CN219936911U - Double-layer pressure sensitive film printed keyboard circuit board - Google Patents
Double-layer pressure sensitive film printed keyboard circuit board Download PDFInfo
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- CN219936911U CN219936911U CN202321215068.2U CN202321215068U CN219936911U CN 219936911 U CN219936911 U CN 219936911U CN 202321215068 U CN202321215068 U CN 202321215068U CN 219936911 U CN219936911 U CN 219936911U
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- 238000003825 pressing Methods 0.000 claims abstract description 46
- 239000010410 layer Substances 0.000 claims description 161
- 239000010408 film Substances 0.000 claims description 96
- 239000010409 thin film Substances 0.000 claims description 13
- 239000002966 varnish Substances 0.000 claims description 11
- 239000002355 dual-layer Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 229920002799 BoPET Polymers 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 18
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 230000006872 improvement Effects 0.000 abstract description 4
- 230000008859 change Effects 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 8
- 238000004080 punching Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000011990 functional testing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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Abstract
The utility model discloses a double-layer pressure-sensitive film printed keyboard circuit board, which comprises a circuit board body and a pressing key cap, wherein the circuit board body is provided with a plurality of grooves; the circuit board body comprises a lower insulating film layer and an upper insulating film layer; the upper surface of the lower insulating film layer is printed with a main circuit layer and a secondary circuit layer which are separated from each other; the upper insulating film layer is provided with a pressing part, the bottom surface of the pressing part is printed with a pressure-sensitive ink layer, and the pressure-sensitive ink layer is positioned above the first contact part and the second contact part. Through printing the pressure sensitive ink layer on the portion of supporting of last insulating film layer, when the portion of supporting is pressed, utilize the pressure sensitive ink lamination to support on first contact portion and second contact portion to according to the size of pressure automatic change impedance, not only can switch on the circuit, can also control the circuit current, its simple structure has effectively reduced the holistic cost of manufacture of product, and production efficiency has also obtained the improvement greatly, more is favorable to the promotion of product market competition.
Description
Technical Field
The utility model relates to the technical field of keyboard circuit boards, in particular to a double-layer pressure-sensitive film printed keyboard circuit board.
Background
The keyboard is the most commonly used and main input device, and english letters, chinese characters, numerals, punctuation marks and the like can be input into a computer through the keyboard, so that commands, input data and the like can be sent to the computer. There are also keyboards with various shortcuts. Over time, independent products with various shortcut functions are sold separately in the market, and special driving and setting software is provided, so that personalized operation can be realized on a compatible machine.
The keyboard circuit board is a control core of the whole keyboard, is positioned in the keyboard and mainly serves as a key scanning identification, coding and transmission interface. Along with the continuous development of technology, the keyboard circuit board is developed into a thin film soft board from the original hard board, and the thickness of the thin film soft board is thinner, so that the thickness of the keyboard is greatly reduced, and convenience is brought to use.
In the prior art, the film printed keyboard circuit board mainly has two structures:
the main structure of the first film printed keyboard circuit board comprises an upper circuit, a lower circuit and an insulating spacer, wherein the upper circuit comprises an upper film and an upper circuit layer formed on the lower surface of the upper film, the lower circuit comprises a lower film and a lower circuit layer formed on the upper surface of the lower film, the insulating spacer is clamped between the upper circuit layer and the lower circuit layer, a through hole is formed in the insulating spacer, a pressing key cap is arranged on the upper film, and the upper circuit layer is pressed downwards through the through hole to be connected with the lower circuit layer in a conducting manner by pressing the upper film. The film printed keyboard circuit board with the structure is formed by combining three layers of structures, the structure is complex, each layer of structure is required to be provided with a group of steel molds, 3 times of punching are required, at least three pieces of equipment are required to be used, materials are consumed, the equipment use amount is large, the process is long, the three pieces of equipment are required to be combined together after punching, the problems of group deviation and the like are required to be paid attention to during combination, and after combination test, a key cap is required to be adhered and pressed, if the group deviation occurs, the load of the key cap is possibly influenced, so that the keyboard is subjected to the doubt about heavy pressure during use, and the product quality cannot be ensured.
The second type of film printed keyboard circuit board is single-layer structure, it sets up main line and auxiliary line with the film on, main line and auxiliary line have first contact portion and second contact portion respectively, and set up the electric conductor on pressing the key cap, the electric conductor is located the top of first contact portion and second contact portion, utilize the electric conductor to push down along with pressing the key cap and contact with first contact portion and second contact portion, thereby realize switching on, the film printed keyboard circuit board of this kind of structure can solve the problem that above-mentioned first type of film printed keyboard circuit board exists well, however, this kind of mode cost of manufacture that sets up the electric conductor on pressing the key cap is higher, and production efficiency is low, be unfavorable for the promotion of product market competition.
In addition, the current film printed keyboard circuit board adopts a light guide or backlight module, the modes all use FPC, the main materials of the FPC are copper foils, and etching and electroplating processes are used in the production process, so that the film printed keyboard circuit board is relatively not environment-friendly.
Therefore, there is a need for improvements to the current thin film printed keyboard wiring boards.
Disclosure of Invention
In view of the above, the present utility model aims at overcoming the drawbacks of the prior art, and its primary objective is to provide a dual-layer pressure-sensitive thin-film printed keyboard circuit board, which can effectively solve the problems of high manufacturing cost and low efficiency of the existing thin-film printed keyboard circuit board.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
a double-layer pressure-sensitive film printed keyboard circuit board comprises a circuit board body and a pressing key cap; the circuit board body comprises a lower insulating film layer and an upper insulating film layer; the upper surface of the lower insulating film layer is printed with a main circuit layer and a secondary circuit layer which are separated from each other, the main circuit layer is provided with a first contact part, the secondary circuit layer is provided with a second contact part, and the second contact part is positioned beside the first contact part; the upper insulating film layer is positioned right above the lower insulating film layer; the pressing key cap is adhered and fixed on the upper surface of the circuit board body and is provided with an elastic pressing part capable of moving up and down; the upper insulating film layer is provided with a pressing part, the pressing part is arranged under the elastic pressing part, the bottom surface of the pressing part is printed with a pressure-sensitive ink layer, the pressure-sensitive ink layer is arranged above the first contact part and the second contact part, and under the action of the pressing part, the pressure-sensitive ink layer is pressed against the first contact part and the second contact part.
As a preferable scheme, the upper surface of the upper insulating film layer is printed with an LED circuit layer, and an LED lamp is bonded and welded on the LED circuit layer to realize a light-emitting function.
As a preferred scheme, the LED circuit layer is positioned at the inner side or the outer side of the pressing key cap.
As a preferable scheme, the upper surface of the lower insulating film layer is printed with an upper insulating varnish layer which is clamped between the lower insulating film layer and the upper insulating film layer, and the upper insulating varnish layer is positioned at the periphery of the main circuit layer and the auxiliary circuit layer so as to achieve a good insulating effect.
As a preferable scheme, the lower surface of the lower insulating film layer is printed with a lower insulating gloss oil layer so as to achieve a good insulating effect.
As a preferable scheme, the lower insulating film layer and the upper insulating film layer are made of PET film materials, and are durable and durable.
As a preferable mode, the main circuit layer and the auxiliary circuit layer are both silver circuits or carbon circuits, and the electric conductivity is excellent.
As a preferable scheme, the pressing key cap is made of rubber, and has good elasticity, so that the hand feeling is better.
As a preferable scheme, the pressure-sensitive ink layer has a dot structure.
Compared with the prior art, the utility model has obvious advantages and beneficial effects, and in particular, the technical scheme can be as follows:
1. through printing the pressure sensitive ink layer on the portion of supporting of last insulating film layer, when the portion of supporting is pressed, utilize the pressure sensitive ink lamination to support on first contact portion and second contact portion to according to the size of pressure automatic change impedance, not only can switch on the circuit, can also control the circuit current, its simple structure has effectively reduced the holistic cost of manufacture of product, and production efficiency has also obtained the improvement greatly, more is favorable to the promotion of product market competition.
2. The LED circuit layer is printed on the upper surface of the upper insulating film layer, the LED lamp is bonded and welded on the upper surface of the upper insulating film layer in a matched manner, the traditional light guide or backlight module is replaced, the FPC is not required, etching and electroplating processes are not required in the production process, the process is more environment-friendly, the process is simpler, and the cost is lower.
In order to more clearly illustrate the structural features and efficacy of the present utility model, the present utility model will be described in detail below with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a schematic cross-sectional view of a preferred embodiment of the present utility model;
FIG. 2 is a graph of impedance versus load for a pressure sensitive ink in accordance with a preferred embodiment of the present utility model.
The attached drawings are used for identifying and describing:
10. circuit board body 11, lower insulating film layer
12. Upper insulating film 121, pressing part
13. Main circuit layer 131, first contact portion
14. Secondary wiring layer 141, second contact portion
15. Pressure sensitive ink layer 16, upper insulating varnish layer
17. Lower insulating gloss oil layer 18, LED circuit layer
20. Pressing key cap 21 and elastic pressing part
30. An LED lamp.
Detailed Description
Referring to fig. 1, a specific structure of a circuit board of a dual-layer pressure-sensitive film printed keyboard according to a preferred embodiment of the utility model is shown, which comprises a circuit board body 10 and a pressing key cap 20.
The circuit board body 10 comprises a lower insulating film layer 11 and an upper insulating film layer 12; the upper surface of the lower insulating film layer 11 is printed with a main line layer 13 and a sub line layer 14 which are separated from each other, the main line layer 13 having a first contact portion 131, the sub line layer 14 having a second contact portion 141, the second contact portion 141 being located laterally of the first contact portion 131; the upper insulating film layer 12 is located right above the lower insulating film layer 11; the upper insulating film layer 12 has a pressing portion 121, the bottom surface of the pressing portion 121 is printed with a pressure sensitive ink layer 15, the pressure sensitive ink layer 15 is located above the first contact portion 131 and the second contact portion 141, and under the action of the pressing portion 121, the pressure sensitive ink layer 15 presses against the first contact portion 131 and the second contact portion 141. In the embodiment, the lower insulating film 11 and the upper insulating film 12 are made of PET film, and the thickness thereof is 0.075mm, but not limited thereto, and can be set according to the actual needs of the clients. The main wiring layer 13 and the sub wiring layer 14 are silver wiring or carbon wiring. The upper surface of the lower insulating film layer 11 is printed with an upper insulating varnish layer 16, the upper insulating varnish layer 16 is sandwiched between the lower insulating film layer 11 and the upper insulating film layer 12, the upper insulating varnish layer 16 is located at the periphery of the main circuit layer 13 and the auxiliary circuit layer 14 to achieve good insulation, and the thickness of the upper insulating varnish layer 16 is 13-17 μm, which is not limited to a limitation, and can be set according to the actual needs of customers. The lower surface of the lower insulating film 11 is printed with a lower insulating varnish layer 17, and the thickness of the lower insulating varnish layer 17 is 13-17 μm, which is not limited to a specific one and can be set according to the actual needs of customers. The pressure sensitive ink layer 15 has a dot structure, the diameter of which is 4.5mm, and the thickness of which is 16-18 μm, but not limited thereto, and can be set according to the actual needs of customers.
The pressing key cap 20 is adhered to the upper surface of the circuit board body 10, the pressing key cap 20 has an elastic pressing portion 21 capable of moving up and down, the pressing portion 121 is located directly below the elastic pressing portion 21, and the elastic pressing portion 21 is used for exerting a force on the pressing portion 121. In this embodiment, the pressing key cap 20 is made of rubber, so that the elasticity is good and the hand feeling is better.
In addition, the upper surface of the upper insulating film layer 12 is printed with an LED circuit layer 18, and the LED lamp 30 is bonded and welded on the LED circuit layer 18 to realize a light emitting function, and the LED circuit layer 18 is located inside or outside the pressing key cap 20, which is not limited, and the positions and sizes of the LED circuit layer 18 and the LED lamp 30 and the number of single group requirements can be adjusted according to the structural changes of the clients, which is not limited.
The utility model also discloses a preparation process of the double-layer pressure-sensitive film printed keyboard circuit board, which comprises the following steps:
(1) Manufacturing a lower insulating film layer 11:
taking an insulating film for preshrinking, printing a main circuit layer 13 and a secondary circuit layer 14 on the insulating film, printing a first insulating UV layer (not shown in the figure) on the insulating film, and printing a second insulating UV layer (not shown in the figure) so that the second insulating UV layer (not shown in the figure) covers the main circuit layer 13, the secondary circuit layer 14 and the first insulating UV layer; then, printing a jumping line (not shown) on the second insulating UV layer, and then printing an insulating ink layer (not shown); finally, the lower insulating film 11 is obtained by punching the outer shape.
(2) Manufacturing an upper insulating film layer 12:
taking another insulating film for preshrinking, printing the pressure-sensitive ink layer 15 on the other insulating film, printing the LED circuit layer 18, insulating and printing, punching the shape, welding the LED lamp 30 on the LED circuit layer 18 in an SMT (surface mount technology) mode for conducting connection, testing LEDs, and obtaining the upper insulating film layer 12 after the test is qualified.
(3) The upper insulating film layer 12 is put right above the lower insulating film layer 11 and combined together, so that the circuit board body 10 is obtained, and then the circuit board body 10 is subjected to one-time functional test and full inspection.
(4) Pressing the key cap 20 to bond and fix the upper surface of the circuit board body 10, then sequentially performing AOI inspection and secondary function test, and finally inspecting, packaging and warehousing.
The utility model also discloses a preparation process of the double-layer pressure-sensitive film printed keyboard circuit board, which comprises the following steps:
(1) Manufacturing a lower insulating film layer 11:
taking an insulating film, preshrinking, punching the insulating film, printing a main circuit layer 13 and a secondary circuit layer 14 on the insulating film, printing an upper insulating UV layer (not shown) on the upper surface of the insulating film, printing a back circuit layer (not shown) on the lower surface of the insulating film, printing a lower insulating UV layer (not shown) on the lower surface of the insulating film, and finally punching the outline to obtain a lower insulating film layer 11.
(2) Manufacturing an upper insulating film layer 12:
taking another insulating film for preshrinking, printing a pressure-sensitive ink layer 15 on the other insulating film, printing an LED circuit layer 18, insulating printing, punching, welding an LED lamp 30 on the LED circuit layer 18 in an SMT mode for conducting connection, testing LEDs, and obtaining an upper insulating film layer 12 after the test is qualified
(3) The upper insulating film layer 12 is put right above the lower insulating film layer 11 and combined together, so that the circuit board body 10 is obtained, and then the circuit board body 10 is subjected to one-time functional test and full inspection.
(4) Pressing the key cap 20 to bond and fix the upper surface of the circuit board body 10, then sequentially performing AOI inspection and secondary function test, and finally inspecting, packaging and warehousing.
The thickness of the prepared double-layer pressure-sensitive film printed keyboard circuit board is thinner, the thinnest thickness is only 0.15mm, when the double-layer pressure-sensitive film printed keyboard circuit board is applied to a keyboard, the double-layer pressure-sensitive film printed keyboard circuit board can timely react to achieve millisecond-level reaction, can be designed to be waterproof, can be used at the temperature of minus 40 ℃ to 90 ℃, has strong weather resistance, can pass a 60g weight 1000 ten-thousand-stroke life test, and has good durability. The product can be used for keyboards, even game keyboards or notebooks, can be distributed on each key on the keyboards by using an IC program, and can display different impedances by using different weights to express different functions, and is shown in the following table and figure 2, namely an impedance and load comparison table and a graph when pressure-sensitive ink is pressed.
| Load (g) | 60 | 100 | 200 | 300 | 400 | 500 | 1000 | 2000 |
| Impedance (omega) | 303 | 296 | 290 | 285 | 281 | 278 | 275 | 275 |
As can be seen from the comparison table and the graph, when no pressure is applied, the product is completely in an open state, and after the trigger is conducted, the larger the applied force is, the lower the loop resistance is, and the characteristics of the product structures of the desktop computer keyboard and the notebook computer keyboard are completely met.
The design focus of the utility model is that: firstly, through printing the pressure sensitive ink layer on the pressure part of the upper insulating film layer, when the pressure part is pressed, the pressure sensitive ink layer is pressed on the first contact part and the second contact part, and the impedance is automatically changed according to the pressure, so that a circuit can be conducted, the circuit current can be controlled, the structure is simple, the whole manufacturing cost of a product is effectively reduced, the production efficiency is greatly improved, and the improvement of the market competitiveness of the product is facilitated. Secondly, through being formed with the LED circuit layer on the upper surface printing of last insulating film layer to the laminating welding has the LED lamp on the cooperation LED circuit layer, has replaced traditional leaded light or backlight unit, need not to use FPC, need not to carry out etching and electroplating process in the production process, more environmental protection, the technology is also simpler, and the cost is also lower more.
The foregoing description is only a preferred embodiment of the present utility model, and is not intended to limit the technical scope of the present utility model, so any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present utility model are still within the scope of the technical solutions of the present utility model.
Claims (9)
1. A double-layer pressure-sensitive film printed keyboard circuit board comprises a circuit board body and a pressing key cap; the circuit board body comprises a lower insulating film layer and an upper insulating film layer; the upper surface of the lower insulating film layer is printed with a main circuit layer and a secondary circuit layer which are separated from each other, the main circuit layer is provided with a first contact part, the secondary circuit layer is provided with a second contact part, and the second contact part is positioned beside the first contact part; the upper insulating film layer is positioned right above the lower insulating film layer; the pressing key cap is adhered and fixed on the upper surface of the circuit board body and is provided with an elastic pressing part capable of moving up and down; the method is characterized in that: the upper insulating film layer is provided with a pressing part, the pressing part is arranged under the elastic pressing part, the bottom surface of the pressing part is printed with a pressure-sensitive ink layer, the pressure-sensitive ink layer is arranged above the first contact part and the second contact part, and under the action of the pressing part, the pressure-sensitive ink layer is pressed against the first contact part and the second contact part.
2. The dual-layer pressure-sensitive thin-film printed keyboard circuit board of claim 1, wherein: the upper surface of the upper insulating film layer is printed with an LED circuit layer, and an LED lamp is bonded and welded on the LED circuit layer.
3. The dual-layer pressure-sensitive thin-film printed keyboard circuit board of claim 2, wherein: the LED circuit layer is positioned beside the inner side or the outer side of the pressing key cap.
4. The dual-layer pressure-sensitive thin-film printed keyboard circuit board of claim 1, wherein: the upper surface of the lower insulating film layer is printed with an upper insulating varnish layer which is clamped between the lower insulating film layer and the upper insulating film layer, and the upper insulating varnish layer is positioned at the periphery of the main circuit layer and the auxiliary circuit layer.
5. The dual-layer pressure-sensitive thin-film printed keyboard circuit board of claim 1, wherein: and a lower insulating gloss oil layer is printed on the lower surface of the lower insulating film layer.
6. The dual-layer pressure-sensitive thin-film printed keyboard circuit board of claim 1, wherein: the lower insulating film layer and the upper insulating film layer are made of PET film.
7. The dual-layer pressure-sensitive thin-film printed keyboard circuit board of claim 1, wherein: the main circuit layer and the auxiliary circuit layer are both silver circuits or carbon circuits.
8. The dual-layer pressure-sensitive thin-film printed keyboard circuit board of claim 1, wherein: the pressing key cap is made of rubber.
9. The dual-layer pressure-sensitive thin-film printed keyboard circuit board of claim 1, wherein: the pressure sensitive ink layer is in a dot structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321215068.2U CN219936911U (en) | 2023-05-18 | 2023-05-18 | Double-layer pressure sensitive film printed keyboard circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321215068.2U CN219936911U (en) | 2023-05-18 | 2023-05-18 | Double-layer pressure sensitive film printed keyboard circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219936911U true CN219936911U (en) | 2023-10-31 |
Family
ID=88493583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321215068.2U Active CN219936911U (en) | 2023-05-18 | 2023-05-18 | Double-layer pressure sensitive film printed keyboard circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219936911U (en) |
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2023
- 2023-05-18 CN CN202321215068.2U patent/CN219936911U/en active Active
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