CN117242584A - Cavity packaging structure, cavity packaging method and electronic equipment - Google Patents
Cavity packaging structure, cavity packaging method and electronic equipment Download PDFInfo
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- CN117242584A CN117242584A CN202180097631.8A CN202180097631A CN117242584A CN 117242584 A CN117242584 A CN 117242584A CN 202180097631 A CN202180097631 A CN 202180097631A CN 117242584 A CN117242584 A CN 117242584A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 200
- 230000000903 blocking effect Effects 0.000 claims abstract description 39
- 238000009423 ventilation Methods 0.000 claims description 37
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 description 29
- 230000008569 process Effects 0.000 description 22
- 239000012535 impurity Substances 0.000 description 15
- 239000003292 glue Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 5
- 238000012858 packaging process Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present application relates to the field of semiconductor technologies, and in particular, to a cavity packaging structure, a cavity packaging method, and an electronic device. The cavity packaging structure comprises a substrate, a shell and a blocking piece, wherein the substrate is provided with a mounting surface for mounting an electronic device, the shell is mounted on the mounting surface of the substrate, a cavity is formed between the shell and the mounting surface of the substrate, and the electronic device is positioned in the cavity; wherein, be equipped with one or more through-holes on the shell, the shutoff piece matches with one or more through-holes, the shutoff piece is optional opens and shutoff one or more through-holes. The cavity packaging structure can keep the balance between the internal air pressure and the external air pressure of the cavity, thereby improving the packaging effect.
Description
The present application relates to the field of semiconductor technologies, and in particular, to a cavity packaging structure, a cavity packaging method, and an electronic device.
Cavity packages are mainly used for packaging Micro-Electro-Mechanical System (MEMS), radio frequency devices, optical devices and power devices. As shown in fig. 1, the present cavity packaging structure mainly comprises a bottom plate 1, a mounting platform 2 and a packaging shell 3, wherein the packaging shell 3 is connected with the bottom plate 1 through adhesive, the mounting platform 2 is arranged between the packaging shell 3 and the bottom plate 1, and an electronic device is arranged on the mounting platform 2. However, in the above process, the glue has a curing process after the package shell 3 is connected with the bottom plate 1, and the curing process generates heat, so that the gas in the cavity formed by the package shell 3 and the bottom plate 1 is heated and expanded, and the air pressure in the cavity is further increased, and the connection part between the package shell 3 and the bottom plate 1 is easy to tilt under the action of pressure, so that the packaging effect is poor.
Disclosure of Invention
The application provides a cavity packaging structure, which can keep the balance between the internal air pressure and the external air pressure of the cavity structure and improve the packaging effect.
In a first aspect, an embodiment of the present application provides a cavity packaging structure, including a substrate, a housing, and a blocking member, where the substrate has a mounting surface, the mounting surface is used for mounting an electronic device, the housing is mounted on the mounting surface of the substrate, a cavity is formed between the housing and the mounting surface of the substrate, and the electronic device is located in the cavity; the shell is provided with one or more through holes and a plugging piece matched with the one or more through holes, wherein the plugging piece is of a detachable structure. In the process of connecting the shell on the substrate in a bonding manner, the shell is required to be fixed on the substrate through baking and solidification, heat is generated during baking and solidification, the heat can heat the cavity, then the air pressure in the cavity formed between the shell and the mounting surface of the substrate is increased, when the air pressure in the cavity is larger than the external air pressure, the plugging piece is not matched with one or more through holes, the one or more through holes are in an opened state, and the air in the cavity can be discharged to the outside of the cavity through the through holes, so that the air pressure in the cavity and the air pressure in the outside are balanced, and the stability of connection between the shell and the substrate is improved. When the air pressure in the cavity is smaller than or equal to the air pressure outside, the plugging piece is arranged at one or more through holes to plug the one or more through holes, so that impurities are prevented from entering the cavity, electronic devices in the cavity are prevented from being polluted, and the working stability of the electronic devices is improved. In addition, after the shell is connected to the mounting surface of the substrate, the substrate is fixed on the main board in a reflow soldering mode, and during reflow soldering, a temperature curve is set in the reflow oven, so that a rapid heating process is provided during reflow soldering, gas in the cavity is heated and expanded in the heating process, the gas pressure in the cavity is also increased, at the moment, the plugging piece can be detached from one or more through holes, one or more through holes are opened, the gas in the cavity can be discharged to the outside through the through holes, and the gas pressure inside and outside the cavity is balanced, so that the stability of connection between the shell and the substrate is ensured.
It should be noted that, a plurality of mounting areas may be formed on the mounting surface of the substrate, and each mounting area may be mounted with an electronic device, and each mounting area is correspondingly connected with a housing. The arrangement mode can improve the packaging efficiency of the electronic device.
In one possible embodiment, the housing may include a side plate and a top plate, the top plate and the side plate may be integrally injection molded, and a side of the side plate away from the top plate is connected to the mounting surface of the base plate, and one or more through holes may be provided in the top plate. Since the top plate is located on the side away from the substrate, the through holes are also located on the side away from the substrate.
The side plate may be provided with one or more through holes, so long as the air pressure inside the cavity is greater than the air pressure outside the cavity, and the air inside the cavity may be discharged to the outside of the cavity through the blocking member and the one or more through holes. In addition, the projection of the one or more vias onto the substrate mounting surface does not overlap with the projection of the electronic device onto the substrate mounting surface (i.e., the vias are not located above the electronic device). When the plugging piece is damaged, impurities entering the cavity through the through hole can not quickly pollute the electronic device and important wiring on the substrate.
In one possible embodiment, the through hole provided on the housing may have various structural forms, for example: the aperture of the through hole gradually decreases from the direction away from the cavity to the direction close to the cavity (i.e. the cross section of the through hole can be conical); alternatively, the cross section of the through hole may be arranged in a step shape from the side far from the cavity to the side of the cavity (wherein the number of steps of the step-shaped through hole may be specifically two, three or four, etc.); alternatively, the through-hole cross-section may be rectangular.
In the above embodiments, the blocking member may be provided as a rubber stopper or a bolt. And when the plugging piece is the rubber plug, from one end of the through hole far away from the cavity to one end of the through hole close to the cavity, the aperture of the through hole can be gradually reduced (namely, the through hole is a conical hole), and the plugging piece (the rubber plug) can also be arranged into a shape (conical shape) matched with the through hole (the conical hole). In order to make the stability and the tightness of the connection between the blocking piece (rubber plug) and the through hole higher, an interference fit (i.e. the dimension of the outer contour of the blocking piece is larger than the dimension of the inner diameter of the through hole) can be adopted between the blocking piece (rubber plug) and the through hole. In addition, when the plugging piece is a rubber plug, the through hole can also be a stepped hole, and the outer contour of the plugging piece can also be a step shape at the moment, so that the plugging piece can be matched with the stepped through hole. In order to improve the tightness of the sealing piece matched with the through holes arranged in a stepped mode, the sealing piece is in interference fit with the through holes arranged in the stepped mode. Moreover, when the plugging piece is a rubber plug, the through hole can also be a rectangular hole, and the plugging piece and the through hole are in interference fit so as to ensure the tightness of connection between the plugging piece and the through hole.
When the blocking member is a bolt, the shape of the cross section of the through hole may be a tapered hole, a stepped hole, or a rectangular hole. And still need be provided with on the through-hole with bolt complex screw thread to make the bolt can fasten on the shell, in order to improve the compactness after bolt and shell are connected, can be provided with sealed the pad between bolt and shell, in order to guarantee the leakproofness of being connected between bolt and the shell.
In the specific implementation process, when the shell is adhered to the substrate through glue and the substrate is connected to the main board through reflow soldering, the blocking piece (the rubber plug or the bolt) needs to be removed from the through hole, so that the through hole is in an opened state, the shell is connected to the substrate and the substrate is welded to the main board, and the air pressure in the cavity formed by the shell and the substrate can be discharged through the through hole after being increased.
It should be noted that after the shell is adhered to the substrate through glue and the substrate is connected to the main board through reflow soldering, the through hole can be sealed in a glue dispensing operation mode, at this time, the shape of the through hole can be in a step shape, so that the adhesive surface area of the glue and the hole wall is increased, and good adhesive strength and sealing effect are ensured.
In a second aspect, an embodiment of the present application provides a cavity packaging structure, including a substrate, a housing, and a housing having elasticity, where the substrate has a mounting surface, the mounting surface is used for mounting an electronic device, the housing is mounted on the mounting surface of the substrate, a cavity is formed between the housing and the mounting surface of the substrate, and the electronic device is located in the cavity; wherein, be equipped with one or more through-holes on the shell, the housing is located the outside of shell to cover one or more through-holes and one or more through-hole peripheral region. In the specific implementation process, the housing can be sleeved on the housing before the housing is adhered to the substrate through glue, and the housing is sleeved on the housing when the substrate is connected to the main board through reflow soldering, so that the probability that external impurities enter the cavity through the through holes is reduced, and the housing is adhered to the substrate and the main board through reflow soldering through glue, gas in the cavity formed between the housing and the substrate is heated and expanded, the gas pressure is increased, the gas in the cavity can enter the housing through the through holes, the housing is deformed, the gas pressure in the cavity is released, the gas pressure in the cavity and the external environment is balanced, and the stability of connection of the substrate and the housing is ensured.
It should be noted that the casing may be a waterproof elastic sleeve or a waterproof elastic film, and the size of the opening of the casing is smaller than that of the housing, so that the casing and the housing are in interference fit when the casing is sleeved on the housing.
In one possible embodiment, the housing may include a side plate and a top plate, the top plate and the side plate may be integrally injection molded, and a side of the side plate away from the top plate is connected to the mounting surface of the base plate, and one or more through holes may be provided in the top plate. Since the top plate is located on the side away from the substrate, the through holes are also located on the side away from the substrate.
The side plate may be provided with one or more through holes, so long as the air pressure inside the cavity is greater than the air pressure outside the cavity, and the air inside the cavity may be discharged to the outside of the cavity through the blocking member and the one or more through holes. In addition, the projection of the one or more vias onto the substrate mounting surface does not overlap with the projection of the electronic device onto the substrate mounting surface (i.e., the vias are not located above the electronic device). When the housing is damaged, impurities entering the cavity through the through hole can not quickly pollute the electronic device and important wiring on the substrate.
In one possible embodiment, the through hole provided on the housing may have various structural forms, for example: the aperture of the through hole gradually decreases from the direction away from the cavity to the direction close to the cavity (i.e. the cross section of the through hole can be conical); alternatively, the cross section of the through hole may be arranged in a step shape from the side far from the cavity to the side of the cavity (wherein the number of steps of the step-shaped through hole may be specifically two, three or four, etc.); alternatively, the through-hole cross-section may be rectangular.
In the above embodiment, the cover includes a top cover that covers the top plate and a side cover that covers the side plate, the top cover and the side cover covering the one or more through holes and the area around the through holes.
In a third aspect, an embodiment of the present application provides a cavity packaging structure, including a substrate, a housing, and a unidirectional ventilation valve, where the substrate has a mounting surface, the mounting surface is used for mounting an electronic device, the housing is mounted on the mounting surface of the substrate, a cavity is formed between the housing and the mounting surface of the substrate, and the electronic device is located in the cavity; wherein, be equipped with one or more through-holes on the shell, one-way breather valve installs in one or more through-holes. When the shell is adhered to the substrate through glue and the substrate is connected to the main board through reflow soldering, gas in a cavity formed between the shell and the substrate is heated and expanded, the air pressure in the cavity is increased, and the gas in the cavity can be discharged into the cavity through the one-way ventilation valve; and when the air pressure outside the cavity is greater than the air pressure in the cavity, the one-way ventilation valve is in a closed state, so that impurities can not enter the cavity, and the packaging reliability is improved.
In one possible embodiment, the housing may include a side plate and a top plate, the top plate and the side plate may be integrally injection molded, and a side of the side plate away from the top plate is connected to the mounting surface of the base plate, and one or more through holes may be provided in the top plate. Since the top plate is located on the side away from the substrate, the through holes are also located on the side away from the substrate.
The side plate may be provided with one or more through holes, so long as the air pressure inside the cavity is greater than the air pressure outside the cavity, and the air inside the cavity may be discharged to the outside of the cavity through the blocking member and the one or more through holes. In addition, the projection of the one or more vias onto the substrate mounting surface does not overlap with the projection of the electronic device onto the substrate mounting surface (i.e., the vias are not located above the electronic device). When the unidirectional ventilation valve is damaged, the impurities entering the cavity through the through hole can not quickly pollute the electronic device and the important wiring on the substrate.
In a fourth aspect, the present application also provides a cavity packaging method, including the steps of:
arranging an electronic device on the surface of a substrate;
adhering a housing having one or more through holes to a surface of the substrate by adhesive, wherein the electronic device is located in a cavity formed by the housing and the substrate;
The blocking member is removably mounted to the one or more through holes.
Specifically, by adopting the method, the stability of connection between the shell and the substrate can be improved, and the packaging reliability can be improved.
In one possible embodiment, the blocking member may be a bolt or a rubber plug, and when the blocking member is a bolt or a rubber plug, it is necessary to wait until the housing is adhered to the substrate and the curing is completed, i.e. wait for each element to cool, and when the air pressure inside the cavity is balanced with the air pressure outside the cavity, one or more through holes are blocked. That is, in this case, the case is adhered to the substrate by the adhesive, and at least one through hole on the case needs to be maintained in an opened state during the curing of the adhesive.
In a fifth aspect, the present application further provides a cavity packaging method, including the steps of:
arranging an electronic device on the surface of a substrate;
adhering a housing having one or more through holes to a surface of the substrate by adhesive, wherein the electronic device is located in a cavity formed by the housing and the substrate;
a cover having elasticity is fitted over the outside of the case, and covers the one or more through holes and the area around the one or more through holes.
Specifically, by adopting the method, the stability of connection between the shell and the substrate can be improved, and the packaging reliability can be improved. In addition, the cover can be sleeved on the outer side of the shell all the time, so that the packaging process can be simplified.
In one possible embodiment, the housing includes a top cover overlying the top plate of the housing and a side cover connected to the top cover, the side cover overlying the side plate of the housing, the top cover and the side cover overlying the one or more through holes.
In a sixth aspect, the present application further provides a cavity packaging method, including the steps of:
arranging an electronic device on the surface of a substrate;
adhering a housing having one or more through holes to a surface of the substrate by adhesive, wherein the electronic device is located in a cavity formed by the housing and the substrate;
and installing a one-way ventilation valve in the one or more through holes.
Specifically, by adopting the method, the stability of connection between the shell and the substrate can be improved, and the packaging reliability can be improved. In addition, according to the characteristic of the unidirectional ventilation valve, the unidirectional ventilation valve can be always arranged in the through hole, and the packaging process can be simplified.
In a seventh aspect, the present application further provides an electronic device, including a printed circuit board and a cavity package structure in any of the above-mentioned technical solutions. The electronic equipment adopting the cavity packaging structure has higher working reliability.
FIG. 1 is a schematic diagram of a prior art cavity package structure;
fig. 2 is a schematic structural diagram of a cavity package structure according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a cavity package structure mounted on a motherboard according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a cavity package structure according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a cavity package structure according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of a cavity package structure according to an embodiment of the present application when two through holes are provided;
fig. 7 is a schematic structural diagram of a cavity package structure according to an embodiment of the present application when two through holes are provided;
fig. 8 is a schematic structural diagram of a cavity package structure according to an embodiment of the present application when two through holes are provided;
fig. 9a is a top view of a cavity package structure according to an embodiment of the present application;
FIG. 9b is a side view of FIG. 9 a;
fig. 10 is a schematic structural diagram of another cavity package structure according to an embodiment of the present application;
fig. 11 is a schematic structural diagram of another cavity package structure according to an embodiment of the present application when two through holes are provided;
Fig. 12a is a schematic structural diagram of another cavity package structure according to an embodiment of the present application;
FIG. 12b is a top view of portion A of FIG. 12 a;
fig. 13 is a schematic structural diagram of another cavity package structure according to an embodiment of the present application when two through holes are provided;
fig. 14 is a schematic structural diagram of another cavity package structure according to an embodiment of the present application when two through holes are provided;
FIG. 15 is a flowchart illustrating steps of a cavity packaging method according to an embodiment of the present application;
FIG. 16 is a flowchart illustrating steps of a cavity packaging method according to another embodiment of the present application;
fig. 17 is a flowchart illustrating steps of another cavity packaging method according to an embodiment of the present application.
Icon: 1-a bottom plate; 2-a mounting platform; 3-packaging the shell; 10-a substrate; 11-an installation area; 20-a housing; 21-a through hole; 22-top plate; 23-side plates; 30-a closure; 40-cavity; 50-an electronic device; 60-a main board; 70-housing; 80-one-way ventilation valve.
Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include, for example, "one or more" such forms of expression, unless the context clearly indicates to the contrary.
Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.
With the rapid development of the semiconductor industry, the packaging application of electronic devices is also becoming more and more widespread, wherein the packaging of electronic devices can prevent impurities in the external environment from polluting the electronic devices, improve the reliability of the operation of the electronic devices, and prolong the service life of the electronic devices. Specifically, the electronic device may be a diode, a triode, a chip, or the like. However, in the prior art, in the packaging process of the electronic device, a pressure difference is generated between the air pressure inside the cavity packaging structure and the air pressure outside the cavity packaging structure, and the strength of the bonding portion in the cavity packaging structure cannot bear the generated pressure difference, which may result in lower packaging efficiency and reliability.
Referring to fig. 2 and 3, the cavity packaging structure provided by the embodiment of the application includes a substrate 10, a housing 20 and a blocking piece 30, the substrate 10 has a mounting surface, the housing 20 is mounted on the mounting surface of the substrate 10, a cavity 40 is formed between the housing 20 and the mounting surface of the substrate 10, one or more electronic devices 50 are accommodated in the cavity 40, and the one or more electronic devices 50 can be mounted on the mounting surface of the substrate 10, wherein one or more through holes 21 and the blocking piece 30 matched with the one or more through holes 21 are provided on the housing 20, and the blocking piece 30 is a detachable structure. Specifically, the housing 20 may be connected to the substrate 10 by means of bonding, and when the housing 20 is bonded to the substrate 10 by means of glue, it is necessary to cure the housing 20 by baking, so that the housing 20 is fixed to the substrate 10, heat is generated during baking and curing, the generated heat heats the cavity 40, and further, the air pressure in the cavity 40 formed between the housing 20 and the mounting surface of the substrate 10 is increased, so that the air pressure in the cavity 40 is greater than the air pressure outside the cavity 40, at this time, the blocking member 30 is detached from the one or more through holes 21, so that the one or more through holes 21 are in an open state, and the air in the cavity 40 is exhausted to the outside of the cavity 40 through the blocking member 30 and the one or more through holes 21, so as to ensure that the air pressure in the cavity 40 is in a balanced state with the outside of the cavity 40, further, improve the stability of the connection between the housing 20 and the substrate 10, thereby reduce the requirement of the connection strength between the housing 20 and the substrate 10, and prevent the housing 20 from tilting. In addition, when the air pressure inside the cavity 40 is balanced with the air pressure outside the cavity 40 and the respective components are cooled, the blocking member 30 blocks the one or more through holes 21 to prevent impurities from entering the cavity 40, and prevent one or more electronic devices 50 and other wires in the cavity 40 from being contaminated, thereby improving the reliability of the electronic devices. In a specific implementation process, the substrate 10 is further required to be mounted on the motherboard 60, and the substrate 10 is specifically fixed on the motherboard 60 by means of reflow soldering, and during reflow soldering, a temperature curve is set in the reflow oven, so that a rapid heating process is provided during reflow soldering, and the heating process can cause the gas in the cavity 40 to expand due to heating, so that the gas pressure in the cavity 40 is increased, at this time, the gas in the cavity 40 can also be discharged to the outside of the cavity 40 through the through hole 21, so that the gas pressure inside and outside the cavity 40 is kept balanced, and the stability of the connection between the housing 20 and the substrate 10 is ensured.
When the substrate 10 is fixed to the main board 60 by reflow soldering, the blocking member 30 is detached from the through hole 21 so that the gas in the cavity 40 is discharged to the outside of the cavity 40 through the through hole 21.
In a possible embodiment, with continued reference to fig. 2 and 3, the mounting surfaces of the housing 20 and the substrate 10 may be connected together by welding, and when the housing 20 and the substrate 10 are connected by welding, the air pressure in the cavity 40 formed between the housing 20 and the mounting surface of the substrate 10 may also increase, and at this time, the through hole 21 may also exhaust the air inside the cavity 40 to the outside of the cavity 40. The housing 20 and the base 10 may also be connected by other means not illustrated here.
In one possible embodiment, with continued reference to fig. 2, the housing 20 may include a top plate 22 and a side plate 23, the top plate 22 and the side plate 23 may be integrally formed, and the side plate 23 may be perpendicularly attached to the mounting surface. The top plate 22 and the side plate 23 may be bonded together by adhesion. One or more through holes 21 may be provided in the top plate 22, since the top plate 22 is located on the side remote from the mounting surface, i.e. the through holes 21 are also remote from the mounting surface; wherein the projection of the through holes 21 on the mounting surface does not overlap with the projection of the one or more electronic devices 50 and the tracks provided on the mounting surface. In this way, when the blocking member 30 for blocking the through hole 21 is damaged, the probability of impurities entering the cavity 40 through the through hole 21 falling onto the one or more electronic devices 50 and onto the wiring is reduced.
In addition, one or more through holes 21 (not shown in fig. 2) may be provided in the side plate 23. Specifically, the through hole 21 may be provided on the side of the side plate 23 away from the substrate 10, the electronic device 50, and the wiring, as long as the gas inside the cavity 40 can be discharged to the outside of the cavity 40 through the through hole 21 when the gas pressure inside the cavity 40 is greater than the gas pressure outside the cavity 40.
In one possible embodiment, the through hole 21 may have various structural forms, for example: the aperture of the through-hole 21 may be gradually reduced from the side away from the cavity 40 to the side of the cavity 40 (i.e., the cross-section of the through-hole 21 may be tapered); alternatively, the cross section of the through hole 21 may be arranged in steps from the side away from the cavity 40 to the side of the cavity 40 (not shown in fig. 2, and the number of steps of the stepped through hole may be two, three, four, or the like); alternatively, the through-hole 21 may be rectangular in cross-section (not shown in fig. 2). The through holes 21 may also take other forms, which are not illustrated here.
In the above embodiment, taking the case where the through hole 21 is one as an example, and one through hole 21 is located in the top plate, the blocking member 30 may be of various types, for example: the blocking member 30 may be a rubber stopper or a bolt; when the blocking member 30 is a rubber stopper, in order to make the stability and the tightness of the connection between the rubber stopper and the through hole 21 higher, the rubber stopper and the through hole 21 may be in interference fit to ensure the tightness of the cavity 40. Specifically, with continued reference to fig. 2, the through hole 21 may be configured as a stepped hole, and the number of steps of the stepped hole may be selected according to the specific situation, at this time, the plugging member 30 implemented by the rubber plug may also be configured in a stepped manner, and in order to make the stability and the tightness of the connection between the rubber plug and the through hole 21 higher, at least one step of the rubber plug configured in a stepped manner may be in interference fit with a corresponding portion of the through hole 21, where the interference fit is that the outer diameter of the component engaged with the hole is larger than the inner diameter of the hole. In addition, referring to fig. 4, the through hole 21 may be provided in a tapered shape, that is, from an end of the through hole 21 away from the substrate 10 to an end of the through hole 21 near the substrate 10, the aperture of the through hole 21 may be gradually reduced, and in order to make the suitability of the stopper 30 implemented by the rubber stopper with the through hole 21 higher, the form of the rubber stopper may be set to be the same as the shape of the through hole 21, and the outer contour size of the rubber stopper is larger than the aperture of the through hole 21, so as to ensure an interference fit between the rubber stopper and the through hole 21. The through hole 21 may be a rectangular cross section, and in this case, the cross section of the rubber plug may be rectangular, so long as the cross section size of the rubber plug is slightly larger than the cross section aperture of the through hole 21, so as to ensure interference fit between the rubber plug and the through hole 21.
In a specific implementation process, when the housing 20 is adhered to the substrate 10 and cured by baking and the substrate 10 is connected to the motherboard 60 by reflow soldering, heat is generated during the connection process, so that the air pressure in the cavity 40 formed between the substrate 10 and the housing 20 is increased, in order to ensure the same air pressure in the cavity 40 as the air pressure outside the cavity 40, the sealing member 30 needs to be detached from the through hole 21, so that the through hole 21 is in an open state, the housing 20 is ensured to be adhered to the substrate 10 by glue, and the housing 20 is fixed to the substrate 10 by baking and cured and the air pressure in the cavity 40 formed between the housing 20 and the substrate 10 is increased and can be discharged through the through hole 21 during the process of connecting the substrate 10 to the motherboard 60 by reflow soldering.
Referring to fig. 5, when the blocking member 30 is a bolt, in order to make the stability and sealability of the connection between the bolt and the through hole 21 higher, a gasket (not shown in fig. 5) may be provided at a side of the bolt contacting the through hole 21, and a screw thread engaged with the bolt may be provided at the through hole 21 so that the bolt may be fastened to the case 20, and also the sealability of the connection between the bolt and the case 20 may be ensured so that the cavity 40 formed by the case 20 and the substrate 10 may be a closed space. Specifically, the through hole 21 may be a rectangular hole (rectangular in cross section), and in this case, a screw may be provided on any one section of the rectangular hole to tightly attach the bolt to the housing 20. The through hole 21 may also be provided as a stepped hole (not shown in fig. 5), and the number of steps of the stepped hole may be selected according to circumstances, and a thread may be provided on a side of the stepped hole near the substrate 10.
In a specific implementation process, during the process of bonding the housing 20 to the substrate 10 and baking and curing, and during the process of connecting the substrate 10 to the motherboard 60 by reflow soldering, heat is generated during the connection process, so that the air pressure in the cavity 40 formed between the substrate 10 and the housing 20 is increased, in order to ensure the stability of the connection between the substrate 10 and the housing 20, the bolts need to be detached from the through holes 21, so that the through holes 21 are in an opened state, and in the process of bonding the housing 20 to the substrate 10 by glue and connecting the substrate 10 to the motherboard 60 by reflow soldering, the air pressure in the cavity 40 formed between the housing 20 and the substrate 10 can be discharged through the through holes 21 after being increased, so that the air pressure inside the cavity 40 is balanced with the air pressure outside the cavity 40.
In one embodiment, referring to fig. 6, taking an example that the number of through holes 21 is two, and two through holes 21 may be provided in the top plate 22 and the side plate 23, respectively, the type of the plugging member 30 may be various, for example: the closure 30 may be a rubber stopper or a bolt. Specifically, when the stopper 30 provided on one of the two through holes 21 is a rubber stopper, the stopper 30 provided on the other through hole 21 may be a rubber stopper. At this time, in order to make the stability and the sealability of the connection between the through hole 21 and the rubber stopper higher, the rubber stopper and the through hole 21 may be interference fit to ensure the sealability of the cavity 40. In addition, the specific shape of the two through holes 21 may be stepped holes, and in order to improve the suitability of the rubber stopper with the through holes 21, the two rubber stoppers may be stepped. Referring to fig. 7, the specific shapes of the two through holes 21 may be tapered, that is, the hole diameters of the through holes 21 may be gradually reduced from the end of the through holes 21 away from the cavity 40 to the end of the through holes 21 near the cavity 40, and the shapes of the two rubber stoppers (stopper 30) may be tapered to improve the adaptability of the rubber stoppers to the through holes 21. The two through holes 21 may be rectangular holes (rectangular in cross section), and the rubber plugs may be rectangular plugs. The shapes of the two through holes 21 may be different, and specifically, any combination of rectangular holes, stepped holes and tapered holes may be used, and at this time, the rubber stopper is changed according to the shape change of the through holes, so long as the interference fit between the rubber stopper and the through holes 21 is ensured.
With continued reference to fig. 6 and 7, when the case 10 is adhered to the substrate 10 by glue and the substrate 10 is connected to the main board 60 by reflow soldering, the air pressure in the cavity 10 formed between the substrate 10 and the case 20 may be increased, and in order to ensure the stability of the connection between the substrate 10 and the case 20, two rubber plugs may be detached from the through holes 21 together or one of the two rubber plugs may be detached from the through holes 21, so as to ensure that the air pressure inside the cavity 40 formed between the case 20 and the substrate 10 may be discharged through one or both through holes 21 after the air pressure inside the cavity 40 is increased during the connection of the case 10 to the substrate 10 and the substrate 10 to the main board 60 by reflow soldering, so that the air pressure inside the cavity 40 is balanced with the air pressure outside the cavity 40.
Referring to fig. 8, when the blocking member 30 provided on one of the two through holes 21 is a rubber stopper and the blocking member 30 provided on the other through hole 21 is a bolt, the cross-sectional shape of the through hole 21 mated with the rubber stopper may be provided as a tapered hole, a rectangular hole or a stepped hole, the shape of the through hole 21 mated with the bolt may be a rectangular hole or a stepped hole, a screw thread mated with the bolt is provided on the rectangular hole or the stepped hole, and the bolt may be provided with a gasket on the outer side of the side plate 23 or the top plate 22 when mated with the through hole 21, so that the connection tightness between the bolt and the casing 20 is ensured when the bolt is tightly connected to the casing 20, and the cavity 40 formed between the casing 20 and the substrate 10 may be a closed space. When the housing 20 is connected with the substrate 10 and the substrate 10 is connected to the motherboard by reflow soldering, the air pressure in the housing 20 and the cavity 40 is increased in the soldering process, so that in order to ensure that the air pressure in the cavity 40 and the air pressure outside the cavity 40 are balanced, the bolts and the rubber plugs can be detached from the through holes 21, or one of the bolts and the rubber plugs is detached from the through holes 21, so that when the air pressure in the cavity 40 is increased, the air in the cavity 40 can be discharged to the outside of the cavity 40 through the through holes 21, and the air pressure in the cavity 40 and the air pressure outside the cavity 40 are balanced.
When the blocking member 30 provided in one of the two through holes 21 is a bolt, the blocking member 30 provided in the other through hole 21 may be a bolt, and in this case, a gasket may be provided between the bolt and the housing 20 in order to ensure the connection tightness between the bolt and the through hole. In addition, after the housing 20 is to be connected to the substrate 10 and the substrate 10 is connected to the motherboard by reflow soldering, the through holes 21 may be plugged by dispensing.
In one possible embodiment, referring to fig. 9a and 9b, there may be a plurality of mounting areas 11 on the mounting surface of the substrate 10, each mounting area 11 may be correspondingly connected to one housing 20, each housing 20 has one or more through holes 21, each housing 20 is provided with a plugging member 30 matched with the through holes, and one or more electronic devices may be mounted in a cavity 40 formed by each housing 20 and its corresponding mounting area 11. The arrangement mode can improve the packaging efficiency of the electronic device.
Referring to fig. 10, the application embodiment provides a cavity package structure, which includes a substrate 10, a housing 20 and a casing 70, the substrate 10 has a mounting surface, the housing 20 is mounted on the mounting surface of the substrate 10, a cavity 40 is formed between the housing 20 and the mounting surface of the substrate 10, one or more electronic devices 50 are accommodated in the cavity 40, and one or more electronic devices 50 can be mounted on the mounting surface of the substrate 10, wherein one or more through holes 21 are provided on the housing 20, the casing 70 is located on the outer side of the housing 20, and the one or more through holes 21 and a region around the one or more through holes 21 are covered. In the specific implementation process, the cover shell 70 may be sleeved on the shell 20 before the shell 20 is adhered to the substrate 10 by glue, and also sleeved on the shell 20 when the substrate 10 is connected to the motherboard 60 by reflow soldering, so as to reduce the probability of external impurities entering the cavity 40 through the through holes 21, and when the shell 20 is connected to the substrate 10 and the substrate 10 is connected to the motherboard 60 by reflow soldering, the gas in the cavity 40 formed between the shell 20 and the substrate 40 is heated and expanded, the gas pressure is increased, the gas in the cavity 40 can enter the cover shell 70 through the through holes 21, and deform the cover shell 70, thereby releasing the gas pressure in the cavity 40, and balancing the gas pressure in the cavity 40 and the external environment, so as to ensure the connection stability of the substrate 10 and the shell 20.
It should be noted that, the casing 70 may be a waterproof elastic sleeve or a waterproof sleeve, and the aperture of the opening of the casing is smaller than that of the casing 20, so that when the casing is sleeved on the casing 20, the casing and the casing 20 are in interference fit, so that the casing and the casing 20 are tightly matched, and the tightness is improved.
With continued reference to fig. 10, the housing 20 may include a top plate 22 and a side plate 23, the top plate 22 and the side plate 23 may be integrally formed, and the side plate 23 may be perpendicularly connected to the mounting surface. The top plate 22 and the side plate 23 may be bonded together by adhesion. One or more through holes 21 may be provided in the top plate 22, since the top plate 22 is located on the side remote from the mounting surface, i.e. the through holes 21 are also remote from the mounting surface; wherein the projection of the through holes 21 on the mounting surface does not overlap with the projection of the one or more electronic devices 50 and the tracks provided on the mounting surface. In this way, when the casing 70 for blocking the through-hole 21 is damaged, the probability of impurities entering the cavity 40 through the through-hole 21 falling onto the one or more electronic devices 50 and onto the wiring is reduced.
In addition, one or more through holes 21 (not shown in fig. 10) may be provided in the side plate 23. Specifically, the through hole 21 may be provided on the side of the side plate 23 away from the substrate 10, the electronic device 50, and the wiring, as long as the gas inside the cavity 40 can be discharged to the outside of the cavity 40 through the through hole 21 when the gas pressure inside the cavity 40 is greater than the gas pressure outside the cavity 40.
The cover 70 may include a top cover and a side cover integrally formed, referring to fig. 11, when the number of through holes 21 is two, the top cover covers the top plate of the housing 20, the side cover covers the side plate of the housing 20, the top cover covers one through hole 21 provided in the top plate, the side cover covers one through hole 21 provided in the side plate, and the side cover extends toward the substrate 10 to cover an area around one through hole 21 provided in the side plate; wherein the through holes 21 provided on the side plates 23 are located at a side close to the top plate 23, the cover 70 may have elasticity in order to make the tightness between the cover 70 and the housing 20 better when the cover 70 covers the two through holes 21. In a specific implementation process, the casing 70 may be sleeved on the housing 20 all the time, so as to reduce the probability of external impurities entering the cavity 40 through the through holes 21, and when the housing 20 is connected to the substrate 10 and the substrate 10 is connected to the motherboard 60 through reflow soldering, the gas in the cavity 40 formed between the housing 20 and the motherboard 40 is heated and expanded, the gas pressure is increased, the gas in the cavity 40 enters the casing through the two through holes 21, and deforms the casing, so as to release the gas pressure in the cavity 40, and balance the gas pressure in the cavity 40 and the gas pressure outside the cavity 40, so as to ensure the connection stability of the substrate 10 and the housing 20.
It should be noted that, by adopting the housing 70 to cooperate with the through hole 21, the process of connecting the substrate 10 to the motherboard 60 can be saved, and the soldering step can be simplified. The shape of the through hole 21 may be any shape, and is not limited herein.
Referring to fig. 12a and 12b, an embodiment of the application provides a cavity package structure, including a substrate 10, a housing 20, and a unidirectional ventilation valve 80, where the substrate 10 has a mounting surface, the housing 20 is mounted on the mounting surface of the substrate 10, and a cavity 40 is formed between the housing 20 and the mounting surface of the substrate 10, the cavity 40 is used for accommodating one or more electronic devices 50, and the one or more electronic devices 50 may be mounted on the mounting surface of the substrate 10, where one or more through holes 21 are provided on the housing 20, and the unidirectional ventilation valve 80 is mounted in the one or more through holes 21. When the case 10 is adhered to the substrate 10 by glue and the substrate 10 is connected to the motherboard by reflow soldering, the gas in the cavity 40 formed between the case 20 and the substrate 10 is expanded by heat, the gas pressure in the cavity 40 increases, and the gas in the cavity 40 can be discharged into the cavity 40 through the unidirectional ventilation valve 80 according to the characteristics of the unidirectional ventilation valve 80; and when the air pressure outside the cavity 40 is greater than or equal to the air pressure in the cavity 40, the unidirectional ventilation valve 80 is in a closed state, so that impurities can not enter the cavity 40, and the packaging reliability is improved. In addition, the unidirectional ventilation valve 80 is also arranged on the through hole 21 in the process that the shell 20 is connected with the substrate 10 and the substrate 10 is connected with the main board through reflow soldering, and the unidirectional ventilation valve 80 does not need to be disassembled, so that the packaging efficiency can be further improved.
It is necessary to have a life span that the through-hole 21 may be provided as a stepped hole in order to facilitate the installation of the one-way ventilation valve 80 in the through-hole 21.
With continued reference to fig. 12a, the housing 20 may include a top plate 22 and a side plate 23, the top plate 22 and the side plate 23 may be integrally formed, and the side plate 23 may be perpendicularly connected to the mounting surface. The top plate 22 and the side plate 23 may be bonded together by adhesion. One or more through holes 21 may be provided in the top plate 22, since the top plate 22 is located on the side remote from the mounting surface, i.e. the through holes 21 are also remote from the mounting surface; wherein the projection of the through holes 21 on the mounting surface does not overlap with the projection of the one or more electronic devices 50 and the tracks provided on the mounting surface. In this way, when the one-way ventilation valve 80 for blocking the through-hole 21 is damaged, the probability of impurities entering the cavity 40 through the through-hole 21 falling onto the one or more electronic devices 50 and onto the wiring is reduced.
In addition, one or more through holes 21 (not shown in fig. 12 a) may also be provided in the side plate 23. Specifically, the through hole 21 may be provided on the side of the side plate 23 away from the substrate 10, the electronic device 50, and the wiring, as long as the gas inside the cavity 40 can be discharged to the outside of the cavity 40 through the through hole 21 when the gas pressure inside the cavity 40 is greater than the gas pressure outside the cavity 40.
The number of through holes 21 may be one, two, three, or the like, and when the number of through holes 21 is one, the through holes 21 may be provided in the side plate 23 or the top plate 22. Referring to fig. 13, when two through holes 21 are provided, and the one-way ventilation valves 80 are provided in both through holes 21, both through holes 21 may be provided as stepped holes in order to allow the one-way ventilation valves 80 to be more conveniently mounted on the housing 20. When the housing 20 is connected to the substrate 10 and the substrate 10 is welded to the motherboard, the gas inside the cavity 40 formed between the housing 20 and the substrate 10 is heated to expand, the gas pressure increases, and the gas inside the cavity 40 can be discharged to the outside of the cavity 40 through the two unidirectional ventilation valves 80 due to the characteristics of the unidirectional ventilation valves 80; and when the air pressure outside the cavity 40 is greater than the air pressure inside the cavity 40, the unidirectional ventilation valve is in a closed state, so that impurities can not enter the cavity 40, and the reliability of the electronic device can be improved.
It should be noted that, the two unidirectional ventilation valves 80 can accelerate the balance of the air pressure inside and outside the cavity 40, and when one unidirectional ventilation valve 80 is damaged, the high-pressure air inside the cavity 40 can be discharged outside the cavity 40 through the other unidirectional ventilation valve 80, so that the connection of the housing 20 to the substrate 10 is not affected. The use of the one-way ventilation valve 80 can also save the process of connecting the substrate 10 to the motherboard and simplify the soldering process.
Referring to fig. 14, in the embodiment, one through hole 21 of the two through holes 21 may be matched with the blocking member 30, and the other through hole may be matched with the unidirectional ventilation valve 80, wherein the cross section of the through hole 21 matched with the blocking member 30 may be one of a tapered hole, a rectangular hole or a stepped hole, the through hole 21 matched with the unidirectional ventilation valve 80 may be a stepped hole, and the through hole 21 matched with the unidirectional ventilation valve 80 may be a stepped hole so that the unidirectional ventilation valve 80 is mounted on the housing 20. In this way, when the housing 20 is connected to the substrate 10 and the substrate 10 is connected to the motherboard by reflow soldering, since the one-way ventilation valve 80 is provided in one of the two through holes 21, the blocking member 30 engaged with the other through hole 21 can be prevented from being detached from the through hole 21, and it is also possible to ensure that the gas inside the cavity 40 is discharged to the outside of the cavity 40 through the one-way ventilation valve when the gas pressure inside the cavity 40 increases.
Referring to fig. 15, the present application further provides a cavity encapsulation method, comprising the steps of:
s10a: arranging an electronic device on the surface of a substrate;
s20a: adhering a housing having one or more through holes to a surface of the substrate by adhesive, wherein the electronic device is located in a cavity formed by the housing and the substrate;
S30a: the blocking member is removably mounted to the one or more through holes.
Specifically, by adopting the method, the stability of connection between the shell and the substrate can be improved, and the packaging reliability can be improved.
It should be noted that, when the plugging member is a bolt or a rubber plug, it is necessary to wait for cooling of each element after the casing is adhered to the substrate and solidification is completed, and then plug one or more through holes when the air pressure inside the cavity is balanced with the air pressure outside the cavity. That is, in this case, the case is adhered to the substrate by the adhesive, and at least one through hole on the case needs to be maintained in an opened state during the curing of the adhesive.
Referring to fig. 16, the present application also provides a cavity encapsulation method, comprising the steps of:
s10b: arranging an electronic device on the surface of a substrate;
s20b: adhering a housing having one or more through holes to a surface of the substrate by adhesive, wherein the electronic device is located in a cavity formed by the housing and the substrate;
s30b: a cover having elasticity is fitted over the outside of the case, and covers the one or more through holes and the area around the one or more through holes.
Specifically, by adopting the method, the stability of connection between the shell and the substrate can be improved, and the packaging reliability can be improved. In addition, the cover can be sleeved on the outer side of the shell all the time, so that the packaging process can be simplified.
In one possible embodiment, the housing includes a top cover overlying the top plate of the housing and a side cover connected to the top cover, the side cover overlying the side plate of the housing, the top cover and the side cover overlying the one or more through holes.
Referring to fig. 17, the present application also provides a cavity encapsulation method, comprising the steps of:
s10c: arranging an electronic device on the surface of a substrate;
s20c: adhering a housing having one or more through holes to a surface of the substrate by adhesive, wherein the electronic device is located in a cavity formed by the housing and the substrate;
s30c: and installing a one-way ventilation valve in the one or more through holes.
Specifically, by adopting the method, the stability of connection between the shell and the substrate can be improved, and the packaging reliability can be improved. In addition, according to the characteristic of the unidirectional ventilation valve, the unidirectional ventilation valve can be always arranged in the through hole, and the packaging process can be simplified.
The application also provides electronic equipment, which comprises a printed circuit board and the cavity packaging structure in any technical scheme. The electronic equipment adopting the cavity packaging structure has higher working reliability.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (26)
- A cavity package structure, comprising:a substrate having a mounting surface for mounting an electronic device;the shell is arranged on the mounting surface of the substrate, a cavity is formed between the shell and the mounting surface of the substrate, and the electronic device is positioned in the cavity, wherein one or more through holes are formed in the shell;the plugging piece is arranged in the one or more through holes, and the plugging piece is of a detachable structure.
- The cavity-packaging structure of claim 1, wherein the housing comprises a side plate and a top plate, one side of the side plate is connected with the substrate, the top plate is connected with one side of the side plate away from the substrate, and one or more through holes are formed in the top plate.
- The cavity package according to claim 2, wherein one or more of the through holes are provided in the side plate.
- A cavity package according to claim 2 or 3, wherein the projection of the one or more vias onto the substrate does not overlap with the projection of the electronic device onto the substrate.
- The cavity-packaging structure according to any one of claims 2 to 4, wherein the aperture of the through hole gradually decreases from a direction away from the cavity to a direction closer to the cavity.
- The cavity package according to any one of claims 2 to 4, wherein the through hole is a stepped hole.
- The cavity-packaging structure according to any one of claims 1-6, wherein the blocking member is a bolt or a rubber stopper detachably provided to the one or more through holes, and the bolt or the rubber stopper is mounted to the one or more through holes after the case is bonded to the substrate and cured.
- A cavity package structure, comprising:a substrate having a mounting surface for mounting an electronic device;the shell is arranged on the mounting surface of the substrate, a cavity is formed between the shell and the mounting surface of the substrate, and the electronic device is positioned in the cavity, wherein one or more through holes are formed in the shell;A cover having elasticity, the cover being located outside the housing and covering the one or more through holes and a region around the one or more through holes.
- The cavity-packaging structure of claim 8, wherein the housing comprises a side plate and a top plate, one side of the side plate is connected with the substrate, the top plate is connected with one side of the side plate away from the substrate, and one or more through holes are formed in the top plate.
- The cavity-packaging structure of claim 9, wherein one or more of the through holes are provided in the side plate.
- The cavity-packaging structure of claim 10, wherein the housing includes a top housing and a side housing coupled to the top housing, the top housing covering the top plate, the side housing covering the side plate, the top housing and the side housing covering the one or more through-holes.
- The cavity package of claims 9-11, wherein a projection of the one or more vias onto the substrate does not overlap with a projection of the electronic device onto the substrate.
- The cavity-packaging structure according to any one of claims 9 to 11, wherein the aperture of the through hole gradually decreases from a direction away from the cavity to a direction closer to the cavity.
- The cavity package according to any one of claims 9 to 11, wherein the through hole is a stepped hole.
- A cavity package structure, comprising:a substrate having a mounting surface for mounting an electronic device;the shell is arranged on the mounting surface of the substrate, a cavity is formed between the shell and the mounting surface of the substrate, and the electronic device is positioned in the cavity, wherein one or more through holes are formed in the shell;the one-way ventilation valve is arranged in the one or more through holes.
- The cavity-packaging structure of claim 15, wherein the housing comprises a side plate and a top plate, one side of the side plate is connected with the substrate, the top plate is connected with one side of the side plate away from the substrate, and one or more through holes are formed in the top plate.
- The cavity-packaging structure of claim 16, wherein one or more of the through holes are provided in the side plate.
- The cavity package of claim 16 or 17, wherein a projection of the one or more vias onto the substrate does not overlap with a projection of the electronic device onto the substrate.
- The cavity-packaging structure according to any one of claims 16 to 18, wherein the aperture of the through-hole gradually decreases from a direction away from the cavity to a direction closer to the cavity.
- The cavity package of any of claims 16-18, wherein the through hole is a stepped hole.
- A method of cavity encapsulation comprising the steps of:arranging an electronic device on the surface of a substrate;adhering a housing having one or more through holes to a surface of the substrate by adhesive, wherein the electronic device is located in a cavity formed by the housing and the substrate;the blocking member is removably mounted to the one or more through holes.
- The method of claim 21, wherein the plugging member is a bolt or a rubber plug, and the bolt or the rubber plug is detachably mounted to the one or more through holes to plug the one or more through holes after the housing is adhered to the substrate and cured.
- A method of cavity encapsulation comprising the steps of:arranging an electronic device on the surface of a substrate;adhering a housing having one or more through holes to a surface of the substrate by adhesive, wherein the electronic device is located in a cavity formed by the housing and the substrate;A cover having elasticity is fitted over the outside of the case, and covers the one or more through holes and the area around the one or more through holes.
- The cavity encapsulation method of claim 23, wherein the housing includes a top cover and a side cover connected to the top cover, the top cover overlying the top plate of the housing, the side cover overlying the side plate of the housing, the top cover and the side cover overlying the one or more through holes.
- A method of cavity encapsulation comprising the steps of:arranging an electronic device on the surface of a substrate;adhering a housing having one or more through holes to a surface of the substrate by adhesive, wherein the electronic device is located in a cavity formed by the housing and the substrate;and installing a one-way ventilation valve in the one or more through holes.
- An electronic device comprising a printed circuit board and a cavity-packaging structure as claimed in any one of claims 1 to 20.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/091579 WO2022227027A1 (en) | 2021-04-30 | 2021-04-30 | Cavity packaging structure, cavity packaging method, and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117242584A true CN117242584A (en) | 2023-12-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180097631.8A Pending CN117242584A (en) | 2021-04-30 | 2021-04-30 | Cavity packaging structure, cavity packaging method and electronic equipment |
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| CN (1) | CN117242584A (en) |
| WO (1) | WO2022227027A1 (en) |
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| KR102076339B1 (en) * | 2013-03-13 | 2020-02-11 | 삼성전자주식회사 | Semiconductor pakage and method of manufacturing the same |
| CN205944134U (en) * | 2016-06-30 | 2017-02-08 | 鸿利智汇集团股份有限公司 | Apron dusts |
| KR20180100792A (en) * | 2017-03-02 | 2018-09-12 | 앰코 테크놀로지 인코포레이티드 | Cavity sensor package having plugged vent hole and method for manufacturing the same |
| CN208888964U (en) * | 2018-11-07 | 2019-05-21 | 刘娜娜 | A kind of protective device of ancient documents |
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2021
- 2021-04-30 WO PCT/CN2021/091579 patent/WO2022227027A1/en active Application Filing
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