CN117133744B - Packaging integrated backboard and preparation device thereof - Google Patents
Packaging integrated backboard and preparation device thereof Download PDFInfo
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- CN117133744B CN117133744B CN202311400710.9A CN202311400710A CN117133744B CN 117133744 B CN117133744 B CN 117133744B CN 202311400710 A CN202311400710 A CN 202311400710A CN 117133744 B CN117133744 B CN 117133744B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 47
- 229910000833 kovar Inorganic materials 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 27
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 3
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- GBCAVSYHPPARHX-UHFFFAOYSA-M n'-cyclohexyl-n-[2-(4-methylmorpholin-4-ium-4-yl)ethyl]methanediimine;4-methylbenzenesulfonate Chemical compound CC1=CC=C(S([O-])(=O)=O)C=C1.C1CCCCC1N=C=NCC[N+]1(C)CCOCC1 GBCAVSYHPPARHX-UHFFFAOYSA-M 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention relates to the technical field of packaging shells and discloses a packaging integrated backboard and a preparation device thereof. According to the invention, the steering position of the welding line can be continuously processed through the welding line path of the two electrodes, the angle between the end parts of the electrodes and the welding line is always constant, the width of the welding line can be effectively controlled through controlling the welding line position of the two parts welded at the electrode ends to be about 45 degrees through the angle, meanwhile, the welded welding line is continuous, the probability of loopholes appearing at the steering position is reduced, and the assembly stability of the backboard is improved.
Description
Technical Field
The invention relates to the field of packaging shells, in particular to a packaging integrated backboard and a preparation device thereof.
Background
The radio frequency power transistor (RF Power Transistor) is a transistor device for amplifying high power in a wireless signal. It is widely used in the fields of wireless communication system, radar, broadcast transmission, power amplification in radio frequency band, etc.
Rf power transistors are typically made of semiconductor materials such as silicon or compound semiconductors. The high-frequency power amplifier has high frequency characteristic and large power bearing capacity, and can effectively amplify an input signal to high output power so as to meet the signal transmission requirement in a wireless communication system.
Rf power transistors play a critical role in wireless communication systems and provide high performance power amplification functions that enable wireless signals to be transmitted over longer distances or better coverage in complex environments.
The enclosure of the radio frequency power transistor provides good protection for the radio frequency power transistor, a matched cover plate in the enclosure adopts a step cover structure, the parallel seam welding process is adopted, a certain angle exists at a welding end of the parallel seam welding when the parallel seam welding is carried out, a welding seam of the parallel seam welding is relatively wide, so that the welding strength is possibly low, when the welding end turns to the parallel seam, electrodes are transferred on two sides, the welding angle is deviated, the problem of discontinuous welding seam occurs, and the problem of sealing failure is caused due to the fact that loopholes are easily generated at the turning position.
Disclosure of Invention
The invention provides a packaging integrated backboard and a preparation device thereof, which solve the technical problems that when a welding end turns in a parallel gap, electrodes are transferred at two sides, the welding angle is deviated, and then the problem of discontinuous welding seams is caused, and a leak is caused at the turning position, so that sealing is invalid in the related art.
The invention provides a packaging integrated backboard, which is used for packaging a radio frequency power transistor, wherein the packaging comprises a bottom plate, a kovar metal ring frame, a radio frequency feed-through assembly and a cover plate, wherein the kovar metal ring frame is arranged on the upper plate surface of the bottom plate, the radio frequency feed-through assembly is arranged on the outer wall of the kovar metal ring frame, and the cover plate is pressed on the kovar metal ring frame;
the radio frequency feed-through assembly comprises a plurality of radio frequency feed-through pipes;
the cover plate is a step cover, and the joint of the cover plate and the kovar metal ring frame is sealed by parallel seam welding.
Further, the inner side wall of the bottom end of the bottom plate is provided with a heat sink plate which is made of CPC, CMC, tungsten copper, molybdenum copper or Cu-Dia materials.
Further, an alumina ceramic seat is arranged at the joint of the radio frequency feed-through pipe and the kovar metal ring frame.
The invention also provides a preparation device of the packaging integrated backboard, which is used for preparing the packaging integrated backboard, and comprises an assembly component, a parallel seam welding component, a material conveying component, a transfer table and a feeding vibration disk, wherein the material conveying component conveys a bottom plate and a kovar metal ring frame to the assembly component together, the feeding vibration disk conveys a radio frequency feed-through pipe to the assembly component, the assembly component assembles the radio frequency feed-through pipe to the kovar metal ring frame, meanwhile, a cover plate is placed on the kovar metal ring frame, the parallel seam welding component seals the cover plate and the kovar metal ring frame through parallel seam welding, and the welded and sealed packaging piece conveys blanking through the transfer table;
the parallel seam welding assembly comprises an electrode assembly, an inserting rod assembly and a driving cylinder, wherein the output end of the driving cylinder is connected with the end part of the electrode assembly, the inserting rod assembly is arranged at the upper end of the electrode assembly, the electrode assembly comprises two groups of electrodes, a pushing block and a sliding sleeve, the pushing block is slidably connected in the inner side of the sliding sleeve, the end parts of the electrodes are provided with connecting rods, the end parts of the connecting rods on the two groups of electrodes are hinged, the middle parts of the two groups of electrodes are provided with rotating columns, the inserting rod assembly comprises a driving source and a pushing column, the driving end of the driving source is connected with the end part of the pushing column, the pushing column can be inserted and pulled in the rotating columns, when the pushing column is inserted in the rotating columns, the opening state of the two groups of electrodes can be kept, and the two groups of electrodes in the opening state move together with the pushing block.
Further, the inserted link assembly further comprises a worm motor, a worm wheel, a worm, a cam and a reset spring, wherein the worm is arranged on an output shaft of the worm motor, the worm wheel is connected with the worm in a meshed mode, the worm wheel is connected with the cam through a shaft, the end face of the cam is connected with the push column, and the reset spring is sleeved on the outer wall of the push column.
Further, a sliding groove is formed in the top end of the sliding sleeve, and when the pushing column is inserted into the rotating column, the inserting rod assembly moves along the groove of the sliding groove through the driving cylinder.
Further, the assembly component comprises a positioning cylinder, clamping blocks and an assembly seat, an assembly groove is formed in the assembly seat, the clamping blocks are arranged in groove walls on two sides of the assembly groove, the output end of the positioning cylinder is connected with the outer side walls of the clamping blocks, and the clamping blocks are used for propping against the outer wall of the alumina ceramic seat and pressing the alumina ceramic seat onto the kovar metal ring frame.
Further, a transferring clamp is further arranged on the workbench and used for conveying the bottom plate and the kovar metal ring frame together into an assembly groove on the assembly seat.
Further, all open on the four sides of switching platform has defeated silo, all is equipped with pneumatic chuck in the cell wall of defeated silo, and pneumatic chuck's tip is equipped with the sucking disc cylinder, and the sucking disc cylinder drives pneumatic chuck along the groove of defeated silo to remove.
Further, be equipped with apron unloading box directly over the assembly seat, the inside horizontal pile of apron is in the inside of apron unloading box.
The invention has the beneficial effects that: the preparation device can continuously process the steering position of the welding line through the welding line path of the two electrodes, the angle between the end part of the electrode and the welding line is always constant, the width of the welding line can be effectively controlled through controlling the welding line position of the electrode end and the two welded parts to be about 45 degrees through the angle, meanwhile, the welded welding line is continuous, the probability of loopholes appearing at the steering position is reduced, and the assembly stability of the backboard is improved.
Drawings
Fig. 1 is a schematic structural diagram of a device for manufacturing a package-integrated back plate according to the present invention;
FIG. 2 is a schematic diagram of a package-integrated back plate according to the present invention;
FIG. 3 is a schematic view of the parallel seam welding assembly of FIG. 1 in accordance with the present invention;
FIG. 4 is a schematic diagram of the structure of the present invention from another perspective of FIG. 3;
fig. 5 is a schematic structural view of the electrode assembly of fig. 4 according to the present invention;
FIG. 6 is a schematic view of an operating state of the electrode assembly of FIG. 4 according to the present invention;
FIG. 7 is a schematic view of the transfer station of FIG. 1 according to the present invention;
fig. 8 is a schematic view of the feed assembly of fig. 1 according to the present invention.
In the figure: 100. a work table; 110. a blanking channel; 200. assembling the assembly; 210. positioning a cylinder; 220. clamping blocks; 230. an assembly seat; 300. a transfer table; 310. a base; 320. a servo motor; 330. a material distributing disc; 340. a suction cup cylinder; 350. a pneumatic chuck; 360. a limit rod; 400. a package; 410. a bottom plate; 420. a first radio frequency feed-through tube; 430. a second radio frequency feed-through tube; 440. a cover plate; 450. a heat sink plate; 500. a first vibration plate; 600. a second vibration plate; 700. a parallel seam welding assembly; 710. a cover plate blanking box; 720. a longitudinal motor; 730. a transverse slide rail; 740. a slide; 750. a transverse cylinder; 760. an electrode assembly; 761. an electrode; 762. a pushing block; 763. a sliding sleeve; 770. a plunger assembly; 771. a worm motor; 772. a worm wheel; 773. a worm; 774. a cam; 775. pushing a column; 780. a driving cylinder; 800. transferring the clamp; 900. a material conveying component; 910. a swing cylinder; 920. a Y-axis sliding table; 930. an X-axis sliding table; 940. a bracket; 950. a Z-axis sliding table; 960. and preheating the platform.
Detailed Description
The subject matter described herein will now be discussed with reference to example embodiments. It is to be understood that these embodiments are merely discussed so that those skilled in the art may better understand and implement the subject matter described herein and that changes may be made in the function and arrangement of the elements discussed without departing from the scope of the disclosure herein. Various examples may omit, replace, or add various procedures or components as desired. In addition, features described with respect to some examples may be combined in other examples as well.
Referring to fig. 2, a package integrated back plate is shown, which is used for a package 400 of a radio frequency power transistor package, wherein the package 400 comprises a bottom plate 410, a kovar metal ring frame, a radio frequency feed-through assembly and a cover plate 440, the kovar metal ring frame is arranged on the upper plate surface of the bottom plate 410, the radio frequency feed-through assembly is arranged on the outer wall of the kovar metal ring frame, and the cover plate 440 is pressed on the kovar metal ring frame;
the rf feed-through assembly comprises a plurality of rf feed-through tubes, as shown in fig. 2, the packaging integrated backboard adopts a standard packaging structure of a 2pin rf power transistor, namely, the number of the rf feed-through tubes is two, and the rf feed-through assembly comprises a first rf feed-through tube 420 and a second rf feed-through tube 430;
the cover plate 440 is a step cover, and the joint of the cover plate 440 and the kovar metal ring frame is sealed by parallel seam welding.
The inner side wall of the bottom end of the bottom plate 410 is provided with a heat sink plate 450, the heat sink plate 450 is made of CPC, CMC, tungsten copper, molybdenum copper or Cu-Dia materials, the heat sink plate 450 is made of CPC, CMC, tungsten copper, molybdenum copper and other high heat dissipation materials, the heat conductivity is 260W/m.K at most, and if the heat conductivity is 580W/m.K.
The joint of the radio frequency feed-through pipe and the kovar metal ring frame is provided with an alumina ceramic seat, the enclosure radio frequency feed-through adopts an HTCC ceramic process, the C-band requirement can be met, and the X-band index can be met at the highest.
The external structure, the size and the number of the radio frequency feed-through pins of the package integrated backboard can be customized.
Referring to fig. 1 to 8, a device for preparing an integrated back plate for packaging is used for preparing the integrated back plate for packaging, and comprises an assembly 200, a parallel seam welding assembly 700, a material conveying assembly 900, an adapting table 300 and a feeding vibration disk, wherein the material conveying assembly 900 conveys a bottom plate 410 and a kovar metal ring frame together to the assembly 200, the feeding vibration disk conveys a radio frequency feed-through pipe to the assembly 200, the assembly 200 assembles the radio frequency feed-through pipe to the kovar metal ring frame, and simultaneously places a cover plate 440 on the kovar metal ring frame, the parallel seam welding assembly 700 seals the cover plate 440 and the kovar metal ring frame through parallel seam welding, and conveys a sealed package 400 to blanking through the adapting table 300;
the parallel seam welding assembly 700 comprises an electrode assembly 760, a rod inserting assembly 770 and a driving cylinder 780, wherein the output end of the driving cylinder 780 is connected with the end part of the electrode assembly 760, the rod inserting assembly 770 is arranged at the upper end of the electrode assembly 760, the electrode assembly 760 comprises two groups of electrodes 761, a push block 762 and a sliding sleeve 763, the push block 762 is connected in the inner side of the sliding sleeve 763 in a sliding mode, connecting rods are arranged at the end parts of the electrodes 761, the connecting rods on the two groups of electrodes 761 are hinged, a rotary column is arranged in the middle of the two groups of electrodes 761, the rod inserting assembly 770 comprises a driving source and a push column 775, the driving end of the driving source is connected to the end part of the push column 775, the push column 775 can be inserted into the rotary column, when the push column 775 is inserted into the rotary column, the open state of the two groups of electrodes 761 can be kept, and the two groups of electrodes 761 in the open state move together with the push block 762.
The outside of the electrode assembly 760 is provided with a bracket, the bracket is connected with a sliding seat 740, the transverse sliding rail 730 is provided with a sliding seat, a longitudinal motor 720 is arranged on the sliding seat, the output shaft of the longitudinal motor 720 is connected with a lead screw, the lead screw is connected with the sliding seat 740, the output end of a transverse cylinder 750 is connected with the outer wall of the sliding seat, and the transverse cylinder 750 is arranged on the end part of the transverse sliding rail 730;
the plunger assembly 770 further comprises a worm motor 771, a worm wheel 772, a worm 773, a cam 774 and a reset spring, wherein the worm 773 is arranged on an output shaft of the worm motor 771, the worm wheel 772 is connected with the worm 773 in a meshed mode, the worm wheel 772 is connected with the cam 774 through a shaft, the end face of the cam 774 is connected with the push column 775, and the reset spring is sleeved on the outer wall of the push column 775.
The top end of the sliding sleeve 763 is provided with a sliding groove, and when the push post 775 is inserted into the rotating post, the inserted rod assembly 770 moves along the groove of the sliding groove through the driving cylinder 780.
The rotating column is sleeved with a reset coil spring which is used for resetting the two groups of electrodes 761 in the middle, the pushing column 775 is of a frustum-shaped structure, and a conical groove matched with the pushing column 775 is formed in the rotating column;
the assembly 200 comprises a positioning cylinder 210, a clamping block 220 and an assembly seat 230, wherein an assembly groove is formed in the assembly seat 230, the clamping block 220 is arranged in the groove walls at two sides of the assembly groove, the output end of the positioning cylinder 210 is connected with the outer side wall of the clamping block 220, and the clamping block 220 is used for propping against the outer wall of the alumina ceramic seat and pressing the alumina ceramic seat onto the kovar metal ring frame.
The workbench 100 is further provided with a transferring clamp 800, the transferring clamp 800 can be used for moving in the X axis, the Y axis and the Z axis, corresponding driving sources are respectively arranged on the X axis, the Y axis and the Z axis, and the transferring clamp 800 is used for conveying the bottom plate 410 and the kovar metal ring frame together into the assembly groove on the assembly seat 230.
Four sides of the transfer table 300 are provided with material conveying grooves, pneumatic suction cups 350 are arranged in the groove walls of the material conveying grooves, suction cup air cylinders 340 are arranged at the end parts of the pneumatic suction cups 350, the suction cup air cylinders 340 drive the pneumatic suction cups 350 to move along the groove directions of the material conveying grooves, limit rods 360 are arranged on the groove openings of the material conveying grooves, and the limit rods 360 are used for abutting against the outer walls of the packaging pieces 400;
the transfer table 300 comprises a base 310, a servo motor 320 and a distributing disc 330, wherein the servo motor 320 is arranged on the base 310, the distributing disc 330 is arranged on an output shaft of the servo motor 320, a supporting plate is arranged at the bottom end of the distributing disc 330, the supporting plate is arranged in the bottom of a conveying trough, a blanking channel 110 is arranged on one side of the workbench 100, the blanking channel 110 is arranged on one side of the distributing disc 330, and the blanking channel 110 is used for receiving prepared packaging pieces 400.
One side of the material distributing disc 330 is provided with a CCD, the CCD is used for performing nodding on the package 400, and the CCD is used for detecting the quality of the package 400 after parallel seam welding in the prior art;
a cover plate blanking box 710 is arranged right above the assembly seat 230, and the cover plate 440 is horizontally stacked in the cover plate blanking box 710.
The material conveying assembly 900 comprises a preheating platform 960, a Z-axis sliding table 950, a support 940, a swinging air cylinder 910, a Y-axis sliding table 920 and an X-axis sliding table 930, wherein the Y-axis sliding table 920 is arranged on the X-axis sliding table 930, the support 940 is arranged at the top end of the X-axis sliding table 930, the Z-axis sliding table 950 is arranged on the support 940, the preheating platform 960 is arranged at the top end of the Z-axis sliding table 950, the swinging air cylinder 910 is arranged on the outer wall of the bottom end of the X-axis sliding table 930, a preheating groove is arranged on the preheating platform 960 and is matched with the specification of the bottom plate 410, and driving sources are respectively arranged on the Y-axis sliding table 920, the X-axis sliding table 930 and the Z-axis sliding table 950 and comprise linear driving members such as air cylinders.
The feeding vibration plate includes, but is not limited to, a first vibration plate 500 and a second vibration plate 600, where the first vibration plate 500 and the second vibration plate 600 respectively convey the first rf feed-through pipe 420 and the second rf feed-through pipe 430 into the assembly base 230.
A reject port is provided on a side of the table 100 near the tray 330, and the reject port is used for rejecting unqualified packages 400.
The preparation flow of the preparation device of the packaging integrated backboard is as follows:
1. preheating
The bottom plate 410 and the kovar metal ring frame are arranged on the preheating platform 960, after preheating, the radio frequency power transistor is arranged in the kovar metal ring frame and clamped and transferred into the assembly seat 230 through the transfer clamp 800;
2. radio frequency feed-through pipe installation
The first and second rf feed-through pipes 420 and 430 are respectively delivered to both sides of the assembly base 230 through the first and second vibration plates 500 and 600, and the first and second rf feed-through pipes 420 and 430 are mounted to both sides of the kovar metal ring frame by pushing the clamping blocks 220 at both sides to press the first and second rf feed-through pipes 420 and 430 through the positioning cylinder 210;
3. parallel seam welded seal
The driving cylinder 780 in the parallel seam welding assembly 700 drives the pushing block 762 to move along the sliding sleeve 763, the connecting rod and the electrode 761 connected with the pushing block 762 are driven to rotate, the two groups of electrodes 761 rotate around the rotating column, the two groups of electrodes 761 are separated, meanwhile, in the separation process, the electrodes 761 move in opposite directions, the joint of the cover plate 440 and the kovar metal ring frame is welded, one side of the kovar metal ring frame and one side of the cover plate 440 are welded, the pushing column 775 is inserted into the rotating column downwards through the inserting rod assembly 770, an open state between the two electrodes 761 is maintained, the driving cylinder 780 drives the pushing block 762 and the electrode assembly 760 to move together, the two groups of electrodes 761 are driven to perform parallel seam welding on two sides of the kovar metal ring frame, after the two sides of the parallel seam welding, the inserting rod assembly 770 draws the pushing column 775 at the same speed, the two groups of electrodes 761 approach in the middle, and the other side of the kovar metal ring frame is subjected to parallel seam welding, and the parallel seam welding on the whole four sides is completed;
the inserted link assembly 770 drives a worm 773 to rotate through a worm motor 771, the worm 773 drives a worm wheel 772 to rotate, the worm wheel 772 drives a cam 774 to rotate, the cam 774 abuts against a push post 775, and the push post 775 is inserted into the rotary post downwards;
the cam 774 rotates, the push column 775 is reset through the reset spring, the push column 775 is pulled out of the rotating column, and meanwhile, the rotating column drives the two groups of electrodes 761 to move in the middle under the reset coil spring;
4. detecting blanking
The distributing disc 330 is driven by the servo motor 320, the notch position of the material conveying groove is corresponding to the assembly groove of the assembly seat 230, the pneumatic sucking disc 350 is driven by the sucking disc cylinder 340 to transfer the packaging piece 400 subjected to parallel seam welding to the material conveying groove, the packaging piece 400 is driven to appear under the CCD through the rotation of the servo motor 320, the CCD detects the packaging piece 400, after the detection is qualified, the discharging is carried out from one side of the material discharging groove 110, and if the detection is disqualified, the discharging disc is rotated along with the rotation of the distributing disc 330, and then the discharging is pushed into the material discharging opening.
The embodiment has been described above with reference to the embodiment, but the embodiment is not limited to the above-described specific implementation, which is only illustrative and not restrictive, and many forms can be made by those of ordinary skill in the art, given the benefit of this disclosure, are within the scope of this embodiment.
Claims (7)
1. The preparation device of the packaging integrated backboard is characterized in that the preparation device comprises an assembly component (200), a parallel seam welding component (700), a material conveying component (900), a transfer table (300) and a material feeding vibration plate, wherein the material conveying component (900) conveys the bottom plate (410) and the kovar metal ring frame together to the assembly component (200), the material feeding vibration plate conveys the radio frequency feed-through pipe to the assembly component (200), the assembly component (200) assembles the radio frequency feed-through pipe to the kovar metal ring frame, meanwhile, the cover plate (440) is placed on the kovar metal ring frame, the parallel seam welding component (700) conveys the cover plate (440) and the kovar metal ring frame to the seal table (300) through the transfer table after passing through the seal table (400);
the parallel seam welding assembly (700) comprises an electrode assembly (760), an inserting rod assembly (770) and a driving air cylinder (780), wherein the output end of the driving air cylinder (780) is connected with the end part of the electrode assembly (760), the inserting rod assembly (770) is arranged at the upper end of the electrode assembly (760), the electrode assembly (760) comprises two groups of electrodes (761), a pushing block (762) and a sliding sleeve (763), the pushing block (762) is slidably connected in the inner side of the sliding sleeve (763), connecting rods are arranged at the end parts of the electrodes (761), the connecting rod end parts of the two groups of electrodes (761) are hinged, a rotary column is arranged in the middle of the two groups of electrodes (761), the inserting rod assembly (770) comprises a driving source and a pushing column (775), the driving end of the driving source is connected with the end part of the pushing column (775), the pushing column (775) can be inserted into the rotary column, when the pushing column (775) is inserted into the rotary column, the two groups of electrodes (761) can be kept in an open state, and the two groups of electrodes (761) in an open state can move together with the pushing block (761).
2. The device for manufacturing the packaging integrated backboard according to claim 1, wherein the inserted link assembly (770) further comprises a worm motor (771), a worm wheel (772), a worm (773), a cam (774) and a return spring, the worm (773) is mounted on an output shaft of the worm motor (771), the worm wheel (772) is meshed with the worm (773), the worm wheel (772) is connected with the cam (774) through a shaft, the end face of the cam (774) is connected with the pushing column (775), and the return spring is sleeved on the outer wall of the pushing column (775).
3. The device for manufacturing the packaging-integrated backboard according to claim 2, wherein a sliding groove is formed in the top end of the sliding sleeve (763), and when the push post (775) is inserted into the rotating post, the insert rod assembly (770) moves along the groove of the sliding groove through the driving cylinder (780).
4. A device for manufacturing a packaging integrated back plate according to claim 3, wherein the assembly (200) comprises a positioning cylinder (210), a clamping block (220) and an assembly seat (230), an assembly groove is formed in the assembly seat (230), the clamping block (220) is arranged in two side groove walls of the assembly groove, an output end of the positioning cylinder (210) is connected with an outer side wall of the clamping block (220), and the clamping block (220) is used for abutting against an outer wall of an alumina ceramic seat and pressing the alumina ceramic seat onto a kovar metal ring frame.
5. The device for manufacturing the integrated back plate for packaging according to claim 4, wherein the workbench (100) is further provided with a transferring clamp (800), and the transferring clamp (800) is used for conveying the bottom plate (410) and the kovar metal ring frame together into the assembly groove on the assembly base (230).
6. The device for manufacturing the packaging integrated backboard according to claim 5, wherein the four sides of the transfer table (300) are provided with the material conveying grooves, the pneumatic suction cups (350) are arranged in the groove walls of the material conveying grooves, the suction cup cylinders (340) are arranged at the end parts of the pneumatic suction cups (350), and the suction cup cylinders (340) drive the pneumatic suction cups (350) to move along the groove of the material conveying grooves.
7. The device for manufacturing the integrated back plate for packaging according to claim 6, wherein a cover plate blanking box (710) is arranged right above the assembly seat (230), and the cover plate (440) is horizontally stacked in the cover plate blanking box (710).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311400710.9A CN117133744B (en) | 2023-10-26 | 2023-10-26 | Packaging integrated backboard and preparation device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311400710.9A CN117133744B (en) | 2023-10-26 | 2023-10-26 | Packaging integrated backboard and preparation device thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117133744A CN117133744A (en) | 2023-11-28 |
| CN117133744B true CN117133744B (en) | 2024-01-30 |
Family
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107481983A (en) * | 2017-09-14 | 2017-12-15 | 苏州中航天成电子科技有限公司 | A kind of Microwave Power Tubes package casing, preparation method and cooling system |
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| WO2022236750A1 (en) * | 2021-05-12 | 2022-11-17 | 重庆康佳光电技术研究院有限公司 | Chip temporary component, display panel and manufacturing method therefor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107481983A (en) * | 2017-09-14 | 2017-12-15 | 苏州中航天成电子科技有限公司 | A kind of Microwave Power Tubes package casing, preparation method and cooling system |
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