CN117153733A - Independent scheduling method for process chambers - Google Patents
Independent scheduling method for process chambers Download PDFInfo
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- CN117153733A CN117153733A CN202311223752.XA CN202311223752A CN117153733A CN 117153733 A CN117153733 A CN 117153733A CN 202311223752 A CN202311223752 A CN 202311223752A CN 117153733 A CN117153733 A CN 117153733A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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Abstract
The application discloses an independent scheduling method of a process chamber, which comprises the following steps: map scanning is carried out on the wafer boxes to obtain the number of wafers, each wafer transmission route and process tasks existing in the wafer boxes; obtaining a process chamber into which each wafer enters according to a wafer transmission route and a process task, and then sequentially sending the wafer ID and the process task to a scheduling of the corresponding process chamber; forming a task pool through scheduling of the process chamber; each process chamber prepares corresponding execution conditions in advance according to process tasks; comparing the current process task carried by the current wafer with the current process task of the process chamber task pool, and if the current process task carried by the current wafer is the same as the current process task of the process chamber task pool, allowing the current wafer to enter the process chamber; after a plurality of wafers entering the process chamber execute the same process task, deleting the process task from the task pool, and preparing corresponding execution conditions for the next task in advance by the process chamber. In the method, the process chamber is prepared in advance for relevant execution conditions of the process and has a verification function.
Description
Technical Field
The application relates to the technical field of wafer transmission, in particular to an independent scheduling method for a process chamber.
Background
The existing wafer scheduling logic performs map searching and matching operation once when the wafer box is opened, so that the number of wafers in the wafer box, the transmission route and the process of each wafer can be obtained; therefore, when the atmospheric mechanical arm takes out a wafer from the wafer box, the wafer is determined to be placed in the upper layer LoadLock or the lower layer LoadLock according to the wafer transmission route and the process, and then the vacuum mechanical arm firstly reads information carried on the wafer from the upper layer LoadLock or the lower layer LoadLock, judges which process chamber is transmitted to, and only reads the wafer information when entering the corresponding process chamber to acquire a specific process, so that the process chamber acquires the information carried by the wafer with hysteresis, whether the current wafer is the wafer to be operated in the process cannot be verified, the related execution condition of the corresponding process cannot be prepared in advance, and the working efficiency is low.
Disclosure of Invention
The application aims to provide an independent scheduling method for a process chamber, wherein the process chamber can acquire the process executed by the current wafer in advance, can prepare related execution conditions of the process in advance, and can immediately execute the wafer-withdrawing operation if the current wafer is inconsistent with the corresponding execution process, thereby having a verification function.
In order to achieve the above object, the method for independently scheduling process chambers according to the present application includes:
map scanning is carried out on the wafer boxes to obtain the number of wafers, each wafer transmission route and process tasks existing in the wafer boxes;
obtaining a process chamber into which each wafer enters according to a wafer transmission route and a process task, and then sequentially sending the wafer ID and the process task to a scheduling of the corresponding process chamber;
forming a task pool through scheduling of the process chamber, and obtaining process tasks of the process chamber based on the task pool;
each process chamber prepares corresponding execution conditions in advance according to process tasks;
comparing the current process task carried by the current wafer with the current process task of the process chamber task pool, and if the current process task carried by the current wafer is the same as the current process task of the process chamber task pool, allowing the current wafer to enter the process chamber; if the two types are different, alarming is carried out;
after a plurality of wafers entering the process chamber execute the same process task, deleting the process task from the task pool, and preparing corresponding execution conditions for the next task in advance by the process chamber.
Preferably, the process chamber is provided with 4 stations, and the process task is in a 2×2station operation mode or a 4×1station operation mode.
Under the preferred mode, the execution condition is that the lifting structure can normally lift, the lifting rotary shipper can normally work, and if the lifting structure or the lifting rotary shipper fails, an alarm is directly given; if the lifting structure or the lifting rotary shipper has no faults, preheating the process chamber, and when preheating is about to be completed, preparing to receive the wafer entering the process chamber, wherein the lifting structure is in a falling state at the moment, and the pressure of the chamber can be transmitted.
Under the preferred mode, preparing corresponding execution conditions in advance, simultaneously taking the wafer from the wafer box by the atmospheric mechanical arm, sending the wafer into the LoadLock, and then taking the wafer from the LoadLock by the vacuum mechanical arm, and preparing to send the wafer into a corresponding process chamber; the process tasks carried by the current wafer are compared with the current process tasks of the process chamber task pool prior to being fed.
In the preferred mode, if the current process task carried by the current wafer is the same as the current process task of the process chamber task pool, the vacuum mechanical arm enters through one bin gate or two bin gate structures of the process chamber, the lifting structure is lifted at the moment and used for supporting the wafer, and then the vacuum mechanical arm exits the lifting structure and falls down, so that the wafer is positioned on the heater, and the bin gate is closed.
Preferably, if the process task is in a 2×2station operation mode, the specific implementation manner is as follows: the wafer 1 and the wafer 2 are located on the heater and then are directly subjected to first deposition, the lifting rotary shipper ascends after the first deposition is finished, the wafer is lifted to rotate 180 degrees clockwise and then descends, and the wafer 1 and the wafer 2 are located on a new heater; the vacuum mechanical arm feeds the No. 3 wafer and the No. 4 wafer into the process chamber, and is located on the original heater, at the moment, the No. 1 wafer and the No. 2 wafer are subjected to second deposition, the No. 3 wafer and the No. 4 wafer are subjected to first deposition, the lifting rotary conveyor ascends after deposition, the lifting wafer is lifted to rotate 180 degrees clockwise and descends, and then the No. 1 wafer and the No. 2 wafer are taken out by the vacuum mechanical arm, put into the No. 5 wafer and the No. 6 wafer to be subjected to deposition, and the cycle is performed.
Preferably, if the process task is in a 4×1station operation mode, the specific implementation manner is as follows: the wafer 1 and the wafer 2 are located on the heater, the lifting rotary shipper ascends, and the wafer is lifted to rotate 180 degrees clockwise and then descends, and the wafer 1 and the wafer 2 are located on the new heater; the vacuum mechanical arm feeds the No. 3 wafer and the No. 4 wafer into the process chamber, and is located on the original heater, at the moment, the No. 4 wafers are all deposited for the first time, the vacuum mechanical arm takes out the No. 3 wafer and the No. 4 wafer after the first time deposition is finished, the No. 5 wafer and the No. 6 wafer are put into the vacuum mechanical arm, the lifting rotary conveyor ascends to lift the wafer to rotate 180 degrees clockwise and then descends, the No. 1 wafer and the No. 2 wafer are taken out by the vacuum mechanical arm, and the No. 7 wafer and the No. 8 wafer are put into the vacuum mechanical arm, so that circulation is performed.
Preferably, the lifting structure includes: a thimble component and a driving component; the thimble component is positioned in the reaction cavity, and the driving component can drive the thimble component to lift; the driving part includes: the device comprises a mounting shell, a servo motor, a coupler, a nut, a lead screw and a push rod assembly; the installation shell is a hollow cavity with two vertical ends open, and is vertically and fixedly arranged below the reaction cavity; the servo motor is vertically and fixedly arranged at the lower end of the installation shell, the coupler, the screw rod and the nut are arranged in the installation shell, the servo motor drives the screw rod to synchronously rotate through the coupler, the screw rod is vertically arranged at the axis position of the installation shell, and the screw rod and the nut are in screw transmission; the nut is connected with the push rod assembly, the push rod assembly penetrates into the reaction cavity from the lower part of the reaction cavity and then is connected with the thimble component, the nut drives the push rod assembly to vertically move, and the push rod assembly drives the thimble component to vertically move.
Preferably, the push rod assembly comprises: a push rod seat and a push rod; the push rod seat is a hollow cavity with an opening at the lower end, the lower end of the push rod seat is fixedly connected with the nut, the screw rod extends into the cavity of the push rod seat, and the push rod seat vertically moves along with the nut; the push rod is coaxially arranged with the screw rod, one end of the push rod is fixedly connected with the upper end of the push rod seat, and the other end of the push rod penetrates through the reaction cavity and is fixedly connected with the thimble component.
Preferably, the driving part further comprises a guide assembly; the guide assembly is arranged between the push rod seat and the inner wall of the installation shell, and the guide assembly vertically guides and radially limits the push rod assembly.
Preferably, the guide assembly includes: a guide rail and a slider; the guide rail is fixedly arranged on the inner wall of the installation shell, and the length direction of the guide rail is vertically arranged; the sliding block is arranged on the guide rail and slides along the guide rail, and the sliding block is fixedly connected with the push rod seat.
Compared with the prior art, the technical scheme adopted by the application has the advantages that:
1. the process chamber can predict the next process task in advance, so that corresponding execution conditions are prepared in advance, the process chamber does not need to wait for wafers to enter and then prepare the execution conditions, the working efficiency is greatly improved, and the time is saved;
2. when the wafer is transferred to the process chamber, the wafer can be compared with the task information of the task pool of the process chamber according to the information carried by the wafer, so that a verification effect is achieved;
3. the lifting structure is arranged in the installation shell through the coupler, the nut and the screw rod, the push rod assembly is connected with the nut in the installation shell, the space in the installation shell is fully utilized, the compactness of the driving part is enhanced, the space occupied by the driving part is reduced, the size of the lifting structure is reduced, and the size requirement of the carrying equipment on the control equipment can be met. The lifting structure enables force to be transferred along the axial direction through coaxially arranging the servo motor, the lead screw and the push rod, and is beneficial to improving the precision of vertical movement of the ejector pin.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a block diagram of a process chamber independent scheduling method;
FIG. 2 is a schematic diagram of a 2×2station operating mode;
FIG. 3 is a schematic diagram of a 4×1station operating mode;
FIG. 4 is a schematic structural view of a lifting structure;
FIG. 5 is a cross-sectional view of a lifting structure;
FIG. 6 is a schematic view of a thimble assembly of the lifting structure;
FIG. 7 is a top view of the ejector pin assembly of the lifting structure;
FIG. 8 is a cross-sectional view A-A of FIG. 7;
FIG. 9 is an enlarged view of part of II in FIG. 8;
fig. 10 is an enlarged view of part of i in fig. 6.
1. A thimble component; 11. a thimble assembly; 111. a thimble; 112. a thimble installation seat; 1121. a horn section; 1122. a cylindrical section; 113. a connecting seat; 1131. a cylindrical section; 1132. a circular ring section; 12. a mounting ring; 121. a circular rectangular groove; 122. a U-shaped compression ring;
2. a driving part; 21. a mounting shell; 22. a servo motor; 23. a coupling; 24. a nut; 241. a positioning stage; 242. a connection section; 25. a screw rod; 26. a push rod assembly; 261. a push rod seat; 262. a push rod; 27. a guide assembly; 271. a guide rail; 272. a sliding block.
Detailed description of the preferred embodiments
The principles of the present disclosure will be described below with reference to several example embodiments shown in the drawings. While the preferred embodiments of the present disclosure are illustrated in the drawings, it should be understood that these embodiments are merely provided to enable those skilled in the art to better understand and practice the present disclosure and are not intended to limit the scope of the present disclosure in any way.
The term "comprising" and variations thereof as used herein means open ended, i.e., "including but not limited to. The term "or" means "and/or" unless specifically stated otherwise. The term "based on" means "based at least in part on". The terms "one example embodiment" and "one embodiment" mean "at least one example embodiment. The term "another embodiment" means "at least one additional embodiment".
Example 1
As shown in fig. 1, the embodiment provides a method for independently scheduling a process chamber, which includes:
s1, carrying out map scanning on a wafer box to obtain the number of wafers in the wafer box, each wafer transmission route and process tasks;
specifically, the outermost loading table loads the wafer cassettes, and map searching operation is performed on the wafer cassettes to obtain the number of wafers, the transmission route of each wafer and the task.
S2, obtaining a process chamber into which each wafer enters according to a wafer transmission route and a process task, and then sequentially sending the wafer ID and the process task to scheduling of the corresponding process chamber;
specifically, in the whole dispatching, each part is independent, rather than waiting for reading information carried by the wafer, the process chamber to be entered is obtained by analyzing the wafer transmission route and the process task, so that the process chamber can acquire task information in advance.
S3, forming a task pool through scheduling of the process chamber, and obtaining process tasks of the process chamber based on the task pool;
specifically, the task pool corresponding to each process chamber is used for queuing tasks, so that the process chamber can execute the process according to the queue each time.
S4, preparing corresponding execution conditions in advance according to the process task by each process chamber;
in an example embodiment, the execution condition is that the lifting structure can be lifted and lowered normally, the lifting rotary shipper can work normally, and if the lifting structure or the lifting rotary shipper fails, an alarm is directly given; if the lifting structure or the lifting rotary shipper has no fault, preheating the process chamber, and when the preheating is about to be completed, preparing to receive the wafer entering the process chamber, wherein the lifting structure is in a falling state at the moment, and the pressure of the chamber can be transmitted;
s5, comparing the process task carried by the current wafer with the current process task of the process chamber task pool, and if the process task carried by the current wafer is the same as the current process task of the process chamber task pool, allowing the current wafer to enter the process chamber; if the two types are different, alarming is carried out;
in an example embodiment, the atmospheric robot takes the wafer from the cassette into LoadLock while preparing the corresponding execution conditions in advance, and then the vacuum robot takes the wafer from LoadLock to prepare for feeding into the corresponding process chamber; the process tasks carried by the current wafer are compared with the current process tasks of the process chamber task pool prior to being fed.
In another embodiment, if the current process task carried by the current wafer is the same as the current process task of the process chamber task pool, the vacuum robot enters through one or two door structures of the process chamber, the lifting structure is lifted at this time to support the wafer, and then the vacuum robot exits the lifting structure to drop, so that the wafer is located on the heater, and the door is closed.
S6, deleting the process task from the task pool after the plurality of wafers entering the process chamber execute the same process task, and preparing corresponding execution conditions for the next task in advance by the process chamber.
In one example embodiment, the process task is a 2×2station operating mode or a 4×1station operating mode.
As shown in fig. 2, the 2×2station operation mode is: the wafer 1 and the wafer 2 are located on the heater and then are directly subjected to first deposition, the lifting rotary shipper ascends after the first deposition is finished, the wafer is lifted to rotate 180 degrees clockwise and then descends, and the wafer 1 and the wafer 2 are located on a new heater; the vacuum mechanical arm feeds the No. 3 wafer and the No. 4 wafer into the process chamber, and is located on the original heater, at the moment, the No. 1 wafer and the No. 2 wafer are subjected to second deposition, the No. 3 wafer and the No. 4 wafer are subjected to first deposition, the lifting rotary conveyor ascends after deposition, the lifting wafer is lifted to rotate 180 degrees clockwise and descends, and then the No. 1 wafer and the No. 2 wafer are taken out by the vacuum mechanical arm, put into the No. 5 wafer and the No. 6 wafer to be subjected to deposition, and the cycle is performed.
As shown in fig. 3, the 4×1station operation mode is: the wafer 1 and the wafer 2 are located on the heater, the lifting rotary shipper ascends, and the wafer is lifted to rotate 180 degrees clockwise and then descends, and the wafer 1 and the wafer 2 are located on the new heater; the vacuum mechanical arm feeds the No. 3 wafer and the No. 4 wafer into the process chamber, and is located on the original heater, at the moment, the No. 4 wafers are all deposited for the first time, the vacuum mechanical arm takes out the No. 3 wafer and the No. 4 wafer after the first time deposition is finished, the No. 5 wafer and the No. 6 wafer are put into the vacuum mechanical arm, the lifting rotary conveyor ascends to lift the wafer to rotate 180 degrees clockwise and then descends, the No. 1 wafer and the No. 2 wafer are taken out by the vacuum mechanical arm, and the No. 7 wafer and the No. 8 wafer are put into the vacuum mechanical arm, so that circulation is performed.
Example 2
The embodiment specifically introduces a lifting structure:
the lifting structure is matched with the vacuum manipulator to finish the picking and placing of the wafer in the process chamber, and the lifting structure comprises: a thimble component 1 and a driving component 2; the thimble component 1 is positioned in the reaction cavity, and the driving component 2 can drive the thimble component 1 to lift; the driving part 2 includes: the installation shell 21, the servo motor 22, the coupler 23, the nut 24, the lead screw 25 and the push rod assembly 26; the installation shell 21 is of a cylindrical structure with a hollow cavity with two vertical ends open, the installation shell 21 is vertically arranged, and the upper end of the installation shell 21 is fixedly arranged on the lower surface of the reaction cavity; the servo motor 22 is vertically and fixedly arranged on the lower end surface of the installation shell 21, the coupler 23, the screw rod 25 and the nut 24 are all arranged in the installation shell 21, the rotating shaft of the servo motor 22 is connected with the screw rod 25 through the coupler 23, the servo motor 22 drives the screw rod 25 to synchronously rotate through the coupler 23, the screw rod 25 is vertically arranged at the axis position of the installation shell 21, the screw rod 25 and the nut 24 are in screw transmission, and the screw rod 25 rotates to drive the nut 24 to vertically move; the nut 24 is connected with the push rod assembly 26, and the bottom of reaction chamber is equipped with the confession push rod assembly 26 of stepping down and penetrates in it from the below of reaction chamber, and push rod assembly 26 links to each other with thimble component 1 in the reaction chamber, and nut 24 drives push rod assembly 26 vertical movement, and push rod assembly 26 drives thimble component 1 vertical movement, realizes the lift of thimble component 1. When the manipulator conveys the wafer to the station, the servo motor 22 is started to enable the thimble component 1 to ascend, the thimble component 1 lifts the wafer off the manipulator, the manipulator is removed, the servo motor 22 acts reversely to enable the thimble component 1 to descend, and the wafer is placed on the station after the thimble component 1 is lower than the station table; when the manipulator takes away the wafer, the servo motor 22 is started to enable the thimble component 1 to ascend, the thimble component 1 lifts the wafer, the manipulator moves to the lower side of the wafer, the servo motor 22 acts reversely to enable the thimble component 1 to descend, after the thimble component 1 is lower than the position of the manipulator, the wafer is placed on the manipulator, and the manipulator moves away to take away the wafer.
As shown in fig. 5, the push rod assembly 26 includes: a push rod seat 261 and a push rod 262; the push rod seat 261 is a hollow cavity with an opening at the lower end, the nut 24 sequentially comprises a positioning stage 241 and a connecting section 242, the connecting section 242 is inserted into the cavity of the push rod seat 261, the connecting section 242 is matched with the cavity of the push rod seat 261, the positioning surface of the positioning stage 241 is abutted against the lower end face of the push rod seat 261, a through hole is arranged on the positioning stage 241, a threaded hole is arranged on the lower end face of the push rod seat 261, the through hole of the positioning stage 241 is aligned with the threaded hole on the lower end face of the push rod seat 261, and the push rod seat 261 is fixedly connected with the nut 24 by arranging a screw in the threaded hole and the through hole; the screw rod 25 passes through the nut 24 and then extends into the cavity of the push rod seat 261, so that the push rod seat 261 and the screw rod 25 are prevented from interfering with each other, the space between the screw rod 25 and the mounting shell 21 is fully utilized, the axial length is reduced, and the push rod seat 261 and the screw rod 25 are more compact; the screw rod 25 rotates to enable the nut 24 to vertically move, and the nut 24 drives the push rod seat 261 to synchronously move; the push rod 262 and the screw rod 25 are coaxially arranged, so that force is transmitted along the axial direction of the push rod 262, and the accuracy of vertical movement is improved; the lower extreme of push rod 262 passes through pin and push rod seat 261's upper end fixed connection, and the upper end of push rod 262 passes the back of stepping down of reaction chamber and is fixed connection with thimble part 1.
Preferably, as shown in conjunction with fig. 4 and 5, the driving part 2 further includes a guide assembly 27, the guide assembly 27 being disposed between the push rod seat 261 and the inner wall of the mounting housing 21, the guide assembly 27 including: a guide rail 271 and a slider 272; the guide rail 271 is fixed on the inner wall of the mounting housing 21 by a screw, and the length direction of the guide rail 271 is vertically arranged; the slider 272 is disposed on the guide rail 271 and vertically slides along the guide rail 271, and the slider 272 is fixedly connected with the push rod seat 261 by a screw. The guide rail 271 and the sliding block 272 act together to guide the push rod seat 261 vertically and limit the push rod seat 261 radially, so that the push rod seat 261 is prevented from shaking, and the precision of vertical movement is affected.
As shown in fig. 4, 5 and 6, the ejector pin assembly 1 includes: a thimble assembly 11 and a mounting ring 12; the three groups of thimble assemblies 11 are arranged on the mounting ring 12, and the three groups of thimble assemblies 11 are arranged in a triangular shape along the same circumferential direction of the mounting ring 12; the push rod 262 is fixed with the mounting ring 12 through the socket head cap screw, and the connection position of the push rod 262 and the mounting ring 12 is positioned between two groups of thimble assemblies 11. The push rod assembly 26 drives the mounting ring 12 to move vertically, and the mounting ring 12 drives the three groups of thimble assemblies 11 to move vertically, so that the three groups of thimble assemblies 11 can lift and put down the wafer.
As shown in connection with fig. 7, 8 and 9, each set of thimble assemblies 11 includes: thimble 111, thimble mount pad 112 and connection pad 113.
Referring to fig. 7, 9 and 10, the connection base 113 is composed of a cylindrical section 1131 and a circular ring section 1132 which are coaxial, wherein the opening of the lower end of the cylindrical section 1131 is consistent with the opening diameter of the circular ring section 1132, and the outer diameter of the circular ring section 1132 is larger than the outer diameter of the cylindrical section 1131; the mounting ring 12 is provided with a circular angle rectangular groove 121 and a U-shaped pressing ring 122, the U-shaped pressing ring 122 is fixedly arranged along the side wall of the circular angle rectangular groove 121, and the U-shaped pressing ring 122 is parallel to and spaced from the bottom surface of the circular angle rectangular groove 121; the opening of the round rectangular groove 121 at one side of the opening of the U-shaped pressure ring 122 is larger than the diameter of the circular ring section 1132, the diameter of the circular ring section 1132 is smaller than the width of the inner side and the outer side of the U-shaped pressure ring 122, and the diameter of the cylindrical section 1131 is smaller than the width of the inner side of the U-shaped pressure ring 122; the circular ring section 1132 enters the circular angle rectangular groove 121 from the position of the opening of the U-shaped pressure ring 122, the circular ring section 1131 is pushed to drive the circular ring section 1132 to move towards the U-shaped pressure ring 122, the upper surface of the circular ring section 1132 is abutted with the lower surface of the U-shaped pressure ring 122, and therefore the connecting seat 113 is fixed on the mounting ring 12; pulling the cylindrical segment 1131 drives the annular segment 1132 away from the U-shaped pressure ring 122, and the annular segment 1132 is separated from the U-shaped pressure ring 122, so that the connecting seat 113 can be taken out from the rounded rectangular groove 121.
The thimble installation seat 112 sequentially comprises a horn section 1121 and a cylindrical section 1122 from top to bottom, the horn section 1121 and the cylindrical section 1122 are coaxial, and a through hole penetrating through the horn section 1121 and the cylindrical section 1122 is formed along the axis.
The horn section 1121 is provided with a slot downwards in a cross shape from an opening at the upper end to the middle part of the length direction of the horn section 1121, so that the upper end of the horn section 1121 is four-lobed, and the upper half part of the horn section 1121 has elasticity; the thimble 111 is long and thin rod-shaped, the outer peripheral surface of the thimble 111 is provided with an annular groove, the inner wall of the horn section 1121 is provided with a bulge, the thimble 111 is vertically inserted into the through hole, and the bulge of the horn section 1121 is clamped into the groove of the thimble 111, so that the thimble 111 and the horn section 1121 are detachably connected.
The upper end opening of the cylinder section 1131 is smaller than the lower end opening, the diameter of the cylinder section 1122 is equal to that of the upper and lower openings of the cylinder section 1131, and the height of the cylinder section 1122 is smaller than that of the cylinder section 1131; the thimble installation seat 112 penetrates through the lower opening of the circular ring section 1132, the cylindrical section 1122 is positioned in the connecting seat 113, one end of the horn section 1121 vertically penetrates out of the upper opening of the connecting seat 113, so that the cylindrical section 1122 is limited in the cavity of the connecting seat 113, and the cylindrical section 1122 can move in the radial direction and the axial direction of the cavity of the connecting seat 113, thereby realizing that the thimble 111 moves along with the cylindrical section 1122; when the thimble 111 receives a radial force, the cylindrical section 1122 may move to weaken the radial force on the thimble 111, thereby avoiding damage to the thimble 111.
As shown in fig. 5, the upper end surface of the push rod 262 is provided with a threaded hole, the threaded hole is positioned between two groups of thimble assemblies 11, the mounting ring 12 is provided with a through hole, a screw is arranged in the threaded hole, and the screw penetrates through the through hole of the mounting ring 12 and then is screwed into the threaded hole to fixedly connect the mounting ring 12 with the push rod assembly 26; the push rod assembly 26 drives the mounting ring 12 to move vertically, and the mounting ring 12 drives the three groups of thimble assemblies 11 to move vertically, so that the three groups of thimble assemblies 11 can lift and put down the wafer.
The principle of the device of the application is as follows:
when the manipulator conveys the wafer to the station, the servo motor 22 is started, the screw rod 25 is driven to rotate through the coupler 23, the screw rod 25 rotates to enable the nut 24 to drive the push rod seat 261 to synchronously move upwards, the push rod seat 261 pushes the push rod 262 to move upwards, the push rod 262 drives the mounting ring 12 to move upwards, the mounting ring 12 enables the three groups of thimble assemblies 11 to synchronously ascend, the three groups of thimble assemblies 11 lift the wafer off the manipulator, the manipulator moves away, the servo motor 22 acts reversely, the coupler 23 drives the screw rod 25 to reversely rotate, the nut 25 moves downwards, the push rod seat 261, the push rod 262, the mounting ring 12 and the three groups of thimble assemblies 11 synchronously move downwards, and the wafer is placed on the station after the thimble 111 is lower than the station table top.
When the manipulator takes away the wafer, the servo motor 22 is started to enable the three groups of thimble assemblies 11 to ascend, and the three groups of thimble assemblies 11 lift the wafer; at this time, the manipulator moves to the lower part of the wafer, the servo motor 22 acts reversely to enable the three groups of thimble assemblies 11 to descend, and after the thimble 111 is lower than the position of the manipulator, the wafer is placed on the manipulator, and the manipulator moves away to realize the removal of the wafer.
The shaft coupling 23, the nut 24 and the screw rod 25 are coaxially arranged in the shell 21, the push rod seat 261 is connected with the nut 24 in the shell 21, the screw rod 25 stretches into the cavity of the push rod seat 261, the axial length is reduced, the guide rail 271 and the sliding block 272 are arranged between the inner wall of the shell 21 and the push rod seat 261, the space between the shell 21 and the screw rod 25 is fully utilized, the compactness of the structure is enhanced, the space occupied by the structure is reduced, the volume of a lifting structure is reduced, and the volume requirement of handling equipment on control equipment can be met.
The above description is only of alternative embodiments of the present disclosure and is not intended to limit the disclosure, and various modifications and variations will be apparent to those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. that fall within the spirit and principles of the present disclosure are intended to be included within the scope of the present disclosure.
Although claims have been formulated in this application to particular combinations of features, it should be understood that the scope of the disclosure also includes any novel feature or any novel combination of features disclosed herein either explicitly or implicitly or any generalisation thereof, whether or not it relates to the same in any claim as presently claimed.
Claims (10)
1. The independent scheduling method of the process chamber is characterized by comprising the following steps:
map scanning is carried out on the wafer boxes to obtain the number of wafers, each wafer transmission route and process tasks existing in the wafer boxes;
obtaining a process chamber into which each wafer enters according to a wafer transmission route and a process task, and then sequentially sending the wafer ID and the process task to a scheduling of the corresponding process chamber;
forming a task pool through scheduling of the process chamber, and obtaining process tasks of the process chamber based on the task pool;
each process chamber prepares corresponding execution conditions in advance according to process tasks;
comparing the current process task carried by the current wafer with the current process task of the process chamber task pool, and if the current process task carried by the current wafer is the same as the current process task of the process chamber task pool, allowing the current wafer to enter the process chamber; if the two types are different, alarming is carried out;
after a plurality of wafers entering the process chamber execute the same process task, deleting the process task from the task pool, and preparing corresponding execution conditions for the next task in advance by the process chamber.
2. The process chamber independent scheduling method of claim 1, wherein the process chamber is provided with 4 stations, and the process task is in a 2 x 2station operating mode or a 4 x 1station operating mode.
3. The method for independent dispatching of process chambers according to claim 1, wherein the execution condition is that a lifting structure can normally lift, a lifting rotary shipper can normally work, and if the lifting structure or the lifting rotary shipper fails, an alarm is directly given; if the lifting structure or the lifting rotary shipper has no faults, preheating the process chamber, and when preheating is about to be completed, preparing to receive the wafer entering the process chamber, wherein the lifting structure is in a falling state at the moment, and the pressure of the chamber can be transmitted.
4. The independent dispatching method of process chambers according to claim 1 or 3, wherein corresponding execution conditions are prepared in advance, and simultaneously, the atmospheric robot takes wafers from the wafer box and sends the wafers into LoadLock, and then the vacuum robot takes wafers from LoadLock and prepares to send the wafers into corresponding process chambers; the process tasks carried by the current wafer are compared with the current process tasks of the process chamber task pool prior to being fed.
5. The method of claim 4, wherein if the current process task carried by the wafer is the same as the current process task of the process chamber task pool, the vacuum robot enters through one or both door structures of the process chamber, the lifting structure is lifted up to support the wafer, and the vacuum robot exits the lifting structure to drop down, so that the wafer is located on the heater, and the door is closed.
6. The process chamber independent scheduling method of claim 2, wherein if the process task is in a 2 x 2station operating mode, the specific implementation is: the wafer 1 and the wafer 2 are located on the heater and then are directly subjected to first deposition, the lifting rotary shipper ascends after the first deposition is finished, the wafer is lifted to rotate 180 degrees clockwise and then descends, and the wafer 1 and the wafer 2 are located on a new heater; the vacuum mechanical arm feeds the No. 3 wafer and the No. 4 wafer into the process chamber, and is located on the original heater, at the moment, the No. 1 wafer and the No. 2 wafer are subjected to second deposition, the No. 3 wafer and the No. 4 wafer are subjected to first deposition, the lifting rotary conveyor ascends after deposition, the lifting wafer is lifted to rotate 180 degrees clockwise and descends, and then the No. 1 wafer and the No. 2 wafer are taken out by the vacuum mechanical arm, put into the No. 5 wafer and the No. 6 wafer to be subjected to deposition, and the cycle is performed.
7. The process chamber independent scheduling method of claim 2, wherein if the process task is in a 4 x 1station operating mode, the specific implementation is: the wafer 1 and the wafer 2 are located on the heater, the lifting rotary shipper ascends, and the wafer is lifted to rotate 180 degrees clockwise and then descends, and the wafer 1 and the wafer 2 are located on the new heater; the vacuum mechanical arm feeds the No. 3 wafer and the No. 4 wafer into the process chamber, and is located on the original heater, at the moment, the No. 4 wafers are all deposited for the first time, the vacuum mechanical arm takes out the No. 3 wafer and the No. 4 wafer after the first time deposition is finished, the No. 5 wafer and the No. 6 wafer are put into the vacuum mechanical arm, the lifting rotary conveyor ascends to lift the wafer to rotate 180 degrees clockwise and then descends, the No. 1 wafer and the No. 2 wafer are taken out by the vacuum mechanical arm, and the No. 7 wafer and the No. 8 wafer are put into the vacuum mechanical arm, so that circulation is performed.
8. The process chamber independent dispatch method of claim 3, wherein the lifting structure comprises: a thimble component and a driving component; the thimble component is positioned in the reaction cavity, and the driving component can drive the thimble component to lift; the driving part includes: the device comprises a mounting shell, a servo motor, a coupler, a nut, a lead screw and a push rod assembly; the installation shell is a hollow cavity with two vertical ends open, and is vertically and fixedly arranged below the reaction cavity; the servo motor is vertically and fixedly arranged at the lower end of the installation shell, the coupler, the screw rod and the nut are arranged in the installation shell, the servo motor drives the screw rod to synchronously rotate through the coupler, the screw rod is vertically arranged at the axis position of the installation shell, and the screw rod and the nut are in screw transmission; the nut is connected with the push rod assembly, the push rod assembly penetrates into the reaction cavity from the lower part of the reaction cavity and then is connected with the thimble component, the nut drives the push rod assembly to vertically move, and the push rod assembly drives the thimble component to vertically move.
9. The process chamber independent scheduling method of claim 8, wherein the pushrod assembly comprises: a push rod seat and a push rod; the push rod seat is a hollow cavity with an opening at the lower end, the lower end of the push rod seat is fixedly connected with the nut, the screw rod extends into the cavity of the push rod seat, and the push rod seat vertically moves along with the nut; the push rod is coaxially arranged with the screw rod, one end of the push rod is fixedly connected with the upper end of the push rod seat, and the other end of the push rod penetrates through the reaction cavity and is fixedly connected with the thimble component.
10. The process chamber independent scheduling method of claim 8, wherein the drive member further comprises a guide assembly; the guide assembly is arranged between the push rod seat and the inner wall of the installation shell, and is used for vertically guiding and radially limiting the push rod assembly; the guide assembly includes: a guide rail and a slider; the guide rail is fixedly arranged on the inner wall of the installation shell, and the length direction of the guide rail is vertically arranged; the sliding block is arranged on the guide rail and slides along the guide rail, and the sliding block is fixedly connected with the push rod seat.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311223752.XA CN117153733A (en) | 2023-09-21 | 2023-09-21 | Independent scheduling method for process chambers |
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| CN202311223752.XA CN117153733A (en) | 2023-09-21 | 2023-09-21 | Independent scheduling method for process chambers |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117612980A (en) * | 2024-01-23 | 2024-02-27 | 天津中科晶禾电子科技有限责任公司 | Wafer bonding device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117612980A (en) * | 2024-01-23 | 2024-02-27 | 天津中科晶禾电子科技有限责任公司 | Wafer bonding device |
| CN117612980B (en) * | 2024-01-23 | 2024-04-02 | 天津中科晶禾电子科技有限责任公司 | Wafer bonding device |
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