CN117135807A - Flexible circuit board and display device - Google Patents
Flexible circuit board and display device Download PDFInfo
- Publication number
- CN117135807A CN117135807A CN202210557690.5A CN202210557690A CN117135807A CN 117135807 A CN117135807 A CN 117135807A CN 202210557690 A CN202210557690 A CN 202210557690A CN 117135807 A CN117135807 A CN 117135807A
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- Prior art keywords
- circuit board
- flexible circuit
- bending
- bending area
- display panel
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- 238000005452 bending Methods 0.000 claims abstract description 144
- 238000013461 design Methods 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 38
- 230000001681 protective effect Effects 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 18
- 229910052742 iron Inorganic materials 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 230000002427 irreversible effect Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
Abstract
The embodiment of the application provides a flexible circuit board and a display device, wherein the flexible circuit board comprises: a first non-bending region, a bending region, and a second non-bending region; the flexible circuit board is in a flattened state, and the first non-bending area, the bending area and the second non-bending area are sequentially distributed along a first direction; in a first direction, the first non-bending region has a first design dimension such that the bending region has a second design dimension; the flexible circuit board is in a bending state, the first non-bending area is configured to be arranged on one side of the display panel, which is far away from the backlight module, and the second non-bending area is configured to be arranged on one side of the backlight module, which is far away from the display panel. According to the embodiment of the application, the size of the first non-bending area is shortened, so that the length of the bending area is increased, the softness of the bending area is improved, the high-low temperature reliability of the flexible circuit board is improved, the light leakage condition of the display panel caused by hardening of the flexible circuit board is further improved, and the yield of the display device is improved.
Description
Technical Field
The application relates to the technical field of semiconductor equipment preparation, in particular to a flexible circuit board and a display device.
Background
In the present display device, a frame structure is often used to support or position structures such as a display panel and a backlight module in the display device, and is connected with a flexible circuit board of the display device.
However, the flexible circuit board is easily hardened at high temperature or low temperature, so that the force applied by the frame structure is easily transferred to the display panel through the hardened flexible circuit board, thereby causing light leakage of the display panel.
In addition, the hardening process of the flexible circuit board is irreversible at high temperature, so that the light leakage condition of the display panel caused by the hardening of the flexible circuit board is difficult to recover after the high temperature is passed, and the display device is damaged.
Disclosure of Invention
Aiming at the defects of the prior art, the application provides a flexible circuit board and a display device, which are used for solving the technical problems that the flexible circuit board is easy to harden at high temperature or low temperature to cause light leakage of a display panel and damage the display device in the prior art.
In a first aspect, an embodiment of the present application provides a flexible circuit board, including: a first non-bending region, a bending region, and a second non-bending region;
the flexible circuit board is in a flattened state, and the first non-bending area, the bending area and the second non-bending area are sequentially distributed along a first direction; in a first direction, the first non-bending region has a first design dimension such that the bending region has a second design dimension;
the flexible circuit board is in a bending state, the first non-bending area is configured to be arranged on one side of the display panel, which is far away from the backlight module, and the second non-bending area is configured to be arranged on one side of the backlight module, which is far away from the display panel.
Optionally, the first design dimension is not less than 1.6 millimeters and less than 1.8 millimeters.
Optionally, the flexible circuit board includes a conductive layer and a substrate that are stacked;
the thickness of the substrate is less than 19 microns and less than 25 microns.
Optionally, in the second non-bending region, the flexible circuit board further includes a first conductive structure and a first protection structure sequentially located on a side of the substrate away from the conductive layer;
the first protection structure is provided with a first via hole; the flexible circuit board further comprises a second conductive structure arranged in the first via hole; the second conductive structure is electrically connected with the conductive layer and the first conductive structure respectively.
Optionally, in the bending region, the flexible circuit board further includes a third conductive structure and a second protective structure sequentially located on a side of the substrate away from the conductive layer;
the second protection structure is provided with a second via hole; the flexible circuit board further comprises a fourth conductive structure arranged in the second via hole; the fourth conductive structure is electrically connected with the conductive layer and the third conductive structure respectively.
Optionally, the flexible circuit board further comprises a protective layer;
the protective layer is arranged on one side of the conductive layer far away from the substrate.
Optionally, in the first non-bending region, the flexible circuit board further includes a third protection structure located on a side of the substrate away from the conductive layer;
one side of the third protection structure far away from the substrate is used for being connected with the display panel.
In a second aspect, an embodiment of the present application provides a display apparatus, including: the flexible circuit board of any of the first aspects above.
Optionally, the display device further includes: a frame structure, a laminated display panel and a backlight module;
the frame structure comprises a first part and a second part which form an included angle with each other; the first part is arranged at one side of the display panel far away from the backlight module, and the second part is arranged at the periphery of the end parts of the laminated display panel and the backlight module;
the flexible circuit board is in under the bending state, and the first non-bending area of the flexible circuit board is arranged between the frame structure and the display panel, and the part bending area of the flexible circuit board is arranged between the second part and the backlight module and is connected with the second part, and the second non-bending area of the flexible circuit board is arranged on one side, far away from the display panel, of the backlight module.
Optionally, the display device further includes: a printed circuit board;
the printed circuit board is arranged on one side of the backlight module, which is far away from the display panel, and part of the second non-bending area is positioned on one side of the printed circuit board, which is far away from the backlight module;
the projection of the printed circuit board on the substrate of the flexible circuit board has no overlapping area with the projection of the first conductive structure on the substrate.
Optionally, the display device further includes: a shielding layer;
the second protection structure of the flexible circuit board is arranged between the second part and the substrate of the flexible circuit board;
the shielding layer is arranged on one side of the second part, the other part of the bending area and the second non-bending area, which is far away from the backlight module.
The technical scheme provided by the embodiment of the application has the beneficial technical effects that:
the flexible circuit board in the embodiment of the application comprises a first non-bending area, a bending area and a second non-bending area, wherein the first non-bending area is positioned at one side of the display panel far away from the backlight module, the second non-bending area is opposite to the first non-bending area after being bent and is positioned at one side of the backlight module far away from the display panel, and the bending area is connected with the first non-bending area and the second non-bending area. In the first direction, the first non-bending region has a first design dimension such that the bending region has a second design dimension. Compared with the prior art, the application shortens the size of the first non-bending area and increases the size of the bending area under the condition that the whole size of the flexible circuit board is fixed, so that the length of the bending area is increased, the softness of the bending area is improved, the high-low temperature reliability of the flexible circuit board is improved, the light leakage condition of the display panel caused by hardening of the flexible circuit board is further improved, and the yield of the display device is improved.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application;
fig. 2 is a schematic diagram of a front view structure of a flexible circuit board with a first protection structure removed according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of another flexible circuit board according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a display device according to an embodiment of the present application.
Reference numerals:
100-a display device;
1-a flexible circuit board;
11-a first non-bending region; 111-a third protective structure;
12-bending region; 121-a third conductive structure; 122-a second protective structure; 1220-second vias; 123-fourth conductive structures;
13-a second non-bending region; 131-a first conductive structure; 132-a first protective structure; 1320-a first via; 133-a second conductive structure;
101-a conductive layer; 102-a substrate; 103-a protective layer;
2-frame structure; 21-a first part; 22-a second part;
3-a display panel;
4-a backlight module; 41-a back plate; 42-a reflective sheet; 43-a light guide plate; 44-diffusion sheet 45-prism sheet; 46-a privacy film; 47-a first middle iron frame; 48-a second middle iron frame; 49-soaking cotton;
5-a printed circuit board; 6-a shielding layer; 7-a polarizer; 8-buffer layer.
Detailed Description
Embodiments of the present application are described below with reference to the drawings in the present application. It should be understood that the embodiments described below with reference to the drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application, and the technical solutions of the embodiments of the present application are not limited.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. The term "and/or" as used herein refers to at least one of the items defined by the term, e.g., "a and/or B" may be implemented as "a", or as "B", or as "a and B".
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail with reference to the accompanying drawings.
The development idea of the application comprises the following steps: the requirements for the high-low temperature reliability of the display device comprise high-low temperature storage (-40-90 ℃) and high-low temperature operation (-30-85 ℃), and the situation that the position of the flexible circuit board generates light leakage with a heavier degree is found in the high-low temperature reliability test or after the test is finished. In the low temperature test, when the ambient temperature is stabilized at-30 ℃ or-40 ℃ for 30 minutes, the light leakage of the third level (which is serious visually and disappears when the temperature is restored to normal temperature) appears at the position of the flexible circuit board, when the high temperature test time passes for 500 hours, the light leakage of the third level also appears at the position of the flexible circuit board, and when the temperature is restored to normal temperature, the light leakage still exists and the severity degree does not disappear.
The inventors have found that the flexible circuit board can harden at either high or low temperatures, and that forces applied by the frame structure are easily transferred to the display panel, thereby causing the display panel to leak light from the location of the flexible circuit board. At high temperatures, the effect of stiffening the flexible circuit board is irreversible, while at low temperatures, the effect of stiffening the flexible circuit board is reversible, so that light leakage is recoverable at low temperatures and is not recoverable at high temperatures.
In particular, for a narrow bezel display device having a bezel structure, the size of the bending region of the flexible circuit board is small, which may be only 1.4 mm, and it is easier to transmit the force of the bezel structure to the display panel, resulting in light leakage.
The application provides a flexible circuit board, which aims to solve the technical problems in the prior art.
The following describes the technical scheme of the present application and how the technical scheme of the present application solves the above technical problems in detail with specific embodiments. It should be noted that the following embodiments may be referred to, or combined with each other, and the description will not be repeated for the same terms, similar features, similar implementation steps, and the like in different embodiments.
Referring to fig. 1, an embodiment of the present application provides a flexible circuit board 1, including: a first non-inflection region 11, an inflection region 12 and a second non-inflection region 13.
In the flattened state of the flexible circuit board 1, the first non-bending region 11, the bending region 12, and the second non-bending region 13 are sequentially distributed along the first direction. In the first direction, the first non-bending region 11 has a first design dimension such that the bending region 12 has a second design dimension.
In the bent state of the flexible circuit board 1, the first non-bending region 11 is configured to be disposed on a side of the display panel 3 away from the backlight module 4, and the second non-bending region 13 is configured to be disposed on a side of the backlight module 4 away from the display panel 3.
In this embodiment, the flexible circuit board 1 includes a first non-bending area 11, a bending area 12 and a second non-bending area 13, the first non-bending area 11 is located at one side of the display panel 3 away from the backlight module 4, the second non-bending area 13 is opposite to the first non-bending area 11 after being bent, and is located at one side of the backlight module 4 away from the display panel 3, and the bending area 12 connects the first non-bending area 11 and the second non-bending area 13. In the first direction, the first non-bending region 11 has a first design dimension such that the bending region 12 has a second design dimension. Compared with the prior art, the application shortens the size of the first non-bending area 11 and increases the size of the bending area 12 under the condition that the size of the flexible circuit board 1 is fixed, so that the length of the bending area 12 is increased, the softness of the bending area 12 is improved, the high-low temperature reliability of the flexible circuit board 1 is improved, the light leakage condition of the display panel 3 caused by the hardening of the flexible circuit board 1 is further improved, and the yield of the display device 100 is improved.
Optionally, the first design dimension is not less than 1.6 millimeters and less than 1.8 millimeters.
Optionally, the first design dimension is 1.7 millimeters. In the prior art, the length of the first non-bending area 11 is 1.8 mm, and the first design size of the first non-bending area 11 is shortened to 1.7 mm, so that the bending area 12 has longer length, is softer and has higher high-low temperature reliability.
Referring to fig. 1, in some possible embodiments, the flexible circuit board 1 includes a conductive layer 101 and a substrate 102 that are stacked.
The thickness of the substrate 102 is less than 19 microns and less than 25 microns.
In this embodiment, by reducing the thickness of the substrate 102, the whole flexible circuit board 1 is softer, and enough compensation space is provided after hardening, so as to avoid light leakage.
Alternatively, the thickness of the substrate 102 is less than 20 microns.
It will be appreciated that the prior art flexible circuit board 1 will include a double layer region to facilitate routing within the flexible circuit board 1. Referring to fig. 1, in some possible embodiments, in the second non-bending region 13, the flexible circuit board 1 further includes a first conductive structure 131 and a first protective structure 132 sequentially located on a side of the substrate 102 away from the conductive layer 101.
The first guard structure 132 has a first via 1320. The flexible circuit board 1 further includes a second conductive structure 133 disposed within the first via 1320. The second conductive structure 133 is electrically connected to the conductive layer 101 and the first conductive structure 131, respectively.
In this embodiment, the original double-layer area is changed into a design of a layer of first conductive structure 131 and a layer of second conductive structure 133 in the first via hole 1320, the area of the original conductive structure is larger, and the area of the second conductive structure 133 in the first via hole 1320 is smaller in this embodiment, which is equivalent to changing the conductive structure from a planar structure to a dot structure, and the influence is smaller relative to the whole flexible circuit board 1, so that the flexible circuit board 1 is softer. Fig. 2 is a schematic plan view of the flexible circuit board 1, for convenience of description, the second conductive structure 133 and a part of the first protection structure 132 on one side of the first conductive structure 131 are not drawn, and only a part of the first protection structure 132 disposed on the same layer as the first conductive structure 131 is remained.
Optionally, the material of the first protection structure 132 includes, but is not limited to, polyimide (polyimide).
In some possible embodiments, referring to fig. 3, in the bending region 12, the flexible circuit board 1 further includes a third conductive structure 121 and a second protective structure 122 sequentially located on a side of the substrate 102 away from the conductive layer 101.
The second protection structure 122 has a second via 1220. The flexible circuit board 1 further includes a fourth conductive structure 123 disposed within the second via 1220. The fourth conductive structure 123 is electrically connected to the conductive layer 101 and the third conductive structure 121, respectively.
In this embodiment, to facilitate routing, the bending region 12 also has a via conductive structure similar to the second non-bending region 13. The side of the third conductive structure 121 away from the substrate 102 is wrapped with the second protection structure 122, which plays an insulating or protecting role.
Optionally, the material of the second protection structure 122 includes, but is not limited to, polyimide (polyimide).
In some possible embodiments, the flexible circuit board 1 further comprises a protective layer 103.
The protective layer 103 is disposed on a side of the conductive layer 101 away from the substrate 102.
It will be appreciated that one side of the flexible circuit board 1 faces the stacked display panel 3 and backlight module 4, and therefore, the protection layer 103 needs to be used to protect the side from the conductive layer 101 affecting the display panel 3 or the backlight module 4 or causing electromagnetic interference between the structures.
Optionally, one or more of the first non-inflection region 11, inflection region 12 and second non-inflection region 13 all comprise a protective layer 103.
Optionally, the material of the protective layer 103 includes, but is not limited to, polyimide (polyimide).
In some possible embodiments, the flexible circuit board 1 further comprises a third protection structure 111 at a side of the substrate 102 remote from the conductive layer 101 in the first non-bending region 11.
The side of the third protection structure 111 remote from the substrate 102 is used for connection with the display panel 3.
In this embodiment, since a portion of the conductive layer 101 in the first non-bending region 11 is a binding region, the other side of the binding region does not need to be bound, and the third protection structure 111 is needed to protect the first non-bending region 11 from electromagnetic interference with other structures in the display device 100, and the insulation or protection effect can be achieved.
Optionally, the material of the third protection structure 111 includes, but is not limited to, polyimide (polyimide).
Based on the same inventive concept, an embodiment of the present application provides a display apparatus 100 including: any of the flexible circuit boards 1 provided in the above embodiments.
The display device 100 provided in this embodiment includes any flexible circuit board 1 provided in the foregoing embodiments, and its implementation principle is similar, and will not be described herein.
In some possible embodiments, referring to fig. 4, the display device 100 further includes: a frame structure 2, a laminated display panel 3 and a backlight module 4.
The frame structure 2 comprises a first portion 21 and a second portion 22 which are angled with respect to each other; the first part 21 is arranged on one side of the display panel 3 away from the backlight module 4, and the second part 22 is arranged on the periphery of the end parts of the laminated display panel 3 and backlight module 4;
the flexible circuit board 1 is in a bending state, the first non-bending area 11 of the flexible circuit board 1 is arranged between the frame structure 2 and the display panel 3, the part bending area 12 of the flexible circuit board 1 is arranged between the second part 22 and the backlight module 4 and is connected with the second part 22, and the second non-bending area 13 of the flexible circuit board 1 is arranged at one side of the backlight module 4 far away from the display panel 3.
In this embodiment, in the bent state of the flexible circuit board 1, the display panel 3 and the backlight module 4 are stacked between the first non-bending region 11 and the second non-bending region 13, and the bending region 12 is located at the end of the stacked display panel 3 and backlight module 4 in the same direction. The structure formed by the display panel 3, the backlight module 4 and the flexible circuit board 1 is located in the included angle space formed by the first portion 21 and the second portion 22 of the frame structure 2.
Alternatively, the frame structure 2 is an iron frame, with the first portion 21 and the second portion 22 being perpendicular.
Optionally, the backlight module 4 includes: a back sheet 41, a reflection sheet 42, a light guide plate 43, a diffusion sheet 44, a prism sheet 45, and a privacy film 46 are stacked. The backlight module 4 further includes a first middle iron frame 47 and a second middle iron frame 48, which are connected perpendicularly to each other, where the first middle iron frame 47 is located at the periphery of the end portions of the back plate 41, the reflective sheet 42, the light guide plate 43, the diffusion sheet 44, the prism sheet 45 and the peep-proof film 46, which are stacked, and the second middle iron frame 48 is located at one side of the peep-proof film 46 away from the prism sheet 45, and one side of the second middle iron frame 48 away from the peep-proof film 46 faces the display panel 3. Foam 49 is further disposed between the display panel 3 and the second middle iron frame 48, and can perform buffering and fixing functions. The specific structure and function of the backlight module 4 are similar to those of the prior art, and will not be described herein.
In some possible embodiments, referring to fig. 4, the display device 100 further includes: a printed circuit board 5.
The printed circuit board 5 is disposed on a side of the backlight module 4 away from the display panel 3, and a portion of the second non-bending region 13 is disposed on a side of the printed circuit board 5 away from the backlight module 4.
The projection of the printed circuit board 5 onto the substrate 102 of the flexible circuit board 1 does not overlap with the projection of the first conductive structure 131 onto the substrate 102.
The printed circuit board 5 in the present embodiment is located between the backlight module 4 and the second non-bending area 13, one side of the printed circuit board 5 is only correspondingly connected with a portion of the second non-bending area 13, and the first conductive structure 131, the first protective structure 132 and the second conductive structure 133 are located in an area of the second non-bending area 13 that does not correspond to the printed circuit board 5.
In some possible embodiments, referring to fig. 4, the display device 100 further includes: a shielding layer 6.
The second protection structure 122 of the flexible circuit board is disposed between the second portion 22 and the substrate 102 of the flexible circuit board 1;
the shielding layer 6 is disposed on a side of the second portion 22, the other portion of the bending region 12, and the second non-bending region 13 away from the backlight module 4.
In this embodiment, one end of the shielding layer 6 is fixed to a side of the second non-bending region 13 away from the backlight module 4, and the other end is bent to the frame structure 2 and connected to the second portion 22 of the frame structure 2 to form an enclosed region. And, the side of the substrate 102 in the second non-bending region 13 having the first conductive structure 131, the first protective structure 132 and the second conductive structure 133 is in contact with the shielding layer 6, and the protruding first protective structure 132 has a small thickness relative to the substrate 102, and does not substantially affect the connection between the shielding layer 6 and the second non-bending region 13.
Optionally, the first non-bending area 11 is only connected with a part of the display panel 3, and a polarizer 7 and a buffer layer 8 are sequentially arranged between the part of the display panel 3, which is not connected with the first non-bending area 11, and the first part 21. Buffer layer 8 includes, but is not limited to, foam.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
1. the flexible circuit board 1 in this embodiment includes a first non-bending area 11, a bending area 12 and a second non-bending area 13, where the first non-bending area 11 is located at a side of the display panel 3 away from the backlight module 4, the second non-bending area 13 is opposite to the first non-bending area 11 after being bent, and is located at a side of the backlight module 4 away from the display panel 3, and the bending area 12 connects the first non-bending area 11 and the second non-bending area 13. In the first direction, the first non-bending region 11 has a first design dimension such that the bending region 12 has a second design dimension. Compared with the prior art, the application shortens the size of the first non-bending area 11 and increases the size of the bending area 12 under the condition that the size of the flexible circuit board 1 is fixed, so that the length of the bending area 12 is increased, the softness of the bending area 12 is improved, the high-low temperature reliability of the flexible circuit board 1 is improved, the light leakage condition of the display panel 3 caused by the hardening of the flexible circuit board 1 is further improved, and the yield of the display device 100 is improved.
2. The length of the first non-bending area 11 is 1.8 mm, and the first design size of the first non-bending area 11 is shortened to 1.7 mm, so that the bending area 12 has longer length, is softer and has higher high-low temperature reliability.
3. In this embodiment, by reducing the thickness of the substrate 102, the whole flexible circuit board 1 is softer, and enough compensation space is provided after hardening, so as to avoid light leakage.
4. In this embodiment, the original double-layer area is changed into a design of a layer of first conductive structure 131 and a layer of second conductive structure 133 in the first via hole 1320, the area of the original conductive structure is larger, and the area of the second conductive structure 133 in the first via hole 1320 is smaller in this embodiment, which is equivalent to changing the conductive structure from a planar structure to a dot structure, and the influence is smaller relative to the whole flexible circuit board 1, so that the flexible circuit board 1 is softer.
5. In this embodiment, to facilitate routing, the bending region 12 also has a via conductive structure similar to the second non-bending region 13. The side of the third conductive structure 121 away from the substrate 102 is wrapped with the second protection structure 122, which plays an insulating or protecting role.
In the description of the present application, directions or positional relationships indicated by words such as "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are based on exemplary directions or positional relationships shown in the drawings, are for convenience of description or simplification of describing embodiments of the present application, and do not indicate or imply that the devices or components referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.
The foregoing is only a part of the embodiments of the present application, and it should be noted that, for those skilled in the art, other similar implementation means based on the technical idea of the present application may be adopted without departing from the technical idea of the solution of the present application, which is also within the protection scope of the embodiments of the present application.
Claims (11)
1. A flexible circuit board, comprising: a first non-bending region, a bending region, and a second non-bending region;
the flexible circuit board is in a flattened state, and the first non-bending area, the bending area and the second non-bending area are distributed in sequence along a first direction; in the first direction, the first non-bending region has a first design dimension such that the bending region has a second design dimension;
the flexible circuit board is in a bending state, the first non-bending area is configured to be arranged on one side, far away from the backlight module, of the display panel, and the second non-bending area is configured to be arranged on one side, far away from the display panel, of the backlight module.
2. The flexible circuit board of claim 1, wherein the first design dimension is not less than 1.6 millimeters and less than 1.8 millimeters.
3. The flexible circuit board of claim 1, wherein the flexible circuit board comprises a conductive layer and a substrate arranged in a stack;
the thickness of the substrate is less than 19 microns and less than 25 microns.
4. A flexible circuit board according to claim 3, further comprising a first conductive structure and a first protective structure located in sequence on a side of the substrate remote from the conductive layer in the second non-bending region;
the first protection structure is provided with a first via hole; the flexible circuit board further comprises a second conductive structure arranged in the first via hole; the second conductive structure is electrically connected with the conductive layer and the first conductive structure respectively.
5. A flexible circuit board according to claim 3, further comprising a third conductive structure and a second protective structure in the bending region, in sequence on a side of the substrate remote from the conductive layer;
the second protection structure is provided with a second via hole; the flexible circuit board further comprises a fourth conductive structure arranged in the second via hole; the fourth conductive structure is electrically connected with the conductive layer and the third conductive structure respectively.
6. The flexible circuit board of claim 3, wherein the flexible circuit board further comprises a protective layer;
the protective layer is arranged on one side of the conductive layer away from the substrate.
7. The flexible circuit board of claim 3, further comprising a third protective structure on a side of the substrate remote from the conductive layer in the first non-flex region;
one side of the third protection structure far away from the substrate is used for being connected with the display panel.
8. A display device, comprising: the flexible circuit board of any of claims 1-7.
9. The display device according to claim 8, further comprising: a frame structure, a laminated display panel and a backlight module;
the frame structure comprises a first part and a second part which form an included angle with each other; the first part is arranged on one side of the display panel away from the backlight module, and the second part is arranged on the periphery of the end parts of the laminated display panel and the backlight module;
the flexible circuit board is in under the bending state, the first non-bending area of the flexible circuit board is arranged between the frame structure and the display panel, the part bending area of the flexible circuit board is arranged between the second part and the backlight module and is connected with the second part, and the second non-bending area of the flexible circuit board is arranged on one side, far away from the display panel, of the backlight module.
10. The display device according to claim 9, further comprising: a printed circuit board;
the printed circuit board is arranged on one side of the backlight module, which is far away from the display panel, and part of the second non-bending area is positioned on one side of the printed circuit board, which is far away from the backlight module;
the projection of the printed circuit board on the substrate of the flexible circuit board is not overlapped with the projection of the first conductive structure on the substrate.
11. The display device according to claim 10, further comprising: a shielding layer;
the second protection structure of the flexible circuit board is arranged between the second part and the substrate of the flexible circuit board;
the shielding layer is arranged on one side of the second part, the other part of the bending area and the second non-bending area, which is far away from the backlight module.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210557690.5A CN117135807A (en) | 2022-05-19 | 2022-05-19 | Flexible circuit board and display device |
| PCT/CN2023/092297 WO2023221784A1 (en) | 2022-05-19 | 2023-05-05 | Flexible circuit board and display apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210557690.5A CN117135807A (en) | 2022-05-19 | 2022-05-19 | Flexible circuit board and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117135807A true CN117135807A (en) | 2023-11-28 |
Family
ID=88834525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210557690.5A Pending CN117135807A (en) | 2022-05-19 | 2022-05-19 | Flexible circuit board and display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117135807A (en) |
| WO (1) | WO2023221784A1 (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080070277A (en) * | 2007-01-26 | 2008-07-30 | 삼성전자주식회사 | Back light assembly and display apparatus having the same |
| CN109872635B (en) * | 2019-03-29 | 2021-07-16 | 厦门天马微电子有限公司 | Display device and manufacturing method thereof |
| CN110174723B (en) * | 2019-04-29 | 2020-05-15 | 厦门天马微电子有限公司 | Display module and display device |
| CN110082961B (en) * | 2019-05-27 | 2024-04-05 | 武汉华星光电技术有限公司 | Glue frame, backlight module and display device |
| CN110189633B (en) * | 2019-05-27 | 2022-01-18 | Oppo广东移动通信有限公司 | Display screen assembly, electronic device and manufacturing method of display screen assembly |
| CN211786483U (en) * | 2020-04-17 | 2020-10-27 | 北京小米移动软件有限公司 | Display screen and mobile terminal |
| CN213545004U (en) * | 2020-11-11 | 2021-06-25 | 维沃移动通信有限公司 | Electronic device |
| CN113363297B (en) * | 2021-05-31 | 2023-02-03 | 深圳市华星光电半导体显示技术有限公司 | Display panel, assembling method thereof and splicing display device |
-
2022
- 2022-05-19 CN CN202210557690.5A patent/CN117135807A/en active Pending
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2023
- 2023-05-05 WO PCT/CN2023/092297 patent/WO2023221784A1/en unknown
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|---|---|
| WO2023221784A1 (en) | 2023-11-23 |
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