CN117086505A - Diamond brazing filler metal and preparation method and application thereof - Google Patents
Diamond brazing filler metal and preparation method and application thereof Download PDFInfo
- Publication number
- CN117086505A CN117086505A CN202311163362.8A CN202311163362A CN117086505A CN 117086505 A CN117086505 A CN 117086505A CN 202311163362 A CN202311163362 A CN 202311163362A CN 117086505 A CN117086505 A CN 117086505A
- Authority
- CN
- China
- Prior art keywords
- diamond
- alloy
- braze
- brazing
- filler metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 115
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 111
- 238000005219 brazing Methods 0.000 title claims abstract description 58
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 38
- 239000002184 metal Substances 0.000 title claims abstract description 38
- 239000000945 filler Substances 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title abstract description 20
- 238000006263 metalation reaction Methods 0.000 title description 2
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 58
- 239000000956 alloy Substances 0.000 claims abstract description 58
- 238000002844 melting Methods 0.000 claims abstract description 25
- 230000008018 melting Effects 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 6
- 230000006698 induction Effects 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 229910016347 CuSn Inorganic materials 0.000 claims description 3
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 abstract description 9
- 238000005087 graphitization Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 20
- 239000002131 composite material Substances 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000005266 casting Methods 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000011049 filling Methods 0.000 description 5
- 238000003723 Smelting Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 230000004580 weight loss Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001027 hydrothermal synthesis Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention relates to a diamond brazing filler metal, a preparation method and application thereof, wherein the diamond brazing filler metal comprises the following components in parts by mass: 65-90 parts of CuSnAlBi alloy and 5-30 parts of diamond; the CuSnAlBi alloy consists of the following components in percentage by mass: 8-12% of Sn, 10-15% of Al, 15-20% of Bi and the balance of Cu; the diamond comprises a (111) surface and a (100) surface, and the diamond brazing filler metal is formed by compounding the alloy and the diamond under low-temperature melting, so that the technical problems of difficult use of an organic binder, difficult coating, easy graphitization and peeling of the diamond and the like can be effectively solved, and the technical effects of environmental friendliness, easy industrialization, lower cost, excellent workpiece performance after diamond brazing coating and the like are realized.
Description
Technical Field
The invention relates to the technical fields of brazing materials, material forming and application, in particular to a diamond brazing filler metal and a preparation method and application thereof.
Background
Diamond brazing is an important material surface modification mode, and the existing diamond brazing is mainly prepared into paste after brazing alloy and diamond are mixed, and then the paste is brazed on a workpiece. However, on the one hand, the mode needs to use the binder, and the binder is usually an organic binder, so that the environment is polluted, the brazing compactness is reduced, on the other hand, the paste is complex in operation in the coating process, industrialization is difficult to realize, even coating is difficult to realize during coating, and the problems of inconsistent thickness and the like can exist.
Meanwhile, the difficulty of diamond infiltration by metal is a problem which has been difficult to solve. In the prior art, diamond is subjected to surface roughening, metal is doped in the diamond preparation process to improve the interface performance between the diamond and the metal, but diamond with smaller granularity is often required to be used in the brazing process, so that the surface roughening difficulty is high, the overall rigidity of the diamond is easily affected after the diamond surface roughening, and meanwhile, the cost for preparing the metal doped modified diamond is high.
In addition, diamond is easy to graphitize at high temperature, and the strength of the diamond is reduced, so that the performance of the workpiece after brazing is poor.
The prior art limits the development of diamond brazing technology.
Disclosure of Invention
Aiming at the prior art, the invention provides a diamond brazing filler metal and a preparation method and application thereof, which solve the problems that the paste diamond brazing filler metal in the prior art needs to use an organic binder and is difficult to realize uniform coating in an industrialized manner, further solve the problem of low interface strength between diamond and a brazing alloy in the prior art, further solve the problem of easy graphitization of the diamond at high temperature in the prior art, and realize the technical effects of environmental friendliness, easy industrialization, lower cost, excellent workpiece performance after diamond brazing and the like.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the diamond brazing filler metal comprises the following components in parts by mass: 65-90 parts of CuSnAlBi alloy and 5-30 parts of diamond; the CuSnAlBi alloy consists of the following components in percentage by mass: 8-12% of Sn, 10-15% of Al, 15-20% of Bi and the balance of Cu; the diamond includes a (111) face and a (100) face.
Since in a general diamond artificial synthesis process, a hexahedral body, i.e., a diamond commercially available conventionally, mainly includes a (111) face and a (100) face, tends to be synthesized. Meanwhile, the CuSn alloy is a common braze alloy with excellent performance, and the melting point of the braze alloy is reduced by adding the Al and the Bi with specific components, so that the diamond and the braze alloy can form a composite material at a lower temperature, and meanwhile, the (100) surface of the Al and the diamond forms a specific proper amount of Al 4 C 3 Bi can then form a lower wetting angle with the (111) face of the diamond, thereby increasing the interfacial bond strength between the diamond and the braze alloy.
Further, the diamond comprises a hexahedral shape.
Hexahedral shapes are a relatively common class of synthetic diamond that includes (111) faces and (100) faces, at low cost.
The invention is not limited to hexahedral shapes and is applicable to other diamonds having both (111) and (100) faces and/or both (111) and (100) faces.
Further, the granularity of the diamond is 50-300 meshes.
Further, the diamond brazing filler metal is in a wire shape, a rod shape, a sheet shape or a foil shape.
The diamond brazing filler metal provided by the invention directly takes the filiform, rod-like, sheet-like or foil-like shape as the forming brazing filler metal, is convenient to store and take, does not need to additionally add adhesive, does not need to carry out operations such as coating, can be directly placed at the corresponding position of a substrate to be brazed, and is convenient to realize industrialization.
Further, the invention also provides a preparation method of the diamond brazing filler metal, which comprises the following steps:
1) Heating the CuSnAlBi alloy to 400-450 ℃ for melting;
2) Adding the diamond, and stirring for 10-20min;
3) And cooling to obtain the diamond brazing filler metal.
The invention can mix and react the CuSnAlBi alloy and the diamond at a lower temperature of 400-450 ℃ to obtain the diamond brazing filler metal with higher interface bonding strength while preventing the diamond from graphitization.
Further, in the step 2), the mixture is stirred and poured into a mold corresponding to a thread shape, a rod shape, a sheet shape or a foil shape for cooling.
Further, in step 1), the cusnlbi alloy is prepared by mixing Cu, sn, al, bi metal in a molten state.
Further, in the step 1), the cusnal bi alloy is prepared by mixing CuSn master alloy, cuAl master alloy and cusi master alloy under melting.
The present invention is not limited to the preparation of the cusnal ali alloy using only the above intermediate alloy, but may be prepared by mixing cusnal ali intermediate alloy, al metal in a melt, or other intermediate alloy and/or metal capable of obtaining the cusnal ali alloy in a melt.
The invention is not limited to preparing the CuSnAlBi alloy by adopting a physical mode of melting down mixing, and the CuSnAlBi alloy can be prepared by chemical methods such as a sol-gel method, a hydrothermal method and the like.
Further, the invention also provides an application of the diamond brazing filler metal in brazing, which comprises the following steps: and attaching the diamond brazing filler metal to the corresponding position of the matrix to be brazed, and heating to 400-450 ℃ to perform brazing.
The invention can be carried out at a lower temperature of 400-450 ℃ in the process of brazing, thereby not only preventing diamond graphitization in the process of brazing, but also protecting the brazing matrix from high-temperature deformation, and being applicable to more types of brazing matrixes.
Further, the brazing is induction brazing.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
1. the invention reasonably utilizes relatively cheap diamond, obtains diamond brazing filler metal with higher interface bonding strength at lower temperature, and has lower cost;
2. the invention reduces the melting point of the brazing alloy by the design and configuration of the CuSnAlBi alloy, is favorable for preventing the diamond from graphitizing in the brazing alloy preparation and brazing process, and simultaneously, the CuSnAlBi alloy with specific composition can well infiltrate the diamond without generating excessive Al 4 C 3 Affecting the performance of the diamond;
3. according to the invention, the CuSnAlBi alloy and the diamond are formed into the diamond brazing filler metal in advance, so that the use of binders, especially organic binders, in the conventional paste brazing filler metal is avoided, and the method is environment-friendly, convenient to operate and easy to industrialize;
4. the invention can adopt a conventional induction brazing mode to realize diamond brazing of various brazing substrates at a lower temperature, and the brazed workpiece has excellent performance and diamond is not easy to peel off.
Drawings
FIG. 1 is a graph showing the comparison of the diamond peeling rates of the inventive example 1 and the comparative examples 1 to 4;
fig. 2 is a graph of the weight loss of the diamonds according to example 1 of the present invention and comparative examples 1 to 4.
Detailed Description
The principles and features of the present invention are described below in connection with the following examples, which are set forth to illustrate, but are not to be construed as limiting the scope of the invention. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
Example 1:
preparation of CuSn10Al13Bi18 alloy: metal Cu, sn, al, bi with purity of 99.99wt.% is prepared according to mass ratioRespectively adding into vacuum smelting furnace, and vacuumizing to 1×10 -1 Pa, charging nitrogen, heating to 1200 ℃ for melting, and carrying out vacuum casting after electromagnetic stirring.
Preparation of CuSn10Al13Bi18 alloy-diamond composite solder: preparing the CuSn10Al13Bi18 alloy and a 100-mesh hexaoctahedral diamond polymer according to a mass ratio of 85:25, adding the CuSn10Al13Bi18 alloy into a vacuum melting furnace, and vacuumizing to 1X 10 -1 Pa, filling nitrogen, heating to 420 ℃ for melting, adding the diamond, electromagnetically stirring for 15min, and casting into a die to prepare the sheet CuSn10Al13Bi18 alloy-diamond composite solder with the thickness of 0.2 mm.
Comparative example 1:
preparation of CuSn10Al31 alloy: adding metals Cu, sn and Al with the purity of 99.99wt.% into a vacuum smelting furnace respectively according to the mass ratio, and vacuumizing to 1X 10 -1 Pa, charging nitrogen, heating to 1200 ℃ for melting, and carrying out vacuum casting after electromagnetic stirring.
Preparation of CuSn10Al31 alloy-diamond composite solder: preparing the CuSn10Al31 alloy and the hexaoctahedral polymorphous diamond with the granularity of 100 meshes according to the mass ratio of 85:25, firstly adding the CuSn10Al31 alloy into a vacuum melting furnace, and vacuumizing to 1 multiplied by 10 -1 Pa, filling nitrogen, heating to 420 ℃ for melting, adding the diamond, electromagnetically stirring for 15min, and casting into a die to prepare the sheet CuSn10Al31 alloy-diamond composite solder with the thickness of 0.2 mm.
Comparative example 2:
preparation of CuSn10Bi31 alloy: adding metals Cu, sn and Bi with the purity of 99.99wt.% into a vacuum smelting furnace respectively according to the mass ratio, and vacuumizing to 1 multiplied by 10 -1 Pa, charging nitrogen, heating to 1200 ℃ for melting, and carrying out vacuum casting after electromagnetic stirring.
Preparation of CuSn10Bi31 alloy-diamond composite solder: preparing the CuSn10Bi31 alloy and the hexaoctahedral polymorphous diamond with the granularity of 100 meshes according to the mass ratio of 85:25, firstly adding the CuSn10Bi31 alloy into a vacuum melting furnace, and vacuumizing to 1 multiplied by 10 -1 Pa, after filling nitrogen, heatMelting at 420 ℃, adding the diamond, electromagnetically stirring for 15min, and casting in a mould to prepare the sheet CuSn10Bi31 alloy-diamond composite solder with the thickness of 0.2 mm.
Comparative example 3:
preparation of CuSn10Al21Bi10 alloy: adding 99.99wt.% metal Cu, sn, al, bi into vacuum melting furnace, and vacuumizing to 1×10 -1 Pa, charging nitrogen, heating to 1200 ℃ for melting, and carrying out vacuum casting after electromagnetic stirring.
Preparation of CuSn10Al21Bi10 alloy-diamond composite solder: preparing the CuSn10Al21Bi10 alloy and a 100-mesh hexaoctahedral diamond polymer according to a mass ratio of 85:25, adding the CuSn10Al21Bi10 alloy into a vacuum melting furnace, and vacuumizing to 1X 10 -1 Pa, filling nitrogen, heating to 420 ℃ for melting, adding the diamond, electromagnetically stirring for 15min, and casting into a die to prepare the sheet CuSn10Al21Bi10 alloy-diamond composite solder with the thickness of 0.2 mm.
Comparative example 4:
preparation of CuSn10Al8Bi23 alloy: adding 99.99wt.% metal Cu, sn, al, bi into vacuum melting furnace, and vacuumizing to 1×10 -1 Pa, charging nitrogen, heating to 1200 ℃ for melting, and carrying out vacuum casting after electromagnetic stirring.
Preparation of CuSn10Al8Bi23 alloy-diamond composite solder: preparing the CuSn10Al8Bi23 alloy and the hexagonal-octahedral diamond with the granularity of 100 meshes according to the mass ratio of 85:25, adding the CuSn10Al8Bi23 alloy into a vacuum melting furnace, and vacuumizing to 1 multiplied by 10 -1 Pa, filling nitrogen, heating to 420 ℃ for melting, adding the diamond, electromagnetically stirring for 15min, and casting into a die to prepare the sheet CuSn10Al8Bi23 alloy-diamond composite solder with the thickness of 0.2 mm.
And (3) testing:
the composite solders of example 1 and comparative examples 1 to 4 were induction soldered to Q235 steel at 420 ℃. The wear test is carried out by adopting an MML-1G abrasive wear testing machine, the test method is carried out according to the regulation of JB/T7705-1995, the test load is 30N, the rotating speed of the rubber wheel is 200r/min, the abrasive adopts corundum sand with the average particle size of 60 meshes, the wear time is 30min, and the wear weight loss of the sample is calculated through mass loss, so that the results are shown in figures 1 and 2. The diamond peeling rate was obtained by observing the ratio of the number of peeled diamonds after abrasion test to the number of untrimmed diamonds in the test area under a microscope, and the diamond weight loss was obtained by weighing the weight difference of the whole specimens before and after abrasion test.
As can be seen from fig. 1 and 2, the addition of Al and Bi in a suitable ratio can enhance the bonding strength between the alloy and diamond, reduce graphitization of diamond, further reduce the peeling rate of diamond, and improve the wear resistance of the diamond solder coating.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
1. the invention reasonably utilizes relatively cheap diamond, obtains diamond brazing filler metal with higher interface bonding strength at lower temperature, and has lower cost;
2. the invention reduces the melting point of the brazing alloy by the design and configuration of the CuSnAlBi alloy, is favorable for preventing the diamond from graphitizing in the brazing alloy preparation and brazing process, and simultaneously, the CuSnAlBi alloy with specific composition can well infiltrate the diamond without generating excessive Al 4 C 3 Affecting the performance of the diamond;
3. according to the invention, the CuSnAlBi alloy and the diamond are formed into the diamond brazing filler metal in advance, so that the use of binders, especially organic binders, in the conventional paste brazing filler metal is avoided, and the method is environment-friendly, convenient to operate and easy to industrialize;
4. the invention can adopt a conventional induction brazing mode to realize diamond brazing of various brazing substrates at a lower temperature, and the brazed workpiece has excellent performance and diamond is not easy to peel off.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. The diamond brazing filler metal is characterized by comprising the following components in parts by weight: 65-90 parts of CuSnAlBi alloy and 5-30 parts of diamond; the CuSnAlBi alloy consists of the following components in percentage by mass: 8-12% of Sn, 10-15% of Al, 15-20% of Bi and the balance of Cu; the diamond includes a (111) face and a (100) face.
2. The diamond braze of claim 1, wherein the diamond comprises a hexahedral shape.
3. The diamond braze of claim 1, wherein the diamond has a particle size of 50-300 mesh.
4. The diamond braze according to claim 1, wherein the diamond braze is in the form of a wire, rod, sheet or foil.
5. A method of producing a diamond braze according to any one of claims 1 to 4, comprising the steps of:
1) Heating the CuSnAlBi alloy to 400-450 ℃ for melting;
2) Adding the diamond, and stirring for 10-20min;
3) And cooling to obtain the diamond brazing filler metal.
6. The method according to claim 5, wherein in step 2), the mixture is stirred and poured into a mold corresponding to a filament, rod, sheet or foil shape for cooling.
7. The method of claim 5, wherein in step 1), the cusnlbi alloy is prepared by mixing Cu, sn, al, bi metal in a molten state.
8. The method according to claim 5, wherein in step 1), the cusnal bi alloy is prepared by mixing CuSn master alloy, cuAl master alloy, and cusi master alloy under melting.
9. Use of a diamond braze according to any of claims 1-4 in braze coating, wherein the braze is applied to a substrate to be braze coated in a corresponding position, heated to 400-450 ℃.
10. The use according to claim 9, wherein the brazing is induction brazing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311163362.8A CN117086505B (en) | 2023-09-11 | 2023-09-11 | Diamond brazing filler metal and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311163362.8A CN117086505B (en) | 2023-09-11 | 2023-09-11 | Diamond brazing filler metal and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117086505A true CN117086505A (en) | 2023-11-21 |
| CN117086505B CN117086505B (en) | 2024-02-13 |
Family
ID=88780333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311163362.8A Active CN117086505B (en) | 2023-09-11 | 2023-09-11 | Diamond brazing filler metal and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117086505B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103347629A (en) * | 2010-11-17 | 2013-10-09 | 费德罗-莫格尔公司 | Wear resistant lead free alloy sliding element and method of making |
| WO2016116536A1 (en) * | 2015-01-22 | 2016-07-28 | Umicore Ag & Co. Kg | Brazing alloy |
| CN110303269A (en) * | 2019-07-02 | 2019-10-08 | 华侨大学 | For the Sn-Cu-Ti solder of low temperature brazing diamond and application |
| CN110508804A (en) * | 2019-09-27 | 2019-11-29 | 郑州机械研究所有限公司 | A kind of pricker applies cream and its preparation method and application |
| CN111001962A (en) * | 2019-12-12 | 2020-04-14 | 郑州机械研究所有限公司 | Brazing coating material and preparation method and application thereof |
| CN111299905A (en) * | 2020-03-20 | 2020-06-19 | 安徽工业大学 | Composite brazing filler metal containing WC and ZrC simultaneously, preparation method thereof and brazing method |
-
2023
- 2023-09-11 CN CN202311163362.8A patent/CN117086505B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103347629A (en) * | 2010-11-17 | 2013-10-09 | 费德罗-莫格尔公司 | Wear resistant lead free alloy sliding element and method of making |
| WO2016116536A1 (en) * | 2015-01-22 | 2016-07-28 | Umicore Ag & Co. Kg | Brazing alloy |
| CN110303269A (en) * | 2019-07-02 | 2019-10-08 | 华侨大学 | For the Sn-Cu-Ti solder of low temperature brazing diamond and application |
| CN110508804A (en) * | 2019-09-27 | 2019-11-29 | 郑州机械研究所有限公司 | A kind of pricker applies cream and its preparation method and application |
| CN111001962A (en) * | 2019-12-12 | 2020-04-14 | 郑州机械研究所有限公司 | Brazing coating material and preparation method and application thereof |
| CN111299905A (en) * | 2020-03-20 | 2020-06-19 | 安徽工业大学 | Composite brazing filler metal containing WC and ZrC simultaneously, preparation method thereof and brazing method |
Non-Patent Citations (1)
| Title |
|---|
| 龙伟民: "金刚石工具钎焊用连接材料研究进展", 材料导报, no. 23, pages 23138 - 23144 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117086505B (en) | 2024-02-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109877413B (en) | Brazing material for SiC ceramic brazing and brazing method | |
| CN101544851B (en) | Metallic bond hollow sphere-shaped super-hard compound material and manufacturing method thereof | |
| CN104668553B (en) | A kind of alloyed powder printing metal parts for direct 3D and preparation method thereof | |
| CN106636989A (en) | Preparation method of high-strength and high-thermal-conductivity graphite-copper composite material | |
| CN109534834A (en) | One kind can ceramic phenolic resin and its preparation method and application | |
| CN112935249B (en) | Efficient preparation method of diamond/metal-based composite material | |
| WO2021035775A1 (en) | Method for preparing aluminum-based composite material | |
| JP2000203973A (en) | Carbon-base metal composite material and its production | |
| CN111690840B (en) | Amorphous phase silicate particle and SiC particle reinforced aluminum matrix composite material and preparation | |
| CN102108458A (en) | Diamond/copper high-thermal conductivity composite material and preparation method thereof | |
| CN117086505B (en) | Diamond brazing filler metal and preparation method and application thereof | |
| CN109778018B (en) | Preparation method of aluminum silicon carbide material and prepared aluminum silicon carbide material | |
| CN109136611B (en) | Metal-based composite material and preparation method and application thereof | |
| CN112829079B (en) | High-sharpness low-cost rhinestone bit and preparation method thereof | |
| CN103981398A (en) | High-performance metal ceramic cladding material and preparation method thereof | |
| CN109290697B (en) | Active brazing filler metal for brazing C/C composite material and preparation method and application thereof | |
| CN110724376B (en) | Efficient high-strength heat conducting fin and preparation method thereof | |
| CN1060533C (en) | Method for prepn. ceramic crystal whisker strengthened metallic compound-base composite material | |
| JP4233133B2 (en) | Silicon carbide composite and heat dissipation component using the same | |
| CN115178912B (en) | Ti-containing alloy 3 AlC 2 Copper-based active composite solder, preparation method and brazing method thereof | |
| CN113385851B (en) | High-temperature-resistant corrosion-resistant solder for silicon carbide ceramic connection and preparation method and application thereof | |
| JPH0226880A (en) | Method for brazing graphite to metal | |
| CN116967568B (en) | Repair process for nickel-based alloy casting surface defects | |
| CN115401357B (en) | Composite solder alloy containing in-situ synthesized nano reinforcing phase and preparation method thereof | |
| CN116117379B (en) | Particle self-reinforced high-entropy amorphous alloy solder for soldering titanium, titanium alloy and stainless steel and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |