CN117245447A - On-machine measurement method and system based on double-turntable machine tool and triggered by turntable rotation - Google Patents

On-machine measurement method and system based on double-turntable machine tool and triggered by turntable rotation Download PDF

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Publication number
CN117245447A
CN117245447A CN202310265629.8A CN202310265629A CN117245447A CN 117245447 A CN117245447 A CN 117245447A CN 202310265629 A CN202310265629 A CN 202310265629A CN 117245447 A CN117245447 A CN 117245447A
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measurement
workpiece
measured
measuring
machine
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钟海军
陈梓萱
夏锡光
颜利军
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Suzhou Qianji Intelligent Software Co ltd
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Suzhou Qianji Intelligent Software Co ltd
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Priority to CN202310265629.8A priority Critical patent/CN117245447A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/20Arrangements for observing, indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/60Analysis of geometric attributes
    • G06T7/62Analysis of geometric attributes of area, perimeter, diameter or volume
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30164Workpiece; Machine component

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Quality & Reliability (AREA)
  • Geometry (AREA)
  • Numerical Control (AREA)

Abstract

The invention provides an on-machine measurement method and system based on a double-turntable machine tool and triggered by turntable rotation, wherein the method comprises the steps of determining the height of a bus of a workpiece to be measured based on the size of the workpiece on a 2D drawing of the workpiece to be measured, and setting measurement parameters according to the height of the bus; calculating the position of each theoretical measuring point according to the measuring parameters to obtain the distribution of each theoretical measuring point of the workpiece to be measured in the 3D space; generating an on-machine measurement path according to the distribution of each theoretical measurement point, and processing the on-machine measurement path into an executable measurement program; and according to the measuring program, measuring the workpiece to be measured by utilizing the rotation of the fifth shaft of the machine tool to obtain the measured data of each measuring point of the workpiece to be measured. According to the invention, a 3D model of a workpiece to be measured is not needed, and only a user needs to set some necessary parameters according to the size on a 2D drawing, the on-machine measurement can be realized by means of the rotation of the fifth axis of the machine tool, so that more applicable scenes are added for the on-machine measurement.

Description

On-machine measurement method and system based on double-turntable machine tool and triggered by turntable rotation
Technical Field
The invention relates to the technical field of on-machine measurement of numerical control machine tools, in particular to an on-machine measurement method and system based on a double-turntable machine tool and triggered by turntable rotation.
Background
The on-machine measurement is a very common measurement means in the processing and manufacturing industry, and the existing on-machine measurement technology firstly needs to plan a plurality of measurement points according to a 3D model of a measured workpiece, then reversely calculates a measurement path according to the normal direction of the measurement points, the safety distance given by a user and the like, and finally completes measurement according to the path. As shown in fig. 1, P is one of a plurality of measurement points planned on the surface of the workpiece model, when the measurement point P is measured, the measuring head moves from a starting position to a safety point S, then moves to a approaching point a at a rapid feeding rate, and then approaches the workpiece at a detection feeding rate until the measuring head is triggered; and after the measuring head contacts the workpiece, returning to the safety point S along the original path, namely, the movement path of S- > A- > P- > A- > S is a complete measurement path of single point measurement.
The current on-machine measurement method always needs to plan the measurement points according to the 3D model of the measured workpiece to obtain the measurement path, but a plurality of measurement scenes with only 2D drawings and no 3D model exist in the actual production process, and the current measurement method cannot complete the measurement point planning under the scenes, so that the use is greatly limited. Meanwhile, the existing on-machine measurement method is complicated in planning measurement points, so that the test efficiency is low.
Therefore, a new on-machine measurement method is needed to achieve efficient measurement in different scenarios.
Disclosure of Invention
Therefore, the embodiment of the invention provides an on-machine measurement method and system based on a double-turntable machine tool and triggered by turntable rotation, which are used for solving the problems that in the prior art, a measurement point cannot be planned and the test efficiency is low because of a 3D model of a tested workpiece is not available.
In order to solve the above problems, an embodiment of the present invention provides an on-machine measurement method based on a dual-turntable machine tool and triggered by turntable rotation, the method comprising:
s1: determining the bus height of the workpiece to be measured based on the size of the workpiece on a 2D drawing of the workpiece to be measured, and setting measurement parameters according to the bus height;
s2: calculating the position of each theoretical measuring point according to the measuring parameters to obtain the distribution of each theoretical measuring point of the workpiece to be measured in the 3D space;
s3: generating an on-machine measurement path according to the distribution of each theoretical measurement point, and processing the on-machine measurement path into an executable measurement program;
s4: and according to the measuring program, measuring the workpiece to be measured by utilizing the rotation of the fifth shaft of the machine tool to obtain the measured data of each measuring point of the workpiece to be measured.
Preferably, in step S1, the bus height of the workpiece to be measured is determined based on the 2D drawing of the workpiece to be measured, and the method for setting the measurement parameter according to the bus height includes the following steps:
firstly, determining the bus height H of a workpiece to be measured based on the size of the workpiece on a 2D drawing of the workpiece to be measured;
setting measurement parameters according to the height H of the bus, wherein the measurement parameters comprise the depth H of a first measurement point of a first row from the upper edge of a workpiece to be measured, the distance d from a left edge, the row spacing r and the helix angle alpha;
finally, the number of measuring points in each row and the total number of rows are adjusted to finish parameter setting, and a pile of false image measuring points are obtained at the moment.
Preferably, the set of artefact measurement points are rectangular in distribution.
Preferably, in step S2, the method for obtaining the distribution of each theoretical measurement point of the workpiece to be measured in the 3D space by calculating the position of each theoretical measurement point according to the measurement parameter includes:
and on each row, keeping the first measuring point motionless, starting from the second measuring point, and rotating each measuring point at a certain angle around a fifth axis to obtain the distribution of all theoretical measuring points of the workpiece to be measured in the 3D space.
Preferably, the rotation angle of the measurement points in the same row is incremented.
Preferably, the position before and after each measuring point rotates is close to the included angle formed by the first measuring point of the row but not more than the set helix angle alpha.
Preferably, according to the measurement program, the method for measuring the workpiece to be measured by using the rotation of the fifth axis of the machine tool to obtain the measured data of each measurement point of the workpiece to be measured specifically includes:
when a certain theoretical measuring point on a workpiece to be measured is measured, the fifth shaft of the machine tool slowly rotates at a detection rotation rate until the measuring head contacts the workpiece and is triggered, the fifth shaft reversely rotates to an original position after the measuring head contacts the workpiece, and meanwhile, the measuring head is lifted and moves to a next measuring position, the operation is repeated, actual measurement data of each measuring point of the workpiece to be measured are obtained, and the actual measurement data of each measuring point are obtained according to the rotation angle of the fifth shaft of the machine tool when the measuring head is triggered.
Preferably, in step S4, the measured data includes three-dimensional coordinates of a measurement point.
The embodiment of the invention provides an on-machine measurement system based on a double-turntable machine tool and triggered by rotation of a turntable, which comprises:
the parameter setting module is used for determining the bus height of the workpiece to be measured based on the size of the workpiece on the 2D drawing of the workpiece to be measured, and setting the measurement parameters according to the bus height;
the theoretical test point calculation module is used for calculating the position of each theoretical measurement point according to the measurement parameters to obtain the distribution of each theoretical measurement point of the workpiece to be measured in the 3D space;
the on-machine test path generation module is used for generating an on-machine measurement path according to the distribution of all theoretical measurement points and processing the on-machine measurement path into an executable measurement program;
and the measured data output module is used for measuring the workpiece to be measured by utilizing the rotation of the fifth shaft of the machine tool according to the measuring program to obtain the measured data of each measuring point of the workpiece to be measured.
The embodiment of the invention also provides electronic equipment, which is characterized by comprising a processor, a memory and a bus system, wherein the processor and the memory are connected through the bus system, the memory is used for storing instructions, and the processor is used for executing the instructions stored by the memory so as to realize the on-machine measurement method based on the double-turntable machine tool and triggered by the rotation of the turntable.
From the above technical scheme, the invention has the following advantages:
the embodiment of the invention provides an on-machine measurement method and system based on a double-turntable machine tool and triggered by turntable rotation, which are used for solving the problem that the existing measurement method cannot plan measurement points under the condition of no 3D model by setting parameters based on a 2D drawing of a workpiece to be measured and calculating theoretical measurement points according to the set parameters, and adding more applicable scenes for on-machine measurement; the invention completes measurement by utilizing the rotation of the fifth shaft of the machine tool, and has higher test efficiency compared with the existing measurement method.
Drawings
For a clearer description of embodiments of the invention or of solutions in the prior art, reference will be made to the accompanying drawings, which are intended to be used in the examples, for a clearer understanding of the characteristics and advantages of the invention, by way of illustration and not to be interpreted as limiting the invention in any way, and from which, without any inventive effort, a person skilled in the art can obtain other figures. Wherein:
FIG. 1 is a schematic diagram of a measurement process of a conventional on-machine measurement method;
FIG. 2 is a flow chart of an on-machine measurement method based on a dual turret machine tool and triggered by turret rotation provided in accordance with an embodiment;
FIG. 3 is a schematic diagram of parameter settings on a 2D drawing of a workpiece to be measured;
FIG. 4 is a schematic diagram of a workpiece to be measured in a 2D layout to 3D space;
FIG. 5 is a distribution of theoretical measurement points of a workpiece to be measured in 3D space;
FIG. 6 is a schematic diagram of a measurement process of any measurement point P on a workpiece to be measured according to the present invention;
fig. 7 is a block diagram of an on-machine measurement system based on a dual turret machine tool and triggered by turret rotation, in accordance with an embodiment.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 2, an embodiment of the present invention provides an on-machine measurement method based on a dual-turntable machine tool and triggered by turntable rotation, the method comprising:
s1: determining the bus height of the workpiece to be measured based on the size of the workpiece on a 2D drawing of the workpiece to be measured, and setting measurement parameters according to the bus height;
s2: calculating the position of each theoretical measuring point according to the measuring parameters to obtain the distribution of each theoretical measuring point of the workpiece to be measured in the 3D space;
s3: generating an on-machine measurement path according to the distribution of each theoretical measurement point, and processing the on-machine measurement path into an executable measurement program;
s4: and according to the measuring program, measuring the workpiece to be measured by utilizing the rotation of the fifth shaft of the machine tool to obtain the measured data of each measuring point of the workpiece to be measured.
The invention provides an on-machine measurement method based on a double-turntable machine tool and triggered by turntable rotation, which solves the problem that the existing measurement method cannot plan measurement points under the condition of no 3D model by setting parameters based on a 2D drawing of a workpiece to be measured and calculating theoretical measurement points according to the set parameters, and adds more applicable scenes for on-machine measurement; the invention completes measurement by utilizing the rotation of the fifth shaft of the machine tool, and has higher test efficiency compared with the existing measurement method.
Further, in step S1, it includes:
as shown in fig. 3, the user determines the height H of the busbar according to the size of the workpiece on the 2D drawing, sets the depth h=1 mm of the first measuring point of the first row from the upper edge of the workpiece and the distance d=5 mm of the first measuring point from the left edge, and the row spacing r=6 mm, the helix angle α=30°, and finally adjusts the number of measuring points of each row to 10 and the total row number to 2, thereby completing the parameter setting, and obtaining a 10×2 imaginary measuring point and rectangular distribution.
Further, in step S2, it includes:
since there is no 3D model, the position of each theoretical measurement point must be calculated back from the parameters described above. On each row, the first measuring point is kept still, from the second measuring point, each measuring point is rotated around the fifth axis by a certain angle (the rotation angle of the measuring points in the same row is increased gradually, and meanwhile, the included angle formed by the position of each measuring point before and after rotation and the first measuring point in the row is close to but not more than the set spiral angle alpha, as shown in fig. 4, when the measuring point P is rotated, the angle PAP' < alpha is required to be met), so that the distribution of all theoretical measuring points in the 3D space, such as two rows of black dots in fig. 5, is obtained.
And (3) generating an on-machine measurement path according to the distribution of the theoretical measurement points obtained in the step S2, and processing the on-machine measurement path into an executable measurement program.
Further, in step S4, it includes:
and when the machine tool executes the obtained measurement program to measure a certain theoretical measurement point on the workpiece to be measured, the fifth shaft of the machine tool slowly rotates at a detection rotation rate until the measuring head contacts the workpiece to be triggered, the fifth shaft reversely rotates to the original position after the measuring head contacts the workpiece, and simultaneously the measuring head is lifted and moves to the next measurement position, and the operation is repeated to obtain the measured data of each measurement point of the workpiece to be measured, wherein the measured data of each measurement point is obtained according to the rotation angle of the fifth shaft of the machine tool when the measuring head is triggered.
Specifically, taking any measuring point P on the workpiece as an example, the right drawing of fig. 6 is a drawing obtained by cutting the left drawing (the cutting plane passes through the measuring point P and is perpendicular to the fifth axis of the machine tool). The measuring head moves to a safety point S from the initial position, then moves to a approaching point A at a fast feeding rate, and then moves to a position of depth d below a bus at a slow feeding rate, namely a waiting point W; then the fifth shaft starts to rotate slowly at the detection rotation rate until the probe contacts the workpiece to be triggered; after the measuring head contacts the workpiece, the fifth shaft reversely rotates to the original position, and meanwhile, the measuring head is lifted and moved to the next measuring position, and the operation is repeated until the measurement of all measuring points is completed.
As shown in table 1 below, the measured coordinates of 20 measurement points of the workpiece to be measured.
As shown in fig. 7, an embodiment of the present invention provides an on-machine measurement system based on a dual turret machine tool and triggered by turret rotation, the system comprising:
the parameter setting module 100 is used for determining the bus height of the workpiece to be measured based on the size of the workpiece on the 2D drawing of the workpiece to be measured, and setting the measurement parameters according to the bus height;
the theoretical test point calculation module 200 is used for calculating the position of each theoretical measurement point according to the measurement parameters to obtain the distribution of each theoretical measurement point of the workpiece to be measured in the 3D space;
an on-machine test path generating module 300, configured to generate an on-machine measurement path according to the distribution of the theoretical measurement points, and process the on-machine measurement path into an executable measurement program;
and the measured data output module 400 is used for measuring the workpiece to be measured by utilizing the rotation of the fifth shaft of the machine tool according to the measuring program to obtain the measured data of each measuring point of the workpiece to be measured.
The system is used for realizing the on-machine measurement method based on the double-turntable machine tool and triggered by the rotation of the turntable, and is not repeated here for avoiding redundancy.
The embodiment of the invention also provides electronic equipment, which comprises a processor, a memory and a bus system, wherein the processor and the memory are connected through the bus system, the memory is used for storing instructions, and the processor is used for executing the instructions stored by the memory so as to realize the on-machine measurement method based on the double-turntable machine tool and triggered by the rotation of the turntable.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
It will be appreciated by those skilled in the art that embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks. These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.

Claims (10)

1. An on-machine measurement method based on a double-turntable machine tool and triggered by turntable rotation, comprising the following steps:
s1: determining the bus height of the workpiece to be measured based on the size of the workpiece on a 2D drawing of the workpiece to be measured, and setting measurement parameters according to the bus height;
s2: calculating the position of each theoretical measuring point according to the measuring parameters to obtain the distribution of each theoretical measuring point of the workpiece to be measured in the 3D space;
s3: generating an on-machine measurement path according to the distribution of each theoretical measurement point, and processing the on-machine measurement path into an executable measurement program;
s4: and according to the measuring program, measuring the workpiece to be measured by utilizing the rotation of the fifth shaft of the machine tool to obtain the measured data of each measuring point of the workpiece to be measured.
2. The on-machine measurement method based on the double-turntable machine tool and triggered by turntable rotation according to claim 1, wherein in step S1, the bus height of the workpiece to be measured is determined based on the 2D drawing of the workpiece to be measured, and the method for setting the measurement parameters according to the bus height comprises the following steps:
firstly, determining the bus height H of a workpiece to be measured based on the size of the workpiece on a 2D drawing of the workpiece to be measured;
setting measurement parameters according to the height H of the bus, wherein the measurement parameters comprise the depth H of a first measurement point of a first row from the upper edge of a workpiece to be measured, the distance d from a left edge, the row spacing r and the helix angle alpha;
finally, the number of measuring points in each row and the total number of rows are adjusted to finish parameter setting, and a pile of false image measuring points are obtained at the moment.
3. The on-machine measurement method based on a double turret machine tool and triggered by the rotation of the turret according to claim 2, characterized in that said set of artefact measurement points is rectangular in distribution.
4. The on-machine measurement method based on the double-turntable machine tool and triggered by turntable rotation according to claim 2, wherein in step S2, the method for calculating the position of each theoretical measurement point according to the measurement parameter to obtain the distribution of each theoretical measurement point of the workpiece to be measured in the 3D space is as follows:
and on each row, keeping the first measuring point motionless, starting from the second measuring point, and rotating each measuring point at a certain angle around a fifth axis to obtain the distribution of all theoretical measuring points of the workpiece to be measured in the 3D space.
5. The on-machine measurement method based on a double turret machine tool and triggered by the rotation of the turret according to claim 4, characterized in that the rotation angle of the measurement points of the same row is incremented.
6. The on-machine measurement method based on the double-turntable machine tool and triggered by the rotation of the turntable according to claim 4, wherein the position before and after each measurement point rotates is close to but not more than the set helix angle alpha with the first measurement point of the row.
7. The on-machine measurement method based on the dual-turntable machine tool and triggered by rotation of the turntable according to claim 1, wherein in step S4, according to the measurement program, the method for measuring the workpiece to be measured by rotation of the fifth axis of the machine tool to obtain the measured data of each measurement point of the workpiece to be measured specifically includes:
when a certain theoretical measuring point on a workpiece to be measured is measured, the fifth shaft of the machine tool slowly rotates at a detection rotation rate until the measuring head contacts the workpiece and is triggered, the fifth shaft reversely rotates to an original position after the measuring head contacts the workpiece, and meanwhile, the measuring head is lifted and moves to a next measuring position, the operation is repeated, actual measurement data of each measuring point of the workpiece to be measured are obtained, and the actual measurement data of each measuring point are obtained according to the rotation angle of the fifth shaft of the machine tool when the measuring head is triggered.
8. The on-machine measurement method based on a dual turret machine tool and triggered by turret rotation according to claim 1, characterized in that in step S4, the measured data comprise three-dimensional coordinates of the measurement points.
9. An on-machine measurement system based on a double-turntable machine tool and triggered by turntable rotation, comprising:
the parameter setting module is used for determining the bus height of the workpiece to be measured based on the size of the workpiece on the 2D drawing of the workpiece to be measured, and setting the measurement parameters according to the bus height;
the theoretical test point calculation module is used for calculating the position of each theoretical measurement point according to the measurement parameters to obtain the distribution of each theoretical measurement point of the workpiece to be measured in the 3D space;
the on-machine test path generation module is used for generating an on-machine measurement path according to the distribution of all theoretical measurement points and processing the on-machine measurement path into an executable measurement program;
and the measured data output module is used for measuring the workpiece to be measured by utilizing the rotation of the fifth shaft of the machine tool according to the measuring program to obtain the measured data of each measuring point of the workpiece to be measured.
10. An electronic device comprising a processor, a memory and a bus system, said processor and memory being connected by the bus system, said memory being adapted to store instructions, said processor being adapted to execute the instructions stored by the memory to implement the on-machine measurement method based on a dual turret machine tool and triggered by turret rotation of any one of claims 1 to 8.
CN202310265629.8A 2023-03-17 2023-03-17 On-machine measurement method and system based on double-turntable machine tool and triggered by turntable rotation Pending CN117245447A (en)

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