CN117229861A - Ceramic circuit board brazing layer remover and removing process - Google Patents
Ceramic circuit board brazing layer remover and removing process Download PDFInfo
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- CN117229861A CN117229861A CN202311184529.9A CN202311184529A CN117229861A CN 117229861 A CN117229861 A CN 117229861A CN 202311184529 A CN202311184529 A CN 202311184529A CN 117229861 A CN117229861 A CN 117229861A
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- circuit board
- ceramic circuit
- brazing layer
- remover
- acid
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- 238000005219 brazing Methods 0.000 title claims abstract description 46
- 239000000919 ceramic Substances 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 21
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 54
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000003381 stabilizer Substances 0.000 claims abstract description 17
- 239000003223 protective agent Substances 0.000 claims abstract description 15
- 229920000805 Polyaspartic acid Polymers 0.000 claims abstract description 10
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229920001577 copolymer Polymers 0.000 claims abstract description 10
- 108010064470 polyaspartate Proteins 0.000 claims abstract description 10
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 10
- 239000011591 potassium Substances 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 claims description 6
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 229910000510 noble metal Inorganic materials 0.000 claims description 6
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical group O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 6
- 229910001930 tungsten oxide Inorganic materials 0.000 claims description 6
- -1 platinum group metals Chemical class 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- MIOPJNTWMNEORI-GMSGAONNSA-N (S)-camphorsulfonic acid Chemical compound C1C[C@@]2(CS(O)(=O)=O)C(=O)C[C@@H]1C2(C)C MIOPJNTWMNEORI-GMSGAONNSA-N 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 claims description 3
- 229940092714 benzenesulfonic acid Drugs 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910000042 hydrogen bromide Inorganic materials 0.000 claims description 3
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims description 3
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 3
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims description 3
- 229910000043 hydrogen iodide Inorganic materials 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 3
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 229910052762 osmium Inorganic materials 0.000 claims description 3
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 claims description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000945 filler Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000011190 CEM-3 Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The application relates to the field of ceramic circuit boards, in particular to a ceramic circuit board brazing layer remover which can thoroughly clean a brazing layer on a ceramic circuit board, improve the removal efficiency, increase the stability and effectively solve the problems in the background technology. The remover comprises sulfuric acid, hydrogen peroxide, a hydrogen peroxide stabilizer, an accelerator, a protective agent and water. Sulfuric acid 0.8-4%, hydrogen peroxide 0.5-3%, hydrogen peroxide stabilizer 0.1-1%, accelerator 0.1-1%, protectant 1-3%, and water in balance. The hydrogen peroxide stabilizer is a mixture of polyaspartic acid potassium and acrylic acid-maleic anhydride copolymer, and the mass ratio of the polyaspartic acid potassium to the acrylic acid-maleic anhydride copolymer is 1:5. the method is simple to operate, has obvious removal effect and is suitable for various circuit boards.
Description
Technical Field
The application relates to the field of ceramic circuit board processing, in particular to a ceramic circuit board brazing layer remover and a ceramic circuit board brazing layer removing process.
Background
With the gradual deepening of electronic technology in various application fields, high integration of circuit boards becomes a necessary trend, a high-level integrated packaging module requires a good heat dissipation bearing system, and the disadvantages of traditional circuit boards FR-4 and CEM-3 in TC (thermal conductivity coefficient) have become a bottleneck for restricting the development of electronic technology. In recent years, the rapid development of the LED industry also puts higher demands on TC indexes of the bearing circuit board. In the field of high-power LED illumination, materials with good heat dissipation performance such as metal, ceramic and the like are often adopted for preparing the circuit substrate, the heat conductivity coefficient of the high-heat-conductivity aluminum substrate is generally 1-4W/M.K, and the heat conductivity coefficient of the ceramic substrate can reach about 220W/M.K according to different preparation modes and material formulas. The ceramic circuit board is a heat-conducting organic ceramic circuit board with the heat conductivity coefficient of 9-20W/m.k, which is prepared by utilizing heat-conducting ceramic powder and an organic adhesive at the temperature of below 250 ℃. The ceramic material has good high-frequency performance and electrical performance, and has the performances of high heat conductivity, excellent chemical stability, excellent thermal stability and the like which are not possessed by the organic substrate, thus being an ideal packaging material for a new generation of large-scale integrated circuits and power electronic modules. In the ceramic circuit board manufacturing process flow, brazing is a very important process.
Brazing refers to a welding method for connecting metals by filling gaps of solid workpieces with liquid brazing filler metal after the brazing filler metal below the melting point of a weldment and the weldment are heated to the melting temperature of the brazing filler metal at the same time. During brazing, firstly, an oxide film and oil stains on the contact surface of a base metal are removed, so that capillary tubes can play a role after the brazing filler metal is melted, and wettability and capillary mobility of the brazing filler metal are improved. And (3) a brazing process: the surface cleaned workpieces are assembled together in a lap joint fashion and solder is placed adjacent to or between the joint gaps. When the workpiece and the brazing filler metal are heated to a temperature slightly higher than the melting point of the brazing filler metal, the brazing filler metal is melted (the workpiece is not melted), sucked and filled between the gaps of the solid workpiece by capillary action, the liquid brazing filler metal and the workpiece metal are mutually diffused and dissolved, and the brazing joint is formed after condensation.
When the circuit board is produced or detached, a plurality of soldering layers are remained on the circuit board, and the soldering layers are cleaned up so as not to influence the use of the circuit board. The brazing layer is treated by a cleaning method, wherein the existing cleaning method is incomplete in removal of the brazing layer, has residues, is low in cleaning efficiency and is unstable in cleaning solution.
Disclosure of Invention
Aiming at the defects of the prior art, the application provides the ceramic circuit board brazing layer remover and the removing process, which can thoroughly clean the brazing layer on the ceramic circuit board, improve the removing efficiency, increase the stability and effectively solve the problems in the background technology.
In order to achieve the above purpose, the present application provides the following technical solutions: the ceramic circuit board brazing layer remover comprises sulfuric acid, hydrogen peroxide, a hydrogen peroxide stabilizer, an accelerator, a protective agent and water.
As a preferred technical scheme, the volume composition ratio of the remover is as follows: sulfuric acid 0.8-4%, hydrogen peroxide 0.5-3%, hydrogen peroxide stabilizer 0.1-1%, accelerator 0.1-1%, protectant 1-3%, and water in balance.
As a preferable technical scheme, the hydrogen peroxide stabilizer is a mixture of polyaspartic acid potassium and acrylic acid-maleic anhydride copolymer, and the mass ratio of polyaspartic acid potassium to acrylic acid-maleic anhydride copolymer is 1:5.
as a preferable technical scheme, the accelerator is a compound of noble metal ions and organic carboxylic acid, and the noble metals comprise gold, silver and platinum group metals (ruthenium, rhodium, palladium, osmium, iridium and platinum).
As a preferable technical scheme, the protective agent is an acrylic ester protective agent.
As a preferable technical scheme, the PH value of the remover is 0.1-4.
As a preferable technical scheme, the water used in the remover is deionized water.
As a preferable technical scheme, the accelerator is a tungsten oxide accelerator.
As a preferred embodiment, the tungsten oxide accelerator contains at least one selected from the group consisting of hydrogen chloride, hydrogen bromide, hydrogen iodide, sulfuric acid, nitric acid, methane sulfonic acid, trifluoromethane sulfonic acid, benzene sulfonic acid, p-toluene sulfonic acid, 10-camphor sulfonic acid, and salts thereof.
The application also provides a process for removing the brazing layer of the ceramic circuit board, which comprises the following steps: s1, preparing a remover solution; s2, adding the remover solution into a cleaning tank and heating to 44-46 ℃; s3, immersing the circuit board in the cleaning pool for 0.5-1.5 minutes, taking out, and cleaning the cleaning solution on the surface of the circuit board by using flowing water.
Compared with the prior art, the application provides the ceramic circuit board brazing layer remover and the removing process, which have the following beneficial effects:
1. according to the application, the hydrogen peroxide stabilizer is added into the remover, so that the stability of the circuit board can be enhanced when the brazing layer is removed, and the problem of instability when the brazing layer is removed by the conventional brazing layer removing solution is solved.
2. According to the application, the accelerator is added into the remover, so that the efficiency of removing the brazing layer of the circuit board can be improved, and the integral processing time of the circuit board can be shortened.
3. According to the application, through mixing the hydrogen peroxide stabilizer and the accelerator, the thoroughness of removing the brazing layer can be improved, and the removing effect of the brazing layer is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application, illustrate and together with the description serve to explain a part of the application:
FIG. 1 is a process flow diagram of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Example 1
As shown in fig. 1, the ceramic circuit board brazing layer remover comprises sulfuric acid, hydrogen peroxide, a hydrogen peroxide stabilizer, an accelerator, a protective agent and water.
In the above embodiment, the composition ratio of the volume of the remover is: 3% of sulfuric acid, 2% of hydrogen peroxide, 0.8% of hydrogen peroxide stabilizer, 0.7% of accelerator, 2% of protective agent and the balance of water.
In the above embodiment, the hydrogen peroxide stabilizer is a mixture of polyaspartic acid potassium and acrylic acid-maleic anhydride copolymer, and the mass ratio of polyaspartic acid potassium to acrylic acid-maleic anhydride copolymer is 1:5.
in the above embodiments, the accelerator is a complex of noble metal ions and organic carboxylic acids, the noble metals include gold, silver and platinum group metals (ruthenium, rhodium, palladium, osmium, iridium, platinum).
In the above embodiment, the protecting agent is an acrylate protecting agent.
In the above examples, the pH of the remover was 3.
In the above embodiment, the water used in the remover is deionized water.
The application also provides a process for removing the brazing layer of the ceramic circuit board, which comprises the following steps: s1, preparing a remover solution; s2, adding the remover solution into a cleaning tank and heating to 44 ℃; s3, immersing the circuit board in the cleaning pool for 1.2 minutes, taking out, and cleaning the cleaning solution on the surface of the circuit board by using flowing water.
Example 2
As shown in fig. 1, the remover component comprises sulfuric acid, hydrogen peroxide, a hydrogen peroxide stabilizer, an accelerator, a protective agent and water.
In the above embodiment, the composition ratio of the volume of the remover is: sulfuric acid 4%, hydrogen peroxide 3%, hydrogen peroxide stabilizer 1%, accelerator 1%, protective agent 3% and the balance water.
In the above embodiment, the hydrogen peroxide stabilizer is a mixture of polyaspartic acid potassium and acrylic acid-maleic anhydride copolymer, and the mass ratio of polyaspartic acid potassium to acrylic acid-maleic anhydride copolymer is 1:5.
in the above embodiment, the protecting agent is an acrylate protecting agent.
In the above examples, the pH of the remover was 4.
In the above embodiment, the water used in the remover is deionized water.
In the above embodiment, the accelerator is a tungsten oxide accelerator.
In the above embodiment, the tungsten oxide accelerator contains at least one selected from the group consisting of hydrogen chloride, hydrogen bromide, hydrogen iodide, sulfuric acid, nitric acid, methane sulfonic acid, trifluoromethane sulfonic acid, benzene sulfonic acid, p-toluene sulfonic acid, 10-camphor sulfonic acid, and salts thereof.
The application also provides a process for removing the brazing layer of the ceramic circuit board, which comprises the following steps: s1, preparing a remover solution; s2, adding the remover solution into a cleaning tank and heating to 45 ℃; s3, immersing the circuit board in the cleaning pool for 1 minute, taking out, and cleaning the cleaning solution on the surface of the circuit board by using flowing water.
It should be noted that, in this document, the terms "first," "second," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate a direction or a position relationship based on that shown in the drawings, and are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure for purposes of understanding and reading by those skilled in the art, and are not intended to limit the scope of the application, in any way, modifications in structure, variations in proportions, or otherwise, used in the practice of the application, which are otherwise, used in the practice of the application, without departing from the spirit or scope thereof.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a ceramic circuit board brazing layer remover which characterized in that: the remover comprises sulfuric acid, hydrogen peroxide, a hydrogen peroxide stabilizer, an accelerator, a protective agent and water.
2. The ceramic circuit board brazing layer remover according to claim 1, wherein: the volume composition ratio of the remover is as follows: sulfuric acid 0.8-4%, hydrogen peroxide 0.5-3%, hydrogen peroxide stabilizer 0.1-1%, accelerator 0.1-1%, protectant 1-3%, and water in balance.
3. The ceramic circuit board brazing layer remover according to claim 1, wherein: the hydrogen peroxide stabilizer is a mixture of polyaspartic acid potassium and acrylic acid-maleic anhydride copolymer, and the mass ratio of the polyaspartic acid potassium to the acrylic acid-maleic anhydride copolymer is 1:5.
4. the ceramic circuit board brazing layer remover according to claim 1, wherein: the accelerator is a compound of noble metal ions and organic carboxylic acid, and the noble metals comprise gold, silver and platinum group metals (ruthenium, rhodium, palladium, osmium, iridium and platinum).
5. The ceramic circuit board brazing layer remover according to claim 1, wherein: the protective agent is an acrylic ester protective agent.
6. The ceramic circuit board brazing layer remover according to claim 1, wherein: the pH value of the remover is 0.1-4.
7. The ceramic circuit board brazing layer remover according to claim 1, wherein: the water used in the remover is deionized water.
8. The ceramic circuit board brazing layer remover according to claim 1, wherein: the accelerator is a tungsten oxide accelerator.
9. The ceramic circuit board brazing layer remover according to claim 8, wherein: the tungsten oxide accelerator contains at least one selected from the group consisting of hydrogen chloride, hydrogen bromide, hydrogen iodide, sulfuric acid, nitric acid, methanesulfonic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, 10-camphorsulfonic acid, and salts thereof.
10. A process for removing a brazing layer of a ceramic circuit board is characterized by comprising the following steps of: the method comprises the following steps: s1, preparing a remover solution; s2, adding the remover solution into a cleaning tank and heating to 44-46 ℃; s3, immersing the circuit board in the cleaning pool for 0.5-1.5 minutes, taking out, and cleaning the cleaning solution on the surface of the circuit board by using flowing water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311184529.9A CN117229861A (en) | 2023-09-14 | 2023-09-14 | Ceramic circuit board brazing layer remover and removing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311184529.9A CN117229861A (en) | 2023-09-14 | 2023-09-14 | Ceramic circuit board brazing layer remover and removing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117229861A true CN117229861A (en) | 2023-12-15 |
Family
ID=89090522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311184529.9A Pending CN117229861A (en) | 2023-09-14 | 2023-09-14 | Ceramic circuit board brazing layer remover and removing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117229861A (en) |
-
2023
- 2023-09-14 CN CN202311184529.9A patent/CN117229861A/en active Pending
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