plate sets 91, so that the flow of the cooling liquid meets the rated power requirements of the corresponding memory bank 41 and the central processing unit module 51, the memory bank 41 and the central processing unit module 51 are in the temperature range of rated operation, excessive cooling liquid does not participate in heat exchange, and the thick thermal resistance of the accumulated liquid on the surface of the memory bank 411 and the heat exchange fins 511 is avoided, thereby improving the heat dissipation efficiency.

In some embodiments, the distribution of the first spray holes on the first spray plate 61, the distribution of the second spray holes on the second spray plate 71, the distribution of the third spray holes on the third spray plate 811, and the distribution of the fourth spray holes on the fourth spray plate 911 are as shown with reference to fig. 5, in which the spray holes 121 are arranged in an array on the spray plate 12. The spray holes 121 may be the same or different in size, and the spray angles of the spray holes 121 may be the same or different, so that the spray holes may be flexibly designed according to the needs.

In some embodiments, as shown in fig. 4, the cooling module further includes a housing 11, the circuit board 1 is disposed in the housing 11, a plurality of independent accommodating cavities are enclosed between the housing 11 and the circuit board 1, and at least one heating module and at least one spraying unit corresponding to the at least one heating module are disposed in each accommodating cavity. In an example, referring to fig. 1 and 3, the first heat generating module 2 and the second heat generating module 3 are disposed on the circuit board 1 side by side along the second direction, and the first heat generating module 2 and the third heat generating module 4 are disposed on the circuit board 1 side by side along the third direction, wherein the third direction is perpendicular to the second direction, and the third direction refers to the direction shown by the Y axis in fig. 3. The housing 11 includes a first housing portion 1101 and a second housing portion 1102, the first housing portion 1101 encloses with the circuit board 1 to form a first cavity, the second housing portion 1102 encloses with the circuit board 1 to form a second cavity, the first cavity and the second cavity are independent from each other, the first spraying unit 6 and the second spraying unit 7 are disposed in the first cavity, and at this time, the first heating module 2 and the second heating module 3 are also disposed in the first cavity. The third spraying unit 8 and the fourth spraying unit 9 are arranged in the second cavity, and the third heating module 4 is also positioned in the second cavity. The first housing 11 is provided with a first opening and a second opening at positions corresponding to the first liquid inlet 63 and the second liquid inlet 72, the second housing 1102 is provided with a third opening at positions corresponding to the third liquid inlet 103, the first liquid inlet 63 extends out of the first housing 1101 through the second opening, the second liquid inlet 72 extends out of the first housing 1101 through the second opening, the third liquid inlet 103 extends out of the second housing 1102 through the third opening, the first housing 1101 is provided with a first liquid outlet 1103, the second housing 1102 is provided with a second liquid outlet 1104, the first liquid outlet 1103 is communicated with the first cavity, and the second liquid outlet 1104 is communicated with the second cavity.

In this embodiment, through setting up first spraying unit 6 and second spraying unit 7 in first cavity, third spraying unit 8 and fourth spraying unit 9 set up in the second cavity, and first cavity and second cavity mutually independent, then the coolant liquid that first spraying unit 6 and second spraying unit 7 sprayed can not flow into the second cavity after absorbing heat, thereby can not produce the influence to the temperature of the coolant liquid that third spraying unit 8 and fourth spraying unit 9 in the second cavity sprayed, guarantee the cooling effect of the coolant liquid that the third spraying unit 8 fourth spraying unit 9 sprayed. And, first cavity and second cavity still can collect the spray, and the spray of collecting will be discharged from first liquid outlet 1103 and second liquid outlet 1104 respectively, then is pumped to the entry of each spray unit again after cooling and carries out heat transfer next time, so reciprocal circulation. The cooling mode of the cooling liquid absorbing the heat can adopt air cooling, water cooling or heat exchange with other heat exchange media for cooling.

In other realizable modes, each radiating element and the corresponding spraying unit can be independently arranged in one accommodating cavity, and each radiating element and the corresponding spraying unit can be optionally combined and then accommodated in different accommodating cavities, so that flexible design can be performed according to requirements.

In some embodiments, the server module further includes a distribution unit (not shown in the figure) in communication with the plurality of spray units for distributing different flows of the cooling liquid to the plurality of spray units. In an example, the diversion unit includes a plurality of diversion pipelines connected with the plurality of cooling liquid storage tanks, and the diversion pipelines are in one-to-one correspondence with the spraying units. And each shunt pipeline is provided with an electromagnetic valve, a flowmeter and a pressure pump. The flow dividing unit determines the cooling liquid flow of each spraying unit according to the total heat generated by each heating module and the cooling liquid flow required by the unit heat of each heating module, regulates and controls the cooling liquid flow of the cooling liquid storage tank flowing to the corresponding spraying unit through the flow dividing pipeline by regulating the opening of each electromagnetic valve, and monitors the flow in the flow dividing pipeline through the flowmeter. The pumping device provides pumping pressure for the cooling liquid in the diversion pipeline, so that the cooling liquid enters the corresponding spraying unit at a certain pressure and is sprayed onto the corresponding heating module through the spraying holes of the spraying unit.

In some embodiments, the server module further includes a temperature detection module (not shown in the figure), where the temperature detection module includes a plurality of temperature sensors, and the temperature sensors are in one-to-one correspondence with the heat generation modules, and are configured to detect temperatures of the heat generation modules, and determine total heat generation amounts of the heat generation modules according to the detected temperatures. In an example, the heat generation amount and the heat generation power of each heat generation module have a preset function relation along with the change of temperature, and the total heat generation amount of each heat generation module can be determined through the preset function relation after the temperature of the heat generation module is obtained.

According to the embodiment, by arranging the independent spraying units on the heating modules, the flow rate of the cooling liquid entering the spraying units can be determined according to the heating values of the heating modules, under the action of pressure, the cooling liquid of the spraying units sprays the cooling liquid to the surfaces of the heating modules respectively through the spraying holes, a thin cooling liquid film is formed on the surfaces of the heating modules and the circuit board 1 instantly by sprayed cooling liquid drops, under the combined action of gravity (the direction of gravity is shown by an arrow in FIG. 1) and the momentum of the cooling liquid in a hanging state of the circuit board 1, the thin cooling liquid film does not still increase the total heat exchange thermal resistance, but flows downwards along the wall surface of the heating module rapidly in the heat exchange process, a small amount of fluorinated liquid drops which do not form liquid films on the heating modules are taken away in the flowing process, the extremely thin liquid film is formed in the flowing process, the heat exchange thermal resistance is reduced, and the heat exchange is enhanced. The cooling liquid which flows down from the hair-emitting element and absorbs a large amount of heat gathers in the first cavity and the second cavity, finally flows out of the server through the liquid outlet, is pumped to the liquid inlets of the spraying units again after being cooled to perform next spraying heat exchange, and is circulated in a reciprocating mode.

The present embodiment proposes a spray control method, which is applied to any one of the server modules provided in the foregoing embodiment, and fig. 8 is a control flowchart of the spray control method according to an exemplary embodiment, and referring to fig. 8, the spray control method includes the following steps:

s81, acquiring the temperature of each heating module;

s82, determining the total heating value of each heating module according to the temperature of each heating module;

s83, determining the required cooling liquid flow of each heating module according to the total heating value of each heating module and the cooling liquid flow required by the unit heat of each heating module;

s84, distributing cooling liquid to the corresponding spraying units according to the cooling liquid flow required by each heating module.

In this embodiment, according to the running state of the server, after the heating modules in the server generate heat, the surface temperature of each heating module is transmitted to the controller through the temperature sensor, the controller receives the temperature of each heating module and then converts the temperature into the total heating quantity Q of each element through logic, then the cooling liquid flow J required by each heating module unit heat is combined to determine that the cooling liquid flow required by each heating module is Q/J, and then cooling liquid is distributed to the corresponding spraying unit according to the required cooling liquid flow Q/J, so that no excessive cooling liquid participates in heat dissipation of each heating module, the situation that the heating module has large surface area liquid thickness thermal resistance is avoided, and the cooling effect on each heating module is effectively improved.

The present embodiment is explained in detail below in connection with specific examples.

Because the power supply, the hard disk 211, the memory 411 and the CPU512 in the server are main operation heating modules, the total number of the heat needing to be taken away by the cooling liquid is Qa, qb, qc, qd in the power supply, the hard disk 211, the memory 411 and the CPU512 respectively, so that each heating module can be in a respective required working temperature interval. The mass flow rate of the cooling liquid used for exchanging unit heat with each heating module is h, i, j, k respectively. The mass flow h, i, J, k is calculated according to the formula q=cp×m×Δt, where m in the formula is the corresponding mass flow h, i, J, k, cp is the specific heat capacity of the coolant, Δt is the temperature difference between the coolant before and after heat exchange for each heat generating module, and Q is the unit heat generation amount 1J.

In summary, each heating module has a ratio of the mass flow rate of the fluorinated liquid required by each heating module within the required working temperature rangeSince the memory bank 411 and the CPU512 share one liquid inlet, the mass flow ratio of the first liquid inlet 63, the second liquid inlet 72 and the third liquid inlet 103 is ∈> The ratio of the flow areas of each first liquid division area 101 and each second liquid division area 102 in the second liquid division pipe 10 is the ratio of the heating values under the rated power of each first memory bank 41 and each central processing unit module 51, so that the flow distribution of different third spray plate sets 81 and different fourth spray plate sets 91 is realized, and the cooling liquid flow meets the rated power requirements of the corresponding memory bank 41 and the central processing unit module 51.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It is to be understood that the invention is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims (16)

1. A server module, the server module comprising:

a circuit board;

the heating modules are arranged on the circuit board;

the cooling module comprises a plurality of spraying units, wherein the spraying units are in one-to-one correspondence with the heating modules, each spraying unit is used for spraying cooling liquid to the corresponding heating module, and each spraying unit is used for providing the cooling liquid in a mode that the corresponding heating module and the circuit board form a liquid film.

2. The server module according to claim 1, wherein each of the spray units is designed with a spray structure adapted to its corresponding heat generating module;

and/or each spraying unit is provided with a spraying direction, a spraying position and a spraying area which are suitable for the heating module.

3. The server module of claim 1 or 2, wherein the plurality of heat generating modules comprises a first heat generating module, the first heat generating module comprising a hard disk group comprising a plurality of hard disks arranged at intervals along a first direction, the first direction being perpendicular to the circuit board;

the plurality of spraying units comprise a first spraying unit, the first spraying unit comprises a plurality of first spraying plates, the plurality of first spraying plates are arranged along the first direction at intervals, the hard disk is arranged between every two adjacent first spraying plates, the first spraying plates are provided with first spraying cavities, one side of each first spraying plate, facing the hard disk, is provided with a plurality of first spraying holes, and the first spraying holes are communicated with the first spraying cavities.

4. The server module of claim 3, wherein the first spray unit further comprises a first liquid distribution pipe, the first liquid distribution pipe communicates the first spray cavities of the plurality of first spray plates, and the first liquid distribution pipe is provided with a first liquid inlet.

5. The server module according to claim 4, wherein the plurality of hard disk groups are arranged side by side along a second direction, the second direction is parallel to a side edge of the circuit board, and the hard disk of each hard disk group is arranged between two adjacent first heating modules.

6. The server module of claim 5, wherein the plurality of heat generating modules comprises a second heat generating module comprising a power source;

the plurality of spraying units comprise a second spraying unit, the second spraying unit comprises a second spraying plate, the second spraying plate is arranged opposite to the power supply, the second spraying plate is provided with a second spraying cavity, one side of the second spraying plate facing the power supply is provided with a plurality of second spraying holes, the second spraying holes are communicated with the second spraying cavity, and the second spraying plate is further provided with a second liquid inlet.

7. The server module of claim 6, wherein the first spray plate comprises a first spray area and a second spray area, wherein a vertical projection of the first spray area on the circuit board coincides with a vertical projection of the hard disk on the circuit board, the second spray area is surrounded around the first spray area, a spray angle of the first spray hole in the first spray area is perpendicular to the hard disk, and a spray angle of the first spray hole in the second spray area is inclined toward a direction approaching to the hard disk;

And/or the second spraying plate comprises a third spraying area and a fourth spraying area, the vertical projection of the third spraying area on the circuit board coincides with the vertical projection of the power supply on the circuit board, the fourth spraying area is arranged around the third spraying area, the spraying angle of the second spraying hole in the third spraying area is perpendicular to the power supply, and the spraying angle of the second spraying hole in the fourth spraying area is inclined towards the direction close to the power supply.

8. The server module of claim 6, wherein the plurality of heating modules comprises a third heating module, the third heating module comprising a bank of memory banks, the bank of memory banks comprising a plurality of memory banks, the plurality of memory banks being arranged at intervals along the second direction;

the plurality of spraying units comprise a third spraying unit, the third spraying unit comprises a third spraying plate group, the third spraying plate group comprises a plurality of third spraying plates, the third spraying plates are arranged along the second direction at intervals, the memory strip is positioned between two adjacent third spraying plates, the third spraying plates comprise a third spraying cavity, one side of the third spraying plate, which faces the memory strip, is provided with a third spraying hole, and the third spraying hole is communicated with the third spraying cavity.

9. The server module of claim 8, wherein the plurality of memory banks is arranged at intervals along the second direction, the plurality of third spraying plate sets is arranged, and the third spraying plate sets are in one-to-one correspondence with the memory banks.

10. The server module of claim 9, wherein the plurality of heat generating modules comprises a fourth heat generating module, the fourth heat generating module comprises a plurality of central processing units, the plurality of central processing units are respectively positioned between two adjacent memory bank groups, the central processing units comprise a CPU and a plurality of heat exchanging fins arranged on the CPU, and the plurality of heat exchanging fins are arranged at intervals along the second direction;

the plurality of spray units comprise a fourth spray unit, the fourth spray unit comprises a plurality of fourth spray plate groups, the fourth spray plate groups are in one-to-one correspondence with the central processor module, the fourth spray plate groups comprise a plurality of fourth spray plates, the fourth spray plates are arranged along the second direction at intervals, the heat exchange fins are located between two adjacent fourth spray plates, the fourth spray plates comprise fourth spray cavities, the fourth spray plates are provided with fourth spray holes towards one side of the heat exchange fins, and the fourth spray holes are communicated with the fourth spray cavities.

11. The server module of claim 10, wherein the cooling module further comprises a second liquid distribution pipeline extending along the second direction, the second liquid distribution pipeline comprising a plurality of first liquid distribution areas and a plurality of second liquid distribution areas, the first liquid distribution areas being in one-to-one correspondence with the third spray plate groups, the second liquid distribution areas being in one-to-one correspondence with the fourth spray plate groups, the first liquid distribution areas comprising a plurality of first liquid distribution holes, the second liquid distribution areas comprising a plurality of second liquid distribution holes, the first liquid distribution holes being in one-to-one communication with the third spray plates, the second liquid distribution holes being in one-to-one communication with the fourth spray plates, the second liquid distribution pipeline further being provided with third liquid inlets.

12. The server module of claim 11, wherein a ratio of flow areas of each of the first and second fluid partitions is a ratio of heat generation amounts at rated power of each of the memory bank groups and each of the cpu modules.

13. The server module of claim 11, wherein the cooling module further comprises a housing, the circuit board is disposed in the housing, a plurality of independent accommodating cavities are enclosed between the housing and the circuit board, and at least one heating module and at least one spraying unit corresponding to the at least one heating module are disposed in each accommodating cavity.

14. The server module of claim 13, wherein the housing comprises a first housing portion and a second housing portion, the first housing portion and the second housing portion are disposed side by side along a third direction, the third direction is perpendicular to the second direction, the first housing portion and the circuit board enclose a first cavity, the second housing portion and the circuit board enclose a second cavity, the first cavity and the second cavity are independent of each other, the first spray unit and the second spray unit are disposed in the first cavity, the third spray unit and the fourth spray unit are disposed in the second cavity, a first opening and a second opening are disposed in positions of the first housing corresponding to the first liquid inlet and the second liquid inlet, a third opening is disposed in positions of the second housing portion corresponding to the third liquid inlet, the first liquid inlet extends out of the first housing from the second opening, and the third liquid inlet extends out of the third housing from the third opening;

the first shell part is provided with a first liquid outlet, the second shell part is provided with a second liquid outlet, the first liquid outlet is communicated with the first cavity, and the second liquid outlet is communicated with the second cavity.

15. The server module of claim 1, further comprising a diverter unit in communication with the plurality of spray units for distributing different flows of coolant to the plurality of spray units.

16. A spray control method of a server module, applied to the server module according to any one of claims 1 to 15, characterized in that the spray control method comprises:

acquiring the temperature of each heating module;

determining the total heating value of each heating module according to the temperature of each heating module;

determining the flow of the cooling liquid required by each heating module according to the total heating value of each heating module and the mass flow of the cooling liquid required by the unit heat of each heating module;

and distributing cooling liquid to the spraying units according to the cooling liquid flow required by each heating module.