CN117238359A - Chip package defect detection method and device, electronic equipment and storage medium - Google Patents

Chip package defect detection method and device, electronic equipment and storage medium Download PDF

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Publication number
CN117238359A
CN117238359A CN202311394358.2A CN202311394358A CN117238359A CN 117238359 A CN117238359 A CN 117238359A CN 202311394358 A CN202311394358 A CN 202311394358A CN 117238359 A CN117238359 A CN 117238359A
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detection
chip
target
defect
information
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黄志旺
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Shenzhen Weike Weiye Electronic Technology Co ltd
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Shenzhen Weike Weiye Electronic Technology Co ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

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Abstract

The present application relates to the field of chip detection technologies, and in particular, to a method and apparatus for detecting a chip package defect, an electronic device, and a storage medium. The chip packaging defect detection method comprises the following steps: acquiring package detection information corresponding to a plurality of chips on a storage device; according to the packaging detection information, determining a target detection chip at the current moment and a target detection item corresponding to the target detection chip from a plurality of chips, wherein the target detection item comprises appearance defect detection and pin defect detection; determining defect detection information of a target detection item according to chip characteristics of a target detection chip, wherein the defect detection information comprises at least one piece of detection requirement equipment information and detection requirement parameters corresponding to the at least one piece of detection requirement equipment information; and controlling the detection demand equipment corresponding to the detection demand equipment information to operate according to the corresponding detection demand parameters based on the defect detection information, so as to obtain a target defect detection result of the target detection project. The detection accuracy of chip package defect detection is improved.

Description

Chip package defect detection method and device, electronic equipment and storage medium
Technical Field
The present application relates to the field of chip detection technologies, and in particular, to a method and apparatus for detecting a chip package defect, an electronic device, and a storage medium.
Background
Different chips are packaged in the storage device to provide different functions for the storage device. The chip is reliably and safely packaged, so that the quality of the storage equipment can meet the standard requirement, the situation that the storage equipment fails or operates unstably in use can be reduced, and the performance of the storage equipment is improved, therefore, the requirement on chip packaging defect detection is higher. Along with the development of technology and economy, the packaging process of chips is becoming technological, and correspondingly, the technical requirements for performing defect detection of chip packaging are also becoming higher and higher.
At present, in the chip packaging process before the storage equipment leaves the factory, most of the storage equipment adopts a manual detection mode, and the chip packaging defect is visually detected for each packaged storage equipment, but the size of the chip is smaller, and meanwhile, the manual detection is influenced by brightness and working time, so that the detection accuracy of the chip packaging defect is lower. In the related art, some factories introduce image acquisition equipment to carry out integral image shooting and corresponding image analysis on a storage device of a packaged chip, but due to the fact that the size of the storage device is smaller, the packaging position of the chip can be blocked, and the detection accuracy is still lower based on the detection of the chip packaging defects carried out by the current integral image shooting.
Disclosure of Invention
In order to improve detection accuracy of chip packaging defect detection, the application provides a chip packaging defect detection method, a device, electronic equipment and a storage medium.
In a first aspect, the present application provides a method for detecting a chip package defect, including:
acquiring package detection information corresponding to a plurality of chips on a storage device;
determining a target detection chip at the current moment and a target detection item corresponding to the target detection chip according to the packaging detection information, wherein the target detection item comprises appearance defect detection and pin defect detection;
determining defect detection information of the target detection item according to chip characteristics of the target detection chip, wherein the defect detection information comprises at least one piece of detection requirement equipment information and detection requirement parameters corresponding to the at least one piece of detection requirement equipment information;
and controlling the detection demand equipment corresponding to the detection demand equipment information to operate according to the corresponding detection demand parameters based on the defect detection information, so as to obtain a target defect detection result of the target detection item.
By adopting the technical scheme, the target detection chip for defect detection at the current moment and the target detection item corresponding to the target detection chip can be determined according to the package detection information, and the target detection item required to be subjected to defect detection can be rapidly positioned. And the chip characteristics of the target detection chip are combined to determine the defect detection information aiming at the target detection item, and then the detection requirement equipment corresponding to the target detection item is utilized to operate according to the detection requirement parameters, so that the target defect detection result is obtained by targeted detection, and the detection accuracy of the whole detection of the final chip package defect is improved.
Optionally, the method further comprises:
acquiring a storage device detection list, and determining a chip packaging mode and a chip layout mode of each storage device in the storage device detection list;
and generating defect detection information corresponding to the storage equipment based on the chip packaging mode and the chip layout mode.
By adopting the technical scheme, the defect detection information corresponding to different storage devices can be generated, and the possible defects of the chip package of the storage devices can be detected more accurately, so that the detection accuracy and pertinence are improved, and the detection process is finer.
Optionally, the package detection information includes a plurality of detected items and detected defect detection results corresponding to each detected item; the method further comprises the steps of:
and adjusting the defect detection information according to a plurality of detected defect detection results to obtain target defect detection information so as to determine whether the detected defect detection result and a target defect detection result corresponding to the target defect detection information have coincident defect detection results.
By adopting the technical scheme, the defect detection information can be adjusted according to the detected defect detection result, so that a more accurate target defect detection result is obtained. And the defect detection result of whether the target defect detection result corresponding to the target defect detection information and the detected defect detection result are coincident can be checked, so that the detection accuracy and reliability are further improved.
Optionally, the package detection information further includes a plurality of tested chips; the determining, according to the package detection information, a target detection chip at a current moment and a target detection item corresponding to the target detection chip includes:
determining a plurality of current chips to be tested and a plurality of current items to be tested of each current chip to be tested according to the plurality of tested chips and the plurality of tested items corresponding to each tested chip;
based on the chip characteristics of the plurality of current chips to be detected, arranging the detection sequences of the plurality of current chips to be detected, and determining the chip detection priority;
and determining a target detection chip at the current moment and a target detection item corresponding to the target detection chip according to the preset item detection priority and the chip detection priority.
By adopting the technical scheme, the current to-be-detected chip and the current to-be-detected item of each current to-be-detected chip can be determined according to the detected chip and the detected item corresponding to each detected chip, the condition of missing detection or repeated detection is avoided, and the chip packaging defect detection can be finer and comprehensive. The detection sequence is arranged according to the chip characteristics, the chip detection priority is determined, and the target detection chip and the target detection item at the current moment can be determined according to the preset item detection priority and the chip detection priority, so that the detection is more targeted and efficient. The efficiency and the accuracy of chip packaging defect detection are improved integrally.
Optionally, the detection requirement equipment corresponding to the detection requirement equipment information comprises temperature detection equipment; and controlling the detection requirement equipment corresponding to the detection requirement equipment information to operate according to the corresponding detection requirement parameters based on the defect detection information to obtain a target defect detection result of the target detection item, wherein the method comprises the following steps:
analyzing the defect detection information, and determining detection requirement parameters corresponding to the temperature detection equipment, wherein the detection requirement parameters comprise use temperature, temperature adjustment frequency, temperature test duration and basic temperature distribution data;
the use temperature, the temperature adjustment frequency and the temperature test duration are led into the temperature detection equipment, the temperature detection equipment is controlled to perform corresponding operation, and target temperature distribution data are determined;
and comparing the target temperature distribution data with the basic temperature distribution data to determine a target defect detection result of the target detection item.
By adopting the technical scheme, firstly, defect detection information is analyzed, and detection requirement parameters corresponding to temperature detection equipment are determined, wherein the detection requirement parameters comprise use temperature, temperature adjustment frequency, test temperature duration and basic temperature distribution data. Then, the parameters are led into temperature detection equipment and controlled to perform corresponding operation so as to determine target temperature distribution data. And comparing the target temperature distribution data with the basic temperature distribution data, and determining a target defect detection result of the target detection item according to the comparison result. Therefore, the temperature defect in the chip packaging process can be detected more accurately, and the accuracy and the reliability of chip packaging defect detection are improved.
In a second aspect, the present application provides a chip package defect detection apparatus, including:
the package detection information acquisition module is used for acquiring package detection information corresponding to a plurality of chips on the storage device;
the target detection item determining module is used for determining a target detection chip at the current moment and a target detection item corresponding to the target detection chip according to the packaging detection information, wherein the target detection item comprises appearance defect detection and pin defect detection;
the defect detection information determining module is used for determining defect detection information of the target detection item according to the chip characteristics of the target detection chip, wherein the defect detection information comprises at least one piece of detection requirement equipment information and detection requirement parameters corresponding to the at least one piece of detection requirement equipment information;
and the detection requirement equipment control module is used for controlling the detection requirement equipment corresponding to the detection requirement equipment information to operate according to the corresponding detection requirement parameters based on the defect detection information so as to obtain a target defect detection result of the target detection item.
Optionally, the chip package defect detection device further includes a defect detection information generation module, configured to:
Acquiring a storage device detection list, and determining a chip packaging mode and a chip layout mode of each storage device in the storage device detection list;
and generating defect detection information corresponding to the storage equipment based on the chip packaging mode and the chip layout mode.
Optionally, the package detection information includes a plurality of detected items and detected defect detection results corresponding to each detected item; the chip packaging defect detection device further comprises a defect detection information adjustment module for:
and adjusting the defect detection information according to a plurality of detected defect detection results to obtain target defect detection information so as to determine whether the detected defect detection result and a target defect detection result corresponding to the target defect detection information have coincident defect detection results.
Optionally, the package detection information further includes a plurality of tested chips; the target detection item determining module is specifically configured to:
determining a plurality of current chips to be tested and a plurality of current items to be tested of each current chip to be tested according to the plurality of tested chips and the plurality of tested items corresponding to each tested chip;
based on the chip characteristics of the plurality of current chips to be detected, arranging the detection sequences of the plurality of current chips to be detected, and determining the chip detection priority;
And determining a target detection chip at the current moment and a target detection item corresponding to the target detection chip according to the preset item detection priority and the chip detection priority.
Optionally, the detection requirement equipment corresponding to the detection requirement equipment information comprises temperature detection equipment; the detection demand equipment control module is specifically used for:
analyzing the defect detection information, and determining detection requirement parameters corresponding to the temperature detection equipment, wherein the detection requirement parameters comprise use temperature, temperature adjustment frequency, temperature test duration and basic temperature distribution data;
the use temperature, the temperature adjustment frequency and the temperature test duration are led into the temperature detection equipment, the temperature detection equipment is controlled to perform corresponding operation, and target temperature distribution data are determined;
and comparing the target temperature distribution data with the basic temperature distribution data to determine a target defect detection result of the target detection item.
In a third aspect, the present application provides an electronic device comprising: a memory and a processor, the memory having stored thereon a computer program capable of being loaded by the processor and performing the method of the first aspect.
In a fourth aspect, the present application provides a computer readable storage medium storing a computer program capable of being loaded by a processor and performing the method of the first aspect.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it will be obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort to a person skilled in the art.
Fig. 1 is a schematic view of an application scenario provided in an embodiment of the present application;
FIG. 2 is a flowchart of a method for detecting a chip package defect according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a chip package defect detecting device according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In addition, the term "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In this context, unless otherwise specified, the term "/" generally indicates that the associated object is an "or" relationship.
Embodiments of the application are described in further detail below with reference to the drawings.
The storage device is a hardware device for storing and reading data, such as a solid state disk, a mechanical hard disk, a memory bank, and the like. In order to ensure that the storage device can work normally, some necessary chips are packaged inside the storage device, for example, main chips packaged in a solid state disk include a controller chip, a flash memory chip, a cache chip and the like. If the package of the chip on the memory has defects of package appearance crack, deformation, poor welding between the pins and the package or PCB, short circuit of internal circuit and the like, the operation process of the memory device is likely to be unstable, or the problems of error reading and writing, data loss and the like occur, so that the performance of the memory device is poor. And therefore is particularly important for detecting chip packaging defects of a memory device.
Currently, most factories adopt a manual detection mode to visually inspect packaged storage devices to determine whether chip packages have defects. Some factories are provided with image acquisition equipment on a chip packaging assembly line to carry out integral image shooting and corresponding image analysis on storage equipment of packaged chips, and the detection accuracy is still lower when the detection of chip packaging defects is carried out based on the current image shooting due to the fact that the size of the storage equipment and the chip packaging position are easily shielded.
Based on the above, the application provides a chip package defect detection method, a chip package defect detection device, electronic equipment and a storage medium. Firstly, package detection information corresponding to a plurality of chips on a storage device is obtained. And determining a target detection chip at the current moment and a target detection item corresponding to the target detection chip according to the packaging detection information. And determining defect detection information of the target detection item according to the chip characteristics of the target detection chip, and controlling detection demand equipment corresponding to the detection demand equipment information to operate according to the corresponding detection demand parameters according to the defect detection information to obtain a target defect detection result of the target detection item.
Fig. 1 is a schematic view of an application scenario provided by the present application. The production facility of the storage device may set up a pipeline, utilize several conveyor belts to transport the storage device frame to the location of each chip package for stopping, complete each chip package, and then transport to the location where the package defect detection is performed. A plurality of detection requirement devices can be installed at the position of the package defect detection, and in the application scenario of fig. 1, the chip package defect detection method can be built on a package detection server. The package inspection server can control operation of a plurality of inspection requirement devices to inspect the chip package for defects.
Reference may be made to the following examples for specific implementation.
Fig. 2 is a flowchart of a method for detecting a chip package defect according to an embodiment of the present application, where the method of the present embodiment may be applied to a package detection server in the above scenario. As shown in fig. 2, the method includes:
s201, acquiring package detection information corresponding to a plurality of chips on the storage device.
The package inspection information may be used to characterize which chip and which portion of the chip should be inspected at the present time, and may include an appearance inspection portion, a connection portion between the leads and the package, a connection portion between the leads and the PCB, and the like. Every time a defect detection of a part on a chip passes, the time of starting detection, the time of ending detection, the result of defect detection of the part and the like can be correspondingly uploaded into package detection information for storage. In some implementations, the package inspection information may include data related to each inspected portion of each chip corresponding to each memory device when the chip package defect inspection was performed on a certain day.
Specifically, the package detection information corresponding to a plurality of chips on the extended area storage device can be directly searched.
S202, determining a target detection chip at the current moment and a target detection item corresponding to the target detection chip according to the package detection information, wherein the target detection item comprises appearance defect detection and pin defect detection.
The package inspection information may include an inspected storage device, an inspected chip, and an inspected portion. A chip may correspond to several detection parts, which may be called detection items, and if there are some detection items that are not detected, the detection items that are not detected may be regarded as target detection items, and the chip may be regarded as target detection chip, where the chip does not belong to the chip for which detection has been completed. When all the detection items are detected, the chip belongs to the chip with the detection completed, and when all the chips in one storage device are in the state with the detection completed, the storage device belongs to the storage device with the detection completed. Appearance defect detection may be used to detect defects in the appearance of the package, including cracks, deformations, corrosion, scratches, etc.; pin defect detection may be used to detect defects in the connection between the pin and the package or PCB. The target detection items may also include functional detection after chip packaging, including circuit shorting, circuit opening, and the like.
Specifically, the package detection information can be analyzed to determine a target detection chip which has not completed defect detection, and the target detection item is obtained by removing the detection item which has completed detection by the target detection chip.
S203, determining defect detection information of a target detection item according to the chip characteristics of the target detection chip, wherein the defect detection information comprises at least one piece of detection requirement equipment information and at least one detection requirement parameter corresponding to the detection requirement equipment information.
The chip characteristics may include maximum pressure that the chip can withstand, maximum temperature that the chip needs to withstand when in use, functions that the chip is to have, and the like. Different memory devices may have different scenes in actual applications, and the chip characteristics of the corresponding chips may also be different. The corresponding chip characteristics may be determined and stored based on actual use of the various memory devices in historical use.
The detection requirement device information may be used to indicate information such as the name, installation position, etc. of the detection requirement device used. The inspection requirement parameter may be used to indicate a parameter that the inspection requirement device needs to operate correspondingly when the chip package is to be subjected to defect inspection corresponding to the inspection requirement device. The defect inspection information may be used to represent specific inspection information for the chip package and may include what inspection requirement equipment is needed to use and what inspection requirement parameters are to be utilized by the inspection requirement equipment. The correspondence between the chip characteristics and the defect detection information may be preset and stored.
Specifically, the chip characteristics corresponding to the target detection chip can be searched first, and then the defect detection information corresponding to the chip characteristics can be searched correspondingly.
S204, based on the defect detection information, controlling the detection requirement equipment corresponding to the detection requirement equipment information to operate according to the corresponding detection requirement parameters, and obtaining a target defect detection result of the target detection project.
The detection requirement device may include an X-ray scanning device, a temperature change detection device, a pressure test device, a functional test device, a pin carding device, and the like. For the temperature change detection device, the corresponding detection requirement device information may include information such as a temperature change interval, a temperature adjustment frequency, and a detection time selection. The target defect detection result may include the presence of a defect and the absence of a defect, and since the detection requirement equipment is not unique, the target defect detection result may include several defect detection results, for example, whether the internal structure has a defect, for example, whether a solder joint, a metal wire, etc. of the chip package has a crack, a disconnection, or a poor connection; whether the chip package has poor internal connection or heat dissipation problem; whether the chip package has the bearing capacity, etc.
Specifically, information such as a detection requirement parameter for drinks can be extracted from the defect detection information, then detection requirement equipment corresponding to the detection requirement equipment information is controlled to operate, corresponding defect detection data is generated, and then a target defect detection result of a target detection item is obtained.
According to the embodiment, the target detection chip to be subjected to defect detection at the current moment and the target detection item corresponding to the target detection chip can be determined according to the package detection information, and the target detection item required to be subjected to defect detection can be rapidly positioned. And the chip characteristics of the target detection chip are combined to determine the defect detection information aiming at the target detection item, and then the detection requirement equipment corresponding to the target detection item is utilized to operate according to the detection requirement parameters, so that the target defect detection result is obtained by targeted detection, and the detection accuracy of the whole detection of the final chip package defect is improved.
In some embodiments, the obtained storage device detection list may be used to determine a chip packaging mode and a chip layout mode of the storage device, so as to generate defect detection information. Specifically, a storage device detection list is obtained, and a chip packaging mode and a chip layout mode of each storage device in the storage device detection list are determined; and generating defect detection information corresponding to the storage equipment based on the chip packaging mode and the chip layout mode.
The storage device detection list can be set according to the storage device which needs to detect the chip packaging defects on the same day. The memory devices to be detected on the same day can be integrated first, and then each memory device is correspondingly associated with a chip packaging mode and a chip layout mode. Since different memory devices use different scenarios and implement different functions, the corresponding chip packaging and chip layout may be different. The chip packaging mode may include surface mounting technology, wire bonding connection, etc., and the chip layout mode may include a board layout, a modularized layout, etc.
When packaging is performed by using different chip packaging modes, certain detection requirement equipment is not available or has special requirements due to different technologies used by chip packaging. When chip packaging defect detection is carried out on storage equipment with different chip layout modes, the density of pins, the intervals among different chips and the like are different, and when the chip packaging defect detection is carried out, for example, pin carding equipment, proper equipment size is required to be selected so as to ensure that other chip detection requirement equipment is not touched as much as possible when a certain chip is detected, and the final detection result is prevented from being inconsistent with the chip. Therefore, the defect detection information corresponding to the storage device can be generated by combining a chip packaging mode and a chip layout mode. A defect detection information generation model to be trained may be built in advance to generate corresponding defect detection information.
The method comprises the steps of constructing a training set by using a historical chip packaging mode, a historical chip layout mode and corresponding historical defect detection information in the historical chip packaging defect detection process, then forming a training sample by using the historical chip packaging mode and the historical chip layout mode, and inputting the training sample into a defect detection information generation model to be trained to obtain an output result, namely the historical defect detection information. According to the historical defect detection information obtained through training and the historical defect detection information actually corresponding to the training set, a loss function is calculated, model parameters of a defect detection information generation model to be trained are adjusted through a gradient descent method, so that the loss function is reduced, training is stopped when the loss function is known not to be reduced, and the defect detection information generation model is obtained.
Specifically, a pre-stored storage device detection list may be obtained first, and a chip packaging mode and a chip layout mode of each storage device may be searched and determined from the detection list. Then, the chip packaging mode and the chip layout mode can be input into the defect detection information generating model, and the defect detection information corresponding to the storage device can be directly output.
In some implementations, defect detection information corresponding to different chip packaging modes and chip layout modes may be preset according to a large amount of data related to historical chip package defect detection. And then correspondingly searching defect detection information corresponding to the storage equipment according to the chip packaging mode and the chip layout mode.
According to the embodiment, the defect detection information corresponding to different storage devices can be generated, and possible defects of the chip package of the storage devices can be detected more accurately, so that the detection accuracy and pertinence are improved, and the detection process is finer.
In some embodiments, the package inspection information includes a number of inspected items and inspected defect inspection results corresponding to each inspected item. The defect detection mode can be adjusted by combining a plurality of detected defect detection results. Specifically, the defect detection information is adjusted according to a plurality of detected defect detection results to obtain target defect detection information so as to determine whether a superposition defect detection result exists in the target defect detection result corresponding to the detected defect detection result and the target defect detection information.
In the above embodiment, when detecting a chip package defect, the detected item that has been detected may be used as the detected item, and the corresponding defect detection result may be the detected defect detection result.
Specifically, when detecting a package defect for a chip on a storage device, the detected defect detection result of the device required for detection selected in the detection process of some detection items may include partial detection of other detection items. Therefore, the defect detection mode at the current moment can be adjusted by utilizing the detected defect detection results, and the defect detection results of other detection items in the detected defect detection results are further detected. At this time, if the target defect detection result has a coincident defect detection result with the detected defect detection result, the packaging position of which chip corresponds to the defect can be specifically determined.
In some implementations, the defect detection mode may be adjusted according to the detected items and the detected defect detection results corresponding to each detected item, so as to adjust the detection requirement parameters of the same detection requirement device during subsequent detection. For example, if it is found that the detection accuracy of a certain detection requirement device is not high, the parameter of the detection requirement device may be adjusted or another detection requirement device may be replaced according to the detected defect detection result, so as to improve the accuracy.
The embodiment can adjust the defect detection information according to the detected defect detection result, thereby obtaining a more accurate target defect detection result. And the defect detection result of whether the target defect detection result corresponding to the target defect detection information and the detected defect detection result are coincident can be checked, so that the detection accuracy and reliability are further improved.
In some embodiments, the package inspection information further includes a number of chips under test. The target detection chip and the target detection item may be determined based on the chip detection priority and the preset item detection priority. Specifically, according to a plurality of tested chips and a plurality of tested items corresponding to each tested chip, a plurality of current chips to be tested and a plurality of current items to be tested of each current chip to be tested are determined; based on the chip characteristics of a plurality of current chips to be detected, arranging the detection sequences of the plurality of current chips to be detected, and determining the chip detection priority; and determining the target detection chip at the current moment and the target detection item corresponding to the target detection chip according to the preset item detection priority and the chip detection priority.
For a manufacturer producing a memory device, it may be that a material is not suitable for further use in the production of the memory device due to price variations in the memory device production material and during the detection of historical chip package defects, and the material may include the chip production material. The chip characteristics of the same chip in the same memory device may vary. The related staff can be required to synchronize when the production materials of the storage device change, and then the encapsulation detection server can update and store the corresponding records. The chip characteristics may also affect the functional aspects of the chip, such as a greater number of functions involved, or a more complex function.
The detection priority of the preset items can be set according to the sequence of chip packaging on the storage device, for example, in the packaging process, various chips and PCBs (printed circuit boards) can be packaged firstly, then the whole storage device is packaged, correspondingly, the connection defect between the chip pins and the PCBs can be detected firstly, then the connection defect between the chip pins and the packaging is detected, and finally the defect of the appearance of the packaging is detected.
Specifically, according to a plurality of tested chips and a plurality of tested items corresponding to each tested chip, a chip which is not subjected to package defect detection and a chip which is not detected by partial detection items are searched, and a plurality of current chips to be tested and a plurality of current items to be tested of each current chip to be tested are obtained. Then, based on the chip characteristics of a plurality of chips to be tested at the current moment, the chips with fewer functions can start to detect, and the chip detection priority is obtained by taking the time from less to more corresponding functions. Then, the chip with the least functions can be used as a target detection chip, and the detection item ranked first in the preset item detection priority is used as a target detection item.
According to the embodiment, the current to-be-tested chip and the current to-be-tested item of each current to-be-tested chip can be determined according to the tested chip and the tested item corresponding to each tested chip, so that the condition of missing detection or repeated detection is avoided, and the chip packaging defect detection can be more detailed and comprehensive. The detection sequence is arranged according to the chip characteristics, the chip detection priority is determined, and the target detection chip and the target detection item at the current moment can be determined according to the preset item detection priority and the chip detection priority, so that the detection is more targeted and efficient. The efficiency and the accuracy of chip packaging defect detection are improved integrally.
In some embodiments, the detection requirement device corresponding to the detection requirement device information includes a temperature detection device. When the detection requirement equipment is temperature detection equipment, the use temperature, the temperature adjustment frequency and the temperature test duration can be led into the temperature detection equipment to obtain target temperature distribution data so as to determine a corresponding target defect detection result.
The temperature detecting device in the detecting demand device may be a device for performing temperature change detection, may adjust the temperature applied to the chip, and detects the temperature distribution on the chip. The usage temperature may correspond to a temperature variation range including the highest temperature, the lowest temperature, and the temperature segment selected for each adjustment of the temperature. For example, the minimum temperature is 10 degrees celsius, the maximum temperature is 50 degrees celsius, and each adjustment may be adjusted by 5 degrees, e.g., 15 degrees celsius, 20 degrees celsius. The adjustment frequency may be used to indicate how long each adjustment of the temperature takes, for example, every 15 seconds, 15 seconds apart from 10 degrees celsius to 15 degrees celsius. The trial temperature period may be used to indicate a period to be continued when the temperature is adjusted to the highest temperature corresponding to the use temperature. The base temperature distribution data may be used to represent the temperature distribution on the chip in the event of a package defect.
Specifically, the detection requirement parameters corresponding to the temperature detection equipment can be extracted from the defect detection information. And then, the use temperature, the temperature adjustment frequency and the temperature test duration in the detection requirement parameters are led into temperature detection equipment, and the temperature detection equipment is started to perform corresponding operation. The temperature detection device can detect the target temperature distribution data and then send the target temperature distribution data to the packaging detection server, and the packaging detection server compares the target temperature distribution data with the basic temperature distribution data after correspondingly receiving the target temperature distribution data. If the comparison result shows that the target temperature distribution data is inconsistent with the basic temperature distribution data, the target defect detection result of the target detection item can be indicated to be defect; if the comparison result shows that the target temperature distribution data is consistent with the basic temperature distribution data, the target defect detection result of the target detection item can be indicated to be that no defect exists.
In this embodiment, defect detection information is first analyzed, and detection requirement parameters corresponding to the temperature detection device are determined, including usage temperature, temperature adjustment frequency, temperature test duration, and basic temperature distribution data. Then, the parameters are led into temperature detection equipment and controlled to perform corresponding operation so as to determine target temperature distribution data. And comparing the target temperature distribution data with the basic temperature distribution data, and determining a target defect detection result of the target detection item according to the comparison result. Therefore, the temperature defect in the chip packaging process can be detected more accurately, and the accuracy and the reliability of chip packaging defect detection are improved.
Fig. 3 is a schematic structural diagram of a chip package defect detecting device according to an embodiment of the present application, and as shown in fig. 3, a chip package defect detecting device 300 according to the present embodiment includes: a package inspection information acquisition module 301, a target inspection item determination module 302, a defect inspection information determination module 303, and an inspection required equipment control module 304.
The package detection information obtaining module 301 is configured to obtain package detection information corresponding to a plurality of chips on the storage device;
the target detection item determining module 302 is configured to determine, according to the package detection information, a target detection chip at a current moment and a target detection item corresponding to the target detection chip, where the target detection item includes appearance defect detection and pin defect detection;
a defect detection information determining module 303, configured to determine defect detection information of a target detection item according to a chip characteristic of a target detection chip, where the defect detection information includes at least one detection requirement device information and a detection requirement parameter corresponding to the at least one detection requirement device information;
and the detection requirement equipment control module 304 is configured to control the detection requirement equipment corresponding to the detection requirement equipment information to operate according to the corresponding detection requirement parameters based on the defect detection information, so as to obtain a target defect detection result of the target detection item.
Optionally, the chip package defect detection apparatus 300 further includes a defect detection information generating module 305 for:
acquiring a storage device detection list, and determining a chip packaging mode and a chip layout mode of each storage device in the storage device detection list;
and generating defect detection information corresponding to the storage equipment based on the chip packaging mode and the chip layout mode.
Optionally, the package detection information includes a plurality of detected items and detected defect detection results corresponding to each detected item; the chip package defect detection apparatus 300 further includes a defect detection information adjustment module 306 for:
and adjusting the defect detection information according to the detected defect detection results to obtain target defect detection information so as to determine whether the detected defect detection result and a target defect detection result corresponding to the target defect detection information have coincident defect detection results.
Optionally, the package inspection information further includes a plurality of tested chips; the target detection item determining module 302 is specifically configured to:
determining a plurality of current chips to be tested and a plurality of current items to be tested of each current chip to be tested according to the plurality of tested chips and the plurality of tested items corresponding to each tested chip;
Based on the chip characteristics of a plurality of current chips to be detected, arranging the detection sequences of the plurality of current chips to be detected, and determining the chip detection priority;
and determining the target detection chip at the current moment and the target detection item corresponding to the target detection chip according to the preset item detection priority and the chip detection priority.
Optionally, the detection requirement equipment corresponding to the detection requirement equipment information comprises temperature detection equipment; the detection requirement device control module 304 is specifically configured to:
analyzing defect detection information, and determining detection requirement parameters corresponding to temperature detection equipment, wherein the detection requirement parameters comprise use temperature, temperature adjustment frequency, temperature test duration and basic temperature distribution data;
the using temperature, the temperature adjusting frequency and the temperature testing duration are led into temperature detecting equipment, the temperature detecting equipment is controlled to perform corresponding operation, and target temperature distribution data are determined;
and comparing the target temperature distribution data with the basic temperature distribution data to determine a target defect detection result of the target detection item.
The apparatus of this embodiment may be used to perform the method of any of the foregoing embodiments, and its implementation principle and technical effects are similar, and will not be described herein again.
Fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application, as shown in fig. 4, an electronic device 400 of the present embodiment may include: a memory 401 and a processor 402.
The memory 401 has stored thereon a computer program that can be loaded by the processor 402 and that performs the methods of the above-described embodiments.
Wherein the processor 402 is coupled to the memory 401, e.g. via a bus.
Optionally, the electronic device 400 may also include a transceiver. It should be noted that, in practical applications, the transceiver is not limited to one, and the structure of the electronic device 400 is not limited to the embodiment of the present application.
The processor 402 may be a CPU (Central Processing Unit ), general purpose processor, DSP (Digital Signal Processor, data signal processor), ASIC (Application Specific Integrated Circuit ), FPGA (Field Programmable Gate Array, field programmable gate array) or other programmable logic device, transistor logic device, hardware components, or any combination thereof. Which may implement or perform the various exemplary logic blocks, modules and circuits described in connection with this disclosure. Processor 402 may also be a combination that implements computing functionality, e.g., comprising one or more microprocessor combinations, a combination of a DSP and a microprocessor, etc.
A bus may include a path that communicates information between the components. The bus may be a PCI (Peripheral Component Interconnect, peripheral component interconnect standard) bus or an EISA (Extended Industry Standard Architecture ) bus, or the like. The buses may be divided into address buses, data buses, control buses, etc. For ease of illustration, the figures are shown with only one bold line, but not with only one bus or one type of bus.
Memory 401 may be, but is not limited to, a ROM (Read Only Memory) or other type of static storage device that can store static information and instructions, a RAM (Random Access Memory ) or other type of dynamic storage device that can store information and instructions, an EEPROM (Electrically Erasable Programmable Read Only Memory ), a CD-ROM (Compact Disc Read Only Memory, compact disc Read Only Memory) or other optical disk storage, optical disk storage (including compact discs, laser discs, optical discs, digital versatile discs, blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer.
The memory 401 is used for storing application program codes for executing the inventive arrangements and is controlled to be executed by the processor 402. The processor 402 is configured to execute the application code stored in the memory 401 to implement what is shown in the foregoing method embodiment.
Among them, electronic devices include, but are not limited to: mobile terminals such as mobile phones, notebook computers, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and the like, and stationary terminals such as digital TVs, desktop computers, and the like. But may also be a server or the like. The electronic device shown in fig. 4 is only an example and should not be construed as limiting the functionality and scope of use of the embodiments of the application.
The electronic device of the present embodiment may be used to execute the method of any of the foregoing embodiments, and its implementation principle and technical effects are similar, and will not be described herein.
The present application also provides a computer-readable storage medium storing a computer program capable of being loaded by a processor and executing the method in the above embodiments.
Those of ordinary skill in the art will appreciate that: all or part of the steps for implementing the method embodiments described above may be performed by hardware associated with program instructions. The foregoing program may be stored in a computer readable storage medium. The program, when executed, performs steps including the method embodiments described above; and the aforementioned storage medium includes: various media that can store program code, such as ROM, RAM, magnetic or optical disks.

Claims (10)

1. A method for detecting a chip package defect, comprising:
acquiring package detection information corresponding to a plurality of chips on a storage device;
determining a target detection chip at the current moment and a target detection item corresponding to the target detection chip according to the packaging detection information, wherein the target detection item comprises appearance defect detection and pin defect detection;
determining defect detection information of the target detection item according to chip characteristics of the target detection chip, wherein the defect detection information comprises at least one piece of detection requirement equipment information and detection requirement parameters corresponding to the at least one piece of detection requirement equipment information;
And controlling the detection demand equipment corresponding to the detection demand equipment information to operate according to the corresponding detection demand parameters based on the defect detection information, so as to obtain a target defect detection result of the target detection item.
2. The method of claim 1, further comprising:
acquiring a storage device detection list, and determining a chip packaging mode and a chip layout mode of each storage device in the storage device detection list;
and generating defect detection information corresponding to the storage equipment based on the chip packaging mode and the chip layout mode.
3. The method according to claim 1, wherein the package inspection information includes a plurality of inspected items and inspected defect inspection results corresponding to each inspected item; the method further comprises the steps of:
and adjusting the defect detection information according to a plurality of detected defect detection results to obtain target defect detection information so as to determine whether the detected defect detection result and a target defect detection result corresponding to the target defect detection information have coincident defect detection results.
4. The method of claim 3, wherein the package inspection information further comprises a plurality of chips; the determining, according to the package detection information, a target detection chip at a current moment and a target detection item corresponding to the target detection chip includes:
Determining a plurality of current chips to be tested and a plurality of current items to be tested of each current chip to be tested according to the plurality of tested chips and the plurality of tested items corresponding to each tested chip;
based on the chip characteristics of the plurality of current chips to be detected, arranging the detection sequences of the plurality of current chips to be detected, and determining the chip detection priority;
and determining a target detection chip at the current moment and a target detection item corresponding to the target detection chip according to the preset item detection priority and the chip detection priority.
5. The method for detecting a chip package defect according to any one of claims 1 to 4, wherein the inspection requirement equipment corresponding to the inspection requirement equipment information includes a temperature inspection equipment; and controlling the detection requirement equipment corresponding to the detection requirement equipment information to operate according to the corresponding detection requirement parameters based on the defect detection information to obtain a target defect detection result of the target detection item, wherein the method comprises the following steps:
analyzing the defect detection information, and determining detection requirement parameters corresponding to the temperature detection equipment, wherein the detection requirement parameters comprise use temperature, temperature adjustment frequency, temperature test duration and basic temperature distribution data;
The use temperature, the temperature adjustment frequency and the temperature test duration are led into the temperature detection equipment, the temperature detection equipment is controlled to perform corresponding operation, and target temperature distribution data are determined;
and comparing the target temperature distribution data with the basic temperature distribution data to determine a target defect detection result of the target detection item.
6. A chip package defect detection apparatus, comprising:
the package detection information acquisition module is used for acquiring package detection information corresponding to a plurality of chips on the storage device;
the target detection item determining module is used for determining a target detection chip at the current moment and a target detection item corresponding to the target detection chip according to the packaging detection information, wherein the target detection item comprises appearance defect detection and pin defect detection;
the defect detection information determining module is used for determining defect detection information of the target detection item according to the chip characteristics of the target detection chip, wherein the defect detection information comprises at least one piece of detection requirement equipment information and detection requirement parameters corresponding to the at least one piece of detection requirement equipment information;
and the detection requirement equipment control module is used for controlling the detection requirement equipment corresponding to the detection requirement equipment information to operate according to the corresponding detection requirement parameters based on the defect detection information so as to obtain a target defect detection result of the target detection item.
7. The chip package defect detection apparatus of claim 6, further comprising a defect detection information generation module configured to:
acquiring a storage device detection list, and determining a chip packaging mode and a chip layout mode of each storage device in the storage device detection list;
and generating defect detection information corresponding to the storage equipment based on the chip packaging mode and the chip layout mode.
8. The device according to claim 6, wherein the package inspection information includes a plurality of inspected items and inspected defect inspection results corresponding to each inspected item; the device also comprises a defect detection information adjusting module for:
and adjusting the defect detection information according to a plurality of detected defect detection results to obtain target defect detection information so as to determine whether the detected defect detection result and a target defect detection result corresponding to the target defect detection information have coincident defect detection results.
9. An electronic device, comprising: a memory and a processor;
the memory is used for storing program instructions;
the processor is configured to invoke and execute program instructions in the memory to perform the chip package defect detection method according to any of claims 1-5.
10. A computer-readable storage medium, wherein the computer-readable storage medium has a computer program stored therein; the computer program, when executed by a processor, implements the chip package defect detection method according to any of claims 1-5.
CN202311394358.2A 2023-10-25 2023-10-25 Chip package defect detection method and device, electronic equipment and storage medium Pending CN117238359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311394358.2A CN117238359A (en) 2023-10-25 2023-10-25 Chip package defect detection method and device, electronic equipment and storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311394358.2A CN117238359A (en) 2023-10-25 2023-10-25 Chip package defect detection method and device, electronic equipment and storage medium

Publications (1)

Publication Number Publication Date
CN117238359A true CN117238359A (en) 2023-12-15

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Country Status (1)

Country Link
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