CN117205976A - Glass-hollowed-out film-glass sandwich micro-fluidic chip - Google Patents
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- CN117205976A CN117205976A CN202310200800.7A CN202310200800A CN117205976A CN 117205976 A CN117205976 A CN 117205976A CN 202310200800 A CN202310200800 A CN 202310200800A CN 117205976 A CN117205976 A CN 117205976A
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- 239000011521 glass Substances 0.000 title claims abstract description 67
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 120
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims abstract description 120
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 120
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims abstract description 119
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims abstract description 119
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 claims abstract description 46
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229920000642 polymer Polymers 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000002360 preparation method Methods 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims abstract description 5
- 239000010453 quartz Substances 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000000178 monomer Substances 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- 238000005411 Van der Waals force Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 6
- 239000010408 film Substances 0.000 abstract 6
- 239000010409 thin film Substances 0.000 abstract 3
- 238000001069 Raman spectroscopy Methods 0.000 description 20
- 238000005530 etching Methods 0.000 description 11
- 238000001514 detection method Methods 0.000 description 9
- 238000001237 Raman spectrum Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000004611 spectroscopical analysis Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000002503 metabolic effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000002444 silanisation Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003915 cell function Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
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- 238000004949 mass spectrometry Methods 0.000 description 1
- 230000003278 mimic effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000002176 non-resonance Raman spectroscopy Methods 0.000 description 1
- 238000012576 optical tweezer Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Abstract
The application discloses a glass-hollowed-out film-glass sandwich micro-fluidic chip, which comprises the following steps: preparing a mould: manufacturing a template, pouring the PDMS high polymer on the template, demolding after the PMDS high polymer is solidified, and then packaging to finish the preparation of the die; preparing a hollowed-out film: preparing a hollowed-out film by using the die prepared in the steps, preparing the hollowed-out film by using a PDMS high polymer, and finally demolding to obtain the hollowed-out film; manufacturing a microfluidic chip: bonding the hollowed-out film and the substrate together, and then bonding a substrate again on the other side of the hollowed-out film. The method for manufacturing the micro-fluidic chip by the hollowed-out thin film can improve the manufacturing precision of the micro-fluidic chip without processing glass, and the hollowed-out thin film can be manufactured in batches by adopting a method for manufacturing the hollowed-out thin film in advance, so that the manufacturing difficulty of the quartz glass micro-fluidic chip is greatly reduced.
Description
Technical Field
The application relates to the field of manufacturing of microfluidic chips, in particular to a manufacturing method of a glass-hollow film-glass sandwich microfluidic chip.
Background
Single cells are the basic unit of life and the basic unit of evolution on earth, so single cell analysis techniques, i.e. functional identification and characterization on single cell precision, are able to mine the vital elements, characterize cell function and understand the vital process at the deepest level. Currently, single cell phenotype testing techniques have been developed that mainly include fluorescence flow, fluorescence droplet flow, raman flow, mass spectrometry, and the like. Single Cell Raman Spectroscopy (SCRS) consists of thousands of resonant or non-resonant raman peaks, which alone or in combination can mimic a particular cell biochemical or metabolic phenotype. Thus, SCRS can capture the metabolic state of cells like a function-based live photo. The sorting of cells by SCRS, raman Activated Cell Sorting (RACS) is expected to be a powerful platform for screening biological components, modules or cells, as it is label-free, culture-free, invasive, and widely applicable to a variety of cells. The core of the RACS technology is a micro-fluidic chip, and single-cell Raman signal acquisition is often carried out by the micro-fluidic chip, so that the single-cell Raman spectrum acquisition cannot be interfered by the background of the chip due to the broad spectrum characteristic of the Raman spectrum. Quartz is an ideal material, and when single-cell raman spectrum acquisition is performed, background signals of quartz have little interference on raman signals of cells. Quartz is an ideal microfluidic chip material for raman spectrum acquisition.
The traditional quartz microfluidic chip is mainly manufactured by etching channels and bonding. The etching process of the channel is complex, the cost is high, and the channel with high depth-to-width ratio is difficult to manufacture. In addition, the bonding of the chip has extremely high requirements on environment and equipment. The quartz microfluidic chip has high manufacturing cost and complex processing technology, and greatly limits the popularization and application of the RACS technology.
Disclosure of Invention
The application discloses a glass-hollowed-out film-glass sandwich micro-fluidic chip, which comprises the following steps:
preparing a mould: manufacturing a template, pouring a PDMS polymer on the template, demolding the PMDS polymer into a PMDS layer after curing, and then packaging to finish the preparation of the die;
preparing a hollowed-out film: pumping uncured PDMS high polymer into a mold, and heating and solidifying to prepare a hollowed-out film; transferring the hollowed-out film to the substrate in a bonding transfer mode;
manufacturing a sandwich microfluidic chip: after the hollowed-out film is transferred onto the substrate in a bonding mode, a piece of substrate is bonded again on the other side of the hollowed-out film, and then the sandwich chip can be manufactured.
By adopting the technical scheme, the glass-hollowed-out film-glass sandwich microfluidic chip can be manufactured, and compared with the traditional method for preparing the microfluidic chip by glass etching, the method is simpler and has low cost. Because the glass sheet does not need to be subjected to channel etching, the processing difficulty can be reduced, the bonding between glass and glass is not needed, and the success rate is high. Meanwhile, compared with a glass chip etching process, the glass-hollow film-glass sandwich microfluidic chip has the advantages that a channel with a high depth-to-width ratio is difficult to manufacture, and the glass-hollow film-glass sandwich microfluidic chip has a flexible channel depth-to-width ratio and can be realized only by manufacturing hollow films with different thicknesses. The microfluidic chip manufactured by the hollowed-out film is clamped between the two substrates, so that the channels of the microfluidic chip are packaged by the two substrates, PDMS high polymers do not exist on the upper and lower sides of the channels, the single-cell Raman signal detection by using the microfluidic chip is not affected by the chip material, and the obtained single-cell Raman signal has good quality.
Optionally, in the preparation step of the die, a silicon wafer is selected to manufacture a template,
after the PDMS high polymer is cured, a sample inlet and a sample outlet are required to be drilled on one side of the PMDS layer, which is away from the channel structure, for the filling and the outflow of materials required for manufacturing the film;
and when the PMDS layer is packaged, bonding and packaging are carried out on one side with the channel structure by adopting glass or ITO glass.
Through adopting above-mentioned technical scheme, the silicon chip is convenient for process, also is convenient for process the back template and carries out secondary adjustment to can make the mould of making more accurate, and adopt glass or ITO glass to encapsulate, because between glass or ITO glass and the PDMS polymer, van der Waals' force is less than between fretwork film and the PDMS polymer, the drawing of patterns of fretwork film of being convenient for, and simultaneously because the fretwork film still inlays the passageway of locating on the mould at this moment, then the mould can restrict the fretwork film, make the fretwork film can not be easily produce the deformation.
Optionally, the mixing ratio of the PDMS monomer and the curing agent in the PDMS polymer used in the mold manufacturing is 13:1, the ratio of the PDMS monomer to the curing agent in the PDMS polymer used for manufacturing the PDMS film is 8:1.
by adopting the technical scheme, the proportion of the PDMS monomer of the high polymer required by the PDMS film to the curing agent is different from the proportion of the PDMS monomer and the curing agent in the PDMS high polymer used by the PDMS layer, so that the subsequent PDMS film can be conveniently peeled off from the PDMS layer. Meanwhile, the proportion of the curing agent in the polymer required by the PDMS layer is low, so that the die has better elasticity and is convenient to strip.
Optionally, in the preparation steps of the hollowed-out film:
heating and solidifying uncured PDMS high polymer in a mould to obtain a hollowed-out film;
then peeling the PDMS layer and the film together from the glass sheet; in the peeling process, the PDMS film is adhered to the PDMS layer, and the PDMS layer can fix the film, so that the film is not easy to deform.
By adopting the technical scheme.
Optionally, in the step of preparing the hollowed-out film, the method further includes transferring the film:
in order to obtain the film, the film is peeled off from the PDMS layer, and the film is transferred onto the substrate in a bonding transfer mode, wherein the PDMS layer and the film are integrally put into oxygen plasma to be bonded with the substrate, and the side, embedded with the film, of the PDMS layer faces the substrate, so that the PDMS layer and the film are bonded on the substrate at the same time; and independently stripping the PDMS layer, wherein the bonding force of the PDMS film on the quartz plate is larger than the van der Waals force, the hydrogen bond and other adhesive force between the PDMS film and the PDMS layer, so that the film can be separated from the PDMS layer, and the bonding is transferred to the substrate. The film transferring mode can reduce the probability of deformation and damage of the film in the transferring process.
By adopting the technical scheme.
Optionally, the substrate is made of glass, quartz glass, or ITO glass, preferably quartz glass. The shape of the substrate can be rectangle, circle, triangle, etc., the thickness is adjusted according to the requirement of the chip, preferably the shape of the substrate for transferring the film is rectangle, and the thickness is 1 millimeter. The substrate is perforated in advance and is used for a sample inlet and a sample outlet of the sandwich chip; the number and the size of the punching holes can be flexibly adjusted.
By adopting the technical proposal, the utility model has the advantages that,
optionally, selecting a substrate: quartz glass with proper size and thickness is selected as a substrate of the sandwich microfluidic chip for receiving and transferring the hollow film;
and (3) transferring and bonding the hollowed-out film: bonding the hollowed-out film on the substrate;
and (3) secondary bonding: and bonding another substrate on one side of the hollowed-out film far away from the substrate, thereby forming the microfluidic chip with the substrate-hollowed-out film-substrate sandwich structure.
By adopting the technical scheme, the hollowed-out parts in the hollowed-out film are used as channels for constructing the microfluidic chip, so that the precision of the microfluidic chip can be improved; compared with the existing preparation method of the quartz glass chip, the preparation method of the sandwich structure of the quartz plate-PDMS film-quartz plate has the advantages that photoetching is not needed for the quartz plate, silanization treatment is not needed in the process of manufacturing the PDMS film, the cost is lower, after the process of manufacturing the PDMS film is finished, the PDMS film is not needed to be peeled off from a die and transferred to the quartz plate, the PDMS film is directly bonded on the quartz plate, the die is peeled off, force is mainly applied to the die in the process of peeling off the die, and the PDMS film is bonded on the quartz plate at the moment and limited by the quartz plate, so that the film cannot be stretched, torn, wrinkled and the like in the process of peeling off the die, and further the microstructure cannot be damaged, the quality of the microfluidic chip cannot be affected, the microfluidic chip is convenient to reuse, and the cost is further reduced.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the novel glass chip manufacturing method is developed, a hollowed-out film layer is manufactured to serve as a micro-channel structure, and glass sheets are bonded on two sides of the hollowed-out film, so that the glass-hollowed-out film-glass sandwich glass microfluidic chip is formed. The etching of the glass channel is replaced by manufacturing the film layer with the hollow structure. The bonding between the original glass and the glass is replaced by the bonding between the film and the glass sheet.
2. And a hollowed film layer is manufactured to serve as a micro-channel, and the glass-hollowed film-glass sandwich quartz glass chip formed by bonding the hollowed film and the glass sheet replaces the etching of the traditional glass micro-fluidic chip on the glass micro-channel, so that the processing difficulty and cost of the chip are greatly reduced.
3. The sandwich glass chips with different structures can be obtained by manufacturing the hollowed-out films with different shapes so as to meet the requirements of collecting and sorting Raman single-cell Raman signals of different types. The sandwich glass chip with different channel depth-to-width ratios can be obtained by manufacturing the hollowed-out films with different thicknesses so as to meet the operation requirements of cells with different sizes.
4. The method can be used for manufacturing low-cost glass microfluidic chips, has the advantages of low Raman background, good optical characteristics and the like, can be used for manufacturing single-cell Raman detection and separation chips with different structures at present, can meet the current requirements for single-cell Raman detection and separation, and has great commercial application prospect and value.
5. The ratio of the PDMS monomer to the curing agent of the polymer required by the PDMS film is different from the ratio of the PDMS monomer to the curing agent in the PDMS polymer used for the PDMS layer, so that the PDMS layer and the PDMS film can be better separated.
Description of the drawings:
fig. 1 is a schematic diagram of a manufacturing process of a mold in a first embodiment.
Fig. 2 is a schematic diagram of a sandwich microfluidic chip of quartz glass-hollow film-quartz glass according to an embodiment.
Fig. 3 is a schematic structural diagram of a single-cell raman detection sorting chip in the second embodiment.
Fig. 4 is a schematic structural diagram of a single-cell raman detection, sorting and culture chip with various structures in the second embodiment.
Detailed Description
Example 1
The embodiment discloses a glass-hollowed-out film-glass sandwich microfluidic chip, referring to fig. 1 and 2, comprising the following steps:
the preparation method of the die comprises the following steps: firstly, a template is manufactured by using a silicon wafer, then, a PDMS polymer is poured into the template, and after the PDMS polymer is solidified to form a PDMS layer, the PDMS layer is finally packaged.
When the template is manufactured, the structure of the channel is designed through drawing software, then a layer of photoresist is coated on the surface of the silicon wafer template, the photoresist is subjected to photoetching through a soft photoetching technology, the needed channel shape is processed on the photoresist, and then the PDMS high polymer is poured into the template to form the PDMS layer with the channel structure.
The mixing ratio of the PDMS monomer and the curing agent in the PDMS high polymer is 13:1, pouring the high polymer into a template, placing the template in an oven at 70 ℃ for overnight curing, and taking out the template for standby.
And after cooling to room temperature, cutting and peeling off the prepared PDMS layer from the silicon wafer template, and wrapping two sides of the PDMS layer by using a sealing film to avoid adhering dust to influence bonding, thereby completing half-manufacturing of the die.
And cutting out the chip on the PDMS layer along the outline according to the structure of the microfluidic chip, processing and manufacturing relevant channels on the cut PDMS layer, and punching a sample inlet and a sample outlet by using a puncher. If scraps appear during the cutting and punching operation, the scraps are immersed in absolute ethyl alcohol for ultrasonic cleaning, and then the surfaces of the scraps are dried by nitrogen.
And bonding the prepared PDMS layer with the channel structure with glass, placing the surface of the PDMS layer with the channel structure and the glass into an oxygen plasma machine together in the bonding process, vacuumizing for 2min, performing plasma treatment for 1min, treating the surfaces of the PDMS layer and the glass, enabling the PDMS layer and the glass to be bonded together better, and reinforcing the bonding in an oven at 70 ℃ for overnight.
The manufacturing of the mould is completed through the steps, and the mould is shown in the figure;
the preparation method of the hollowed-out film comprises the following steps: PDMS high polymer was injected into the mold using a syringe, and the mixing ratio of PDMS monomer and curing agent was 8:1, then placing the mould on a heating plate for heating, taking down and cooling to room temperature after the heating and solidification are finished, and peeling the PDMS layer and the film together with the glass sheet by using a blade. In the peeling process, the PDMS film is adhered to the PDMS layer, and the PDMS layer can fix the film, so that the film is not easy to deform.
And when the PDMS high polymer is injected, injecting the PDMS high polymer from a sample inlet of the mold by adopting an injector, so that the channel is filled with the PDMS high polymer until the PDMS high polymer overflows from the sample outlet, and ensuring that the channel structure on the PDMS layer is filled with the PDMS high polymer.
Heating the mold, heating on a heating plate at 100-200deg.C for 5-60min, taking off, standing at room temperature, and cooling; preferably heating at 150deg.C for 5min; the PDMS high polymer can be solidified to form the needed PDMS hollow film.
And when the mold is released, the PDMS layer is separated from glass or ITO glass, and because the PDMS layer and the PDMS hollow film are made of PDMS polymers with the same materials and different proportions, the hollow film is embedded in the PDMS layer, and the PDMS layer can limit the hollow film, so that the hollow film cannot be pulled and deformed in the mold releasing process, and the precision of the hollow film is improved.
The manufacturing method of the micro-fluidic chip comprises the following steps: firstly, manufacturing a substrate with proper size by using quartz glass, conveniently using the substrate to receive a film, bonding the quartz glass and a hollowed-out film, and finally bonding a piece of quartz glass with the same size on the other side of the hollowed-out film again, thereby completing the sandwich quartz microfluidic chip in the form of quartz glass, hollowed-out film and quartz glass. Because the PDMS film is a hollowed film, quartz glass seals two surfaces of a channel on the chip, the upper side and the lower side of the channel in the chip can not be shielded by PDMS high polymer, and the manufactured glass microfluidic chip has the advantages of low Raman background, good optical characteristics and the like, can be used for acquiring single-cell Raman spectrums, is coupled with cell manipulation means such as optical tweezers and the like, and can be used for realizing single-cell Raman sorting.
In the bonding process, firstly, the transfer of the film is completed, in order to obtain the film, the film is required to be peeled off from the PDMS layer, the film is transferred onto the substrate in a bonding transfer mode, the PDMS layer and the film are integrally put into oxygen plasma to be bonded with the substrate, and the side, embedded with the film, of the PDMS layer faces towards the substrate, so that the PDMS layer and the film are bonded on the substrate at the same time; and independently stripping the PDMS layer, wherein the bonding force of the PDMS film on the quartz plate is larger than the van der Waals force, the hydrogen bond and other adhesive force between the PDMS film and the PDMS layer, so that the film can be separated from the PDMS layer, and the bonding is transferred to the substrate. The film transferring mode can reduce the probability of deformation and damage of the film in the transferring process.
The hollow film after demolding and one piece of quartz glass are bonded, and at the moment, the bonding force of the PDMS film on the quartz glass is larger than the van der Waals force between the PDMS film and the mold and the adhesive force such as hydrogen bond, so that the PDMS film can be left on the quartz glass without silanization treatment, and the method is simpler and more convenient, and can not have dangerous hidden danger.
After the first bonding is finished, bonding is carried out on the second piece of quartz glass, before the bonding is carried out, a sample inlet and a sample outlet are required to be formed on the quartz glass, and then the quartz glass is bonded on the other side of the hollowed-out film, so that the manufacturing of the microfluidic chip in a sandwich form is finished.
The etching of the glass channel is replaced by manufacturing a film layer with a hollow structure; compared with the traditional method for preparing the micro-fluidic chip by glass etching, the method is simpler and has low cost. The difficulty of processing can be reduced because etching of the glass sheet is not required. The bonding between the original glass and the glass is replaced by the bonding between the film and the quartz glass. Bonding between glass and glass or between quartz glass and quartz glass is not needed, and the success rate is high. Meanwhile, compared with a glass chip etching process, the method is difficult to manufacture a channel with a high depth-to-width ratio, and the quartz glass-hollowed-out film-quartz glass sandwich microfluidic chip has a flexible channel depth-to-width ratio, and can be realized only by manufacturing hollowed-out films with different thicknesses.
Example two
A manufacturing method of a single-cell Raman detection sorting chip comprises the following steps:
different single-cell Raman detection separation chips are different in the production of hollowed-out films, and channels with different structures are produced through drawing software to meet the requirements of different single-cell Raman detection separation culture functions and the like. Then, different structures shown in fig. 4 are manufactured through the manufacturing flow, and the different structures can meet the requirements of various single-cell raman detection, sorting, culture and other functions.
The above embodiments are not intended to limit the scope of the present application, so: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (7)
1. A glass-hollowed-out film-glass sandwich micro-fluidic chip is characterized in that: the method comprises the following steps:
preparing a mould: manufacturing a template, pouring a PDMS polymer on the template, demolding the PMDS polymer into a PMDS layer after curing, and then packaging to finish the preparation of the die;
preparing a hollowed-out film: pumping uncured PDMS high polymer into a mold, and heating and solidifying to prepare a hollowed-out film; transferring the hollowed-out film to the substrate in a bonding transfer mode;
manufacturing a sandwich microfluidic chip: after the hollowed-out film is transferred onto the substrate in a bonding mode, a piece of substrate is bonded again on the other side of the hollowed-out film, and then the sandwich chip can be manufactured.
2. The glass-hollowed-out film-glass sandwich microfluidic chip according to claim 1, wherein: in the preparation step of the die, a silicon wafer is selected to manufacture a template,
after the PDMS high polymer is cured, a sample inlet and a sample outlet are required to be drilled on one side of the PMDS layer, which is away from the channel structure, for the filling and the outflow of materials required for manufacturing the film;
and when the PMDS layer is packaged, bonding and packaging are carried out on one side with the channel structure by adopting glass or ITO glass.
3. The glass-hollowed-out film-glass sandwich microfluidic chip according to claim 2, wherein: in the step of manufacturing the mold, the mixing ratio of the PDMS monomer and the curing agent in the PDMS high polymer used for manufacturing the mold is 13:1, the mixing ratio of PDMS monomer and curing agent in PDMS polymer used in the preparation of PDMS film is 8:1.
4. the glass-hollowed-out film-glass sandwich microfluidic chip according to claim 1, wherein: the preparation method of the hollowed-out film comprises the following steps:
heating and solidifying uncured PDMS high polymer in a mould to obtain a hollowed-out film;
then peeling the PDMS layer and the film together from the glass sheet; in the peeling process, the PDMS film is adhered to the PDMS layer, and the PDMS layer can fix the film, so that the film is not easy to deform.
5. The glass-hollowed-out film-glass sandwich microfluidic chip according to claim 1, wherein: in the step of preparing the hollowed-out film, the method further comprises the step of transferring the film:
in order to obtain the film, the film is peeled off from the PDMS layer, and the film is transferred onto the substrate in a bonding transfer mode, wherein the PDMS layer and the film are integrally put into oxygen plasma to be bonded with the substrate, and the side, embedded with the film, of the PDMS layer faces the substrate, so that the PDMS layer and the film are bonded on the substrate at the same time; and independently stripping the PDMS layer, wherein the bonding force of the PDMS film on the quartz plate is larger than the van der Waals force, the hydrogen bond and other adhesive force between the PDMS film and the PDMS layer, so that the film can be separated from the PDMS layer, and the bonding is transferred to the substrate. The film transferring mode can reduce the probability of deformation and damage of the film in the transferring process.
6. The glass-hollowed-out film-glass sandwich microfluidic chip according to claim 1, wherein: the substrate is made of glass, quartz glass or ITO glass, preferably quartz glass. The shape of the substrate can be rectangle, circle, triangle, etc., the thickness is adjusted according to the requirement of the chip, preferably the shape of the substrate for transferring the film is rectangle, and the thickness is 1 millimeter. The substrate is perforated in advance and is used for a sample inlet and a sample outlet of the sandwich chip; the number and the size of the punching holes can be flexibly adjusted.
7. The glass-hollowed-out film-glass sandwich microfluidic chip according to claim 1, wherein: the manufacturing of the microfluidic chip comprises the following steps:
selecting a substrate: quartz glass with proper size and thickness is selected as a substrate of the sandwich microfluidic chip for receiving and transferring the hollow film;
and (3) transferring and bonding the hollowed-out film: bonding the hollowed-out film on the substrate;
and (3) secondary bonding: and bonding another substrate on one side of the hollowed-out film far away from the substrate, thereby forming the microfluidic chip with the substrate-hollowed-out film-substrate sandwich structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310200800.7A CN117205976A (en) | 2023-03-04 | 2023-03-04 | Glass-hollowed-out film-glass sandwich micro-fluidic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310200800.7A CN117205976A (en) | 2023-03-04 | 2023-03-04 | Glass-hollowed-out film-glass sandwich micro-fluidic chip |
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| Publication Number | Publication Date |
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| CN117205976A true CN117205976A (en) | 2023-12-12 |
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|---|---|---|---|
| CN202310200800.7A Pending CN117205976A (en) | 2023-03-04 | 2023-03-04 | Glass-hollowed-out film-glass sandwich micro-fluidic chip |
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| Country | Link |
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- 2023-03-04 CN CN202310200800.7A patent/CN117205976A/en active Pending
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