CN117187753A - Evaporation boat for evaporating metallized polypropylene copper film and preparation method thereof - Google Patents
Evaporation boat for evaporating metallized polypropylene copper film and preparation method thereof Download PDFInfo
- Publication number
- CN117187753A CN117187753A CN202310614039.1A CN202310614039A CN117187753A CN 117187753 A CN117187753 A CN 117187753A CN 202310614039 A CN202310614039 A CN 202310614039A CN 117187753 A CN117187753 A CN 117187753A
- Authority
- CN
- China
- Prior art keywords
- evaporation boat
- evaporating
- copper film
- evaporation
- metallized polypropylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001704 evaporation Methods 0.000 title claims abstract description 134
- 230000008020 evaporation Effects 0.000 title claims abstract description 107
- -1 polypropylene copper Polymers 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000004544 sputter deposition Methods 0.000 claims abstract description 34
- 229910033181 TiB2 Inorganic materials 0.000 claims abstract description 29
- 239000007788 liquid Substances 0.000 claims abstract description 29
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims description 25
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- 238000005520 cutting process Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 17
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 239000013077 target material Substances 0.000 claims description 12
- 229910052582 BN Inorganic materials 0.000 claims description 11
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 11
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 11
- 229910010293 ceramic material Inorganic materials 0.000 claims description 10
- 238000009694 cold isostatic pressing Methods 0.000 claims description 10
- 238000002485 combustion reaction Methods 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 10
- 239000000498 cooling water Substances 0.000 claims description 10
- 238000011049 filling Methods 0.000 claims description 10
- 238000011068 loading method Methods 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 3
- 239000007888 film coating Substances 0.000 claims description 2
- 238000009501 film coating Methods 0.000 claims description 2
- 238000009834 vaporization Methods 0.000 claims 1
- 230000008016 vaporization Effects 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052802 copper Inorganic materials 0.000 abstract description 9
- 239000010949 copper Substances 0.000 abstract description 9
- 238000005260 corrosion Methods 0.000 abstract description 8
- 230000007797 corrosion Effects 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 28
- 239000004743 Polypropylene Substances 0.000 description 7
- 229920001155 polypropylene Polymers 0.000 description 7
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006255 coating slurry Substances 0.000 description 1
- 238000005049 combustion synthesis Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The application discloses an evaporation boat for evaporating a metallized polypropylene copper film and a preparation method thereof, and in one aspect, the application provides an evaporation boat for evaporating a metallized polypropylene copper film, which comprises an evaporation boat substrate 1, wherein a shallow liquid groove 3 is formed in the evaporation boat substrate 1, and a sputtering layer 2 is covered at one end of the evaporation boat substrate 1, which is provided with the shallow liquid groove 3; on the other hand, the application provides a preparation method of the evaporation boat for evaporating the metallized polypropylene copper film. In the application, titanium diboride is hit by a sputtering coating method to form a sputtering layer 2 with a protective effect on the surface of a evaporation boat substrate 1, and the evaporation boat substrate 1 can reach 2400 ℃ or above by utilizing the characteristic of high melting point of the titanium diboride, so that the evaporation conditions are achieved, and meanwhile, the titanium diboride has oxidation resistance, is not easy to lose electrons and can resist corrosion of molten metal, so that the titanium diboride is not easy to be corroded by copper solution during evaporation, thereby realizing continuous evaporation.
Description
Technical Field
The application relates to the technical field of evaporation boats for coating films, in particular to an evaporation boat for evaporating a metallized polypropylene copper film and a preparation method thereof.
Background
The deposition of a layer of metal, known as PVD physical vapor deposition, on a polypropylene film has been a common process, the most common deposited metal being aluminum, and the aluminized polypropylene film obtained in an open environment can be used for packaging purposes at a vacuum level of 10 -4 The aluminized polypropylene film obtained in the mbar vacuum chamber can be used for manufacturing metallized film capacitors.
In order to deposit metal on the polypropylene film, the metal needs to be melted and then converted into gas phase, and then the gas phase is attached to the polypropylene film, and the function is completed by the conductive ceramic evaporation boat.
Conductive ceramic evaporation boats and methods of making the same have been disclosed in the prior art:
the method for preparing the novel conductive ceramic evaporation boat by combustion synthesis disclosed in application publication No. CN101723678A is that the conventional conductive ceramic evaporation boat is obtained by mixing various ceramic powders according to a proportion and hot-pressing and sintering the mixture at high temperature and high pressure for a long time, and common evaporation boat materials comprise boron nitride-titanium diboride and aluminum nitride-boron nitride-titanium diboride.
The preparation method comprises the steps of coating slurry mixed by various materials on a boat body of the evaporation boat, and then performing reaction sintering under the protection of atmosphere.
However, with the rapid development of new energy lithium batteries, a novel copper-plated polypropylene film for a lithium battery current collector appears, and a PVD physical vapor deposition method is used for obtaining a metallized polypropylene copper film.
Disclosure of Invention
In order to solve the technical problems, the application provides an evaporation boat capable of bearing the temperature required by evaporating a metallized polypropylene copper film and a preparation method thereof.
On one hand, the application provides an evaporation boat for evaporating a metallized polypropylene copper film, which comprises an evaporation boat substrate 1, wherein a shallow liquid groove 3 is formed in the evaporation boat substrate 1, and a sputtering layer 2 is covered at one end of the evaporation boat substrate 1, which is provided with the shallow liquid groove 3.
Through above-mentioned technical scheme, through setting up the sputtering layer, can protect evaporation boat base member, promote evaporation efficiency.
As a further technical scheme of the application, the sputtering layer 2 is titanium diboride.
Through the technical scheme, the high-melting-point characteristic of titanium diboride is utilized to enable the evaporation boat to reach the condition of evaporating copper, and meanwhile, the corrosion resistance of the titanium diboride is utilized to avoid reaction with copper solution, so that the service life of the evaporation boat is ensured.
As a further technical scheme of the application, the thickness of the sputtering layer 2 is 0.1-1mm.
Through the technical scheme, the corrosion speed of the sputtering layer is delayed on the premise of not considering unlimited increase of the thickness of the sputtering layer, so that the service life is prolonged.
On the other hand, the application provides a preparation method of an evaporation boat for evaporating a metallized polypropylene copper film, which comprises the following steps:
s1, loading boron nitride, titanium diboride and aluminum nitride into a container, performing cold isostatic pressing under the pressure of 8-30 MPa to obtain a prefabricated blank, then placing the prefabricated blank into a closed pressure container filled with circulating cooling water, filling high-pressure nitrogen to enable the pressure applied to the prefabricated blank in the closed container to be 30-100 MPa, then igniting to enable the prefabricated blank to perform self-propagating combustion reaction, cooling the prefabricated blank along with a furnace after the reaction is finished to obtain a conductive ceramic composite material, and cutting and processing the obtained conductive ceramic material to obtain a conductive ceramic evaporation boat substrate 1;
s2, cutting a shallow liquid groove 3 on the end face of the evaporation boat substrate 1;
s3, the vacuum degree is 1.333 x 10 -2 ～1.333*10 -5 Under Pa, a target material is plated on one side of the evaporation boat substrate 1 with the shallow liquid groove 3 by using a sputtering coating method, so as to form a sputtering layer 2.
Through the technical scheme, the sputtering layer formed by magnetron sputtering can protect the evaporation boat substrate, so that the evaporation boat substrate cannot be corroded by copper solution at a high temperature of 1800-2400 ℃, and the vapor deposition work of the metallized polypropylene copper film can be stably completed for a long time.
As a further technical scheme of the application, the target in the step S3 is titanium diboride.
As a further technical scheme of the application, the thickness of the sputtering layer 2 in the step 3 is 0.1-1mm.
In a third aspect, an evaporation boat for evaporating a metallized polypropylene copper film is used in the field of film coating.
In summary, the application has the following beneficial technical effects:
1. through being provided with the sputtering layer, can protect the evaporation boat base member, make it be applicable to 1800-2400 ℃'s processing environment, realize continuous stable evaporation plating, promote evaporation plating efficiency, prolong the life of evaporation boat base member, reduce the change frequency of evaporation boat base member.
2. The sputtering layer formed by magnetron sputtering can protect the evaporation boat substrate, so that the evaporation boat substrate cannot be corroded by copper solution at a high temperature of 1800-2400 ℃, and the vapor deposition work of the metallized polypropylene copper film can be stably completed for a long time.
Drawings
FIG. 1 is a schematic cross-sectional elevation view of the present application;
FIG. 2 is a schematic diagram of a left side cross-sectional structure of the present application;
fig. 3 is a schematic top view of the present application.
Reference numerals illustrate: 1. an evaporation boat substrate; 2. sputtering a layer; 3. a shallow liquid tank.
Detailed Description
The application is described in further detail below with reference to the drawings and examples.
The application designs an evaporation boat for evaporating a metallized polypropylene copper film, which comprises an evaporation boat substrate 1, wherein a shallow liquid groove 3 is formed in the evaporation boat substrate 1, and a sputtering layer 2 is covered at one end of the evaporation boat substrate 1, which is provided with the shallow liquid groove 3.
The sputtered layer 2 is titanium diboride.
The thickness of the sputtered layer 2 is 0.1-1mm.
The application relates to a preparation method of an evaporation boat for evaporating a metallized polypropylene copper film, which comprises the following steps:
s1, loading 4kg of boron nitride, 4kg of titanium diboride and 2kg of aluminum nitride into a container, performing cold isostatic pressing under the pressure of 8-30 MPa to obtain a prefabricated blank, then placing the prefabricated blank into a closed pressure container filled with circulating cooling water, filling high-pressure nitrogen to enable the pressure applied to the prefabricated blank in the closed container to be 30-100 MPa, then igniting to enable the prefabricated blank to perform self-propagating combustion reaction, cooling the prefabricated blank along with a furnace after the reaction is finished to obtain a conductive ceramic composite material, and cutting and processing the obtained conductive ceramic material to obtain a conductive ceramic evaporation boat substrate 1;
s2, cutting a shallow liquid groove 3 on the end face of the evaporation boat substrate 1;
s3, the vacuum degree is 1.333 x 10 -2 ～1.333*10 -5 Under Pa, a target material is plated on one side of the evaporation boat substrate 1 with the shallow liquid groove 3 by using a sputtering coating method, so as to form a sputtering layer 2.
The target material in the step S3 is titanium diboride.
The thickness of the sputtering layer 2 in the step 3 is 0.1-1mm.
When the copper plating film is actually plated, copper metal is vapor deposited on the polypropylene film in a vacuum environment, the temperature of the evaporation boat needs to reach 1800-2400 ℃, but the existing evaporation boat is designed for evaporating aluminum metal and cannot bear the high temperature, and the evaporation boat substrate 1 can be corroded by copper solution to be damaged rapidly after use, so that continuous stable evaporation can not be realized.
Based on the above, the titanium diboride is beaten by the vacuum magnetron sputtering machine to form the sputtering layer 2 with the protective effect on the surface of the evaporation boat substrate 1, and the evaporation boat substrate 1 can reach more than 2400 ℃ by utilizing the characteristic of high melting point of the titanium diboride, so that the evaporation conditions are achieved, and meanwhile, the titanium diboride has oxidation resistance, is not easy to lose electrons and can resist corrosion of molten metal, so that the titanium diboride is not easy to be corroded by copper solution during evaporation, thereby realizing continuous evaporation.
The important components referred to in the application are all purchased from commercial products unless specifically stated otherwise, wherein:
aluminum nitride, available from Zhejiang Mannich nanotechnology Co., ltd;
boron nitride, available from mountain eastern glaring new materials limited;
titanium diboride, available from Nanguo's alloy welding materials Inc.
Example 1
The evaporation boat for evaporating the metallized polypropylene copper film comprises the following steps:
s1, loading 4kg of boron nitride, 4kg of titanium diboride and 2kg of aluminum nitride into a container, performing cold isostatic pressing under the pressure of 8MPa to obtain a prefabricated blank, then placing the prefabricated blank into a closed pressure container filled with circulating cooling water, filling high-pressure nitrogen to enable the pressure applied to the prefabricated blank in the closed container to be 30MPa, then igniting to enable the prefabricated blank to perform self-propagating combustion reaction, cooling the prefabricated blank along with a furnace after the reaction is finished to obtain a conductive ceramic composite material, and cutting and processing the obtained conductive ceramic material to obtain a conductive ceramic evaporation boat substrate 1;
s2, cutting a shallow liquid groove 3 on the end face of the evaporation boat substrate 1;
s3, the vacuum degree is 1.333 x 10 -2 Under Pa, a target material was plated on the evaporation boat substrate 1 on the side having the shallow liquid bath 3 by a sputter coating method to form a sputtered layer 2 having a thickness of 0.08 mm.
Example 2
The evaporation boat for evaporating the metallized polypropylene copper film comprises the following steps:
s1, loading 4kg of boron nitride, 4kg of titanium diboride and 2kg of aluminum nitride into a container, performing cold isostatic pressing under the pressure of 30MPa to obtain a prefabricated blank, then placing the prefabricated blank into a closed pressure container filled with circulating cooling water, filling high-pressure nitrogen to enable the pressure applied to the prefabricated blank in the closed container to be 100MPa, then igniting to enable the prefabricated blank to perform self-propagating combustion reaction, cooling the prefabricated blank along with a furnace after the reaction is finished to obtain a conductive ceramic composite material, and cutting and processing the obtained conductive ceramic material to obtain a conductive ceramic evaporation boat substrate 1;
s2, cutting a shallow liquid groove 3 on the end face of the evaporation boat substrate 1;
s3, the vacuum degree is 1.333 x 10 -5 Under Pa, a target material was plated on the evaporation boat substrate 1 on the side having the shallow liquid bath 3 by a sputter coating method to form a sputtered layer 2 having a thickness of 0.1 mm.
Example 3
The evaporation boat for evaporating the metallized polypropylene copper film comprises the following steps:
s1, loading 4kg of boron nitride, 4kg of titanium diboride and 2kg of aluminum nitride into a container, performing cold isostatic pressing under the pressure of 15MPa to obtain a prefabricated blank, then placing the prefabricated blank into a closed pressure container filled with circulating cooling water, filling high-pressure nitrogen to enable the pressure applied to the prefabricated blank in the closed container to be 50MPa, then igniting to enable the prefabricated blank to perform self-propagating combustion reaction, cooling the prefabricated blank along with a furnace after the reaction is finished to obtain a conductive ceramic composite material, and cutting and processing the obtained conductive ceramic material to obtain a conductive ceramic evaporation boat substrate 1;
s2, cutting a shallow liquid groove 3 on the end face of the evaporation boat substrate 1;
s3, the vacuum degree is 1.333 x 10 -3 Under Pa, a target material was plated on the evaporation boat substrate 1 on the side having the shallow liquid bath 3 by a sputter coating method to form a sputtered layer 2 having a thickness of 0.3 mm.
Example 4
The evaporation boat for evaporating the metallized polypropylene copper film comprises the following steps:
s1, loading 4kg of boron nitride, 4kg of titanium diboride and 2kg of aluminum nitride into a container, performing cold isostatic pressing under the pressure of 15MPa to obtain a prefabricated blank, then placing the prefabricated blank into a closed pressure container filled with circulating cooling water, filling high-pressure nitrogen to enable the pressure applied to the prefabricated blank in the closed container to be 50MPa, then igniting to enable the prefabricated blank to perform self-propagating combustion reaction, cooling the prefabricated blank along with a furnace after the reaction is finished to obtain a conductive ceramic composite material, and cutting and processing the obtained conductive ceramic material to obtain a conductive ceramic evaporation boat substrate 1;
s2, cutting a shallow liquid groove 3 on the end face of the evaporation boat substrate 1;
s3, the vacuum degree is 1.333 x 10 -2 Under Pa, a target material was plated on the evaporation boat substrate 1 on the side having the shallow liquid bath 3 by a sputter coating method to form a sputtered layer 2 having a thickness of 0.5 mm.
Example 5
The evaporation boat for evaporating the metallized polypropylene copper film comprises the following steps:
s1, loading 4kg of boron nitride, 4kg of titanium diboride and 2kg of aluminum nitride into a container, performing cold isostatic pressing under the pressure of 15MPa to obtain a prefabricated blank, then placing the prefabricated blank into a closed pressure container filled with circulating cooling water, filling high-pressure nitrogen to enable the pressure applied to the prefabricated blank in the closed container to be 50MPa, then igniting to enable the prefabricated blank to perform self-propagating combustion reaction, cooling the prefabricated blank along with a furnace after the reaction is finished to obtain a conductive ceramic composite material, and cutting and processing the obtained conductive ceramic material to obtain a conductive ceramic evaporation boat substrate 1;
s2, cutting a shallow liquid groove 3 on the end face of the evaporation boat substrate 1;
s3, the vacuum degree is 1.333 x 10 -2 Under Pa, a target material was plated on the evaporation boat substrate 1 on the side having the shallow liquid bath 3 by a sputter coating method to form a sputtered layer 2 having a thickness of 0.7 mm.
Example 6
The evaporation boat for evaporating the metallized polypropylene copper film comprises the following steps:
s1, loading 4kg of boron nitride, 4kg of titanium diboride and 2kg of aluminum nitride into a container, performing cold isostatic pressing under the pressure of 15MPa to obtain a prefabricated blank, then placing the prefabricated blank into a closed pressure container filled with circulating cooling water, filling high-pressure nitrogen to enable the pressure applied to the prefabricated blank in the closed container to be 50MPa, then igniting to enable the prefabricated blank to perform self-propagating combustion reaction, cooling the prefabricated blank along with a furnace after the reaction is finished to obtain a conductive ceramic composite material, and cutting and processing the obtained conductive ceramic material to obtain a conductive ceramic evaporation boat substrate 1;
s2, cutting a shallow liquid groove 3 on the end face of the evaporation boat substrate 1;
s3, the vacuum degree is 1.333 x 10 -2 Under Pa, a target material was plated on the evaporation boat substrate 1 on the side having the shallow liquid bath 3 by a sputter coating method to form a sputtered layer 2 having a thickness of 1mm.
Example 7
The evaporation boat for evaporating the metallized polypropylene copper film comprises the following steps:
s1, loading 4kg of boron nitride, 4kg of titanium diboride and 2kg of aluminum nitride into a container, performing cold isostatic pressing under the pressure of 15MPa to obtain a prefabricated blank, then placing the prefabricated blank into a closed pressure container filled with circulating cooling water, filling high-pressure nitrogen to enable the pressure applied to the prefabricated blank in the closed container to be 50MPa, then igniting to enable the prefabricated blank to perform self-propagating combustion reaction, cooling the prefabricated blank along with a furnace after the reaction is finished to obtain a conductive ceramic composite material, and cutting and processing the obtained conductive ceramic material to obtain a conductive ceramic evaporation boat substrate 1;
s2, cutting a shallow liquid groove 3 on the end face of the evaporation boat substrate 1;
s3, the vacuum degree is 1.333 x 10 -5 Under Pa, a target material was plated on the evaporation boat substrate 1 at the side having the shallow liquid bath 3 by a sputter coating method to form a sputtered layer 2 having a thickness of 1.2 mm.
Performance detection
And (3) obtaining a metallized polypropylene copper film by using a physical vapor deposition method through utilizing an evaporation boat substrate, carrying out continuous evaporation, and recording the average corrosion rate of the sputtered layer within 10 hours.
The evaporation boats prepared in examples 1-7 were tested for performance according to the method described above, and the test results are shown in Table 1:
TABLE 1
As can be seen from the above examples 1 to 7 and Table 1, the increase of the corrosion resistance after the thickness of the sputtered layer is increased from 0.08mm to 0.1mm is more remarkable, while the corrosion resistance is gradually increased as the thickness of the sputtered layer 2 is continuously increased, but when the thickness of the sputtered layer 2 is increased to above 1mm, the corrosion rate tends to decrease, so that the preferred thickness of the sputtered layer 2 is 0.1 to 1mm without considering the longer the service life of the sputtered layer 2 is.
The above embodiments are not intended to limit the scope of the present application, so: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (7)
1. The utility model provides an evaporation boat for coating by vaporization metallized polypropylene copper film, includes evaporation boat base member (1), its characterized in that: the evaporation boat is characterized in that the evaporation boat substrate (1) is provided with a shallow liquid groove (3), and one end of the evaporation boat substrate (1) provided with the shallow liquid groove (3) is covered with a sputtering layer (2).
2. The evaporation boat for evaporating metallized polypropylene copper film according to claim 1, wherein: the sputtering layer (2) is titanium diboride.
3. The evaporation boat for evaporating metallized polypropylene copper film according to claim 1, wherein: the thickness of the sputtering layer (2) is 0.1-1mm.
4. The method for preparing the evaporation boat for evaporating the metallized polypropylene copper film according to claim 1, which is characterized in that: the method comprises the following steps:
s1, loading boron nitride, titanium diboride and aluminum nitride into a container, performing cold isostatic pressing under the pressure of 8-30 MPa to obtain a prefabricated blank, then placing the prefabricated blank into a closed pressure container filled with circulating cooling water, filling high-pressure nitrogen to enable the pressure applied to the prefabricated blank in the closed container to be 30-100 MPa, then igniting to enable the prefabricated blank to perform self-propagating combustion reaction, cooling the prefabricated blank along with a furnace after the reaction is finished to obtain a conductive ceramic composite material, and cutting and processing the obtained conductive ceramic material to obtain a conductive ceramic evaporation boat substrate (1);
s2, cutting a shallow liquid groove (3) on the end face of the evaporation boat substrate (1);
s3, the vacuum degree is 1.333 x 10 -2 ～1.333*10 -5 Under the condition of Pa, a sputtering coating method is used for coating a target material on one side of the evaporation boat substrate (1) with the shallow liquid groove (3) to form a sputtering layer (2).
5. The evaporation boat for evaporating metallized polypropylene copper film of claim 4, wherein: the target material in the step S3 is titanium diboride.
6. The method for preparing the evaporation boat for evaporating the metallized polypropylene copper film according to claim 4, wherein the method comprises the following steps: the thickness of the sputtering layer (2) in the step 3 is 0.1-1mm.
7. Use of an evaporation boat for evaporating a metallized polypropylene copper film according to claim 1 in the field of film coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310614039.1A CN117187753A (en) | 2023-10-18 | 2023-10-18 | Evaporation boat for evaporating metallized polypropylene copper film and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310614039.1A CN117187753A (en) | 2023-10-18 | 2023-10-18 | Evaporation boat for evaporating metallized polypropylene copper film and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117187753A true CN117187753A (en) | 2023-12-08 |
Family
ID=88996673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310614039.1A Pending CN117187753A (en) | 2023-10-18 | 2023-10-18 | Evaporation boat for evaporating metallized polypropylene copper film and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117187753A (en) |
-
2023
- 2023-10-18 CN CN202310614039.1A patent/CN117187753A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2021134972A1 (en) | Chromium-silicon alloy sputtering target material and preparation method therefor | |
| CN111872390B (en) | Method for preparing diamond metal matrix composite material by selective laser melting process | |
| CN108411272A (en) | A kind of preparation method of bearing AlCrCuFeNi systems high-entropy alloy coating | |
| CN108359927B (en) | NiCr/Al2O3Preparation method of composite coating | |
| CN109182951B (en) | Method for preparing chromium-aluminum-carbon composite coating by plasma spraying | |
| CN109402564B (en) | AlCrSiN and AlCrSiON double-layer nano composite coating and preparation method thereof | |
| CN109972100A (en) | A kind of preparation method of tubulose chromium target | |
| CN105648407B (en) | A kind of high-compactness molybdenum niobium alloy target and its preparation process | |
| CN102352483A (en) | Preparation method of silicon-aluminium alloy hollow rotary target for vacuum sputtering coating | |
| CN102869807B (en) | Titanium diboride target | |
| CN102560338B (en) | Metal ceramic coating and preparation method thereof | |
| CN106811724A (en) | A kind of corrosion-resistant high-entropy alloy coating of Mg alloy surface and preparation method thereof | |
| CN111455333B (en) | Al-Cr-O film with Al-rich corundum structure and preparation method thereof | |
| WO2023115929A1 (en) | High-entropy metal oxide coating, preparation method therefor and use thereof | |
| WO2023197469A1 (en) | High-conductivity corrosion-resistant amorphous/nanocrystalline composite coexisting coating, and preparation method therefor and use thereof | |
| CN110670029A (en) | High-hardness wear-resistant TiN/TiAlSiN composite coating on surface of aluminum alloy and preparation method thereof | |
| CN117187753A (en) | Evaporation boat for evaporating metallized polypropylene copper film and preparation method thereof | |
| CN113088883A (en) | High-temperature alloy composite metal ceramic coating and preparation method thereof | |
| CN108411262A (en) | A kind of low-temp reaction sputtering sedimentation nanometer α-Al2O3The method of coating | |
| CN116121700A (en) | Refractory element doped wear-resistant gradient HfMSiCN ceramic layer and preparation method thereof | |
| CN115537808B (en) | Method for depositing high-entropy alloy coating on surface of ceramic matrix composite | |
| Zhong et al. | Deposition and characterization of NiAl and Ni–Al–N thin films from a NiAl compound target | |
| CN114672755B (en) | Non-wetting coating suitable for resisting high-temperature aluminum permeation and preparation method thereof | |
| US20060115243A1 (en) | Resistance-heated boat and manufacturing method thereof | |
| CN100575535C (en) | The metallic surface forms TiB 2The method of ceramic composite |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |