CN104005078A - Electroplating apparatuses and methods employing liquid particle counter modules - Google Patents

Abstract

Disclosed herein are electroplating apparatuses for electroplating metal onto a semiconductor wafer which may include an electroplating cell, an electrolyte circulation system connected to the cell for circulating electrolyte to and from the cell, first and second sampling ports for taking first and second sample of electrolyte at first and second locations in the apparatus, and one or more liquid particle counter modules, connected to the first and second sampling ports, for measuring particle concentration in the electrolyte. Also disclosed herein are methods for reducing particle concentration in an electrolyte present in an electroplating apparatus which may include determining an approximate particle concentration using a liquid particle counter module and modifying the operation of the electroplating apparatus to reduce particle concentration in the electrolyte.

Description

Adopt electroplanting device and the method for liquid particle counter module

The cross reference of related application

The application requires on June 21st, 2012 application, be entitled as the U.S. Provisional Patent Application No.61/662 of " LIQUID PARTICLE COUNTER FOR ELECTROPLATING APPARATUS ", 853, its full content is incorporated to herein by reference, and for all objects.

Technical field

Present invention relates in general to field of electroplating, relate more specifically to adopt electroplanting device and the method for liquid particle counter module.

Technical background

Be electroplate with many application.One of them important application be on semiconductor wafer electro-coppering to be formed for the conductive copper wire of individual devices of " wiring " unicircuit.Conventionally, this electroplating technology is as the step in Damascus manufacturing processed for example.Other important application comprise silicon through hole (TSV) plating and wafer-class encapsulation (WLP).In modern wafer electroplating processes, lasting problem is the quality of the metallic membrane of deposition.Special concern be deposition metallic membrane on defect.The example of such defect comprises the defect that pit, projection and the particle/aggregation because forming on film produces.Later stage in device manufacturing course is often electroplated, and now treated wafer is worth several thousand dollars.The defect of introducing in this stage can cause unicircuit manufacturers to bear heavy losses.

The end user of advanced plating tool collects defect information common every day.They by electroplating and plating defect being counted and can be accomplished this point in monitor wafer.The defect that produces pit in electrolytic coating is problematic especially, and any defect is all harmful to.The defect estimation of the electroplanting device by usage monitoring wafer has been introduced various problems.First, monitor wafer is quite expensive.In addition, the time of electroplating in monitor wafer of cost is the stop time of device.Can not Electroplating Production wafer when monitor wafer is installed.In addition, when and where the monitor wafer of use can not accurate positioning device break down because particle produces.

Summary of the invention

The present invention proposes the various embodiments of liquid particle counter (LPC) module as the member of plating tool.LPC module can help to detect the particle in electrolytic solution, makes the planner of electroplanting device and operator introduce remarkable defect in problematic condition and solved these problematic conditions before wafer.In design phase, research and development stage and wafer manufacture phase process, the enforcement of LPC module has been proved to be useful.For example, in some embodiments, in electroplanting device, the monitoring of the continuous particulate of different positions can provide stable technique mark, so that the condition of the member on instrument/device of selecting in production process is known.In addition, can the chemicals that enter in electrolytic solution be provided in different positions and/or previously be combined in the detection that enters the chemicals in electrolytic solution.In addition, detect the defect performance in prediction of wafer exactly, only acquisition traditionally conventionally after wafer is processed with unit metering outfit of this tolerance (metric) at the LPC that is chosen as the position that solves specified defect type.In some embodiments, the open enforcement of the LPC module on plating tool/device allows to carry out comprehensive detection and diagnosis scheme, and this scheme has disclosed real-time instrument condition and subsystem fault eliminating in time and safeguarded.In addition, LPC module can be for producing the isolation of the hardware of particle in research and design process at this device.In some cases, such hardware component can be changed before producing, thereby likely reduced the defect of producing wafer.

In some embodiments, LPC module can be used the method for scattering of light as particle detection.Grain types as different in solid particulate and bubble etc. may produce similar LPC scattering mark.In some embodiments, LPC module is connected to the multiple thief hatchs that are distributed in whole device.Single LPC module can detect granule density in the multiple different position from whole electroplating device.Thief hatch can be designed and be positioned to catch or get rid of the particle of some type.For example, thief hatch can be designed to get rid of bubble and makes it not arrive LPC module.

Some embodiment disclosed herein relates to plated metal to the device on substrate.The feature of described device is following characteristics: (a) for plated metal to the plating tank on substrate; (b) be connected to the electrolyte circulation system of described plating tank; (c) for measuring the one or more liquid particle counter modules at electrolyte solution middle particle concentration; And (d) the two or more positions in this device for the thief hatch of sample drawn.In various embodiments, described device is arranged to electro-coppering.

Single liquid particle counter module can be configured to analyze the sample from multiple thief hatchs.For this reason, liquid particle counter module can be coupling-connected to manifold, can optionally monitor thief hatch.Manifold and the device being associated can comprise: the valve of each thief hatch, the electrolytic solution of sample is drawn into one or more pumps of LPC module, and for transporting selectively at specified time from one or more valves of specific mouthful sample and relevant controller.

In some embodiments, liquid particle counter module is designed to analyze flow rate between approximately 2 and 250 ml/min, or flow rate is between approximately 5 and 100 ml/min, or flow rate is between approximately 5 and 50 ml/min, or flow rate is between approximately 5 and 20 ml/min, or flow rate is the electrolytic solution between approximately 9 and 11 ml/min.In some implementations, described liquid particle counter module can be coupling-connected to discharger.Therefore, in some embodiments, the sample recording may not necessarily be recycled to electroplanting device.

In some embodiments, described liquid particle counter module is configured to collecting granules in the container for granule based on size.The example of the size range of the particle of different containers comprises: diameter is between approximately 0.1 and approximately 0.15 micron, diameter is between approximately 0.15 and approximately 0.2 micron, diameter is between approximately 0.2 and approximately 0.3 micron, and diameter is between approximately 0.3 and approximately 0.5 micron, and diameter is greater than approximately 0.5 micron.

In some implementations, thief hatch can have and is arranged at points different in electrolyte circulation system and/or plating tank tactfully.Electrolyte circulation system can comprise various types of flow elements (as pump).Upstream and/or downstream that thief hatch is located immediately at studied flow element can be set.The processing flow element that terminology used here " directly " represents there is no other is between described thief hatch and the described flow element studied.

In some embodiments, at least one in thief hatch is directly arranged at the downstream of pump.Another thief hatch can be arranged at the upstream of identical pump.In the design of some devices, described electrolyte circulation system comprises the second pump and the 3rd optional pump, and extra thief hatch is directly arranged at the downstream of described the second pump and optional described the 3rd pump.

Electrolyte circulation system can comprise bath (bath) container, and it can hold at least one in described thief hatch.Described electrolyte circulation system can comprise one or more contactors (design is so that electrolytic solution is degassed), and can have the thief hatch in the downstream that is directly arranged at described contactor.In some embodiments, described electrolyte circulation system can comprise one or more particulate filters, each (or relative) thief hatch that has himself, and this thief hatch is directly arranged at the downstream of corresponding strainer.

In some embodiments, at least one in thief hatch can be directly arranged at the upstream of described plating tank.In some embodiments, at least one in described thief hatch is arranged at least one the inside in described plating tank.In some embodiments, at least one in described thief hatch is arranged at the barrier film near plating tank inside.This barrier film can be the anolyte compartment (Separated Anode Chamber) of the further separation of following explanation or the part of SAC.

Schemes more of the present invention relate to the method for the granule density in the electrolytic solution existing for definite electroplanting device, and this electroplanting device comprises electrolyzer and electrolyte circulation system.The feature of described method is following characteristics: (a) by the sample of electrolytic solution, the thief hatch from described device is directed to liquid particle counter module; (b) determine the granule density of thief hatch by liquid particle counter module; (c) regulate the operation of described electroplanting device, to reduce granule density.In some embodiments, regulate the described operation of described electroplanting device to relate to determine the source of particle contamination and change described source with minimizing granule density with suitable instrument, chemicals or member.

Therefore, herein disclosed is for plated metal to the electroplanting device on semiconductor wafer.In some embodiments, described device can comprise the plating tank for hold anode and electrolytic solution at electroplating process, be connected to described groove for making electrolytic solution be to and from the electrolyte circulation system of described groove circulation, and be connected to described one or more thief hatch for measuring one or more liquid particle counter modules of granule density of described electrolytic solution.In some embodiments, described one or more thief hatch can comprise the first thief hatch of taking the first sample of electrolytic solution for the first location place at described device, and takes the second thief hatch of the second sample of electrolytic solution for the second position place at described device.In some embodiments, described device can comprise the manifold that is connected at least two thief hatchs and at least one liquid particle counter module, and in some such embodiment, described device can also comprise two or more valves, for controlling electrolytic solution flowing from least two thief hatchs to described manifold, and in some further embodiment, controller comprises machine readable instructions, for controlling the opening and closing of described two or more valves, thereby control described flow of electrolytic solution from described at least two thief hatchs to described manifold.In some embodiments, described device can also comprise discharger, and at least one liquid particle counter module can be connected to described discharger.

In some embodiments, at least one in the described LPC module of described electroplanting device can comprise the particle collector of selectable size, and this particle collector has the container based on size for collecting granules.In some such embodiment, the described container based on size can comprise: the first container, and it is for collecting the particle of diameter between approximately 0.1 and 0.15 micron; Second container, it is for collecting the particle of diameter between approximately 0.15 and 0.2 micron; The 3rd container, it is for collecting the particle of diameter between approximately 0.2 and 0.3 micron; The 4th container, it is for collecting the particle of diameter between approximately 0.3 and 0.5 micron; And the 5th container, the particle that it is greater than approximately 0.5 micron for collecting diameter.

In some embodiments, electroplanting device can also comprise pump, be located immediately at the thief hatch of downstream and the upstream of described pump, and described device can also comprise controller, this controller is configured to the granule density of the upstream and downstream of (i) monitoring described pump, (ii) determines when this pump produces the grain amount that exceedes threshold value; And (iii) when described pump produces while exceeding the grain amount of described threshold value, produce alarm and/or regulate the operation of described device.

In some embodiments, can there is the thief hatch of the inside that is positioned at described plating tank, and described electroplanting device can also comprise controller, this controller can be configured to: (i) the granule density of monitoring the inside of described plating tank, (ii) determine when that the described granule density in described plating tank is greater than threshold level, and (iii) in the time that the described granule density in described plating tank is greater than threshold level, produces alarm and/or regulate the operation of described device.

In some embodiments, a kind of electroplanting device, it has plating tank, electrolyte circulation system, for take the first and second thief hatchs of the first and second samples of electrolytic solution at the first location of described device and second position place, and one or more LPC modules that are connected to described thief hatch, this device can also comprise controller, this controller is configured to (i) determine the approximate granule density in described the first sample by described one or more liquid particle counter modules, (ii) determine the approximate granule density in described the second sample by described one or more liquid particle counter modules, and (iii) regulate the operation of described electroplanting device to reduce the granule density in the electrolytic solution of being to and from described plating tank circulation.In some embodiments, described controller can be further configured to the source of determining the particle contamination in described device according to the described approximate granule density in the first and second samples, and in some such embodiment, regulate the described operation of described electroplanting device to comprise electrolytic solution is deflected from from the described source of particle contamination.In addition, in some such embodiment, the described source of particle contamination may be another plating tank of described electroplanting device, and electrolytic solution is deflected from and comprises and close one or more valves so that this groove is isolated from described electrolyte circulation system from described groove.In some embodiments, described controller can be configured to guide described first sample of electrolytic solution from described the first thief hatch to described one or more liquid particle counter modules, and guides described second sample of electrolytic solution from described the second thief hatch to described one or more liquid particle counter modules.

In some embodiments, a kind of electroplanting device, it has plating tank, electrolyte circulation system, for take the first and second thief hatchs of the first and second samples of electrolytic solution at the first location of described device and second position place, and one or more LPC modules that are connected to described thief hatch, this device can also comprise controller, this controller is configured to (i) determine the approximate granule density in described the first sample by described one or more liquid particle counter modules, (ii) determine the approximate granule density in described the second sample by described one or more liquid particle counter modules, if and (iii) the described approximate granule density in described the first sample and/or described the second sample exceedes threshold value, if and/or the value of difference between described approximate granule density in described the first and second samples exceedes threshold value, send the operator of alarm to described electroplanting device.

Herein disclosed is a kind ofly for reducing the method for the granule density in the electrolytic solution that electroplanting device exists, this electroplanting device has plating tank and for making electrolytic solution be to and from the electrolyte circulation system of plating tank circulation.In some embodiments, the method can comprise that first thief hatch of the first sample that (i) guides electrolytic solution from described device is to one or more liquid particle counter modules, (ii) determine the approximate granule density in described the first sample by described one or more liquid particle counter modules, (iii) second thief hatch of the second sample that guides electrolytic solution from described device is to one or more liquid particle counter modules, (iv) determine the approximate granule density in described the second sample by described one or more liquid particle counter modules, and (v) regulate the operation of described electroplanting device to reduce the granule density in the electrolytic solution existing in described electroplanting device.In some such embodiment, regulate the operation of described electroplanting device can comprise the source of determining particle contamination according to the approximate granule density in the first and second samples, and change the described source of particle contamination.According to different embodiments, the described source of particle contamination can be chemicals or the member in described electroplanting device.In other embodiments, regulating the operation of described electroplanting device to comprise deflects from electrolytic solution from the described source of particle contamination, and in some such embodiment, the described source of particle contamination may be plating tank, and electrolytic solution is deflected from and comprises and close one or more valves with by the recycle system isolation of described groove and described electrolytic solution from described groove.

Be described in further detail below these features of the present invention and further feature with reference to relevant accompanying drawing.

Brief description of the drawings

Fig. 1 shows the electroplanting device to semiconductor wafer for plated metal, and described electroplanting device comprises three plating tanks, is connected to three grooves so that electrolytic solution is to and from the electrolyte circulation system and the liquid particle counter module that circulate in each groove.

Fig. 2 shows several example thief hatchs that are provided for discharging bubble.

Fig. 3 has shown the particle that produced by the pump of the different brands analytical results compared with their particle performance.

Fig. 4 has shown in the time that additive joins in electrolytic solution, the chart of the granule density that the electrolytic solution of the related electroplanting device of tool work daily record of monitoring and displaying time measures.

Fig. 5 has shown an embodiment of the contact between number of defects on granule density and sheet.

Fig. 6 has shown an embodiment of the electroplanting device with plating tank and electrolyte circulation system.

Fig. 7 has shown an embodiment of the plating tank of the separative anolyte compartment of tool.

Fig. 8 shown there is plating tank, electrolyte circulation system and for regulating the embodiment of electroplanting device of system of one or more anolyte compartments internal pressure.

Fig. 9 has schematically illustrated a kind of method of the granule density that reduces the electrolytic solution in electroplanting device.

Embodiment

After description in, will set forth many details so that fully understanding embodiment of the present invention to be provided.Disclosed embodiment can be implemented in the case of lacking some or all in these details.In other cases, known technological operation is not described in detail in order to avoid fuzzy disclosed embodiment unnecessarily.Disclosed embodiment is described together in connection with specific embodiment simultaneously, and this should not be understood to limit disclosed embodiment.

In this application, term " semiconductor wafer ", " wafer ", " substrate ", " wafer substrates " and " unicircuit that part is made " are used convertibly.It will be appreciated by those skilled in the art that these terms can refer to the silicon wafer in any one stage in many stages of manufacturing at unicircuit.Detailed description below supposes that disclosed implementation operates in wafer substrates.But disclosed implementation is not limited to so.Workpiece can be different shape, size and material.Except semiconductor wafer, can utilize other workpiece of disclosed implementation to comprise various article, as printed circuit board (PCB) and analogue.

Further, in this application, term " electroplate liquid ", " plating bath ", " bath ", " electrolyte solution " and " electrolytic solution " exchange are used.It will be appreciated by those skilled in the art that these terms can refer to the solution that comprises metal ion and possible other additives, for plating or plated metal to workpiece.

Embodiment disclosed herein relates to, and in electroplating process, reduces configuration and the method for the use plating tool equipment of the defect in wafer substrates.Embodiment disclosed herein can be applicable to electroplanting device and method, and electroplanting device and method are designed to be vaccinated for example 300 millimeters or 450 millimeters of wafers of thin conductive seed layer.In some embodiments, method and apparatus as herein described can be used as disposing for example Sabre of Lam Research company ^tMthe upgrading of the electroplanting device of instrument and so on.In some embodiments, described device can be installed on existing on-the-spot instrument and also can be arranged on complete and or the electroplating system of coming of new in.Disclosed liquid particle counter system allows terminal user to monitor and maintain the normal of electroplanting device, for example to prevent from being plated high the scrapping of cost of wafer.In some embodiments, disclosed system also can be used for distinguishing problematic element by device planner, and described element is introduced the particle that may cause the problem defect that is plated wafer.

The each irrelevant project of embodiment disclosed herein in can tracer liquid electrolytic solution.These projects comprise bubble and solid particulate.Generally speaking, the bubble, solid particulate and other the little defects that in electrolytic solution, have problems are all called as " particle " in this article.

Particle detection can be carried out according to the different elements or the characteristic of fluid that connect by electrolyte circulation system fluid.Electrolyte circulation system described herein can comprise different characteristic of fluid.These characteristic of fluid can include, but not limited to fluid line (comprising line or weir), strainer, pump, fluid intake, fluid outlet, valve, level sensor and under meter.Be understandable that, any valve can comprise the valve of manual valve, air control valve, needle-valve, electrically operated valve, vent valve and/or any other applicable type.Any one or more in these features can be deleterious particle sources.For this reason, any one that electrolytic solution can be in these features or several before or after carry out the analysis of particle.

Fig. 1 shows device 100, for plated metal, to semiconductor wafer, described semiconductor wafer comprises three plating tanks 14, is connected to three grooves so that electrolytic solution is to and from the electrolyte circulation system and liquid particle counter (LPC) module 171 that circulate in each groove.Electrolyte circulation system is schematically illustrated in Fig. 1 by different elements (as bathed container 12, pump 120, contactor 182, strainer 186) to the line of plating tank 14 of coupling device 100, and electrolyte movement direction represents with stack arrow on line.Fig. 1 also shows, and in some embodiments, device 100 can comprise optional LPC module 172.Dotted line shown in figure represents to add/optional LPC module 17 how fluid be connected to the rest part of electrolyte circulation system.

Fig. 1 has shown different thief hatch 180 to be positioned at about the little circular element of the different positions of the device 100 of electrolyte circulation system.They are each identifies to distinguish their different positionss in device with letter.Thief hatch 180 is for the sampling of electrolytic solution, so that sample can be transferred to LPC module 171 and optional LPC module 172, for grain size analysis.This grain size analysis can comprise the real-time measurement of the granule density in the electrolytic solution that flows through thief hatch, and described LPC module is connected to described thief hatch, so that the granule density of the different elements of the device 100 of flowing through can monitored (being Real-Time Monitoring) sometimes.Electroplanting device, according to different embodiments, can adopt any one or two in described thief hatch 180 as shown in Figure 1 or three or multiple or all.In addition,, according to special embodiment, can adopt the more or less thief hatch 180 than as shown in Figure 1.

Can be monitored in the element of electroplanting device 100 and parts be that in plating tank 14(figure, separate marking is " plating tank " 1,2 and 3), separate marking is " pump " 1,2,3 in pump 120(figure) and contactor 182(figure in separate marking be " contactor ").Contactor is used for gas dissolved and/or bubble to remove from electrolytic solution.In other devices 100, can detected element comprise and electroplate bath of liquid container 12(and be labeled as in the drawings " baths ") and strainer 186(figure in separate marking be " strainer ").The thief hatch 180 of each of these elements is connected to LPC module by the applicable fluid line schematically showing in Fig. 1.

The granule density itself obtaining from single sampling location and particle size dispersion information or together with being used to evaluation device state from the information of other sampling locations.The scope of electroplanting device state estimation includes but is not limited to (1) tool elements performance, (2) instrument chemical state, and (3) wafer defect characteristic.

For the classification of the thief hatch position of lpc analysis comprise at least following these:

1. plating tank

2. for example bathe Rong Qi –: for holding the container to the electrolytic solution of one or more plating tanks.

3. pump

4. strainer

5. contactor

In some embodiments, thief hatch is arranged on the upstream and downstream of flow element under study for action.By this way, described element can be isolated to determine whether it is the sources of particles of polluting electrolytic solution.

Therefore, in some embodiments, electroplanting device can have one or more pumps and can have the thief hatch in one or more downstreams that are located immediately at pump.For example, the electroplanting device 100 shown in Fig. 1 has the thief hatch 180 that is located immediately at pump 120 downstreams.In some embodiments, thief hatch can be located immediately at the upstream of pump, or can have the thief hatch that is located immediately at the upstream of pump and is located immediately at the downstream of pump.Rear a kind of configuration for example, can make to judge the contribution of pump to electrolytic solution middle particle concentration directly beyond all doubtly.

Similarly, in some embodiments, electroplanting device can have one or more particulate filters and can have one or more thief hatchs that are located immediately at particulate filter downstream.For example, the electroplanting device 100 shown in Fig. 1 has the thief hatch 180 that is located immediately at strainer 186 downstreams.In some embodiments, thief hatch can be located immediately at the upstream of particulate filter, or can have the thief hatch that is located immediately at the upstream of strainer and is located immediately at the downstream of strainer.Rear a kind of configuration for example, can make to judge the effect of particulate filter to electrolytic solution middle particle concentration directly beyond all doubtly.

Similarly, in some embodiments, electroplanting device can have one or more contactors and can have one or more thief hatchs that are located immediately at contactor downstream.In some embodiments, thief hatch can be located immediately at the upstream of contactor, or can have the thief hatch of the upstream and downstream that is located immediately at contactor.Rear a kind of configuration for example, can make to judge the contribution of contactor to electrolytic solution middle particle concentration directly beyond all doubtly.For example, the electroplanting device 100 shown in Fig. 1 has the thief hatch 180 that is located immediately at contactor 182 upstream and downstreams.

Similarly, in some embodiments, electroplanting device can comprise and is located immediately at the plating tank upstream of one or more electroplanting devices and/or the thief hatch in downstream.But thief hatch also can be positioned at any convenient location of plating tank inside.In some such embodiment, thief hatch is as far as possible near wafer setting.But some specific positions are found to have special use in the design of SAC groove:

(a) SAC(in wafer catholyte liquid chamber separates anolyte compartment) top of film.The particle that these mouthfuls produce identification strainer is very useful.They extraly in identification slot by for example precipitating the particle producing on the spot.Therefore, dispose and separate the thief hatch that the electroplanting device of anolyte compartment can have close film and be positioned at its downstream in plating tank, described film is separated the separation anolyte compartment in plating tank and catholyte liquid chamber.

(b) near ion resistance groove-shape element (ionically resistive channeled element) (be sometimes called HRVA and be below described).In some embodiments, thief hatch is positioned near the excircle of HRVA and a little above HRVA.At the thief hatch of such position to detecting particle that bubble is relevant of great use.

Thief hatch also can be positioned at the bath container of electroplanting device and/or be positioned at electroplanting device bath container upstream and/or be positioned at the downstream of the bath container of electroplanting device, such bath container for example: as the bath container 12 shown in the part of the electroplanting device 100 in Fig. 1.Bathe container and can hold extra electrolytic solution, as shown in Figure 1, the one or more plating tanks 14 in electrolytic solution turnover electroplanting device 100 capable of circulation.Bathe the thief hatch 180 in container, as being labeled as the thief hatch of " P " in Fig. 1, the degraded chemical substance of sources of particles introduce chemical substance or to(for) identification of great use.Overtime monitoring is bathed electrolytic solution in container and can be learnt that some chemical compositions in electrolytic solution are degraded and generate particle etc.

Single thief hatch 180 can become to catch or discharge bubble according to the position configuration of thief hatch.The pump moving by cavitation is may originating of bubble pollutent.Therefore can be configured to catch bubble and solid particulate near the thief hatch of pump.From example, can see A, the B in Fig. 1, the downstream that C thief hatch 180 is located immediately at 1,2, No. 3 pump 120.But, the thief hatch (each of for example Fig. 1 G, H and I thief hatch 180 is located immediately at the downstream of strainer 186) that is arranged in strainer downstream can be configured to only catch solid particulate, because the strainer ging wrong probably produces particle instead of bubble.

In some embodiments, the thief hatch that is designed to catch bubble is arranged on the position that bubble may gather.For example, thief hatch can be down and is easily gathered the flow element at place near conduit top or other bubbles by its natural buoyancy.

In other embodiments, bubble is discharged from thief hatch, and thief hatch can be arranged on the bottom of flow element or the place that other bubbles can not gather.Some examples have been shown in Fig. 2.Notice that the entrance of thief hatch opening upwards enters main fluid conduit conventionally in these examples, so that mobile bubble has to be difficult for occurring because of the buoyancy of previously described bubble because downward velocity component flows into the thing of thief hatch in main pipe.

The LPC module of embodiment as herein described can obtain from different sources.They can be the special structure of invention as herein described or they can be conventional instruments.LPC module is available on market.In different embodiments, suitable LPC module is that those promote the module to chemical industry and medical industry.Particle Measuring Systems, Lighthouse and RION are some suppliers that produce LPC module.Certainly, embodiment of the present invention is the limited LPC module that these suppliers provide.

In some embodiments, LPC module is used optical detective technology, and it utilizes scattering effect to detect particle.In each embodiment, LPC module adopts the laser beam through the electrolytic solution sample flowing or stagnate.In some embodiments, wavelength is near infrared or red (for example, 633nm).Selected wavelength is the function of particle size to be detected.Particle in nano-scale range can utilize the laser beam with relative short wavelength to detect.Photodetector is positioned near the volume element of incident beam around.Can also use other particle detection mechanism (, not depending on those particle detection mechanisms of scattering of light).

In some embodiments, LPC module in the scope of each side all between about 10 inches to 20 inches.LPC module can be placed on the position easily arbitrarily on electroplanting device, is configured so that LPC is attached to deoscillator or other vibration isolation mechanism.

LPC module is connected with one or more thief hatch fluids via applicable connection.In each embodiment, LPC module can be configured to multiplexed design, wherein the multiple thief hatchs of single LPC module queries.In some implementations, a LPC module once only can be measured from a thief hatch.Therefore it is continuous, making the LPC measurement of each mouthful of place's granule density in these mouthfuls.In some implementations, the LPC module fluid that some thief hatchs can be special with himself is connected, the granule density of special LPC module-specific in measuring the electrolytic solution sampling from this thief hatch.

For example, Fig. 1 shows plating bath container 12, and it has its inner electrolytic solution thief hatch " P " being connected with special LPC module 172 fluids.And, the line of flow that illustrates the shade of the fluid connection between thief hatch 180 and LPC unit 172 indicates the optional feature of additional LPC module 172 clearly, but, certainly should be understood that, many concrete details of the embodiment schematically showing in Fig. 1 are also optional (although not showing so clearly).

But often, LPC module shares substantially between thief hatch.A kind of mode that realizes this point is to pass through manifold.Therefore, as shown in Figure 1, manifold 188 can be for being transported to LPC module 171 by sample from each thief hatch 180.Certainly, skilled person will appreciate that, there is other shared mode that realizes LPC module, such as providing fluid path for sample electrolytic solution is transported to the suitable combination of circulation duct and the element of shared one or more LPC modules from each thief hatch by using.

If use manifold, manifold can be connected with at least two thief hatchs and at least one LPC module.Manifold 188 shown in Fig. 1 comprises the single outlet being connected from multiple entrances of multiple thief hatchs 180 and with LPC module 171.Manifold 188 can be configured to monitoring which or multiple thief hatch 180 and LPC module 171 by one or more the switching easily stopping or allow electrolyte stream to cross in multiple entrances.For example, plural valve can be used for controlling electrolytic solution and flows through entrance (, from least two thief hatchs to manifold).In addition,, as hereinafter discussed more comprehensively, in some embodiments, device 100 can comprise controller, the opening and closing of the plural valve of described controller control.In some embodiments, LPC module can be configured to electrolytic solution sample and measure the granule density in the electrolytic solution of following speed: in the about speed between 2mL/min and 250mL/min, or the speed between about 5mL/min and 100mL/min, or the speed between about 5mL/min and 50mL/min, or the speed between about 5mL/min and 20mL/min, or the speed between about 9mL/min and 11mL/min, or more particularly, in the about speed of 10mL/min.

As shown in Figure 1, in some embodiments, electrolytic solution sample fluid can be directed to discharger 126 after it leaves LPC module 171.Same discharger 126 is also used in it and captures the electrolytic solution sample fluid of using after leaving optional LPC module 172.The electrolyte flow of sampling is delivered to discharger after particle sizing instead of again led the possibility of the pollution that one or more measurement due in LPC module of getting back in the plating tank of having avoided final access to plant in electrolyte circulation system causes.

In many realizations, the sampling system being associated with LPC module comprises the conduit of different lengths as required being transported to LPC module to analyze from the each sample in multiple thief hatchs.In some embodiments, for the relevant granule density of monitoring period source, expect to use the conduit of short length.

In one embodiment, LPC module is configured to collect diameter and is at least the particle of 0.1 μ m.LPC module is also collected the particle in the particle storehouse based on size, to allow to generate the distribution of the size that detects particle.The example of the particle size range of collecting in these storehouses comprises: diameter is between about 0.05 μ m and 0.1 μ m, diameter is between about 0.1 μ m and about 0.15 μ m, diameter is between about 0.15 μ m and about 0.2 μ m, diameter is between about 0.2 μ m and about 0.3 μ m, diameter is between about 0.3 μ m and about 0.5 μ m, and diameter is greater than about 0.5 μ m.The scope of the particle size that can be detected by LPC module in other embodiments, depends on the selected LPC module for installing.

In one structure, electroplanting device can comprise the LPC module being connected with each thief hatch.In another structure, electroplanting device comprises two LPC modules, and one is arranged to monitor continuously coating bath container, and another is arranged to monitor continuously plating tank.Manifold or other LPC fluid system are configured to regulate as required fluid to carry to make it possible to that the sample analysis of other thief hatch from electrolyte circulation system is isolated to possible particle and generate source or pollutent or other defect cause.In some embodiments, at least one in LPC module can be shared by plural plating tank, and LPC fluid system is configured to sample to be transported to LPC module from each plating tank.

According to embodiment; conventionally also have the computer program and/or the codimg logic (being below only called " logic ") that are associated with one or more LPC modules, it works to control particle sizing operation, processing, storage and analysis to measure result conventionally; and conventionally operate LPC module, etc.Logic can be hard-coded in electronic unit or it can be realized by the software moving on treater.Equally, logic can be integrated in LPC module itself, or but it can be different from LPC module carry out on the hardware of communicating by letter with LPC module electronic.

In some embodiments, the various sampling fluids parameters of logical controllable that are associated with LPC module.For example, the adjustable sampling rate of logic, for example, measures the frequency of granule density from electrolytic solution sample by LPC module.Therefore, in some such embodiments, LPC module and the logic being associated thereof can generate the real-time granule density marks for treatment being associated with specific processing module/parts, although be the data representation at discrete sampling point place by obtaining in some timed intervals of being determined by aforementioned sample speed.The one or more predetermined mark characteristic of the mark being associated with specific features that then, this can be measured and these parts compares to judge whether these parts operate as desired in specification.Then, can by with the detection of predetermined labels and depart from and be treated to alarm significantly, alarm can be used for abnormal (or may be abnormal) situation to warn the operator to device.Be discussed in more detail below for example, example under the background that identifies defectiveness instrument (, defective pump or strainer), the detection of specification outer chemical process, etc.

But, it should be noted that, although can betiding, such processing and analysis in some embodiments (or its part) be integrated in one or more LPC modules in logic, but in other embodiments, the such processing of some or all and analysis can occur via the logic realizing on the central controller of electroplanting device, more generally, the central controller of electroplanting device can operate to control the overall operation of electroplating system.Now discussing system controller in further detail, and combined with it adjust in response to the granule density being measured by one or more LPC modules various electro-plating methods and the device that it operates.However, should be understood that, for realize the data processing of these technology and method and analysis logic can reside in LPC module originally with it, or on central controller, or on other data processing module of some in electroplanting device, or on outside data processing equipment, or on aforesaid arbitrary composition.Therefore, for example, in specific embodiment, each logic module can be positioned on one or more LPC modules originally with it and on central controller, and then LPC module and central controller operate to adjust the operation of electroplanting device in the mode coordinating or give the alarm in response to the outer granule density of the specification being measured by one or more LPC modules.

Adjust central controller and the logic of operation in response to the granule density being measured by LPC module

Therefore, each embodiment comprises central controller, and described central controller has controls the logic of processing operation according to the present invention.For example, central controller can and be configured to control some or all aspects of electroplating operations with electroplanting device coupling, comprise the granule density measuring result that monitoring is obtained by one or more LPC modules and it is reacted, be fed to anolyte and catholyte, the catholyte of releasing, carry anolyte to catholyte, etc.

In some embodiments, central controller is also configured to the signal that receives in response to the especially one or more LPC modules of all parts from system and the parameter of regulation system.These parameters can comprise flow velocity, dosage timing in electrolyte circulation system for example, control the opening and closing (referring to the manifold 188 in Fig. 1 for example) of opening and closing, the control of valve of the electrolyte flow valve relevant with manifold thus controlling which thief hatch (for example, referring to 180 in Fig. 1) makes its fluid of sampling be directed to one or more LPC modules (referring to the LPC module 171 in Fig. 1 for example), etc.For example, can utilize various sensors and volumetry (for example, pH sensor, voltammetry, acidity or chemical titration, spectrophotometric sensor, conductivity sensor, density sensor etc.) monitor particles concentration and/or coating bath concentration of component in anolyte and/or catholyte.In some embodiments, the concentration of electrolyte component is to utilize the independent supervisory system that comprises LPC module to determine from outside, and concentration is reported to central controller by it.In other embodiments, from systematic collection to raw information be sent to controller, controller carries out concentration judgement according to raw data.In either case, central controller can be configured to cutoff device, collects the further information granule density of specific location (for example), and regulate batching parameter or flow parameter in response to these signals and/or concentration, thereby the homeostasis of keeping system.In addition, in some embodiments, volume sensor, fluid level sensor and pressure transmitter can be used for providing feedback to controller.In some embodiments, can carry out guiding pump control from the algorithm of the signal of the one or more LPC modules in pressure regulating device and/or horizon sensor by utilization.

Conventionally, central controller will comprise one or more vessel assemblys and be configured to realization actuating logic so that device can be carried out the one or more treaters according to method of the present disclosure.The machine readable media that comprises the instruction of controlling treatment in accordance with the present invention operation can be coupled with central controller.

Now various technology, algorithm and/or the method for adjusting the operation of electroplanting device in response to granule density measuring result will be disclosed under the background of central controller, should understand (as discussed above) disclosure and contain these designs, no matter where particular embodiment by chance resides at physically with the logic that realizes these designs.

For example, in some embodiments, first central controller guides one or more LPC modules to judge that whether the granule density in plating tank is excessive.This information can be directly related with handling property, because as described above, the high granule density in plating tank generally can cause wafer defect and poor plating performance.The LPC module (or multiple module) that is used for the granule density of judging plating tank can be connected with the thief hatch fluid in plating tank downstream being located immediately in electrolyte circulation system, or thief hatch can be positioned at the inside of plating tank.In plating tank has some embodiments of independent anolyte compartment (as other place is described herein), thief hatch can be positioned on by the separated film of cathode compartment in independent anolyte compartment and plating tank nearby and downstream.In any case, central controller can be configured to monitor the granule density in plating tank inside via the one or more LPC modules that are connected with one or more above-mentioned thief hatchs, and judges when the granule density in plating tank is greater than threshold level.If exceed predeterminated level, central controller can be configured to produce the operation of warning and/or setting device.In addition, in some embodiments, due to the importance of grain count in plating tank itself, one or more LPC modules and central controller can be configured to the position of wafer in plating tank granule density is sampled more continually.(sampling rate of measuring for granule density is discussed above.）

And, in some embodiments, if high granule density (as just described) detected in plating tank, central controller can be configured to guide the operation of each LPC module that is arranged in electrolyte circulation system to measure the granule density of all parts upstream and downstream in addition, produces high granule density with which parts most probable of doing the best in decision maker.In this way, the logic adopting on central controller can play the effect of attempting isolating problem source.Hereinafter by more detail and illustrate under concrete background aspect some of this process.

I. the LPC of upper tool part part performance monitoring

Can monitor the each module/parts on electroplanting device for particle performance (generation, filtration, accumulation etc.).Produced excessive particle if module/parts learn or suspected, one or more LPC modules can be designated with monitoring from the granule density of electrolytic solution sample of thief hatch of upstream and downstream that is located immediately at suspicious parts.Then, can the difference based between two LPC readings carry out count particles and produce speed, for example, if the value of the difference between the approximate granule density in upstream sample and downstream sample exceedes threshold value, can alerts triggered or the operation of setting device.Similarly, for the parts/module that is designed (or known) and leaches particle, LPC module can be designated with monitoring respectively at the granule density of the upstream and downstream of specific parts/module, and can the difference based on two LPC readings carry out count particles filtering rate.If module learnt or suspected accumulation particle, LPC module can be designated with monitoring granule density before particular module and afterwards and can the difference based on two LPC readings carry out count particles retention rate respectively.When LPC monitor showing goes out to depart from can accept reference range time, need repairing or change module or parts.The method can also be applied to the more both different brands of limiting-members or the performance of model, thereby can select the parts of optimal performance for electroplanting device.

Pump be for illustrate LPC module how for assessment of with the useful example of screening pump performance.Fig. 3 shows the result being obtained by the analysis of the particle of the pump generation about different brands.The pump of two types compares at particle aspect of performance.In order to calculate the particle being produced by pump, LPC module is for sample to the electrolytic solution of the pump discharge from each pump (, the direct granule density in pump downstream of monitoring) and entrance (, the direct granule density in pump upstream of monitoring) simultaneously.The difference of pump discharge and pump intake speed is that pump particle produces speed.As shown in the figure, pump B shows than the obvious few particle of pump A and produces.

Similarly method can be implemented in central controller and for example, for monitoring in time the particle performance of pump or other upper tool part part (, strainer, degasser, contactor etc.).This real-time parts monitoring can identify performance issue before performance issue leads to, and therefore prevented catastrophic event of failure.For example, in conventional electroplating system, mostly time, do not monitor pump performance.Conventional way is, in the time that pump has fault or in the time that it reaches its recommendation life-span, to change pump.For the former situation, before pump has fault, pump produces the granule density improving in the time span extending, and this adversely affects defect and the traits of yield of plating tool.For the latter's situation, the recommendation life-span is that the average pump based on different standards is advised.For special pump, the recommendation life-span may be too early or is excessively late.As shown in Figure 3, the data display of collection goes out the possible wide region variation of pump performance.Therefore, the pump performance of single pump can be assessed potentially via the monitoring of the pump operation of central controller and LPC module, the balance of the cost/performance of improvement may be reached.

Therefore, in order to monitor all parts of electroplanting device and identified performance issue before performance issue to lead to serious event of failure, in some embodiments, electroplanting device can adopt be located immediately at components downstream thief hatch, be located immediately at the thief hatch of parts upstream and be configured to the central controller of the granule density of monitor component upstream and downstream.By this monitoring, central controller can be configured to judging part and whether and when produce the particle more than threshold quantity, and if be, identifies particle contamination source, produces the operation of warning and/or adjustment electroplanting device as response.Operation adjustment can turn to electrolytic solution away from the logic in particle contamination source, from the operator's that electrolyte circulation system removes the logic of destructive parts, alarm that parts need to be changed sends to electroplanting device logic or possible shutoff electroplanting device until can safeguard the logic of avoiding valuable wafer to be damaged for for example carrying out.In some cases, particle contamination source may be other plating tank, and electrolytic solution is turned to away from this groove may comprise and close one or more valves with by the rest part isolation of destructive parts and electrolyte circulation system.

As mentioned above, parts can be pump, but it can also be the parts of other type as above.For example, if parts are strainer, whether relevant consideration may fully reduce by the amounts of particles in the electrolytic solution of strainer for strainer.In this case, about monitor filter, controller can be configured to the granule density of monitor filter upstream and downstream, and is configured to judge strainer when to have fault and reduces grain amount to threshold level or reduce amounts of particles and make particle ratio in downstream electrolytic solution and upstream electrolytic solution below threshold rate.If judged like this, the operation that controller can be configured to produce alarm as response and/or adjust electroplanting device.For example, warn the operator of electroplanting device to change destructive strainer by transmission.

II. the LPC of chemical substance state monitoring on instrument

Various chemical substances are transported to plating tank to realize electroplating process.Electroplate the main focus of institute and be, the existence of the molecule of the chemical substance entering and the particle that produces in various chemistry and surrounding environment (air, temperature etc.) and in the interaction between chemical substance during electroplating process.Can adopt the LPC monitoring chemical state of matter in real time of sampling by suitable position.

Fig. 4 provides the diagrammatic representation of granule density in the coating bath of monitoring plating tool.The spike of granule density occurs with the different timed intervals, shows that source of pollution enter in solution container.By differentiating source of pollution by relevant to tool events daily record LPC data.In Fig. 4, the frame of mark is corresponding to importing the additive in coating bath in each time in the time that granule density spike occurs.In this case, additive A is diagnosed as source of pollution.Further investigation shows, additive A has been degraded and has no longer been suitable for using on instrument.As illustrated in example, by implementing LPC monitoring, can identify in time chemical substance problem.As a result, when discovering tool situation is unsuitable for the processing of wafers valuable resource that contributes to avoid waste.

III.LPC monitors and mates with the direct of defects on wafers performance

Defects on wafers performance is the tolerance to plating tool.Small particle is the one of the main reasons of defects on wafers.The ordinary method that obtains defects on wafers data is after wafer is aborning by coating, conventionally to expend a few hours to measure with various independently measurement facilities the wafer of processing.Consequently, drift about indefinite in the situation that in defect, before a few hours after problem occurs, all can not find event, wasted during this period the time of multiple wafers and instrument.But, by implementing in position LPC sampling, can obtain wafer during by coating to the defects on wafers particle data that quantitative and qualitative analysis is relevant in real time.Fig. 5 shows such example.During wafer coating, observe the rising tendency (solid line) of solid granulates concentration, this is identified by the wafer of crossing in the upper check processing of measurement facility (yellow dots will) subsequently.As shown in drawing, LPC data are obviously mated with defects on wafers counting very much.Because the granule density data from LPC module are provided in real time, can be in the detection that may carry out defect drift event the time the earliest, and the valuable resource of therefore avoiding waste, and enable to eliminate in time defect fault cause.

With plating tank and the device of the example of recirculation system

Explain the concrete example of the plating tank with recirculation system and the device that can be incorporated to thief hatch as above and LPC module now with reference to Fig. 6-8.

Submitting in US application serial No. 13/051 on March 18th, 2011, that denomination of invention is the people such as Rash for " ELECTROLYTE LOOP FOR PRESSURE REGULATION FOR SEPARATED ANODE CHAMBER OF ELECTROPLATING SYSTEM ", invention people, in 822, described an example with the applicable electroplanting device of recirculation system in detail, the full content of this application is incorporated in herein by reference.Submitting in US application serial No. 13/305 on November 28th, 2011, that denomination of invention is the people such as Mayer for " ELECTROPLATING APPARATUS AND PROCESS FOR WAFER LEVEL PACKAGING ", invention people, in 384, described other applicable electroplanting device, the full content of this application is incorporated in herein by reference.

Now will the example of the electroplanting device that comprises plating tank and electrolyte circulation system be described.With reference to Fig. 6, electroplating system 10 comprises feed proportioning system 11, and it changes the chemical composition of plating bath 12 in solution container.Thief hatch (not shown) can be positioned on the inside of solution container and is connected with LPC module.Anode and catholyte delivery system 13-1 and 13-2 are delivered to plating tank 14 by anolyte and catholyte (being sometimes called " anolyte " and " catholyte ") respectively.Thief hatch (not shown) can be positioned on the inside of plating tank 14, is connected separately with LPC module.Electroplating solution can also be respectively turns back to the plating bath 12 solution container by anode and catholyte delivery system 13-1 and 13-2 from plating tank 14.

Only give an example, anolyte delivery system 13-1 can be the closed loop system of circulating anode electrolytic solution.Excessive anolyte can turn back in plating bath 12 as required.Catholyte delivery system 13-2 can circulate and return the electroplating solution from the plating bath 12 in solution container.As described further below, anolyte delivery system can also be open loop system.

With reference now to Fig. 7,, show exemplary plating tank 14.Although plating tank 14 is shown as the plating tank of independent anolyte compartment (SAC) type, technician will appreciate that the plating tank that can use other type.Plating tank 14 comprises cathode compartment 18 and anolyte compartment 22, and cathode compartment 18 and anolyte compartment 22 are separated by film 24.Although what show is film 24, can adopt other demarcation structure, comprise sintered glass, porous polyolefin etc.Thief hatch (if present) can be configured to obtain sample catholyte and this catholyte is offered to LPC module from cathode compartment 18.Plating tank may need to adjust to adapt to thief hatch.In addition, can economize in some implementations striping.In each embodiment, the electrolytic solution in SAC is at the about copper between 10gm/l and 50gm/l and 0 and the about H between 200gm/l ₂sO ₄the aqueous solution of composition.

Film 24 can be supported by film frame (not shown).Only by way of example, film 24 can be microporous medium dielectric and that can comprise the direct fluid transmission of resistance.Only by way of example, film 24 can be cationic membrane.Only by way of example, cationic membrane can be included in trade name the film of lower sale, can obtain from Dupont Corporation of Wilmington Delaware.In the United States Patent (USP) 6,527,920 of authorizing the people such as Mayer and authorize the people's such as Reid United States Patent (USP) 6,126,798 and 6,569, in 299, described the electroplanting device with the film that is used to form independent anolyte compartment, the full content of these patents is incorporated in herein by reference.

Cathode compartment 18 and anolyte compartment 22 can comprise respectively the mobile ring of catholyte and the mobile ring of anolyte.Catholyte and anolyte can have identical or different chemical compositions and attribute.Only by way of example, anolyte can have been broken away from trough additive substantially, and catholyte can include trough additive simultaneously.

Anode 28 is arranged in anolyte compartment 22 and can comprises metal or metal alloy.Only by way of example, metal or metal alloy can comprise copper, copper/phosphorous, plumbous, silver/tin or other applicable metal.In some embodiments, anode 28 is inert anode (being sometimes referred to as " dimensional stabilizing " anode).Anode 28 is electrically connected with the plus end of power supply (not shown).The negative terminal of power supply can be connected with the Seed Layer on substrate 70.

The stream of anolyte is as shown in arrow 38 via central authorities mouthful and be fed in anolyte compartment 22 through anode 28.Optionally, one or more flow point stringing (not shown) are for delivery of anolyte.In the time using, flow point stringing can be along supplying with anolyte to strengthen the convection current from the surperficial dissolved ions of anode 28 towards the surperficial direction of anode 28.Optionally, the second thief hatch (not shown) can be connected to directly at the central authorities of the upstream of plating tank 14 mouthful or flow point stringing (not shown) sample electrolytic solution is transported to LPC module (not shown).

Anolyte flow through by manifold 32 in leave anolyte compartment 22 and turn back to anode electrolysis bath of liquid (not shown) at 30 places so that recirculation.In some implementations, film 24 can be taper to reduce the bubble of collecting at the middle body of film 24.In other words, anolyte compartment's top board is back taper.Can be arranged as the radially outer of adjacent membrane for the reflux line of electroplating solution.

Although it is solid that anode 28 is shown as, anode 28 can also comprise the multiple metalworks such as spherical or other shape (not shown) of layout (not shown) in heaps.In the time using the method, inlet streams manifold can be arranged in the bottom of anolyte compartment 22.Electrolyte stream can upwards be guided by porous anode terminal strip.

Anolyte is optionally directed on the surface of anode 28 to reduce with the accumulation of the active substance of dissolving or to exhaust the voltage being associated and is raise by one or more flow point stringings.The method also trends towards reducing anode passivation.

Anolyte compartment 22 and cathode compartment 18 are separated by film 24.Under the impact of applied electric field, positively charged ion is walked by film 24 and cathode compartment 18 and is arrived substrate 70 from anolyte compartment 22.Film 24 stops the electrolyte component diffusion of non-positively charged or convection current and substantially through anolyte compartment 22.For example, film 24 can stop negatively charged ion and non-charged organic electroplating additive.

The catholyte that is supplied to cathode compartment 18 can have the chemical constitution that is different from anolyte.For example, catholyte can comprise such as accelerator, inhibitor, leveler etc. additive.Only by way of example, catholyte can comprise chlorion, plating bath organic compound (such as thiocarbamide, benzotriazole, thiohydracrylic acid (MPS), two sulfhedryl propanesulfonic acid (SPS), polyoxyethylene, polyoxytrimethylene) and/or other applicable additive.

Catholyte enters cathode compartment 18 and walks by manifold 54 and arrives one or more flow point stringings 58 at 50 places.Although show flow point stringing 58, can save in some implementations flow point stringing 58.Only by way of example, flow point stringing 58 can comprise non-conductive tubular material, such as polymkeric substance or pottery.Only by way of example, flow point stringing 58 can comprise the pipe of hollow, and wall is made up of little sintered particles.Only by way of example, flow point stringing 58 can comprise the pipe of the solid wall that is wherein drilled with hole.

One or more flow point stringings 58 can be oriented and make opening be arranged to guide fluid to flow to film 24 places.Thief hatch (not shown) can be positioned in chamber 18, and the sample of fluid stream is transported to LPC module (not shown) to analyze.Flow point stringing 58 also can be oriented guiding fluid and flow to the region in cathode compartment 18 instead of be directed to film 24 places.The discussion with the electroplanting device of the flow point stringing with groove comprises and is that the people such as the invention people that submits on December 17th, 2009 is Mayer and its full content are incorporated in U.S. Patent application 12/640,992 herein by reference.

Electrolytic solution is finally walked by flow diffuser 60 and through near the lower surface of substrate 70.Electrolytic solution leaves cathode compartment 18 and turns back in plating bath in weir wall 74 as arrow 72 is shown in.

Only by way of example, flow diffuser 60 can comprise microporous diffuser, and it is greater than about 20% hole conventionally.Alternately, flow diffuser can comprise that ion resists channel floor, sometimes also referred to as the resistive virtual anodes of height (HRVA) plate, is incorporated in the United States Patent (USP) 7 that is published on November 24th, 2009 herein by reference such as its full content, in 622,024 shown one.Thief hatch can be positioned at ion and resists near the neighboring of channel floor and resist above the summary of channel floor at ion and be connected with LPC module for detection particle.It is useful for detecting the particle relevant to bubble that thief hatch is placed on to such position.Channel floor is typically less than about 5% hole and bestows higher resistance.In other is realized, flow diffuser 60 can save.

Each patent has been described the electroplanting device that can be suitable for implementing independent anolyte compartment of containing of embodiment disclosed herein (SAC).These patents for example comprise: United States Patent (USP) 6,126, and 798,6,527,920 and 6,569,299, each patent has been incorporated in the present invention by reference above; And be published on the United States Patent (USP) 6,821,407 on November 23rd, 2004 and be published on the United States Patent (USP) 6,890,416 on May 10th, 2005, the full content of these two patents is incorporated in herein by reference.Disclosed embodiment can also for example, by be designed to (to deposit two or more elements simultaneously, tin and silver) apparatus and method implement, such as submitting the U.S. Patent application 13/305 that is called " ELECTROPLATING APPARATUS AND PROCESS FOR WAFER LEVEL PACKAGING " in the name on November 28th, 2011, those apparatus and method of describing in 384, the full content of this patent application is that all objects are incorporated herein by reference.

In each embodiment, the electroplanting device using together with system described herein has " clam shell " design.At the United States Patent (USP) of authorizing the people such as Patton 6 that is published on December 5th, 2000,156,167 and be published on the United States Patent (USP) of authorizing the people such as Reid 6 on October 5th, 2004,800, in 187, described the general explanation of the clam shell electroplanting device with the aspect that is suitable for using together with the present invention in detail, these two patents are that all objects are incorporated in herein by reference.

Referring now to Fig. 8, show the example system 90 of the pressure for regulating one or more anolyte compartments.First anode chamber 22-1 and second anode chamber 22-2 comprise film 24-1 and 24-2, and it is arranged between anolyte compartment and the cathode compartment of correspondence.Reduced significantly the difficulty of bubble removal according to system 90 of the present disclosure, regulated the pressure in the 22-1 of anolyte compartment and 22-2 simultaneously, and without accurate pump and/or pressure feedback, this reduces cost and complexity.

Deionization (DI) water source 100 is provided to deionized water via valve 112 conduit 114 that can comprise thief hatch.Electroplating solution source 104 is provided to conduit 114 via valve 108 by electroplating solution or electrolytic solution.In some embodiments, device comprises the thief hatch that is located immediately at downstream, electroplating solution source.Electroplating solution can be primary formation solution (VMS).For a kind of discussion realizing of being furnished with VMS and DI water, referring to for example submitting in U.S. Patent application No.11/590 on October 30th, 2006, that invention people is the people such as Buckalew, 413, the full content of this patent application is incorporated in herein by reference.Pump 120 has the input aperture being communicated with conduit 114 fluids.The delivery port of pump 120 is communicated with the input aperture of strainer (not shown) via conduit 121.Thief hatch (not shown) can be connected with conduit 121 and via conduit (not shown), fluid sample is transported to LPC module (not shown) to carry out particle detection.In many embodiments, this strainer may be dispensable, because all filtrations are processed by strainer 164.

Conduit 124 is connected with conduit 128 and 130, and conduit 128 is connected with the 22-1 of anolyte compartment and 22-2 respectively with 130.Outlet valve 126 can be used for ejecting the fluid from conduit 124.Can understand, outlet valve 126 can be positioned on other position of electroplating in the recycle system.For example, outlet valve 126 can merge in the modified example of valve 108, and this modified example is T-valve.The electrolytic solution that conduit 132 and 134 receives respectively from the 22-1 of anolyte compartment and 22-2.Conduit 132 and 134 is connected to pressure regulating device 138 by conduit 136.Thief hatch (not shown) can be positioned on conduit 136 and with LPC module and is connected.

Pressure regulating device 138 comprises housing 140, and housing 140 comprises and is arranged on its bottom surface 141 or near entrance 142.Entrance 142 is communicated with vertical tubular member 144, and tubular member 144 comprises entrance 145 and outlet 146.Housing 140 also comprises on the bottom surface 141 of the first outlet 147, the first outlet 147 and housing 140 or near entrance 142 separates.Housing 140 is also included near second outlet 152 of top 153 of housing 140.

In each embodiment, pressure regulating device is exposed in normal atmosphere.In other words, pressure regulating device is " opening ", therefore forms open loop for anolyte recirculation.Be exposed to normal atmosphere can be by for example arranging ventilating pit or other opening is realized in housing 140.In other cases, electrolyte outlet pipe (for example, conduit 154) can have opening with allow contact with electrolytic solution atmosphere.In concrete embodiment, delivery channel is transported to electrolytic solution in groove, and groove is exposed to normal atmosphere certainly.Be incorporated in by reference in full U.S. Patent application No.13/051 herein submitting on March 18th, 2011 and its, described the extra details of the pressure regulating device that is suitable for some realizations in 822.

In the illustrated embodiment, pressure regulating device 138 also comprises filtration medium 164.Filtration medium 164 can comprise the porous material that filters bubble from electrolytic solution.Filtration medium 164 can be positioned on level attitude as shown in the figure or on what its applicable position in office and filtered bubble and/or particle from anolyte to turn back to the 22-1 of anolyte compartment and 22-2 at anolyte before.More generally, can adopt the bubble detaching device of other form.These comprise porous material wafer, such as " Porex " ^tMbrand filtering product (Porex Technologies, Fairburn, GA), screen cloth, activated carbon etc.

In some implementations, filtration medium 164 can be arranged side by side in conduit 121 or other conduit the outside of housing 140.In other is realized, filtration medium 164 can become the angle between horizontal and vertical to arrange.In other realization, filtration medium 164 can be arranged in vertical position, and outlet can be arranged on the sidewall of housing 140.Can conceive other other modified example.

In concrete embodiment, strainer 164 has sleeve-shaped and fits on tubular member 144.It can be adaptive from top to bottom on sleeve pipe or at least most of height.In some cases, strainer comprises containment member, such as the O shape circle that is arranged in the position on interior week of strainer and coordinate with tubular member 144.Strainer is configured to before exporting 147, remove particle and/or bubble at conveying electrolyte from electrolytic solution.For bubble management, strainer has size, and to be approximately 40 microns or less hole be enough, or size is approximately 10 microns or less in some cases.In concrete embodiment, average hole dimension is between about 5 microns and 10 microns.This strainer has the extremely oarse-grained additional benefits of removal.As example, applicable strainer can be from Parker Hannifin Corp., filtration division, and Haverhill, MA obtains (for example, the collapsible polypropylene filter parts number PMG050-9FV-PR of 5 microns of hole dimensions).In some designs, the external diameter of strainer will be between about 2 inches and 3 inches.In addition, filter size can be selected so that leave certain space between strainer and the shell of pressure-regulator.This gap can allow more easily and more reliably to regulate the horizon sensor in pressure-regulator.In some embodiments, governor body and strainer are sized to and make to leave the gap of about 0.2 inch to 0.5 inch between them.

The first outlet 147 is communicated with conduit 148, and conduit 148 returns to anolyte and completes anolyte flow circuit.Thief hatch (not shown) can be positioned on conduit 138 and with LPC module and is connected.Conduit 154 is connected to the second outlet 152 in the plating bath 12 in solution container, to dispose as required the overflow of anolyte.In some cases, as mentioned above, conduit 154 was emptied to groove (not shown) before the solution container arriving for keeping plating bath 12.

In some implementations, the entrance 145 of vertical tubular member 144 is positioned vertically within least part of below of film 24-1 and 24-2.The outlet 146 of vertical tubular member 144 is positioned at the top of film 24-1 and 24-2.

In some embodiments, the plating bath 12 in solution container provides catholyte in cathode compartment.Because offering the electrolytic solution of plating bath from pressure-regulator 138 is anolyte, anolyte can not have electroplating additive, and the composition of the electrolytic solution in plating bath may need to regulate before being transported to cathode compartment.For example, some electroplating additives can be fitted in plating bath in being held in solution container.

In use, originally the 22-1 of anolyte compartment and 22-2 can be filled with electroplating solution and/or deionized water.Pump 120 can be switched on to provide stream.In some implementations, pump 120 can provide approximate 2-4 liter by per minute.Pump 120 causes the variation of the pressure of electrolytic solution in anolyte compartment 22.In addition, carry fresh electroplating solution can cause the temporary transient increase of the anode electrolysis hydraulic coupling in chamber 22 from source 104.Along with the pressure in anolyte compartment 22 increases, electrolytic solution flows out vertical tubular member 144 and the flow downwards along vertical tubular member 144.Electrolytic solution flows through filtration medium 164(if present) and from exporting 147 outflows.

Reduce the method for the granule density in electroplanting device

Use description to now reduce the several different methods of the granule density in the electrolytic solution being present in electroplanting device.These methods relate to above-described for adjust the various technology of operation of electroplanting device in response to granule density measuring result, under the background of the logic on the central controller or other hardware that are implemented in electroplanting device, this are discussed above.But, should be understood that, in many cases, method described herein can realize via residing in logic on central controller or the other device of the electroplanting device of communicating by letter with the LPC module electronic of electroplanting device (for software or hardware encoding).Similarly, should be understood that, the method that technology, method and/or the algorithm of describing above with reference to central controller can also can be carried out to be independent of the background of central controller or other particular hardware is as feature.

Therefore, to there is plating tank and carrying out the background of device of the electrolyte circulation system that circulation of elecrolyte loops back to groove and from groove for making, this paper describes these parts/modules for reducing the certain methods of the granule density in the electrolytic solution being present in electroplanting device.Fig. 9 schematically shows some such methods.For example, with reference to Fig. 9, method 900 can comprise: the first thief hatch guiding (910) by the first sample of electrolytic solution from this device, to one or more liquid particles counters (LPC) module, is to utilize one or more LPC modules to determine the approximate granule density in (920) first samples subsequently.In some such embodiments, method 900 can further comprise: the second sample guiding (930) of the electrolytic solution of the second thief hatch from device is arrived to one or more LPC modules; And utilize one or more LPC modules to determine the approximate granule density in (940) second samples.Finally, in some such embodiments, the operation that method can end to adjust (950) electroplanting device is to reduce the granule density that is present in the electrolytic solution in electroplanting device.

In order to reduce granule density according to adopted method, can adjust in every way the operation of electroplanting device.In some embodiments, the operation of adjustment electroplanting device can comprise to reduce granule density: the approximate granule density in approximate granule density and the second sample based in the first sample is differentiated particle contamination source; And replacing particle contamination source.For example, pump may produce excessive particle, and as mentioned above, and the adjustment of device can comprise replacing pump.In other embodiments, the operation of adjusting electroplanting device can comprise as the discriminating source of pollution as described in just to reduce particle contamination, and electrolytic solution turned to and away from particle contamination source.For example, if in the multiple plating tanks in electroplanting device is producing excessive particle contamination, can be by closing one or more valves electrolytic solution is turned to away from this groove (as mentioned above) groove and electrolyte circulation system isolation.

Lithographic patterning instrument and process

Above-described device and process can be combined with lithographic patterning instrument or process, for example, and for manufacture or the production of semiconducter device.Normally, although dispensable, this instrument/process will be used together or carry out in common manufacturing facility.The lithographic patterning of film generally includes some or all in following steps, and each step needs multiple possible execution of instrument: (1) utilizes spin coating or Spray painting tool that photo-resist is applied on workpiece (, substrate); (2) utilize hot plate or stove or UV tools of solidifying to solidify photo-resist; (3) utilize the instrument such as wafer stepping exposure machine, by mask, photo-resist is exposed to visible light or UV light or x ray light; (4) thus resist is developed and optionally removes resist and therefore utilize instrument such as wet platform by its patterning; (5) utilize dry etching instrument or plasmaassisted etch tool by resist pattern transfer in lower membrane or workpiece; And (6) utilize the instrument such as RF or microwave plasma resist stripper to remove resist.This process can provide such as utilizing said apparatus incoming call to fill the characteristic pattern damascene, silicon through hole or the wafer-class encapsulation feature of silver-colored tin.In some embodiments, electroplate occur in resist patterned after but resist be removed before (by resist plating).

Other embodiment

Although described process, system, device and composition above in order to improve the sharpness of understanding by some details, but it will be obvious to those skilled in the art that and can in the scope of claims of enclosing, implement some changes and improvements.It should be noted in the discussion above that and have the multiple alternative that realizes process disclosed herein, system, device and composition.Therefore, disclosed embodiment should be considered as exemplary instead of restrictive, and the scope of each claims of enclosing should not be limited to the detail of embodiment described herein.

Claims (28)

1. For plated metal to the electroplanting device on semiconductor wafer, described device comprises:

   For hold the plating tank of anode and electrolytic solution at electroplating process;

   Be connected to described groove for making electrolytic solution be to and from the electrolyte circulation system of described groove circulation;

   For take the first thief hatch of the first sample of electrolytic solution at the first location place of described device;

   For take the second thief hatch of the second sample of electrolytic solution at the second position place of described device;

   The one or more liquid particle counter modules that are used for the granule density of measuring described electrolytic solution, described liquid particle counter module is connected to described the first thief hatch and described the second thief hatch.
2. 2. device according to claim 1, it also comprises manifold, described manifold is connected at least two thief hatchs and is connected at least one liquid particle counter module.
3. 3. device according to claim 2, it also comprises the two or more valves that flow for controlling the electrolytic solution from least two thief hatchs to described manifold.
4. 4. device according to claim 3, it also comprises controller, and described controller comprises the described mobile machine readable instructions of the opening and closing electrolytic solution from described at least two thief hatchs to described manifold with control for controlling described two or more valves.
5. 5. device according to claim 1, wherein, at least one liquid particle counter module is configured to the granule density in the described electrolytic solution of measuring rate between approximately 9 and 11 ml/min.
6. 6. device according to claim 1, it also comprises pump, and wherein directly in the downstream of described pump, thief hatch is set, and wherein directly in the upstream of described pump, thief hatch is set.
7. 7. device according to claim 6, it also comprises controller, and this controller is configured to the described granule density of the upstream and downstream of (i) monitoring described pump, and (II) determines when described pump produces the grain amount that exceedes threshold value; And (iii) when described pump produces while exceeding the grain amount of described threshold value, produce alarm and/or regulate the operation of described device.
8. 8. device according to claim 1, it also comprises the container for preserving electrolytic solution, and wherein in described container, thief hatch is set.
9. 9. device according to claim 1, it also comprises contactor, and wherein directly in the downstream of described contactor, thief hatch is set.
10. 10. device according to claim 1, it also comprises particulate filter, and wherein directly in the downstream of described particulate filter, thief hatch is set.
11. 11. devices according to claim 1, wherein, directly arrange thief hatch in the upstream of described plating tank.
12. 12. devices according to claim 1, wherein, directly arrange thief hatch in the upstream of described plating tank, and directly in the downstream of described plating tank, thief hatch are set.
13. 13. devices according to claim 1, wherein, arrange thief hatch in the inside of described plating tank.
14. 14. devices according to claim 13, it also comprises the anolyte compartment of the separation in described plating tank, and wherein, be close to the barrier film that the described cathode compartment that makes in described plating tank and the described anolyte compartment separating separate, and be positioned at and make the downstream part of the barrier film that the described cathode compartment of described plating tank separates with the described anolyte compartment separating that thief hatch is set.
15. 15. devices according to claim 13, it also comprises controller, this controller is configured to the described granule density of the described inside of (i) monitoring described plating tank, (II) determines when that the described granule density in described plating tank is greater than threshold level, and (III) in the time that the described granule density in described plating tank is greater than described threshold level, produces alarm and/or regulate the operation of described device.
16. 16. electroplanting devices according to claim 1, it also comprises controller, this controller is configured to:

    Determine the approximate granule density in described the first sample by described one or more liquid particle counter modules;

    Determine the approximate granule density in described the second sample by described one or more liquid particle counter modules; And

    Regulate the operation of described electroplanting device, to reduce the particle concentration in the described electrolytic solution of being to and from described plating tank circulation.
17. 17. electroplanting devices according to claim 16, wherein said controller is further configured to the source of determining the particle contamination in described device according to the described approximate granule density in described the first sample and described the second sample, and the described operation that wherein, regulates described electroplanting device comprises electrolytic solution is deflected from from the described source of particle contamination.
18. 18. electroplanting devices according to claim 17, wherein, another plating tank that the described source of particle contamination is described electroplanting device, and wherein electrolytic solution is deflected from and comprises and close one or more valves from this groove, to isolate this groove from described electrolyte circulation system.
19. 19. electroplanting devices according to claim 16, wherein, described controller is further configured to:

    Described first sample of guiding electrolytic solution is from described the first thief hatch to described one or more liquid particle counter modules; And

    Described second sample of guiding electrolytic solution is from described the second thief hatch to described one or more liquid particle counter modules.
20. 20. electroplanting devices according to claim 1, it also comprises controller, this controller is configured to:

    Determine the approximate granule density in described the first sample by described one or more liquid particle counter modules;

    Determine the approximate granule density in described the second sample by described one or more liquid particle counter modules; And

    If when the described approximate granule density in described the first sample and/or described the second sample exceedes threshold value, send the operator of alarm to described electroplanting device.
21. 21. electroplanting devices according to claim 1, it also comprises controller, this controller is configured to:

    Determine the approximate granule density in described the first sample by described one or more liquid particle counter modules;

    Determine the approximate granule density in described the second sample by described one or more liquid particle counter modules; And

    If when the value of difference exceedes threshold value between the described approximate granule density in described the first sample and described the second sample, send the operator of alarm to described electroplanting device.
22. 22. electroplanting devices according to claim 21, wherein, described the first thief hatch is located immediately at the upstream of described plating tank, and described the second thief hatch is located immediately at the downstream of described plating tank.
23. 23. electroplanting devices according to claim 21, it also comprises pump, and wherein, described the first thief hatch is located immediately at the upstream of described pump, and described the second thief hatch is located immediately at the downstream of described pump.
24. 24. 1 kinds of methods for reducing the granule density in the electrolytic solution existing in electroplanting device, this electroplanting device has electrolyzer and for making electrolytic solution be to and from the electrolyte circulation system of described electrolyzer circulation, described method comprises:

    First thief hatch of the first sample of guiding electrolytic solution from described device is to one or more liquid particle counter modules;

    Determine the approximate granule density in described the first sample by described one or more liquid particle counter modules;

    Second thief hatch of the second sample of guiding electrolytic solution from described device is to described one or more liquid particle counter modules;

    Determine the approximate granule density in described the second sample by described one or more liquid particle counter modules; And

    Regulate the operation of described electroplanting device, to reduce the granule density in the described electrolytic solution existing in described electroplanting device.
25. 25. methods according to claim 24, wherein, regulate the described operation of described electroplanting device to comprise:

    Determine the source of particle contamination according to the described approximate granule density in the described approximate granule density in described the first sample and described the second sample; And

    Change the described source of particle contamination.
26. 26. methods according to claim 25, wherein, the described source of particle contamination is chemicals or the member in described electroplanting device.
27. 27. methods according to claim 24, wherein, regulate the described operation of described electroplanting device to comprise:

    Determine the source of particle contamination according to the described approximate granule density in the described approximate granule density in described the first sample and described the second sample; And

    Electrolytic solution is deflected from from the described source of particle contamination.
28. 28. methods according to claim 27, wherein, the described source of particle contamination is plating tank, and wherein, and electrolytic solution is deflected from and comprises and close one or more valves to isolate described groove from described electrolyte circulation system from described groove.