CN117248193A

CN117248193A - Coating chamber and coating equipment

Info

Publication number: CN117248193A
Application number: CN202311527040.7A
Authority: CN
Inventors: 毛文瑞
Original assignee: Jiangsu Leadmicro Nano Technology Co Ltd
Current assignee: Jiangsu Leadmicro Nano Technology Co Ltd
Priority date: 2023-11-16
Filing date: 2023-11-16
Publication date: 2023-12-19

Abstract

The application relates to a coating chamber and coating equipment, include: the cavity comprises a cover plate, a bottom plate and side walls, wherein the cover plate and the bottom plate are oppositely arranged, the side walls are positioned between the cover plate and the bottom plate, the cover plate, the bottom plate and the side walls enclose a reaction cavity, and the cavity is provided with an air inlet and an air outlet; the carrier plate is arranged in the reaction cavity and provided with a bearing surface for containing objects to be treated; the uniform flow device is arranged in the reaction cavity and is arranged between at least one of the air inlet and the air outlet and the carrier plate at intervals; the flow homogenizing device comprises a flow homogenizing plate and a flow homogenizing piece, wherein a plurality of air homogenizing holes are formed in the flow homogenizing plate in a penetrating way, and the flow homogenizing piece is arranged on one surface of the flow homogenizing plate facing the carrier plate; the even flow piece covers an even gas hole at least and communicates with even gas hole, and the side of even flow piece sets up the air channel mouth, and the contained angle A between the air current direction of air channel mouth and the even flow board principal plane satisfies: a is more than or equal to 0 degree and less than 90 degrees. The coating chamber and the coating have the advantage that the object to be treated is not easy to damage.

Description

Coating chamber and coating equipment

Technical Field

The application relates to the technical field of coating, in particular to a coating chamber and coating equipment.

Background

The coating equipment needs to provide a vacuum environment for the objects to be treated of the silicon wafer and the glass in the coating process, and after the objects to be treated are transferred into the coating cavity, the coating cavity needs to be vacuumized before coating, and process gas needs to be filled into the coating cavity in the coating process; the process of pumping and inflating the coating cavity easily causes damage to the object to be treated.

Disclosure of Invention

Based on the above, it is necessary to provide a coating chamber and a coating apparatus for solving the problem of damage to the object to be treated.

A first aspect of the present application provides a coating chamber comprising: the device comprises a cavity, a first cover plate, a second cover plate, a first bottom plate, a second bottom plate and a second bottom plate, wherein the cavity comprises a cover plate, a bottom plate and a side wall arranged oppositely, the side wall is arranged between the cover plate and the bottom plate, the cover plate, the bottom plate and the side wall enclose a reaction cavity, and the cavity is provided with an air inlet and an air outlet; the carrier plate is arranged in the reaction cavity and provided with a bearing surface for containing objects to be treated; the uniform flow device is arranged in the reaction cavity and is arranged between at least one of the air inlet and the air outlet and the carrier plate at intervals; the flow homogenizing device comprises a flow homogenizing plate and a flow homogenizing piece, wherein a plurality of air homogenizing holes are formed in the flow homogenizing plate in a penetrating mode, and the flow homogenizing piece is arranged on one surface of the flow homogenizing plate, which faces the carrier plate; the even flow piece covers at least one even gas pocket and with even gas pocket intercommunication, even flow piece's side sets up the air flue mouth, the air flue mouth the air current direction with the contained angle A between the even flow board major surface satisfies: a is more than or equal to 0 degree and less than 90 degrees.

In one embodiment, the included angle a between the air flow direction of the air passage opening and the main plane of the uniform flow plate satisfies the following conditions: a is more than or equal to 5 degrees and less than or equal to 80 degrees.

In one embodiment, the included angle a between the air flow direction of the air passage opening and the main plane of the uniform flow plate satisfies the following conditions: a is more than or equal to 10 degrees and less than or equal to 60 degrees.

In one embodiment, the air inlet and the air outlet are arranged at intervals.

In one embodiment, the air inlet is disposed on one of the base plate and the cover plate, and the air outlet is disposed on the other of the base plate and the cover plate; or the air inlet and the air outlet are arranged on the bottom plate or the cover plate together.

In one embodiment, the flow homogenizing device is arranged between the air inlet and the carrier plate at intervals.

In one embodiment, the flow homogenizing device is arranged between the air outlet and the carrier plate at intervals.

In one embodiment, the flow homogenizing device comprises two flow homogenizing devices, wherein one flow homogenizing device is arranged between the air inlet and the carrier plate at intervals, and the other flow homogenizing device is arranged between the air outlet and the carrier plate at intervals.

In one embodiment, the flow-homogenizing device comprises a connecting piece, wherein the connecting piece is arranged on the surface of the flow-homogenizing plate, which is opposite to the carrier plate, and is used for being connected with the adjacent cover plate and/or the adjacent bottom plate and/or the adjacent side wall.

In one embodiment, the air homogenizing holes are arranged in a linear array on the air homogenizing plate, and the air homogenizing parts are air homogenizing pipes covered on each row of the air homogenizing holes; the uniform flow pipe comprises a pipe top wall and pipe side walls formed by extending edges of two sides of the pipe top wall towards the same direction; the open end of the homogenizing pipe is covered on the homogenizing plate and communicated with the homogenizing holes covered under the homogenizing plate, the top wall of the pipe is opposite to the homogenizing holes, and the air passage opening is arranged on the side wall of the pipe.

In one embodiment, the flow homogenizing pipe comprises a flange formed by outwards turning the tail end of the side wall of the pipe away from the top wall of the pipe, and the flange is fixedly connected with the flow homogenizing plate.

In one embodiment, every two adjacent rows of the uniform flow tubes can be integrally connected through the flanges therebetween.

In one embodiment, the flow homogenizing element is a flow homogenizing column matched with the air homogenizing hole; the inside of the uniform flow column is provided with a main flow hole and at least one flow dividing hole, the main flow hole is arranged along the axial direction of the uniform flow column, one end of the main flow hole is communicated with the corresponding uniform flow hole, and the other end of the main flow hole is arranged in a closed manner; one end of the flow dividing hole is communicated with the main flow hole, and the other end of the flow dividing hole is arranged on the side wall of the uniform flow column and is communicated with the outside.

In one embodiment, the uniform flow column comprises a mounting section and a uniform gas section which are mutually connected along the axis direction of the uniform flow column, the mounting section is columnar and is encapsulated in each uniform gas hole, the uniform gas section is hexahedron with the outer diameter larger than the aperture of the uniform gas hole, and the distribution holes are uniformly distributed on each surface of the circumference of the uniform gas section.

In one embodiment, the uniform flow member is configured as a flow guide plate arranged on one side of each uniform air hole facing the carrier plate; the guide plate is obliquely arranged from the edge of one side of the air homogenizing hole to the direction close to the carrier plate, and the air channel opening is formed by the interval between the guide plate and the carrier plate.

In one embodiment, the included angle a between the air flow direction of the air passage opening and the main plane of the uniform flow plate satisfies the following conditions: a is 15 degrees or more and 45 degrees or less.

A second aspect of the present application provides a coating apparatus comprising a coating chamber as described above.

The beneficial effects are that:

according to the coating chamber and the coating equipment, the flow homogenizing device comprises the flow homogenizing plate and the flow homogenizing piece; the uniform flow plate is penetrated and formed with a plurality of uniform air holes, the uniform flow piece is arranged on one surface of the uniform flow plate facing the carrier plate, the uniform flow piece at least covers one uniform air hole and is communicated with the uniform air holes, the side surface of the uniform flow piece is provided with a gas port, and the included angle A between the gas flow direction of the gas port and the main plane of the uniform flow plate is as follows: a is more than or equal to 0 degree and less than 90 degrees; the air channel opening is ensured not to be directly aligned with the plate surface of the substrate, the process air can flow through the flow distribution of the flow distribution plate on the flow distribution plate, and the flow direction is changed through the air channel opening at the side surface of the flow distribution piece so as to be close to the plate surface of the carrier plate or contact with the plate surface of the carrier plate in the flow direction of a certain inclined angle, thus changing the flow direction of the process air, effectively improving the uniformity, reducing the local air flow impact and effectively preventing the to-be-processed objects on the carrier plate from being damaged.

Drawings

Fig. 1 is a schematic structural diagram of a plating apparatus according to some embodiments of the present application, in which single-line arrows are used to indicate the flow direction of process gases.

Fig. 2 is an enlarged block diagram of region B of the structure shown in fig. 1.

Fig. 3 is a schematic structural diagram of a uniform flow device according to some embodiments of the present application.

Fig. 4 is a schematic view of the structure shown in fig. 3 from another perspective.

Fig. 5 is an exploded view of the structure shown in fig. 4.

Fig. 6 is a schematic view of a portion of a flow homogenizing tube according to some embodiments of the present application.

Fig. 7 is a schematic structural diagram of a uniform flow device according to some embodiments of the present application.

Fig. 8 is a schematic view of a portion of a flow homogenizing tube according to some embodiments of the present application.

Fig. 9 is a schematic structural diagram of a uniform flow device according to some embodiments of the present application.

Fig. 10 is an assembled schematic view of a flow-homogenizing plate and a flow-homogenizing column according to some embodiments of the present application, in which a single-line arrow is used to indicate the axial direction of the flow-dividing hole.

Fig. 11 is a schematic structural diagram of a uniform flow column according to some embodiments of the present application.

Fig. 12 is a schematic structural diagram of a uniform flow device according to some embodiments of the present application.

Fig. 13 is a schematic structural diagram of a flow-homogenizing plate and a flow deflector according to some embodiments of the present application, in which single-line arrows are used to illustrate the airflow direction of the air duct opening.

Fig. 14 is a perspective view of a plating apparatus according to some embodiments of the present application.

Reference numerals illustrate:

the device comprises a cavity body-10, a cover plate-11, a bottom plate-12, side walls-13, a reaction cavity-14, an air inlet-15, an air outlet-16, a carrier plate-20, a flow homogenizing device-30, a flow homogenizing plate-31, a flow homogenizing part-32, a flow homogenizing hole-33, an air passage port-34, a connecting piece-35, a flow homogenizing pipe-40, a pipe top wall-41, a pipe side wall-42, a folded edge-43, an open end-44, a guide plate-50, a flow homogenizing column-60, a main flow hole-61, a flow dividing hole-62, a mounting section-63, a gas homogenizing section-64, a film coating chamber-100, a vacuum pump-400 and an air source 700.

Detailed Description

Embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical solutions of the present application, and thus are only examples, and are not intended to limit the scope of protection of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions.

In the description of the embodiments of the present application, these terms "first," "second," etc., are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order, or a primary or secondary relationship.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In the description of the embodiments of the present application, the term "and/or" is merely an association relationship describing an association object, which means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In the description of the embodiments of the present application, the terms "plurality" and "a plurality" mean at least two (including two), such as two, three, etc., unless specifically defined otherwise. Similarly, the terms "plurality of sets" and "plurality of sets" when present refer to more than two sets (including two sets), and the terms "plurality of sheets" when present refer to more than two sheets (including two sheets).

In the description of the embodiments of the present application, if there are any such terms as "center", "longitudinal", "transverse", "length", "width", "thickness", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counter-clockwise", "axial", "radial", "circumferential", etc., these terms refer to an orientation or positional relationship based on that shown in the drawings, for convenience of description and simplicity of description only, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the embodiments of the present application.

In the description of the embodiments of the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," etc., should be construed broadly if any. For example, the two parts can be fixedly connected, detachably connected or integrated; or may be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.

In this application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

The first aspect of the present application provides a coating chamber 100, which is applied in a coating apparatus, and can effectively change the flow direction of a process gas, improve the uniformity of the gas flow, reduce the local gas flow impact, and ensure that the to-be-treated object on a carrier plate 20 is damaged due to the impact of the process gas in the process of coating the to-be-treated object.

In the embodiments of the present application, the object to be treated may be a silicon wafer, a glass sheet, or a sheet to be coated formed of other materials, which is not limited herein, and when the object to be treated is a large glass sheet, the glass sheet is not required to be placed on the carrier 20, and the glass sheet may be directly placed in the coating chamber 100; the process gas may be nitrogen (N2) or monosilane (SiH 4), or other gases, and is not limited in this regard.

Referring to fig. 1 to 14, a plating chamber 100 includes: a chamber 10, a carrier plate 20 and a flow homogenizing device 30.

Wherein the chamber 10 includes a cover plate 11 and a bottom plate 12 disposed opposite to each other, and a sidewall 13 between the cover plate 11 and the bottom plate 12. The cover plate 11 and the base plate 12 may be metal hard plates, for example, stainless steel plates, aluminum alloy plates, copper alloy plates; the cover plate 11, the bottom plate 12 and the side wall 13 enclose a reaction cavity 14, and the cavity 10 is provided with an air inlet 15 and an air outlet 16; the air inlet 15 and the air outlet 16 are used for communicating with external air extraction equipment or inflation equipment; such as vacuum pump 400 (referenced below), gas source 700 (referenced below), and the like.

The carrier 20 is disposed in the reaction chamber 14. The carrier plate 20 may be a hard plate, for example, a stainless steel plate, an aluminum alloy plate, a copper alloy plate, an ABS plastic plate. The carrier plate 20 has a carrying surface for holding the object to be treated, so that the carrier plate 20 can conveniently carry the object to be treated into the reaction chamber 14 for coating.

The flow homogenizing device 30 is disposed in the reaction chamber 14 and is disposed between the carrier 20 and at least one of the air inlet 15 and the air outlet 16 at intervals.

Referring to fig. 1 and 2, the flow homogenizing device 30 includes a flow homogenizing plate 31 and a flow homogenizing member 32, wherein a plurality of air homogenizing holes 33 are formed on the flow homogenizing plate 31 in a penetrating manner, and the flow homogenizing member 32 is disposed on a surface of the flow homogenizing plate 31 facing the carrier 20. The current uniformity plate 31 can be made of aluminum alloy, steel, ceramic and other materials, and has good heat conductivity, so that the current uniformity plate 31 can maintain proper temperature in the process of performing plasma enhanced chemical vapor deposition, and deformation caused by thermal stress is avoided. In addition, the surface of the uniform flow plate 31 may be coated with a protective coating to enhance corrosion resistance. The air homogenizing holes 33 are distributed on the homogenizing plate 31 and communicate with both sides of the homogenizing plate 31. The axis direction of the air homogenizing holes 33 is basically vertical to the air homogenizing plate 31, and the cross section of the air homogenizing holes 33 is far smaller than the cross section of the air inlet 15/the air outlet 16, so that the effects of flow restriction, flow division and homogenizing flow are achieved on the process gas, and the damage to the to-be-treated objects on the carrier plate 20 caused by the overlarge flow velocity of the process gas in a local area is avoided.

The uniform flow piece 32 at least covers one uniform air hole 33 and is communicated with the uniform air hole 33, the side surface of the uniform flow piece 32 is provided with an air passage opening 34, and the included angle A between the air flow direction of the air passage opening 34 and the main plane of the uniform flow plate 31 meets the following conditions: a is more than or equal to 0 degree and less than 90 degrees. That is, the air passage 34 is not perpendicular to the surface of the carrier plate 20, so that the process gas does not strike the surface of the carrier plate 20 in a vertical or nearly vertical direction, and the impact of the impact force of the gas on the objects to be processed on the carrier plate 20 is reduced.

The process gas is split by the flow-homogenizing plate 31 on the flow-homogenizing plate 31, and the air passage opening 34 on the side surface of the flow-homogenizing member 32 changes the flow direction to be parallel to the direction of the plate surface of the carrier plate 20 or to be in contact with the plate surface of the carrier plate 20 at a certain inclination angle, so that the flow direction of the process gas is changed, the uniformity is effectively improved, the local air flow impact is reduced, and the condition that the object to be treated on the carrier plate 20 is damaged is effectively prevented.

Alternatively, the air inlet 15 may be provided on one of the bottom plate 12 and the cover plate 11, and the air outlet 16 may be provided on the other of the bottom plate 12 and the cover plate 11. That is, in this configuration, the flow direction of the process gas stream is directed from the base plate 12 to the cover plate 11/cover plate 11 to the base plate 12; regardless of the direction, the process air always diffuses to the surface of the object to be treated placed on the carrier 20 during the flowing process, thereby completing the film plating.

Optionally, the air inlet 15 and the air outlet 16 are also arranged together on the base plate 12 or the cover plate 11.

In some embodiments, referring to fig. 1 and 2, the flow homogenizing device 30 may be one, and the flow homogenizing device 30 is disposed between the air inlet 15 and the carrier 20 at intervals; the flow-homogenizing device 30 may be disposed between the air outlet 16 and the carrier plate 20 at intervals, specifically, according to the design.

For the convenience of understanding, the air inlet 15 is provided on the bottom plate 12, and the air outlet 16 is provided on the cover plate 11 for explanation.

Relatively independent gas diffusion spaces are respectively formed between the carrier plate 20 and the uniform flow plate 31, and between the uniform flow plate 31 and the wall surface where the gas inlet 15 is located, that is, the bottom plate 12.

When the uniform flow device 30 is arranged between the air inlet 15 and the carrier 20 at intervals; the process gas enters the reaction cavity 14 through the gas inlet 15 and diffuses in the gas diffusion space between the bottom plate 12 and the uniform flow plate 31, and then enters the gas diffusion space between the carrier plate 20 and the uniform flow plate 31 through the uniform gas holes 33 and the gas holes 34 of the uniform flow piece 32, so that the process gas uniformly circulates and diffuses from the gas inlet 15 to the surface of the object to be treated contained in the carrier plate 20, and the film plating is completed.

Similarly, when the flow homogenizing device 30 is arranged between the air outlet 16 and the carrier plate 20 at intervals; the process gas which completes coating on the surface of the object to be treated contained in the carrier plate 20 is uniformly diffused through the gas diffusion space between the carrier plate 20 and the uniform flow plate 31, enters the gas diffusion space between the cover plate 11 and the uniform flow plate 31 through the gas port 34 and the uniform gas hole 33 of the uniform flow member 32, and finally is discharged from the gas outlet 16.

In both cases, the flow homogenizing device 30 is able to effectively change the flow direction of the process gas and improve the uniformity of the gas flow, reducing the local gas flow impingement, regardless of the position of the flow homogenizing device 30.

In some embodiments, referring to fig. 1 and 2, the flow homogenizing device 30 includes two flow homogenizing devices, wherein one flow homogenizing device 30 is disposed between the air inlet 15 and the carrier plate 20 at intervals, and the other flow homogenizing device is disposed between the air outlet 16 and the carrier plate 20 at intervals; thus, the air inlet and the air outlet of the film coating chamber can improve the air flow uniformity through the uniform flow device 30, and the local air flow impact is reduced. The specific principle process may refer to the previous embodiment, and will not be described herein.

In the following embodiments, the process gas is introduced into the reaction chamber 14 from the gas inlet 15 and uniformly diffused on the surface of the substrate 20 to be treated to complete the coating, as will be described.

In some embodiments, referring to fig. 1 and 2, the angle a between the direction of the air flow at the air passage opening 34 and the principal plane of the uniform flow plate 31 is as follows: a is more than or equal to 5 degrees and less than or equal to 80 degrees; in this way, in the range of the included angle, the process gas can be ensured to contact with the plate surface of the carrier plate 20 in the flow direction of the inclined angle, and the smaller impact angle is selected according to the flow rate of the process gas, so that the uniformity is effectively improved, the local air flow impact is reduced, and the condition that the object to be treated on the carrier plate 20 is damaged is effectively prevented.

It will be appreciated that when the angle a between the direction of the gas flow through the gas passage 34 and the plane of the main surface of the flow homogenizing plate 31 is close to 90 °, a certain impact is still generated, and the impact can be reduced by reducing the velocity of the process gas, but this results in a reduced coating efficiency. In practical production, the included angle a between the air flow direction of the air passage opening 34 and the main plane of the uniform flow plate 31 can be satisfied: a is more than or equal to 10 degrees and less than or equal to 60 degrees; for example, the included angle a is 15 °, 20 °, 30 °, 45 °, 60 °; on the one hand, as the impact angle of the process gas is gradually reduced, the impact force of the process gas at the same speed is reduced, so that the local airflow impact can be reduced; on the other hand, due to the existence of the included angle A, the process gas can select a larger rate under the equal impact force as the impact angle of the process gas gradually increases, and the process gas can still keep a certain rate, so that the coating efficiency is ensured not to be too low.

In some embodiments, referring to fig. 1 and 14, the coating chamber 100 includes a plurality of gas inlets 15 disposed at intervals, so that the process gas can enter the reaction chamber 14 through the plurality of gas inlets 15, thereby realizing a flow division effect, reducing local airflow impact, and effectively preventing the to-be-processed objects contained in the carrier 20 from being damaged.

In addition, the coating chamber 100 may further include a plurality of air outlets 16 disposed at intervals, which function similar to the air inlets 15, and will not be described herein.

In some embodiments, referring to fig. 1 to 5, the flow-equalizing device 30 includes a connecting member 35, where the connecting member 35 is disposed on a surface of the flow-equalizing plate 31 facing away from the carrier 20, and is used to connect with an adjacent cover plate 11 and/or bottom plate 12 and/or side wall 13, so as to achieve relative fixation of the flow-equalizing device 30 and the cavity 10.

Specifically, the connection member 35 may be a connection column, one end of which is connected to the adjacent cover plate 11 and/or bottom plate 12 and/or side wall 13, and the other end of which is connected to the uniform flow plate 31. The connecting post may be made of alloy steel, ceramic, etc., and has good thermal conductivity to avoid deformation of the connecting post 70 caused by thermal stress.

The connecting piece 35 and the adjacent cover plate 11 and/or the base plate 12 and/or the side wall 13 can be connected by screw threads, or can be clamped or in interference fit, particularly according to the design.

In some embodiments, reference is made to fig. 1-7; the air holes 33 are arranged in a linear array on the air-homogenizing plate 31, and the air-homogenizing element 32 is an air-homogenizing pipe 40 covering the air holes 33.

The homogenizing pipes 40 may extend along a straight line for a certain length to form an elongated open slot, and each homogenizing pipe 40 is covered with at least one row of homogenizing holes 33. The flow homogenizing tube 40 may be sealed or open at both ends. In this way, the process gas flowing out from the gas homogenizing holes 33 can pass through the gas channel port 34 on the gas homogenizing pipe 40, so that the process gas contacts with the plate surface of the carrier plate 20 in a direction close to the plate surface of the carrier plate 20 or in a flowing direction with a certain inclination angle, thereby reducing local gas flow impact and effectively preventing the to-be-processed objects on the carrier plate 20 from being damaged.

In other embodiments, the plurality of air homogenizing holes 33 may be arranged along a circular or arc shape on the air homogenizing plate 31, unlike the previous embodiment; accordingly, the flow homogenizing tube 40 may extend in a circular or arcuate shape; specifically, the arrangement of the air holes 33 is not limited in this point, depending on the design.

In some embodiments, referring to fig. 1 to 6, the flow homogenizing pipe 40 includes a pipe top wall 41 and pipe side walls 42 formed by extending edges of both sides of the pipe top wall 41 in the same direction; the open end 44 of the homogenizing tube 40 is covered on the homogenizing plate 31 and communicates with the homogenizing holes 33 covered thereunder, the tube top wall 41 is opposite to the homogenizing holes 33, and the air passage opening 34 is provided on the tube side wall 42.

The tube top wall 41 and the two tube side walls 42 are joined to form a U shape; the open end 44 of the homogenizing pipe 40 is covered on the homogenizing plate 31, and the homogenizing pipe 40 and the homogenizing plate 31 are surrounded to form a relatively closed area; the position of the uniform air hole 33 is just aligned with the tube top wall 41, the tube top wall 41 is of a blind plate structure which does not allow air flow to pass through, and the air passage opening 34 is arranged on the tube side wall 42, so that after the process air enters a closed area formed by surrounding the uniform air hole 33 and the uniform air passage tube 40 and the uniform air passage plate 31, the process air needs to be turned and sprayed out of the air passage opening 34 on the tube side wall 42, the flow direction of the process air is changed, the uniformity is effectively improved, the local air flow impact is reduced, and the condition that the object to be treated on the carrier plate 20 is damaged is effectively prevented.

In some embodiments, referring to fig. 1-6, the flow homogenizing tube 40 includes a flange 43, the flange 43 being formed by the end of the tube side wall 42 remote from the tube top wall 41 being folded outwardly, the flange 43 being fixedly attached to the homogenizing plate 31.

The homogenizing pipe 40 can be a sheet metal part formed by multiple bending, and has simple process and low cost, and is convenient for mass production. By providing the flange 43, it is attached to the current homogenizing plate 31 and fixedly connected by welding or bolting.

Unlike the previous embodiments, in other embodiments, the side of the two tube side walls 42 away from the tube top wall 41 may be directly welded to the uniform flow plate 31 without providing the folded edges 43; in particular, the design is subject to.

In some embodiments, referring to fig. 1-6, each adjacent two rows of shim tubes 40 can be integrally connected by a hem 43 therebetween; in this way, the plurality of rows of flow homogenizing pipes 40 are formed together into a single flow homogenizing pipe whole plate, and are attached to the flow homogenizing plate 31.

The whole plate of the homogenizing pipe can be a sheet metal stamping plate, a plurality of air passage ports 34 are formed by stamping at a preset position, and then the homogenizing pipe 40 is formed by stamping on the same whole plate through unified bending or stamping, and the air passage ports 34 are ensured to be positioned on the pipe side wall 42 of the homogenizing pipe 40, so that the homogenizing pipe is suitable for mass production, and the process is simpler.

In some embodiments, referring to fig. 1, and 9-11, the flow homogenizing member 32 is a flow homogenizing column 60 coupled to the air homogenizing holes 33.

The uniform flow columns 60 are in one-to-one correspondence with the uniform air holes 33; wherein the flow homogenizing column 60 may be a metal plug, such as one or more of a stainless steel plug, an aluminum alloy plug, a copper alloy plug.

The inside of the uniform flow column 60 is provided with a main flow hole 61 and at least one flow dividing hole 62, the main flow hole 61 is arranged along the axial direction of the uniform flow column 60, one end of the main flow hole 61 is communicated with the corresponding uniform air hole 33, and the other end is arranged in a closed manner; one end of the diversion hole 62 communicates with the main flow hole 61, and the other end is opened on the side wall of the uniform flow column 60 and communicates with the outside.

The uniform flow column 60 comprises a mounting section 63 and a uniform air section 64 which are mutually connected along the axis direction, wherein the mounting section 63 is columnar and is encapsulated in each uniform air hole 33. The mounting section 63 and the air homogenizing holes 33 can be connected by interference press connection or welding, and usually can also be connected by screw threads, so that the subsequent maintenance and replacement of the air homogenizing column 60 are facilitated.

The air homogenizing section 64 may be a polygonal cylinder, such as a regular square cylinder, a diamond cylinder, a cylinder, or other irregular polygonal cylinder.

In the present embodiment, the air homogenizing section 64 has a hexahedral shape with an outer diameter larger than the aperture of the air homogenizing hole 33. The principle description will be given below with the air inlet 15 being located on the bottom plate 12 for ease of understanding.

The process gas enters the reaction chamber 14 from the gas inlet 15, diffuses in the gas diffusion space between the bottom plate 12 and the uniform flow plate 31, enters the uniform flow column 60 through the main flow hole 61, is guided by the main flow hole 61 and the flow dividing hole 62, is ejected from the opening of the flow dividing hole 62 on the side wall of the uniform flow column 60, and flows into the gas diffusion space between the carrier plate 20 and the uniform flow plate 31; the direction of the process gas is repeatedly changed when the process gas flows, so that impact force is weakened, and flow speed is reduced; by arranging the included angle A between the axial direction of the diversion holes 62 and the uniform flow plate 31, and the included angle A is more than or equal to 0 degree and less than or equal to 80 degrees, the process air can be contacted with the plate surface of the carrier plate 20 in the direction close to the plate surface of the carrier plate 20 or in the flowing direction with a certain inclined angle, so that the impact force is relieved, the process air can be uniformly distributed on the carrier plate 20, the local air flow impact is reduced, the process air is uniformly circulated and diffused from the air inlet 15 to the surface of the object to be treated contained in the carrier plate 20, and the film plating is completed.

In general, the smaller the angle a between the axial direction of the flow dividing hole 62 and the plate surface of the uniform flow plate 31, the more impact force of the process gas can be relieved, specifically, the design is based.

In some embodiments, as shown in fig. 10-11, the flow splitting holes 62 are evenly distributed across the circumferential surfaces of the plenum 64. For a uniform flow column 60, there may be multiple diversion holes 62 connected simultaneously with a main flow hole 61 to form a diversion.

Specifically, a flow of process gas enters the uniform flow column 60 through the main flow hole 61, is split into a plurality of flows through the plurality of flow splitting holes 62 on each surface of the circumferential direction of the uniform gas section 64 after being guided, is sprayed out at a preset angle and direction, and can be diffused to the gas diffusion space between the carrier plate 20 and the uniform flow plate 31 in a more uniform and more divergent manner, so that the process gas is ensured to be uniformly diffused to the surface of the object to be treated contained in the carrier plate 20, and the film coating is completed; meanwhile, the weaker multi-strand process gas can be ensured not to generate larger airflow impact, and the objects to be treated contained in the carrier plate 20 are prevented from being impacted and damaged.

In some embodiments, referring to fig. 1, 12 and 13, the flow homogenizing members 32 are configured as baffles 50 disposed on a side of each air homogenizing hole 33 facing the carrier 20. The baffle 50 is inclined from the edge of the air-homogenizing hole 33 to the direction approaching the carrier 20, and the interval between the baffle and the carrier is configured as an air passage 34.

The air homogenizing holes 33 are in one-to-one correspondence with the guide plates 50. The air homogenizing plate 31 may be a stamped sheet metal part, the air homogenizing holes 33 are through holes punched on the air homogenizing plate 31 by a die, the guide plate 50 may be a sheet structure punched from the air homogenizing plate 31 by a die, and the stamping angle of the die is set to ensure that the sheet structure is still connected with a part of the edge of the air homogenizing holes 33, so that a plurality of air homogenizing holes 33 and the guide plate 50 can be punched on one air homogenizing plate 31 simultaneously or sequentially, thereby forming a plurality of air channel ports 34.

In connection with the orientation shown in fig. 13, the area between the end of the baffle 50 remote from the air holes 33 and the air-homogenizing plate 31 is formed as an air passage port 34. The process gas enters from the gas inlet 15 and diffuses in the gas diffusion space between the bottom plate 12 and the uniform flow plate 31, enters through the uniform gas holes 33 and is guided by the guide plate 50 until being sprayed out from the region between the uniform flow plate 31 and the end of the guide plate 50 away from the uniform gas holes 33, and flows into the gas diffusion space between the carrier plate 20 and the uniform flow plate 31; the axial direction passing through the air passage opening 34 is arranged obliquely to the uniform flow plate 31; the process gas is led to change the direction through the guide plate 50, and the flowing direction of the process gas is contacted with the plate surface of the carrier plate 20 at a certain inclination angle, so that the impact force is slowed down, the process gas can be distributed on the plate surface of the carrier plate 20 in a uniform manner, the local air flow impact is reduced, and the condition that the objects to be treated contained in the carrier plate 20 are damaged is effectively prevented.

Specifically, the angle a between the air flow direction of the air passage opening 34 and the principal plane of the uniform flow plate 31 satisfies: a is 15 degrees or more and 45 degrees or less. In practical arrangement, considering the stamping process and the requirement of process gas when the carrier 20 is used for coating the object to be treated, the included angle a between the plate surface of the deflector 50 and the plate surface of the uniform flow plate 31 may be set to 15 ° -45 °, specifically, the design is in order.

A second aspect of the present application provides a coating apparatus comprising a coating chamber 100 as described above.

Referring to fig. 1 and 14, the coating apparatus may include a vacuum pump 400, a gas collecting line 500, a first control valve 510, a shunt line 600, a second control valve 610, and a gas source 700. One end of the gas collecting pipe 500 is connected to the gas outlet 16, and the other end of the gas collecting pipe 500 is connected to the vacuum pump 400. One end of the shunt line 600 is connected to the air inlet 15 and the other end of the shunt line 600 is connected to the air source 700.

The process gas in the reaction chamber 14 is pumped by the vacuum pump 400, and is injected into the coating chamber 210 by the gas source 700 through the shunt pipeline 600, so as to realize the coating environment necessary for coating the to-be-treated objects contained on the carrier plate 20. The first control valve 510 is disposed on the gas collecting pipeline 500, and the second control valve 610 is disposed on the shunt pipeline 600, for controlling the pipeline to be on-off, so as to ensure the automatic production of the coating process.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims

1. A coating chamber, comprising:

the device comprises a cavity (10), wherein the cavity (10) comprises a cover plate (11) and a bottom plate (12) which are oppositely arranged, and a side wall (13) positioned between the cover plate (11) and the bottom plate (12), the cover plate (11), the bottom plate (12) and the side wall (13) enclose a reaction cavity (14), and the cavity (10) is provided with an air inlet (15) and an air outlet (16);

the carrier plate (20) is arranged in the reaction cavity (14) and is provided with a bearing surface for containing objects to be treated; and

a flow homogenizing device (30) arranged in the reaction cavity (14) and arranged between the carrier plate (20) and at least one of the air inlet (15) and the air outlet (16) at intervals;

the flow homogenizing device (30) comprises a flow homogenizing plate (31) and a flow homogenizing piece (32), wherein a plurality of air homogenizing holes (33) are formed in the flow homogenizing plate (31) in a penetrating mode, and the flow homogenizing piece (32) is arranged on one surface of the flow homogenizing plate (31) facing the carrier plate (20); the air homogenizing piece (32) at least covers one air homogenizing hole (33) and is communicated with the air homogenizing hole (33), an air passage opening (34) is formed in the side face of the air homogenizing piece (32), and an included angle A between the air flow direction of the air passage opening (34) and the main plane of the air homogenizing plate (31) is as follows: a is more than or equal to 0 degree and less than 90 degrees.

2. The coating chamber according to claim 1, characterized in that the angle a between the gas flow direction of the gas passage opening (34) and the main plane of the uniform flow plate (31) is such that: a is more than or equal to 5 degrees and less than or equal to 80 degrees.

3. The coating chamber according to claim 2, characterized in that the angle a between the gas flow direction of the gas passage opening (34) and the main plane of the flow homogenizing plate (31) is such that: a is more than or equal to 10 degrees and less than or equal to 60 degrees.

4. The coating chamber according to claim 1, characterized in that it comprises a plurality of spaced apart air inlets (15) and a plurality of spaced apart air outlets (16).

5. The coating chamber according to claim 1, characterized in that the air inlet (15) is provided on one of the bottom plate (12) and the cover plate (11), the air outlet (16) being provided on the other of the bottom plate (12) and the cover plate (11); or the air inlet (15) and the air outlet (16) are arranged on the bottom plate (12) or the cover plate (11) together.

6. The coating chamber according to claim 1, characterized in that the flow homogenizing device (30) is arranged at intervals between the air inlet (15) and the carrier plate (20).

7. The coating chamber according to claim 1, characterized in that the flow homogenizing device (30) is arranged at intervals between the gas outlet (16) and the carrier plate (20).

8. The coating chamber according to claim 1, wherein the flow homogenizing device (30) comprises two, wherein one of the flow homogenizing devices (30) is arranged between the air inlet (15) and the carrier plate (20) at intervals, and the other one of the flow homogenizing devices is arranged between the air outlet (16) and the carrier plate (20) at intervals.

9. Coating chamber according to claim 5, characterized in that the flow-homogenizing device (30) comprises a connecting piece (35), which connecting piece (35) is arranged on the surface of the flow-homogenizing plate (31) facing away from the carrier plate (20) for connection with the adjacent cover plate (11) and/or the base plate (12) and/or the side walls (13).

10. The coating chamber according to any one of claims 1 to 9, wherein a plurality of said air-homogenizing holes (33) are arranged in a linear array on said air-homogenizing plate (31), said air-homogenizing members (32) being air-homogenizing pipes (40) covering each row of said air-homogenizing holes (33);

wherein the homogenizing pipe (40) comprises a pipe top wall (41) and pipe side walls (42) formed by extending edges of two sides of the pipe top wall (41) towards the same direction; the open end (44) of the uniform flow pipe (40) is covered on the uniform flow plate (31) and is communicated with the uniform air holes (33) covered under the uniform flow plate, the pipe top wall (41) is opposite to the uniform air holes (33), and the air passage opening (34) is arranged on the pipe side wall (42).

11. The coating chamber according to claim 10, characterized in that the flow-homogenizing pipe (40) comprises a flange (43), the flange (43) being formed by an end of the pipe side wall (42) remote from the pipe top wall (41) being turned outwards, the flange (43) being fixedly connected to the flow-homogenizing plate (31).

12. Coating chamber according to claim 11, characterized in that each adjacent two rows of said uniform flow tubes (40) can be integrally connected by said folds (43) therebetween.

13. Coating chamber according to any one of claims 1 to 9, characterized in that the flow homogenizing element (32) is a flow homogenizing column (60) coupled to the air homogenizing hole (33);

a main flow hole (61) and at least one flow dividing hole (62) are formed in the uniform flow column (60), the main flow hole (61) is formed along the axial direction of the uniform flow column (60), one end of the main flow hole (61) is communicated with the corresponding uniform flow hole (33), and the other end of the main flow hole is in closed arrangement; one end of the diversion hole (62) is communicated with the main flow hole (61), and the other end of the diversion hole is arranged on the side wall of the uniform flow column (60) and is communicated with the outside.

14. The coating chamber according to claim 13, wherein the uniform flow column (60) comprises a mounting section (63) and a uniform gas section (64) which are mutually connected along the axis direction of the uniform gas column, the mounting section (63) is columnar and is encapsulated in each uniform gas hole (33), the uniform gas section (64) is hexahedral with an outer diameter larger than the pore diameter of the uniform gas hole (33), and the flow distribution holes (62) are uniformly distributed on each surface of the uniform gas section (64) in the circumferential direction.

15. The coating chamber according to any one of claims 1 to 9, wherein the flow homogenizing member (32) is configured as a baffle (50) provided at a side of each of the air homogenizing holes (33) facing the carrier plate (20);

the guide plate (50) is obliquely arranged from the edge of one side of the air homogenizing hole (33) to the direction close to the carrier plate (20), and the interval between the guide plate and the carrier plate is the air passage opening (34).

16. The coating chamber according to claim 15, characterized in that the angle a between the direction of the air flow in the air passage opening (34) and the main plane of the flow homogenizing plate (31) is such that: a is 15 degrees or more and 45 degrees or less.

17. A coating apparatus comprising a coating chamber (100) according to any one of claims 1 to 16.