CN117233583B - Full-automatic test equipment for packaging semiconductor chip - Google Patents
Full-automatic test equipment for packaging semiconductor chip Download PDFInfo
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- CN117233583B CN117233583B CN202311522882.3A CN202311522882A CN117233583B CN 117233583 B CN117233583 B CN 117233583B CN 202311522882 A CN202311522882 A CN 202311522882A CN 117233583 B CN117233583 B CN 117233583B
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- 238000012360 testing method Methods 0.000 title claims abstract description 106
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 239000000523 sample Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 12
- 230000003028 elevating effect Effects 0.000 claims description 9
- 230000008520 organization Effects 0.000 claims 2
- 238000001514 detection method Methods 0.000 abstract description 7
- 239000010720 hydraulic oil Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 230000001276 controlling effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Abstract
The invention discloses full-automatic test equipment for packaging semiconductor chips, which relates to the technical field of chip test equipment, wherein a test table is connected onto a rack in a sliding manner, a test mechanism is arranged above the test table and used for testing the chips, two clamping blocks are symmetrically arranged on two sides of the test table, telescopic rods are arranged on the clamping blocks, the output ends of the telescopic rods are connected with L-shaped side plates, driving parts are fixedly arranged on the inner sides of the L-shaped side plates, two correction rods are symmetrically arranged on two sides of the driving parts, the output ends of the driving parts are connected with the correction rods, semicircular rings are fixedly arranged on the correction rods, the driving parts can splice the two semicircular rings to form a limit ring, the chip pins are enclosed, and the limit ring is driven to move upwards to correct the bent chip pins. The invention can correct the chip pins before testing by the pin correction mechanism so as to ensure that the test mechanism can be contacted with all the chip pins, thereby ensuring the accuracy of the detection result.
Description
Technical Field
The invention relates to the technical field of chip testing equipment, in particular to full-automatic testing equipment for packaging semiconductor chips.
Background
In the prior art, as disclosed in chinese patent publication No. CN115327349a, a chip package testing device convenient to take is disclosed, which comprises a frame, linear motors, a testing machine, a slide rail and the like, wherein the rear wall in the frame is connected with two linear motors, the two linear motors are symmetrically arranged left and right, the testing machine is connected between the two linear motors in a sliding manner, and the slide rails are connected on the left and right sides of the bottom wall in the frame. According to the invention, through the U-shaped push rod, people can conveniently pull the placing plate, and meanwhile, the first spring enables the placing plate to automatically move backwards for resetting, so that the labor force of people can be reduced, and the supporting plate moves upwards, so that chips can be ejected out, and the tested chips can be taken out conveniently by people, so that the convenience of the device can be improved. However, the technical scheme has the following defects: because in the chip production processing process, the processing precision of the packaging technology is limited, part of chip pins can be bent, and then a test probe of a tester cannot be contacted with the bent chip pins, so that the detection result is inaccurate.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides full-automatic test equipment for packaging semiconductor chips, and the pins of the chips can be corrected before testing by the pin correction mechanism, so that the test mechanism can be contacted with all the pins of the chips, and the accuracy of a detection result is ensured.
To achieve the purpose, the invention adopts the following technical scheme:
the invention provides full-automatic test equipment for packaging semiconductor chips, which comprises a rack, a test bench, a test mechanism and a pin correction mechanism, wherein the test bench is connected to the rack in a sliding manner, the test mechanism is arranged above the test bench and used for testing the chips, the pin correction mechanism comprises clamping pieces, telescopic rods, L-shaped side plates, correction rods, semicircular rings and driving parts, the clamping pieces comprise clamping blocks, the two clamping pieces are symmetrically arranged on two sides of the test bench and are connected to the rack in a sliding manner, the telescopic rods are arranged on the clamping blocks, the output ends of the telescopic rods are connected with L-shaped side plates, the driving parts are fixedly arranged on the inner sides of the L-shaped side plates, the two correction rods are symmetrically arranged on two sides of the driving parts, the output ends of the driving parts are connected with the correction rods, the semicircular rings are fixedly arranged on the correction rods, the driving parts can splice the two semicircular rings to form a limiting ring, the pins of the chips, and the limiting ring is driven to move upwards to correct the bent pins of the chips.
In a preferred technical scheme of the invention, the test mechanism comprises a lifting part, a lifting table, a supporting plate, a test plate, test probes and a tester, wherein the lifting part is fixedly arranged on the frame, the lifting table is connected with the lifting part, one side of the lifting table is provided with the supporting plate, two rows of positioning holes are uniformly formed in the supporting plate, the test plate is fixedly arranged above the supporting plate in parallel, the test probes are uniformly arranged at the bottom of the test plate and aligned with the positioning holes one by one, the tester is fixedly arranged on the frame, and the test probes are electrically connected with the tester.
In the preferred technical scheme of the invention, the lifting part comprises a sliding guide rail, a lifting motor and a threaded shaft, wherein the sliding guide rail is vertically and fixedly arranged on the frame, the lifting motor is fixedly arranged at the top of the sliding guide rail, the threaded shaft is connected with an output shaft of the lifting motor, the lifting table is connected onto the sliding guide rail in a sliding manner, and the lifting table is in threaded connection with the threaded shaft.
In the preferred technical scheme of the invention, the inner side wall of the positioning hole is provided with an inward draft angle of five degrees.
In the preferred technical scheme of the invention, the supporting plate is embedded with a heating module, the temperature controller is fixedly arranged on the frame, and the heating module is electrically connected with the temperature controller.
In the preferred technical scheme of the invention, the clamping piece further comprises a support column, a first motor and a screw rod, wherein the support column is vertically and fixedly arranged on the frame, the first motor is fixedly arranged at the top of the support column, the screw rod is connected to an output shaft of the first motor, and the screw rod is in threaded connection with the clamping block.
In the preferred technical scheme of the invention, a flexible cushion layer is fixedly arranged on one side, close to each other, of the clamping blocks.
In the preferred technical scheme of the invention, the driving part comprises a hydraulic cylinder, a rubber hose, a pump body, a first side circular tube, a first piston plate, a first spring, a first piston rod, a second side circular tube, a second piston plate, a second spring and a second piston rod, wherein the hydraulic cylinder is arranged on the inner side of the L-shaped side plate, one end of the rubber hose is communicated with the hydraulic cylinder, the other end of the rubber hose is connected with the pump body on the frame, the two sides of the hydraulic cylinder are horizontally provided with the first side circular tube, the first piston plate is connected to the inner side wall of the first side circular tube in a sliding manner, the first piston plate is connected to the inner side wall of the first side circular tube through the first spring, one end of the first piston rod is connected with the first piston plate, the other end of the first piston rod is connected with the correction rod, the second side circular tube is vertically fixed at the top of the hydraulic cylinder, the second piston plate is connected to the inner side wall of the second side circular tube through the second spring in a sliding manner, the bottom end of the second piston rod is connected with the second piston plate, and the top end of the second piston rod is connected with the L-shaped side plate.
In a preferred technical scheme of the invention, the elastic coefficient of the first spring is smaller than that of the second spring.
The beneficial effects of the invention are as follows:
according to the full-automatic test equipment for packaging the semiconductor chip, provided by the invention, the pins of the chip can be corrected before testing by the pin correction mechanism, so that the test mechanism can be contacted with all the pins of the chip, and the accuracy of a detection result is ensured; the clamping piece is arranged and can clamp and fix the chip on the test bench so as to avoid the influence of the sliding of the chip in the correction and detection processes on the detection result; the locating hole that sets up can be to the supplementary correction of chip pin, and locating hole and heating module mutually support, can heat the chip pin to eliminate resilience force.
Drawings
Fig. 1 is a schematic perspective view of a fully automatic test equipment for packaging semiconductor chips (after removing a housing) according to an embodiment of the present invention;
FIG. 2 is a schematic view of the structure of FIG. 1 in the front view direction;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
FIG. 4 is a schematic cross-sectional view of the drive section of FIG. 3;
FIG. 5 is a cross-sectional view taken in the direction B-B in FIG. 2;
fig. 6 is a partial enlarged view at C in fig. 5.
In the figure:
1. a frame; 2. a test bench; 3. a testing mechanism; 31. a lifting part; 311. a sliding guide rail; 312. a lifting motor; 313. a threaded shaft; 32. a lifting table; 33. a support plate; 331. positioning holes; 34. a test board; 35. a test probe; 36. a tester; 37. a temperature controller; 4. a pin correction mechanism; 41. a clamping member; 411. a clamping block; 412. a support column; 413. a first motor; 414. a screw rod; 415. a flexible cushion layer; 42. a retractable rod; 43. an L-shaped side plate; 44. a correction lever; 45. a semicircular ring; 5. a driving section; 501. a hydraulic cylinder; 502. a rubber hose; 503. a pump body; 504. a first side round tube; 505. a first piston plate; 506. a first spring; 507. a first piston rod; 508. a second side round tube; 509. a second piston plate; 510. a second spring; 511. and a second piston rod.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
As shown in fig. 1-6, in the embodiment, a full-automatic test device for packaging a semiconductor chip is provided, which includes a frame 1, a test board 2, a test mechanism 3 and a pin correction mechanism 4, the test board 2 is slidably connected to the frame 1, the test mechanism 3 is disposed above the test board 2 and is used for testing the chip, the pin correction mechanism 4 includes a clamping member 41, a telescopic rod 42, an L-shaped side plate 43, a correction rod 44, a semicircular ring 45 and a driving portion 5, the clamping member 41 includes clamping blocks 411, the two clamping blocks 411 are symmetrically disposed on two sides of the test board 2, the clamping blocks 411 are slidably connected to the frame 1, the telescopic rod 42 is disposed on the clamping blocks 411, the output end of the telescopic rod 42 is connected with the L-shaped side plate 43, the driving portion 5 is fixedly disposed on the inner side of the L-shaped side plate 43, the two correction rods 44 are symmetrically disposed on two sides of the driving portion 5, the output end of the driving portion 5 is connected with the correction rod 44, the semicircular ring 45 is fixedly disposed on the correction rod 44, the driving portion 5 can splice two semicircular rings 45 to form a limit ring, the chip pin is enclosed, and the bent pin is forwardly moved on the chip. In this embodiment, the frame 1 is fixed to the ground by means of legs. The test bench 2 is used for placing the chip, and the test bench 2 sliding connection is in the frame 1, can push out the test bench 2 to one side after the test is finished and push out the frame 1, make things convenient for the staff to get and put the chip. The testing mechanism 3 is used for testing whether the chip is short-circuited or not, so that workers can pick out defective products, and the quality of products is guaranteed. Because in the production and processing process, the condition that crooked appears in some chip pins easily, and then leads to the unable contact of test mechanism 3 with crooked pin, causes the test result inaccurate, so through setting up pin correction mechanism 4, can correct the pin before the test, guarantee the accuracy of testing result. The clamping block 411 has an L-shaped structure, and the clamping member 41 is used for clamping and fixing the chip to prevent sliding in the detection process; the telescopic rod 42 is of a telescopic structure and can drive the L-shaped side plate 43 to be close to or far away from the test bench 2; the correction rods 44 are arranged above the clamping blocks 411 in parallel, the correction rods 44 are also arranged along the length direction of the clamping blocks 411, the driving part 5 can drive the two correction rods 44 to be close to or far away from each other, further, the end parts of the two semicircular rings 45 are abutted, the diameter of the spliced limiting ring is slightly larger than the size of the chip pins, and a layer of smooth plating layer is plated on the inner side wall of the semicircular rings 45 so as to reduce friction between the semicircular rings 45 and the chip pins and avoid abrasion.
Specifically, the testing mechanism 3 includes a lifting portion 31, a lifting platform 32, a supporting plate 33, a testing plate 34, a testing probe 35 and a testing instrument 36, the lifting portion 31 is fixedly arranged on the frame 1, the lifting portion 31 is connected with the lifting platform 32, one side of the lifting platform 32 is provided with the supporting plate 33, two rows of positioning holes 331 are uniformly formed in the supporting plate 33, the testing plate 34 is fixedly arranged above the supporting plate 33 in parallel, the testing probe 35 is uniformly arranged at the bottom of the testing plate 34, the testing probe 35 is aligned with the positioning holes 331 one by one, and the testing instrument 36 is fixedly arranged on the frame 1, and the testing probe 35 is electrically connected with the testing instrument 36. In this embodiment, the lifting platform 32 is disposed above the test platform 2, and the lifting portion 31 is used to drive the lifting platform 32 to move up and down, so as to control whether the test probe 35 contacts with the chip pins. The supporting plate 33 and the test plate 34 are disposed on the same side of the elevating table 32, and the supporting plate 33 and the test plate 34 are horizontally disposed. The locating holes 331 are used to assist in locating the chip pins so that the chip pins can be properly aligned with the test probes 35. The tester 36 can receive and process the signal from the test probe 35 to determine whether a short circuit failure occurs in the chip.
Specifically, the lifting portion 31 includes a sliding guide rail 311, a lifting motor 312 and a threaded shaft 313, the sliding guide rail 311 is vertically fixed on the frame 1, the lifting motor 312 is fixed on the top of the sliding guide rail 311, an output shaft of the lifting motor 312 is connected with the threaded shaft 313, the lifting platform 32 is slidably connected to the sliding guide rail 311, and the lifting platform 32 is in threaded connection with the threaded shaft 313. In this embodiment, the slide rail 311 is disposed on the right side of the test stand 2, and the lift table 32 can slide up and down along the slide rail 311. The lifting motor 312 is used for driving the threaded shaft 313 to rotate, so as to drive the lifting table 32 to move up and down.
Specifically, the inner side wall of the positioning hole 331 is provided with an inward draft angle of five degrees. In this embodiment, the bottom aperture of the positioning hole 331 should be larger than the top aperture, and the set drawing inclined plane can play an auxiliary correction role on the chip pins.
Specifically, the supporting plate 33 is embedded with a heating module, the temperature controller 37 is fixedly arranged on the frame 1, and the heating module is electrically connected with the temperature controller 37. In this embodiment, the heating module is configured to heat the supporting plate 33, so that the chip pins passing through the positioning holes 331 are also heated to eliminate the resilience force of the material. The temperature controller 37 is used for regulating and controlling the heating power of the heating module so as to achieve the purpose of regulating the heating temperature.
Specifically, the clamping piece 41 further comprises a support column 412, a first motor 413 and a screw rod 414, the support column 412 is vertically and fixedly arranged on the frame 1, the first motor 413 is fixedly arranged at the top of the support column 412, the screw rod 414 is connected to an output shaft of the first motor 413, and the screw rod 414 is in threaded connection with the clamping block 411. In this embodiment, support column 412 is disposed on the rear side of test station 2. The first motor 413 is the double-end motor, and lead screw 414 transversely sets up, and first motor 413 is used for driving lead screw 414 rotation, and then makes two grip blocks 411 be close to each other or keep away from each other to realize the centre gripping fixed to the chip on the testboard 2, in order to prevent that the chip from sliding in the test process.
Specifically, a flexible cushion 415 is fixedly provided at one side of the clamping blocks 411 adjacent to each other. In this embodiment, the flexible cushion 415 has a certain elasticity, so that the chip is prevented from being damaged.
Specifically, the driving portion 5 includes a hydraulic cylinder 501, a rubber hose 502, a pump body 503, a first side circular tube 504, a first piston plate 505, a first spring 506, a first piston rod 507, a second side circular tube 508, a second piston plate 509, a second spring 510 and a second piston rod 511, the hydraulic cylinder 501 is disposed inside the L-shaped side plate 43, one end of the rubber hose 502 is communicated with the hydraulic cylinder 501, the other end of the rubber hose 502 is connected with the pump body 503 on the frame 1, both sides of the hydraulic cylinder 501 are horizontally provided with the first side circular tube 504, the first piston plate 505 is slidably connected on the first side circular tube 504, and the first piston plate 505 is connected to the inner side wall of the first side circular tube 504 through the first spring 506, one end of the first piston rod 507 is connected with the first piston plate 505, the other end of the first piston rod 507 is connected with the correction rod 44, the second side circular tube 508 is vertically fixed on the top of the hydraulic cylinder 501, the second piston plate 509 is slidably connected on the inner side wall of the second side circular tube 508 through the second spring 510, the bottom end of the second piston rod 511 is connected with the second piston rod 509, and the top end of the second piston rod 511 is connected with the L-shaped side plate 43. In this embodiment, the hydraulic cylinder 501 is horizontally arranged, the hydraulic cylinder 501 is filled with hydraulic oil, and the pump body 503 can control the pumping of hydraulic oil into the hydraulic cylinder 501 or the pumping of hydraulic oil in the hydraulic cylinder 501. The two first side round pipes 504 are all arranged horizontally, the central axes of the two first side round pipes 504 coincide, when hydraulic oil is pumped into the hydraulic cylinder 501, the two first piston plates 505 are pushed away from each other, otherwise, when the hydraulic oil in the hydraulic cylinder 501 is pumped out, the two first piston plates 505 are pushed to be close to each other, and then synchronous movement of the control correction rod 44 is realized. The second side circular tube 508 is arranged vertically to the first side circular tube 504, when hydraulic oil is pumped into the hydraulic cylinder 501, the second piston plate 509 is fixed to the L-shaped side plate 43 through the second piston rod 511, so that the hydraulic cylinder 501 is driven to move downwards relative to the L-shaped side plate 43, and the correction rod 44 is driven to move synchronously, otherwise, when hydraulic oil in the hydraulic cylinder 501 is pumped out, the correction rod 44 is controlled to move upwards.
Specifically, the spring rate of the first spring 506 is smaller than the spring rate of the second spring 510. In this embodiment, since the elastic coefficient of the first spring 506 is smaller, when the hydraulic oil in the hydraulic cylinder 501 is pumped out, the first piston plate 505 will first overcome the elastic force of the first spring 506 to move, and when the first piston plate 505 moves to the limit position, the second piston plate 509 will relatively slide against the elastic force of the second spring 510, so as to achieve the purpose of automatically controlling the movement sequence of the correction lever 44.
Working principle:
when in use, firstly, a chip is placed on the test bench 2, the pins of the chip are upward, then the first motor 413 is started, the first motor 413 drives the screw rod 414 to rotate, further the two clamping blocks 411 are mutually close to clamp and fix the chip, then the telescopic rod 42 is started, the telescopic rod 42 drives the L-shaped side plate 43 to move towards the direction close to the test bench 2, the pins of the chip are positioned between the two correction rods 44, then the pump body 503 is started, the pump body 503 pumps hydraulic oil in the hydraulic cylinder 501 through the rubber hose 502, at the moment, due to the smaller elastic coefficient of the first spring 506, the first piston plate 505 overcomes the elastic force of the first spring 506 to mutually close, the correction rods 44 are driven to synchronously move, so that the two semicircular rings 45 are spliced to form a limit ring to enclose the pins of the chip, then the hydraulic oil in the hydraulic cylinder 501 is continuously reduced, the second piston plate 509 is made to slide relatively against the elastic force of the second spring 510, so that the hydraulic cylinder 501 moves up against the L-shaped side plate 43, and then drives the correction rod 44 to move up synchronously, correcting the chip pins, so that the chip pins are in a vertical state, then the lifting motor 312 is started, the lifting motor 312 drives the threaded shaft 313 to rotate, the threaded shaft 313 drives the lifting table 32 to slide down along the sliding guide rail 311, and then the supporting plate 33 moves down synchronously and inserts the chip pins into the positioning holes 331, so as to realize auxiliary correction, at this moment, the pump body 503 can be controlled to pump hydraulic oil into the hydraulic cylinder 501 to reset the correction rod 44, and at the same time, after the chip pins are inserted into the positioning holes 331, the heating module is started to heat the chip pins, so that the resilience force is eliminated, and when the lifting table 32 moves down to the test probe 35 to contact the chip pins, the chip can be detected, to ensure product quality.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The invention is not to be limited by the specific embodiments disclosed herein, and other embodiments are within the scope of the invention as defined by the claims of the present application.
Claims (9)
1. A full-automatic test equipment for packaging semiconductor chips is characterized in that: including frame (1), testboard (2), accredited testing organization (3) and pin correction mechanism (4), testboard (2) sliding connection is provided with accredited testing organization (3) in frame (1) above testboard (2) for test the chip, pin correction mechanism (4) are including clamping part (41), telescopic link (42), L type curb plate (43), correction pole (44), semicircle ring (45) and drive division (5), clamping part (41) are including clamping block (411), two clamping blocks (411) symmetry set up in testboard (2) both sides, and clamping block (411) sliding connection is provided with telescopic link (42) on frame (1), telescopic link (42) output is connected with L type curb plate (43), L type curb plate (43) inboard has set firmly drive division (5), two correction poles (44) symmetry set up in drive division (5) both sides, and the output and the drive division (44) of drive division (5) are connected, set firmly semicircle ring (45) on correction pole (44) and can make two correction pins (45) to make the limit chip that will be bent, limit the limit chip is just moved.
2. The fully automated test equipment for packaging semiconductor chips as defined in claim 1, wherein: the utility model provides a test mechanism (3) is including elevating system (31), elevating platform (32), backup pad (33), test board (34), test probe (35) and tester (36), elevating system (31) set firmly in on frame (1), be connected with elevating system (32) on elevating system (31), elevating system (32) one side is provided with backup pad (33), evenly seted up two rows of locating holes (331) on backup pad (33), backup pad (33) top parallel has set firmly test board (34), test board (34) bottom evenly is provided with test probe (35), and test probe (35) and locating hole (331) one-to-one align, tester (36) set firmly in on frame (1), test probe (35) and tester (36) electric connection.
3. A fully automated test equipment for packaging semiconductor chips as defined in claim 2, wherein: lifting part (31) include slide rail (311), elevator motor (312) and screw shaft (313), slide rail (311) vertical set firmly in on frame (1), slide rail (311) top has set firmly elevator motor (312), and the output shaft of elevator motor (312) has screw shaft (313), elevating platform (32) sliding connection is on slide rail (311), and elevating platform (32) and screw shaft (313) threaded connection.
4. A fully automated test equipment for packaging semiconductor chips as defined in claim 2, wherein: the inner side wall of the positioning hole (331) is provided with an inward drawing die angle of five degrees.
5. A fully automated test equipment for packaging semiconductor chips as defined in claim 2, wherein: the support plate (33) is embedded with a heating module, the temperature controller (37) is fixedly arranged on the frame (1), and the heating module is electrically connected with the temperature controller (37).
6. The fully automated test equipment for packaging semiconductor chips as defined in claim 1, wherein: the clamping piece (41) further comprises a support column (412), a first motor (413) and a screw rod (414), the support column (412) is vertically and fixedly arranged on the frame (1), the first motor (413) is fixedly arranged at the top of the support column (412), the screw rod (414) is connected to an output shaft of the first motor (413), and the screw rod (414) is in threaded connection with the clamping block (411).
7. The fully automated test equipment for packaging semiconductor chips as defined in claim 1, wherein: a flexible cushion layer (415) is fixedly arranged on one side, close to each other, of the clamping block (411).
8. The fully automated test equipment for packaging semiconductor chips as defined in claim 1, wherein: the driving part (5) comprises a hydraulic cylinder (501), a rubber hose (502), a pump body (503), a first side circular tube (504), a first piston plate (505), a first spring (506), a first piston rod (507), a second side circular tube (508), a second piston plate (509), a second spring (510) and a second piston rod (511), wherein the hydraulic cylinder (501) is arranged on the inner side of the L-shaped side plate (43), one end of the rubber hose (502) is communicated with the hydraulic cylinder (501), the other end of the rubber hose (502) is connected with the pump body (503) on the frame (1), both sides of the hydraulic cylinder (501) are horizontally provided with the first side circular tube (504), the first side circular tube (504) is connected with the first piston plate (505) in a sliding manner, one end of the first piston rod (507) is connected with the inner side wall of the first side circular tube (504) through the first spring (506), the other end of the first piston rod (507) is connected with the piston rod (44), the top of the hydraulic cylinder (501) is vertically fixedly provided with the second side circular tube (508) and the second piston plate (509) is connected with the second piston plate (509) through the second piston plate (509) in a sliding manner, the bottom end of the second piston rod (511) is connected with the second piston plate (509), and the top end of the second piston rod (511) is connected with the L-shaped side plate (43).
9. The fully automated test equipment for packaging semiconductor chips as defined in claim 8, wherein: the first spring (506) has a spring rate that is less than the spring rate of the second spring (510).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311522882.3A CN117233583B (en) | 2023-11-16 | 2023-11-16 | Full-automatic test equipment for packaging semiconductor chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311522882.3A CN117233583B (en) | 2023-11-16 | 2023-11-16 | Full-automatic test equipment for packaging semiconductor chip |
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| Publication Number | Publication Date |
|---|---|
| CN117233583A CN117233583A (en) | 2023-12-15 |
| CN117233583B true CN117233583B (en) | 2024-01-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311522882.3A Active CN117233583B (en) | 2023-11-16 | 2023-11-16 | Full-automatic test equipment for packaging semiconductor chip |
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| CN114264934A (en) * | 2021-12-21 | 2022-04-01 | 西安重冶电控科技有限公司 | Debugging detection equipment for circuit control panel production |
| CN114705962A (en) * | 2022-03-24 | 2022-07-05 | 深圳市安润佳半导体科技有限公司 | Semiconductor package element testing device |
| CN115662913A (en) * | 2022-09-22 | 2023-01-31 | 温州城市大学 | Semiconductor chip package testing device |
| JP2023103672A (en) * | 2022-01-14 | 2023-07-27 | 三菱電機株式会社 | Semiconductor device test device |
-
2023
- 2023-11-16 CN CN202311522882.3A patent/CN117233583B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212845780U (en) * | 2020-08-24 | 2021-03-30 | 深圳市华力宇电子科技有限公司 | Fingerprint chip testing device with fake finger mechanism |
| CN113687165A (en) * | 2021-08-26 | 2021-11-23 | 山东大学 | High-low voltage engineering electrical element testing device and testing method thereof |
| CN114264934A (en) * | 2021-12-21 | 2022-04-01 | 西安重冶电控科技有限公司 | Debugging detection equipment for circuit control panel production |
| JP2023103672A (en) * | 2022-01-14 | 2023-07-27 | 三菱電機株式会社 | Semiconductor device test device |
| CN114705962A (en) * | 2022-03-24 | 2022-07-05 | 深圳市安润佳半导体科技有限公司 | Semiconductor package element testing device |
| CN115662913A (en) * | 2022-09-22 | 2023-01-31 | 温州城市大学 | Semiconductor chip package testing device |
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| Publication number | Publication date |
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| CN117233583A (en) | 2023-12-15 |
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