CN117238388A - Electroplating solution monitoring system for composite electroplating based on data analysis - Google Patents
Electroplating solution monitoring system for composite electroplating based on data analysis Download PDFInfo
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 205
- 238000009713 electroplating Methods 0.000 title claims abstract description 119
- 239000002131 composite material Substances 0.000 title claims abstract description 30
- 238000007405 data analysis Methods 0.000 title claims abstract description 15
- 238000004458 analytical method Methods 0.000 claims abstract description 87
- 230000002159 abnormal effect Effects 0.000 claims abstract description 70
- 230000005856 abnormality Effects 0.000 claims abstract description 45
- 238000007747 plating Methods 0.000 claims abstract description 42
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims abstract description 27
- 238000005457 optimization Methods 0.000 claims abstract description 12
- 238000004891 communication Methods 0.000 claims abstract description 4
- 239000000243 solution Substances 0.000 claims description 61
- 238000003756 stirring Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 16
- 238000010790 dilution Methods 0.000 claims description 16
- 239000012895 dilution Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000004364 calculation method Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000003792 electrolyte Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000002245 particle Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013433 optimization analysis Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The application belongs to the field of plating solution supervision, relates to a data analysis technology, and is used for solving the problem that a plating solution supervision system for composite plating in the prior art cannot make correct processing and optimization decisions when the plating solution is abnormal, in particular to a plating solution supervision system for composite plating based on data analysis, which comprises a supervision platform, wherein the supervision platform is in communication connection with a plating monitoring module, an abnormality analysis module, a point position monitoring module and a storage module; the electroplating monitoring module is used for monitoring and analyzing the composite electroplating liquid: setting a plurality of monitoring points in the electroplating bath, and marking the monitoring points as normal points or abnormal points through a monitoring coefficient JC; according to the application, the composite electroplating solution can be monitored and analyzed, after a plurality of monitoring points are arranged in the electroplating bath, the degree of abnormity of the electroplating solution at the monitoring points is fed back through the monitoring coefficient, so that whether the electroplating solution meets the processing requirement or not is judged by combining the monitoring results of all the monitoring points.
Description
Technical Field
The application belongs to the field of plating solution supervision, relates to a data analysis technology, and in particular relates to a plating solution supervision system for composite plating based on data analysis.
Background
The composite plating is also called as dispersion plating, and the dispersion plating is to use a plating method to co-deposit solid particles and metal so as to obtain a composite plating layer with a particle structure dispersed on matrix metal on a substrate, namely, solid insoluble solid particles are uniformly dispersed in a plating solution to prepare a suspension for plating.
The plating solution monitoring system for composite plating in the prior art cannot monitor the plating solution at multiple points, and then performs transverse monitoring analysis and longitudinal decision analysis according to the monitoring data of multiple monitoring points, so that correct processing and optimization decisions cannot be made when the plating solution is abnormal.
The application provides a solution to the technical problem.
Disclosure of Invention
The application aims to provide a composite electroplating solution monitoring system based on data analysis, which is used for solving the problem that the composite electroplating solution monitoring system in the prior art cannot make correct processing and optimization decisions when the electroplating solution is abnormal;
the technical problems to be solved by the application are as follows: how to provide a plating solution monitoring system for composite plating based on data analysis, which can make correct processing and optimization decisions when the plating solution is abnormal.
The aim of the application can be achieved by the following technical scheme:
the electroplating liquid monitoring system for the composite electroplating based on the data analysis comprises a monitoring platform, wherein the monitoring platform is in communication connection with an electroplating monitoring module, an anomaly analysis module, a point location monitoring module and a storage module;
the electroplating monitoring module is used for monitoring and analyzing the composite electroplating liquid: setting a plurality of monitoring points in the electroplating bath, acquiring temperature data WD and concentration data ND of the monitoring points before metal electroplating processing, performing numerical calculation to obtain a monitoring coefficient JC of the monitoring points, and marking the monitoring points as normal points or abnormal points through the monitoring coefficient JC; marking the number ratio of the abnormal point positions to the monitoring point positions as an abnormal coefficient, and judging whether the electroplating solution in the electroplating bath meets the requirement or not through the abnormal coefficient;
the abnormality analysis module is used for carrying out decision analysis on abnormal states of the electroplating liquid: performing temperature decision analysis and concentration decision analysis on the electroplating solution;
the point location monitoring module is used for monitoring and analyzing abnormal characteristics of the monitoring point location: and (3) obtaining a monitoring point marking result when electroplating processing is carried out in the last M1 months, marking the times of marking the monitoring point as an abnormal point as a marking value of the monitoring point, obtaining a marking threshold value through a storage module, marking the monitoring point with the marking value not smaller than the marking threshold value as an analysis point, and marking the abnormal characteristics of the analysis point.
As a preferred embodiment of the present application, the process of acquiring the temperature data WD includes: acquiring a temperature value of the electroplating solution at a monitoring point, calling a temperature range of the electroplating solution, marking an average value of a maximum value and a minimum value of the temperature range as a temperature standard value, and marking an absolute value of a difference value between the temperature value and the temperature standard value as temperature data WD; the acquisition process of the concentration data ND includes: and acquiring a concentration value of the electroplating solution at the monitoring point, calling a concentration range of the electrolyte, marking an average value of a maximum value and a minimum value of the concentration range as a concentration standard value, and marking an absolute value of a difference value between the concentration value and the concentration standard value as concentration data ND.
As a preferred embodiment of the present application, the specific process of marking the monitoring point as a normal point or an abnormal point includes: the monitoring threshold value JCmax is obtained through the storage module, and the monitoring coefficient JC of the monitoring point position is compared with the monitoring threshold value JCmax: if the monitoring coefficient JC is smaller than the monitoring threshold value JCmax, judging that the electroplating liquid at the monitoring point position meets the requirement, and marking the corresponding monitoring point position as a normal point position; if the monitoring coefficient JC is greater than or equal to the monitoring threshold value JCmax, judging that the electroplating liquid at the monitoring point position does not meet the requirement, and marking the corresponding monitoring point position as an abnormal point position.
As a preferred embodiment of the present application, the specific process for determining whether the plating solution in the plating tank satisfies the requirements includes: the storage module acquires an abnormal threshold value, and compares the abnormal coefficient with the abnormal threshold value: if the abnormality coefficient is smaller than the abnormality threshold, judging that the electroplating solution in the electroplating tank meets the processing requirement; if the abnormality coefficient is greater than or equal to the abnormality threshold, judging that the electroplating solution in the electroplating bath does not meet the processing requirement, generating an abnormality analysis signal and sending the abnormality analysis signal to the supervision platform, and sending the abnormality analysis signal to the abnormality analysis module after the supervision platform receives the abnormality analysis signal.
As a preferred embodiment of the application, the specific process of performing temperature decision analysis on the electroplating solution comprises the following steps: summing the temperature values of all the monitoring points to obtain the temperature representation value of the electroplating bath, forming a temperature set by the temperature values of all the monitoring points, and comparing the temperature representation value with a temperature range: if the temperature representing value is larger than the maximum boundary value of the temperature range, generating a cooling signal and sending the cooling signal to the supervision platform, and sending the cooling signal to a mobile phone terminal of a manager after the supervision platform receives the cooling signal; if the temperature representing value is smaller than the minimum boundary value of the temperature range, generating a heating signal and sending the heating signal to the supervision platform, and sending the heating signal to a mobile phone terminal of a manager after the supervision platform receives the heating signal; if the temperature expression value is in the temperature range, generating a stirring signal and sending the stirring signal to the supervision platform, and after receiving the stirring signal, the supervision platform sends the stirring signal to a mobile phone terminal of a manager, and meanwhile, the temperature value of the monitoring point is compared with the temperature range one by one: if the temperature value is larger than the maximum boundary value of the temperature range, marking the corresponding monitoring point position as a high-temperature point position; if the temperature value is smaller than the minimum boundary value of the temperature range, marking the corresponding monitoring point position as a low-temperature point position; if the temperature value is within the temperature range, no marking is made.
As a preferred embodiment of the application, the specific process of performing concentration decision analysis on the electroplating solution comprises the following steps: and (3) carrying out concentration decision analysis on the electroplating solution: summing the concentration values of each monitoring point to obtain a concentration representation value of the electroplating bath, and comparing the concentration representation value with a concentration range: if the concentration representing value is larger than the maximum boundary value of the concentration range, generating a dilution signal and sending the dilution signal to a supervision platform, and after receiving the dilution signal, the supervision platform sends the dilution signal to a mobile phone terminal of a manager; if the concentration representation value is smaller than the minimum boundary value of the concentration range, generating a concentration signal and sending the concentration signal to a supervision platform, and after receiving the concentration signal, the supervision platform sends the concentration signal to a mobile phone terminal of a manager; if the concentration expression value is within the concentration range, generating a stirring signal and sending the stirring signal to a supervision platform, wherein the supervision platform receives the stirring signal and then sends the stirring signal to a mobile phone terminal of a manager, and meanwhile, the concentration value of the monitoring point is compared with the concentration range one by one: if the concentration value is larger than the maximum boundary value of the concentration range, marking the corresponding monitoring point position as a high-concentration point position; if the concentration value is smaller than the minimum boundary value of the concentration range, marking the corresponding monitoring point position as a concentration low point position; if the concentration value is within the concentration range, no marking is made.
As a preferred embodiment of the present application, the specific process of marking the abnormal characteristics of the analysis point comprises: the times of marking the analysis point positions as the high point position, the low temperature point position, the high concentration point position and the low concentration point position are respectively marked as Wen Gaozhi, the low temperature value, the high concentration value and the low concentration value of the analysis point positions, the Wen Gaozhi, the low temperature value, the high concentration value and the low concentration value of the analysis point positions are subjected to variance calculation to obtain a concentration coefficient, a concentration threshold value is obtained through a storage module, and the concentration coefficient is compared with the concentration threshold value: if the concentration coefficient is smaller than the concentration threshold value, marking the abnormal characteristic of the analysis point as uniformity abnormality; if the concentration coefficient is greater than or equal to the concentration threshold, marking the abnormal characteristic of the analysis point as concentration abnormality; marking the number of analysis points with abnormal characteristics marked as uniformity abnormality as an integral value, acquiring an integral threshold value through a storage module, generating an integral optimization signal when the integral value is not smaller than the integral threshold value, and transmitting the integral optimization signal to a supervision platform; otherwise, marking the point marking result corresponding to the maximum value of the Wen Gaozhi, the low-temperature value, the high-concentration value and the low-concentration value as the concentrated characteristic of the analysis point, and sending the concentrated characteristic of the analysis point to the supervision platform.
The application has the following beneficial effects:
1. the composite electroplating liquid can be monitored and analyzed through the electroplating monitoring module, after a plurality of monitoring points are arranged in the electroplating bath, a plurality of monitoring parameters collected by the monitoring points are comprehensively analyzed and calculated to obtain monitoring coefficients, and the degree of abnormality of the electroplating liquid at the monitoring points is fed back through the monitoring coefficients, so that whether the electroplating liquid meets the processing requirements is judged according to the monitoring results of all the monitoring points;
2. the abnormal state of the electroplating liquid can be subjected to decision analysis when the electroplating liquid does not meet the processing requirement through the abnormal analysis module, and an abnormal processing decision is made for the abnormal electroplating liquid by combining the temperature decision analysis result and the concentration decision analysis result, so that the abnormal processing efficiency of the electroplating liquid is improved;
3. the monitoring and analyzing module can monitor and analyze the abnormal characteristics of the monitoring points, data cleaning is carried out according to the marking times of the monitoring points, then longitudinal optimization analysis is carried out on the historical marking states of the analysis points, and the most suitable optimization scheme is implemented for the electroplating bath.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a system block diagram of a first embodiment of the present application;
fig. 2 is a flowchart of a method according to a second embodiment of the application.
Detailed Description
The technical solutions of the present application will be clearly and completely described in connection with the embodiments, and it is obvious that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Example 1
As shown in FIG. 1, the electroplating liquid monitoring system for composite electroplating based on data analysis comprises a monitoring platform, wherein the monitoring platform is in communication connection with an electroplating monitoring module, an anomaly analysis module, a point location monitoring module and a storage module.
The electroplating monitoring module is used for monitoring and analyzing the composite electroplating liquid: a plurality of monitoring points are arranged in the electroplating bath, temperature data WD and concentration data ND of the monitoring points are obtained before metal electroplating processing, and the obtaining process of the temperature data WD comprises the following steps: acquiring a temperature value of the electroplating solution at a monitoring point, calling a temperature range of the electroplating solution, marking an average value of a maximum value and a minimum value of the temperature range as a temperature standard value, and marking an absolute value of a difference value between the temperature value and the temperature standard value as temperature data WD; the acquisition process of the concentration data ND includes: acquiring a concentration value of the electroplating solution at a monitoring point, calling a concentration range of the electrolyte, marking an average value of a maximum value and a minimum value of the concentration range as a concentration standard value, and marking an absolute value of a difference value between the concentration value and the concentration standard value as concentration data ND; obtaining a monitoring coefficient JC of a monitoring point position through a formula JC=α1WD+α2ND, wherein α1 and α2 are proportionality coefficients, and α1 is larger than α2 and larger than 1; the monitoring threshold value JCmax is obtained through the storage module, and the monitoring coefficient JC of the monitoring point position is compared with the monitoring threshold value JCmax: if the monitoring coefficient JC is smaller than the monitoring threshold value JCmax, judging that the electroplating liquid at the monitoring point position meets the requirement, and marking the corresponding monitoring point position as a normal point position; if the monitoring coefficient JC is greater than or equal to the monitoring threshold value JCmax, judging that the electroplating liquid at the monitoring point position does not meet the requirement, and marking the corresponding monitoring point position as an abnormal point position; marking the number ratio of the abnormal point positions to the monitoring point positions as an abnormal coefficient, acquiring an abnormal threshold value through a storage module, and comparing the abnormal coefficient with the abnormal threshold value: if the abnormality coefficient is smaller than the abnormality threshold, judging that the electroplating solution in the electroplating tank meets the processing requirement; if the abnormality coefficient is greater than or equal to the abnormality threshold, judging that the electroplating solution in the electroplating bath does not meet the processing requirement, generating an abnormality analysis signal and sending the abnormality analysis signal to a supervision platform, and sending the abnormality analysis signal to an abnormality analysis module after the supervision platform receives the abnormality analysis signal; and (3) monitoring and analyzing the composite electroplating solution, after a plurality of monitoring points are arranged in the electroplating bath, comprehensively analyzing and calculating a plurality of monitoring parameters acquired by the monitoring points to obtain monitoring coefficients, and feeding back the abnormal degree of the electroplating solution at the monitoring points through the monitoring coefficients so as to judge whether the electroplating solution meets the processing requirement or not according to the monitoring results of all the monitoring points.
The abnormality analysis module is used for carrying out decision analysis on abnormal states of the electroplating liquid: and (3) carrying out temperature decision analysis on the electroplating solution: summing the temperature values of all the monitoring points to obtain the temperature representation value of the electroplating bath, forming a temperature set by the temperature values of all the monitoring points, and comparing the temperature representation value with a temperature range: if the temperature representing value is larger than the maximum boundary value of the temperature range, generating a cooling signal and sending the cooling signal to the supervision platform, and sending the cooling signal to a mobile phone terminal of a manager after the supervision platform receives the cooling signal; if the temperature representing value is smaller than the minimum boundary value of the temperature range, generating a heating signal and sending the heating signal to the supervision platform, and sending the heating signal to a mobile phone terminal of a manager after the supervision platform receives the heating signal; if the temperature expression value is in the temperature range, generating a stirring signal and sending the stirring signal to the supervision platform, and after receiving the stirring signal, the supervision platform sends the stirring signal to a mobile phone terminal of a manager, and meanwhile, the temperature value of the monitoring point is compared with the temperature range one by one: if the temperature value is larger than the maximum boundary value of the temperature range, marking the corresponding monitoring point position as a high-temperature point position; if the temperature value is smaller than the minimum boundary value of the temperature range, marking the corresponding monitoring point position as a low-temperature point position; if the temperature value is within the temperature range, marking is not carried out;
and (3) carrying out concentration decision analysis on the electroplating solution: and (3) carrying out concentration decision analysis on the electroplating solution: summing the concentration values of each monitoring point to obtain a concentration representation value of the electroplating bath, and comparing the concentration representation value with a concentration range: if the concentration representing value is larger than the maximum boundary value of the concentration range, generating a dilution signal and sending the dilution signal to a supervision platform, and after receiving the dilution signal, the supervision platform sends the dilution signal to a mobile phone terminal of a manager; if the concentration representation value is smaller than the minimum boundary value of the concentration range, generating a concentration signal and sending the concentration signal to a supervision platform, and after receiving the concentration signal, the supervision platform sends the concentration signal to a mobile phone terminal of a manager; if the concentration expression value is within the concentration range, generating a stirring signal and sending the stirring signal to a supervision platform, wherein the supervision platform receives the stirring signal and then sends the stirring signal to a mobile phone terminal of a manager, and meanwhile, the concentration value of the monitoring point is compared with the concentration range one by one: if the concentration value is larger than the maximum boundary value of the concentration range, marking the corresponding monitoring point position as a high-concentration point position; if the concentration value is smaller than the minimum boundary value of the concentration range, marking the corresponding monitoring point position as a concentration low point position; if the concentration value is within the concentration range, marking is not carried out; when the electroplating liquid does not meet the processing requirement, carrying out decision analysis on the abnormal state of the electroplating liquid, and carrying out an abnormal processing decision on the abnormal electroplating liquid by combining the temperature decision analysis result and the concentration decision analysis result, thereby improving the abnormal processing efficiency of the electroplating liquid.
The point location monitoring module is used for monitoring and analyzing the abnormal characteristics of the monitoring point location: obtaining a monitoring point marking result when electroplating processing is carried out in the last M1 month, marking the number of times that the monitoring point is marked as an abnormal point as a marking value of the monitoring point, obtaining a marking threshold value through a storage module, marking the monitoring point with the marking value not smaller than the marking threshold value as an analysis point, marking the analysis point as a high point, a low temperature point, a high concentration point and a low concentration point as Wen Gaozhi, a low temperature value, a high concentration value and a low concentration value of the analysis point respectively, carrying out variance calculation on Wen Gaozhi, the low temperature value, the high concentration value and the low concentration value of the analysis point to obtain a concentration coefficient, obtaining the concentration threshold value through the storage module, and comparing the concentration coefficient with the concentration threshold value: if the concentration coefficient is smaller than the concentration threshold value, marking the abnormal characteristic of the analysis point as uniformity abnormality; if the concentration coefficient is greater than or equal to the concentration threshold, marking the abnormal characteristic of the analysis point as concentration abnormality; marking the number of analysis points with abnormal characteristics marked as uniformity abnormality as an integral value, acquiring an integral threshold value through a storage module, generating an integral optimization signal when the integral value is not smaller than the integral threshold value, and transmitting the integral optimization signal to a supervision platform; otherwise, marking the point marking results corresponding to the Wen Gaozhi, low-temperature value, high-concentration value and maximum value in the low-concentration value as the concentrated features of the analysis points, and sending the concentrated features of the analysis points to the supervision platform; and monitoring and analyzing the abnormal characteristics of the monitoring points, cleaning data according to the marking times of the monitoring points, and then performing longitudinal optimization analysis on the historical marking states of the analysis points to implement the most suitable optimization scheme for the electroplating bath.
Example two
As shown in fig. 2, a method for monitoring a plating solution for composite plating based on data analysis includes the steps of:
step one: monitoring and analyzing the composite electroplating solution: setting a plurality of monitoring points in the electroplating bath, acquiring temperature data WD and concentration data ND of the monitoring points before metal electroplating processing, performing numerical calculation to obtain a monitoring coefficient JC of the monitoring points, and marking the monitoring points as normal points or abnormal points through the monitoring coefficient JC;
step two: decision analysis is carried out on the abnormal state of the electroplating liquid: carrying out temperature decision analysis on the electroplating solution, generating a heating signal, a cooling signal or a stirring signal, and sending the heating signal, the cooling signal or the stirring signal to a supervision platform; performing concentration decision analysis on the electroplating solution, generating a dilution signal, a concentration signal or a stirring signal, and sending the dilution signal, the concentration signal or the stirring signal to a supervision platform;
step three: and monitoring and analyzing the abnormal characteristics of the monitoring points and marking the abnormal characteristics of the analysis points as centralized abnormality or uniformity abnormality.
The utility model provides a composite electroplating solution supervisory systems for electroplating based on data analysis, during operation sets up a plurality of monitoring points in the plating bath, before carrying out metal electroplating processing, obtains the temperature data WD and the concentration data ND of monitoring points and carries out numerical value calculation and obtains the monitoring coefficient JC of monitoring points, marks monitoring points as normal point or abnormal point through monitoring coefficient JC; carrying out temperature decision analysis on the electroplating solution, generating a heating signal, a cooling signal or a stirring signal, and sending the heating signal, the cooling signal or the stirring signal to a supervision platform; performing concentration decision analysis on the electroplating solution, generating a dilution signal, a concentration signal or a stirring signal, and sending the dilution signal, the concentration signal or the stirring signal to a supervision platform; and monitoring and analyzing the abnormal characteristics of the monitoring points and marking the abnormal characteristics of the analysis points as centralized abnormality or uniformity abnormality.
The foregoing is merely illustrative of the structures of this application and various modifications, additions and substitutions for those skilled in the art can be made to the described embodiments without departing from the scope of the application or from the scope of the application as defined in the accompanying claims.
The formulas are all formulas obtained by collecting a large amount of data for software simulation and selecting a formula close to a true value, and coefficients in the formulas are set by a person skilled in the art according to actual conditions; such as: the formula jc=α1×wd+α2×nd; collecting a plurality of groups of sample data by a person skilled in the art and setting a corresponding monitoring coefficient for each group of sample data; substituting the set monitoring coefficient and the acquired sample data into a formula, forming a ternary one-time equation set by any three formulas, screening the calculated coefficient, and taking an average value to obtain values of alpha 1 and alpha 2 which are respectively 3.25 and 2.73;
the size of the coefficient is a specific numerical value obtained by quantizing each parameter, so that the subsequent comparison is convenient, and the size of the coefficient depends on the number of sample data and the corresponding monitoring coefficient is preliminarily set for each group of sample data by a person skilled in the art; as long as the proportional relation between the parameter and the quantized value is not affected, for example, the monitoring coefficient is directly proportional to the value of the temperature data.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the application disclosed above are intended only to assist in the explanation of the application. The preferred embodiments are not intended to be exhaustive or to limit the application to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and the practical application, to thereby enable others skilled in the art to best understand and utilize the application. The application is limited only by the claims and the full scope and equivalents thereof.
Claims (7)
1. The electroplating liquid monitoring system for the composite electroplating based on the data analysis is characterized by comprising a monitoring platform, wherein the monitoring platform is in communication connection with an electroplating monitoring module, an anomaly analysis module, a point location monitoring module and a storage module;
the electroplating monitoring module is used for monitoring and analyzing the composite electroplating liquid: setting a plurality of monitoring points in the electroplating bath, acquiring temperature data WD and concentration data ND of the monitoring points before metal electroplating processing, performing numerical calculation to obtain a monitoring coefficient JC of the monitoring points, and marking the monitoring points as normal points or abnormal points through the monitoring coefficient JC; marking the number ratio of the abnormal point positions to the monitoring point positions as an abnormal coefficient, and judging whether the electroplating solution in the electroplating bath meets the requirement or not through the abnormal coefficient;
the abnormality analysis module is used for carrying out decision analysis on abnormal states of the electroplating liquid: performing temperature decision analysis and concentration decision analysis on the electroplating solution;
the point location monitoring module is used for monitoring and analyzing abnormal characteristics of the monitoring point location: and (3) obtaining a monitoring point marking result when electroplating processing is carried out in the last M1 months, marking the times of marking the monitoring point as an abnormal point as a marking value of the monitoring point, obtaining a marking threshold value through a storage module, marking the monitoring point with the marking value not smaller than the marking threshold value as an analysis point, and marking the abnormal characteristics of the analysis point.
2. The plating solution monitoring system for composite plating according to claim 1, wherein the process of obtaining the temperature data WD comprises: acquiring a temperature value of the electroplating solution at a monitoring point, calling a temperature range of the electroplating solution, marking an average value of a maximum value and a minimum value of the temperature range as a temperature standard value, and marking an absolute value of a difference value between the temperature value and the temperature standard value as temperature data WD; the acquisition process of the concentration data ND includes: and acquiring a concentration value of the electroplating solution at the monitoring point, calling a concentration range of the electrolyte, marking an average value of a maximum value and a minimum value of the concentration range as a concentration standard value, and marking an absolute value of a difference value between the concentration value and the concentration standard value as concentration data ND.
3. The electroplating solution monitoring system for composite electroplating according to claim 2, wherein the specific process of marking the monitoring point as a normal point or an abnormal point comprises: the monitoring threshold value JCmax is obtained through the storage module, and the monitoring coefficient JC of the monitoring point position is compared with the monitoring threshold value JCmax: if the monitoring coefficient JC is smaller than the monitoring threshold value JCmax, judging that the electroplating liquid at the monitoring point position meets the requirement, and marking the corresponding monitoring point position as a normal point position; if the monitoring coefficient JC is greater than or equal to the monitoring threshold value JCmax, judging that the electroplating liquid at the monitoring point position does not meet the requirement, and marking the corresponding monitoring point position as an abnormal point position.
4. A plating solution monitoring system for composite plating according to claim 3, wherein the specific process of determining whether the plating solution in the plating tank satisfies the requirement comprises: the storage module acquires an abnormal threshold value, and compares the abnormal coefficient with the abnormal threshold value: if the abnormality coefficient is smaller than the abnormality threshold, judging that the electroplating solution in the electroplating tank meets the processing requirement; if the abnormality coefficient is greater than or equal to the abnormality threshold, judging that the electroplating solution in the electroplating bath does not meet the processing requirement, generating an abnormality analysis signal and sending the abnormality analysis signal to the supervision platform, and sending the abnormality analysis signal to the abnormality analysis module after the supervision platform receives the abnormality analysis signal.
5. The system for monitoring and controlling a composite plating solution based on data analysis according to claim 4, wherein the specific process of performing temperature decision analysis on the plating solution comprises: summing the temperature values of all the monitoring points to obtain the temperature representation value of the electroplating bath, forming a temperature set by the temperature values of all the monitoring points, and comparing the temperature representation value with a temperature range: if the temperature representing value is larger than the maximum boundary value of the temperature range, generating a cooling signal and sending the cooling signal to the supervision platform, and sending the cooling signal to a mobile phone terminal of a manager after the supervision platform receives the cooling signal; if the temperature representing value is smaller than the minimum boundary value of the temperature range, generating a heating signal and sending the heating signal to the supervision platform, and sending the heating signal to a mobile phone terminal of a manager after the supervision platform receives the heating signal; if the temperature expression value is in the temperature range, generating a stirring signal and sending the stirring signal to the supervision platform, and after receiving the stirring signal, the supervision platform sends the stirring signal to a mobile phone terminal of a manager, and meanwhile, the temperature value of the monitoring point is compared with the temperature range one by one: if the temperature value is larger than the maximum boundary value of the temperature range, marking the corresponding monitoring point position as a high-temperature point position; if the temperature value is smaller than the minimum boundary value of the temperature range, marking the corresponding monitoring point position as a low-temperature point position; if the temperature value is within the temperature range, no marking is made.
6. The system for monitoring and controlling a plating solution for composite plating based on data analysis according to claim 5, wherein the specific process of performing concentration decision analysis on the plating solution comprises: and (3) carrying out concentration decision analysis on the electroplating solution: summing the concentration values of each monitoring point to obtain a concentration representation value of the electroplating bath, and comparing the concentration representation value with a concentration range: if the concentration representing value is larger than the maximum boundary value of the concentration range, generating a dilution signal and sending the dilution signal to a supervision platform, and after receiving the dilution signal, the supervision platform sends the dilution signal to a mobile phone terminal of a manager; if the concentration representation value is smaller than the minimum boundary value of the concentration range, generating a concentration signal and sending the concentration signal to a supervision platform, and after receiving the concentration signal, the supervision platform sends the concentration signal to a mobile phone terminal of a manager; if the concentration expression value is within the concentration range, generating a stirring signal and sending the stirring signal to a supervision platform, wherein the supervision platform receives the stirring signal and then sends the stirring signal to a mobile phone terminal of a manager, and meanwhile, the concentration value of the monitoring point is compared with the concentration range one by one: if the concentration value is larger than the maximum boundary value of the concentration range, marking the corresponding monitoring point position as a high-concentration point position; if the concentration value is smaller than the minimum boundary value of the concentration range, marking the corresponding monitoring point position as a concentration low point position; if the concentration value is within the concentration range, no marking is made.
7. The plating solution monitoring system for composite plating according to claim 6, wherein the specific process of marking the abnormal characteristics of the analysis points comprises: the times of marking the analysis point positions as the high point position, the low temperature point position, the high concentration point position and the low concentration point position are respectively marked as Wen Gaozhi, the low temperature value, the high concentration value and the low concentration value of the analysis point positions, the Wen Gaozhi, the low temperature value, the high concentration value and the low concentration value of the analysis point positions are subjected to variance calculation to obtain a concentration coefficient, a concentration threshold value is obtained through a storage module, and the concentration coefficient is compared with the concentration threshold value: if the concentration coefficient is smaller than the concentration threshold value, marking the abnormal characteristic of the analysis point as uniformity abnormality; if the concentration coefficient is greater than or equal to the concentration threshold, marking the abnormal characteristic of the analysis point as concentration abnormality; marking the number of analysis points with abnormal characteristics marked as uniformity abnormality as an integral value, acquiring an integral threshold value through a storage module, generating an integral optimization signal when the integral value is not smaller than the integral threshold value, and transmitting the integral optimization signal to a supervision platform; otherwise, marking the point marking result corresponding to the maximum value of the Wen Gaozhi, the low-temperature value, the high-concentration value and the low-concentration value as the concentrated characteristic of the analysis point, and sending the concentrated characteristic of the analysis point to the supervision platform.
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