CN117156664A - Printed circuit board based on stainless steel substrate - Google Patents
Printed circuit board based on stainless steel substrate Download PDFInfo
- Publication number
- CN117156664A CN117156664A CN202311214606.0A CN202311214606A CN117156664A CN 117156664 A CN117156664 A CN 117156664A CN 202311214606 A CN202311214606 A CN 202311214606A CN 117156664 A CN117156664 A CN 117156664A
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- layer
- key
- miniled
- conductive
- stainless steel
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- 239000000758 substrate Substances 0.000 title claims abstract description 158
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 100
- 239000010935 stainless steel Substances 0.000 title claims abstract description 99
- 238000002955 isolation Methods 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000009434 installation Methods 0.000 claims description 61
- 239000010408 film Substances 0.000 claims description 35
- 239000010409 thin film Substances 0.000 claims description 18
- 239000002131 composite material Substances 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 20
- 238000000034 method Methods 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 265
- 230000008901 benefit Effects 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000005265 energy consumption Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000004952 Polyamide Substances 0.000 description 5
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229920006259 thermoplastic polyimide Polymers 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000011031 large-scale manufacturing process Methods 0.000 description 3
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- -1 wherein Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Input From Keyboards Or The Like (AREA)
Abstract
The application discloses a printed circuit board based on a stainless steel base material, which comprises: the printed circuit board is a printed circuit board with a multilayer structure and combined into a whole, and comprises: the stainless steel substrate supporting layer, wherein, stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually joint in proper order forms integrated into one piece structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer and switch on the circuit, miniLED light emitting device sets up the position of predetermineeing on the MiniLED control circuit of conductive line layer. The application solves the problems of complex circuit layer structure, troublesome assembly procedure, thicker total thickness of finished products, high material manufacturing cost, higher processing cost and low quality consistency of the finished products in the traditional scheme of the backlight keyboard of the notebook computer.
Description
Technical Field
The application relates to the field of circuit boards, in particular to a printed circuit board based on a stainless steel base material.
Background
A keyboard is a type of instruction and data input means for operating the device to function, and also to a set of function keys arranged by the system to operate a machine or device. The keyboard is the most commonly used and main input device, and english letters, numbers, punctuation marks and the like can be input into a computer through the keyboard, so that commands, input data and the like can be sent to the computer. In the prior art, in order to improve portability and flexibility, tablet computers and notebook computers widely use independent keyboards as input devices.
The backlight keyboard of the notebook computer on the market at present comprises a keyboard functional structure part and a keyboard backlight part; wherein the keyboard functional structure part mainly comprises a supporting layer and a keyboard flexible circuit layer; the keyboard backlight part mainly comprises a backlight flexible circuit layer, the type notebook computer backlight keyboard comprises a plurality of parts, the circuit layer is complex in structure, the assembly procedure is troublesome, the total thickness of the finished product is thicker, the manufacturing material cost is high, the processing cost is higher, and the quality consistency of the finished product is low.
Therefore, a new technical scheme of a printed circuit board based on a stainless steel substrate is needed currently, and the problems that the structure of a circuit layer is complex, the assembly procedure is troublesome, the total thickness of a finished product is thicker, the manufacturing material cost is high, the processing cost is higher, and the quality consistency of the finished product is low in the scheme of the backlight keyboard of the notebook computer currently are solved.
Disclosure of Invention
The application provides a printed circuit board based on a stainless steel base material, which solves the problems of complex circuit layer structure, troublesome assembly process, thicker total thickness of finished products, high material manufacturing cost, higher processing cost and low quality consistency of the finished products in the prior scheme of the backlight keyboard of the notebook computer.
In order to solve the above problems, the present application provides a printed circuit board based on a stainless steel substrate, comprising:
the printed circuit board is a printed circuit board with a multilayer structure and combined into a whole, and comprises: the stainless steel substrate supporting layer, wherein, stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually joint in proper order forms integrated into one piece structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer and switch on the circuit, miniLED light emitting device sets up the position of predetermineeing on the MiniLED control circuit of conductive line layer.
Further, the printed circuit board may further include: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, and the corresponding conductive circuit layer is also formed by two layers;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually join in proper order and form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, miniLED light emitting device sets up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: a keyboard key conducting film circuit layer, a first conductive circuit layer and a first substrate isolating insulating layer are arranged above the stainless steel substrate supporting layer from far to near, and a MiniLED light emitting device, a second conductive circuit layer and a second substrate isolating insulating layer are arranged below the stainless steel substrate supporting layer from far to near; the first conductive circuit layer is provided with a key conducting circuit, and the second conductive circuit layer is provided with a MiniLED control circuit.
Further, the printed circuit board may further include: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, and the corresponding conductive circuit layer is also formed by two layers;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually join in proper order and form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, miniLED light emitting device sets up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: the stainless steel substrate supporting layer is provided with a keyboard key conducting film circuit layer, a MiniLED light-emitting device, a second conductive circuit layer, a second substrate isolating insulating layer, a first conductive circuit layer and a first substrate isolating insulating layer from far to near, wherein the second conductive circuit layer is provided with a MiniLED control circuit, and the first conductive circuit layer is provided with a key conducting circuit.
Further, the printed circuit board may further include: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, and the corresponding conductive circuit layer is also formed by two layers;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually join in proper order and form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, miniLED light emitting device sets up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: the stainless steel substrate supporting layer is provided with a keyboard key conducting film circuit layer, a second conductive circuit layer, a second substrate isolating insulating layer, a MiniLED light emitting device, a first conductive circuit layer and a first substrate isolating insulating layer from far to near, wherein the first conductive circuit layer is provided with a MiniLED control circuit, and the second conductive circuit layer is provided with a key conducting circuit.
Further, the printed circuit board may further include: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, correspondingly, the conductive circuit layer is also two layers; the MiniLED light-emitting devices are arranged on different conductive circuit layers respectively;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually join in proper order and form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, miniLED light emitting device sets up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: a keyboard key conducting film circuit layer, a first MiniLED light-emitting device, a first conductive circuit layer and a first substrate isolation insulating layer are arranged above the stainless steel substrate supporting layer from far to near, and a second MiniLED light-emitting device, a second conductive circuit layer and a second substrate isolation insulating layer are arranged below the stainless steel substrate supporting layer from far to near; the first conductive circuit layer is provided with a key-on circuit and a MiniLED control circuit for controlling the first MiniLED light-emitting device, and the second conductive circuit layer is provided with a MiniLED control circuit for controlling the second MiniLED light-emitting device.
Further, the printed circuit board may further include: the stainless steel substrate supporting layer is provided with a first key cap key core structure mounting hole site; the substrate isolation insulating layer is connected with the stainless steel substrate supporting layer, the stainless steel substrate supporting layer is provided with a corresponding position of the first key cap key core structure installation hole site, the substrate isolation insulating layer is provided with a second key cap key core structure installation hole site, the size of the second key cap key core structure installation hole site is smaller than or equal to that of the first key cap key core structure installation hole site, and a straight line formed by connecting the center of the second key cap key core structure installation hole site and the center of the first key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer.
Further, the printed circuit board may further include: the conductive circuit layer is also provided with a third key cap key core structure installation hole site, the conductive circuit layer is jointed with the substrate isolation insulating layer, the substrate isolation insulating layer is provided with a corresponding position of the second key cap key core structure installation hole site, the conductive circuit layer is provided with a third key cap key core structure installation hole site, the size of the third key cap key core structure installation hole site is larger than or equal to that of the first key cap key core structure installation hole site, and a straight line formed by connecting the center of the third key cap key core structure installation hole site and the center of the first key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer; the MiniLED light-emitting device is arranged at a preset position on a MiniLED control circuit of the conductive circuit layer in an attaching and welding mode.
Further, the printed circuit board may further include: the keyboard key conducting film circuit layer is provided with a fourth key cap key core structure mounting hole site and a key conducting contact, and the key conducting contact is arranged outside the position of the fourth key cap key core structure mounting hole site on the keyboard key conducting film circuit layer; the keyboard key conduction film circuit layer is connected with the conductive circuit layer, a corresponding position of a third key cap key core structure installation hole site is arranged on the conductive circuit layer, the keyboard key conduction film circuit layer is provided with a fourth key cap key core structure installation hole site, and a straight line formed by connecting the center of the fourth key cap key core structure installation hole site and the center of the third key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer.
Further, the printed circuit board may further include: the substrate isolation insulating layer is an insulating composite material with the temperature resistance of more than 230 ℃ and low dielectric constant, and the insulating composite material comprises: the TPI, TPU or PA class, the thickness of the base material isolation insulating layer is 5 μm to 50 μm.
Further, the printed circuit board may further include: the materials of the conductive circuit layer comprise: the thickness of the conductive circuit layer is 3-10 μm, which is a conductive metal material of copper foil, aluminum foil, tin foil or silver foil.
Through the scheme, the application has the following advantages:
structural integrity: the stainless steel substrate supporting layer, the substrate isolating insulating layer and the conductive circuit layer are sequentially mutually jointed to form the printed circuit board with an integrated structure, so that the printed circuit board can replace the supporting layer in a traditional notebook computer backlight keyboard, and the MiniLED circuit and part or all of the key conducting circuits are arranged on the same side or the front and back sides of the printed circuit board based on the stainless steel substrate in a mode of mixed single-layer circuit or multi-layer circuit.
Ease of processing: the assembly process of the backlight keyboard of the notebook computer is greatly reduced by arranging the printed circuit board with the stainless steel base material, and the alignment, the lamination and the assembly process between each functional layer and the structural layer of the original backlight keyboard of the notebook computer are omitted. And the MiniLED light-emitting device can be easily arranged on the circuit board of the stainless steel base material through the general attaching and welding procedure by virtue of the characteristic of extremely low temperature expansion and shrinkage of the stainless steel base material, so that the production difficulty is reduced, the product yield is improved, and the production cost is reduced.
Product stability: the existing notebook computer backlight keyboard is formed by combining a keyboard functional structure part and a keyboard backlight part in a glue film or glue mode, and a large number of semi-automatic or manual glue film or glue bonding procedures between original laminated structures are omitted through a printed circuit board with a stainless steel base material, so that the stability of the notebook computer backlight keyboard is greatly improved.
In summary, the application has the advantages of simple and efficient circuit design of the printed circuit board with structural integrity, elimination of processing simplicity of adapting adjustment, reduction of material types in the processing process of the printed circuit board, and the like, and the circuit board provided with the stainless steel base material omits a great number of semiautomatic or manual glue film or glue bonding procedures between original laminated structures, so that the stability of the backlight keyboard of the notebook computer is greatly improved, meanwhile, the application scheme of a MiniLED light source under each key can reduce the brightness requirement of a single MiniLED light source, on one hand, common or even secondary light emitting diodes can be used, and the backlight source is close to the target, so that the energy consumption can be greatly reduced by reducing the brightness, the targets of reducing the product cost, improving the production efficiency and increasing the market competitiveness of the product are realized, and the application has wide application prospect and economic benefit.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic exploded view of a printed circuit board based on a stainless steel substrate according to the present application;
FIG. 2 is a schematic exploded view of one embodiment of a printed circuit board of the present application;
FIG. 3 is an exploded view of another embodiment of a printed circuit board of the present application;
fig. 4 is a schematic exploded view of a printed circuit board according to still another embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The following describes in detail the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.
The main design idea of the application is as follows: the printed circuit board using the stainless steel substrate as the circuit supporting layer has the following advantages: high temperature resistance: the printed circuit board with the stainless steel substrate as the circuit supporting layer has excellent high-temperature performance. When the circuit board operates in a high temperature environment, the support layer generally has a large thermal deformation, thereby affecting the performance and life of the circuit board. The deformation of the circuit board taking the stainless steel base material as the circuit supporting layer is extremely small due to high temperature, so that the circuit board can stably run for a long time in a high temperature environment; high strength: the printed circuit board with the stainless steel substrate as the circuit supporting layer has higher strength. When the circuit board is struck or vibrated in a mechanical environment, the ageing and fracture problems are easy to occur to part of the supporting layer, and the stainless steel base material is used as the circuit supporting layer, so that the circuit board can be effectively protected; long service life: because the stainless steel substrate is used as the printed circuit board of the circuit supporting layer, the service life of the circuit board is effectively prolonged. Meanwhile, the printed circuit board with the stainless steel substrate as the circuit supporting layer has corrosion resistance, so that the circuit board can be effectively prevented from being chemically corroded, and the service life of the circuit board is further prolonged; better heat dissipation performance: the stainless steel supporting layer has higher heat conductivity, so that heat can be better discharged from the circuit board, and the heat dissipation performance of the circuit board is improved. In conclusion, the printed circuit board with the stainless steel substrate as the circuit supporting layer has the advantages of high temperature resistance, high strength, long service life, good heat dissipation performance and the like. Under high temperature, mechanical and chemical environment, the stainless steel substrate is used as a circuit supporting layer to better protect the circuit board, so that the reliability and the service life of the circuit board are improved.
According to the application, the stainless steel substrate supporting layer, the MiniLED control circuit and the key conducting circuit are combined into a whole through the stainless steel substrate material, and the stainless steel substrate material is used for integrating the MiniLED control circuit and the key conducting circuit, so that a part or the whole key conducting circuit can be arranged on a printed circuit board based on the stainless steel substrate, and the key function can be triggered and realized only by arranging a conductive material below a key cap structure after the key conducting circuit is integrated greatly. The application has the advantages of simplifying and efficient circuit design, avoiding adapting and adjusting, reducing the variety of materials in the processing process of the printed circuit board, and the like, and realizes the aims of effectively adjusting the thickness and structure of the backlight keyboard of the notebook computer, reducing the production cost, improving the production efficiency and increasing the market competitiveness of the product. In addition, the steps of adapting and adjusting are reduced, the production flow is simplified, the complexity of inventory management can be reduced by reducing the types of materials, the cost of material purchase and management is reduced, and the production efficiency is improved.
According to the application, an application scheme of a MiniLED light source is ensured through each key, so that the brightness requirement of a single MiniLED light source can be reduced, on one hand, a common or even secondary light emitting diode can be used, and the backlight source is close to a target, so that the use of energy consumption can be greatly reduced by reducing the brightness. The MiniLED light-emitting device can be arranged on the same surface of the key conducting circuit to emit light from the front surface, or on the back surface of the key conducting circuit, and the light source is uniformly reflected to the front surface of the thin film keyboard triggering circuit by arranging the diffusion film and the reflection film.
The application makes the application of MiniLED which needs high mounting precision easy to implement by the extremely low temperature creep characteristic of the stainless steel base material, reduces the production difficulty and improves the production efficiency.
In summary, the application has the advantages of simple and efficient circuit design of the printed circuit board with structural integrity, elimination of processing simplicity of adapting adjustment, reduction of material types in the processing process of the printed circuit board, and the like, and the printed circuit board with the stainless steel substrate omits a large number of semi-automatic or manual adhesive film or glue bonding procedures between original laminated structures, so that the stability of the backlight keyboard of the notebook computer is greatly improved, meanwhile, an application scheme of a MiniLED light source is ensured through each key, the brightness requirement of a single MiniLED light source is reduced, on one hand, a common or even secondary LED can be used, and the backlight source is close to a target, so that the energy consumption is greatly reduced by reducing the brightness, the purposes of reducing the product cost, improving the production efficiency and increasing the market competitiveness of the product are realized, and the application has wide application prospect and economic benefit.
As shown in fig. 1, a printed circuit board 30 according to the present application based on a stainless steel substrate is a printed circuit board having a multi-layered structure combined as one body, comprising: the stainless steel substrate supporting layer 301, wherein the stainless steel substrate supporting layer 301, the substrate isolating insulating layer 302 and the conductive circuit layer 303 are sequentially mutually combined to form an integrated structure, a MiniLED control circuit and a key conducting circuit are arranged on the conductive circuit layer, and the MiniLED light emitting device 40 is arranged at a preset position on the MiniLED control circuit of the conductive circuit layer.
According to the application, through the arrangement that the stainless steel substrate supporting layer, the substrate isolating insulating layer and the conductive circuit layer are sequentially mutually jointed to form an integrated structure, the support layer in the traditional notebook computer backlight keyboard can be replaced, and the MiniLED circuit and part or all of the key conducting circuits are arranged on the same side or the front and back sides of a printed circuit board based on the stainless steel substrate in a mode of mixed single-layer circuit or multi-layer circuit; the semi-automatic or manual glue film setting or glue bonding process between a large number of original laminated structures is omitted, so that the stability of the backlight keyboard of the notebook computer is greatly improved; meanwhile, the thickness and the structure of the backlight keyboard of the notebook computer can be effectively adjusted, and the total thickness of a finished product is reduced.
The stainless steel substrate supporting layer can adopt the heat dissipation coefficient higher than 16W ferritic stainless steel foil or austenitic stainless steel foil with a heat dissipation coefficient higher than 16W. The ferrite stainless steel foil with the heat dissipation coefficient higher than 16W or the austenitic stainless steel foil with the heat dissipation coefficient higher than 16W is adopted, so that the printed circuit board based on the stainless steel metal has the characteristics of high heat dissipation and high heat load.
Wherein the thickness of the stainless steel substrate supporting layer may be set to be less than 50 μm; the thickness of the stainless steel substrate supporting layer is smaller than 50 mu m, so that the thickness of the printed circuit board can be reduced, and the trend of lightening and thinning requirements of a backlight keyboard of a notebook computer can be met.
In one embodiment of the present application, the printed circuit board further includes: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, and the corresponding conductive circuit layer is also formed by two layers;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually joint in proper order form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, a plurality of MiniLED luminescent device respectively set up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: as shown in fig. 2, a keyboard key conducting thin film circuit layer 20, a first conductive circuit layer 303 and a first substrate isolating insulating layer 302 are arranged above a stainless steel substrate supporting layer 301 from far to near, and a plurality of MiniLED light emitting devices 40, a second conductive circuit layer 303 and a second substrate isolating insulating layer 302 are arranged below the stainless steel substrate supporting layer 301 from far to near; the first conductive circuit layer is provided with a key conducting circuit, and the second conductive circuit layer is provided with a MiniLED control circuit. According to the embodiment, the MiniLED control circuit and the key conducting circuit are separated on different conducting circuit layers through the two conducting circuit layers, the MiniLED light emitting device is arranged on the second conducting circuit layer (namely, the back surface of the key conducting circuit), the light source is uniformly reflected to the front surface of the thin film keyboard triggering circuit through the diffusion film and the reflection film, each key is ensured to have an application scheme of a MiniLED light source, so that the brightness requirement of a single MiniLED light source can be reduced, on one hand, a common or even secondary light emitting diode can be used, and the use of energy consumption can be greatly reduced by reducing the brightness due to the fact that the backlight source is close to a target; meanwhile, the structure of the embodiment can realize the purpose of effectively adjusting the thickness and the structure of the backlight keyboard of the notebook computer.
In another embodiment of the present application, the printed circuit board further includes: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, and the corresponding conductive circuit layer is also formed by two layers;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually joint in proper order form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, a plurality of MiniLED luminescent device respectively set up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: as shown in fig. 3, the stainless steel substrate supporting layer 301 is provided with a keyboard key conducting thin film circuit layer 20, a plurality of MiniLED light emitting devices 40, a second conductive circuit layer 303, a second substrate isolating insulating layer 302, a first conductive circuit layer 303 and a first substrate isolating insulating layer 302 from far to near, wherein the second conductive circuit layer is provided with MiniLED control circuits, and the first conductive circuit layer is provided with key conducting circuits. According to the embodiment, the MiniLED control circuit and the key conducting circuit are arranged on different conducting circuit layers in a separated mode, the MiniLED light emitting device can be arranged on the same surface of the key conducting circuit to emit light in the front, each key is provided with an application scheme of a MiniLED light source, so that the brightness requirement of a single MiniLED light source can be reduced, on one hand, a common or even secondary light emitting diode can be used, and on the other hand, as the backlight source is close to a target, the energy consumption can be greatly reduced by reducing the brightness; meanwhile, the structure of the embodiment can realize the purpose of effectively adjusting the thickness and the structure of the backlight keyboard of the notebook computer.
In yet another embodiment of the present application, the printed circuit board further includes: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, and the corresponding conductive circuit layer is also formed by two layers;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually joint in proper order form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, a plurality of MiniLED luminescent device respectively set up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: the stainless steel substrate supporting layer is provided with a keyboard key conducting film circuit layer, a second conductive circuit layer, a second substrate isolating insulating layer, a plurality of MiniLED light emitting devices, a first conductive circuit layer and a first substrate isolating insulating layer from far to near, wherein the first conductive circuit layer is provided with a MiniLED control circuit, and the second conductive circuit layer is provided with a key conducting circuit. According to the embodiment, the MiniLED control circuit and the key conducting circuit are arranged on different conducting circuit layers in a separated mode, the MiniLED light emitting device can be arranged on the same surface of the key conducting circuit to emit light in the front, each key is provided with an application scheme of a MiniLED light source, so that the brightness requirement of a single MiniLED light source can be reduced, on one hand, a common or even secondary light emitting diode can be used, and on the other hand, as the backlight source is close to a target, the energy consumption can be greatly reduced by reducing the brightness; meanwhile, the structure of the embodiment can realize the purpose of effectively adjusting the thickness and the structure of the backlight keyboard of the notebook computer.
In another embodiment of the present application, the printed circuit board further includes: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, and the corresponding conductive circuit layer is also formed by two layers; the MiniLED light-emitting devices are arranged on different conductive circuit layers respectively;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually joint in proper order form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, a plurality of MiniLED luminescent device respectively set up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: as shown in fig. 4, a keyboard key conducting thin film circuit layer 20, a plurality of first MiniLED light emitting devices 40, a first conductive circuit layer 303 and a first substrate isolating insulating layer 302 are arranged above a stainless steel substrate supporting layer 301 from far to near, and a plurality of second MiniLED light emitting devices 40, a second conductive circuit layer 303 and a second substrate isolating insulating layer 302 are arranged below the stainless steel substrate supporting layer 301 from far to near; the first conductive circuit layer is provided with a key-on circuit and a MiniLED control circuit for controlling the first MiniLED light-emitting device, and the second conductive circuit layer is provided with a MiniLED control circuit for controlling the second MiniLED light-emitting device. In the embodiment, through the two conductive circuit layers, part of the MiniLED control circuit and the key conducting circuit are arranged on the first conductive circuit layer (namely, the MiniLED light-emitting device can be arranged on the same surface of the key conducting circuit to emit light on the front surface), and part of the MiniLED light-emitting device is arranged on the second conductive circuit layer (namely, the back surface of the key conducting circuit) to uniformly reflect the light source to the front surface of the thin film keyboard triggering circuit through the diffusion film and the reflection film; the arrangement can meet the requirement of users with high brightness of the notebook keyboard, each key ensures an application scheme of MiniLED light and reflection enhancement light source, so that the brightness requirement of a single MiniLED light source can be reduced, on one hand, common or even secondary LEDs can be used, and because the backlight source is close to a target, the energy consumption can be greatly reduced by reducing the brightness; meanwhile, the structure of the embodiment can realize the purpose of effectively adjusting the thickness and the structure of the backlight keyboard of the notebook computer.
Further comprises: the stainless steel substrate supporting layer is provided with a first key cap key core structure mounting hole site; the substrate isolation insulating layer is connected with the stainless steel substrate supporting layer, the stainless steel substrate supporting layer is provided with a corresponding position of the first key cap key core structure installation hole site, the substrate isolation insulating layer is provided with a second key cap key core structure installation hole site, the size of the second key cap key core structure installation hole site is smaller than or equal to that of the first key cap key core structure installation hole site, and a straight line formed by connecting the center of the second key cap key core structure installation hole site and the center of the first key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer. The arrangement is convenient for installing the keyboard key cap on the printed circuit board of the notebook computer keyboard.
The substrate isolation insulating layer is an insulating composite material with the temperature resistance of more than 230 ℃ and low dielectric constant, and the insulating composite material comprises: thermoplastic Polyimide (TPI), thermoplastic polyurethane rubber (TPU) and Polyamide (PA) are used for blocking the stainless steel substrate supporting layer and the conductive circuit layer from forming an electric performance insulating non-conductive function. The size of the second key cap key core structure installation hole site is smaller than or equal to that of the first key cap key core structure installation hole site, and the key cap key core structure installation hole site has the advantages that: when the key pins penetrate through the substrate isolation insulating layer, redundant adhesive materials can form an insulating protective layer between the stainless steel substrate supporting layer and the conductive circuit layer, so that the phenomenon of short circuit among the key pins is avoided, and the whole circuit works more stably. The center of the second key cap key core structure installation hole site and the center of the first key cap key core structure installation hole site are connected to form a straight line perpendicular to the arrangement of the stainless steel base material supporting layer, so that the keyboard key cap can be conveniently installed on the printed circuit board of the notebook computer keyboard.
Further comprises: the conductive circuit layer is also provided with a third key cap key core structure installation hole site, the conductive circuit layer is jointed with the substrate isolation insulating layer, the substrate isolation insulating layer is provided with a corresponding position of the second key cap key core structure installation hole site, the conductive circuit layer is provided with a third key cap key core structure installation hole site, the size of the third key cap key core structure installation hole site is larger than or equal to that of the first key cap key core structure installation hole site, and a straight line formed by connecting the center of the third key cap key core structure installation hole site and the center of the first key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer; the MiniLED light-emitting device is arranged at a preset position on a MiniLED control circuit of the conductive circuit layer in an attaching and welding mode. The arrangement is convenient for installing the keyboard key cap on the printed circuit board of the notebook computer keyboard. The size of the installation hole site of the key core structure of the third key cap is larger than or equal to that of the installation hole site of the key core structure of the first key cap, so that the key cap of the keyboard is convenient to install on a printed circuit board of the keyboard of the notebook computer.
The shapes of the first key cap key core structure installation hole site, the second key cap key core structure installation hole site and the third key cap key core structure installation hole site are mutually adapted, so that the keyboard key cap is conveniently installed on the printed circuit board of the notebook computer keyboard.
Further comprises: the keyboard key conducting film circuit layer is provided with a fourth key cap key core structure mounting hole site and a key conducting contact, and the key conducting contact is arranged outside the position of the fourth key cap key core structure mounting hole site on the keyboard key conducting film circuit layer; the keyboard key conduction film circuit layer is connected with the conductive circuit layer, a corresponding position of a third key cap key core structure installation hole site is arranged on the conductive circuit layer, the keyboard key conduction film circuit layer is provided with a fourth key cap key core structure installation hole site, and a straight line formed by connecting the center of the fourth key cap key core structure installation hole site and the center of the third key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer. The arrangement is convenient for installing the keyboard key cap on the printed circuit board of the notebook computer keyboard.
The number of key-on contacts is plural, the plurality of key conducting contacts are uniformly arranged around the position of the fourth key cap key core structure mounting hole position on the key conducting film circuit layer of the keyboard. The plurality of key conduction contacts are arranged, so that the key conduction contacts on the key conduction film circuit layer of the keyboard are triggered by the operation of pressing the key cap of the keyboard, and the operation is more convenient and sensitive.
The mode of correspondingly selecting the key-press conducting film circuit layer of the keyboard can be a contact conducting mode or an upper-layer and lower-layer film circuit superposition mode according to the design mode of the key-press conducting circuit to realize triggering. The setting can be more flexible, the method is suitable for various application scenes, and the use satisfaction of the user is improved.
Further comprises: the substrate isolation insulating layer is an insulating composite material with the temperature resistance of more than 230 ℃ and low dielectric constant, and the insulating composite material can comprise: TPI, TPU or PA, the thickness of the substrate isolating insulating layer is 5 μm to 50 μm; the insulating composite material includes: TP I, TPU or PA are mature products, have low cost and good insulating property, are suitable for temperature control of mass production, and are convenient for mass production and manufacture. Meanwhile, the thickness of the substrate isolation insulating layer can be effectively adjusted, the thickness and the structure of the backlight keyboard of the notebook computer can be adapted to flexible production, the total thickness of a finished product is reduced, and the large-scale production and manufacturing are facilitated.
The materials of the conductive circuit layer comprise: the thickness of the conductive circuit layer is 3-10 μm, which is a conductive metal material of copper foil, aluminum foil, tin foil or silver foil. The conductive metal material of the copper foil, the aluminum foil, the tin foil or the silver foil is a mature product, the cost is low, and meanwhile, the thickness and the structure of the backlight keyboard of the notebook computer can be effectively adjusted through the thickness setting of the conductive circuit layer, so that the notebook computer backlight keyboard can be suitable for flexible production, the total thickness of a finished product is reduced, and the notebook computer backlight keyboard is beneficial to large-scale production and manufacture.
In the present application, the preferred embodiments are only described with emphasis on being different from other preferred embodiments, and the embodiments formed by the combination can be arbitrarily combined as long as the preferred embodiments do not conflict, and the embodiments formed by the combination are also within the scope disclosed in the present specification, and in view of the brevity of the text, the embodiments formed by the combination will not be separately described herein.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.
In this context, the preferred embodiments are only described with emphasis on being different from other preferred embodiments, and the embodiments formed by the combination may be arbitrarily combined as long as they do not collide, and the embodiments formed by the combination are also within the scope of the disclosure of the present specification, and in view of brevity, the embodiments formed by the combination will not be described separately.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.
Claims (10)
1. A printed circuit board based on a stainless steel substrate, comprising:
the printed circuit board is a printed circuit board with a multilayer structure and combined into a whole, and comprises: the stainless steel substrate supporting layer, wherein, stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually joint in proper order forms integrated into one piece structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer and switch on the circuit, miniLED light emitting device sets up the position of predetermineeing on the MiniLED control circuit of conductive line layer.
2. The printed circuit board of claim 1, wherein the printed circuit board comprises,
further comprises: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, and the corresponding conductive circuit layer is also formed by two layers;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually join in proper order and form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, miniLED light emitting device sets up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: a keyboard key conducting film circuit layer, a first conductive circuit layer and a first substrate isolating insulating layer are arranged above the stainless steel substrate supporting layer from far to near, and a MiniLED light emitting device, a second conductive circuit layer and a second substrate isolating insulating layer are arranged below the stainless steel substrate supporting layer from far to near; the first conductive circuit layer is provided with a key conducting circuit, and the second conductive circuit layer is provided with a MiniLED control circuit.
3. The printed circuit board of claim 2, wherein,
further comprises: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, and the corresponding conductive circuit layer is also formed by two layers;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually join in proper order and form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, miniLED light emitting device sets up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: the stainless steel substrate supporting layer is provided with a keyboard key conducting film circuit layer, a MiniLED light-emitting device, a second conductive circuit layer, a second substrate isolating insulating layer, a first conductive circuit layer and a first substrate isolating insulating layer from far to near, wherein the second conductive circuit layer is provided with a MiniLED control circuit, and the first conductive circuit layer is provided with a key conducting circuit.
4. The printed circuit board of claim 2, wherein,
further comprises: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, and the corresponding conductive circuit layer is also formed by two layers;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually join in proper order and form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, miniLED light emitting device sets up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: the stainless steel substrate supporting layer is provided with a keyboard key conducting film circuit layer, a second conductive circuit layer, a second substrate isolating insulating layer, a MiniLED light emitting device, a first conductive circuit layer and a first substrate isolating insulating layer from far to near, wherein the first conductive circuit layer is provided with a MiniLED control circuit, and the second conductive circuit layer is provided with a key conducting circuit.
5. The printed circuit board of claim 2, wherein,
further comprises: the keyboard key is communicated with the thin film circuit layer; the substrate isolating insulating layer is formed by two layers, and the corresponding conductive circuit layer is also formed by two layers; the MiniLED light-emitting devices are arranged on different conductive circuit layers respectively;
stainless steel substrate supporting layer, substrate isolation insulating layer and conductive line layer mutually join in proper order and form an integral type structure, wherein, be provided with MiniLED control circuit and button on the conductive line layer, miniLED light emitting device sets up the position of predetermineeing on the MiniLED control circuit of conductive line layer, specifically means: a keyboard key conducting film circuit layer, a first MiniLED light-emitting device, a first conductive circuit layer and a first substrate isolation insulating layer are arranged above the stainless steel substrate supporting layer from far to near, and a second MiniLED light-emitting device, a second conductive circuit layer and a second substrate isolation insulating layer are arranged below the stainless steel substrate supporting layer from far to near; the first conductive circuit layer is provided with a key-on circuit and a MiniLED control circuit for controlling the first MiniLED light-emitting device, and the second conductive circuit layer is provided with a MiniLED control circuit for controlling the second MiniLED light-emitting device.
6. The printed circuit board according to any of claims 2 to 5, wherein,
further comprises: the stainless steel substrate supporting layer is provided with a first key cap key core structure mounting hole site; the substrate isolation insulating layer is connected with the stainless steel substrate supporting layer, the stainless steel substrate supporting layer is provided with a corresponding position of the first key cap key core structure installation hole site, the substrate isolation insulating layer is provided with a second key cap key core structure installation hole site, the size of the second key cap key core structure installation hole site is smaller than or equal to that of the first key cap key core structure installation hole site, and a straight line formed by connecting the center of the second key cap key core structure installation hole site and the center of the first key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer.
7. The printed circuit board of claim 6, wherein the printed circuit board is,
further comprises: the conductive circuit layer is also provided with a third key cap key core structure installation hole site, the conductive circuit layer is jointed with the substrate isolation insulating layer, the substrate isolation insulating layer is provided with a corresponding position of the second key cap key core structure installation hole site, the conductive circuit layer is provided with a third key cap key core structure installation hole site, the size of the third key cap key core structure installation hole site is larger than or equal to that of the first key cap key core structure installation hole site, and a straight line formed by connecting the center of the third key cap key core structure installation hole site and the center of the first key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer; the MiniLED light-emitting device is arranged at a preset position on a MiniLED control circuit of the conductive circuit layer in an attaching and welding mode.
8. The printed circuit board of claim 7, wherein the printed circuit board is,
further comprises: the keyboard key conducting film circuit layer is provided with a fourth key cap key core structure mounting hole site and a key conducting contact, and the key conducting contact is arranged outside the position of the fourth key cap key core structure mounting hole site on the keyboard key conducting film circuit layer; the keyboard key conduction film circuit layer is connected with the conductive circuit layer, a corresponding position of a third key cap key core structure installation hole site is arranged on the conductive circuit layer, the keyboard key conduction film circuit layer is provided with a fourth key cap key core structure installation hole site, and a straight line formed by connecting the center of the fourth key cap key core structure installation hole site and the center of the third key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer.
9. The printed circuit board of claim 8, wherein the printed circuit board is,
further comprises: the substrate isolation insulating layer is an insulating composite material with the temperature resistance of more than 230 ℃ and low dielectric constant, and the insulating composite material comprises: TPI, TPU or PA, the thickness of the substrate isolating insulation layer is 5 μm to 50 μm.
10. The printed circuit board of claim 9, wherein the printed circuit board is,
further comprises: the materials of the conductive circuit layer comprise: the thickness of the conductive circuit layer is 3-10 μm, which is a conductive metal material of copper foil, aluminum foil, tin foil or silver foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311214606.0A CN117156664A (en) | 2023-09-19 | 2023-09-19 | Printed circuit board based on stainless steel substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311214606.0A CN117156664A (en) | 2023-09-19 | 2023-09-19 | Printed circuit board based on stainless steel substrate |
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| Publication Number | Publication Date |
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| CN117156664A true CN117156664A (en) | 2023-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311214606.0A Pending CN117156664A (en) | 2023-09-19 | 2023-09-19 | Printed circuit board based on stainless steel substrate |
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| Country | Link |
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| CN (1) | CN117156664A (en) |
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2023
- 2023-09-19 CN CN202311214606.0A patent/CN117156664A/en active Pending
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