CN117059684A - Packaging structure of photovoltaic device and preparation method of packaging structure - Google Patents
Packaging structure of photovoltaic device and preparation method of packaging structure Download PDFInfo
- Publication number
- CN117059684A CN117059684A CN202311107373.4A CN202311107373A CN117059684A CN 117059684 A CN117059684 A CN 117059684A CN 202311107373 A CN202311107373 A CN 202311107373A CN 117059684 A CN117059684 A CN 117059684A
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- China
- Prior art keywords
- frame sealing
- substrate
- sealing glue
- glue
- closed space
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 216
- 239000003292 glue Substances 0.000 claims abstract description 192
- 239000000758 substrate Substances 0.000 claims abstract description 159
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000012945 sealing adhesive Substances 0.000 claims abstract description 31
- 150000001875 compounds Chemical class 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000011261 inert gas Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 229910010272 inorganic material Inorganic materials 0.000 claims description 5
- 239000011147 inorganic material Substances 0.000 claims description 5
- 239000011368 organic material Substances 0.000 claims description 5
- 238000000016 photochemical curing Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000001723 curing Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 abstract description 25
- 229910052760 oxygen Inorganic materials 0.000 abstract description 25
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 24
- 238000002834 transmittance Methods 0.000 abstract description 7
- 230000002745 absorbent Effects 0.000 description 6
- 239000002250 absorbent Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000001110 calcium chloride Substances 0.000 description 2
- 229910001628 calcium chloride Inorganic materials 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The application discloses a packaging structure of a photovoltaic device and a preparation method of the packaging structure. The packaging structure comprises a first substrate, a second substrate, a first frame sealing adhesive and a second frame sealing adhesive. The first substrate and the second substrate are arranged at intervals, and are bonded through the first frame sealing glue. The first frame sealing glue, the first substrate and the second substrate are enclosed to form a closed space, and the closed space is used for arranging a photovoltaic device, namely the first frame sealing glue encapsulates the photovoltaic device so as to reduce water, oxygen and the like from entering the closed space. And the second frame sealing glue is arranged on one side, far away from the closed space, of the first frame sealing glue, and surrounds at least part of the first frame sealing glue, and is respectively connected with the first substrate, the second substrate and the first frame sealing glue, and seals the first frame sealing glue, so that the water oxygen transmittance of the first frame sealing glue is further reduced, and the device performance of the photovoltaic device is ensured.
Description
Technical Field
The application relates to the field of packaging, in particular to a packaging structure of a photovoltaic device and a preparation method of the packaging structure.
Background
Photovoltaic cells are a practical path for green low carbon energy sources. The perovskite photovoltaic cell has the characteristics of suitability for large-area low-cost manufacture, high photoelectric conversion efficiency and the like, and is an important development direction of the photovoltaic cell industry.
In order to ensure the life of perovskite photovoltaic cells, the cells must be encapsulated with high water and oxygen resistance to prevent degradation of the cell device performance due to water and oxygen. In the related art, the battery is packaged by adopting an ultraviolet glue packaging technology, but the ultraviolet glue has higher oxygen transmittance, and the packaging failure risk of long-term operation of the battery is increased.
Disclosure of Invention
The embodiment of the application provides a packaging structure of a photovoltaic device and a preparation method of the packaging structure, aiming at solving the problem of packaging failure of the photovoltaic device.
An embodiment of a first aspect of the present application provides a packaging structure of a photovoltaic device, the packaging structure including: a first substrate; the first substrate and the second substrate are arranged at intervals; the first frame sealing glue is arranged between the first substrate and the second substrate, and the first frame sealing glue, the first substrate and the second substrate are enclosed to form a closed space which is used for arranging a photovoltaic device; the second frame sealing glue is positioned on one side of the first frame sealing glue away from the closed space, and surrounds at least part of the first frame sealing glue, and the second frame sealing glue is respectively connected with the first substrate, the second substrate and the first frame sealing glue.
According to an embodiment of the first aspect of the present application, the first frame sealing glue includes a plurality of sub frame sealing glues that are arranged at intervals and sleeved with each other, and the sub frame sealing glues close to the photovoltaic device are enclosed to form a closed space.
According to any one of the foregoing embodiments of the first aspect of the present application, the sealed space is filled with an inert gas.
According to any one of the foregoing embodiments of the first aspect of the present application, the adjacent sub-seal frame adhesives are spaced to form a space, and the space is filled with an inert gas.
According to any of the foregoing embodiments of the first aspect of the present application, the first frame sealing adhesive includes an inorganic material.
According to any of the foregoing embodiments of the first aspect of the present application, the first frame sealing adhesive includes glass frit.
According to any of the foregoing embodiments of the first aspect of the present application, the second sealant includes an organic material.
According to any of the foregoing embodiments of the first aspect of the present application, the second frame sealing adhesive includes an organic adhesive.
According to any of the foregoing embodiments of the first aspect of the present application, the edge of the second sealant away from the enclosed space is flush with the edge of the first substrate.
According to any of the foregoing embodiments of the first aspect of the present application, the edge of the second sealant away from the enclosed space is flush with the edge of the second substrate.
According to any of the foregoing embodiments of the first aspect of the present application, the package structure further includes: the water absorption structure is positioned in the closed space.
According to any one of the foregoing embodiments of the first aspect of the present application, one of the water absorbing structure and the photovoltaic device is disposed on the first substrate, and the other is disposed on the second substrate.
According to any of the foregoing embodiments of the first aspect of the present application, the plurality of water absorbing structures are distributed at intervals, or the water absorbing structures are integrally provided.
According to any of the foregoing embodiments of the first aspect of the present application, the water absorbing structure is spaced apart from the photovoltaic device.
An embodiment of the second aspect of the present application provides a method for manufacturing a package structure, including:
preparing a first frame sealing adhesive on a first substrate;
aligning and pressing the first substrate and the second substrate;
processing the first frame sealing glue to enable the first frame sealing glue to be respectively bonded with the first substrate and the second substrate;
preparing second frame sealing glue, and processing the second frame sealing glue, so that the second frame sealing glue is respectively bonded with the first substrate, the second substrate and the first frame sealing glue, the first substrate and the second substrate enclose to form a closed space, the closed space is used for setting a photovoltaic device, the second frame sealing glue is positioned on one side, far away from the closed space, of the first frame sealing glue, and the second frame sealing glue is arranged around at least part of the first frame sealing glue.
According to an embodiment of the second aspect of the present application, in the processing step of the first frame sealing adhesive, the method includes:
and carrying out laser melting operation on the first frame sealing glue.
According to an embodiment of the second aspect of the present application, in the processing step of the second frame sealing adhesive, the method includes:
and heating and curing or photo-curing the second frame sealing glue.
An embodiment of a third aspect of the present application provides a method for manufacturing a package structure, including:
preparing a first frame sealing adhesive and a second frame sealing adhesive on a first substrate;
aligning and pressing the first substrate and the second substrate;
processing is carried out to first frame sealing glue and second frame sealing glue to make the second frame sealing glue bond with first base plate, second base plate, first frame sealing glue respectively, first frame sealing glue, first base plate and second base plate enclose and form airtight space, airtight space is used for setting up photovoltaic device, and the second frame sealing glue is located the first frame sealing glue and keeps away from the one side in airtight space, and the second frame sealing glue encircles the setting of at least partial first frame sealing glue.
According to the packaging structure provided by the embodiment of the application, the packaging structure comprises a first substrate, a second substrate, a first frame sealing adhesive and a second frame sealing adhesive. The first substrate and the second substrate are arranged at intervals, and are bonded through the first frame sealing glue. The first frame sealing glue, the first substrate and the second substrate are enclosed to form a closed space, and the closed space is used for arranging a photovoltaic device, namely the first frame sealing glue encapsulates the photovoltaic device so as to reduce water, oxygen and the like from entering the closed space. And a second frame sealing glue is arranged on one side, far away from the closed space, of the first frame sealing glue, the second frame sealing glue surrounds at least part of the first frame sealing glue, and the second frame sealing glue is respectively connected with the first substrate, the second substrate and the first frame sealing glue, so that the second frame sealing glue seals the first frame sealing glue, the water oxygen transmittance of the first frame sealing glue is further reduced, and the device performance of the photovoltaic device is ensured.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings, in which like reference characters designate the same or similar features, and in which the figures are not to scale.
FIG. 1 is a partial cross-sectional view of a package structure provided by an embodiment of the present application;
FIG. 2 is a partial cross-sectional view of a package structure in another embodiment;
FIG. 3 is a partial cross-sectional view of a package structure in yet another embodiment;
FIG. 4 is a partial cross-sectional view of a package structure in yet another embodiment;
FIG. 5 is a partial cross-sectional view of a package structure in yet another embodiment;
fig. 6 is a schematic flow chart of a method for manufacturing a package structure according to an embodiment of the present application;
fig. 7 is a schematic flow chart of a method for manufacturing a package structure according to an embodiment of the present application.
Reference numerals illustrate:
10. a package structure; 20. a photovoltaic device;
100. a first substrate;
200. a second substrate;
300. a first frame sealing adhesive; 310. sub-seal frame glue; 320. a closed space; 330. a spacing space;
400. a second frame sealing adhesive;
500. a water absorbing structure.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are merely configured to illustrate the application and are not configured to limit the application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
It will be understood that when a layer, an area, or a structure is described as being "on" or "over" another layer, another area, it can be referred to as being directly on the other layer, another area, or another layer or area can be included between the layer and the other layer, another area. And if the component is turned over, that layer, one region, will be "under" or "beneath" the other layer, another region.
Embodiments of the present application provide a packaging structure of a photovoltaic device and a method for manufacturing the packaging structure, and embodiments of the packaging structure of the photovoltaic device and the method for manufacturing the packaging structure will be described below with reference to the accompanying drawings.
The embodiment of the application provides a packaging structure of a photovoltaic device, which can be a perovskite solar cell.
Referring to fig. 1, fig. 1 is a partial cross-sectional view of a package structure according to an embodiment of the application.
As shown in fig. 1, an embodiment of the first aspect of the present application provides a packaging structure 10 of a photovoltaic device 20, where the packaging structure 10 includes a first substrate 100, a second substrate 200, a first frame sealing adhesive 300, and a second frame sealing adhesive 400; the first substrate 100 and the second substrate 200 are disposed at a distance; the first frame sealing glue 300 is arranged between the first substrate 100 and the second substrate 200, the first frame sealing glue 300, the first substrate 100 and the second substrate 200 are enclosed to form a closed space 320, and the closed space 320 is used for arranging the photovoltaic device 20; the second frame sealing glue 400 is located at one side of the first frame sealing glue 300 away from the closed space 320, the second frame sealing glue 400 is disposed around at least part of the first frame sealing glue 300, and the second frame sealing glue 400 is respectively connected with the first substrate 100, the second substrate 200 and the first frame sealing glue 300.
According to the package structure 10 of the embodiment of the present application, the package structure 10 includes a first substrate 100, a second substrate 200, a first frame sealing compound 300 and a second frame sealing compound 400. The first substrate 100 and the second substrate 200 are spaced apart from each other, and the first substrate 100 and the second substrate 200 are bonded by the first frame sealing adhesive 300. The first frame sealing glue 300, the first substrate 100 and the second substrate 200 enclose to form a closed space 320, and the closed space 320 is used for setting the photovoltaic device 20, that is, the first frame sealing glue 300 encapsulates the photovoltaic device 20, so as to reduce water, oxygen and the like from entering the closed space 320. The second frame sealing glue 400 is arranged on one side, far away from the closed space 320, of the first frame sealing glue 300, the second frame sealing glue 400 is arranged around at least part of the first frame sealing glue 300, and the second frame sealing glue 400 is respectively connected with the first substrate 100, the second substrate 200 and the first frame sealing glue 300, so that the second frame sealing glue 400 seals the first frame sealing glue 300, the water oxygen transmittance of the first frame sealing glue 300 is further reduced, and the device performance of the photovoltaic device 20 is guaranteed.
Referring to fig. 2, fig. 2 is a partial cross-sectional view of a package structure according to another embodiment.
As shown in fig. 2, in some alternative embodiments, the first frame sealing compound 300 includes a plurality of sub frame sealing compounds 310 disposed at intervals and sleeved with each other, the sub-seal 310 adjacent to the photovoltaic device 20 encloses to form a closed space 320.
The mutually sleeved means that the plurality of sub frame sealing adhesives 310 are arranged in a closed ring shape, so as to form a plurality of ring-shaped sub frame sealing adhesives 310 which are distributed at intervals.
In these alternative embodiments, the first frame sealing glue 300 includes a plurality of sub frame sealing glue 310 distributed at intervals, and the plurality of sub frame sealing glue 310 are mutually sleeved to form a multi-channel package, so as to further improve the packaging performance of the first frame sealing glue 300 and reduce the entry of water oxygen and the like into the enclosed space 320. The sub-seal frame adhesive 310 close to the photovoltaic device 20 encloses with the first substrate 100 and the second substrate 200 to form a closed space 320, so as to set the photovoltaic device 20, and package and protect the photovoltaic device 20, thereby ensuring the device characteristics of the photovoltaic device 20.
In some alternative embodiments, the enclosed space 320 is filled with an inert gas, such as nitrogen (N) 2 )。
In these alternative embodiments, the inert gas in the enclosed space 320 has no effect on the device performance of the photovoltaic device 20, so that the inert gas disposed in the enclosed space 320 can have a certain protection effect on the photovoltaic device 20. And the inert gas is filled in the closed space 320, and the inert gas can form a gas-phase package for the photovoltaic device 20, has a certain blocking effect on water vapor and oxygen, and reduces the contact between the water vapor and the oxygen and the photovoltaic device 20.
In some alternative embodiments, the adjacent sub-frame sealing glue 310 forms a spacing space 330 at intervals, and the spacing space 330 is filled with inert gas.
In these alternative embodiments, the inert gas in the space 330 has no influence on the device performance of the photovoltaic device 20, and filling the inert gas in the space 330 is equivalent to providing a gas-phase package, which has a certain blocking effect on water vapor and oxygen, and the inert gas is used in combination with the first sealant 300, so as to further reduce the contact between the water vapor and oxygen and the photovoltaic device 20.
In some alternative embodiments, the first frame sealing compound 300 comprises an inorganic material.
In these alternative embodiments, the first frame sealing compound 300 is made of an inorganic material, which can improve the sealing performance of the first frame sealing compound 300 and reduce the entry of water and oxygen and contact with the photovoltaic device 20 compared to the sealing process using an organic material in the related art.
Optionally, the first frame sealing adhesive 300 includes glass frit. Optionally, the first substrate 100 and the second substrate 200 are both glass substrates, that is, the first frame sealing glue 300 and the first substrate 100 and the second substrate 200 are both made of the same glass frit material, when the first frame sealing glue 300 is melted by laser, the first frame sealing glue 300 is similar to the first substrate 100 and the second substrate 200, so that the first frame sealing glue 300 is respectively fused with the first substrate 100 and the second substrate 200, the first frame sealing glue 300 is integrated with the first substrate 100 and the second substrate 200 after being cured, the connection tightness of the first frame sealing glue 300 and the first substrate 100 and the second substrate 200 is improved, and the entry of water and oxygen into the closed space 320 and the contact with the photovoltaic device 20 are further reduced. And the first frame sealing adhesive 300 of the inorganic material has lower water oxygen transmittance and better illumination resistance and ageing resistance.
In some alternative embodiments, the second frame sealing glue 400 comprises an organic material, for example, the second frame sealing glue 400 comprises an organic glue.
In these alternative embodiments, when the second frame sealing compound 400 includes an organic material, a heating or photo-curing manner is required to form bonding on the second frame sealing compound 400, so that the second frame sealing compound 400 is in sealing connection with the first frame sealing compound 300, the first substrate 100 and the second substrate 200, thereby realizing further sealing of the second frame sealing compound 400 on the photovoltaic device 20, improving the overall packaging performance of the packaging structure 10, and further reducing the entry of water and oxygen into the sealed space 320 and contacting with the photovoltaic device 20. And the second frame sealing glue 400 is formed by heating or photo-curing, so that the adhesion between the first frame sealing glue 300 and the first substrate 100 and the second substrate 200 is not affected.
Optionally, the first frame sealing glue 300 includes glass powder, the second frame sealing glue 400 includes organic glue, and the first frame sealing glue 300 and the second frame sealing glue 400 can be processed directly on the first substrate 100 by adopting screen printing or printing methods.
Referring to fig. 3, fig. 3 is a partial cross-sectional view of a package structure according to another embodiment.
In some alternative embodiments, as shown in fig. 3, the edge of the second frame sealing adhesive 400 away from the enclosed space 320 is disposed flush with the edge of the first substrate 100.
In these alternative embodiments, one end of the second frame sealing compound 400 is in sealing connection with the first frame sealing compound 300, and the other end is disposed flush with the edge of the first substrate 100, so that the portion of the first substrate 100 extending out of the first frame sealing compound 300 toward the side away from the enclosed space 320 can be supported by the second frame sealing compound 400, so as to improve the impact resistance and vibration resistance of the first substrate 100.
In some alternative embodiments, the edge of the second frame sealing compound 400 away from the enclosed space 320 is disposed flush with the edge of the second substrate 200.
In these alternative embodiments, one end of the second frame sealing compound 400 is in sealing connection with the first frame sealing compound 300, and the other end is disposed flush with the edge of the second substrate 200, so that the portion of the second substrate 200 extending out of the first frame sealing compound 300 toward the side away from the enclosed space 320 can be supported by the second frame sealing compound 400, to improve the impact resistance and vibration resistance of the second substrate 200.
Optionally, the extending thickness of the second frame sealing glue 400 along the direction towards the closed space 320 is 1mm-10mm, and when the extending thickness of the second frame sealing glue 400 is greater than or equal to 1mm, the problems that the water-oxygen barrier effect is poor and the preparation difficulty is high due to the fact that the extending thickness of the second frame sealing glue 400 is too small can be solved. When the extension thickness of the second frame sealing glue 400 is less than or equal to 10mm, the problems of more consumable and high cost caused by the fact that the extension thickness of the second frame sealing glue 400 is large can be solved. Optionally, the second frame sealing adhesive 400 has an extension thickness of one of 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, and 9mm in a direction toward the closed space 320.
Referring to fig. 4, fig. 4 is a partial cross-sectional view of a package structure according to another embodiment.
As shown in fig. 4, in some alternative embodiments, the package structure 10 further includes: the water absorbing structure 500 is located in the enclosed space 320.
In these alternative embodiments, after the photovoltaic device 20 is encapsulated by using the encapsulation structure 10, the water absorbing structure 500 is disposed in the enclosed space 320, so that the water vapor existing in the enclosed space 320 can be reduced, and thus the problem that the performance of the photovoltaic device 20 is affected by the water vapor is improved.
Optionally, the absorbent structure 500 includes a desiccant, such as calcium chloride (CaCl) 2 ) Inorganic drying agents such as magnesium oxide (MgO) and the like have better water absorption capacity, and the erosion of water vapor to the photovoltaic device 20 is reduced, so that the service life of the photovoltaic device 20 is prolonged.
In some alternative embodiments, one of the water absorbing structure 500 and the photovoltaic device 20 is disposed on the first substrate 100, and the other is disposed on the second substrate 200.
In these alternative embodiments, the water absorbing structure 500 is disposed on the first substrate 100, the photovoltaic device 20 is disposed on the second substrate 200, or the water absorbing structure 500 is disposed on the second substrate 200, the photovoltaic device 20 is disposed on the first substrate 100, the water absorbing structure 500 and the photovoltaic device 20 are disposed on different substrates, so as to reduce mutual interference between the water absorbing structure 500 and the photovoltaic device 20, and ensure device performance of the photovoltaic device 20 and water absorbing performance of the water absorbing structure 500.
Referring to fig. 4 and fig. 5 together, fig. 5 is a partial cross-sectional view of a package structure according to another embodiment.
There are various ways to arrange the absorbent structure 500, for example, in some alternative embodiments, as shown in fig. 5, a plurality of absorbent structures 500 are spaced apart, or, as shown in fig. 4, the absorbent structures 500 are integrally arranged.
In these alternative embodiments, when a plurality of spaced apart absorbent structures 500 are provided, the absorbent structures 500 may be positioned at various locations to allow the various locations in the containment structure to remain dry. When the water absorbing structure 500 is integrally arranged, the preparation process is simplified, and the integrally arranged water absorbing structure 500 has larger area and better water absorbing performance.
Optionally, the water absorbing structure 500 is spaced from the photovoltaic device 20, so as to ensure that the water absorbing structure 500 and the photovoltaic device 20 do not interfere with each other, and ensure the device performance of the photovoltaic device 20 and the water absorbing performance of the water absorbing structure 500.
The packaging structure 10 provided by the application has the advantages of simple structure, simple preparation process and packaging process flow, and low-cost and easily-obtained materials of the packaging structure 10; and adopt the packaging structure 10 of each embodiment described above, can effectively guarantee that packaging structure 10 is inside to be in totally closed and the state of isolated water oxygen, the setting of first frame sealing glue 300 and second frame sealing glue 400 can effectively isolate the infiltration of water oxygen to the life of extension photovoltaic device 20.
The materials of the functional structural layers of the photovoltaic device 20 in the embodiment of the present application may be known to those skilled in the art, and other parameters such as the thickness of the photovoltaic device 20 and the thickness of the packaging structure 10 may be adjusted according to the requirements, which are not limited and described herein.
An embodiment of the second aspect of the present application further provides a method for manufacturing a package structure 10, where the package structure 10 may be the package structure 10 provided in any one of the embodiments of the first aspect, please refer to fig. 1 to fig. 5 together, and refer to fig. 6, and fig. 6 is a flow chart of a method for manufacturing a package structure according to an embodiment of the present application. The preparation method comprises the following steps:
step S01: and preparing a first frame sealing adhesive on the first substrate.
Step S02: and aligning and pressing the first substrate and the second substrate.
Step S03: and processing the first frame sealing glue so that the first frame sealing glue is respectively adhered to the first substrate and the second substrate.
Step S04: preparing second seal frame glue, and processing the second seal frame glue, so that the second seal frame glue is respectively bonded with the first substrate, the second substrate and the first seal frame glue, the first substrate and the second substrate enclose to form a closed space, the closed space is used for setting a photovoltaic device, the second seal frame glue is positioned on one side of the first seal frame glue away from the closed space, the second seal frame glue surrounds at least part of the first seal frame glue, and the second seal frame glue is respectively connected with the first substrate, the second substrate and the first seal frame glue.
According to the manufacturing method of the second aspect of the embodiment of the present application, the first frame sealing compound 300 is manufactured on the first substrate 100 through step S01. The first substrate 100 and the second substrate 200 are aligned and pressed by step S02. Then, the first frame sealing glue 300 is processed in step S03, so that the first frame sealing glue 300 is adhered to the first substrate 100 and the second substrate 200 respectively. Finally, the second frame sealing glue 400 is prepared and the second frame sealing glue 400 is processed in step S04, so that the second frame sealing glue 400 is bonded with the first substrate 100, the second substrate 200 and the first frame sealing glue 300 respectively. The first frame sealing glue 300, the first substrate 100 and the second substrate 200 enclose to form a closed space 320, and the closed space 320 is used for setting the photovoltaic device 20, that is, the first frame sealing glue 300 encapsulates the photovoltaic device 20, so as to reduce water, oxygen and the like from entering the closed space 320. The second frame sealing glue 400 is arranged on one side, far away from the closed space 320, of the first frame sealing glue 300, the second frame sealing glue 400 surrounds at least part of the first frame sealing glue 300 and is in sealing connection with the first frame sealing glue 300, the second frame sealing glue 400 seals the first frame sealing glue 300, the water oxygen transmittance of the first frame sealing glue 300 is further reduced, and the device performance of the photovoltaic device 20 is guaranteed.
In some alternative embodiments, in the processing step of the first frame sealing adhesive 300, the method includes:
the first frame sealing glue 300 is subjected to laser melting operation.
Optionally, in the processing step of the second frame sealing adhesive 400, the method includes:
the second frame sealing glue 400 is heat-cured or photo-cured.
In these alternative embodiments, the first frame sealing compound 300 is processed by laser melting, and the second frame sealing compound 400 is processed by heat curing or photo curing, which are both simpler processing methods, so that the first frame sealing compound 300 and the second frame sealing compound 400 can be bonded with the first substrate 100 and the second substrate 200, and the package structure 10 has better sealing performance.
An embodiment of the third aspect of the present application further provides a method for manufacturing a package structure 10, where the package structure 10 may be the package structure 10 provided in any one of the embodiments of the first aspect, please refer to fig. 1 to fig. 5 together, and refer to fig. 7, and fig. 7 is a flow chart of a method for manufacturing a package structure according to an embodiment of the present application. The preparation method comprises the following steps:
step S1: and preparing a first frame sealing adhesive and a second frame sealing adhesive on the first substrate.
Step S2: and aligning and pressing the first substrate and the second substrate.
Step S3: processing is carried out to first frame sealing glue and second frame sealing glue to make the second frame sealing glue bond with first base plate, second base plate, first frame sealing glue respectively, first frame sealing glue, first base plate and second base plate enclose and form airtight space, airtight space is used for setting up photovoltaic device, and the second frame sealing glue is located the first frame sealing glue and keeps away from the one side in airtight space, and the second frame sealing glue encircles the setting of at least partial first frame sealing glue.
According to the manufacturing method of the embodiment of the third aspect of the present application, the first frame sealing compound 300 and the second frame sealing compound 400 are manufactured on the first substrate 100 through step S1. The first substrate 100 and the second substrate 200 are aligned and pressed by step S2. Then, the first frame sealing glue 300 and the second frame sealing glue 400 are processed in step S3, so that the first frame sealing glue 300 is adhered to the first substrate 100 and the second substrate 200 respectively. The first frame sealing glue 300, the first substrate 100 and the second substrate 200 enclose to form a closed space 320, and the closed space 320 is used for setting the photovoltaic device 20, that is, the first frame sealing glue 300 encapsulates the photovoltaic device 20, so as to reduce water, oxygen and the like from entering the closed space 320. The second frame sealing glue 400 is arranged on one side, far away from the closed space 320, of the first frame sealing glue 300, the second frame sealing glue 400 surrounds at least part of the first frame sealing glue 300 and is in sealing connection with the first frame sealing glue 300, the second frame sealing glue 400 seals the first frame sealing glue 300, the water oxygen transmittance of the first frame sealing glue 300 is further reduced, and the device performance of the photovoltaic device 20 is guaranteed.
These embodiments are not exhaustive or to limit the application to the precise embodiments disclosed, and according to the application described above. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and the practical application, to thereby enable others skilled in the art to best utilize the application and various modifications as are suited to the particular use contemplated. The application is limited only by the claims and the full scope and equivalents thereof.
Claims (10)
1. A packaging structure for a photovoltaic device, comprising:
a first substrate;
the first substrate and the second substrate are arranged at intervals;
the first frame sealing glue is arranged between the first substrate and the second substrate, and the first frame sealing glue, the first substrate and the second substrate are enclosed to form a closed space, and the closed space is used for arranging the photovoltaic device;
the second frame sealing glue is positioned on one side, far away from the closed space, of the first frame sealing glue, the second frame sealing glue is arranged around at least part of the first frame sealing glue, and the second frame sealing glue is respectively connected with the first substrate, the second substrate and the first frame sealing glue.
2. The packaging structure according to claim 1, wherein the first frame sealing glue comprises a plurality of sub frame sealing glues which are arranged at intervals and sleeved with each other, and the sub frame sealing glues close to the photovoltaic device are enclosed to form the closed space.
3. The package structure according to claim 2, wherein the enclosed space is filled with an inert gas.
4. The package structure of claim 2, wherein adjacent sub-frame sealing glue spaces form a space, and inert gas is filled in the space.
5. The package structure of any one of claims 1 to 4, wherein the first frame sealing compound comprises an inorganic material;
preferably, the first frame sealing glue comprises glass powder.
6. The package structure of any one of claims 1 to 4, wherein the second frame sealing compound comprises an organic material;
preferably, the second frame sealing glue comprises an organic glue;
preferably, the edge of the second frame sealing glue away from the closed space is flush with the edge of the first substrate;
preferably, the edge of the second frame sealing glue away from the closed space is flush with the edge of the second substrate.
7. The package structure according to any one of claims 1 to 4, further comprising:
the water absorption structure is positioned in the closed space;
preferably, one of the water absorbing structure and the photovoltaic device is arranged on the first substrate, and the other is arranged on the second substrate;
preferably, a plurality of the water absorbing structures are distributed at intervals, or the water absorbing structures are integrally arranged;
preferably, the water absorbing structure is spaced from the photovoltaic device.
8. A method of manufacturing a package structure, the method comprising:
preparing a first frame sealing adhesive on a first substrate;
aligning and pressing the first substrate and the second substrate;
processing the first frame sealing glue so that the first frame sealing glue is respectively bonded with the first substrate and the second substrate;
preparing second frame sealing glue, and processing the second frame sealing glue, so that the second frame sealing glue is respectively adhered to the first substrate, the second substrate and the first frame sealing glue, the first substrate and the second substrate enclose to form a closed space, the closed space is used for setting a photovoltaic device, the second frame sealing glue is positioned on one side, far away from the closed space, of the first frame sealing glue, and the second frame sealing glue surrounds at least part of the first frame sealing glue.
9. The method according to claim 8, wherein in the step of processing the first frame sealing compound, the method comprises:
performing laser melting operation on the first frame sealing glue;
preferably, in the step of processing the second frame sealing glue, the method includes:
and heating and curing or photo-curing the second frame sealing glue.
10. A method of manufacturing a package structure, the method comprising:
preparing a first frame sealing adhesive and a second frame sealing adhesive on a first substrate;
aligning and pressing the first substrate and the second substrate;
the first frame sealing glue and the second frame sealing glue are processed, so that the second frame sealing glue is respectively adhered to the first substrate, the second substrate and the first frame sealing glue, the first substrate and the second substrate enclose to form a closed space, the closed space is used for setting a photovoltaic device, the second frame sealing glue is located on one side, far away from the closed space, of the first frame sealing glue, and the second frame sealing glue surrounds at least part of the first frame sealing glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311107373.4A CN117059684A (en) | 2023-08-30 | 2023-08-30 | Packaging structure of photovoltaic device and preparation method of packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311107373.4A CN117059684A (en) | 2023-08-30 | 2023-08-30 | Packaging structure of photovoltaic device and preparation method of packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117059684A true CN117059684A (en) | 2023-11-14 |
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ID=88664303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311107373.4A Pending CN117059684A (en) | 2023-08-30 | 2023-08-30 | Packaging structure of photovoltaic device and preparation method of packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117059684A (en) |
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2023
- 2023-08-30 CN CN202311107373.4A patent/CN117059684A/en active Pending
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