CN117098304A - Transparent circuit board and manufacturing method thereof - Google Patents
Transparent circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN117098304A CN117098304A CN202311125104.0A CN202311125104A CN117098304A CN 117098304 A CN117098304 A CN 117098304A CN 202311125104 A CN202311125104 A CN 202311125104A CN 117098304 A CN117098304 A CN 117098304A
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- Prior art keywords
- transparent
- protective film
- insulating protective
- circuit board
- layer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 230000001681 protective effect Effects 0.000 claims abstract description 78
- 239000010410 layer Substances 0.000 claims description 71
- 239000011248 coating agent Substances 0.000 claims description 24
- 238000000576 coating method Methods 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 4
- 229920002799 BoPET Polymers 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 abstract description 8
- 230000003287 optical effect Effects 0.000 description 6
- 239000003973 paint Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
Abstract
The invention relates to the technical field of transparent circuit boards for antennas, in particular to a transparent circuit board and a manufacturing method thereof, wherein the transparent circuit board comprises a transparent plate, a first transparent insulating protective film adhered to one surface of the transparent plate, and a first conductive circuit layer clamped between the transparent plate and the first transparent insulating protective film, wherein the first conductive circuit layer is distributed in a grid structure, so that the whole transparent circuit board is transparent, is completely different from the traditional high-frequency circuit board in visual effect, is better fused with the environment, and has better visual effect and more attractive appearance; and can be effectively applied to 5G base stations, displays, display screens, various antennas and the like, and the traditional high-frequency circuit board is omitted in related equipment, so that the weight is lighter, and the cost is lower.
Description
Technical Field
The invention relates to the technical field of transparent circuit boards for antennas, in particular to a transparent circuit board and a manufacturing method thereof.
Background
An antenna is a transducer that converts a guided wave propagating on a transmission line into an electromagnetic wave propagating in an unbounded medium (usually free space) or vice versa. A component for transmitting or receiving electromagnetic waves in a radio device. Engineering systems such as radio communication, broadcasting, television, radar, navigation, electronic countermeasure, remote sensing, radio astronomy and the like all rely on antennas to work when information is transmitted by electromagnetic waves.
However, most of the existing high-frequency circuit boards are colored light-shielding plates, which are not coordinated with the environment when being applied to deep coverage scenes such as residential areas and indoor distribution systems, and particularly, 5G base stations, displays, display screens, various antennas and the like are affected by visual limitations, so that the high-frequency circuit boards cannot be effectively applied.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide a transparent circuit board.
The invention also aims to provide a manufacturing method of the transparent circuit board, which has the advantages of simple operation, convenient control, high production efficiency and low production cost and can be used for mass production.
The aim of the invention is achieved by the following technical scheme: the utility model provides a transparent circuit board, includes transparent panel, bonds in the first transparent insulating protection film of transparent panel one side and presss from both sides the first conductive line layer of locating between transparent panel and the first transparent insulating protection film, first conductive line layer is net structure and distributes.
Preferably, the transparent board is a transparent PC board.
Preferably, the first transparent insulating protective film is a transparent PET film, and the thickness of the first transparent insulating protective film is 30-100 μm.
Preferably, the first conductive circuit layer is an etched copper foil layer or an electroplated copper layer, the thickness of the first conductive circuit layer is 2-50 μm, and the grid line width of the first conductive circuit layer is 3-15 μm.
Preferably, the transparent circuit board further comprises a first adhesive layer, and the transparent board and the first conductive circuit layer are bonded through the first adhesive layer and the first adhesive layer.
Preferably, a hole penetrating through the first transparent insulating protective film, the first conductive circuit layer and the transparent plate in sequence is formed in one side of the transparent circuit board.
Preferably, the transparent circuit board further includes a first logo coating surrounding the connection hole and applied to the first transparent insulating protection film.
Preferably, the transparent circuit board further comprises a second transparent insulating protective film adhered to the other surface of the transparent board and a second conductive circuit layer sandwiched between the transparent board and the second transparent insulating protective film, the second conductive circuit layer is distributed in a grid structure, and the connecting holes sequentially penetrate through the first transparent insulating protective film, the first conductive circuit layer, the transparent board, the second conductive circuit layer and the second transparent insulating protective film.
Preferably, the transparent circuit board further comprises a second adhesive layer and a second identification coating layer surrounding the connecting hole and coated on the second transparent insulating protective film, and the transparent board and the second conductive circuit layer are bonded through the second adhesive layer and the second adhesive layer.
The other object of the invention is achieved by the following technical scheme: the manufacturing method of the transparent circuit board comprises the following steps:
(S1) taking a first transparent insulating protective film, and performing grid copper coating treatment on one surface of the first transparent insulating protective film to obtain the first transparent insulating protective film with a first conductive circuit layer;
and (S2) taking a transparent plate, coating an adhesive on the surface of the first transparent insulating protective film with the first conductive circuit layer, adhering the adhesive on the surface of the transparent plate, and drying the transparent plate at 130-150 ℃ after vacuum lamination to obtain the transparent circuit board.
The invention has the beneficial effects that: the transparent circuit board provided by the invention adopts the transparent plate, the first transparent insulating protective film adhered to one surface of the transparent plate and the first conductive circuit layer clamped between the transparent plate and the first transparent insulating protective film, and the first conductive circuit layer is distributed in a grid structure, so that the whole transparent circuit board is transparent, is completely different from the traditional high-frequency circuit board in visual effect, is better fused with the environment, and has better visual effect and more attractive appearance; and can be effectively applied to 5G base stations, displays, display screens, various antennas and the like, and the traditional high-frequency circuit board is omitted in related equipment, so that the weight is lighter, and the cost is lower.
The manufacturing method of the invention has simple operation, convenient control, high production efficiency and low production cost, and can be used for mass production.
Drawings
FIG. 1 is a schematic structural view of embodiment 1 of the present invention;
FIG. 2 is a partial cross-sectional view of embodiment 1 of the present invention;
FIG. 3 is a partially exploded view of embodiment 1 of the present invention;
FIG. 4 is a partial cross-sectional view of embodiment 2 of the present invention;
FIG. 5 is a partially exploded view of embodiment 2 of the present invention;
FIG. 6 is a physical diagram of the product of example 2 of the present invention;
fig. 7 is another visual product object of embodiment 2 of the present invention.
The reference numerals are: 1. a transparent plate; 2. a first transparent insulating protective film; 3. a first conductive trace layer; 4. a first adhesive layer; 5. a receiving hole; 6. a first identification coating; 7. a second transparent insulating protective film; 8. a second conductive line layer; 9. a second adhesive layer; 10. and a second identification coating.
Detailed Description
The present invention will be further described with reference to examples and drawings, which are not intended to be limiting, for the understanding of those skilled in the art.
Example 1
As shown in fig. 1-3, a transparent circuit board comprises a transparent plate 1, a first transparent insulating protective film 2 adhered to one surface of the transparent plate 1, and a first conductive circuit layer 3 sandwiched between the transparent plate 1 and the first transparent insulating protective film 2, wherein the first conductive circuit layer 3 is distributed in a grid structure.
The transparent circuit board adopts a transparent plate 1, a first transparent insulating protective film 2 adhered to one surface of the transparent plate 1 and a first conductive circuit layer 3 clamped between the transparent plate 1 and the first transparent insulating protective film 2, wherein the first conductive circuit layer 3 is distributed in a grid structure, so that the whole transparent circuit board is transparent, is completely different from a traditional high-frequency circuit board in visual effect, and is better fused with the environment; and can be effectively applied to 5G base stations, displays, display screens, various antennas and the like, and the traditional high-frequency circuit board is omitted in related equipment, so that the weight is lighter, and the cost is lower. Furthermore, the first conductive circuit layer 3 is distributed in a grid structure, which is more favorable for the stability of signal transmission and reception, preferably, the grid structure is a honeycomb net or a diamond net, and more preferably, the grid structure is a honeycomb net structure.
Furthermore, the transparent plate 1 is a transparent PC plate, the light transmittance of the transparent plate reaches more than 80%, the transparent plate has high transmittance to visible light, the attractive appearance is high, and the transparent plate is better integrated with the environment; and can be effectively applied to 5G base stations, displays, display screens, various antennas and the like.
Further, the first transparent insulating protective film 2 is a transparent PET film, and the thickness of the first transparent insulating protective film 2 is 30-100 μm, so that the first transparent insulating protective film can achieve an insulating protective effect while meeting the transparent effect, and is beneficial to protecting the first conductive circuit layer 3. Preferably, the thickness of the first transparent insulating protective film 2 is 30, 40, 45, 50, 55, 60, 70, 80, 90 or 100 μm, and more preferably, the thickness of the first transparent insulating protective film 2 is 50 μm.
Further, the first conductive circuit layer 3 is an etched copper foil layer or an electroplated copper layer, the thickness of the first conductive circuit layer 3 is 2-50 μm, and the grid line width of the first conductive circuit layer 3 is 3-15 μm; the etching copper foil layer or the electroplated copper layer ensures that the first conductive circuit layer 3 is distributed in a grid structure by utilizing an etching or electroplating mode, and the thickness and the grid line width are controlled, so that the whole transparent circuit board is transparent, is completely different from the traditional antenna high-frequency circuit board in visual effect, and is better fused with the environment. Preferably, the first conductive circuit layer 3 is an etched copper foil layer, the thickness of the first conductive circuit layer 3 is 2, 4, 5, 6, 7, 8, 10, 15, 20, 25, 30, 40 or 50 μm, and the grid line width of the first conductive circuit layer 3 is 3, 4, 5, 6, 7, 8, 9, 10, 12 or 15 μm; more preferably, the thickness of the first conductive line layer 3 is 5 μm, and the grid line width of the first conductive line layer 3 is 5 μm.
Further, the transparent circuit board further comprises a first adhesive layer 4, and the transparent board 1 and the first conductive circuit layer 3 are bonded through the first adhesive layer 4 and the first adhesive layer 4. Preferably, the first adhesive layer 4 is made of optical adhesive, such as optical adhesive using epoxy resin as binder, polyurethane optical adhesive or optical organic silicone rubber adhesive, through vacuum hot pressing and drying, and has high transparency and good bonding property; more preferably, the optical adhesive used is an optical adhesive using epoxy resin as a binder.
Furthermore, a hole 5 penetrating through the first transparent insulating protective film 2, the first conductive circuit layer 3 and the transparent plate 1 in sequence is formed in one side of the transparent circuit board, and the hole 5 is used for signal connection with other elements of the antenna in actual use.
Further, the transparent circuit board further comprises a first identification coating 6 surrounding the connection hole 5 and coated on the first transparent insulating protective film 2, so that the position of the first conductive circuit layer 3 can be conveniently identified, and other elements of the subsequent antenna can be connected with the connection hole 5 of the transparent circuit board through signals.
The manufacturing method of the transparent circuit board comprises the following steps:
(S1) taking a first transparent insulating protective film 2, and performing grid copper-coating treatment on one surface of the first transparent insulating protective film 2 to obtain the first transparent insulating protective film 2 with a first conductive circuit layer 3;
and (S2) taking the transparent plate 1, coating an adhesive on the surface of the first transparent insulating protective film 2 with the first conductive circuit layer 3, adhering the adhesive on the surface of the transparent plate 1, and drying the transparent plate at 130-150 ℃ after vacuum lamination to obtain the transparent circuit board.
Preferably, the drying temperature in step (S2) is 140 ℃.
Further, the grid copper-clad treatment is to clad copper foil on one side of the first transparent insulating protective film 2 and then etch the first transparent insulating protective film to form a grid structure distribution or to electroplate copper on one side of the first transparent insulating protective film 2 and form a grid structure distribution. Preferably, the grid copper-clad treatment is that copper foil is attached to one surface of the first transparent insulating protective film 2 and then etched to form grid structure distribution.
Further, one end of the first transparent insulating protective film 2 in the step (S1) is coated with a marking paint and dried to obtain a first marking coating 6; and step (S2) after drying, drilling the transparent circuit board along the middle part of the first identification coating 6 to form a connecting hole 5. The marking paint is paint with color marks.
Example 2
This embodiment differs from embodiment 1 in that: both sides of the transparent plate 1 are provided with transparent insulating protective films and conductive circuit layers.
Specifically, as shown in fig. 4-7, the transparent circuit board further includes a second transparent insulating protective film 7 adhered to the other surface of the transparent board 1, and a second conductive circuit layer 8 sandwiched between the transparent board 1 and the second transparent insulating protective film 7, where the second conductive circuit layer 8 is distributed in a grid structure, and the via holes 5 sequentially penetrate through the first transparent insulating protective film 2, the first conductive circuit layer 3, the transparent board 1, the second conductive circuit layer 8, and the second transparent insulating protective film 7.
Further, the transparent circuit board further comprises a second adhesive layer 9 and a second identification coating 10 which surrounds the connecting hole 5 and is coated on the second transparent insulating protective film 7, and the transparent board 1 and the second conductive circuit layer 8 are bonded through the second adhesive layer 9 and the second adhesive layer 9.
The manufacturing method of the transparent circuit board comprises the following steps:
(S1) taking the first transparent insulating protective film 2 and the second transparent insulating protective film 7, performing a grid copper-clad treatment on one surface of the first transparent insulating protective film 2, performing a grid copper-clad treatment on one surface of the second transparent insulating protective film 7, and then obtaining the first transparent insulating protective film 2 having the first conductive line layer 3 and the second transparent insulating protective film 7 having the second conductive line layer 8;
(S2) taking the transparent plate 1, coating an adhesive on one surface of the first transparent insulating protective film 2 with the first conductive circuit layer 3 and coating an adhesive on one surface of the second transparent insulating protective film 7 with the second conductive circuit layer 8, respectively adhering the adhesive on two surfaces of the transparent plate 1, and drying at 130-150 ℃ after vacuum lamination to obtain the transparent circuit board.
Preferably, the drying temperature in step (S2) is 140 ℃.
Further, the grid copper-coating treatment is that after copper foil is coated on one side of the first transparent insulating protective film 2, copper is etched to be distributed in a grid structure, or copper is electroplated on one side of the first transparent insulating protective film 2 and distributed in a grid structure, and after copper foil is coated on one side of the second transparent insulating protective film 7, copper is etched to be distributed in a grid structure, or copper is electroplated on one side of the second transparent insulating protective film 7 and distributed in a grid structure. Preferably, the grid copper-clad treatment is to apply copper foil to one side of the first transparent insulating protective film 2 and then etch the first transparent insulating protective film to form a grid structure, and to apply copper foil to one side of the second transparent insulating protective film 7 and then etch the second transparent insulating protective film to form a grid structure.
Further, in the step (S1), a first identification coating 6 is obtained after the first transparent insulating protective film 2 is coated with the identification coating and dried, and a second identification coating 10 is obtained after the second transparent insulating protective film 7 is coated with the identification coating and dried; and (S2) after drying, drilling the transparent circuit board along the first identification coating 6 to the second identification coating 10 to form the connecting holes 5. The marking paint is paint with color marks.
The above embodiments are preferred embodiments of the present invention, and besides, the present invention may be implemented in other ways, and any obvious substitution is within the scope of the present invention without departing from the concept of the present invention.
Claims (10)
1. A transparent circuit board, characterized in that: the transparent plate comprises a transparent plate, a first transparent insulating protective film adhered to one surface of the transparent plate, and a first conductive circuit layer clamped between the transparent plate and the first transparent insulating protective film, wherein the first conductive circuit layer is distributed in a grid structure.
2. A transparent circuit board according to claim 1, wherein: the transparent plate is a transparent PC plate.
3. A transparent circuit board according to claim 1, wherein: the first transparent insulating protective film is a transparent PET film, and the thickness of the first transparent insulating protective film is 30-100 mu m.
4. A transparent circuit board according to claim 1, wherein: the first conductive circuit layer is an etched copper foil layer or an electroplated copper layer, the thickness of the first conductive circuit layer is 2-50 mu m, and the grid line width of the first conductive circuit layer is 3-15 mu m.
5. A transparent circuit board according to claim 1, wherein: the transparent circuit board further comprises a first adhesive layer, and the transparent board and the first conductive circuit layer are bonded through the first adhesive layer.
6. A transparent circuit board according to claim 1, wherein: and one side of the transparent circuit board is provided with a connecting hole which sequentially penetrates through the first transparent insulating protective film, the first conductive circuit layer and the transparent plate.
7. The transparent circuit board of claim 6, wherein: the transparent circuit board further includes a first logo coating surrounding the via and applied to the first transparent insulating protective film.
8. The transparent circuit board of claim 6, wherein: the transparent circuit board further comprises a second transparent insulating protective film adhered to the other surface of the transparent board and a second conductive circuit layer clamped between the transparent board and the second transparent insulating protective film, wherein the second conductive circuit layer is distributed in a grid structure, and the connecting holes sequentially penetrate through the first transparent insulating protective film, the first conductive circuit layer, the transparent board, the second conductive circuit layer and the second transparent insulating protective film.
9. The transparent circuit board of claim 8, wherein: the transparent circuit board also comprises a second adhesive layer and a second identification coating which surrounds the connecting hole and is coated on the second transparent insulating protective film, and the transparent board and the second conductive circuit layer are bonded by the second adhesive layer.
10. A method of manufacturing a transparent circuit board according to any one of claims 1 to 9, comprising the steps of:
(S1) taking a first transparent insulating protective film, and performing grid copper coating treatment on one surface of the first transparent insulating protective film to obtain the first transparent insulating protective film with a first conductive circuit layer;
and (S2) taking a transparent plate, coating an adhesive on the surface of the first transparent insulating protective film with the first conductive circuit layer, adhering the adhesive on the surface of the transparent plate, and drying the transparent plate at 130-150 ℃ after vacuum lamination to obtain the transparent circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311125104.0A CN117098304A (en) | 2023-09-01 | 2023-09-01 | Transparent circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311125104.0A CN117098304A (en) | 2023-09-01 | 2023-09-01 | Transparent circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117098304A true CN117098304A (en) | 2023-11-21 |
Family
ID=88782787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311125104.0A Pending CN117098304A (en) | 2023-09-01 | 2023-09-01 | Transparent circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117098304A (en) |
-
2023
- 2023-09-01 CN CN202311125104.0A patent/CN117098304A/en active Pending
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