CN117075255A - Optical packaging method of optical fiber array and optical packaging structure of optical fiber array chip - Google Patents
Optical packaging method of optical fiber array and optical packaging structure of optical fiber array chip Download PDFInfo
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- CN117075255A CN117075255A CN202310001388.6A CN202310001388A CN117075255A CN 117075255 A CN117075255 A CN 117075255A CN 202310001388 A CN202310001388 A CN 202310001388A CN 117075255 A CN117075255 A CN 117075255A
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- optical fiber
- fiber array
- chip
- light source
- optical
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 222
- 230000003287 optical effect Effects 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 239000000835 fiber Substances 0.000 claims abstract description 111
- 230000008878 coupling Effects 0.000 claims abstract description 96
- 238000010168 coupling process Methods 0.000 claims abstract description 96
- 238000005859 coupling reaction Methods 0.000 claims abstract description 96
- 239000003292 glue Substances 0.000 claims abstract description 59
- 230000037361 pathway Effects 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 16
- 239000002210 silicon-based material Substances 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12147—Coupler
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The application relates to an optical packaging method of an optical fiber array and an optical packaging structure of an optical fiber array chip. The optical packaging method of the optical fiber array comprises the following steps: providing an optical fiber array, an ultraviolet light source and a chip, wherein the optical fiber array comprises at least two optical fiber channels; connecting the ultraviolet light source to at least a portion of the fiber optic pathway; coupling the optical fiber array with the chip, and arranging ultraviolet glue at the coupling part of the optical fiber array and the chip, wherein the ultraviolet glue is configured to be cured after being irradiated by ultraviolet light; and starting the ultraviolet light source to solidify the ultraviolet glue.
Description
Technical Field
The present application relates to the field of optical packaging technology, and in particular, to an optical packaging method for an optical fiber array and an optical packaging structure for an optical fiber array chip.
Background
In the technology related to silicon photonics, complex photonic switching circuits can be integrated on a single substrate, providing compact and low cost optical path connections to meet the continuing growth in switching capacity demands of telecommunications, data centers, and high performance computing markets. This also places more stringent requirements on the packaging of silicon optical chips, i.e., on the attachment of the fiber array to the chip.
However, the novel optical fiber array has a problem that it cannot be optically packaged using the conventional method.
Disclosure of Invention
The application provides an optical packaging method of an optical fiber array and an optical packaging structure of an optical fiber array chip, which are used for solving all or part of the defects in the related art.
According to a first aspect of an embodiment of the present application, there is provided an optical packaging method of an optical fiber array, including: providing an optical fiber array, an ultraviolet light source and a chip, wherein the optical fiber array comprises at least two optical fiber channels;
connecting the ultraviolet light source to at least a portion of the fiber optic pathway;
coupling the optical fiber array with the chip, and arranging ultraviolet glue at the coupling part of the optical fiber array and the chip, wherein the ultraviolet glue is configured to be cured after being irradiated by ultraviolet light;
and starting the ultraviolet light source to solidify the ultraviolet glue.
In some embodiments, coupling the fiber array with the chip includes:
at least a portion of the fibre channel is aligned for optical coupling with the chip.
In some embodiments, the chip includes a grating coupler located on a side of the chip facing the fiber array; optically coupling at least a portion of the fiber optic channel with the chip, comprising:
forming a datum line along a side edge of the chip, and aligning the side of the optical fiber array with the datum line; connecting a debugging light source with at least one optical fiber channel, wherein light emitted by the debugging light source forms a light spot after passing through the optical fiber channel; the ultraviolet light source, at least a portion of the fiber channel, and the chip are optically coupled into alignment by coinciding the light spot with the grating coupler.
In some embodiments, the commissioning light source comprises a laser light source.
In some embodiments, before the forming a reference line along the side edge of the chip, the method further includes: providing at least four microscopes and a display screen; at least one microscope is arranged on the left side, the right side, the rear side and the upper side of the chip respectively; the display screen is connected with the microscope;
and adjusting the microscope to enable the chip and the optical fiber array to be clearly displayed in the display screen.
In some embodiments, the ultraviolet light source is coupled to a portion of the fiber optic channel;
the fiber channels connected to the ultraviolet light source account for 20% to 30% of all the fiber channels in the fiber array.
In some embodiments, the ultraviolet light source is connected to the fiber optic channel by a connector;
the connecting piece comprises a flange part.
In some embodiments, the polishing angle of the fiber array is the same as the coupling angle of the chip.
In some embodiments, after the turning on the ultraviolet light source to cure the ultraviolet glue disposed at the coupling of the fiber array and the chip, the method further comprises:
closing the ultraviolet light source and disconnecting the ultraviolet light source from the optical fiber array;
the ultraviolet glue is arranged around the coupling part of the optical fiber array and the chip;
and starting the ultraviolet light source to enable the ultraviolet light source to irradiate the ultraviolet glue around the coupling position of the optical fiber array and the chip.
In some embodiments, the fiber array is a silica-based fiber array.
According to a second aspect of the embodiment of the present application, there is provided an optical package structure of an optical fiber array chip, where the optical package structure of the optical fiber array chip is prepared by using any one of the optical package methods of the optical fiber array;
and part of the ultraviolet glue is positioned at the coupling part of the optical fiber array and the chip, and the ultraviolet glue corresponds to the optical fiber channel.
In some embodiments, the material of the fiber array comprises an opaque material.
In some embodiments, the fiber array is a silica-based fiber array.
According to the embodiment of the application, the ultraviolet light source is connected with at least part of the optical fiber channels, so that the ultraviolet light emitted by the ultraviolet light source can be transmitted to the coupling position of the optical fiber array and the chip through the optical fiber channels, and the ultraviolet glue arranged at the coupling position is cured after being irradiated by the ultraviolet light. The ultraviolet light is transmitted to the coupling position of the optical fiber array and the chip through the optical fiber channel, so that the ultraviolet light does not need to be transmitted through the optical fiber array to irradiate the coupling position of the optical fiber array and the chip, the problem that the ultraviolet light cannot irradiate the coupling position of the optical fiber array and the chip when the optical fiber array adopts a material which is difficult to transmit light can be avoided, the range of materials which can be adopted by the optical fiber array can be further expanded, and the optical fiber array can adopt materials comprising silicon-based materials to improve the preparation precision of the optical fiber array.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
FIG. 1 is a flow chart illustrating a method of coupling an optical fiber array according to an embodiment of the present application;
FIG. 2 is a schematic diagram of an intermediate structure, shown in accordance with an embodiment of the present application;
FIG. 3 is a schematic diagram of another intermediate structure shown in accordance with an embodiment of the present application;
FIG. 4 is a schematic diagram of an optical fiber array according to an embodiment of the present application;
FIG. 5 is a top view of a chip according to an embodiment of the application;
FIG. 6 is a schematic diagram of another intermediate structure shown in accordance with an embodiment of the present application;
FIG. 7 is a schematic diagram of another intermediate structure shown in accordance with an embodiment of the present application;
FIG. 8 is a schematic diagram of another intermediate structure shown in accordance with an embodiment of the present application;
fig. 9 is a schematic diagram illustrating another intermediate structure according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with aspects of the application as detailed in the accompanying claims.
An embodiment of the present application provides an optical packaging method of an optical fiber array, and fig. 1 shows a flowchart of the optical packaging method of the optical fiber array. As shown in fig. 1, the optical packaging method of the optical fiber array includes the following steps: s110 to S130.
In step S110, an optical fiber array 11, an ultraviolet light source 12 and a chip 13 are provided, where the optical fiber array 11 includes at least two optical fiber channels 111, and the ultraviolet light source 12 is connected to at least some of the optical fiber channels 111.
Fig. 2 is a schematic diagram of an intermediate structure, to which the structure of step S110 may refer, according to an embodiment of the present application. As shown in fig. 2, the fiber array 11 includes at least two fiber channels 111. For example, the fiber array 11 may include four fiber channels 111, or the fiber array 11 may include sixteen fiber channels 111, or the fiber array 11 may include thirty-two fiber channels 111, or the fiber array 11 may include sixty-four fiber channels 111, but is not limited thereto.
The ultraviolet light emitted by the ultraviolet light source 12 may enter at least a portion (including all) of the fiber optic channel 111 connected to the ultraviolet light source 12. That is, the ultraviolet light source 12 may be connected to either a portion of the fiber optic channels 111 or all of the fiber optic channels 111.
It should be noted that, although the optical fiber array 11 in fig. 2 includes only four optical fiber channels 111, the present application is not limited thereto, and the optical fiber array 11 may include other numbers of optical fiber channels 111.
In step S120, the optical fiber array 11 is coupled to the chip 13, and the ultraviolet glue 14 is disposed at the coupling position of the optical fiber array 11 and the chip 13, where the ultraviolet glue 14 is configured to be cured after being irradiated by ultraviolet light.
Fig. 3 is another intermediate structure diagram, to which the structure of step S120 may refer, according to an embodiment of the present application. As shown in fig. 3, an ultraviolet glue 14 is provided at the coupling of the fiber array 11 and the chip 13. After being irradiated by ultraviolet light and solidified, the ultraviolet glue 14 can fix the optical fiber array 11 and the chip 13 with each other. The ultraviolet light received by the ultraviolet glue 14 is the ultraviolet light emitted by the ultraviolet light source 12 and transmitted to the coupling part through at least part of the optical fiber channel 111 connected with the ultraviolet light source 12. Meanwhile, the coupling part of the optical fiber array 11 and the chip 13 is coated by the arranged ultraviolet glue 14, so that the optical fiber array 11 and the chip 13 are encapsulated.
Note that the structure in fig. 2 is a schematic view of the partial structure in fig. 3 in the first direction X. Specifically, the ultraviolet light source 12, the optical fiber array 11 and the connector 20 shown in fig. 2 are schematic diagrams of the ultraviolet light source 12, the optical fiber array 11 and the connector 20 in the first direction X in fig. 3.
In step S130, the ultraviolet light source 12 is turned on to cure the ultraviolet glue 14.
Fig. 4 shows a schematic structure of the optical fiber array 11. As shown in fig. 4, the fiber array 11 includes a fiber channel 111 and an enclosure 112. The fiber channel 111 is located within the enclosure 112. In general, the material of the encapsulant 112 may be glass or silicon-based. When the material of the encapsulation body 112 is a glass material, the thickness of the encapsulation body 112 using the glass material is too small due to the low mechanical strength of the glass material, so that the photolithography technique cannot be used. In the case where the photolithography technique cannot be used, a method of etching a V-shaped groove is generally used for the encapsulation body 112, but there is a problem of accumulated error in this method. Thus causing cumulative errors in the encapsulation 112 using the glass material. When the material of the encapsulation body 112 is a silicon-based material, a photolithography process may be used because the silicon-based material has a mechanical strength stronger than that of a glass material. The use of photolithography can prevent the encapsulant 112 from being formed of a silicon-based material. However, after the silicon-based material is adopted, due to the property that the silicon-based material is difficult to transmit light, ultraviolet light cannot be irradiated to the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber array 11, and thus the ultraviolet glue 14 arranged at the coupling position of the optical fiber array 11 and the chip 13 cannot be cured. The ultraviolet glue 14 disposed at the coupling portion of the optical fiber array 11 and the chip 13 cannot be cured, which results in that the optical fiber array 11 and the chip 13 cannot be packaged normally.
The arrangement of the ultraviolet glue 14 at the coupling position of the optical fiber array 11 and the chip 13 means that the ultraviolet glue 14 is arranged between the optical fiber array 11 and the chip 13. The meaning of the ultraviolet glue 14 at the coupling point of the optical fiber array 11 and the chip 13 described elsewhere herein is the same as that described herein.
By connecting the ultraviolet light source 12 with at least part of the optical fiber channels 111, the ultraviolet light emitted by the ultraviolet light source 12 can be transmitted to the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber channels 111, so that the ultraviolet glue 14 arranged at the coupling position is cured after being irradiated by the ultraviolet light. Since the ultraviolet light is transmitted to the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber channel 111, it is unnecessary to try to make the ultraviolet light irradiate the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber array 11, so that the problem that the ultraviolet light cannot irradiate the coupling position of the optical fiber array 11 and the chip 13 when the optical fiber array 11 is made of a material which is difficult to transmit light can be avoided, and furthermore, the range of the materials which can be used by the optical fiber array 11 can be expanded, and the optical fiber array 11 can be made of materials including silicon-based materials so as to improve the preparation precision of the optical fiber array 11.
It should be noted that the technical problem is only described by taking a silicon-based material that is difficult to transmit light as an example, but in other embodiments, the above technical solution may be also adopted when other materials that are difficult to transmit light or materials that easily cause ultraviolet light to generate more serious dissipation are adopted for the encapsulation body 112.
In some embodiments, coupling the optical fiber array 11 with the chip 13, and disposing the ultraviolet glue 14 at the coupling of the optical fiber array 11 with the chip 13 may include: the fiber array 11 is coupled to the chip 13. The coupling state of the optical fiber array 11 and the chip 13 is then canceled so that a certain space exists between the optical fiber array 11 and the chip 13. And ultraviolet glue 14 is dripped into the space, and then the optical fiber array 11 is coupled with the chip 13 again, so that the ultraviolet glue 14 is arranged at the coupling position of the optical fiber array 11 and the chip 13.
In some embodiments, as shown in fig. 3 and 4, the fiber array 11 may include a fiber channel 111 and an enclosure 112. The encapsulation body 112 includes a substrate groove 113, a substrate 114, and a cover plate 115. The fiber channel 111 is located within the substrate 114. Specifically, the substrate groove 113 is located in the substrate 114, that is, the substrate groove 113 is engraved in the substrate 114. The substrate slot 113 is configured to accommodate the fiber channel 111.
The fiber channel 111 may be disposed within the substrate slot 113. And then the substrate 114 and the cover plate 115 are aligned, i.e. the cover plate 115 covers one side of the substrate 114 provided with the substrate groove 113, so that the integrated body formed by aligning the substrate 114 and the cover plate 115 is an encapsulation body 112. The fiber channel 111 is disposed in the package 112 formed by the substrate 114 and the cover 115.
Also, the fiber array 11 may also have a first coupling face 116. The first coupling surface 116 is configured to face a side of the chip 13 and is coupled to the chip 13.
Meanwhile, it should be noted that although the optical fiber array 11 shown in fig. 4 includes 5 optical fiber channels 111, the present application is not limited thereto, and the number of optical fiber channels 111 included in the optical fiber array 11 may be specifically set according to actual needs.
In some embodiments, coupling the fiber array 11 with the chip 13 includes:
at least a portion of the fiber channel 111 is optically coupled in alignment with the chip 13.
By performing optical coupling alignment on at least part of the optical fiber channels 111 and the chip 13, light emitted by the ultraviolet light source 12 can be more transmitted to the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber channels 111, so that the irradiation curing effect of the ultraviolet light source 12 on the ultraviolet glue 14 arranged at the coupling position of the optical fiber array 11 and the chip 13 can be improved. Meanwhile, the problem that ultraviolet light cannot irradiate the coupling part of the optical fiber array 11 and the chip 13 when the optical fiber array 11 is made of a material which is difficult to transmit light can be avoided, so that the range of the material which can be used for the optical fiber array 11 can be expanded, and the optical fiber array 11 can be made of a material comprising a silicon-based material so as to improve the preparation precision of the optical fiber array 11.
In some embodiments, fig. 5 shows a top view of the chip 13, and fig. 6 shows another intermediate structure according to an embodiment of the application. As shown in fig. 5 and 6, the chip 13 includes a grating coupler 131, and the grating coupler 131 is located on a side of the chip 13 facing the optical fiber array 11. Correspondingly, optically coupling at least a portion of the fiber channel 111 to the chip 13, comprising:
a fiducial line 134 is formed along the side edge of chip 13 to align the sides of fiber array 11 with fiducial line 134. The debug light source 15 is connected to at least one optical fiber channel 111, and light emitted by the debug light source 15 forms a light spot after passing through the optical fiber channel 111. At least a portion of the fibre channel 111 is aligned for optical coupling with the chip 13 by overlapping the light spot with the grating coupler 131.
Specifically, the debug light source 15 may include a debug channel 151 and a debug light source body 152. Debug channel 151 is connected to fibre channel 111 by connector 20. Light emitted from the debug light source body 152 can enter the optical fiber channel 111 through the debug channel 151, and forms a light spot after passing through the optical fiber channel 111. After the optical coupling alignment is completed, the commissioning light source 15 may be disconnected from the fibre channel 111. Through the steps, the optical coupling alignment between the ultraviolet light source 12 and at least part of the optical fiber channel 111 and the chip 13 can be ensured, so that more light emitted by the ultraviolet light source 12 can be transmitted to the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber channel 111, and further, the irradiation curing effect of the ultraviolet light source 12 on the ultraviolet glue 14 arranged at the coupling position of the optical fiber array 11 and the chip 13 can be ensured to be improved.
In some embodiments, as shown in fig. 5, the chip 13 has a second coupling surface 136. The second coupling surface 136 faces one side of the fiber array 11 and the second coupling surface 136 is configured to couple with the first coupling surface 116.
The chip 13 includes a grating coupler 131 and a pad array 135. The grating coupler 131 and the pad array 135 are both located on the second coupling surface 136.
Wherein the grating coupler 131 includes a grating channel 132 and an optical waveguide 133. After the first coupling surface 116 is coupled to the second coupling surface 136, the light transmitted by the fiber array 11 may enter the optical waveguide 133 through the grating channel 132 to form a large loop structure, i.e., the optical waveguide 133 is configured to transmit an optical signal. It should be noted that, the connection manner of the grating channels 132 and the optical waveguide 133 shown in fig. 5 is only one possible embodiment, but in other embodiments, the optical waveguide 133 is not limited thereto, and other numbers of grating channels 132 may be connected to the optical waveguide 133 according to actual needs, and the grating channels 132 connected to the optical waveguide 133 may be arranged according to actual needs.
Grating couplers 131 are located on both sides of the pad array 135. The pad array 135 has pads 1351 arranged in an array. It should be noted that, the pads 1351 arrayed in the pad array 135 shown in fig. 5 are only exemplary, and in fact, the pads 1351 in the pad array 135 may be flexibly arranged according to actual needs.
In some embodiments, the commissioning light source 15 includes a laser light source. Since the laser light source has excellent coherence and collimation, when the debug light source 15 includes the laser light source, the light emitted from the debug light source body 152 enters the optical fiber channel 111 through the debug channel 151, and the relative position between the light spot formed after passing through the optical fiber channel 111 and the debug light source body 152 is more accurate. Thus, the inclusion of a laser light source in the debug light source 15 may ensure optical coupling alignment between the ultraviolet light source 12, at least a portion of the fiber channel 111, and the chip 13.
In some embodiments, as shown in fig. 7, before forming a reference line 134 along the side edge of the chip 13, the method further includes: at least four microscopes 21 and a display screen 22 are provided. At least one microscope 21 is provided on each of the left, right, rear and upper sides of the chip 13. The display 22 is connected to the microscope 21.
The microscope 21 is adjusted so that the chip 13 and the fiber array 11 are clearly displayed in the display screen 22. The state between the optical fiber array 11 and the chip 13 can be clearly displayed through the microscope 21 and the display screen 22, so that the accuracy of the operation in the foregoing can be ensured.
In some embodiments, the ultraviolet light source 12 is coupled to a portion of the fiber optic channel 111.
The fibre channel 111 connected to the uv light source 12 comprises 20% to 30% of all fibre channels 111 in the fibre array 11. For example, the fiber channels 111 connected to the ultraviolet light source 12 may account for 20% of all the fiber channels 111 in the fiber array 11, or the fiber channels 111 connected to the ultraviolet light source 12 may account for 25% of all the fiber channels 111 in the fiber array 11, or the fiber channels 111 connected to the ultraviolet light source 12 may account for 30% of all the fiber channels 111 in the fiber array 11, but are not limited thereto.
I.e. in case the uv light source 12 is connected to part of the fibre channel 111 instead of to all of the fibre channels 111, the fibre channels 111 connected to the uv light source 12 account for 20% to 30% of all fibre channels 111 in the fibre array 11. By the arrangement, the cost rise caused by the connection of all the optical fiber channels 111 in the optical fiber array 11 with the ultraviolet light source 12 can be avoided, and meanwhile, the ultraviolet glue 14 arranged at the coupling position of the optical fiber array 11 and the chip 13 can be solidified by ensuring the quantity of the ultraviolet light source 12 transmitted by the optical fiber channels 111.
Preferably, the fiber channels 111 connected to the ultraviolet light source 12 may comprise 25% of all fiber channels 111 in the fiber array 11. By the arrangement, the cost rise caused by the connection of all the optical fiber channels 111 in the optical fiber array 11 with the ultraviolet light source 12 can be avoided, and the quantity of the ultraviolet light source 12 transmitted by the optical fiber channels 111 can be ensured to ensure that the ultraviolet glue 14 arranged at the coupling position of the optical fiber array 11 and the chip 13 can obtain a better curing effect.
In some embodiments, as shown in fig. 2 and 3, the ultraviolet light source 12 is connected to the fiber channel 111 by a connector 20. The connector 20 comprises a flange-like part. Specifically, the ultraviolet light source 12 may also include at least one light source channel 121 and a light source 122. The light source channel 121 and the fiber channel 111 may be connected by a connector 20. After the light source channel 121 and the optical fiber channel 111 are aligned, the connector 20 can keep the relative positions of the light source channel 121 and the optical fiber channel 111 fixed. The connection member 20 may include flange-like parts, but is not limited thereto, and the light source channel 121 and the optical fiber channel 111 may be connected to each other by other types of connection members 20 without affecting the transmission of ultraviolet light in the light source channel 121 and the optical fiber channel 111. After the light source channel 121 is connected to the fiber channel 111, it may be ensured that ultraviolet light emitted by the light source 122 can enter the fiber channel 111 through the light source channel 121.
It should be noted that, although the portion of the optical fiber channel 111 extending out of the optical fiber array 11 is shown in fig. 2 and 3, this is merely for more intuitively describing the connection relationship and connection manner of the light source channel 121 and the optical fiber channel 111, and in fact, the portion of the optical fiber channel 111 extending out of the optical fiber array 11 may or may not be the same.
In some embodiments, as shown in FIG. 6, debug channel 151 is connected to fibre channel 111 by a connector 20. The connector 20 comprises a flange-like part. Specifically, after the debug channel 151 and the optical fiber channel 111 are aligned, the connector 20 can keep the relative positions of the debug channel 151 and the optical fiber channel 111 fixed. The connection member 20 may include a flange-like part, but is not limited thereto, and the debug channel 151 and the optical fiber channel 111 may be connected to each other by other types of connection members 20 without affecting the transmission of ultraviolet light in the debug channel 151 and the optical fiber channel 111. After the debug channel 151 is connected to the optical fiber channel 111, it is ensured that the light emitted from the debug light source body 152 can enter the optical fiber channel 111 through the debug channel 151.
It should be noted that, although the portion of the optical fiber channel 111 extending out of the optical fiber array 11 is shown in fig. 6, this is merely for more intuitively describing the connection relationship and connection manner between the debug channel 151 and the optical fiber channel 111, and in fact, the portion of the optical fiber channel 111 extending out of the optical fiber array 11 may be present, or the portion extending out of the optical fiber array 11 may be absent.
In some embodiments, as shown in FIG. 6, the polishing angle A of the fiber array 11 1 Coupling angle A with chip 13 2 The same applies. By making the polishing angle A of the optical fiber array 11 1 Coupling angle A with chip 13 2 Likewise, the fiber array 11 may be better coupled to the chip 13, thereby facilitating the transmission of light within the fiber channel 111 of the fiber array 11.
In some embodiments, FIG. 8 is another intermediate structure shown in accordance with an embodiment of the present application. As shown in fig. 8, after the ultraviolet light source 12 is turned on to cure the ultraviolet glue 14 disposed at the coupling position of the optical fiber array 11 and the chip 13, the method further includes:
the uv light source 12 is turned off and the uv light source 12 is disconnected from the fiber array 11. An ultraviolet glue 14 is provided around the coupling of the fiber array 11 and the chip 13. The uv light source 12 is turned on so that the uv light source 12 irradiates the uv glue 14 around the coupling of the fiber array 11 and the chip 13.
By disposing the ultraviolet glue 14 around the coupling position of the optical fiber array 11 and the chip 13 and curing the ultraviolet glue 14 disposed around the coupling position of the optical fiber array 11 and the chip 13 by irradiation of the ultraviolet light source 12, the coupling position of the optical fiber array 11 and the chip 13 can be further encapsulated, and thus, the coupling effect of the optical fiber array 11 and the chip 13 can be enhanced and stabilized.
Meanwhile, it should be noted that the uv light source 12 may be turned on once after each dropping of the uv glue 14 to cure the uv glue 14 dropped previously, so as to avoid uncontrolled flow of the uv glue 14 caused by excessive dropping of uncured uv glue 14.
In some embodiments, the fiber array 11 is a silica-based fiber array. After the silicon-based material is adopted, due to the property that the silicon-based material is difficult to transmit light, ultraviolet light cannot irradiate to the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber array 11, and ultraviolet glue 14 arranged at the coupling position of the optical fiber array 11 and the chip 13 cannot be solidified. The ultraviolet glue 14 disposed at the coupling portion of the optical fiber array 11 and the chip 13 cannot be cured, which results in that the optical fiber array 11 and the chip 13 cannot be packaged normally. Therefore, when the optical fiber array 11 is a silica-based optical fiber array, the problem that the optical fiber array 11 and the chip 13 cannot be packaged normally is more likely to occur. Therefore, the above-described optical packaging method is also more desirable.
In some embodiments, fig. 9 is another intermediate structure shown in accordance with an embodiment of the present application. As shown in fig. 9, prior to connecting the ultraviolet light source 12 with at least a portion of the fiber optic channel 111, it further comprises: a radiator 24 and a circuit board 25 are sequentially formed on the substrate 23. A mounting hole 251 is provided in the circuit board 25, and the mounting hole 251 is a through hole penetrating the circuit board 25. The chip 13 is encapsulated with the interposer 26 as one encapsulating structure 27, the interposer 26 being configured to electrically connect with pads 1351 within the pad array 135 of the chip 13 to rewire the pads 1351 of the chip 13 through the interposer 26. The chip 13 portion of the encapsulation structure 27 is disposed in the disposition hole 251, and the chip 13 is in direct contact with the heat sink 24, so that the temperature of the chip 13 is lowered by the heat sink 24. The interposer 26 portion of the encapsulation structure 27 is then electrically connected to the pads on the circuit board 25 to electrically connect the pads 1351 of the chip 13 to the pads on the circuit board 25 through the rewiring function of the interposer 26.
The application also provides an optical package structure of the optical fiber array chip, which is prepared by adopting the optical package method of any one of the optical fiber arrays. Part of the ultraviolet glue 14 is located at the coupling position of the optical fiber array 11 and the chip 13, and the ultraviolet glue 14 corresponds to the optical fiber channel 111.
By connecting the ultraviolet light source 12 with at least part of the optical fiber channels 111, the ultraviolet light emitted by the ultraviolet light source 12 can be transmitted to the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber channels 111, so that the ultraviolet glue 14 arranged at the coupling position is cured after being irradiated by the ultraviolet light. Since the uv light is transmitted to the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber channel 111, the uv glue 14 is required to be located at the coupling position of the optical fiber array 11 and the chip 13, and the uv glue 14 and the optical fiber channel 111 are required to be disposed correspondingly, so that the uv light transmitted to the coupling position of the optical fiber array 11 and the chip 13 can irradiate the uv glue 14 located at the coupling position.
Meanwhile, since the ultraviolet light is transmitted to the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber channel 111, the ultraviolet light does not need to be transmitted through the optical fiber array 11 to irradiate the coupling position of the optical fiber array 11 and the chip 13, so that the problem that the ultraviolet light cannot irradiate the coupling position of the optical fiber array 11 and the chip 13 when the optical fiber array 11 is made of a material which is difficult to transmit light can be avoided, and furthermore, the range of the materials which can be adopted by the optical fiber array 11 can be expanded, and the optical fiber array 11 can be made of materials including silicon-based materials so as to improve the preparation precision of the optical fiber array 11.
In some embodiments, the material of the fiber array comprises an opaque material. Since the ultraviolet light is transmitted to the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber channel 111, it is unnecessary to try to make the ultraviolet light irradiate the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber array 11, so that the problem that the ultraviolet light cannot irradiate the coupling position of the optical fiber array 11 and the chip 13 when the optical fiber array 11 is made of a material difficult to transmit light can be avoided, and further, the range of materials which can be used by the optical fiber array 11 can be expanded, namely, the materials of the optical fiber array can comprise a light-impermeable material.
In some embodiments, the fiber array is a silica-based fiber array. After the silicon-based material is adopted, due to the property that the silicon-based material is difficult to transmit light, ultraviolet light cannot irradiate to the coupling position of the optical fiber array 11 and the chip 13 through the optical fiber array 11, and ultraviolet glue 14 arranged at the coupling position of the optical fiber array 11 and the chip 13 cannot be solidified. The ultraviolet glue 14 disposed at the coupling portion of the optical fiber array 11 and the chip 13 cannot be cured, which results in that the optical fiber array 11 and the chip 13 cannot be packaged normally. Therefore, when the optical fiber array 11 is a silica-based optical fiber array, the problem that the optical fiber array 11 and the chip 13 cannot be packaged normally is more likely to occur. Therefore, the above-described optical packaging method is also more desirable.
The above embodiments of the present application may be complementary to each other without collision.
It is noted that in the drawings, the size of layers and regions may be exaggerated for clarity of illustration. Moreover, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or intervening layers may be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may be present. In addition, it will be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intervening layer or element may also be present. Like reference numerals refer to like elements throughout.
The term "plurality" refers to two or more, unless explicitly defined otherwise.
Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It is to be understood that the application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (13)
1. An optical packaging method of an optical fiber array is characterized by providing an optical fiber array, an ultraviolet light source and a chip, wherein the optical fiber array comprises at least two optical fiber channels;
connecting the ultraviolet light source to at least a portion of the fiber optic pathway;
coupling the optical fiber array with the chip, and arranging ultraviolet glue at the coupling part of the optical fiber array and the chip, wherein the ultraviolet glue is configured to be cured after being irradiated by ultraviolet light;
and starting the ultraviolet light source to solidify the ultraviolet glue.
2. The method of claim 1, wherein coupling the fiber array to the chip comprises:
at least a portion of the fibre channel is aligned for optical coupling with the chip.
3. The method of claim 2, wherein the chip includes a grating coupler on a side of the chip facing the optical fiber array; optically coupling at least a portion of the fiber optic channel with the chip, comprising:
forming a datum line along a side edge of the chip, and aligning the side of the optical fiber array with the datum line; connecting a debugging light source with at least one optical fiber channel, wherein light emitted by the debugging light source forms a light spot after passing through the optical fiber channel; the ultraviolet light source, at least a portion of the fiber channel, and the chip are optically coupled into alignment by coinciding the light spot with the grating coupler.
4. The method of claim 3, wherein the debug light source comprises a laser light source.
5. The method of claim 3, further comprising, prior to said forming a fiducial line along a side edge of said chip: providing at least four microscopes and a display screen; at least one microscope is arranged on the left side, the right side, the rear side and the upper side of the chip respectively; the display screen is connected with the microscope;
and adjusting the microscope to enable the chip and the optical fiber array to be clearly displayed in the display screen.
6. The method of claim 1, wherein the ultraviolet light source is coupled to a portion of the fiber optic channel;
the fiber channels connected to the ultraviolet light source account for 20% to 30% of all the fiber channels in the fiber array.
7. The method of claim 1, wherein the ultraviolet light source is connected to the fiber channel via a connector;
the connecting piece comprises a flange part.
8. The method of claim 1, wherein the polishing angle of the fiber array is the same as the coupling angle of the chip.
9. The method of claim 1, further comprising, after the turning on the ultraviolet light source to cure the ultraviolet glue disposed at the coupling point of the optical fiber array and the chip:
closing the ultraviolet light source and disconnecting the ultraviolet light source from the optical fiber array;
the ultraviolet glue is arranged around the coupling part of the optical fiber array and the chip;
and starting the ultraviolet light source to enable the ultraviolet light source to irradiate the ultraviolet glue around the coupling position of the optical fiber array and the chip.
10. The method of claim 1, wherein the optical fiber array is a silicon-based optical fiber array.
11. An optical package structure of an optical fiber array chip, characterized in that the optical package structure of the optical fiber array chip is prepared by adopting the optical package method of the optical fiber array according to any one of claims 1 to 10;
and part of the ultraviolet glue is positioned at the coupling part of the optical fiber array and the chip, and the ultraviolet glue corresponds to the optical fiber channel.
12. The fiber array chip optical package of claim 11, wherein the material of the fiber array comprises an opaque material.
13. The fiber array chip optical package structure of claim 12, wherein the fiber array is a silicon-based fiber array.
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