CN117096084A - Magnetic LED crystal grain transferring device and transferring method thereof - Google Patents

Abstract

The invention provides a magnetic light-emitting diode crystal grain transferring device which is used for transferring a plurality of magnetic light-emitting diode crystal grains and comprises a substrate, a plurality of magnetic pieces and a vibrating mechanism. The substrate comprises a plurality of crystal grain arrangement areas which are arranged at intervals, and each crystal grain arrangement area comprises an arrangement surface. Each magnetic piece is aligned with each grain setting area, and each magnetic piece comprises an alignment N pole and an alignment S pole, and the arrangement direction of each alignment N pole and each alignment S pole is parallel to the setting surface. The vibration mechanism is coupled to the substrate. The N pole and the S pole of each magnetic LED crystal grain are respectively attracted by the contraposition S pole and the contraposition N pole, so that the magnetic LED crystal grain is transferred to the crystal grain setting area in a contraposition mode, and the vibration mechanism can vibrate the substrate to enable the magnetic LED crystal grain to be overturned and contraposition again. Thereby effectively transferring the magnetic light-emitting diode crystal grains.

Description

Magnetic LED crystal grain transferring device and transferring method thereof

Technical Field

The present invention relates to a transfer device and a transfer method, and more particularly, to a magnetic light emitting diode die transfer device and a magnetic light emitting diode die transfer method.

Background

The light emitting diode (Light Emitting Diode; LED) die has advantages of low power consumption, high luminous efficiency and long life, and is widely used in various fields.

In some fields, such as LED displays, a plurality of LED dies are disposed on a substrate, and if a conventional surface adhesion technology is used, only one LED die can be transferred at a time, so that the operation time is too long to meet the requirement of mass transfer.

In view of this, it is an object of the related art to develop a magnetic light emitting diode die transfer apparatus and a magnetic light emitting diode die transfer method capable of performing mass transfer.

Disclosure of Invention

In order to solve the above problems, the present invention provides a magnetic light emitting diode die transfer apparatus and a magnetic light emitting diode die transfer method, by which a large number of magnetic light emitting diode dies can be transferred efficiently.

According to one embodiment of the present invention, a magnetic light emitting diode die transfer device is provided for transferring a plurality of magnetic light emitting diode dies, each magnetic light emitting diode die comprises an N-pole and an S-pole and has a height direction, the arrangement direction of each N-pole and each S-pole is approximately perpendicular to the height direction, and the magnetic light emitting diode die transfer device comprises a substrate, a plurality of magnetic members and a vibration mechanism. The substrate comprises a plurality of grain arrangement areas which are arranged at intervals, and each grain arrangement area comprises an arrangement surface. Each magnetic piece is aligned with each grain setting area, each magnetic piece comprises a pair of aligned N poles and a pair of aligned S poles, the alignment direction of each aligned N pole and each aligned S pole is approximately parallel to each setting surface, and the aligned N pole of one magnetic piece corresponds to the aligned S pole of the adjacent other magnetic piece. The vibration mechanism is coupled to the substrate. Wherein, each N pole and each S pole of each magnetic LED crystal grain are respectively attracted by each contraposition S pole and each contraposition N pole, so that each magnetic LED crystal grain is transferred to each crystal grain setting area in contraposition; when at least one magnetic light emitting diode grain falls into a grain setting area and the N pole of the at least one magnetic light emitting diode grain is not aligned with the alignment S pole of the magnetic piece in the grain setting area, the vibration mechanism vibrates the substrate to enable the at least one magnetic light emitting diode grain to be overturned and realigned.

Therefore, based on the arrangement direction relation of the para N pole and the para S pole of the magnetic part, the magnetic LED crystal grain transfer para position can be truly attracted by the principle of opposite attraction, and the effect of one-time mass transfer can be achieved. In addition, the vibration mechanism vibrates the substrate, so that the non-aligned magnetic light-emitting diode crystal grains can be turned over to be aligned again, the use convenience is achieved, and the alignment efficiency can be improved.

According to the magnetic LED die transfer device of the foregoing embodiment, each magnetic element may have a magnet structure.

According to the magnetic LED die transfer device of the foregoing embodiment, each magnetic element may have an electromagnet structure.

According to the magnetic led die transfer device of the foregoing embodiment, each magnetic element may include a glass plate, a plurality of first through holes, a plurality of second through holes, a plurality of first conductive portions and a plurality of second conductive portions. The glass plate is disposed under the substrate. The first through holes penetrate through the glass plate and are arranged at equal intervals. The second through holes penetrate through the glass plate and are arranged at equal intervals, and the second through holes and the first through holes are staggered but not collinear. The plurality of first conductive portions are filled in the first through holes and the second through holes. The plurality of second conductive parts are positioned on the surface of the glass plate, and each second conductive part is connected with each first conductive part positioned in each first through hole and each first conductive part positioned in each second through hole. The first conductive parts and the second conductive parts are connected to form a spiral structure.

The magnetic led die transfer device according to the foregoing embodiment may further include a controller electrically connected to the plurality of magnetic elements, the controller being configured to control each of the magnetic elements to be turned on to generate magnetic force or turned off to cancel the magnetic force.

According to the magnetic light emitting diode die transferring apparatus of the foregoing embodiment, a bottom surface of each magnetic light emitting diode die may be substantially square.

According to one embodiment of the present invention, a method for transferring a plurality of led dies is provided, wherein each led die includes an N-pole and an S-pole and has a height direction, and the arrangement direction of each N-pole and each S-pole is approximately perpendicular to the height direction. In the step of providing the substrate, a substrate is provided, wherein the substrate comprises a plurality of die arrangement areas. In the step of providing the magnetic pieces, a plurality of magnetic pieces are provided and respectively correspond to the plurality of grain setting areas, each magnetic piece is arranged in the substrate or outside the substrate at intervals, each magnetic piece comprises a pair of opposite N poles and a pair of opposite S poles, the arrangement direction of each opposite N pole and each opposite S pole is approximately parallel to each setting surface, and the opposite N pole of one magnetic piece corresponds to the opposite S pole of the adjacent other magnetic piece. In the transferring step, each N pole and each S pole of each magnetic LED crystal grain are respectively attracted by each contraposition S pole and each contraposition N pole, so that each magnetic LED crystal grain is transferred and contraposition to each crystal grain setting area. In the vibration step, the substrate is vibrated, and at least one magnetic light emitting diode grain which is mutually exclusive with the polarity of the magnetic part of the at least one grain arrangement area is turned over, so that the at least one magnetic light emitting diode grain is realigned.

According to the foregoing embodiment of the method for transferring a magnetic light emitting diode die, in the step of providing the substrate, the substrate may be made of a glass material and includes: forming a plurality of through holes on a substrate; photoresist coating, exposure and etching are carried out on the substrate so as to form a plurality of metal setting areas on the substrate to be respectively communicated with the plurality of through holes; and filling the metal arrangement regions and the through holes with metal materials to form crystal grain arrangement regions.

According to the method for transferring the led die of the foregoing embodiment, a part of the led die emits a first color light, another part emits a second color light, and another part emits a third color light, and in the transferring step, a part of the magnetic members is turned on to generate a magnetic force so that the led die of the part emitting the first color light is attracted and aligned; then, keeping one part of the magnetic parts open, and enabling the other part of the magnetic parts to open so as to generate magnetic force to enable the magnetic light emitting diode crystal grains of the other part emitting second color light to be attracted and aligned; and finally, starting all the magnetic pieces, and enabling the magnetic light-emitting diode crystal grains which emit the third color light and are still a part of the magnetic light-emitting diode crystal grains to be attracted and aligned.

According to the method for transferring the magnetic light emitting diode die of the foregoing embodiment, each die arrangement region has a groove structure and has a receiving space, and in the vibrating step, the substrate is vibrated up and down, so that the at least one magnetic light emitting diode die falls into the receiving space again after being separated from the receiving space.

Drawings

FIG. 1 is a schematic diagram of a magnetic LED die transfer apparatus and a magnetic LED die according to a first embodiment of the present invention;

FIG. 2 is a schematic diagram of a magnetic LED die transfer apparatus and a magnetic LED die according to a second embodiment of the present invention;

FIG. 3 is a schematic side cross-sectional view of a magnetic LED die transfer apparatus and a magnetic LED die according to a third embodiment of the present invention;

FIG. 4 is a schematic top view of the magnetic part of the LED die transfer apparatus of the third embodiment of FIG. 3;

FIG. 5 is a schematic top view of a magnetic LED die transfer apparatus and a magnetic LED die according to a fourth embodiment of the invention;

fig. 6 is a view showing the formation of a substrate of a magnetic light emitting diode die transfer device according to a fourth embodiment of the present invention; and

fig. 7 is a block flow diagram of a method for transferring a magnetic light emitting diode die according to a fifth embodiment of the invention.

Reference numerals illustrate:

100,200,300,400: magnetic LED crystal grain transferring device

110,210,310,410: substrate board

111,411,412,413: grain arrangement region

1111: setting surface

112: spacer region

120,220,320: magnetic member

121,221,321: para-position N pole

122,222,322: para-position S pole

130: vibration mechanism

323: glass plate

324: first through hole

325: second through hole

326: first conductive part

327: second conductive part

415: through hole

416: metal arrangement region

440: controller for controlling a power supply

500: magnetic LED crystal grain transferring method

510: substrate providing step

520: magnetic member providing step

530: transfer step

540: vibration step

D11, D12, D21, D22: tangential direction of magnetic force line

L1, L2, L3: magnetic LED crystal grain

L11: n pole

L12: s pole

M1: metal material

R1: photoresist

Detailed Description

Embodiments of the present invention will be described below with reference to the accompanying drawings. For purposes of clarity, many practical details will be set forth in the following description. However, the reader should appreciate that these practical details should not be used to limit the invention. That is, in some embodiments of the invention, these practical details are unnecessary. Furthermore, for the sake of simplicity of the drawing, some of the existing conventional structures and elements are shown in the drawing in a simplified schematic manner; and repeated elements will likely be indicated by identical or analogous numerals.

In addition, the terms first, second, third, etc. are used herein only to describe different elements or components, and there is no limitation on the elements/components themselves, and thus, the first element/component may be modified as a second element/component. And the combination of elements/components/mechanisms/modules herein is not a commonly known, conventional or existing combination in the art, and it cannot be determined whether the combination of elements/components/mechanisms/modules themselves are existing or not, which is easily accomplished by one of ordinary skill in the art.

Referring to fig. 1, fig. 1 is a schematic diagram illustrating a magnetic led die transfer apparatus 100 and a magnetic led die L1 according to a first embodiment of the invention. According to an embodiment of the present invention, a magnetic light emitting diode die transferring apparatus 100 is provided for transferring a plurality of magnetic light emitting diode dies L1, wherein each magnetic light emitting diode die L1 includes an N-pole L11 and an S-pole L12 and has a height direction, and an arrangement direction of each N-pole L11 and each S-pole L12 is approximately perpendicular to the height direction, and the magnetic light emitting diode die transferring apparatus 100 includes a substrate 110, a plurality of magnetic members 120 and a vibration mechanism 130. The substrate 110 includes a plurality of die-setting regions 111, the die-setting regions 111 are arranged at intervals, and each die-setting region 111 includes a setting surface 1111. Each magnetic element 120 is aligned with each die setting region 111, and each magnetic element 120 includes a pair of aligned N-poles 121 and a pair of aligned S-poles 122, the alignment direction of each aligned N-pole 121 and each aligned S-pole 122 is approximately parallel to each setting surface 1111, and the aligned N-pole 121 of one magnetic element 120 corresponds to the aligned S-pole 122 of another adjacent magnetic element 120. The vibration mechanism 130 is coupled to the substrate 110. Wherein, each N pole L11 and each S pole L12 of each magnetic light emitting diode die L1 are respectively attracted by each alignment S pole 122 and each alignment N pole 121, so that each magnetic light emitting diode die L1 is transferred and aligned to each die setting region 111; when at least one magnetic light emitting diode die L1 falls into a die placement area 111 and the N-pole L11 of the at least one magnetic light emitting diode die L1 is not aligned with the aligned S-pole 122 of the magnetic member 120 of the die placement area 111, the vibration mechanism 130 vibrates the substrate 110 to turn over and realign the at least one magnetic light emitting diode die L1.

Therefore, based on the arrangement direction relationship between the para-N pole 121 and the para-S pole 122 of the magnetic element 120, the magnetic led die L1 can be firmly attracted to the shift alignment by the principle of opposite attraction, so as to achieve a large amount of shift effects at a time. In addition, the vibration mechanism 130 vibrates the substrate 110, so that the non-aligned magnetic light emitting diode die L1 can be turned over to perform alignment again, thereby not only having convenient use, but also improving alignment efficiency. Details of the magnetic light emitting diode die transfer apparatus 100 will be described later.

The led die L1 may include an epitaxial layer and a magnetic metal plate, where the epitaxial layer is disposed on the magnetic metal plate, and the magnetic metal plate may include a nickel-iron alloy layer and a copper layer, for example, and may have a high thermal conductivity, a low thermal expansion coefficient, and an initial magnetic permeability, and may have weak magnetic properties, and the magnetic directions are horizontally aligned.

The substrate 110 may be a transparent substrate or an insulating substrate, the die-setting regions 111 may have a groove structure, the bottom surface of the groove structure forms a setting surface 1111, and a spacing region 112 may be spaced between the die-setting regions 111. In the first embodiment of fig. 1, each magnetic element 120 may have a magnet structure, which may be embedded in the substrate 110, but in other embodiments, each magnetic element may be disposed outside the substrate, which is not limited thereto.

The magnetic members 120 are horizontally arranged, the magnetic members 120 generate magnetic force, the tangential directions of magnetic lines of force above and below the installation surface 1111 are respectively D11 and D12, and the tangential directions of magnetic lines of force D21 and D22 are also formed above and below the spacers 112. As shown in fig. 1, the tangential direction D11 of the magnetic lines of force is opposite to and mutually exclusive from the tangential direction D21 of the magnetic lines of force, which can help to separate the led die L1. In other words, since the magnetism of the led die L1 is horizontally aligned, there is a problem that the led die L1 is easily connected to each other and is not easily separated. By the arrangement in which the magnetic flux tangential direction D11 of the die arrangement region 111 is opposite to the magnetic flux tangential direction D21 of the spacer region 112, separation of the connected magnetic light emitting diode die L1 can be facilitated at the time of transfer of the magnetic light emitting diode die L1.

The vibration mechanism 130 may have a vibration rod structure, and a motor, an eccentric block, and other elements may be disposed in the vibration mechanism 130 to cause vibration, so as to vibrate the substrate 110. In other embodiments, the substrate may be connected to a robot and the substrate may be vibrated by the robot, which is not a limitation of the present invention. During the process of transferring the led die L1, a portion of the led die L1 may be inverted when it falls into the die placement region 111, i.e., the S-pole L12 of the led die L1 is aligned with the aligned S-pole 122 of the magnetic element 120, so that the led die L1 cannot be adsorbed and fixed by the magnetic element 120 due to the mutual exclusion relationship, and is still in a movable state. In this case, if the substrate 110 is vibrated up and down by the vibration mechanism 130, the movable led dies L1 are flipped up and turned over, and can be realigned. The led die L1, which is correctly oriented and attracted and fixed by the magnetic member 120, is not affected and remains fixed.

In addition, a bottom surface of each of the led dies L1 may be substantially square. That is, the bottom surfaces of the led dies L1 have the same length and width, so the die-setting region 111 can also have the setting surfaces 1111 with the same length and width corresponding to the led dies L1, so the led dies L1 are easier to fall into the die-setting region 111.

Referring to fig. 2, fig. 2 is a schematic diagram illustrating a magnetic led die transfer apparatus 200 and a magnetic led die L1 according to a second embodiment of the invention. The led die transfer apparatus 200 of the two embodiments of fig. 2 is similar to the led die transfer apparatus 100 of the one embodiment of fig. 1, but the magnetic element 220 is independent from the substrate 210, and the magnetic element 220 may have an electromagnet structure. As shown in fig. 2, the magnetic element 220 can be wound with a coil and energized to form an alignment N pole 221 and an alignment S pole 222, and the alignment N pole 221 and the alignment S pole 222 are horizontally aligned to be the same as the alignment direction of the N pole L11 and the S pole L12 of the led die L1, so as to achieve the effect of adsorption alignment. The magnetic force of the magnetic member 220 can be achieved by the magnitude of the current or the number of turns of the coil, and the magnetic pole direction can be changed by the direction of the current, so that the configuration is convenient.

Referring to fig. 3 and 4, fig. 3 is a schematic side sectional view of a portion of a magnetic light emitting diode die transferring apparatus 300 and a magnetic light emitting diode die L1 according to a third embodiment of the invention, and fig. 4 is a schematic top view of a magnetic element 320 of the magnetic light emitting diode die transferring apparatus 300 of the third embodiment of fig. 3. In the led die transfer apparatus 300, the magnetic elements 320 also have an electromagnet structure, and each magnetic element 320 includes a glass plate 323, a plurality of first through holes 324, a plurality of second through holes 325, a plurality of first conductive portions 326 and a plurality of second conductive portions 327. The glass plate 323 is disposed under the substrate 310, and the plurality of first through holes 324 penetrate the glass plate 323 and are arranged at equal intervals. The plurality of second through holes 325 penetrate the glass plate 323 and are arranged at equal intervals, and the plurality of second through holes 325 are staggered but not collinear with the plurality of first through holes 324. The plurality of first conductive portions 326 fill the first through holes 324 and the second through holes 325. The plurality of second conductive portions 327 are positioned on the surface of the glass plate 323, and each second conductive portion 327 connects each first conductive portion 326 positioned in each first through hole 324 and each first conductive portion 326 positioned in each second through hole 325. Wherein the first conductive portions 326 and the second conductive portions 327 are connected to form a spiral structure. In this case, the alignment N-pole 321 and the alignment S-pole 322 are horizontally aligned and have the same alignment direction as the N-pole L11 and the S-pole L12 of the led die L1, so as to achieve the effect of adsorption alignment.

Specifically, as shown in fig. 3 and 4, the glass plate 323 may include, for example, 3 first through holes 324 and 3 second through holes 325,3, the first through holes 324 being aligned in a horizontal direction, the 3 second through holes 325 being aligned in another horizontal direction, and each first through hole 324 and each second through hole 325 being non-collinear in a vertical direction. The first conductive portion 326 and the second conductive portion 327 may be, for example, copper, that is, after the first conductive portion 326 is disposed in the first through hole 324 and the second through hole 325, a conductive hole (VIA) structure is formed, and the second conductive portion 327 is disposed on the upper surface and the lower surface of the glass plate 323, and finally, a spiral coil structure is formed, and after being energized, the alignment S-electrode 322 and the alignment N-electrode 321 are formed. In the third embodiment, the glass plate 323 may further have an effect of preventing the magnetic member 320 from being shorted. It should be noted that, although the number of turns of the first conductive portion 326 and the second conductive portion 327 shown in fig. 3 and 4 is 3, the number of turns of the coil can be changed according to the magnetic force line requirement, which is not limited by the drawings.

Referring to fig. 5 and 6, fig. 5 is a schematic top view illustrating a led die transferring apparatus 400 and led dies L1, L2, L3 according to a fourth embodiment of the invention, and fig. 6 is a schematic view illustrating a substrate 410 of the led die transferring apparatus 400 according to the fourth embodiment of the invention. The substrate 410 of the led die transfer device 400 may include a plurality of die-setting regions 411,412,413, where the die-setting regions 411,412,413 are respectively used for setting the led dies L1, L2, L3, and the led die L1 may emit a first color light, such as red light, the led die L2 may emit a second color light, such as blue light, and the led die L3 may emit a third color light, such as blue light.

As shown in fig. 5, 6 and fig. 6, a plurality of through holes 415 may be formed on the substrate 410, a photoresist R1 is coated on the substrate 410, and then a plurality of metal placement regions 416 may be formed by exposure and etching to respectively communicate with the plurality of through holes 415. Thus, the metal material M1 is filled in each metal set region 416 and each via 415, and die set regions 411,412,413 are formed. In other embodiments, the substrate may be formed by other methods, but not limited to the above.

Referring to fig. 5, each of the die placement areas 411,412,413 may correspond to a magnetic element (not shown in the fourth embodiment), and the led die transfer apparatus 400 further includes a controller 440 electrically connected to the magnetic element, and the controller 440 is configured to control each of the magnetic elements to be turned on to generate magnetic force or turned off to cancel the magnetic force. In other words, since the magnetic members have an electromagnet structure, the magnetic force can be generated by turning on the power, and when not powered, the magnetic members have no magnetic force, so that the controller 440 can control each magnetic member to select the desired die arrangement regions 411,412,413 to arrange the desired magnetic led dies L1, L2, L3.

For example, all the magnetic elements corresponding to the die-setting area 411 may be turned on first, and a large number of the led dies L1 are taken, so that the led dies L1 are transferred and adsorbed to the die-setting area 411; starting the magnetic parts corresponding to all the grain setting areas 411 and 412, and taking a large number of magnetic light emitting diode grains L2 so that the magnetic light emitting diode grains L2 are transferred and adsorbed to the grain setting area 412; finally, the magnetic parts corresponding to all the die arrangement areas 411,412,413 are opened, and a large number of the led dies L3 are taken, so that the led dies L3 are transferred and adsorbed to the die arrangement area 413, including but not limited to the above disclosure.

Referring to fig. 7 together with fig. 1, fig. 7 is a block flow chart of a method 500 for transferring a led die according to a fifth embodiment of the invention, and details of the method 500 for transferring a led die will be described with reference to the apparatus 100 for transferring a led die of fig. 1. The led die transfer method 500 may be used to transfer a plurality of led dies L1, where each led die L1 includes an N-pole L11 and an S-pole L12 and has a height direction, and the arrangement direction of each N-pole L11 and each S-pole L12 is approximately perpendicular to the height direction, and the led die transfer method 500 includes a substrate providing step 510, a magnetic part providing step 520, a transfer step 530, and a vibrating step 540.

In the substrate providing step 510, a substrate 110 is provided, and the substrate 110 includes a plurality of die arrangement regions 111.

In the magnetic element providing step 520, a plurality of magnetic elements 120 are provided corresponding to the plurality of die-setting regions 111, each magnetic element 120 is arranged in the substrate 110 at intervals, each magnetic element 120 includes a pair of aligned N-poles 121 and a pair of aligned S-poles 122, the alignment direction of each aligned N-pole 121 and each aligned S-pole 122 is approximately parallel to each setting surface 1111, and the aligned N-pole 121 of one magnetic element 120 corresponds to the aligned S-pole 122 of another adjacent magnetic element 120.

In the transferring step 530, the N poles L11 and S poles L12 of the led dies L1 are attracted by the aligned S poles 122 and the aligned N poles 121, respectively, so as to transfer the led dies L1 to the die placement areas 111.

In the vibrating step 540, the substrate 110 is vibrated, and the at least one led die L1 having a polarity mutually exclusive with the magnetic component 120 of the at least one die-setting region 111 is flipped over, so that the at least one led die L1 is realigned.

Specifically, in the substrate providing step 510, the die-setting regions 111 are arranged at intervals, and each die-setting region 111 has a groove structure and has a receiving space. In the magnetic element providing step 520, the magnetic element 120 may have a magnet structure, and may be buried in the substrate 110 and correspond to the setting surface 1111 of each die setting region 111 when the substrate 110 is fabricated. Alternatively, as in the second embodiment of fig. 2, the magnetic member 220 may have an electromagnet structure and be independent from the substrate 210.

In the transferring step 530, a plurality of led dies L1 may be provided, and in the initial state, the led dies L1 may be in a state of being connected to each other and being movable arbitrarily without being magnetically attracted by the magnetic member 120. In the transferring step 530, each led die L1 is attracted by the magnetic force of the magnetic member 120 and falls into the accommodating space of each die-setting region 111, and cannot be moved arbitrarily due to the magnetic force. If the led dies L1 fall into the accommodating space of the die-setting regions 111 but are opposite in direction, the magnetic force of the led dies L1 is mutually exclusive to the magnetic force of the magnetic member 120, so that the substrate 110 can vibrate up and down in the vibrating step 540, so that the led dies L1 opposite in direction fall into the accommodating space again after leaving the accommodating space, and the led dies L1 are turned over by the relationship of vibration and opposite magnetic force, thereby facilitating realignment.

As shown in fig. 5 to 7, the substrate 410 may be made of a glass material, and the substrate providing step 510 may include: forming a plurality of through holes 415 on the substrate 410; coating, exposing and etching the photoresist R1 on the substrate 410 to form a plurality of metal disposing regions 416 on the substrate 410 for respectively connecting the plurality of through holes 415; and filling the metal set regions 416 and the through holes 415 with a metal material M1 to form die set regions 411,412, 413.

The led dies L1, L2, L3 can emit different colors, wherein the led die L1 emits a first color, the led die L2 emits a second color, and the led die L3 emits a third color. Therefore, in the transferring step 530, a portion of the magnetic elements is turned on, that is, the magnetic elements corresponding to the die-setting area 411 are electrified to generate magnetic force to attract and align the led die L1 emitting the first color light; then, the part of the plurality of magnetic elements is kept open, and the other part of the plurality of magnetic elements is opened, namely, the magnetic elements corresponding to the crystal grain arrangement areas 411 and 412 are electrified so as to generate magnetic force to enable the magnetic light-emitting diode crystal grain L2 emitting the second color light to be attracted and aligned; finally, all the magnetic pieces are turned on, that is, all the magnetic pieces corresponding to the die arrangement areas 411,412,413 are electrified, and the magnetic light emitting diode die L3 emitting the third color light is attracted and aligned. Thus, the led dies L1, L2, L3 with different colors can be disposed in the different die placement areas 411,412, 413. It should be noted that, when the led die L1 is disposed, if there is a misalignment, the vibration step 540 may be performed until all led dies L1 are disposed, and then the led die L2 with the second color light is further performed, and the vibration step 540 may be matched, so details will not be repeated.

Although the present invention has been described with reference to the above embodiments, it should be understood that the present invention is not limited thereto, and that various changes and modifications can be made by one skilled in the art without departing from the spirit and scope of the present invention as defined by the appended claims.

Claims (10)

1. The utility model provides a magnetism emitting diode crystal grain shifts transfer device for shift a plurality of magnetism emitting diode crystal grains, each magnetism emitting diode crystal grain contains an N utmost point and an S utmost point and has a direction of height, and the direction of arrangement of each this N utmost point and each this S utmost point is roughly perpendicular with this direction of height, and characterized in that, this magnetism emitting diode crystal grain shifts transfer device includes:

a substrate including a plurality of die-setting regions, the die-setting regions being arranged at intervals, and each die-setting region including a setting surface;

the magnetic pieces are aligned with the grain arrangement areas, each magnetic piece comprises an alignment N pole and an alignment S pole, the alignment direction of each alignment N pole and each alignment S pole is approximately parallel to each arrangement surface, and the alignment N pole of one magnetic piece corresponds to the alignment S pole of the adjacent other magnetic piece; and

a vibration mechanism coupled to the substrate;

wherein, each N pole and each S pole of each magnetic LED grain are respectively attracted by each contraposition S pole and each contraposition N pole, so that each magnetic LED grain is transferred and contraposition to each grain setting area; when at least one of the magnetic light emitting diode dies falls into the die arrangement region and the N pole of the at least one of the magnetic light emitting diode dies is not aligned with the alignment S pole of the magnetic piece in the die arrangement region, the vibration mechanism vibrates the substrate to enable the at least one of the magnetic light emitting diode dies to turn over and realign.

2. The led die transfer device of claim 1, wherein each of the magnetic members has a magnet structure.

3. The device of claim 1, wherein each of the magnetic elements has an electromagnet structure.

4. The led die transfer device of claim 3, wherein each of the magnetic elements comprises:

a glass plate disposed under the substrate;

a plurality of first through holes penetrating the glass plate and arranged at equal intervals;

the second through holes penetrate through the glass plate and are arranged at equal intervals, and the second through holes and the first through holes are staggered but are not collinear;

a plurality of first conductive portions filled in the first through holes and the second through holes; and

a plurality of second conductive parts positioned on the surface of the glass plate, wherein each second conductive part is connected with each first conductive part positioned in each first through hole and each first conductive part positioned in each second through hole;

the first conductive parts and the second conductive parts are connected to form a spiral structure.

5. The magnetic light emitting diode die transfer device of claim 3, further comprising:

and the controller is electrically connected with the magnetic pieces and is used for controlling each magnetic piece to be opened to generate magnetic force or closed to cancel the magnetic force.

6. The device of claim 1, wherein a bottom surface of each of the led dies is substantially square.

7. The magnetic LED crystal grain transferring method is used for transferring a plurality of magnetic LED crystal grains, each magnetic LED crystal grain comprises an N pole and an S pole and has a height direction, and the arrangement direction of each N pole and each S pole is approximately perpendicular to the height direction, and is characterized in that the magnetic LED crystal grain transferring method comprises the following steps:

a substrate providing step of providing a substrate comprising a plurality of die arrangement regions;

providing a plurality of magnetic pieces corresponding to the grain setting areas respectively, wherein each magnetic piece is arranged in the substrate or outside the substrate at intervals, each magnetic piece comprises a contraposition N pole and a contraposition S pole, the arrangement direction of each contraposition N pole and each contraposition S pole is approximately parallel to each setting surface, and the contraposition N pole of one magnetic piece corresponds to the contraposition S pole of the other adjacent magnetic piece;

a transfer step, making each N pole and each S pole of each magnetic LED die be respectively attracted by each contraposition S pole and each contraposition N pole so as to transfer each magnetic LED die to each die setting area; and

and a vibration step of vibrating the substrate to turn over at least one magnetic LED die mutually exclusive with the polarity of the magnetic part of at least one die arrangement area so as to realign the at least one magnetic LED die.

8. The method of claim 7, wherein in the step of providing the substrate, the substrate is made of a glass material and comprises:

forming a plurality of through holes on the substrate;

photoresist coating, exposure and etching are carried out on the substrate so as to form a plurality of metal setting areas on the substrate to be respectively communicated with the through holes; and

filling the metal arrangement regions and the through holes with metal materials to form the crystal grain arrangement regions.

9. The method of claim 7, wherein a portion of the led dies emit a first color light, another portion emits a second color light, and another portion emits a third color light, and in the transferring step, a portion of the magnetic members is turned on to generate a magnetic force so that the led dies of the portion emitting the first color light are attracted and aligned; then, keeping one part of the magnetic parts open, and enabling the other part of the magnetic parts to open so as to generate magnetic force to enable the magnetic light-emitting diode crystal grains of the other part emitting second color light to be attracted and aligned; and finally, starting all the magnetic parts, and enabling the magnetic light-emitting diode crystal grains which emit the third color light to be attracted and aligned.

10. The method of claim 7, wherein each die-setting area has a recess structure and has a receiving space, and the substrate is vibrated up and down in the vibrating step to make the at least one magnetic light emitting diode die fall into the receiving space again after being separated from the receiving space.