CN117177166B - Digital loudspeaker and manufacturing method thereof - Google Patents

Digital loudspeaker and manufacturing method thereof Download PDF

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CN117177166B
CN117177166B CN202311428132.XA CN202311428132A CN117177166B CN 117177166 B CN117177166 B CN 117177166B CN 202311428132 A CN202311428132 A CN 202311428132A CN 117177166 B CN117177166 B CN 117177166B
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electrode plate
dielectric layer
short
forming
air rear
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CN117177166A (en
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刘长华
袁飞洋
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Earth Mountain Suzhou Microelectronics Technology Co ltd
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Earth Mountain Suzhou Microelectronics Technology Co ltd
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Abstract

The invention discloses a digital loudspeaker and a manufacturing method thereof, relates to the technical field of microelectronic manufacturing, and aims to solve the problems that when an MEMS loudspeaker is processed, a driving plate or a vibrating diaphragm is required to be processed one by one, the time is relatively consumed, and the processing and manufacturing efficiency is low. The manufacturing method of the digital loudspeaker comprises the steps of fixedly arranging a first electrode plate on one side of a substrate with an air rear cavity; forming one or more driving plates on the first electrode plate; depositing a first dielectric layer on the first electrode plate; a second electrode plate is fixedly arranged on one side of the first dielectric layer, which is far away from the first electrode plate; forming a plurality of diaphragms on the second electrode plate; filling a second dielectric layer in the adjacent vibrating diaphragms of the second electrode plate; a plurality of vibration gaps are formed on the first dielectric layer. The digital loudspeaker is formed by the manufacturing method of the digital loudspeaker. The digital loudspeaker and the manufacturing method thereof are used for improving the processing and manufacturing efficiency of the digital loudspeaker.

Description

Digital loudspeaker and manufacturing method thereof
Technical Field
The invention relates to the technical field of microelectronic manufacturing, in particular to a digital loudspeaker and a manufacturing method thereof.
Background
A speaker is a transducer device capable of converting an electrical signal into an acoustic signal. The speaker is the basis for making sound, acoustically active noise reduction devices, etc., and therefore, the performance of the speaker has a critical impact on the fabrication of acoustic devices. The MEMS speaker (Micro Electro Mechanical System), i.e., the MEMS speaker, has advantages of good consistency, low power consumption, small size, low price, etc., over conventional voice coil speakers.
At present, the existing MEMS speaker includes a plurality of pixel sound generating units, and the pixel sound generating unit promotes the air through the motion of its vibrating diaphragm relative electrode board and realizes the simulation sound production, but in order to improve the required pixel of MEMS speaker drive accuracy of pixel, the required pixel sound generating unit's of MEMS speaker quantity is more, and during processing, need form drive plate or vibrating diaphragm at processing one by one, comparatively consuming time, processing manufacturing efficiency is low.
Disclosure of Invention
The invention aims to provide a digital loudspeaker and a manufacturing method thereof, which are used for improving the processing and manufacturing efficiency of the digital loudspeaker.
In order to achieve the above object, the present invention provides a method for manufacturing a digital speaker, comprising the steps of:
forming a plurality of air rear cavities on a substrate;
a first electrode plate is fixedly arranged on one side of the substrate with the air rear cavity;
forming one or more driving plates on the first electrode plate;
at least one perforation is arranged on each driving plate, and each air rear cavity is at least communicated with one perforation;
depositing a first dielectric layer on the first electrode plate;
a second electrode plate is fixedly arranged on one side of the first dielectric layer, which is far away from the first electrode plate;
forming a plurality of diaphragms on the second electrode plate;
filling a second dielectric layer in the adjacent vibrating diaphragms of the second electrode plate;
a plurality of vibration gaps are formed on the first dielectric layer, and each vibration gap is located between the corresponding vibrating diaphragm and the driving plate.
According to the manufacturing method of the digital loudspeaker, one or more driving plates can be formed on the first electrode plate, a plurality of vibrating diaphragms are formed on the second electrode plate, the driving plates and the vibrating diaphragms are respectively corresponding to at least one air rear cavity, on one hand, a first medium layer is arranged between the driving plates and the vibrating diaphragms, a plurality of vibration gaps are formed on the first medium layer, adjacent vibration gaps are not communicated with each other, the vibration gaps are in one-to-one correspondence with the air rear cavities, one pixel sounding unit is formed by the driving plates, the vibrating diaphragms, the vibration gaps and the air rear cavities which are corresponding to the vibration gaps, and after the driving plates and the vibrating diaphragms are respectively electrified, the vibrating diaphragms at one side of the vibration gaps vibrate under the action of an electric field, and compressed air sounds; on the other hand, the first medium layer is arranged between the adjacent driving plates, so that the adjacent driving plates are insulated, the second medium layer is arranged between the adjacent vibrating diaphragms, so that the adjacent vibrating diaphragms are insulated, different currents are respectively fed into different vibrating diaphragms and different driving plates, the vibration frequency and the vibration amplitude of the vibrating diaphragms at different positions of the loudspeaker can be adjusted, the sound production of the pixel sound production units at different positions of the loudspeaker can be flexibly adjusted and controlled, and the sound production precision of the loudspeaker is improved; in addition, in the manufacturing process, a plurality of driving plates are formed on the corresponding first electrode plate, a plurality of vibrating diaphragms are formed on the second electrode plate, and a plurality of pixel sounding units can be formed at one time, so that the manufacturing efficiency of the loudspeaker is improved.
Optionally, in the method for manufacturing a digital speaker, forming one or more driving boards on the first electrode board includes:
etching on the first electrode plate to form a plurality of first short-circuit grooves extending along a first direction, wherein the first short-circuit grooves are distributed along a second direction, and a driving plate corresponding to a plurality of air rear cavities is formed between the adjacent first short-circuit grooves;
alternatively, forming one or more driving plates on the first electrode plate includes:
etching a plurality of first short-circuit grooves extending along a first direction on the first electrode plate, wherein the plurality of first short-circuit grooves are distributed along a second direction;
etching the first electrode plate to form a second short-circuit groove extending along a second direction; the first short-circuit groove and the second short-circuit groove divide the first electrode plate into a plurality of driving plates, and each driving plate corresponds to one or a plurality of air rear cavities respectively.
Optionally, in the method for manufacturing a digital speaker, forming the plurality of diaphragms on the second electrode plate includes:
etching a plurality of third short-circuit grooves extending along a second direction on the second electrode plate, wherein the plurality of third short-circuit grooves are distributed along the first direction, and a vibrating diaphragm corresponding to a plurality of air rear cavities is formed between every two adjacent third short-circuit grooves;
alternatively, forming the plurality of diaphragms on the second electrode plate includes:
etching a plurality of third short-circuit grooves extending along the second direction on the second electrode plate, wherein the plurality of third short-circuit grooves are distributed along the first direction;
etching the second electrode plate to form a fourth short-circuit groove extending along the first direction; the first direction is different from the second direction, the third short-circuit groove and the fourth short-circuit groove divide the second electrode plate into a plurality of vibrating diaphragms, and each vibrating diaphragm corresponds to one or a plurality of air rear cavities respectively.
Optionally, in the method for manufacturing a digital speaker, after depositing the first dielectric layer on the first electrode plate and before fixedly disposing the second electrode plate on a side of the first dielectric layer away from the first electrode plate, the method for manufacturing a digital speaker further includes:
a plurality of annular bulges are formed on one side of the second electrode plate, which is close to the first dielectric layer, and each annular bulge corresponds to one air rear cavity;
fixedly arranging a second electrode plate on one side of the first dielectric layer far away from the first electrode plate comprises:
the annular protrusions are embedded into one side, far away from the first electrode plate, of the first dielectric layer, and the annular protrusions divide the first dielectric layer into a net-shaped supporting dielectric structure and a plurality of dielectric structures to be etched.
Optionally, in the method for manufacturing a digital speaker, depositing the first dielectric layer on the first electrode plate includes:
depositing a reticular supporting medium structure on the first electrode plate, wherein the projection of the reticular supporting medium structure on the first electrode plate covers the edge area of each driving plate;
and depositing a medium structure to be etched at each hollow position of the net-shaped supporting medium structure, wherein the net-shaped supporting medium structure and the medium structure to be etched form a first medium layer, and the materials of the net-shaped supporting medium structure and the medium structure to be etched are different.
Optionally, in the method for manufacturing a digital speaker, after depositing the second dielectric layer on the second electrode plate, before forming the plurality of vibration gaps on the first dielectric layer, the method further includes:
forming cantilever patterns on each vibrating diaphragm, wherein the cantilever patterns penetrate through the vibrating diaphragms;
forming a plurality of vibration gaps on the first dielectric layer, each vibration gap being located between a corresponding diaphragm and a drive plate, including:
and contacting the etching medium with the medium structure to be etched through the cantilever patterns, and etching the medium structure to be etched to form a vibration gap.
Optionally, in the method for manufacturing a digital speaker, after forming the plurality of air rear cavities on the substrate and before fixedly disposing the first electrode plate on the side of the substrate having the air rear cavities, the method for manufacturing a digital speaker further includes:
a plurality of through holes are formed in the substrate, and each air rear cavity is communicated with at least one through hole;
forming a plurality of vibration gaps on the first dielectric layer, each vibration gap being located between a corresponding diaphragm and a drive plate, including:
and enabling the etching medium to sequentially pass through the through hole, the air rear cavity and the perforation to be in contact with the medium structure to be etched, and etching the medium structure to be etched to form a vibration gap.
Optionally, in the method for manufacturing a digital speaker, after forming a plurality of vibration gaps on the first dielectric layer, the method for manufacturing a digital speaker further includes:
and forming a plurality of pins PAD on the peripheral sides of the first electrode plate and the second electrode plate, connecting each driving plate with the corresponding pin PAD, and connecting each vibrating diaphragm with the corresponding pin PAD.
The invention also provides a digital loudspeaker manufactured by the manufacturing method of the digital loudspeaker, which comprises the following steps:
a plurality of air rear cavities are arranged on one side of the substrate, and each air rear cavity is communicated with the outside atmosphere;
the driving plates are fixedly arranged on one side of the substrate with the air rear cavity, at least one perforation is arranged on each driving plate, and each perforation is communicated with the corresponding air rear cavity;
the reticular supporting medium structure is fixedly arranged on one side of the driving plate far away from the substrate, a plurality of vibration gaps are formed in the middle of the reticular supporting medium structure, and each vibration gap is communicated with the corresponding air rear cavity through a perforation;
the driving plate and the vibrating diaphragm are insulated through a reticular supporting medium structure arranged between the driving plate and the vibrating diaphragm, the driving plate and the vibrating diaphragm are respectively corresponding to at least one air rear cavity, a plurality of vibrating gaps are formed in the middle of the reticular supporting medium structure, the driving plate, the vibrating diaphragm, the vibrating gaps and the air rear cavity which are corresponding to the vibrating gaps jointly form a pixel sounding unit, after the driving plate and the vibrating diaphragm are respectively electrified, the vibrating diaphragm at one side of the vibrating gaps vibrates under the action of an electric field, and compressed air sounds; on the other hand, the first medium layer sets up between adjacent drive plate for adjacent drive plate is insulating, and the second medium layer sets up between adjacent vibrating diaphragm, makes adjacent vibrating diaphragm insulating, lets in different electric currents respectively for different vibrating diaphragms and different drive plates, can adjust vibration frequency and the amplitude of the vibrating diaphragm of different positions of speaker, and then nimble regulation and control speaker different positions's pixel sound production unit sound production, and then improves the sound production precision of speaker.
The vibrating diaphragms are arranged on one side, far away from the driving plate, of the reticular supporting medium structure.
Optionally, the digital speaker further includes a plurality of pins PAD, each diaphragm is connected to a corresponding pin PAD, and each driving board is connected to a corresponding pin PAD.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
fig. 1 is a flowchart of a method for manufacturing a digital speaker according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first electrode plate according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first electrode plate with a plurality of driving plates formed thereon according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of another embodiment of the present invention after forming a plurality of driving plates on a first electrode plate;
fig. 5 is a schematic structural diagram of a second electrode plate according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a second electrode plate with a plurality of diaphragms formed thereon according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another embodiment of the present invention after forming a plurality of diaphragms on a second electrode plate;
fig. 8 is a first schematic diagram of matching a first electrode plate and a second electrode plate according to an embodiment of the present invention;
fig. 9 is a second schematic diagram of the first electrode plate and the second electrode plate according to the embodiment of the present invention;
fig. 10 is a schematic structural diagram of a digital speaker formed by a manufacturing method of a digital speaker according to an embodiment of the present invention;
fig. 11 is a schematic diagram of a partial structure of a digital speaker formed by a manufacturing method of the digital speaker according to an embodiment of the present invention.
Reference numerals:
1-a first electrode plate; 11-a drive plate; 111-perforating; 12-a first short-circuit groove; 13-a second short-circuit slot; 2-a first dielectric layer; 21-a mesh-like support medium structure; 22-a medium structure to be etched; 3-a second electrode plate; 31-a diaphragm; 311-cantilever pattern; 32-a third short-circuit groove; 33-fourth short-circuit groove; 34-annular protrusion; 4-a substrate; 41-air rear chamber; 5-vibration gap; 6-pin PAD.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. The meaning of "a number" is one or more than one unless specifically defined otherwise.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
A speaker is a transducer device capable of converting an electrical signal into an acoustic signal. The speaker is the basis for making sound, acoustically active noise reduction devices, etc., and therefore, the performance of the speaker has a critical impact on the fabrication of acoustic devices. The MEMS speaker (Micro Electro Mechanical System), i.e., the MEMS speaker, has advantages of good consistency, low power consumption, small size, low price, etc., over conventional voice coil speakers. At present, current MEMS speaker includes a plurality of pixel sound generating units, and the pixel sound generating unit promotes the air through the motion of its vibrating diaphragm relative electrode plate and realizes the simulation sound production, but in order to improve MEMS speaker drive pixel's precision, the required pixel sound generating unit's of MEMS speaker quantity is more, and during processing, need process one by one and form drive plate or vibrating diaphragm, comparatively consuming time, processing manufacturing efficiency is low.
In order to solve the above problems, as shown in fig. 1, an embodiment of the present invention provides a method for manufacturing a digital speaker, including:
step 100: forming a plurality of air rear cavities on a substrate;
specifically, according to the requirements of the digital loudspeaker, a plurality of air rear cavities are distributed on the same side of the substrate in a matrix;
step 200: a first electrode plate is fixedly arranged on one side of the substrate with the air rear cavity;
step 300: forming one or more driving plates on the first electrode plate;
specifically, each driving plate is at least correspondingly arranged on one side of one air rear cavity, so that each driving plate is ensured to correspond to at least one air rear cavity;
step 400: at least one perforation is arranged on each driving plate, and each air rear cavity is at least communicated with one perforation;
by the arrangement, the air rear cavity can be communicated with the formed vibration gap through the perforation;
step 500: depositing a first dielectric layer on the first electrode plate;
on one hand, the first dielectric layer can isolate the driving plate from the vibrating diaphragm, and prevent the driving plate from being conducted with the vibrating diaphragm; on the other hand, the first dielectric layer can insulate adjacent driving plates, after forming, the electric field intensity generated by different driving plates can be adjusted by controlling the energizing quantity of the different driving plates, and then the vibration amplitude and the vibration frequency of different vibrating films can be adjusted;
step 600: a second electrode plate is fixedly arranged on one side of the first dielectric layer, which is far away from the first electrode plate;
step 700: forming a plurality of diaphragms on the second electrode plate;
specifically, each vibrating diaphragm at least corresponds to one air rear cavity;
step 800: filling a second dielectric layer in the adjacent vibrating diaphragms of the second electrode plate;
specifically, a medium is deposited on a second electrode plate, then the medium on the surface of the vibrating diaphragm is removed, the medium in the adjacent vibrating diaphragm is reserved, a second medium layer is formed, the second medium layer can insulate the adjacent vibrating diaphragm, after forming, the generated electric field intensity can be adjusted by controlling the electrifying quantity of different vibrating diaphragms, and then the amplitude and the vibration frequency of different vibrating diaphragms are adjusted;
step 900: a plurality of vibration gaps are formed on the first dielectric layer, and each vibration gap is located between the corresponding vibrating diaphragm and the driving plate.
According to the manufacturing method of the digital loudspeaker, one or more driving plates can be formed on the first electrode plate, a plurality of vibrating membranes are formed on the second electrode plate, the driving plates and the vibrating membranes correspond to at least one air rear cavity respectively, on one hand, a first medium layer is arranged between the driving plates and the vibrating membranes, a plurality of vibration gaps are formed on the first medium layer, adjacent vibration gaps are not communicated with each other, the vibration gaps correspond to the air rear cavities one by one, a pixel sounding unit is formed by the driving plates, the vibrating membranes, the vibration gaps and the air rear cavities corresponding to the vibration gaps, and after the driving plates and the vibrating membranes are respectively electrified, the vibrating membranes at one side of the vibration gaps vibrate under the action of an electric field, and compressed air sounds; on the other hand, the first medium layer is arranged between the adjacent driving plates, so that the adjacent driving plates are insulated, the second medium layer is arranged between the adjacent vibrating diaphragms, so that the adjacent vibrating diaphragms are insulated, different currents are respectively fed into different vibrating diaphragms and different driving plates, the vibration frequency and the vibration amplitude of the vibrating diaphragms at different positions of the loudspeaker can be adjusted, the sound production of the pixel sound production units at different positions of the loudspeaker can be flexibly adjusted and controlled, and the sound production precision of the loudspeaker is improved; in addition, in the manufacturing process, one or more driving plates are formed on the corresponding first electrode plate, and a plurality of vibrating diaphragms are formed on the second electrode plate, so that a plurality of pixel sounding units can be formed at one time, and the manufacturing efficiency of the loudspeaker is improved.
As one possible implementation, as shown in fig. 2 and 3, step 300: forming one or more drive plates on the first electrode plate includes:
step 310: a plurality of first short-circuit grooves 12 extending along a first direction are etched on the first electrode plate 1, the plurality of first short-circuit grooves 12 are arranged along a second direction, and a driving plate 11 corresponding to a plurality of air rear cavities is formed between adjacent first short-circuit grooves 12.
After forming a plurality of vibration gaps on the first dielectric layer, the first dielectric layer is supported and arranged on one side of the driving plate 11, orthographic projection of the first dielectric layer on the driving plate 11 after forming a plurality of vibration gaps divides the driving plate 11 into a plurality of parts, each part corresponds to an air rear cavity and one vibration gap, and finally a pixel sounding unit is formed with the vibrating diaphragm. So set up, the processing step is comparatively simple, and manufacturing speed is fast.
As another possible implementation, as shown in fig. 2 and 4, step 300: forming one or more drive plates on the first electrode plate includes:
step 321: etching to form a plurality of first short-circuit grooves 12 extending along a first direction on the first electrode plate 1, wherein the plurality of first short-circuit grooves 12 are arranged along a second direction;
step 322: etching to form a second short-circuit groove 13 extending in the second direction on the first electrode plate 1; wherein the first direction and the second direction are different, preferably the first direction is perpendicular to the second direction, and the first short-circuit groove 12 and the second short-circuit groove 13 divide the first electrode plate into a plurality of driving plates 11, and each driving plate 11 corresponds to one or more air rear cavities respectively. Illustratively, as shown in fig. 4, the second shorting groove 13 and the first shorting groove 12 divide the first electrode plate 1 into two rows of multiple driving plates 11, wherein each driving plate 11 in one row corresponds to one air rear cavity, and each driving plate 11 in the other row corresponds to multiple air rear cavities; or, the second short-circuit groove 13 and the first short-circuit groove 12 divide the first electrode plate 1 into two rows of multiple driving plates 11, each driving plate 11 in two rows corresponds to multiple air rear cavities, the position of the second short-circuit groove 13 is set according to actual sounding requirements, and the number of the air rear cavities corresponding to the driving plates 11 in two rows is changed.
The first short-circuit groove 12 and the second short-circuit groove 13 divide the first electrode plate 1 into a plurality of driving plates 11 in two rows and multiple rows, so that each driving plate 11 corresponds to one or more air rear cavities and vibration gaps, one or more pixel sounding units are finally formed with the vibrating diaphragm, the first medium layer is arranged between the driving plates 11, adjacent driving plates 11 are mutually insulated, the current introduced by each driving plate 11 can be independently controlled, the driving precision of the pixel sounding units corresponding to different driving plates 11 can be accurately adjusted, and high-precision digital sounding is realized.
As yet another possible implementation, step 300: forming one or more drive plates on the first electrode plate includes:
the whole first electrode plate is used as a driving plate.
After forming a plurality of vibration gaps on the first dielectric layer, the first dielectric layer supports and sets up in one side of drive plate 11, and the orthographic projection of first dielectric layer on drive plate 11 after forming a plurality of vibration gaps separates drive plate 11 into a plurality of parts, and every part corresponds cavity behind an air and a vibration gap, finally forms a plurality of pixel sound generating units with different vibrating diaphragms, through the circular telegram volume of control different vibrating diaphragms, adjusts the driving accuracy of corresponding pixel sound generating unit, so sets up, and first electrode plate need not to process, further accelerates digital loudspeaker's manufacturing speed.
As one possible implementation, as shown in fig. 5 and 6, step 700: forming a plurality of diaphragms on the second electrode plate includes:
step 710: a plurality of third short-circuit grooves 32 extending along the second direction are etched on the second electrode plate 3, the plurality of third short-circuit grooves 32 are arranged along the first direction, and a diaphragm 31 corresponding to a plurality of air rear cavities is formed between adjacent third short-circuit grooves 32.
After forming a plurality of vibration gaps on the first medium layer, the first medium layer is supported and arranged between the vibrating diaphragm 31 and the driving plate, the orthographic projection of the first medium layer on the vibrating diaphragm after forming a plurality of vibration gaps divides the vibrating diaphragm 31 into a plurality of parts, each part corresponds to an air rear cavity and one vibration gap, and finally, a pixel sounding unit is formed with the driving plate, as shown in fig. 8, the extending directions of the first short-circuit groove 12 and the third short-circuit groove 32 are different, namely, the extending directions of the vibrating diaphragm 31 and the driving plate are different, after forming a plurality of pixel sounding units, the adjacent pixel sounding units are at least different in vibrating diaphragm or different in driving plate, and the driving precision of each pixel sounding unit can be adjusted by adjusting the electrifying quantity of each vibrating diaphragm 31 and each driving plate, so that high-precision digital sounding is realized.
As another possible implementation, as shown in fig. 5 and 7, step 700: forming a plurality of diaphragms on the second electrode plate includes:
step 721: etching to form a plurality of third short-circuit grooves 32 extending in the second direction on the second electrode plate 3, the plurality of third short-circuit grooves 32 being arranged in the first direction;
step 722: etching to form a fourth short-circuit groove 33 extending in the first direction on the second electrode plate 3; the third and fourth short-circuit grooves 32 and 33 divide the second electrode plate 3 into a plurality of diaphragms 31, and each diaphragm 31 corresponds to one or more air rear cavities. As shown in fig. 7, the third short-circuit groove 32 and the fourth short-circuit groove 33 divide the second electrode plate 3 into two rows and a plurality of columns of the diaphragms 31, wherein each diaphragm 31 in one row corresponds to one air rear cavity, and each diaphragm 31 in the other row corresponds to a plurality of air rear cavities; or, the third short-circuit groove 32 and the fourth short-circuit groove 33 divide the second electrode plate 3 into two rows and a plurality of vibration films 31, each vibration film 31 in the two rows corresponds to a plurality of air rear cavities, the position of the fourth short-circuit groove 33 is set according to the actual sounding requirement, and the number of the air rear cavities corresponding to the vibration films 31 in the two rows is changed.
The third short-circuit groove 32 and the fourth short-circuit groove 33 divide the second electrode plate 3 into a plurality of vibrating membranes 31 in two rows and a plurality of columns, so that each vibrating membrane 31 corresponds to one or a plurality of air rear cavities and vibration gaps, one or a plurality of pixel sounding units are finally formed with the driving plate, the second medium layer is arranged between the vibrating membranes 31, adjacent vibrating membranes 31 are mutually insulated, the current introduced by each vibrating membrane 31 can be independently controlled, the driving precision of the pixel sounding units corresponding to different vibrating membranes 31 can be accurately adjusted, and high-precision digital sounding is realized.
As an alternative, in the method for manufacturing a digital speaker, in step 500: after depositing the first dielectric layer on the first electrode plate, and at step 600: before the second electrode plate is fixedly arranged on one side, far away from the first electrode plate, of the first dielectric layer, the manufacturing method of the digital loudspeaker further comprises the following steps:
a plurality of annular bulges 34 shown in fig. 9 are formed on one side of the second electrode plate, which is close to the first dielectric layer, and each annular bulge 34 corresponds to one air rear cavity;
step 600: fixedly arranging a second electrode plate on one side of the first dielectric layer far away from the first electrode plate comprises:
as shown in fig. 7, an annular protrusion 34 is embedded in a side of the first dielectric layer remote from the first electrode plate, and the plurality of annular protrusions 34 divide the first dielectric layer into a mesh-shaped supporting dielectric structure 21 and a plurality of dielectric structures 22 to be etched.
After the first dielectric layer is divided into the mesh-shaped supporting dielectric structure 21 and the plurality of dielectric structures 22 to be etched by the annular protrusions 34, the annular protrusions 34 can prevent the etching medium from corroding the mesh-shaped supporting dielectric structure 21 when the dielectric structures 22 to be etched are etched.
As another alternative, in the method for manufacturing a digital speaker, step 500: depositing a first dielectric layer on the first electrode plate includes:
depositing a reticular supporting medium structure on the first electrode plate, wherein the projection of the reticular supporting medium structure on the first electrode plate covers the edge area of each driving plate;
and depositing a medium structure to be etched at each hollow position of the net-shaped supporting medium structure, wherein the net-shaped supporting medium structure and the medium structure to be etched form a first medium layer, and the materials of the net-shaped supporting medium structure and the medium structure to be etched are different.
The method comprises the steps of firstly depositing a reticular supporting medium structure on a first electrode plate, then depositing a medium structure to be etched at each hollow position of the reticular supporting medium structure, wherein the reticular supporting medium structure and the medium structure to be etched are different in materials, and the adoption of etching medium with good etching effect on the medium structure to be etched and poor etching effect on the reticular supporting medium structure ensures that the reticular supporting medium structure cannot be damaged.
In some embodiments, in the method for manufacturing a digital speaker, after depositing the second dielectric layer on the second electrode plate, before forming the plurality of vibration gaps on the first dielectric layer, the method further includes:
forming cantilever patterns on each vibrating diaphragm, wherein the cantilever patterns penetrate through the vibrating diaphragms;
forming a plurality of vibration gaps on the first dielectric layer, each vibration gap being located between a corresponding diaphragm and a drive plate, including:
and contacting the etching medium with the medium structure to be etched through the cantilever patterns, and etching the medium structure to be etched to form a vibration gap.
Forming cantilever patterns on the vibrating diaphragm, enabling the cantilever patterns to penetrate through the vibrating diaphragm, enabling etching media to contact with the first dielectric layer through the cantilever patterns, and etching on the first dielectric layer to form vibration gaps; in addition, after cantilever patterns are formed on the vibrating diaphragm, the vibrating diaphragm can deform more, so that the amplitude of the vibrating diaphragm is improved, and the sounding effect of the loudspeaker is improved; in addition, when a plurality of vibration gaps are formed on the first dielectric layer, the etching dielectric is contacted with the dielectric structure to be etched through the cantilever patterns, and the dielectric structure to be etched is etched, so that the formation of the vibration gaps is completed.
In other embodiments, in the method for manufacturing a digital speaker, after forming the plurality of air rear cavities on the substrate and before fixedly disposing the first electrode plate on the side of the substrate having the air rear cavities, the method for manufacturing a digital speaker further includes:
a plurality of through holes are formed in the substrate, and each air rear cavity is communicated with at least one through hole;
forming a plurality of vibration gaps on the first dielectric layer, each vibration gap being located between a corresponding diaphragm and a drive plate, including:
and enabling the etching medium to sequentially pass through the through hole, the air rear cavity and the perforation to be in contact with the medium structure to be etched, and etching the medium structure to be etched to form a vibration gap.
On one hand, the air rear cavity is communicated with the external atmosphere through the through hole, so that the vibration gap, the perforation, the air rear cavity, the through hole and the external atmosphere are sequentially communicated; on the other hand, when a plurality of vibration gaps are formed on the first dielectric layer, the etching dielectric sequentially passes through the through holes, the air rear cavity and the perforations to be in contact with the dielectric structure to be etched, and the dielectric structure to be etched is etched, so that the formation of the vibration gaps is completed.
Specifically, in the above method for manufacturing a digital speaker, as shown in fig. 10, step 900: after forming the plurality of vibration gaps on the first dielectric layer, the method for manufacturing the digital speaker further comprises:
and forming a plurality of pins PAD6 on the peripheral sides of the first electrode plate and the second electrode plate, connecting each driving plate with the corresponding pin PAD6, and connecting each vibrating diaphragm with the corresponding pin PAD 6.
The driving plate and the vibrating diaphragm are communicated with external current through corresponding pins PAD6, so that an electric field is generated, and vibration and sounding of the vibrating diaphragm are promoted.
As shown in fig. 10 and 11, the present invention further provides a digital speaker manufactured by the above-mentioned manufacturing method of a digital speaker, the digital speaker including a substrate 4, a plurality of driving boards 11, a mesh-shaped supporting medium structure 21, and a plurality of diaphragms 31, one side of the substrate 4 being provided with a plurality of air rear cavities 41, each air rear cavity 41 being in communication with the outside atmosphere; each driving plate 11 is fixedly arranged on one side of the base 4 with the air rear cavity 41, at least one perforation 111 is arranged on each driving plate 11, and each perforation 111 is communicated with the corresponding air rear cavity 41; the reticular supporting medium structure 21 is fixedly arranged on one side of the driving plate 11 far away from the substrate 4, a plurality of vibration gaps 5 are formed in the middle of the reticular supporting medium structure 21, and each vibration gap 5 is communicated with the corresponding air rear cavity 41 through a perforation 111; each diaphragm 31 is arranged on the side of the mesh-like supporting medium structure 21 remote from the drive plate 11.
The driving plate 11 and the vibrating diaphragm 31 are insulated through the net-shaped supporting medium structure 21 arranged between the driving plate 11 and the vibrating diaphragm 31, the driving plate 11 and the vibrating diaphragm 31 are respectively corresponding to at least one air rear cavity 41, a plurality of vibrating gaps 5 are formed in the middle of the net-shaped supporting medium structure 21, the driving plate 11, the vibrating diaphragm 31, the vibrating gaps 5 and the air rear cavities 41 corresponding to the vibrating gaps 5 jointly form a pixel sounding unit, after the driving plate 11 and the vibrating diaphragm 31 are respectively electrified, the vibrating diaphragm 31 at one side of the vibrating gaps 5 vibrates under the action of an electric field, and compressed air sounds; on the other hand, the first medium layer is arranged between the adjacent driving plates 11, so that the adjacent driving plates 11 are insulated, the second medium layer is arranged between the adjacent vibrating diaphragms 31, so that the adjacent vibrating diaphragms 31 are insulated, different currents are respectively fed to different vibrating diaphragms 31 and different driving plates 11, vibration frequencies and vibration amplitudes of the vibrating diaphragms 31 at different positions of the loudspeaker can be adjusted, and then the pixel sounding units at different positions of the loudspeaker can be flexibly adjusted and controlled to sound, so that the sounding precision of the loudspeaker is improved.
In some embodiments, the digital speaker further includes a plurality of pins PAD6, each diaphragm 31 is connected to a corresponding pin PAD6, and each driving board 11 is connected to a corresponding pin PAD 6. So set up, drive plate and vibrating diaphragm 31 all communicate with outside electric current through corresponding pin PAD6, and then produce the electric field, impel vibrating diaphragm 31 vibration sound production.
In some embodiments, the diaphragm 31 of the digital speaker is provided with a cantilever pattern 311. So set up, can increase the vibration amplitude of vibrating diaphragm 31, improve the sound production effect.
In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. A method of manufacturing a digital loudspeaker, comprising the steps of:
forming a plurality of air rear cavities on a substrate;
a first electrode plate is fixedly arranged on one side of the substrate with the air rear cavity;
forming one or more driving plates on the first electrode plate;
at least one perforation is formed in each driving plate, and each air rear cavity is communicated with at least one perforation;
depositing a first dielectric layer on the first electrode plate;
a second electrode plate is fixedly arranged on one side, far away from the first electrode plate, of the first dielectric layer;
forming a plurality of diaphragms on the second electrode plate;
filling a second dielectric layer in the adjacent vibrating diaphragm of the second electrode plate;
and forming a plurality of vibration gaps on the first medium layer, wherein each vibration gap is positioned between the corresponding vibrating diaphragm and the driving plate, the vibrating diaphragm, the vibration gap and the air rear cavity corresponding to the vibration gap jointly form a pixel sounding unit.
2. The method of manufacturing a digital speaker of claim 1, wherein forming a plurality of drive plates on the first electrode plate comprises:
etching the first electrode plate to form a plurality of first short-circuit grooves extending along a first direction, wherein the first short-circuit grooves are distributed along a second direction, and a driving plate corresponding to a plurality of air rear cavities is formed between the adjacent first short-circuit grooves;
alternatively, the forming the plurality of driving plates on the first electrode plate includes:
etching the first electrode plate to form a plurality of first short-circuit grooves extending along a first direction, wherein the first short-circuit grooves are distributed along a second direction;
etching the first electrode plate to form a second short-circuit groove extending along the second direction; the first direction and the second direction are different, the first short-circuit groove and the second short-circuit groove divide the first electrode plate into a plurality of driving plates, and each driving plate corresponds to one or a plurality of air rear cavities respectively.
3. The method of manufacturing a digital speaker of claim 1, wherein forming a plurality of diaphragms on the second electrode plate comprises:
etching the second electrode plate to form a plurality of third short-circuit grooves extending along a second direction, wherein the third short-circuit grooves are distributed along a first direction, and a vibrating diaphragm corresponding to a plurality of air rear cavities is formed between every two adjacent third short-circuit grooves;
alternatively, the forming the plurality of diaphragms on the second electrode plate includes:
etching the second electrode plate to form a plurality of third short-circuit grooves extending along a second direction, wherein the third short-circuit grooves are distributed along a first direction;
etching the second electrode plate to form a fourth short-circuit groove extending along the first direction; the first direction and the second direction are different, the third short-circuit groove and the fourth short-circuit groove divide the second electrode plate into a plurality of vibrating diaphragms, and each vibrating diaphragm corresponds to one or more air rear cavities respectively.
4. The method of manufacturing a digital speaker of claim 1, wherein after depositing a first dielectric layer on the first electrode plate and before fixedly disposing a second electrode plate on a side of the first dielectric layer away from the first electrode plate, the method further comprises:
a plurality of annular bulges are formed on one side of the second electrode plate, which is close to the first dielectric layer, and each annular bulge corresponds to one air rear cavity;
fixedly arranging a second electrode plate on one side of the first dielectric layer away from the first electrode plate comprises:
the annular protrusions are embedded into one side, far away from the first electrode plate, of the first dielectric layer, and the annular protrusions divide the first dielectric layer into a net-shaped supporting dielectric structure and a plurality of dielectric structures to be etched.
5. The method of manufacturing a digital speaker of claim 1, wherein depositing a first dielectric layer on the first electrode plate comprises:
depositing a mesh-shaped supporting medium structure on the first electrode plate, wherein the projection of the mesh-shaped supporting medium structure on the first electrode plate covers the edge area of each driving plate;
and depositing a medium structure to be etched at each hollow position of the net-shaped supporting medium structure, wherein the net-shaped supporting medium structure and the medium structure to be etched form a first medium layer, and the net-shaped supporting medium structure and the medium structure to be etched are made of different materials.
6. The method of manufacturing a digital speaker as recited in any one of claims 4 to 5, wherein after depositing a second dielectric layer on the second electrode plate, before forming a plurality of vibration gaps on the first dielectric layer, the method further comprises:
forming cantilever patterns on each vibrating diaphragm, wherein the cantilever patterns penetrate through the vibrating diaphragms;
forming a plurality of vibration gaps on the first dielectric layer, wherein each vibration gap is located between the corresponding vibrating diaphragm and the driving plate and comprises:
and enabling the etching medium to be in contact with the medium structure to be etched through the cantilever patterns, and etching the medium structure to be etched to form the vibration gap.
7. The method of manufacturing a digital speaker according to any one of claims 4 to 5, wherein after forming a plurality of air rear cavities on a substrate and before fixedly disposing a first electrode plate on a side of the substrate having the air rear cavities, the method further comprises:
a plurality of through holes are formed in the substrate, and each air rear cavity is communicated with at least one through hole;
forming a plurality of vibration gaps on the first dielectric layer, wherein each vibration gap is located between the corresponding vibrating diaphragm and the driving plate and comprises:
and enabling the etching medium to sequentially pass through the through hole, the air rear cavity and the through hole to be in contact with the medium structure to be etched, and etching the medium structure to be etched to form a vibration gap.
8. The method of manufacturing a digital speaker of claim 1, wherein after forming a plurality of vibration gaps on the first dielectric layer, the method further comprises:
and forming a plurality of pins PAD on the peripheral sides of the first electrode plate and the second electrode plate, connecting each driving plate with the corresponding pin PAD, and connecting each vibrating diaphragm with the corresponding pin PAD.
9. A digital speaker manufactured by the manufacturing method of a digital speaker according to any one of claims 1 to 8, the digital speaker comprising:
the device comprises a substrate, wherein one side of the substrate is provided with a plurality of air rear cavities, and each air rear cavity is communicated with the outside atmosphere;
the driving plates are fixedly arranged on one side of the substrate with the air rear cavity, at least one perforation is formed in each driving plate, and each perforation is communicated with the corresponding air rear cavity;
the reticular supporting medium structure is fixedly arranged on one side of the driving plate, which is far away from the substrate, a plurality of vibration gaps are formed in the middle of the reticular supporting medium structure, and each vibration gap is communicated with the corresponding air rear cavity through the perforation;
the vibrating diaphragms are arranged on one side, far away from the driving plate, of the reticular supporting medium structure.
10. The digital loudspeaker of claim 9, further comprising a plurality of pins PAD, each diaphragm being coupled to a corresponding pin PAD, each driver board being coupled to a corresponding pin PAD.
CN202311428132.XA 2023-10-31 2023-10-31 Digital loudspeaker and manufacturing method thereof Active CN117177166B (en)

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Publication number Priority date Publication date Assignee Title
CN101959110A (en) * 2009-07-16 2011-01-26 鸿富锦精密工业(深圳)有限公司 Loudspeaker of micro-electro-mechanical system and electronic device
KR101610173B1 (en) * 2014-11-28 2016-04-07 현대자동차 주식회사 Microphone system and control method of microphone
CN113747328A (en) * 2021-09-03 2021-12-03 苏州敏芯微电子技术股份有限公司 Micro-electro-mechanical structure and manufacturing method thereof, wafer, microphone and terminal
CN113993050A (en) * 2021-08-26 2022-01-28 地球山(北京)科技有限公司 MEMS speaker unit, MEMS digital speaker and electronic terminal
CN115802256A (en) * 2022-12-27 2023-03-14 地球山(苏州)微电子科技有限公司 Pixel sounding unit, manufacturing method thereof and digital sounding chip
CN115914975A (en) * 2022-12-08 2023-04-04 地球山(苏州)微电子科技有限公司 Pixel sounding unit, manufacturing method thereof and digital sounding chip

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101959110A (en) * 2009-07-16 2011-01-26 鸿富锦精密工业(深圳)有限公司 Loudspeaker of micro-electro-mechanical system and electronic device
KR101610173B1 (en) * 2014-11-28 2016-04-07 현대자동차 주식회사 Microphone system and control method of microphone
CN113993050A (en) * 2021-08-26 2022-01-28 地球山(北京)科技有限公司 MEMS speaker unit, MEMS digital speaker and electronic terminal
CN113747328A (en) * 2021-09-03 2021-12-03 苏州敏芯微电子技术股份有限公司 Micro-electro-mechanical structure and manufacturing method thereof, wafer, microphone and terminal
CN115914975A (en) * 2022-12-08 2023-04-04 地球山(苏州)微电子科技有限公司 Pixel sounding unit, manufacturing method thereof and digital sounding chip
CN115802256A (en) * 2022-12-27 2023-03-14 地球山(苏州)微电子科技有限公司 Pixel sounding unit, manufacturing method thereof and digital sounding chip

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