CN117096072B - Hot press for chip production and working method thereof - Google Patents
Hot press for chip production and working method thereof Download PDFInfo
- Publication number
- CN117096072B CN117096072B CN202311363668.8A CN202311363668A CN117096072B CN 117096072 B CN117096072 B CN 117096072B CN 202311363668 A CN202311363668 A CN 202311363668A CN 117096072 B CN117096072 B CN 117096072B
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- upper die
- inner sleeve
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 94
- 238000001816 cooling Methods 0.000 claims abstract description 53
- 239000000110 cooling liquid Substances 0.000 claims abstract description 21
- 230000001681 protective effect Effects 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000010073 coating (rubber) Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Abstract
The invention relates to the technical field of chip packaging, in particular to a hot press for chip production and a working method thereof. The invention provides a hot press for chip production, wherein an upper die heating plate is arranged above a workbench in a lifting manner, and a positioning cooling piece is vertically fixed on the upper die heating plate; the positioning shaft sleeve is fixed on the workbench and is arranged right below the positioning cooling piece; the adjusting piece is fixed on the workbench, and the movable end of the adjusting piece is suitable for being inserted into the positioning shaft sleeve; when the upper die heating plate moves downwards, the positioning cooling piece is suitable for being inserted into the positioning shaft sleeve; the buffer end at the lower end of the positioning cooling piece is suitable for reducing friction between the positioning cooling piece and the positioning shaft sleeve; after the movable end of the adjusting piece is inserted into the positioning shaft sleeve, the lower end of the positioning cooling piece is suitable for being contracted upwards when the upper die heating plate moves downwards; the cooling liquid in the positioning cooling piece is suitable for cooling the upper die heating plate.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a hot press for chip production and a working method thereof.
Background
In the production process of the chip, the chip and the substrate are bonded through glue, and are heated and cured through a hot press. In order to improve the alignment accuracy of the upper die and the lower die, a positioning guide post is required to be fixed on the upper die heating plate, and a shaft sleeve which is matched with the positioning guide post is arranged on the workbench.
The traditional positioning guide post can not be inserted into the shaft sleeve because of offset, and when the positioning guide post slightly offsets, the end part of the positioning guide post can be worn seriously, so that the positioning accuracy is affected. Meanwhile, after the upper die heating plate heats the upper die, the cooling effect is poor, and the condition of gradually heating up and heating the next die is not facilitated. Therefore, there is a need to develop a hot press for chip production and a working method thereof.
Disclosure of Invention
The invention aims to provide a hot press for chip production and a working method thereof.
In order to solve the above technical problems, the present invention provides a hot press for chip production, including:
the device comprises a workbench, an adjusting piece, a positioning shaft sleeve, an upper die heating plate and a positioning cooling piece, wherein the upper die heating plate is arranged above the workbench in a lifting manner, and the positioning cooling piece is vertically fixed on the upper die heating plate;
the positioning shaft sleeve is fixed on the workbench, and the positioning shaft sleeve is arranged right below the positioning cooling piece;
the adjusting piece is fixed on the workbench, and the movable end of the adjusting piece is suitable for being inserted into the positioning shaft sleeve;
when the upper die heating plate moves downwards, the positioning cooling piece is suitable for being inserted into the positioning shaft sleeve;
the buffer end at the lower end of the positioning cooling piece is suitable for reducing friction between the positioning cooling piece and the positioning shaft sleeve;
after the movable end of the adjusting piece is inserted into the positioning shaft sleeve, the lower end of the positioning cooling piece is suitable for being contracted upwards when the upper die heating plate moves downwards;
the cooling liquid in the positioning cooling piece is suitable for cooling the upper die heating plate.
Preferably, the positioning cooling member includes: the inner sleeve is arranged in the outer sleeve in a sliding manner, and the inner sleeve and the outer sleeve are sealed in a sliding manner;
the outer sleeve is vertically fixed at the lower end of the upper die heating plate;
the inner sleeve is hollow, and is suitable for storing cooling liquid;
the protective sleeve is fixed at the lower end of the inner sleeve, and the protective sleeve is suitable for relieving the external force born by the inner sleeve.
Preferably, a positioning block is fixed at the lower end of the inner sleeve, the positioning block is hollow, and the positioning block is conical.
Preferably, the protective sleeve is hemispherical, and the protective sleeve is made of flexible materials.
Preferably, a positioning groove is formed in the outer wall of the lower end of the inner sleeve, a fixing ring is fixed at the upper end of the protective sleeve, and the fixing ring is suitable for being inserted into the positioning groove.
Preferably, a runner is arranged in the upper die heating plate, the runner is arranged in an S shape, and the runner is communicated with the outer sleeve.
Preferably, the flow passage gradually increases in horizontal height from one end near the outer sleeve to the other end.
Preferably, the positioning sleeve includes: the flange plate is fixed at the lower end of the positioning column and is suitable for fixing the positioning column on the workbench;
the positioning column is hollow, and the inner sleeve is suitable for being inserted into the positioning column;
the radiating fins are arranged at equal intervals around the positioning column.
Preferably, the adjusting member includes: the device comprises an adjusting cylinder, a locating plate and a plurality of limiting strips, wherein the adjusting cylinder is fixed on the workbench, and the locating plate is vertically fixed at the movable end of the adjusting cylinder;
the limiting strips are fixed on the side wall of the locating plate at equal intervals, and one limiting strip corresponds to one locating column.
Preferably, the outer wall of the positioning column is provided with a locking groove, and the limit strip is suitable for being inserted into the locking groove;
the limiting strip is suitable for being inserted into the locking groove to prevent the inner sleeve from being inserted into the positioning column.
Preferably, a supporting frame is fixed on the workbench, a plurality of lifting cylinders are fixed at equal intervals at the lower end of the supporting frame, the upper die heating plate is fixed at the movable end of the lifting cylinder, and the lifting cylinders are suitable for driving the upper die heating plate to vertically move up and down.
On the other hand, the invention also provides a working method of the hot press for chip production, after a workpiece is placed in a lower die on a workbench, the lifting cylinder is suitable for driving the upper die heating plate to vertically move up and down, and the upper die heating plate synchronously drives the positioning cooling piece to move down;
when the protective sleeve at the lower end of the inner sleeve is contacted with the upper end of the positioning column, the protective sleeve is suitable for slowing down friction damage between the inner sleeve and the upper end wall of the positioning column;
after the inner sleeve is inserted into the positioning column, the upper die heating plate is suitable for heating and solidifying the workpiece;
after the workpiece is heated and solidified, the upper die heating plate moves upwards, and the adjusting cylinder drives the limit strips to be inserted into the locking grooves;
the upper die heating plate moves downwards again until the protective sleeve is abutted against the limiting strip, the upper die heating plate continues to move downwards, the inner sleeve gradually contracts upwards, and cooling liquid in the inner sleeve and the outer sleeve is suitable for flowing into the upper die heating plate so as to cool the upper die heating plate;
the upper die heating plate moves upwards until the protective sleeve is separated from the positioning column, and the cooling liquid in the upper die heating plate is suitable for flowing into the inner sleeve and the outer sleeve;
the adjusting cylinder drives the limit bar to move in the direction away from the positioning column, so that the upper die heating plate can heat and solidify the next workpiece.
The hot press for chip production has the beneficial effects that through the arrangement of the positioning cooling piece and the positioning shaft sleeve, the protective sleeve can avoid the abrasion condition caused by direct contact between the inner sleeve and the positioning column, and meanwhile, the cooling liquid can cool the upper die heating plate, so that the cooling efficiency of the upper die heating plate is accelerated.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a perspective view of a preferred embodiment of a hot press for chip production according to the present invention;
FIG. 2 is a perspective view of an upper mold heating plate and a positioning cooling member of the present invention;
FIG. 3 is a longitudinal cross-sectional cutaway perspective view of the positioning cooling member of the present invention;
fig. 4 is a partial enlarged view of a in fig. 3;
FIG. 5 is a perspective view of the positioning sleeve of the present invention;
FIG. 6 is a perspective view of an adjustment member of the present invention;
fig. 7 is an internal perspective view of the upper mold heating plate of the present invention.
In the figure:
1. a work table; 11. a support frame; 12. a lifting cylinder;
2. an adjusting member; 21. adjusting a cylinder; 22. a positioning plate; 23. a limit bar;
3. positioning the shaft sleeve; 31. positioning columns; 32. a flange plate; 33. a heat radiation fin; 34. a locking groove;
4. an upper die heating plate; 40. a flow passage;
5. positioning a cooling piece; 51. an inner sleeve; 52. an outer sleeve; 53. a protective sleeve; 54. a positioning block; 55. and a fixing ring.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In a first embodiment, as shown in fig. 1 to 7, the present invention provides a hot press for chip production, including: the device comprises a workbench 1, an adjusting piece 2, a positioning shaft sleeve 3, an upper die heating plate 4 and a positioning cooling piece 5, wherein the upper die heating plate 4 is arranged above the workbench 1 in a lifting manner, and the positioning cooling piece 5 is vertically fixed on the upper die heating plate 4; the workbench 1 is fixedly provided with a supporting frame 11, a plurality of lifting cylinders 12 are fixed at equal intervals at the lower end of the supporting frame 11, the upper die heating plate 4 is fixed at the movable end of the lifting cylinders 12, and the lifting cylinders 12 are suitable for driving the upper die heating plate 4 to vertically move up and down. Be provided with a plurality of fixed stations on the workstation 1, the last detachable of solidification station is provided with a plurality of fixed lower moulds, last mould hot plate 4 goes up the detachable and is provided with the rubber coating clamp plate, the rubber coating clamp plate with fixed lower mould and work piece size looks adaptation. According to different workpiece sizes, the fixed lower die and the rubber coating pressing plate with different models can be replaced.
The positioning shaft sleeve 3 is fixed on the workbench 1, and the positioning shaft sleeve 3 is arranged right below the positioning cooling piece 5; when the upper mold heating plate 4 moves downwards, the positioning cooling piece 5 is suitable for being driven to synchronously move downwards, the positioning cooling piece 5 is suitable for being inserted into the positioning shaft sleeve 3, and in the process that the lower end of the positioning cooling piece 5 is in contact with the positioning shaft sleeve 3, the protective sleeve 53 and cooling liquid in the inner sleeve 51 play a buffering role, so that the positioning block 54 can be prevented from being directly contacted with the inner wall of the positioning column 31. The adjusting piece 2 is fixed on the workbench 1, and the movable end of the adjusting piece 2 is suitable for being inserted into the positioning shaft sleeve 3; the positioning cooling member 5 is adapted to be inserted into the positioning sleeve 3 to correct the accuracy of the encapsulated pressing plate with respect to the fixed lower die when it moves downward. Wherein, when the upper mould heating plate 4 moves downwards, the positioning cooling piece 5 is suitable for being inserted into the positioning shaft sleeve 3; by whether the positioning cooling member 5 can be inserted into the positioning sleeve 3, it is checked whether the rubber coating press plate corresponds to the fixed lower die. The buffer end at the lower end of the positioning cooling piece 5 is suitable for reducing friction between the positioning cooling piece 5 and the positioning shaft sleeve 3; after the movable end of the adjusting piece 2 is inserted into the positioning shaft sleeve 3, when the upper die heating plate 4 moves downwards, the lower end of the positioning cooling piece 5 is suitable for shrinking upwards; the cooling liquid in the positioning cooling member 5 is adapted to cool the upper mold heating plate 4.
Referring to fig. 2 and 3, the positioning cooling member 5 includes: an inner sleeve 51, an outer sleeve 52 and a protective sleeve 53, the inner sleeve 51 being slidably disposed within the outer sleeve 52, and the inner sleeve 51 being slidably sealed with the outer sleeve 52; the inner sleeve 51 is adapted to slide vertically up and down within the outer sleeve 52. The outer sleeve 52 is vertically fixed at the lower end of the upper die heating plate 4; the inner sleeve 51 is hollow inside, and the inner sleeve 51 is suitable for storing cooling liquid; the protective sleeve 53 is fixed at the lower end of the inner sleeve 51, and the protective sleeve 53 is suitable for relieving the external force applied to the inner sleeve 51. The protective sleeve 53 is adapted to slow down the friction between the inner sleeve 51 and the positioning post 31 when the inner sleeve 51 is in contact with the positioning post 31.
Referring to fig. 4, a positioning block 54 is fixed at the lower end of the inner sleeve 51, the positioning block 54 is hollow, and the positioning block 54 is tapered. The protective sleeve 53 is hemispherical, and the protective sleeve 53 is made of flexible materials. The outer wall of the lower end of the inner sleeve 51 is provided with a positioning groove, a fixing ring 55 is fixed at the upper end of the protecting sleeve 53, and the fixing ring 55 is suitable for being inserted into the positioning groove. The positioning block 54 and the conical arrangement of the outer wall of the positioning block can enable the inner sleeve 51 to be better inserted into the positioning column 31; the positioning block 54 can guide the inner sleeve 51 to be inserted into the positioning column 31 when the inner sleeve 51 moves downwards to slightly deviate; the protective sleeve 53 and the cooling liquid in the inner sleeve 51 are arranged, when the outer wall of the positioning block 54 is abutted against the positioning column 31, the deformation of the protective sleeve 53 and the cooling liquid in the protective sleeve 53 can also play a role in buffering the external force received by the end part of the inner sleeve 51, so that the direct contact between the inner sleeve 51 and the positioning column 31 can be avoided, and the abrasion of the inner sleeve 51 and the positioning column 31 can be avoided.
Referring to fig. 7, a runner 40 is provided in the upper mold heating plate 4, the runner 40 is in an S-shape, and the runner 40 is communicated with the outer sleeve 52. The flow passage 40 increases in level from one end adjacent the outer sleeve 52 to the other. In order to automatically cool the upper mold heating plate 4, the cooling liquid in the inner sleeve 51 is suitable to flow into the upper mold heating plate 4 along the runner 40. When the upper mold heating plate 4 needs to be cooled, the limiting strips 23 are inserted into the locking grooves 34, at the moment, the upper mold heating plate 4 drives the inner sleeve 51 to move downwards, after the inner sleeve 51 is limited by the limiting strips 23, the inner sleeve 51 gradually contracts inwards towards the outer sleeve 52 along with the continuous downwards movement of the upper mold heating plate 4, and cooling liquid in the outer sleeve 52 is suitable for flowing into the upper mold heating plate 4 along the flow passage 40, so that the effect of cooling the upper mold heating plate 4 is realized. And when the upper die heating plate 4 gradually moves upwards and is far away from the positioning column 31, the inner sleeve 51 gradually extends outwards, and the cooling liquid in the runner 40 is suitable for flowing into the inner sleeve 51 and the outer sleeve 52, so that the upper die heating plate 4 can be cooled, and the heating solidification effect of the upper die heating plate 4 on a workpiece can not be influenced.
Referring to fig. 5, the positioning sleeve 3 includes: the positioning column 31, the flange piece 32 and the plurality of radiating fins 33, wherein the flange piece 32 is fixed at the lower end of the positioning column 31, and the flange piece 32 is suitable for fixing the positioning column 31 on the workbench 1; the positioning column 31 is hollow, and the inner sleeve 51 is suitable for being inserted into the positioning column 31; a plurality of the heat dissipation fins 33 are circumferentially arranged around the positioning column 31 at equal intervals. The outer wall of the positioning column 31 is provided with a locking groove 34, and the limit strip 23 is suitable for being inserted into the locking groove 34; wherein the stop bar 23 is adapted to be inserted into the locking groove 34 to prevent the inner sleeve 51 from being inserted into the positioning post 31. The flange 32 is disposed below the table 1, and the upper mold heating plate 4 is inserted into the positioning column 31 from the top down and the inner sleeve 51, which may result in poor fixing stability of the flange 32 and the table 1. The heat dissipation fins 33 are arranged, the heat dissipation fins 33 are suitable for penetrating through the workbench 1, not only can the inner sleeve 51 be cooled, but also the heat dissipation fins 33 improve the stability of fixing between the positioning column 31 and the workbench 1.
When the upper die heating plate 4 moves downwards to heat and solidify the workpiece, the inner sleeve 51 and the outer sleeve 52 are inserted into the positioning column 31, at this time, the fixing column is attached to the outer wall of the outer sleeve 52, and the heat dissipation fins 33 are suitable for accelerating the heat dissipation on the outer sleeve 52, so that the cooling and heat dissipation effects are improved.
Referring to fig. 6, the adjusting member 2 includes: the automatic adjusting device comprises an adjusting cylinder 21, a positioning plate 22 and a plurality of limiting strips 23, wherein the adjusting cylinder 21 is fixed on the workbench 1, and the positioning plate 22 is vertically fixed at the movable end of the adjusting cylinder 21; the plurality of limiting strips 23 are fixed on the side wall of the positioning plate 22 at equal intervals, and one limiting strip 23 corresponds to one positioning column 31. The adjusting cylinder 21 is adapted to drive the limit bar 23 to insert into the locking groove 34, when the inner sleeve 51 moves downward after the limit bar 23 is inserted into the locking groove 34, the inner sleeve 51 cannot be inserted into the positioning column 31, at this time, the inner sleeve 51 can only shrink inwards towards the outer sleeve 52, and the cooling liquid in the inner sleeve 51 is adapted to flow into the flow channel 40. And when the inner sleeve 51 moves downward after the stop bar 23 is far away from the positioning post 31, the outer sleeve 52 and the inner sleeve 51 are adapted to be inserted into the positioning post 31.
An embodiment two, the present embodiment also provides a working method of a hot press for producing a chip on the basis of the embodiment one, which includes the hot press for producing a chip according to the embodiment one, and the specific structure is the same as that of the embodiment one, and the working method of the hot press for producing a chip is not described here again, and is as follows:
after the workpiece is placed in the lower die on the workbench 1, the lifting cylinder 12 is suitable for driving the upper die heating plate 4 to vertically move up and down, and the upper die heating plate 4 synchronously drives the positioning cooling piece 5 to move down; the protective sleeve 53 at the lower end of the inner sleeve 51 is adapted to slow down frictional damage between the inner sleeve 51 and the upper end wall of the positioning column 31 when the protective sleeve 53 contacts the upper end of the positioning column 31; after the inner sleeve 51 is inserted into the positioning column 31, the upper mold heating plate 4 is suitable for heating and solidifying the workpiece; after the workpiece is heated and solidified, the upper die heating plate 4 moves upwards, and the adjusting cylinder 21 drives the limit bar 23 to be inserted into the locking groove 34; the upper die heating plate 4 moves downwards again until the protective sleeve 53 is abutted against the limiting strip 23, the upper die heating plate 4 continues to move downwards, the inner sleeve 51 gradually contracts upwards, and cooling liquid in the inner sleeve 51 and the outer sleeve 52 is suitable for flowing into the upper die heating plate 4 so as to cool the upper die heating plate 4; the upper mold heating plate 4 moves upwards until the protective sleeve 53 is disengaged from the positioning column 31, and the cooling liquid in the upper mold heating plate 4 is suitable for flowing into the inner sleeve 51 and the outer sleeve 52; the adjusting cylinder 21 drives the limit bar 23 to move away from the positioning column 31, so that the upper die heating plate 4 can heat and solidify the next workpiece.
The components (components not illustrating specific structures) selected in the application are all common standard components or components known to those skilled in the art, and the structures and principles of the components are all known to those skilled in the art through technical manuals or through routine experimental methods. Moreover, the software programs referred to in the present application are all prior art, and the present application does not relate to any improvement of the software programs.
In the description of embodiments of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (9)
1. A hot press for chip production, comprising:
the device comprises a workbench (1), an adjusting piece (2), a positioning shaft sleeve (3), an upper die heating plate (4) and a positioning cooling piece (5), wherein the upper die heating plate (4) is arranged above the workbench (1) in a lifting manner, and the positioning cooling piece (5) is vertically fixed on the upper die heating plate (4);
the positioning shaft sleeve (3) is fixed on the workbench (1), and the positioning shaft sleeve (3) is arranged right below the positioning cooling piece (5);
the adjusting piece (2) is fixed on the workbench (1), and the movable end of the adjusting piece (2) is suitable for being inserted into the positioning shaft sleeve (3);
wherein, when the upper mould heating plate (4) moves downwards, the positioning cooling piece (5) is suitable for being inserted into the positioning shaft sleeve (3);
the buffer end at the lower end of the positioning cooling piece (5) is suitable for reducing friction between the positioning cooling piece (5) and the positioning shaft sleeve (3);
after the movable end of the adjusting piece (2) is inserted into the positioning shaft sleeve (3), when the upper die heating plate (4) moves downwards, the lower end of the positioning cooling piece (5) is suitable for shrinking upwards;
the cooling liquid in the positioning cooling piece (5) is suitable for cooling the upper die heating plate (4);
the positioning cooling piece (5) comprises: an inner sleeve (51), an outer sleeve (52) and a protective sleeve (53), wherein the inner sleeve (51) is arranged in the outer sleeve (52) in a sliding way, and the inner sleeve (51) and the outer sleeve (52) are sealed in a sliding way;
the outer sleeve (52) is vertically fixed at the lower end of the upper die heating plate (4);
-said inner sleeve (51) being hollow inside, said inner sleeve (51) being adapted to store a cooling liquid therein;
the protective sleeve (53) is fixed at the lower end of the inner sleeve (51), and the protective sleeve (53) is suitable for relieving the external force applied to the inner sleeve (51);
a runner (40) is arranged in the upper die heating plate (4), the runner (40) is arranged in an S shape, and the runner (40) is communicated with the outer sleeve (52);
the flow passage (40) increases in level from one end near the outer sleeve (52) to the other.
2. A hot press for chip production as claimed in claim 1, wherein:
a positioning block (54) is fixed at the lower end of the inner sleeve (51), the positioning block (54) is hollow, and the positioning block (54) is conical.
3. A hot press for chip production as claimed in claim 2, wherein:
the protective sleeve (53) is hemispherical, and the protective sleeve (53) is made of flexible materials.
4. A hot press for chip production as claimed in claim 3, wherein:
the outer wall of the lower end of the inner sleeve (51) is provided with a positioning groove, the upper end of the protective sleeve (53) is fixedly provided with a fixing ring (55), and the fixing ring (55) is suitable for being inserted into the positioning groove.
5. The die attach thermocompressor of claim 4, wherein:
the positioning sleeve (3) comprises: the positioning device comprises a positioning column (31), a flange plate (32) and a plurality of radiating fins (33), wherein the flange plate (32) is fixed at the lower end of the positioning column (31), and the flange plate (32) is suitable for fixing the positioning column (31) on the workbench (1);
the positioning column (31) is hollow, and the inner sleeve (51) is suitable for being inserted into the positioning column (31);
the plurality of radiating fins (33) are arranged circumferentially around the positioning column (31) at equal intervals.
6. The die attach thermocompressor of claim 5, wherein:
the adjusting member (2) includes: the automatic feeding device comprises an adjusting cylinder (21), a positioning plate (22) and a plurality of limiting strips (23), wherein the adjusting cylinder (21) is fixed on the workbench (1), and the positioning plate (22) is vertically fixed at the movable end of the adjusting cylinder (21);
the limiting strips (23) are fixed on the side wall of the locating plate (22) at equal intervals, and one limiting strip (23) corresponds to one locating column (31).
7. The die attach thermocompressor of claim 6, wherein:
the outer wall of the positioning column (31) is provided with a locking groove (34), and the limiting strip (23) is suitable for being inserted into the locking groove (34);
wherein the limit bar (23) is suitable for being inserted into the locking groove (34) so as to prevent the inner sleeve (51) from being inserted into the positioning column (31).
8. The die attach thermocompressor of claim 7, wherein:
the automatic die lifting device is characterized in that a supporting frame (11) is fixed on the workbench (1), a plurality of lifting cylinders (12) are fixed at equal intervals at the lower end of the supporting frame (11), the upper die heating plate (4) is fixed at the movable end of the lifting cylinders (12), and the lifting cylinders (12) are suitable for driving the upper die heating plate (4) to vertically move up and down.
9. A method for operating a hot press for chip production, characterized in that a hot press for chip production according to claim 8 is used,
after a workpiece is placed in a lower die on a workbench (1), the lifting cylinder (12) is suitable for driving the upper die heating plate (4) to vertically move up and down, and the upper die heating plate (4) synchronously drives the positioning cooling piece (5) to move down;
when the protective sleeve (53) at the lower end of the inner sleeve (51) is in contact with the upper end of the positioning column (31), the protective sleeve (53) is suitable for slowing down friction damage between the inner sleeve (51) and the upper end wall of the positioning column (31);
after the inner sleeve (51) is inserted into the positioning column (31), the upper die heating plate (4) is suitable for heating and solidifying a workpiece;
after the workpiece is heated and solidified, the upper die heating plate (4) moves upwards, and the adjusting cylinder (21) drives the limit strips (23) to be inserted into the locking grooves (34);
the upper die heating plate (4) moves downwards again until the protective sleeve (53) is abutted against the limiting strip (23), the upper die heating plate (4) continues to move downwards, the inner sleeve (51) gradually contracts upwards, and cooling liquid in the inner sleeve (51) and the outer sleeve (52) is suitable for flowing into the upper die heating plate (4) so as to cool the upper die heating plate (4);
the upper mould heating plate (4) moves upwards until the protective sleeve (53) is separated from the positioning column (31), and the cooling liquid in the upper mould heating plate (4) is suitable for flowing into the inner sleeve (51) and the outer sleeve (52);
the adjusting cylinder (21) drives the limit bar (23) to move in a direction away from the positioning column (31) so that the upper die heating plate (4) can heat and solidify the next workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202311363668.8A CN117096072B (en) | 2023-10-20 | 2023-10-20 | Hot press for chip production and working method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311363668.8A CN117096072B (en) | 2023-10-20 | 2023-10-20 | Hot press for chip production and working method thereof |
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| Publication Number | Publication Date |
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| CN117096072A CN117096072A (en) | 2023-11-21 |
| CN117096072B true CN117096072B (en) | 2024-02-02 |
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| JP2007220769A (en) * | 2006-02-15 | 2007-08-30 | Matsushita Electric Ind Co Ltd | Thermocompression bonding device of semiconductor component |
| CN103747634A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB thermal insulation stroke-limiting hot-pressing clamping jig |
| CN204859786U (en) * | 2015-08-03 | 2015-12-09 | 刘文生 | Tight tool is pressed from both sides in hot pressing of PCB board water -cooling location restricted driving journey |
| CN205071497U (en) * | 2015-08-14 | 2016-03-02 | 周卫荣 | Water -cooling PCB board hot pressing tool with fixed buffer function |
| CN111599733A (en) * | 2020-06-30 | 2020-08-28 | 安徽三优光电科技有限公司 | Crystal expanding machine capable of accurately controlling expansion degree and working method thereof |
| CN212436043U (en) * | 2020-06-22 | 2021-01-29 | 廊坊华文机电设备有限公司 | PCB positioning hot-pressing jig |
| CN113363219A (en) * | 2021-05-11 | 2021-09-07 | 苏州通富超威半导体有限公司 | BGA product, hot-pressing equipment and hot-pressing process |
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2023
- 2023-10-20 CN CN202311363668.8A patent/CN117096072B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007220769A (en) * | 2006-02-15 | 2007-08-30 | Matsushita Electric Ind Co Ltd | Thermocompression bonding device of semiconductor component |
| CN103747634A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB thermal insulation stroke-limiting hot-pressing clamping jig |
| CN204859786U (en) * | 2015-08-03 | 2015-12-09 | 刘文生 | Tight tool is pressed from both sides in hot pressing of PCB board water -cooling location restricted driving journey |
| CN205071497U (en) * | 2015-08-14 | 2016-03-02 | 周卫荣 | Water -cooling PCB board hot pressing tool with fixed buffer function |
| CN212436043U (en) * | 2020-06-22 | 2021-01-29 | 廊坊华文机电设备有限公司 | PCB positioning hot-pressing jig |
| CN111599733A (en) * | 2020-06-30 | 2020-08-28 | 安徽三优光电科技有限公司 | Crystal expanding machine capable of accurately controlling expansion degree and working method thereof |
| CN113363219A (en) * | 2021-05-11 | 2021-09-07 | 苏州通富超威半导体有限公司 | BGA product, hot-pressing equipment and hot-pressing process |
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|---|---|
| CN117096072A (en) | 2023-11-21 |
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