CN117119348A

CN117119348A - Audio circuit, circuit board and electronic equipment

Info

Publication number: CN117119348A
Application number: CN202211080573.0A
Authority: CN
Inventors: 吴志华; 李婷婷
Original assignee: Shenzhen Tcl Yunchuang Technology Co ltd
Current assignee: Shenzhen Tcl Yunchuang Technology Co ltd
Priority date: 2022-09-05
Filing date: 2022-09-05
Publication date: 2023-11-24
Also published as: WO2024051393A1

Abstract

The embodiment of the application discloses an audio circuit, a circuit board and electronic equipment, wherein the audio circuit comprises a main chip and is used for decoding audio information to obtain digital audio information; the audio chip is connected with the main chip and is used for performing digital-to-analog conversion on the digital audio information to obtain analog audio information, amplifying the analog audio information to obtain driving information, and outputting the driving information to the loudspeaker; the first grounding end is connected with the grounding end of the main chip; the second grounding end is connected with the grounding end of the audio chip, and the first grounding end and the second grounding end are arranged in an isolated mode. The embodiment of the application can reduce noise interference to the audio circuit and improve the audio experience of a user.

Description

Audio circuit, circuit board and electronic equipment

Technical Field

The present application relates to the field of electronic technologies, and in particular, to an audio circuit, a circuit board, and an electronic device.

Background

With the increasing quality of life, people play audio by using various electronic devices has become an indispensable part of daily life, and requirements of people on sound quality effects of playing audio by electronic devices are also higher and higher, functions of current electronic devices are more and more abundant, corresponding functional circuits are more and more, such as a display circuit, a radio frequency circuit, a touch circuit, a camera circuit, a charging circuit and the like, however, other functional circuits easily generate noise interference to an audio circuit, and noise is perceived by a user, so that audio experience of the user is reduced.

Disclosure of Invention

The embodiment of the application provides an audio circuit, a circuit board and electronic equipment, which can reduce noise interference on the audio circuit and improve audio experience of a user.

In a first aspect, an embodiment of the present application provides an audio circuit, including:

the main chip is used for decoding the audio information to obtain digital audio information;

the audio chip is connected with the main chip and is used for performing digital-to-analog conversion on the digital audio information to obtain analog audio information, amplifying the analog audio information to obtain driving information and outputting the driving information to a loudspeaker;

the first grounding end is connected with the grounding end of the main chip;

the second grounding end is connected with the grounding end of the audio chip, and the first grounding end and the second grounding end are arranged in an isolated mode.

Optionally, the main chip further includes a first power supply end, configured to receive a first working voltage;

the audio chip further comprises a second power supply end for receiving a second working voltage.

Optionally, the audio circuit further includes:

the power management chip comprises a first power output end and a second power output end, wherein the first power output end is connected with the first power supply end, the second power output end is connected with the second power supply end, and the first working voltage output by the first power output end is different from the second working voltage output by the second power output end.

Optionally, the audio chip includes:

the digital-to-analog conversion module is used for carrying out digital-to-analog conversion on the digital audio information so as to obtain analog audio information;

and the audio power amplification module is used for amplifying the analog audio information to obtain driving information.

In a second aspect, an embodiment of the present application provides a circuit board, including:

a circuit area on which the audio circuit of any of the above embodiments is disposed;

the signal wiring area comprises a first signal wiring and a second signal wiring which are mutually spaced, and the first signal wiring and the second signal wiring are respectively and electrically connected with an audio chip of the audio circuit and used for transmitting the driving information;

the first signal wire and the second signal wire are connected through a first grounding wire, and the first grounding wire is electrically connected with a second grounding end of the audio circuit.

Optionally, the signal routing area further includes:

the fourth grounding wire is arranged on the same layer as the first grounding wire and is mutually spaced, the fourth grounding wire is arranged on one side of the first signal wire away from the first grounding wire, and the fourth grounding wire is connected with the first grounding end;

The fifth grounding wire is arranged on the same layer as the first grounding wire and is mutually spaced, the fifth grounding wire is arranged on one side, far away from the first grounding wire, of the second signal wire, and the fifth grounding wire is connected with the first grounding end.

Optionally, the circuit board further includes a first shielding protection layer, and the first shielding protection layer is disposed on one side of the signal routing area, and includes a second grounding wire, where the orthographic projection of the second grounding wire in the signal routing area covers the first signal routing, the first grounding wire and the second signal routing, and the second grounding wire is connected with the second grounding end.

Optionally, the circuit board further includes a second shielding protection layer, and the second shielding protection layer is disposed on the other side of the signal routing area, and includes a third grounding routing, where the orthographic projection of the third grounding routing in the signal routing area covers the first signal routing, the first grounding routing and the second signal routing, and the third grounding routing is connected with the second grounding end.

Optionally, the first shielding protection layer further includes a sixth grounding trace and a seventh grounding trace, the sixth grounding trace and the seventh grounding trace are arranged on the same layer and are spaced from each other, and the sixth grounding trace and the seventh grounding trace are respectively arranged at two sides of the second grounding trace.

Optionally, the second shielding protection layer further includes an eighth grounding trace and a ninth grounding trace, the eighth grounding trace and the ninth grounding trace are arranged on the same layer and are spaced from each other, and the eighth grounding trace and the ninth grounding trace are respectively arranged at two sides of the third grounding trace.

Optionally, the circuit board further includes:

the first grounding end is connected with the first grounding area;

the second grounding end is connected with the second grounding area;

and the first grounding area and the second grounding area are respectively connected with the main grounding area, and the area of the main grounding area is larger than that of the first grounding area and the second grounding area.

In a third aspect, an embodiment of the present application provides an electronic device, including:

a circuit board as in any one of the above embodiments;

and the loudspeaker is electrically connected with the audio chip of the circuit board.

Optionally, the second ground terminal is further configured to be electrically connected to the speaker.

In the embodiment of the application, the grounding end of the main chip is connected with the first grounding end, the grounding end of the audio chip is connected with the second grounding end, the first grounding end and the second grounding end are arranged in an isolated manner, the first grounding end can be used for being connected with the grounding end of the main chip and other functional circuits, and the second grounding end is only used for being connected with the audio circuit and is not connected with the main chip and other functional circuits, so that the second grounding end has no interference noise generated by the main chip or other functional circuits, and noise interference on the audio circuit can be reduced and audio experience of a user is improved by connecting the audio chip with the second grounding end.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of a first structure of an audio circuit according to an embodiment of the present application.

Fig. 2 is a schematic diagram of a first structure of a circuit board according to an embodiment of the present application.

Fig. 3 is a schematic diagram of a second structure of an audio circuit according to an embodiment of the present application.

Fig. 4 is a schematic diagram of a second structure of a circuit board according to an embodiment of the present application.

Fig. 5 is a schematic diagram of a third structure of an audio circuit according to an embodiment of the present application.

Fig. 6 is a schematic diagram of a first structure of a signal routing area according to an embodiment of the present application.

Fig. 7 is a schematic diagram of a second structure of a signal routing area according to an embodiment of the present application.

Fig. 8 is a schematic diagram of a third structure of a circuit board according to an embodiment of the present application.

Fig. 9 is a schematic diagram of a first structure of a first shielding protection layer and a second shielding protection layer according to an embodiment of the present application.

Fig. 10 is a schematic diagram of a third structure of a signal routing area according to an embodiment of the present application.

Fig. 11 is a schematic diagram of a second structure of the first shielding protection layer and the second shielding protection layer according to the embodiment of the present application.

Fig. 12 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application, its application, or uses. All other embodiments, which can be made by a person skilled in the art without any inventive effort, are intended to be within the scope of the present application based on the embodiments of the present application.

People use a variety of electronic devices to play audio, such as head mounted audio devices, VR/AR devices, stereo, cell phones, tablet computers, televisions, etc., that can be used to play audio. The functions of the electronic device are more and more abundant, and corresponding functional circuits are more and more, such as a display circuit corresponding to a display function, a radio frequency circuit corresponding to a radio frequency function, a touch circuit corresponding to a touch function, a camera circuit corresponding to a camera function, and the like, however, the circuits of other functions of the electronic device easily generate noise interference to an audio circuit, and when the electronic device plays audio, the noise is perceived by a user, so that the audio experience of the user is affected.

The embodiment of the application provides an audio circuit, which can reduce noise interference generated by other functional circuits on the audio circuit, thereby improving the tone quality effect of electronic equipment. This will be described below with reference to the accompanying drawings.

Referring to fig. 1, fig. 1 is a schematic diagram of a first structure of an audio circuit according to an embodiment of the application. The audio circuit 100 includes a main chip 110, an audio chip 120, a first ground terminal 130 and a second ground terminal 140, wherein the main chip 110 is used for decoding audio information to obtain digital audio information; the audio chip 120 is connected with the main chip 110, and is used for performing digital-to-analog conversion on the digital audio information to obtain analog audio information, amplifying the analog audio information to obtain driving information, and outputting the driving information to the loudspeaker 200; the first ground 130 is connected to the ground of the main chip 110; the second ground terminal 140 is connected to the ground terminal of the audio chip 120, and the first ground terminal 130 and the second ground terminal 140 are isolated.

The main chip 110 may be considered a central processor of the electronic device 10 that can process and process various data for the various functional circuits of the electronic device 10. For the audio circuit 100, the main chip 110 may be configured to decode audio information, for example, parse an audio file in an MP3/AAC format to obtain digital audio information, and the main chip 110 may also perform algorithm processing on the digital audio information, for example, perform signal equalization, dynamic range processing, bass enhancement, spatial sound enhancement, and other processing on the digital audio information.

The audio chip 120 converts digital audio information into analog audio information, the analog audio information is easily interfered by noise of other functional circuits, and the audio chip 120 amplifies the analog audio information to obtain driving information for driving the speaker 200 to play, which makes even small noise easily perceived by a user after being amplified by the speaker 200.

In the embodiment of the present application, the ground terminal of the main chip 110 is connected to the first ground terminal 130, and the ground terminal of the audio chip 120 is connected to the second ground terminal 140, where the second ground terminal 140 is used for connecting to the audio chip 120, and the first ground terminal 130 may be used for connecting to the ground terminal of the main chip 110 and other functional circuits, for example, the first ground terminal 130 may be connected to the ground terminal of the main chip 110, the display circuit, the radio frequency circuit, the touch circuit, and the camera circuit.

For example, please refer to fig. 2, fig. 2 is a schematic diagram of a first structure of a circuit board according to an embodiment of the present application. The audio circuit 100 may be disposed on a circuit board 300, the circuit board 300 including a first ground region 150 connected to the first ground terminal 130 and a second ground region 160 connected to the second ground terminal 140.

The circuit board 300 may be a multi-layer board, for example, may be a 3-layer board, a 5-layer board, or an 8-layer board, etc., and a plurality of metal lands, for example, a plurality of copper foils printed on the circuit board 300 are provided on the circuit board 300 as metal lands, and a plurality of copper foils are separately provided, for example, a plurality of copper foils are provided at different positions or different layers on the same layer of the circuit board 300. The plurality of copper foils comprises a large-area copper foil and at least two small-area copper foils, each small-area copper foil is connected with the large-area copper foil, the small-area copper foils are not directly connected, and each small-area copper foil and the large-area copper foil can be connected through printing wiring or via 180 wiring. A large area of copper foil is used as the main ground region 170, a small area of copper foil is used as the first ground region 150, and another small area of copper foil is used as the second ground region 160. The first ground region 150 and the second ground region 160 may be located at the same layer of the circuit board 300 or may be located at different layers of the circuit board 300.

During operation, each functional circuit may generate interference noise to other functional circuits, such as interference noise generated by electromagnetic coupling between functional circuits, which may interfere with other functional circuits through the commonly connected first ground region 150. In the audio circuit 100, analog audio information is more susceptible to noise interference than digital audio information. Therefore, the first grounding terminal 130 and the second grounding terminal 140 are isolated, so that the interference signals generated by other functional circuits, such as the display circuit, the radio frequency circuit, the touch circuit, the camera circuit, etc. do not generate noise interference to the analog audio information of the audio chip 120 through the first grounding area 150. And the second grounding end 140 is only used for connecting the audio circuit 100, and is not connected with the main chip 110 and other functional circuits, the second grounding area 160 is clean and can not lead interference noise generated by the main chip 110 and other functional circuits, thereby reducing noise interference to the audio circuit 100, ensuring the quality of audio information and improving the audio experience of users.

In an embodiment, please refer to fig. 3, fig. 3 is a schematic diagram of a second structure of an audio circuit according to an embodiment of the present application. The main chip 110 further includes a first power supply terminal 111 for receiving a first operating voltage VSYS; the audio chip 120 further comprises a second power supply terminal 121 for receiving a second operating voltage VCC. The main chip 110 receives the first operating voltage VSYS through the first power supply terminal 111 for normal operation, and the audio chip 120 receives the second operating voltage VCC through the second power supply terminal 121 for normal operation, where the first operating voltage VSYS and the second operating voltage VCC may be different, for example: the first operating voltage VSYS is 3.8V and the second operating voltage VCC is 3.3V.

Referring to fig. 4, fig. 4 is a schematic diagram of a second structure of a circuit board according to an embodiment of the application. The circuit board 300 may include a power management chip 310 including a first power output terminal 311 and a second power output terminal 312, the first power output terminal 311 being connected to the first power supply terminal 111 of the main chip 110, the second power output terminal 312 being connected to the second power supply terminal 121 of the audio chip 120, the first operating voltage VSYS output by the first power output terminal 311 being different from the second operating voltage VCC output by the second power output terminal 312.

The electronic device 10 further includes a power supply circuit 320, where the power supply circuit 320 is connected to the power management chip 310, and the power supply circuit 320 may be a battery circuit, or may be a conversion circuit that converts commercial power, such as 220V, into an operating voltage of the power management chip 310, and the power management chip 310 converts the voltage of the power supply circuit 320 into an operating voltage required by each functional circuit in the electronic device 10, and outputs different operating voltages to corresponding functional circuits through different power output terminals. Such as: the power management chip 310 outputs a first operating voltage VSYS of 3.8V to the first power supply terminal 111 of the main chip 110 through the first power output terminal 311, and the power management chip 310 outputs a second operating voltage VCC of 3.3V to the second power supply terminal 121 of the audio chip 120 through the second power output terminal 312, so that the main chip 110 and the audio chip 120 can operate normally. Of course, the values of the first operating voltage VSYS and the second operating voltage VCC may be the same as needed, but the first operating voltage VSYS and the second operating voltage VCC are provided by different power outputs of the power management chip 310.

The first power output terminal 311 of the power management chip 310 may be connected to the first power supply terminal 111 of the main chip 110, or may be connected to a power supply terminal of another functional circuit, for example, the first power output terminal 311 may also be used to connect to a power supply terminal of a display circuit, a radio frequency circuit, a touch circuit, or a camera circuit directly or through other components, where each functional circuit may generate interference noise to another functional circuit, such as interference noise generated by power jitter, during operation, and these interference noises may also interfere with another functional circuit through the commonly connected first power output terminal 311. For example, the first power output terminal 311 may be connected to different functional circuits through the first power trace 330, and these functional circuits may draw current from the first operating voltage VSYS output from the first power output terminal 311, and these interference noises may interfere with other functional circuits through the commonly connected first power trace 330.

In the audio circuit 100, analog audio information is more susceptible to noise interference than digital audio information. In this embodiment, the first power output terminal 311 is connected to the first power supply terminal 111 of the main chip 110 and the power supply terminals of other functional circuits through the first power trace 330, the second power output terminal 312 is connected to the second power supply terminal 121 of the audio chip 120 through the second power trace 340, and the first power trace 330 and the second power trace 340 are independent from each other and have no electrical connection therebetween. Therefore, the second power trace 340 is only used for being connected to the second power supply terminal 121 of the audio chip 120, but not connected to the first ground terminal 130 of the main chip 110 and not connected to the power supply terminals of other functional circuits, so that the second power trace 340 basically does not have interference noise generated by the main chip 110 or other functional circuits, or the power jitter of the first power trace 330 does not affect the working voltage of the second power trace 340, thereby reducing noise interference to the audio circuit 100 from the power supply terminal, further improving the quality of audio information, and improving the audio experience of the user.

In an embodiment, please refer to fig. 5, fig. 5 is a schematic diagram illustrating a third structure of an audio circuit according to an embodiment of the present application. The audio chip 120 comprises a digital-to-analog conversion module 121 and an audio power amplifier module 122, wherein the digital-to-analog conversion module 121 is used for carrying out digital-to-analog conversion on digital audio information so as to obtain analog audio information; the audio power amplifier module 122 is configured to amplify the analog audio information to obtain driving information.

The digital-to-analog conversion module 121 converts the digital audio information into analog audio information, and the audio power amplification module 122 amplifies the analog audio information to obtain driving information, so that the analog audio information is easy to be interfered by noise of other functional circuits, even if the noise is small, the analog audio information is easy to be perceived by a user when being amplified by the audio power amplification module 122, and the audio experience of the user is affected.

It should be noted that, if the number of speakers 200 of the electronic device 10 is 1 or 2, the audio chip 120 may include a digital-to-analog conversion module 121 and an audio power amplifier module 122; if the number of speakers 200 of the electronic device 10 is greater, for example, 4 or 5, the number of the corresponding digital-to-analog conversion modules 121 and the number of the audio power amplifier modules 122 can be increased accordingly to control the corresponding speakers 200 respectively.

In this embodiment, the digital-to-analog conversion module 121 and the audio power amplifier module 122 are also electrically connected to the second ground terminal 140 for grounding, and electrically connected to the second power output terminal 312 for inputting the working voltage, so that noise interference of the main chip 110 and other functional circuits on analog audio information can be reduced or eliminated from the power supply terminal and the ground terminal at the same time, thereby improving the sound quality of the audio played by the speaker 200.

The embodiment of the application also provides a circuit board 300, which comprises the audio circuit 100 of any of the above embodiments. The circuit board 300 is an important electronic component, and is a support for an electronic component and a carrier for electrically connecting the electronic component. None of the functional implementations of the electronic device leave the hardware physical basis of the circuit board 300. The circuit board 300 may be a flexible circuit board (FPC), which is a flexible printed circuit board made of polyimide or polyester film as a base material, and has a thin thickness and good flexibility, so as to realize flexible design and product form innovation, and is commonly used for connection between different functional components and functional circuits of electronic equipment, and is particularly suitable for narrow and irregular spaces.

Referring to fig. 6, fig. 6 is a schematic diagram of a first structure of a signal routing area according to an embodiment of the present application. The circuit board 300 includes a circuit area and a signal wiring area 360, the audio circuit 100 is disposed in the circuit area, the signal wiring area 360 includes a first signal wiring 361 and a second signal wiring 362 that are spaced apart from each other, and the first signal wiring 361 and the second signal wiring 362 are electrically connected to the audio chip 120 of the audio circuit 100, respectively, for transmitting driving information; a first grounding trace 363 is disposed between the first signal trace 361 and the second signal trace 362, and the first grounding trace 363 is electrically connected to the second grounding terminal 140 of the audio circuit 100.

The electronic device 10 has, illustratively, 2 speakers 200, including a first speaker 210 and a second speaker 220. The driving information output by the audio chip 120 includes first driving information and second driving information, the first driving information includes left channel audio information, the second driving information includes right channel audio information, and the first signal wire 361 is connected to the audio chip 120 of the audio circuit 100 and is used for transmitting the first driving information to the first speaker 210 to drive the first speaker 210 to play the left channel audio information; the second signal trace 362 is connected to the audio chip 120 of the audio circuit 100 and is used for transmitting driving information to the second speaker 220 to drive the second speaker 220 to play right channel audio information, so that the electronic device 10 can play dual channel audio, thereby providing stereo audio effects for a user.

In an embodiment, please continue to refer to fig. 2, the circuit board 300 includes a first grounding region 150, a second grounding region 160, and a main grounding region 170, the first grounding terminal 130 is connected to the first grounding region 150, and the second grounding terminal 140 is connected to the second grounding region 160; the first and second ground regions 150 and 160 are connected to the main ground region 170, respectively, and the main ground region 170 has a larger area than the first and second ground regions 150 and 160.

Illustratively, a plurality of metal lands, such as a plurality of copper foils printed on the circuit board 300, are disposed on the circuit board 300 as the metal lands, and a plurality of copper foils are separately disposed, such as a plurality of copper foils disposed at different positions or different layers of the same layer of the circuit board 300. The plurality of copper foils comprise a large-area copper foil and at least two small-area copper foils, each small-area copper foil is connected with the large-area copper foil respectively, the small-area copper foils are not directly connected, and each small-area copper foil and the large-area copper foil can be connected through printing wiring or via wiring. A large area of copper foil is used as the main ground region 170, a small area of copper foil is used as the first ground region 150, and another small area of copper foil is used as the second ground region 160.

In this embodiment, the first grounding trace 363 is disposed between the first signal trace 361 and the second signal trace 362, so that mutual crosstalk of audio information between the first signal trace 361 and the second signal trace 362 can be reduced or eliminated, the first grounding trace 363 is electrically connected with the second grounding terminal 140 of the audio circuit 100, and the second grounding terminal 140 is only used for connecting the audio circuit 100, not connecting the main chip 110 and not connecting other functional circuits, so that the second grounding region 160 connected with the second grounding terminal 140 is substantially free of interference noise generated by the main chip 110 or other functional circuits, and therefore the first grounding trace 363 is clean and does not introduce noise to interfere with driving information transmitted by the first signal trace 361 and the second signal trace 362, thereby ensuring quality of audio information. Note that, the first ground trace 363, the first signal trace 361, and the second signal trace 362 are close to each other on the circuit board 300 but are also isolated from each other.

It should be noted that the electronic device 10 may have only 1 speaker, the corresponding signal trace area may have only 1 signal trace, and the speaker may play the audio information of the mono channel. The electronic device 10 may also have a greater number of speakers for playing audio information of a greater number of channels, and the signal routing area may have a greater number of signal routing lines for transmitting audio information of different channels to the corresponding speakers, respectively, for example, the signal routing area may also have a third signal routing line, a fourth signal routing line, etc., so that audio information of a greater number of channels of the user may be provided, so that the user may more closely feel in presence. If there are multiple signal traces, a grounding trace electrically connected to the second grounding terminal 140 may be disposed between every two adjacent signal traces, so as to prevent crosstalk between the multiple signal traces.

With continued reference to fig. 6, in one embodiment, the signal trace region 360 further includes a fourth ground trace 364 and a fifth ground trace 365. The fourth grounding trace 364 and the first grounding trace 363 are arranged in the same layer and are spaced from each other, the fourth grounding trace 364 is arranged on one side of the first signal trace 361 away from the first grounding trace 363, and the fourth grounding trace 364 is connected with the first grounding terminal 130; the fifth grounding trace 365 and the first grounding trace 363 are arranged in the same layer and are spaced apart from each other, the fifth grounding trace 365 is arranged on the side of the second signal trace 362 away from the first grounding trace 363, and the fifth grounding trace 365 is connected to the first grounding terminal 130.

The fourth ground trace 364 may shield interference noise on a side of the first signal trace 361 remote from the first ground trace 363; the fifth ground trace 365 may shield interference noise on a side of the second signal trace 362 remote from the first ground trace 363. Therefore, on the layer where the signal trace area 360 is located, the first grounding trace 363 can shield the mutual crosstalk of the audio information between the first signal trace 361 and the second signal trace 362, the fourth grounding trace 364 and the fifth grounding trace 365 can shield the interference noise located at two sides of the first signal trace 361 and the second signal trace 362, so that on the layer where the signal trace area 360 is located, the first signal trace 361 and the second signal trace 362 are isolated in a packet mode, so that the driving information transmitted by the first signal trace 361 and the second signal trace 362 is not easily interfered by the noise of the layer where the signal trace area 360 is located.

Illustratively, the fourth ground trace 364 and the fifth ground trace 365 may be connected to the first ground terminal 130, and although the first ground terminal 130 is connected to the first ground region 150, the first ground region 150 is relatively less susceptible to interference noise of the main chip 110 or other functional circuits, due to the smaller thickness of the first signal trace 361 and the second signal trace 362, i.e., the smaller area facing the fourth ground trace 364 and the fifth ground trace 365; in addition, the first grounding region 150 is connected to the main chip 110 and other functional circuits, the second grounding region 160 is only used for connecting the audio circuit 100, so the area of the first grounding region 150 is larger than that of the second grounding region 160, and the fourth grounding trace 364 and the fifth grounding trace 365 can be directly connected to the first grounding terminal 130 in order to simplify the layout of the grounding trace of the circuit board 300.

In another example, please refer to fig. 7, fig. 7 is a schematic diagram of a second structure of a signal trace area according to an embodiment of the present application. The fourth grounding trace 364 and the fifth grounding trace 365 may also be connected to the second grounding terminal 140, so that on the layer where the signal trace area 360 is located, the first grounding trace 363, the fourth grounding trace 364 and the fifth grounding trace 365 are all connected to the second grounding terminal 140, and the second grounding terminal 140 is only used for connecting the audio circuit 100, which is clean and does not introduce interference noise of the main chip 110 or other functional circuits, so that the first signal trace 361 and the second signal trace 362 can be better isolated from each other in a wrapping manner, so that the driving information transmitted by the first signal trace 361 and the second signal trace 362 is less likely to be interfered by noise on the layer where the signal trace area 360 is located. Note that the fourth ground trace 364, the first signal trace 361, the first ground trace 363, the second signal trace 362, and the fifth ground trace 365 are close to each other but also isolated from each other on the circuit board 300.

In an embodiment, please refer to fig. 8 and fig. 9, fig. 8 is a third schematic structural diagram of a circuit board according to an embodiment of the present application, and fig. 9 is a schematic structural diagram of a first shielding protection layer and a second shielding protection layer according to an embodiment of the present application. The circuit board 300 further includes a first shielding protection layer 370 disposed on one side of the signal trace area 360, where the first shielding protection layer 370 includes a second grounding trace 371, and the orthographic projection of the second grounding trace 371 in the signal trace area 360 covers the first signal trace 361, the first grounding trace 363 and the second signal trace 362, and the second grounding trace 371 is connected to the second grounding terminal 140.

The circuit board 300 may be a multi-layer board, in which the signal trace area 360 is disposed on one layer, the first shielding protection layer 370 is disposed on a layer above or below the layer where the signal trace area 360 is disposed, the second grounding trace 371 of the first shielding protection layer 370 covers the first signal trace 361, the first grounding trace 363 and the second signal trace 362 in the orthographic projection of the signal trace area 360, and the second grounding trace 371 can shield interference noise generated by the main chip 110 or other functional circuits, so that the first signal trace 361 and the second signal trace 362 are not easily affected by the interference noise of the upper layer or the lower layer in space. In addition, the second grounding trace 371 is electrically connected to the second grounding terminal 140 of the audio circuit 100, and the second grounding terminal 140 is only used for connecting the audio circuit 100, not connecting the main chip 110 and not connecting other functional circuits, so that the second grounding trace 371 is clean and does not introduce interference noise of the main chip 110 and other functional circuits.

In an embodiment, the circuit board 300 further includes a second shielding protection layer 380 disposed on the other side of the signal trace area 360, the second shielding protection layer 380 includes a third grounding trace 381, the orthographic projection of the third grounding trace 381 in the signal trace area 360 covers the first signal trace 361, the first grounding trace 363 and the second signal trace 362, and the third grounding trace 381 is connected to the second grounding terminal 140. For example, the first shielding protection layer 370 is disposed on the upper layer of the signal trace region 360, and the second shielding protection layer 380 is disposed on the lower layer of the signal trace region 360. The third ground trace 381 may shield interference noise generated by the main chip 110 or other functional circuits such that the first signal trace 361 and the second signal trace 362 are not easily affected by interference noise of a next layer in space. In addition, the third grounding trace 381 is electrically connected to the second grounding terminal 140 of the audio circuit 100, and the second grounding terminal 140 is only used for connecting the audio circuit 100, not connecting the main chip 110 and not connecting other functional circuits, so that the third grounding trace 381 is clean and does not introduce interference noise of the main chip 110 and other functional circuits.

It should be noted that, the first shielding protection layer 370 may also be disposed on a layer next to the layer where the signal trace area 360 is disposed, and the second shielding protection layer 380 is disposed on a layer next to the layer where the signal trace area 360 is disposed. The signal trace region 360, the first shielding protection layer 370, and the second shielding protection layer 380 are adjacent to each other but are also isolated from each other.

The first shielding protection layer 370 is disposed on the upper layer of the layer where the signal trace area 360 is located, the second grounding trace 371 of the first shielding protection layer 370 can shield interference noise on the upper layer of the first signal trace 361 and the second signal trace 362, the second shielding protection layer 380 is disposed on the lower layer of the layer where the signal trace area 360 is located, and the third grounding trace 381 of the second shielding protection layer 380 can shield interference noise on the lower layer of the first signal trace 361 and the second signal trace 362, so that a package ground isolation is formed for the first signal trace 361 and the second signal trace 362 in space, and the first signal trace 361 and the second signal trace 362 are protected from noise of peripheral circuits. Therefore, for the first signal trace 361 and the second signal trace 362, not only the interference noise from the same layer, but also the interference noise from the upper layer or the lower layer in the space can be shielded, and the first grounding trace 363, the second grounding trace 371 and the third grounding trace 381 are all connected with the second grounding terminal 140, so that the grounding traces are clean, and do not lead the interference signals of the main chip 110 or other functional circuits, so that the driving information transmitted by the first signal trace 361 and the second signal trace 362 is cleaner, thereby ensuring the quality of audio information transmission, and improving the tone quality effect of the audio played by the loudspeaker 200.

It should be noted that, if the signal trace area 360 has only 1 signal trace, the orthographic projections of the second grounding trace 371 and the third grounding trace 381 in the signal trace area 360 may cover 1 signal trace, and if the signal trace area 360 has more signal traces, such as the third signal trace and the fourth signal trace, the orthographic projections of the second grounding trace 371 and the third grounding trace 381 in the signal trace area 360 may cover all signal traces, so as to shield all signal traces from interference noise.

In an embodiment, the first shielding protection layer 370 further includes a sixth grounding trace 372 and a seventh grounding trace 373, the sixth grounding trace 372 and the seventh grounding trace 373 are disposed on the same layer as the second grounding trace 371 and are spaced apart from each other, and the sixth grounding trace 372 and the seventh grounding trace 373 are disposed on two sides of the second grounding trace 371 respectively.

The second grounding trace 371 of the first shielding protection layer 370 shields the interference noise of the layer on the first signal trace 361 and the second signal trace 362, and the sixth grounding trace 372 and the seventh grounding trace 373 are respectively arranged at intervals on two sides of the second grounding trace 371, so that the interference signals on two sides of the second grounding trace 371 can be further shielded, the interference noise of the layer on the first signal trace 361 and the second signal trace 362 can be better shielded, and the influence of the interference noise on the driving information transmitted by the first signal trace 361 and the second signal trace 362 is reduced. To simplify the layout of the grounding traces in the circuit, the sixth grounding trace 372 and the seventh grounding trace 373 may be connected to the first grounding terminal 130.

In an embodiment, the second shielding protection layer 380 further includes an eighth grounding trace 382 and a ninth grounding trace 383, the eighth grounding trace 382 and the ninth grounding trace 383 are disposed on the same layer as the third grounding trace 381 and are spaced apart from each other, and the eighth grounding trace 382 and the ninth grounding trace 383 are disposed on two sides of the third grounding trace 381 respectively.

The third grounding trace 381 of the second shielding protection layer 380 shields the interference noise located at the next layer of the first signal trace 361 and the second signal trace 362, and the eighth grounding trace 382 and the ninth grounding trace 383 are respectively arranged at two sides of the third grounding trace 381 at intervals, so that the interference signals at two sides of the third grounding trace 381 can be further shielded, and the interference noise located at the next layer of the first signal trace 361 and the second signal trace 362 can be better shielded, and the influence of the interference noise on the driving information transmitted by the first signal trace 361 and the second signal trace 362 is reduced. To simplify the layout of the ground traces in the circuit, the eighth ground trace 382 and the ninth ground trace 383 may be connected to the first ground 130. The first shielding protection layer 370 and the second shielding protection layer 380 may be the same, or may be adjusted to different sizes according to the layout of the actual circuit board.

In an embodiment, please refer to fig. 10 and 11, fig. 10 is a third structural schematic diagram of a signal routing area provided in an embodiment of the present application, and fig. 11 is a second structural schematic diagram of a first shielding protection layer and a second shielding protection layer provided in an embodiment of the present application. The tenth ground trace 366 disposed between the first signal trace 361 and the second signal trace 362 of the signal trace region 360 may also be connected to the first ground 130 of the audio circuit 100, and the tenth ground trace 366 may shield the mutual crosstalk of the audio information between the first signal trace 361 and the second signal trace 362, but since the tenth ground trace 366 connected to the first ground 130 has interference noise generated by the main chip 110 or other functional circuits, the anti-interference effect of connecting the tenth ground trace 366 to the first ground 130 is inferior to that of connecting the second ground 140.

In addition, the first shielding protection layer 370 may include only the eleventh ground trace 374 connected to the first ground terminal 130, the first shielding protection layer 380 may include only the twelfth ground trace 384 connected to the first ground terminal 130, the eleventh ground trace 374 and the twelfth ground trace 384 may shield peripheral interference noise located at a layer and a layer next to the first signal trace 361 and the second signal trace 362, but since the eleventh ground trace 374 and the twelfth ground trace 384 exist in themselves with interference noise generated by the main chip 110 or other functional circuits, the first shielding protection layer 370 has only the anti-interference effect of the eleventh ground trace 374 and is not as good as the first shielding protection layer 370 has the anti-interference effect of the second ground trace 371, and the second shielding protection layer 380 has only the anti-interference effect of the twelfth ground trace 384 and is not as good as the second shielding protection layer 380 has the anti-interference effect of the third ground trace 381.

Referring to fig. 12, fig. 12 is a schematic structural diagram of an electronic device according to an embodiment of the application. The embodiment of the present application further provides an electronic device 10, where the electronic device 10 includes the circuit board 300 of any one of the above embodiments, and the electronic device 10 further includes a speaker 200, and the speaker 200 is electrically connected to the audio chip 120 of the circuit board 300. The number of speakers 200 may be 1, 2, 3, 4, 5, etc. as needed.

The electronic device 10 may be, for example, a headset, a sound device, a mobile phone, a tablet computer, a television, or the like, which can be used to play audio. By way of example, the electronic device 10 may be a head-mounted audio device that is becoming increasingly popular for people's life, such as: the head TWS earphone can not only meet the personal audio-visual entertainment requirement of a user, but also functionally connect to wireless connection from wired connection, upgrade the portability degree and upgrade the individuation degree; with the upgrade of audio codec and sound effect processing technology, the sound effect realized by the TWS earphone spans from stereo to spatial sound effect, and the sound experience is upgraded, so that the user can experience the immersive audio experience of the large cinema system with the TWS earphone. For another example: the head-mounted AR/VR device, focusing on the virtual world's audiovisual entertainment experience, and the recently emerging meta universe, creates a connection of the virtual and real world through the head-mounted AR/VR device.

The function application of the head-mounted audio equipment is more and more, besides the audio playing function, a display function, a charging function, a noise reduction function, a motion detection function, an in-ear detection function, a voice control function, a touch control function and the like are also added, and corresponding functional circuits are more and more complex. At the same time, the shape and size of the head-mounted audio device are gradually miniaturized. This means that the design space of the head mounted audio device is more and more limited, while more interference factors are present in the circuit. Because the speaker of the head-mounted audio device is tightly attached to the ear, sound can be directly transmitted into the ear of a user, and very little noise can be perceived by the user, so that the noise interference of other functional circuits on the speaker is avoided as much as possible.

In another example, the electronic device 10 may also be a sound with a larger power amplification factor, and even after the very small noise is amplified, the noise is easily perceived by the user when the speaker plays the audio, so that the sound quality effect of the audio played by the sound is affected. In addition, the electronic device 10 such as a mobile phone, a tablet, a television, etc. is also required to avoid noise interference of other functional circuits on the speaker, so as to improve the sound quality of the electronic device.

In an embodiment, the second ground 140 is also used for electrical connection with the speaker 200. When the speaker 200 plays audio, if noise interference of the main chip 110 or other functional circuits is received, the played audio has noise, which may affect the audio experience of the user.

Therefore, in this embodiment, the second grounding terminal 140 is further used for electrically connecting with the speaker 200, the second grounding terminal 140 is only used for connecting with the audio circuit 100, and is not connected with the main chip 110 and other functional circuits, so that the second grounding terminal 140 is clean and does not introduce interference noise generated by other functional circuits, and the speaker 200 is grounded through the second grounding terminal 140, thereby reducing noise interference to the speaker 200, making the audio played by the speaker 200 clean, making the user feel no interference noise, and further improving the sound quality of the audio played by the speaker 200.

In the foregoing embodiments, the descriptions of the embodiments are focused on, and the portions of a certain embodiment that are not described in detail in the foregoing embodiments may be referred to in the foregoing detailed description of the display device, which is not repeated herein.

The audio circuit, the circuit board and the electronic device provided by the embodiments of the present application are described in detail, and specific examples are applied to illustrate the principles and the implementation of the present application, and the description of the above embodiments is only used to help understand the method and the core idea of the present application; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present application, the present description should not be construed as limiting the present application in summary.

Claims

1. An audio circuit, comprising:

the first grounding end is connected with the grounding end of the main chip;

2. The audio circuit of claim 1, wherein the audio circuit comprises a plurality of audio circuits,

the main chip further comprises a first power supply end for receiving a first working voltage;

3. The audio circuit of claim 2, wherein the audio circuit further comprises:

4. The audio circuit of claim 1, wherein the audio chip comprises:

5. A circuit board, comprising:

a circuit region on which the audio circuit according to any one of claims 1 to 4 is provided;

6. The circuit board of claim 5, wherein the signal routing area further comprises:

7. The circuit board of claim 5, further comprising a first shielding layer disposed on a side of the signal trace region and including a second ground trace, wherein an orthographic projection of the second ground trace on the signal trace region covers the first signal trace, the first ground trace, and the second signal trace, and wherein the second ground trace is connected to the second ground terminal.

8. The circuit board of claim 7, further comprising a second shielding layer disposed on the other side of the signal trace region and comprising a third ground trace, wherein an orthographic projection of the third ground trace on the signal trace region covers the first signal trace, the first ground trace, and the second signal trace, and wherein the third ground trace is connected to the second ground terminal.

9. The circuit board of claim 7, wherein the first shielding protection layer further comprises a sixth ground trace and a seventh ground trace, the sixth ground trace, the seventh ground trace and the second ground trace are disposed in a same layer and are spaced apart from each other, and the sixth ground trace and the seventh ground trace are disposed on two sides of the second ground trace, respectively.

10. The circuit board of claim 8, wherein the second shielding protection layer further comprises an eighth ground trace and a ninth ground trace, the eighth ground trace, the ninth ground trace and the third ground trace are arranged in the same layer and are spaced apart from each other, and the eighth ground trace and the ninth ground trace are respectively arranged at two sides of the third ground trace.

11. The circuit board of claim 5, wherein the circuit board further comprises:

the first grounding end is connected with the first grounding area;

the second grounding end is connected with the second grounding area;

12. An electronic device, comprising:

a circuit board as claimed in any one of claims 5 to 11;

13. The electronic device of claim 12, wherein the second ground is further configured to electrically connect with the speaker.