CN117135879A - Gas-liquid integrated heat dissipation system of edge data center and operation control method thereof - Google Patents
Gas-liquid integrated heat dissipation system of edge data center and operation control method thereof Download PDFInfo
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- CN117135879A CN117135879A CN202310895117.XA CN202310895117A CN117135879A CN 117135879 A CN117135879 A CN 117135879A CN 202310895117 A CN202310895117 A CN 202310895117A CN 117135879 A CN117135879 A CN 117135879A
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- 239000007788 liquid Substances 0.000 title claims abstract description 227
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 118
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000002826 coolant Substances 0.000 claims abstract description 4
- 238000005086 pumping Methods 0.000 claims abstract description 4
- 230000001105 regulatory effect Effects 0.000 claims description 80
- 238000005507 spraying Methods 0.000 claims description 11
- 238000012544 monitoring process Methods 0.000 claims description 5
- 230000033228 biological regulation Effects 0.000 claims description 4
- 230000018199 S phase Effects 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 238000005057 refrigeration Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 9
- 230000005494 condensation Effects 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20345—Sprayers; Atomizers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses a gas-liquid integrated heat dissipation system of an edge data center and an operation control method thereof, wherein the system comprises a primary gas-liquid heat exchanger, a server integral heat dissipation module and a circulating water pump; the circulating water pump is used for pumping a cooling medium to the primary gas-liquid heat exchanger so as to take away the heat of the whole cabinet of the server; the inlet of the circulating water pump is communicated with the outlet of the integral heat dissipation module of the server, the outlet of the circulating water pump is communicated with the inlet of the primary gas-liquid heat exchanger, and the outlet of the primary gas-liquid heat exchanger is communicated with the inlet of the integral heat dissipation module of the server to form a water circulation unit; the server integral heat dissipation module comprises a secondary gas-liquid heat exchanger, an air supply device in the server and a liquid cooling heat dissipation sub-module. According to the invention, the primary gas-liquid heat exchanger and the integral heat dissipation module of the server are subjected to integrated natural cooling, and the heat of the high-power chip and the low-power device is sequentially carried away through a single cold source, so that mechanical refrigeration is eliminated, and energy is saved.
Description
Technical Field
The invention relates to the technical field of energy conservation and cooling of data centers, in particular to a gas-liquid integrated heat dissipation system of an edge data center and an operation control method thereof.
Background
In the existing data center server cold plate type liquid cooling heat dissipation system, a high-power CPU in the server dissipates heat through a cold plate, namely liquid fluid indirectly contacts and dissipates heat through a cold plate and a server heating chip, 70% -80% of total heat productivity of the server is taken away, and the rest 20% -30% of heat generated by a low-power device dissipates heat through an independently arranged precise air conditioner. Because the high-power chip and the low-power device respectively adopt two sets of heat dissipation systems, the investment of a data center cooling system is high, and the system operation regulation and control are complex. In addition, the cold plate liquid cooling heat dissipation efficiency is high, can realize the complete natural cooling of year by improving the liquid supply temperature in order to satisfy the heat dissipation demand, need not the compressor and participate in the refrigeration, however accurate air conditioner forced air cooling heat dissipation is because the cooling flow is long, the cooling temperature is low, and most time needs the compressor to participate in the refrigeration, and natural cold source utilization ratio is lower, and the energy consumption is off-high.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a gas-liquid integrated heat dissipation system for an edge data center, which is designed by integrating a high-power chip liquid cooling and a single cold source of electronic device air cooling in a tightly coupled manner, and fully utilizes a natural cold source to realize the natural cooling of the data center, thereby saving energy.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
the gas-liquid integrated heat dissipation system of the edge data center is characterized by comprising a primary gas-liquid heat exchanger, a server integral heat dissipation module and a circulating water pump;
the circulating water pump is used for pumping a cooling medium to the primary gas-liquid heat exchanger so as to take away the heat of the whole cabinet of the server; the inlet of the circulating water pump is communicated with the outlet of the integral heat dissipation module of the server, the outlet of the circulating water pump is communicated with the inlet of the primary gas-liquid heat exchanger, and the outlet of the primary gas-liquid heat exchanger is communicated with the inlet of the integral heat dissipation module of the server to form a water circulation unit;
the server integral heat dissipation module comprises a secondary gas-liquid heat exchanger, an air supply device in the server and a liquid cooling heat dissipation sub-module; the air return from the server cabinet passes through the secondary air-liquid heat exchanger and the air supply device in the server to take away the heat of the environment of the server cabinet and the low-power devices, and the liquid cooling heat dissipation submodule takes away the heat of the high-power devices in the server cabinet through water circulation.
Further, the edge data center gas-liquid integrated heat dissipation system also comprises an exhaust fan and a spraying device; the primary gas-liquid heat exchanger completes the switching between the working condition cooling mode and the indirect evaporative cooling mode according to the work of the exhaust fan and the spraying device.
Further, in the dry working condition cooling mode, the exhaust fan is started, and the spraying device is closed; in the indirect evaporative cooling mode, the exhaust fan is turned on and the spraying device is turned on.
And further, the two-stage gas-liquid heat exchanger and the liquid cooling heat radiating sub-module are flexibly switched in series and parallel through valve control.
Further, when the secondary gas-liquid heat exchanger and the liquid cooling heat dissipation submodule are connected in series, the outlet of the primary gas-liquid heat exchanger is communicated with the inlet of the secondary gas-liquid heat exchanger, the outlet of the secondary gas-liquid heat exchanger is communicated with the inlet of the liquid cooling heat dissipation submodule, and the outlet of the liquid cooling heat dissipation submodule is communicated with the inlet of the primary gas-liquid heat exchanger.
Further, when the two-stage gas-liquid heat exchanger and the liquid cooling sub-module are connected in parallel, the outlet of the first-stage gas-liquid heat exchanger is communicated with the inlets of the two-stage gas-liquid heat exchanger and the liquid cooling sub-module, and the outlet of the two-stage gas-liquid heat exchanger is communicated with the inlet of the first-stage gas-liquid heat exchanger.
Further, the server integral heat dissipation module further comprises a first regulating valve, a second regulating valve, a third regulating valve and a fourth regulating valve;
one end of the first regulating valve is connected with the outlet of the primary gas-liquid heat exchanger, and the other end of the first regulating valve is connected with the inlet of the secondary gas-liquid heat exchanger; one end of the third regulating valve is connected in a pipeline which is communicated with the first regulating valve and the outlet of the primary gas-liquid heat exchanger, and the other end of the third regulating valve is connected with the inlet of the liquid cooling heat radiator module; one end of the second regulating valve is connected with the outlet of the secondary gas-liquid heat exchanger and one end of the fourth regulating valve, and the other end of the second regulating valve is connected in a pipeline which is communicated with the inlet of the third regulating valve and the liquid cooling heat radiator sub-module; the other end of the fourth regulating valve is connected in a pipeline in which the outlet of the secondary gas-liquid heat exchanger is communicated with the inlet of the circulating water pump; the outlet of the circulating water pump is connected with the inlet of the primary gas-liquid heat exchanger.
Further, the edge data center gas-liquid integrated heat dissipation system further comprises a temperature sensor, wherein the temperature sensor is arranged on a pipeline connected with the first regulating valve and the primary gas-liquid heat exchanger and used for monitoring the outlet temperature of the primary gas-liquid heat exchanger.
Further, the edge data center gas-liquid integrated heat dissipation system further comprises a control unit, wherein the control unit is respectively connected with the first regulating valve, the second regulating valve, the third regulating valve, the fourth regulating valve and the phase signals of the temperature sensor and used for controlling the operation of the server integrated heat dissipation module.
Correspondingly, the invention also provides an operation control method of the gas-liquid integrated heat dissipation system of the edge data center, wherein the heat dissipation system is characterized by comprising the following steps:
s1: starting a gas-liquid integrated heat dissipation system of the edge data center;
s2: setting cooling temperature T of liquid cooling heat dissipation module of data center 1 Cooling temperature T of two-stage gas-liquid heat exchanger 2 ；
S3: monitoring the outdoor environment dry bulb temperature m and the primary gas-liquid heat exchanger outlet temperature n;
s4: if the cooling temperature T 2 The m is more than or equal to 3.5 ℃, the primary gas-liquid heat exchanger is operatedThe method is characterized in that the method is operated in a dry working condition cooling mode, otherwise, the primary gas-liquid heat exchanger is operated in an indirect evaporative cooling mode;
s5: judging the outlet temperature n of the primary gas-liquid heat exchanger, if T 1 N is more than or equal to 5 ℃, the first regulating valve and the second regulating valve are opened, the third regulating valve and the fourth regulating valve are closed, and the secondary gas-liquid heat exchanger and the liquid cooling heat dissipation module are in series connection; otherwise, the second regulating valve is closed, the first regulating valve, the third regulating valve and the fourth regulating valve are opened, the two-stage gas-liquid heat exchanger and the liquid cooling heat dissipation module are connected in parallel in operation, and the control of the branch flow is realized by regulating the opening of the first regulating valve and the opening of the third regulating valve;
s6: the PID regulation method is utilized to regulate the frequency of the circulating water pump and the exhaust fan to ensure that the cooling temperature T of the liquid cooling heat dissipation module is reduced 1 And the cooling temperature T of the secondary gas-liquid heat exchanger 2 Adjusting to a specified temperature.
S7: judging the cooling temperature of the primary liquid cooling heat dissipation module and the cooling temperature of the secondary gas-liquid heat exchanger every 5min, and returning to S3 if the temperature exceeds the set value
Compared with the prior art, the invention has the beneficial effects that:
1. according to the gas-liquid integrated heat dissipation system of the edge data center, through the coupling matching design of the primary gas-liquid heat exchanger, the secondary gas-liquid heat exchanger and the liquid cooling heat dissipation module, the problem of integrated cooling of high-low power electronic devices is solved, and annual natural cooling operation of the cabinet of the edge data center is realized.
2. The integral heat radiation module of the server of the gas-liquid integrated heat radiation system of the edge data center has two connection modes, namely a series connection mode and a parallel connection mode, can be flexibly selected and adjusted according to the heat radiation requirement of the server and the water outlet temperature of the primary gas-liquid heat exchanger, can meet the heat radiation requirement of the server in the same cabinet under different meteorological conditions, and has wider application range.
3. According to the operation method of the gas-liquid integrated heat dissipation system of the edge data center, provided by the invention, through setting the judgment conditions, the real-time switching of different connection modes is realized, and the energy waste is reduced.
Drawings
FIG. 1 is a schematic diagram of a gas-liquid integrated heat dissipation system for an edge data center according to an embodiment of the present invention;
reference numeral 1 illustrates: 1-an exhaust fan; 2-spraying device; 3-a primary gas-liquid heat exchanger; 4-a server integral heat dissipation module; 41-a secondary gas-liquid heat exchanger; 42-an air supply device in the server; 43-liquid cooling heat dissipation module; 44-a circulating water pump; 45-a first regulating valve; 46-a second regulating valve; 47-a third regulating valve; 48-a fourth regulating valve; 5-a control unit;
fig. 2 (a) and 2 (b) are schematic structural diagrams of a liquid-cooled plate type heat dissipation module and a flat heat pipe heat dissipation module of the liquid-cooled heat dissipation module of the present invention, respectively.
Fig. 2 (a) and fig. 2 (b) are labeled: 431-liquid cooling plate; 4311-liquid inlet of liquid cooling plate; 4312-a liquid outlet of the liquid cooling plate; 432-flat plate heat pipe; 4321-a flat heat pipe evaporation end; 4322-flat heat pipe condensing end; 4323-refrigerant inlet at condensing end of flat heat pipe; 4324-refrigerant outlet at condensing end of flat heat pipe; 4325-a water circulation inlet at the condensing end of the flat heat pipe; 4326-a water circulation outlet at the condensing end of the flat heat pipe.
Fig. 3 is a control flow diagram of the present invention.
Detailed Description
The technical scheme of the invention is further described below with reference to the accompanying drawings and examples.
Examples:
it is noted that the terms "first," "second," and the like in the description and claims of the invention and in the foregoing figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order; the terms "low power", "high power" are relative terms and are not limited by the particular power level. It is to be understood that the data so used may be interchanged where appropriate, such that embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein; . Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus.
Referring to fig. 1, a schematic structural diagram of an edge data center gas-liquid integrated heat dissipation system according to an embodiment of the present invention is shown, which mainly includes a primary gas-liquid heat exchanger 3, a server integral heat dissipation module 4, and a circulating water pump 44; the circulating water pump 44 is used for pumping a cooling medium (low-temperature liquid) to the primary gas-liquid heat exchanger 3 so as to take away the heat of the whole cabinet of the server; the inlet of the circulating water pump 44 is communicated with the outlet of the integral heat dissipation module of the server, the outlet of the circulating water pump is communicated with the inlet of the primary gas-liquid heat exchanger 44, and the outlet of the primary gas-liquid heat exchanger 44 is communicated with the inlet of the integral heat dissipation module of the server to form a water circulation unit.
The server integral heat radiation module comprises a secondary gas-liquid heat exchanger 41, an in-server air supply device 42 and a liquid cooling heat radiation sub-module 43; the return air from the server cabinet passes through the secondary air-liquid heat exchanger 41 and the air supply device 42 in the server to take away the heat of the environment of the server cabinet and the low-power devices, and the liquid cooling heat dissipation submodule 43 takes away the heat of the high-power devices in the server cabinet through water circulation. In this embodiment, the secondary gas-liquid heat exchanger 41, the air supply device 42, the liquid cooling heat dissipation module 43 and the circulating water pump are integrated 44 into the cabinet of the edge data center, so that the problem of integrated cooling of high-low power electronic devices is solved in the cabinet, and the annual natural cooling operation of the cabinet of the edge data center is realized.
Therefore, the gas-liquid integrated heat dissipation system of the edge data center solves the problem of integrated cooling of high-low power electronic devices through the coupling matching design of the primary gas-liquid heat exchanger, the secondary gas-liquid heat exchanger and the liquid cooling heat dissipation module, and achieves annual natural cooling operation of the cabinet of the edge data center.
As a preferable mode of the above-mentioned gas-liquid integrated heat radiation system of the edge data center, the system further comprises an exhaust fan 1 and a spraying device 2. The primary gas-liquid heat exchanger 3 switches a dry working condition cooling mode and an indirect evaporative cooling mode according to the external environment temperature; in the dry working condition cooling mode, the exhaust fan 1 is started, and the spraying device 2 is closed; in the indirect evaporative cooling mode, the exhaust fan 1 is turned on and the spraying device 2 is turned on.
In a specific embodiment, the valve control is used to flexibly switch between the series connection and the parallel connection between the secondary gas-liquid heat exchanger 41 and the liquid cooling sub-module 43. That is, the integral heat dissipation module of the server has two connection modes, namely a series connection mode and a parallel connection mode, can be flexibly selected and adjusted according to the heat dissipation requirement of the server and the water outlet temperature of the primary gas-liquid heat exchanger, can meet the heat dissipation requirement of the server in the same cabinet under different meteorological conditions, and has wider application range.
When the secondary gas-liquid heat exchanger 41 and the liquid cooling sub-module 43 are connected in series, the outlet of the primary gas-liquid heat exchanger 3 is communicated with the inlet of the secondary gas-liquid heat exchanger 41, the outlet of the secondary gas-liquid heat exchanger 41 is communicated with the inlet of the liquid cooling sub-module 43, and the outlet of the liquid cooling sub-module 43 is communicated with the inlet of the primary gas-liquid heat exchanger 3. When the two-stage gas-liquid heat exchanger 41 and the liquid cooling sub-module 43 are connected in parallel, the outlet of the first-stage gas-liquid heat exchanger 3 is communicated with the inlets of the two-stage gas-liquid heat exchanger 41 and the liquid cooling sub-module 43, and the outlets of the two-stage gas-liquid heat exchanger 41 and the liquid cooling sub-module 43 are communicated with the inlet of the first-stage gas-liquid heat exchanger 3.
In a specific embodiment, the above-mentioned integral heat dissipation module of the server further includes a first adjusting valve 45, a second adjusting valve 46, a third adjusting valve 47, and a fourth adjusting valve 48; one end of the first regulating valve 41 is connected with the outlet of the primary gas-liquid heat exchanger 3, and the other end of the first regulating valve is connected with the inlet of the secondary gas-liquid heat exchanger 41; one end of the third regulating valve 47 is connected to the pipeline that the first regulating valve 45 is communicated with the outlet of the primary gas-liquid heat exchanger 3, and the other end is connected to the inlet of the liquid cooling sub-module 43; one end of the second regulating valve 46 is connected with the outlet of the second-stage gas-liquid heat exchanger 41 and one end of the fourth regulating valve 48, and the other end is connected in a pipeline in which the third regulating valve 47 is communicated with the inlet of the liquid cooling sub-module 43; the other end of the fourth regulating valve 48 is connected in a pipeline in which the outlet of the secondary gas-liquid heat exchanger 43 is communicated with the inlet of the circulating water pump 44; the outlet of the circulating water pump 44 is connected with the inlet of the primary gas-liquid heat exchanger 3. Thus, the flexible switching between the serial connection and the parallel connection of the two-stage gas-liquid heat exchanger and the liquid cooling heat radiator sub-module can be realized by controlling the switch of different regulating valves
As another preferable mode of the above-mentioned gas-liquid integrated heat dissipation system of the edge data center, the system further includes a temperature sensor, where the temperature sensor is disposed on a pipeline connected to the first adjusting valve 45 and the primary gas-liquid heat exchanger 3, and is used for monitoring the outlet temperature of the primary gas-liquid heat exchanger 3. The system further comprises a control unit 5, wherein the control unit 5 is respectively connected with the first regulating valve 45, the second regulating valve 46, the third regulating valve 47, the fourth regulating valve 48 and the phase signals of the temperature sensor for controlling the operation of the whole heat dissipation module of the server.
In one embodiment, as shown in fig. 2 (a) and fig. 2 (b), the liquid cooling module 43 is a liquid cooling plate module 431 or a flat heat pipe module 432.
As shown in fig. 2 (a), the liquid cooling plate module 431 includes a liquid cooling plate liquid inlet 4311 and a liquid cooling plate liquid outlet 4312.
As shown in fig. 2 (b), the flat heat pipe module 432 includes an evaporation end 4321, a condensation end 4322, a condensation end refrigerant inlet 4323, a flat heat pipe condensation end refrigerant outlet 4324, a condensation end water circulation inlet 4325, and a condensation end water circulation outlet 4326; the heat of the high-power device is taken away through the water circulation channel at the condensing end.
As shown in fig. 3, the embodiment further provides a control method of the gas-liquid integrated heat dissipation system of the edge data center, which specifically includes the following steps:
s1: and starting the gas-liquid integrated heat dissipation system of the edge data center.
S2: setting cooling temperature T of liquid cooling heat dissipation module of data center 1 Cooling temperature T of two-stage gas-liquid heat exchanger 2 。
S3: the outdoor environment dry bulb temperature m and the primary gas-liquid heat exchanger outlet temperature n are monitored.
S4: if the cooling temperature T 2 M is more than or equal to 3.5 ℃, the primary gas-liquid heat exchanger is operated in a dry working condition cooling mode; otherwise, the primary gas-liquid heat exchanger is operated in an indirect evaporative cooling mode; and S5 is performed.
S5: judging the outlet temperature n of the primary gas-liquid heat exchanger, if T 1 N is more than or equal to 5 ℃, the first regulating valve 45 and the second regulating valve 46 are opened, the third regulating valve 47 and the fourth regulating valve 48 are closed, and the two-stage gas-liquid heat exchanger 41 and the liquid cooling heat radiating module 43 are in series connection; otherwise, the second regulating valve 46 is closed, the first regulating valve 45, the third regulating valve 47 and the fourth regulating valve 48 are opened, the two-stage gas-liquid heat exchanger 41 and the liquid cooling heat radiating module 43 are connected in parallel in an operation mode, and the opening degree of the first regulating valve 45 and the opening degree of the third regulating valve 47 are regulated to control the branch flow;
s6: the PID regulation method is utilized, and the frequency of the circulating water pump and the exhaust fan is regulated to ensure that the cooling temperature T of the liquid cooling heat dissipation module is lower than the cooling temperature T 1 And the cooling temperature T of the secondary gas-liquid heat exchanger 2 Adjust to the specified temperature, and execute S7.
S7: and judging the cooling temperature of the primary liquid cooling heat dissipation module and the cooling temperature of the secondary gas-liquid heat exchanger every 5min, and returning to the step S3 if the temperature exceeds the set value.
Setting the above judgment conditions produces the following effects:
(1) When evaluating from the angle of edge data center gas-liquid integrated heat radiation system equipment, T 1 -n and T 2 The larger the upper limit value of the m difference value is, the wider the corresponding heat dissipation power range of the CPU of the server is, so that frequent switching of cooling modes can be avoided, and the service life of the gas-liquid integrated heat dissipation system equipment of the edge data center is prolonged; t (T) 1 -n and T 2 The smaller the upper limit value of the m difference value is, the more accurate the control of the working temperature of the CPU of the server is.
(2) When evaluating from the angle of the gas-liquid integrated heat radiation system section of the edge data center, T 1 And T 2 The larger the value is, the better the energy-saving effect of the gas-liquid integrated heat dissipation system of the edge data center is, but when the running load fluctuation of the server is larger, the working temperature of the CPU of the server is possibly caused to approach the limit temperatureDegree.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the essence of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The gas-liquid integrated heat dissipation system of the edge data center is characterized by comprising a primary gas-liquid heat exchanger, a server integral heat dissipation module and a circulating water pump;
the circulating water pump is used for pumping a cooling medium to the primary gas-liquid heat exchanger so as to take away the heat of the whole cabinet of the server; the inlet of the circulating water pump is communicated with the outlet of the integral heat dissipation module of the server, the outlet of the circulating water pump is communicated with the inlet of the primary gas-liquid heat exchanger, and the outlet of the primary gas-liquid heat exchanger is communicated with the inlet of the integral heat dissipation module of the server to form a water circulation unit;
the server integral heat dissipation module comprises a secondary gas-liquid heat exchanger, an air supply device in the server and a liquid cooling heat dissipation sub-module; the air return from the server cabinet passes through the secondary air-liquid heat exchanger and the air supply device in the server to take away the heat of the environment of the server cabinet and the low-power devices, and the liquid cooling heat dissipation submodule takes away the heat of the high-power devices in the server cabinet through water circulation.
2. The edge data center gas-liquid integrated heat dissipating system of claim 1, further comprising an exhaust fan and a spray device; the primary gas-liquid heat exchanger completes the switching between a dry working condition cooling mode and an indirect evaporative cooling mode according to the work of the exhaust fan and the spraying device.
3. The edge data center gas-liquid integrated heat dissipating system of claim 2, wherein in said dry mode, said exhaust fan is on and said spraying device is off; in the indirect evaporative cooling mode, the exhaust fan is turned on and the spraying device is turned on.
4. The integrated gas-liquid heat dissipation system of edge data center of claim 1, wherein the flexible switching between serial connection and parallel connection is realized between the secondary gas-liquid heat exchanger and the liquid cooling sub-module through valve control.
5. The integrated gas-liquid heat dissipation system of edge data center of claim 4, wherein when the secondary gas-liquid heat exchanger and the liquid cooling sub-module are connected in series, the primary gas-liquid heat exchanger outlet is communicated with the secondary gas-liquid heat exchanger inlet, the secondary gas-liquid heat exchanger outlet is communicated with the liquid cooling sub-module inlet, and the liquid cooling sub-module outlet is communicated with the primary gas-liquid heat exchanger inlet.
6. The integrated gas-liquid heat dissipation system of edge data center of claim 4, wherein when the two-stage gas-liquid heat exchanger and the liquid cooling sub-module are connected in parallel, the outlet of the first-stage gas-liquid heat exchanger is communicated with the inlets of the two-stage gas-liquid heat exchanger and the liquid cooling sub-module, and the outlet of the two-stage gas-liquid heat exchanger is communicated with the inlet of the first-stage gas-liquid heat exchanger.
7. The edge data center gas-liquid integrated heat dissipating system of claim 5 or 6, wherein the server-integrated heat dissipating module further comprises a first regulator valve, a second regulator valve, a third regulator valve, and a fourth regulator valve;
one end of the first regulating valve is connected with the outlet of the primary gas-liquid heat exchanger, and the other end of the first regulating valve is connected with the inlet of the secondary gas-liquid heat exchanger; one end of the third regulating valve is connected in a pipeline which is communicated with the first regulating valve and the outlet of the primary gas-liquid heat exchanger, and the other end of the third regulating valve is connected with the inlet of the liquid cooling heat radiator module; one end of the second regulating valve is connected with the outlet of the secondary gas-liquid heat exchanger and one end of the fourth regulating valve, and the other end of the second regulating valve is connected in a pipeline which is communicated with the inlet of the third regulating valve and the liquid cooling heat radiator sub-module; the other end of the fourth regulating valve is connected in a pipeline in which the outlet of the secondary gas-liquid heat exchanger is communicated with the inlet of the circulating water pump; the outlet of the circulating water pump is connected with the inlet of the primary gas-liquid heat exchanger.
8. The integrated edge data center gas-liquid heat dissipating system of claim 7, further comprising a temperature sensor disposed in a line connecting the first regulator valve and the primary gas-liquid heat exchanger for monitoring the primary gas-liquid heat exchanger outlet temperature.
9. The edge data center gas-liquid integrated heat dissipating system of claim 8, further comprising a control unit connected to the first, second, third, fourth, and temperature sensor's phase lines, respectively, for operation control of the server's overall heat dissipating module.
10. An operation control method of a gas-liquid integrated heat dissipation system of an edge data center, wherein the heat dissipation system is the heat dissipation system of claim 9, and the method comprises:
s1: starting a gas-liquid integrated heat dissipation system of the edge data center;
s2: setting cooling temperature T of liquid cooling heat dissipation module of data center 1 Cooling temperature T of two-stage gas-liquid heat exchanger 2 ；
S3: monitoring the outdoor environment dry bulb temperature m and the primary gas-liquid heat exchanger outlet temperature n;
s4: if the cooling temperature T 2 M is more than or equal to 3.5 ℃, the primary gas-liquid heat exchanger is operated in a dry working condition cooling mode, otherwise, the primary gas-liquid heat exchanger is operated in an indirect evaporative cooling mode;
s5: judging the outlet temperature n of the primary gas-liquid heat exchanger, if T 1 N is more than or equal to 5 ℃, the first regulating valve and the second regulating valve are opened, the third regulating valve and the fourth regulating valve are closed, and the secondary gas-liquid heat exchanger and the liquid cooling heat dissipation module are in series connection; otherwise, the second regulating valve is closed, the first regulating valve, the third regulating valve and the fourth regulating valve are opened, the two-stage gas-liquid heat exchanger and the liquid cooling heat dissipation module are connected in parallel in operation, and the control of the branch flow is realized by regulating the opening of the first regulating valve and the opening of the third regulating valve;
s6: the PID regulation method is utilized to regulate the frequency of the circulating water pump and the exhaust fan to ensure that the cooling temperature T of the liquid cooling heat dissipation module is reduced 1 And the cooling temperature T of the secondary gas-liquid heat exchanger 2 Adjusting to a specified temperature;
s7: and judging the cooling temperature of the primary liquid cooling heat dissipation module and the cooling temperature of the secondary gas-liquid heat exchanger every 5min, and returning to the step S3 if the temperature exceeds the set value.
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