CN117074513B - Defect identification method based on alternating current electromagnetic field and array detection probe - Google Patents
Defect identification method based on alternating current electromagnetic field and array detection probe Download PDFInfo
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- CN117074513B CN117074513B CN202311326347.0A CN202311326347A CN117074513B CN 117074513 B CN117074513 B CN 117074513B CN 202311326347 A CN202311326347 A CN 202311326347A CN 117074513 B CN117074513 B CN 117074513B
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- 230000005672 electromagnetic field Effects 0.000 title claims abstract description 30
- 230000005284 excitation Effects 0.000 claims description 21
- 230000003750 conditioning effect Effects 0.000 claims description 11
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Abstract
The invention belongs to the technical field of electromagnetic nondestructive testing, and particularly relates to a defect identification method based on an alternating current electromagnetic field and an array detection probe. The invention provides a defect identification method based on an alternating current electromagnetic field and an array detection probe. The defect identification method comprises the following steps: acquiring an X-direction magnetic field Bx signal and a Z-direction magnetic field Bz signal; removing the background magnetic fields of each path of X-direction magnetic field Bx signal and Z-direction magnetic field Bz signal to obtain an X-direction magnetic field Bx without the background magnetic field 1 Signal and Z-direction magnetic field Bz 1 A signal; drawing to obtain Bx 1 Array image and Bz of signals 1 An array image of the signal; searching Bx 1 Array image and Bz of signals 1 And the distortion area corresponding to the disturbance of the same time position in the array image of the signal.
Description
Technical Field
The invention belongs to the technical field of electromagnetic nondestructive testing, and particularly relates to a defect identification method based on an alternating current electromagnetic field and an array detection probe.
Background
In the service process of petroleum and petrochemical equipment such as oil pipelines, pressure vessels and the like, the surface of the equipment structure is extremely easy to generate crack defects due to long-term influence of corrosion, stress and high temperature, so that the normal operation of the equipment structure is influenced; when the crack propagates to a certain extent, the structural failure of the equipment can be caused, and serious safety accidents are caused. Therefore, timely and effective crack detection has important significance for decision maintenance and safe operation of equipment. In the method, an alternating current magnetic field detection (Alternating Current Field Measurement, ACFM) technology is a non-contact electromagnetic nondestructive detection technology, and the technology can realize rapid detection of cracks on the surface and near surface of a structure under complex working conditions because the coating or the attachment on the surface of the structure is not required to be cleaned before detection, so that the technology is successfully applied to the fields of petroleum pipelines, ocean platforms, rail transit and the like.
However, the inventor finds out after further research that in the actual detection process, if the detection personnel operate the probe improperly or the surface of the detected workpiece is uneven, the probe cannot keep constant lift-off in the scanning process, and finally a certain lift-off jitter signal exists in the detection signal. It is worth noting that the distortion characteristics of the lift-off jitter signal are very similar to those caused by the defects, so that technicians are difficult to exclude the lift-off jitter signal, accurate identification of the defects under the lift-off jitter cannot be realized, and missing detection or misjudgment of the defects are very easy to cause. In addition, for the existing ac electromagnetic field single probe, when a significant distortion area is found in the acquired one-dimensional characteristic signal, the distortion area needs to be scanned repeatedly for many times to eliminate interference signals caused by non-defects, which increases the detection cost and time and reduces the detection efficiency.
Disclosure of Invention
The invention provides a defect identification method based on an alternating current electromagnetic field and an array detection probe.
In order to solve the technical problems, the invention adopts the following technical scheme:
a defect identification method based on an alternating current electromagnetic field comprises the following steps:
step one: enabling the array detection probe to scan in parallel along the surface of the workpiece to acquire an X-direction magnetic field Bx signal and a Z-direction magnetic field Bz signal;
step two: extracting background magnetic fields of defect-free positions, and respectively removing the background magnetic fields of each path of X-direction magnetic field Bx signal and Z-direction magnetic field Bz signal to obtain an X-direction magnetic field Bx without the background magnetic field 1 Signal and Z-direction magnetic field Bz 1 A signal;
step three: the position of the array detection probe is taken as X-axis data, the position of the sensor array is taken as Y-axis data, the amplitude of the acquired magnetic field signal is taken as Z-axis data, and the Bx is obtained by drawing 1 Array image and Bz of signals 1 An array image of the signal;
step four: searching Bx 1 Array image and Bz of signals 1 Distortion region corresponding to disturbance of same position in time in array image of signal；
Judging whether distortion signals acquired by different sensor units in the distortion area are perpendicular to an X axis or not; if the distortion signals are all perpendicular to the X axis, judging the distortion signals as lift-off signals, otherwise judging the distortion signals as defect signals.
The invention also provides an array detection probe based on the alternating current electromagnetic field, which comprises: the probe comprises a probe shell, a Lei Mo joint, a sensor array, an excitation device and a signal conditioning circuit; the Lei Mo connector is arranged on one side of the probe shell and is used for transmitting detection signals; the sensor array, the excitation device and the signal conditioning circuit are all arranged in the probe shell;
the excitation device comprises an excitation coil and a U-shaped magnetic core, wherein the excitation coil is uniformly wound on the U-shaped magnetic core and is used for generating a uniform induction electromagnetic field on the surface of a tested workpiece; the sensor array is arranged right below the excitation device and comprises n groups of sensor units, wherein n is more than or equal to 3; the sensor units are arranged at the positions between the two supporting legs at the lower part of the U-shaped magnetic core and are uniformly and equidistantly arranged along the direction of the cross beam of the U-shaped magnetic core; each group of sensor units consists of 1 TMR magnetic sensor with X-axis sensitive direction and 1 TMR magnetic sensor with Z-axis sensitive direction; the signal conditioning circuit is arranged above the excitation device and is used for amplifying and filtering signals output by the sensor array.
Preferably, the method further comprises the following steps: a probe gland for sealing the probe housing;
the probe gland is fixedly connected with the probe shell into an integrated structure through a fixing screw.
The invention provides a defect identification method based on an alternating current electromagnetic field and an array detection probe. The defect identification method comprises the following steps: acquiring an X-direction magnetic field Bx signal and a Z-direction magnetic field Bz signal; removing the background magnetic fields of each path of X-direction magnetic field Bx signal and Z-direction magnetic field Bz signal to obtain an X-direction magnetic field Bx without the background magnetic field 1 Signal and Z-direction magnetic field Bz 1 A signal; drawing to obtain Bx 1 Array image and Bz of signals 1 An array image of the signal; searching Bx 1 Array image and Bz of signals 1 And the distortion area corresponding to the disturbance of the same time position in the array image of the signal. The defect identification method based on the alternating current electromagnetic field with the structural characteristics and the array detection probe verify the obtained detection results through different sensor units, so that the accuracy and the detection efficiency of the detection results are remarkably improved; meanwhile, the X-direction magnetic field Bx signal and the Z-direction magnetic field Bz signal are obtained based on the array detection probe, after background magnetic field interference of each signal is removed, accurate identification of jitter lift-off defect disturbance is completed according to distortion signals obtained by different sensor units, so that interference signals caused by non-defects are eliminated, and finally the accuracy of detection results is improved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the following figures:
FIG. 1 is a schematic diagram of the overall structure of an array detection probe based on an alternating electromagnetic field;
FIG. 2 is a schematic diagram of an explosion structure of an array detection probe based on an alternating electromagnetic field;
FIG. 3 is a schematic diagram of the overall structure of a sensor array in an array inspection probe;
FIG. 4a is a bottom view of a sensor array in an array inspection probe;
FIG. 4b is a top view of the sensor array in the array inspection probe;
FIG. 5 is a schematic diagram of the structure of the probe housing in the array inspection probe;
FIG. 6 is a schematic flow chart of a defect identification method based on an AC electromagnetic field;
FIG. 7 is a schematic diagram of a parallel scanning work piece structure in a defect identification method based on an AC electromagnetic field;
FIG. 8 is a schematic diagram of an array inspection probe during a first parallel scanning process in a defect identification method based on an AC electromagnetic field;
FIG. 9 is a drawing of the resulting Bx 1 An array image of the signal;
FIG. 10 is a diagram showing the resulting Bz 1 An array image of the signal.
Reference numerals:
10. a probe housing; 101. a housing sidewall; 102. a land; 103. rectangular grooves; 104. a threaded hole; 105. a mounting hole; 20. lei Mo joint; 30. a sensor array; 301. a sensor unit; 3011. TMR magnetic sensor with X-axis sensitive direction; 3012. TMR magnetic sensor with Z-axis sensitivity direction; 40. an excitation device; 401. a U-shaped magnetic core; 402. an exciting coil; 50. a signal conditioning circuit; 60. a probe gland; 70. and (5) fixing the screw.
Detailed Description
The invention provides a defect identification method based on an alternating current electromagnetic field and an array detection probe.
The invention provides a defect identification method based on an alternating current electromagnetic field, which is shown in fig. 6 and specifically comprises the following steps:
step one: and enabling the array detection probe to scan in parallel along the surface of the workpiece to acquire an X-direction magnetic field Bx signal and a Z-direction magnetic field Bz signal. Wherein, the workpiece scanned in parallel can be referred to as shown in fig. 7, and the scanning process of the array detection probe in parallel can be referred to as shown in fig. 8.
Step two: extracting background magnetic fields of defect-free positions, and respectively removing the background magnetic fields of each path of X-direction magnetic field Bx signal and Z-direction magnetic field Bz signal to obtain an X-direction magnetic field Bx without the background magnetic field 1 Signal and Z-direction magnetic field Bz 1 A signal.
Step three: the position of the array detection probe is taken as X-axis data, the position of the sensor array is taken as Y-axis data, the amplitude of the acquired magnetic field signal is taken as Z-axis data, and the Bx is obtained by drawing 1 Array image and Bz of signals 1 An array image of the signal. Wherein Bx is 1 Signal signalArray image and Bz of (a) 1 An array image of the signals can be seen with reference to fig. 9 and 10.
Step four: searching Bx 1 Array image and Bz of signals 1 The corresponding distortion area occurs when disturbance occurs at the same time and position in the array image of the signal;
judging whether distortion signals acquired by different sensor units in the distortion area are perpendicular to an X axis or not; if the distortion signals are all perpendicular to the X axis, judging the distortion signals as lift-off signals, otherwise judging the distortion signals as defect signals.
In the Bx shown in fig. 9 and 10 1 Array image and Bz of signals 1 For an array image of a signal, when the array inspection probe passes a defect, the time and location of entry of different sensor units into the defect area are different, for example: when the sensor unit with the number 1 enters first and the sensor unit with the number 5 enters later, the defect signal is in an inclined state. And for Bx shown in fig. 9 and 10 1 Array image and Bz of signals 1 For the array image of the signal, when the probe lift-off interference of the array detection probe occurs, bx 1 Signals and Bz 1 The signals will be disturbed at the same time and position, the specific illustration of which corresponds to the features shown in the right areas of fig. 9 and 10.
Then, further to Bx 1 Signals and Bz 1 Judging distortion signals acquired by different sensor units in a distortion area corresponding to disturbance at the same position of the signals simultaneously: if the distortion signals are all perpendicular to the X axis, judging the distortion signals as lift-off signals, otherwise judging the distortion signals as defect signals.
Specifically, refer to Bx shown in fig. 9 and 10 1 Array image and Bz of signals 1 And (3) an array image of the signals, wherein the 1 st distortion area from the left side to the right side of the figure forms a certain angle with the X axis due to the distortion signals acquired by different magnetic sensors. Therefore, the defect signal is determined. The distortion areas at the 2 nd and 3 rd positions from the left to the right of the figure are perpendicular to the X-axis due to the distortion signals acquired by the different magnetic sensors. Therefore, judgmentThe signal is set as the lift-off signal.
Thus, the whole defect identification process of the defect identification method based on the alternating current electromagnetic field is completed. Compared with the prior art, the defect identification method based on the alternating current electromagnetic field can effectively distinguish the defect signal from the lift-off interference signal of the detection probe, and further prove how to realize the whole process of accurately identifying the defect under the lift-off jitter of the detection probe through the discussion.
In addition, as shown in fig. 1 or fig. 2, the invention further provides an array detection probe based on an alternating electromagnetic field, which specifically comprises: the probe comprises a probe shell, a Lei Mo joint, a sensor array, an excitation device and a signal conditioning circuit. Wherein, lei Mo connects and installs in probe shell one side for signal transmission. And the sensor array, the excitation device and the signal conditioning circuit are all arranged inside the probe shell.
Further, as shown in fig. 2, the exciting device comprises an exciting coil and a U-shaped magnetic core, wherein the exciting coil is uniformly wound on the U-shaped magnetic core and is used for generating a uniform induction electromagnetic field on the surface of the workpiece to be tested. The sensor array is arranged right below the excitation device and comprises n groups of sensor units, wherein n is more than or equal to 3 (as shown in fig. 3 or 4a and 4b, wherein five groups of sensor units are arranged in fig. 3, 4a and 4 b). The sensor units are arranged at positions between the two supporting legs at the lower part of the U-shaped magnetic core and are uniformly arranged at equal intervals along the direction of the cross beam of the U-shaped magnetic core. Each group of sensor units consists of 1 TMR magnetic sensor with an X-axis sensitive direction and 1 TMR magnetic sensor with a Z-axis sensitive direction. The signal conditioning circuit is arranged above the excitation device and is used for amplifying and filtering signals output by the sensor array.
As a preferred embodiment of the present invention, a specific structure of the probe housing is provided for facilitating the installation and fixation of the Lei Mo connector, the sensor array, the excitation device, the signal conditioning circuit, and other structural units (a schematic diagram is shown in fig. 5). Specifically, the probe shell is provided with a shell side wall, a terrace with edge, a rectangular groove, a threaded hole and a mounting hole. The prismatic tables are positioned at four corners of the side wall of the shell and are used for fixedly mounting the excitation device. The rectangular recess is located at the bottom of the probe housing for mounting the sensor array. The probe gland is also hermetically arranged at the opening of the probe shell through the matching of the threaded hole and the fixing screw; a mounting hole is also provided on one side of the probe housing for interference fit with the Lei Mo connector.
Compared with the detection probe in the prior art, the array detection probe based on the alternating-current electromagnetic field provided by the invention has the advantages that the plurality of sensor units (each group of sensor units consists of 1 TMR magnetic sensor with the X-axis sensitive direction and 1 TMR magnetic sensor with the Z-axis sensitive direction) are arranged in the scanning direction, so that the detection structures detected by the sensor units can mutually verify, the defect that the detection result (precision) of the array detection probe in the prior art can be improved due to the fact that the array detection probe needs multiple scanning is overcome, and the detection efficiency of the detection probe is greatly improved.
The invention provides a defect identification method based on an alternating current electromagnetic field and an array detection probe. The defect identification method comprises the following steps: acquiring an X-direction magnetic field Bx signal and a Z-direction magnetic field Bz signal; removing the background magnetic fields of each path of X-direction magnetic field Bx signal and Z-direction magnetic field Bz signal to obtain an X-direction magnetic field Bx without the background magnetic field 1 Signal and Z-direction magnetic field Bz 1 A signal; drawing to obtain Bx 1 Array image and Bz of signals 1 An array image of the signal; searching Bx 1 Array image and Bz of signals 1 And the distortion area corresponding to the disturbance of the same time position in the array image of the signal. The defect identification method based on the alternating current electromagnetic field with the structural characteristics and the array detection probe verify the obtained detection results through different sensor units, so that the accuracy and the detection efficiency of the detection results are remarkably improved; meanwhile, based on the array detection probe, an X-direction magnetic field Bx signal and a Z-direction magnetic field Bz signal are obtained, after background magnetic field interference of each signal is removed, accurate identification of jitter lift-off defect disturbance is completed according to distortion signals obtained by different sensor units, and therefore interference caused by non-defects is eliminatedAnd the signal is finally used for improving the accuracy of the detection result.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (3)
1. A defect identification method based on an alternating current electromagnetic field is characterized by comprising the following steps:
step one: enabling the array detection probe to scan in parallel along the surface of the workpiece to acquire an X-direction magnetic field Bx signal and a Z-direction magnetic field Bz signal;
step two: extracting background magnetic fields of defect-free positions, and respectively removing the background magnetic fields of each path of X-direction magnetic field Bx signal and Z-direction magnetic field Bz signal to obtain an X-direction magnetic field Bx without the background magnetic field 1 Signal and Z-direction magnetic field Bz 1 A signal;
step three: the position of the array detection probe is taken as X-axis data, the position of the sensor array is taken as Y-axis data, the amplitude of the acquired magnetic field signal is taken as Z-axis data, and the Bx is obtained by drawing 1 Array image and Bz of signals 1 An array image of the signal;
step four: searching Bx 1 Array image and Bz of signals 1 The corresponding distortion area occurs when disturbance occurs at the same time and position in the array image of the signal; judging whether distortion signals acquired by different sensor units in the distortion area are perpendicular to an X axis or not; if the distortion signals are all perpendicular to the X axis, judging the distortion signals as lift-off signals, otherwise judging the distortion signals as defect signals.
2. The method for identifying defects based on an alternating current electromagnetic field according to claim 1, wherein the array inspection probe used in the method for identifying defects comprises: the probe comprises a probe shell, a Lei Mo joint, a sensor array, an excitation device and a signal conditioning circuit; the Lei Mo connector is arranged on one side of the probe shell and is used for signal transmission; the sensor array, the excitation device and the signal conditioning circuit are all arranged in the probe shell;
the excitation device comprises an excitation coil and a U-shaped magnetic core, wherein the excitation coil is uniformly wound on the U-shaped magnetic core and is used for generating a uniform induction electromagnetic field on the surface of a tested workpiece; the sensor array is arranged right below the excitation device and comprises n groups of sensor units, wherein n is more than or equal to 3; the sensor units are arranged at the positions between the two supporting legs at the lower part of the U-shaped magnetic core and are uniformly and equidistantly arranged along the direction of the cross beam of the U-shaped magnetic core; each group of sensor units consists of 1 TMR magnetic sensor with X-axis sensitive direction and 1 TMR magnetic sensor with Z-axis sensitive direction; the signal conditioning circuit is arranged above the excitation device and is used for amplifying and filtering signals output by the sensor array.
3. The method for identifying defects based on an ac electromagnetic field according to claim 2, wherein the array inspection probe used in the method for identifying defects further comprises: a probe gland for sealing the probe housing;
the probe gland is fixedly connected with the probe shell into an integrated structure through a fixing screw.
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