CN117098319A - Radio frequency transmission line manufacturing method and radio frequency transmission line based on LDS - Google Patents
Radio frequency transmission line manufacturing method and radio frequency transmission line based on LDS Download PDFInfo
- Publication number
- CN117098319A CN117098319A CN202310647182.0A CN202310647182A CN117098319A CN 117098319 A CN117098319 A CN 117098319A CN 202310647182 A CN202310647182 A CN 202310647182A CN 117098319 A CN117098319 A CN 117098319A
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- circuit
- radio frequency
- metallizable
- transmission line
- coating
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 76
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 61
- 239000011248 coating agent Substances 0.000 claims abstract description 60
- 238000000034 method Methods 0.000 claims abstract description 43
- 238000005530 etching Methods 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000005507 spraying Methods 0.000 claims abstract description 10
- 229910021645 metal ion Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 150000002902 organometallic compounds Chemical class 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 9
- 238000001125 extrusion Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/005—Manufacturing coaxial lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/06—Coaxial lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguides (AREA)
Abstract
The invention discloses a manufacturing method of a radio frequency transmission line and the radio frequency transmission line based on an LDS, and the method comprises the following steps: etching a preset first circuit on a substrate through an LDS process; spraying a first metallizable coating on the surface of the first circuit; etching a central circuit on the first metallizable coating through an LDS process; spraying a second metallizable coating on the center circuit; etching a preset second circuit on the second metallizable coating; and a plurality of through holes are formed on two sides of the central circuit in an extending manner along the length direction of the transmission line so as to electrically connect the first circuit and the second circuit. The radio frequency transmission line manufactured by the method can obtain smaller height so as to adapt to increasingly wide application scenes of radio frequency technology.
Description
Technical Field
The invention belongs to the technical field of radio frequency, and particularly relates to a manufacturing method of a radio frequency transmission line and a radio frequency transmission line based on an LDS.
Background
The radio frequency, which is often referred to as RF, RF modules perform the function of high-speed data transmission in extremely small volumes at lower cost. In recent years, the application of radio frequency has become more and more widespread. Radio frequency is an abbreviation for radio frequency, which means the electromagnetic frequency that can radiate into space, ranging from 300kHz to 300 GHz. The radio frequency is radio frequency current, which is the short term of high frequency alternating current variable electromagnetic wave. Alternating current that varies less than 1000 times per second is referred to as low frequency current, alternating current that varies more than 10000 times is referred to as high frequency current, and radio frequency is a high frequency current. The radio frequency (300K-300G) is the higher frequency band of the high frequency, and the microwave band (300M-300G) is the higher frequency band of the radio frequency.
The RF module transmission is widely used in the fields of vehicle monitoring, remote control, telemetry, small wireless network, wireless meter reading, access control system, cell paging, industrial data acquisition system, wireless tag, identification, non-contact RF smart card, small wireless data terminal, safety fire protection system, wireless remote control system, biological signal acquisition, hydrological monitoring, robot control, wireless 232 data communication, wireless 485/422 data communication, digital audio, digital image transmission, etc.
Whereas coaxial Cable is commonly used for the current radio frequency transmission line, cable with a diameter of 1.13mm is generally required, and the diameter is limited to a region with a special limitation on some structural space, such as in the sound cavity of Speaker. In addition, the shielding of the upper layer and the lower layer can be realized only by a hole technology on the side surface, and the technology can realize long-strip or even whole conducting shielding at present.
Therefore, the manufacturing process of the radio frequency transmission line needs to be further researched to adapt to the wide application scenario of the radio frequency.
Disclosure of Invention
The invention aims to provide a manufacturing method of a radio frequency transmission line and a radio frequency transmission line based on an LDS, and the radio frequency transmission line manufactured by the method can obtain smaller height so as to adapt to increasingly wide application scenes of radio frequency technology.
In order to solve the above problems, a first technical solution of the present invention is: a method of manufacturing a radio frequency transmission line, comprising the steps of: etching a preset first circuit on a substrate through an LDS process; spraying a first metallizable coating on the surface of the first circuit; etching a central circuit on the first metallizable coating through an LDS process; spraying a second metallizable coating on the center circuit; etching a preset second circuit on the second metallizable coating; and a plurality of through holes are arranged at two sides of the central circuit and extend along the length direction of the transmission line so as to electrically connect the first circuit and the second circuit.
Preferably, the etching the preset first circuit through the LDS process specifically includes: and etching the substrate according to a preset circuit pattern by using numerical control laser, and releasing metal ions along the etching route by the substrate after laser irradiation so as to form a first circuit.
Preferably, the material used for spraying the first metallizable coating and the second metallizable coating is a modified plastic containing an organometallic compound that releases particles upon laser irradiation.
Preferably, the thickness of the first metallizable coating and/or the second metallizable coating is 60-70 um.
Preferably, etching the central circuit on the first metallizable coating by an LDS process further comprises: and etching the first metallizable coating according to a preset circuit pattern by using a numerical control laser, wherein after laser irradiation, the first metallizable coating releases metal ions along the etching route to form a central line, the line width of the central line ranges from 0.1mm to 0.5mm, and the thickness of the central line ranges from 0.15mm to 0.25 mm.
Preferably, the method further comprises: and a connecting hole is formed in the second metallizable coating and communicated with the central circuit so as to realize connection between the central circuit and the radio frequency antenna.
Preferably, the diameter of the connecting hole is between 0.2mm and 0.3 mm.
Preferably, the diameter of the via hole is between 0.2mm and 0.3mm, and the distance between adjacent via holes along the length extending direction of the transmission line is between 1mm and 3 mm.
Based on the same inventive concept, the second technical scheme of the invention is as follows: an LDS-based radio frequency transmission line comprising: the circuit comprises a substrate, a first circuit etched on the substrate through an LDS process, a first metallizable coating sprayed on the first circuit, a central circuit etched on the first metallizable coating through the LDS process, a second metallizable coating sprayed on the central circuit, and a second circuit etched on the second metallizable coating through the LDS process; and the through holes are arranged on two sides of the central circuit and extend along the length direction of the transmission line, and are used for electrically connecting the first circuit and the second circuit.
Preferably, the method further comprises: and a connection hole passing through the second metallizable coating for connecting the center line to a radio frequency antenna.
By adopting the technical scheme, the invention has the following advantages and positive effects compared with the prior art:
1. compared with the coaxial Cable radio frequency transmission line manufactured by adopting an extrusion process in the prior art, the radio frequency transmission line manufactured by adopting the LDS process in the embodiment of the invention can be smaller in size, so that the radio frequency transmission line manufactured by the method can be better suitable for more scenes and has stronger universality.
2. The cable radio frequency transmission line in the prior art can be connected with devices such as a radio frequency antenna and a PCB board through a via hole, but the radio frequency transmission line based on the LDS in this embodiment can be connected with devices such as a radio frequency antenna or a PCB board through a connection hole formed on the surface of the second metallizable coating, and can easily realize edge connection or integral side connection due to the electrical connection with the central line through the connection hole, as shown in fig. 6 and 7, parasitic capacitance cannot be generated between the radio frequency transmission line and the central line of the transmission line due to the fact that the connection hole 8 does not have redundant copper pads, and therefore no redundant signal interference cannot be generated.
Drawings
Fig. 1 is a cross-sectional view of an LDS-based radio frequency transmission line in accordance with an embodiment of the present invention;
fig. 2 is a schematic process diagram of a method for manufacturing a radio frequency transmission line according to an embodiment of the invention;
fig. 3 is a cross-sectional view of an LDS-based radio frequency transmission line (provided with a connection hole) in accordance with an embodiment of the present invention;
FIG. 4 is a schematic diagram showing the comparison between the dimensions of a prior art RF cable and an RF transmission line according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a prior art radio frequency cable connection via a via;
FIG. 6 is a schematic diagram of an RF transmission line using edge connection according to an embodiment of the present invention;
fig. 7 is a schematic diagram of an rf transmission line using integral side connection according to an embodiment of the present invention.
Reference numerals illustrate:
1-a substrate; 2-a first circuit; 3-a first metallizable coating; 4-a central circuit; 5-a second metallizable coating; 6-a second circuit; 7-via holes; 8-connecting holes; 100-radio frequency transmission line.
Detailed Description
The invention provides a fiber ring plugging repairing device which is further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the invention will become more apparent from the following description and from the claims.
Example 1
As shown in fig. 1, an LDS-based radio frequency transmission line 100 includes: a substrate 1, a first circuit 2 etched on the substrate 1 through an LDS process, a first metallizable coating 3 sprayed on the first circuit 2, a central circuit 4 etched on the first metallizable coating 3 through an LDS process, a second metallizable coating 5 sprayed on the central circuit 4, and a second circuit 6 etched on the second metallizable coating 5 through an LDS process; and a plurality of via holes 7 provided on both sides of the central circuit 4 and extending in the longitudinal direction of the transmission line, wherein the via holes 7 are used for electrically connecting the first circuit 2 and the second circuit 6.
Compared with the coaxial Cable radio frequency transmission line manufactured by adopting an extrusion process in the prior art, the radio frequency transmission line 100 manufactured by adopting the LDS (Laser Direct Structuring, laser direct structuring technology) process in the embodiment of the invention can be smaller in size, so that the radio frequency transmission line 100 manufactured by adopting the method can be better suitable for more scenes and has stronger universality.
Referring to fig. 3, preferably, further comprising: a connection hole 8 for connecting the centre line to a radio frequency antenna is made through the second metallizable coating 5.
Compared with the prior art, the cable radio frequency transmission line of the present embodiment can be connected with devices such as a radio frequency antenna and a PCB board through the via hole 7, as shown in fig. 5, the position indicated by the arrow is the cable radio frequency transmission line, but the radio frequency transmission line 100 based on the LDS of the present embodiment can be connected with devices such as a radio frequency antenna or a PCB board through the connection hole 8 by opening the connection hole 8 on the surface of the second metallizable coating 5, and as the connection hole 8 is electrically connected with the central line, edge connection or whole side connection can be easily achieved, as shown in fig. 6 and 7 (the radio frequency transmission line 100 cannot be seen), since the connection hole 8 has no redundant copper pad, parasitic capacitance cannot be generated with the central line of the transmission line, and redundant signal interference cannot be generated.
Example two
Referring to fig. 2, a method of manufacturing a radio frequency transmission line 100 is shown, comprising the steps of:
s1: etching a preset first circuit 2 on a substrate 1 through an LDS process;
s2: spraying a first metallizable coating 3 on the surface of the first circuit 2;
s3: etching a central circuit 4 on the first metallizable coating 3 by an LDS process;
s4: spraying a second metallizable coating 5 on said central circuit 4;
s5: etching a preset second circuit 6 on the second metallizable coating 5; and extends along the length direction of the transmission line, and a plurality of through holes 7 are arranged at two sides of the central circuit 4 so as to electrically connect the first circuit 2 and the second circuit 6.
Compared with the coaxial Cable radio frequency transmission line manufactured by adopting the extrusion process in the prior art, the radio frequency transmission line 100 manufactured by adopting the LDS process can be smaller in size, so that the radio frequency transmission line 100 manufactured by adopting the method can be better suitable for more scenes and has stronger universality.
Preferably, the etching the preset first circuit 2 by the LDS process specifically includes: etching the substrate 1 according to a preset circuit pattern by using a numerical control laser, and releasing metal ions along the etching route by the substrate 1 after laser irradiation to form a first circuit 2.
In this embodiment, the first circuit 2 is etched on the substrate 1 by using a digitally controlled laser, where the first circuit 2 is designed in advance, and the substrate 1 has the performance of releasing metal ions along a laser path after laser irradiation and generating metal deposition to form a circuit, that is, copper and nickel plating, and the first circuit 2 plays a role in shielding signals in a central circuit, so that radio frequency signals in the central circuit do not interfere with other circuits as much as possible.
Preferably, the material used for spraying the first metallizable coating 3 and the second metallizable coating 5 is a modified plastic containing an organometallic compound, which releases particles after laser irradiation.
The central line is formed by an LDS process, so that a smaller thickness can be obtained, see fig. 4, which is a schematic diagram illustrating the comparison between the dimensions of the rf transmission line 100 according to the embodiment of the present invention and the dimensions of the rf cable line in the prior art. It can be seen that the size of the radio frequency transmission line 100 in the embodiment of the present invention is greatly reduced, and the radio frequency cable line in the prior art usually needs a thickness of 1.05mm at least, but the embodiment can obtain a thickness of 0.3mm, so that the radio frequency cable line is applicable to a narrower space. Provides technical support for the wide application of radio frequency.
Preferably, the thickness of the first metallizable coating 3 and/or the second metallizable coating 5 is 60-70 um.
Referring to fig. 1, the thickness of the first metallizable coating 3 and the second metallizable coating 5 can be 60-70 um, and compared with the radio frequency cable formed by extrusion technology in the prior art, a thinner shielding layer and core wire can be obtained, wherein the shielding layer corresponding to the radio frequency cable is the first circuit 2 and the second circuit 6 in the present embodiment, and the core wire corresponding to the radio frequency cable is the central line in the present embodiment.
Preferably, etching the central circuit 4 on the first metallizable coating 3 by an LDS process further comprises: and etching the first metallizable coating 3 according to a preset circuit pattern by using a numerical control laser, wherein after laser irradiation, the first metallizable coating 3 releases metal ions along the etching route to form a central line, the line width of the central line ranges from 0.1mm to 0.5mm, and the thickness of the central line ranges from 0.15mm to 0.25 mm.
By adopting the LDS technology, the central line can easily obtain the line width of 0.1mm to 0.5mm and the thickness of 0.15mm to 0.25mm, and the radio frequency cable line has obviously excellent size advantages compared with the radio frequency cable line adopting an extrusion form in the prior art.
Preferably, the method further comprises: and a connecting hole 8 is arranged on the second metallizable coating 5 and communicated with the central circuit so as to realize the connection of the central circuit and the radio frequency antenna.
Compared with the prior art, the cable radio frequency transmission line of the present embodiment can be connected with devices such as a radio frequency antenna and a PCB board by means of the via hole 7, but the radio frequency transmission line 100 based on the LDS of the present embodiment can be connected with devices such as a radio frequency antenna or a PCB board by means of the connection hole 8 by opening the connection hole 8 on the surface of the second metallizable coating 5, and can easily realize edge connection or whole side connection by means of the electrical connection between the connection hole 8 and the central line, as shown in fig. 6 and 7 (the radio frequency transmission line 100 cannot be seen), since the connection hole 8 does not have redundant copper pads, parasitic capacitance cannot be generated with the central line of the transmission line, and thus no redundant signal interference cannot be generated.
Referring to fig. 6, an edge connection schematic diagram of the rf transmission line 100 according to an embodiment of the present invention is shown, and fig. 7 is a schematic diagram of an overall side connection schematic diagram of the rf transmission line 100 according to an embodiment of the present invention.
In fig. 4, the core wire and the conductor of the radio frequency cable of the prior art can be connected only by means of the via hole 7, but the radio frequency transmission line 100 and the conductor of the present invention can be connected by means of the via hole 7, or by means of side connection or side-to-side connection, so that no redundant signal interference is generated.
Preferably, the diameter of the connecting hole 8 is between 0.2mm and 0.3 mm.
The diameter of the connecting hole 8 is set to be between 0.2mm and 0.3mm, so that the connection with most devices such as radio frequency antennas or PCBs (printed circuit boards) can be met, and the universality is strong.
Preferably, the diameter of the via hole 7 is between 0.2mm and 0.3mm, and the distance between adjacent via holes 7 along the length extending direction of the transmission line is between 1mm and 3 mm. The diameter of the via hole 7 is between 0.2mm and 0.3mm, which is easy to obtain in the process, so that the manufacturing process has better convenience.
Unlike the radio frequency cable of the prior art, although the via holes 7 of the present embodiment do not completely close the central line, the spacing between the via holes 7 is set between 1mm and 3mm, so that the common communication shielding requirement can be satisfied.
Compared with the prior art, the manufacturing method of the radio frequency transmission line 100 of the embodiment not only can realize the reduction of the size of the radio frequency transmission line 100, but also has more efficient manufacturing process, requires less materials, and further reduces the cost of storage and transportation of the supply chain.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is within the scope of the appended claims and their equivalents to fall within the scope of the invention.
Claims (10)
1. A method of manufacturing a radio frequency transmission line, comprising the steps of:
etching a preset first circuit on a substrate through an LDS process;
spraying a first metallizable coating on the surface of the first circuit;
etching a central circuit on the first metallizable coating through an LDS process;
spraying a second metallizable coating on the center circuit;
etching a preset second circuit on the second metallizable coating;
and a plurality of through holes are arranged at two sides of the central circuit and extend along the length direction of the transmission line so as to electrically connect the first circuit and the second circuit.
2. The method of manufacturing a radio frequency transmission line according to claim 1, wherein etching the predetermined first circuit by an LDS process comprises: and etching the substrate according to a preset circuit pattern by using numerical control laser, and releasing metal ions along the etching route by the substrate after laser irradiation so as to form a first circuit.
3. The method of claim 1, wherein the material used to spray the first and second metallizable coatings is a modified plastic containing an organometallic compound that releases particles upon laser irradiation.
4. The method of manufacturing a radio frequency transmission line according to claim 2, wherein the thickness of the first metallizable coating and/or the second metallizable coating is 60-70 um.
5. The method of manufacturing a radio frequency transmission line according to claim 1, wherein etching a center circuit on the first metallizable coating by an LDS process further comprises: and etching the first metallizable coating according to a preset circuit pattern by using a numerical control laser, wherein after laser irradiation, the first metallizable coating releases metal ions along the etching route to form a central line, the line width of the central line ranges from 0.1mm to 0.5mm, and the thickness of the central line ranges from 0.15mm to 0.25 mm.
6. The method of manufacturing a radio frequency transmission line according to claim 5, further comprising: and a connecting hole is formed in the second metallizable coating and communicated with the central circuit so as to realize connection between the central circuit and the radio frequency antenna.
7. The method of manufacturing a radio frequency transmission line according to claim 6, wherein the diameter of the connection hole is between 0.2mm and 0.3 mm.
8. The method of manufacturing a radio frequency transmission line according to claim 1, wherein the diameter of the via hole is between 0.2mm and 0.3mm, and the pitch between adjacent via holes along the length extension direction of the transmission line is between 1mm and 3 mm.
9. An LDS-based radio frequency transmission line comprising: the circuit comprises a substrate, a first circuit etched on the substrate through an LDS process, a first metallizable coating sprayed on the first circuit, a central circuit etched on the first metallizable coating through the LDS process, a second metallizable coating sprayed on the central circuit, and a second circuit etched on the second metallizable coating through the LDS process; and the through holes are arranged on two sides of the central circuit and extend along the length direction of the transmission line, and are used for electrically connecting the first circuit and the second circuit.
10. The radio frequency transmission line of claim 9, further comprising: and a connection hole passing through the second metallizable coating for connecting the center line to a radio frequency antenna.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310647182.0A CN117098319A (en) | 2023-06-02 | 2023-06-02 | Radio frequency transmission line manufacturing method and radio frequency transmission line based on LDS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310647182.0A CN117098319A (en) | 2023-06-02 | 2023-06-02 | Radio frequency transmission line manufacturing method and radio frequency transmission line based on LDS |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117098319A true CN117098319A (en) | 2023-11-21 |
Family
ID=88775960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310647182.0A Pending CN117098319A (en) | 2023-06-02 | 2023-06-02 | Radio frequency transmission line manufacturing method and radio frequency transmission line based on LDS |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117098319A (en) |
-
2023
- 2023-06-02 CN CN202310647182.0A patent/CN117098319A/en active Pending
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