CN117055236B - Light beam expanding system and photoelectric equipment - Google Patents
Light beam expanding system and photoelectric equipment Download PDFInfo
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- CN117055236B CN117055236B CN202311308782.0A CN202311308782A CN117055236B CN 117055236 B CN117055236 B CN 117055236B CN 202311308782 A CN202311308782 A CN 202311308782A CN 117055236 B CN117055236 B CN 117055236B
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- 230000003287 optical effect Effects 0.000 claims abstract description 123
- 239000000463 material Substances 0.000 claims description 21
- 238000005253 cladding Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 7
- 230000005693 optoelectronics Effects 0.000 claims description 5
- 238000004891 communication Methods 0.000 abstract description 9
- 238000004806 packaging method and process Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 11
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- 239000013307 optical fiber Substances 0.000 description 5
- 238000013519 translation Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000012858 packaging process Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
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- 238000012536 packaging technology Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
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- 238000006467 substitution reaction Methods 0.000 description 2
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- 239000003989 dielectric material Substances 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0905—Dividing and/or superposing multiple light beams
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
Abstract
The application provides an optical beam expanding system and photoelectric equipment, and relates to the technical field of optical communication. The optical beam expanding system includes: the optical chip comprises a first lens assembly, a second lens assembly, an optical chip and a carrier plate; the optical chip is arranged in a first area on the carrier plate; the first lens component is arranged in a second area corresponding to the first area on the carrier plate; the second lens component is arranged in a third area between the first area and the second area on the carrier plate; the optical chip is used for outputting an optical waveguide beam; the second lens component is used for refracting the optical waveguide beam to obtain an offset beam and outputting the offset beam to the central axis position of the first lens component; the first lens assembly is used for expanding the beam based on the offset beam so as to output an expanded beam. The second lens component is arranged between the optical chip and the first lens component, so that the second lens component refracts the optical waveguide beam, and off-axis beam expansion of the optical chip beam can be realized under the condition that the central axis of the beam expansion lens and the optical waveguide are not at the coaxial height.
Description
Technical Field
The present application relates to the field of optical communications technologies, and in particular, to an optical beam expanding system and an optoelectronic device.
Background
The optical module is used as one of the necessary devices for optical interconnection, and has the function of realizing photoelectric signal conversion and completing the receiving and transmitting of optical signals. External modulator optical chips such as silicon light and lithium niobate based on integrated optical waveguide technology are expected to provide optical modules with larger bandwidth and low cost, but optical waveguide chips generally face the problem of low alignment tolerance of optical fiber coupling, and a first lens component is generally required to perform laser beam expansion treatment so as to improve the alignment tolerance of coupling with optical fibers.
In the existing optical module packaging technology, an optical chip and an optical fiber are generally directly adopted for active alignment coupling packaging, and due to the fact that the size of a die spot of the optical chip is small and alignment tolerance is low, the coupling packaging is completed by adopting a six-dimensional high-precision alignment system under the chip light-emitting condition, so that the packaging speed is low and the mass production cost is high. Or the large-mode-spot-size output is realized by adopting the instruments such as a direct-tuning laser, a photoelectric detector, a separation lens assembled optical module and the like, but the bandwidth of the laser is limited in the direct-tuning working mode, the bandwidth requirement of the rapid current optical module cannot be met, and the air tightness, the stability and the volume size of the packaging module are poor, so that the light beam expansion effect of the traditional packaging mode is poor, and the current optical communication requirement cannot be met.
Disclosure of Invention
In view of the foregoing, an objective of the embodiments of the present application is to provide an optical beam expanding system and an optoelectronic device, so as to solve the problem of poor optical beam expanding effect caused by the packaging manner in the prior art.
In order to solve the above-mentioned problem, in a first aspect, an embodiment of the present application provides an optical beam expanding system, including: the optical chip comprises a first lens assembly, a second lens assembly, an optical chip and a carrier plate;
the optical chip is arranged in a first area on the carrier plate; the first lens component is arranged in a second area corresponding to the first area on the carrier plate; the second lens component is arranged in a third area between the first area and the second area on the carrier plate;
the optical chip is used for outputting an optical waveguide beam;
the second lens component is used for refracting the optical waveguide light beam to obtain an offset light beam, and outputting the offset light beam to the central axis position of the first lens component;
the first lens assembly is used for expanding the beam based on the offset beam so as to output an expanded beam.
In the implementation process, in a third area between a first area of the optical chip and a second area of the first lens assembly for performing optical beam expansion on the carrier plate, a corresponding second lens assembly is arranged, so that the second lens assembly refracts an optical waveguide beam output by the optical chip, and the obtained offset beam is output to a central axis position of the first lens assembly for beam expansion processing. The beam can be laterally translated by the second lens assembly to achieve off-axis beam expansion of the microchip beam without the central axis of the beam expanding lens being at an on-axis height with the optical waveguide beam. The alignment tolerance of the light beam is high, the size of the beam expansion die spot is not limited by the specification of the light chip, the beam expansion of various die spot sizes can be realized, the packaging speed of the light beam expansion system is higher, and the current various light communication requirements can be met.
Optionally, the second lens assembly is parallel to the first side of the optical chip and the second lens assembly is parallel to the second side of the first lens assembly;
the second lens component and the carrier plate form a set included angle, and the set included angle comprises any angle from 0 degree to 180 degrees.
In the above implementation, in order to implement the beam refracting function of the second lens assembly, the second lens assembly may be configured as a parallel flat plate lens assembly with two parallel sides. And the included angle between the second lens component and the carrier plate is set, and the set included angle can be selected and adjusted according to actual conditions so as to provide an adjustable installation mode.
Optionally, a light-transmitting material is filled between the optical chip, the second lens assembly and the first lens assembly;
the light-transmitting material is used for transmitting light beams.
In the implementation process, the light-transmitting materials can be filled in the plurality of structural components to fix all components in the light beam expanding system, so that a sealed whole system is formed for packaging, the light beam expanding system is good in air tightness, high in stability and convenient for mass production, the light-transmitting materials can also transmit light beams, loss is small in transmission, and light beam transmission can be realized among the plurality of structures.
Optionally, the refractive index of the light-transmitting material is a first refractive index, and the refractive index of the second lens component is a second refractive index different from the first refractive index.
In order to achieve off-axis beam expansion in the case where the optical waveguide beam and the first lens component are not on-axis, the light-transmitting material and the second lens component may be set to materials with different refractive indexes to form multiple refractions based on the refraction principle of light, so that the beam can translate without changing the propagation direction angle of the beam, so as to perform beam expansion at the optimal beam expansion position, i.e., the central axis position, of the offset beam in the first lens component.
Optionally, the offset beam is determined by the set included angle, the first refractive index, the second refractive index, and a lens thickness between the first side and the second side of the second lens assembly, so that the offset beam is horizontally input at the central axis position of the first lens assembly in a first direction parallel to the carrier plane.
In the implementation process, the set included angle between the offset light beam and the second lens component and the carrier plate, the first refractive index of the light-transmitting material, the second refractive index of the second lens component and the lens thickness between the first side and the second side of the second lens component are related, and a specific light beam translation function can be realized by adjusting a plurality of parameters so that the offset light beam can be input into the central axis position of the first lens component.
Optionally, the beam offset of the offset beam is obtained by:
；
；
；
wherein,for the first refractive index +.>For the second refractive index +.>For an angle of incidence determined on the basis of said set angle, < >>For a refraction angle determined based on said set angle, < >>For the lens thickness +.>For the propagation path length of light in the second lens assembly,/for the second lens assembly>For the beam offset.
In the implementation process, the beam offset of the offset beam is calculated through a plurality of influence parameters, so that the relevant radius size of the first lens component, the beam spot size of the beam expansion output and the like can be determined based on the beam offset. The beam spot size of the expanded beam is not limited by the specification of the optical chip, and the beam offset of the offset beam can be adjusted and controlled according to a plurality of parameters, so that the offset beam can be coaxial with the central axis of the first lens assembly, and the expanded beam with various spot sizes is realized.
Optionally, the first side of the second lens assembly is provided with a first antireflection film;
the second side of the second lens assembly is provided with a second anti-reflection film.
In the implementation process, since the first side and the second side of the second lens assembly need to receive the light beam or output the light beam, in order to increase the transmittance of the light beam and reduce the loss during light beam transmission, corresponding anti-reflection films may be respectively disposed on the first side and the second side of the second lens assembly, so as to improve the efficiency of light beam transmission.
Optionally, the light beam expanding system further comprises a connecting piece, wherein the connecting piece is arranged on the connecting surface of the carrier plate;
the optical chip is inversely arranged on the first area through the connecting piece;
the first lens component is arranged on the second area through the connecting piece;
the second lens assembly is disposed on the third region by the connection member.
In the implementation process, since the carrier is a temporary component in the packaging process, a corresponding temporary connector may be provided, and a plurality of devices may be temporarily disposed on each area on the carrier, so as to align or align each component in the optical beam expanding system. Because the second lens component can realize the corresponding light beam translation function, and the angle between the second lens component and the carrier plate is relevant when refracting, and is irrelevant with distance and position, therefore, the first area and the second area can be selected and adjusted according to the requirements and actual conditions, a plurality of groups of optical chips and the first lens component can be arranged, and the third area can be arranged at any position in the first area and the second area to realize the corresponding function.
Optionally, the optical chip includes: a substrate layer, an insulating layer, a waveguide layer and an upper cladding layer;
the upper cladding is connected with the first area through the connecting piece;
the waveguide layer is arranged on the top of the upper cladding layer in a second direction perpendicular to the carrier plate and pointing away from the carrier plate, and the waveguide layer is used for outputting the optical waveguide light beam;
the insulating layer is arranged on the top of the waveguide layer, and the substrate layer is arranged on the top of the insulating layer.
In the above implementation process, in order to reduce the alignment error of the optical chip and the first lens component in the second direction perpendicular to the carrier plate and pointing away from the carrier plate, the optical chip may be inversely arranged on the first region by using the characteristic that the upper cladding layer in the optical chip is thinner and the absolute thickness error is small.
In a second aspect, embodiments of the present application further provide an optoelectronic device comprising the light beam expanding system according to any of the first aspects above.
In summary, the embodiment of the application provides an optical beam expanding system and an optoelectronic device, which can set up a second lens assembly to transversely translate a light beam, so that off-axis beam expanding of an optical chip light beam is realized under the condition that a central axis of a beam expanding lens and an optical waveguide are not at a coaxial height, alignment tolerance of the light beam is high, the size of a beam expanding die spot is not limited by the specification of the optical chip, beam expanding of various die spot sizes can be realized, and the packaging speed of the optical beam expanding system is higher, so that the current various optical communication requirements can be met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a first optical beam expanding system according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of another optical beam expanding system according to an embodiment of the present application.
Icon: 1-a first lens assembly; 2-a second lens assembly; 3-optical chip; 301-substrate layer, 302-insulating layer, 303-waveguide layer, 304-upper cladding layer, 4-carrier plate, 5-connector, 6-light transmitting material.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the present application without making any inventive effort, are intended to be within the scope of the embodiments of the present application.
In the existing optical module packaging technology, an optical chip and an optical fiber are directly adopted for active alignment coupling packaging, and the optical chip is small in size of a die spot and low in alignment tolerance, so that the coupling packaging is completed by adopting a six-dimensional high-precision alignment system under the condition that the chip emits light in packaging, and the packaging speed is low, and the large-scale production cost is high. The laser can also be used for realizing large-mode-spot-size output by adopting instruments such as a direct-tuning laser, a photoelectric detector, a split lens assembled optical module and the like, the bandwidth of the laser is limited in the direct-tuning working mode although the coupling tolerance is high, the rapidly-increased bandwidth requirement cannot be met, and the air tightness, the stability and the volume size of the package are poor. Therefore, the existing packaging mode causes that the beam expanding lens cannot realize the function of large-mode-spot-size beam expanding, the light beam expanding effect is poor, and the current light communication requirement cannot be met.
In order to solve the problem, the embodiment of the application provides an optical beam expanding system, which is packaged in corresponding photoelectric equipment to realize corresponding functions of photoelectric signal conversion, receiving, transmitting and the like.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a first optical beam expanding system according to an embodiment of the present application, where the optical beam expanding system includes: a first lens assembly 1, a second lens assembly 2, an optical chip 3 and a carrier plate 4.
The optical chip 3 includes, but is not limited to, integrated optical waveguide chips such as silicon, silicon nitride, thin film lithium niobate, silicon dioxide, III-V, and germanium silicon, and the optical chip 3 may be a monolithic integrated chip or a heterogeneous integrated chip. The first lens assembly 1 may be an optical beam expander lens, and may include a lens group composed of a single lens or a plurality of microlenses capable of achieving beam spot size expansion. The second lens assembly 2 may be provided as a plate lens with a refractive function to effect translation of the light beam.
Illustratively, the materials of the first lens assembly 1 and the second lens assembly 2 include, but are not limited to, quartz glass, transparent polymer, and the like, which have low loss at the optical communication wavelength.
Alternatively, the number of the optical chips 3 and the first lens assembly 1 may be set to one, or may be positioned in a corresponding one-dimensional array or two-dimensional array.
In order to solve the problems of small size of the beam spot of the optical chip 3 and low alignment tolerance of optical fiber coupling, a photoelectric co-packaging plastic packaging technology method can be adopted to package the electric chip, the optical chip 3 and the beam expanding lens into an integral system, thereby realizing large-mode spot output. The optical chip 3 may be disposed in a first region on the carrier plate 4; disposing the first lens assembly 1 on a second region of the carrier plate 4 corresponding to the first region; the second lens assembly 2 is arranged in a third region of the carrier plate 4 between the first region and the second region. The present application also shows the propagation path of the light beam in fig. 1, the optical chip 3 is used for outputting an optical waveguide light beam, the optical waveguide light beam can be output in a first direction parallel to the plane of the carrier plate 4, the second lens assembly 2 is used for refracting the optical waveguide light beam to obtain an offset light beam, and outputting the offset light beam to the central axis position of the first lens assembly 1, and the first lens assembly 1 is used for performing beam expansion based on the offset light beam so as to output a beam expansion light beam.
The central axis position of the first lens assembly 1 is the optimal optical beam expanding position, and the second lens assembly 2 can transversely translate the optical beam, so that the off-axis beam expansion of the optical chip 3 beam is realized under the condition that the central axis of the beam expanding lens and the optical waveguide beam are not at the coaxial height. The alignment tolerance of the light beam is high, the size of the beam expansion die spot is not limited by the specification of the optical chip 3, the beam expansion of various die spot sizes can be realized, the packaging speed of the optical beam expansion system is higher, and the current various optical communication requirements can be met.
Optionally, referring to fig. 2, fig. 2 is a schematic structural diagram of another optical beam expanding system according to an embodiment of the present application, where a first side of the second lens assembly 2 near the optical chip 3 and a second side of the second lens assembly 2 near the first lens assembly 1 are parallel to form a parallel plate lens. The second lens component 2 and the carrier plate 4 form a set included angle alpha, the set included angle alpha comprises any angle from 0 degrees to 180 degrees, and the set included angle alpha can be selected and adjusted according to actual conditions so as to provide an adjustable installation mode. Fig. 2 only shows a case where the set angle α is an acute angle, and the description is not repeated for other cases.
Optionally, a light-transmitting material 6 is filled between the optical chip 3, the second lens assembly 2 and the first lens assembly 1. The light-transmitting material 6 can fix each component in the light beam expanding system, so that a sealed whole system is formed for packaging, the light beam expanding system is good in air tightness, high in stability and convenient for mass production, the light-transmitting material 6 can also transmit light beams, loss is small during transmission, and light beam transmission can be realized among a plurality of structures.
Illustratively, the material of the light-transmitting material 6 includes, but is not limited to, quartz glass, transparent polymer, or the like, which has a low loss at the optical communication wavelength.
Optionally, the refractive index of the light-transmitting material 6 is a first refractive index n1, the refractive index of the second lens component 2 is a second refractive index n2, n1 different from the first refractive index, and n2 may be larger than n2, n1 or smaller than n2, so as to form multiple refraction based on the refraction principle of light, thereby enabling the light beam to translate without changing the propagation direction angle of the light beam, so as to inject the offset light beam into the optimal beam expansion position in the first lens component 1, namely, the central axis position for beam expansion, and off-axis beam expansion can be realized under the condition that the light waveguide light beam and the first lens component 1 are different from each other through different refractive indexes.
Alternatively, according to the refractive index principle of light, when the optical waveguide beam is obliquely incident through the first lens assembly 1, the emergent light is refracted twice, the beam is translated in the transverse direction (i.e. the first direction parallel to the plane of the carrier plate 4), but the propagation direction angle of the beam is not changed. Therefore, the offset beam is determined by the set angle α, the first refractive index n1, the second refractive index n2, and the lens thickness h between the first side and the second side of the second lens assembly 2, so that the offset beam is horizontally input at the central axis position of the first lens assembly 1. A specific beam translation function can be achieved by adjusting a number of parameters to enable the offset beam to be input at the position of the central axis of the first lens assembly 1.
The beam offset of the offset beam is obtained by:
；
；
；
wherein,for a first refractive index>For the second refractive index>For an angle of incidence determined based on the set angle alpha,for a refraction angle determined based on the set angle alpha +.>For the thickness of the lens>For the propagation path length of light in the second lens assembly 2 +.>Is the beam offset. The beam spot size of the expanded beam is not limited by the specification of the optical chip 3, and the beam offset of the offset beam can be adjusted and controlled according to a plurality of parameters, so that the offset beam can be coaxial with the central axis of the first lens assembly 1, thereby realizing the expansion of multiple spot sizes.
Illustratively, a device is provided=1.57，/>=1.48，/>When the included angle α=60° is set to be =1 mm, the incident angle is +>=30°, refraction angle +.>=31.96°, propagation path length L of about 1.18mm, and +.>=40.3 um. For a beam offset of 40.3um, the maximum radius size of the first lens assembly 1 may exceed 40um, with the corresponding output maximum beam spot size radius being greater than 40um.
Alternatively, since the first side and the second side of the second lens assembly 2 need to receive the light beam or output the light beam, the first side of the second lens assembly 2 is provided with a first antireflection film; the second side of the second lens assembly 2 is provided with a second anti-reflection film to increase the transmittance of the light beam, reduce the loss during the light beam transmission, and improve the efficiency of the light beam transmission.
Optionally, since the carrier 4 is a temporary component in the packaging process, the light beam expanding system may further comprise a temporary connector 5, where the connector 5 is arranged on the connection surface of the carrier 4. By way of example, the connection 5 may be a material with a connection function, such as a bonding glue, which facilitates removal.
Wherein the optical chip 3 is arranged on the first area upside down by the connecting piece 5, the first lens component 1 is arranged on the second area by the connecting piece 5, and the second lens component 2 is arranged on the third area by the connecting piece 5. During the setting, the optical chip 3, the first lens component 1 and the second lens component 2 can be mounted on the carrier plate 4 provided with the connecting piece 5 by using the high-precision chip mounter, grooves are not needed to be engraved on the carrier plate 4 in the packaging process so as to enable the first lens component 1 to be arranged in the grooves to be coaxial with the optical chip 3, the process complexity is low, the influence of alignment errors can be avoided, and the packaging yield is high.
It should be noted that, because the second lens assembly 2 can implement the corresponding beam translation function, and the angle between the second lens assembly 2 and the carrier plate 4 during refraction is related to the distance and the position, the first area and the second area can be selected and adjusted according to the requirements and the actual situation, multiple groups of optical chips 3 and the first lens assembly 1 can be further arranged, and the third area can be arranged at any position in the first area and the second area to implement the corresponding function.
It should be noted that, the temporary carrier plate 4 and the connection piece 5 may be disposed in the optical beam expanding system, so as to be used as a temporary component for aligning or aligning each component in the optical beam expanding system in the packaging process, or may be used as a temporary component outside the optical beam expanding system, so as to align or align each component in the optical beam expanding system. After the light transmitting material 6 fixes and encapsulates the components in the light beam expanding system, the carrier plate 4 and the connecting piece 5 inside or outside the light beam expanding system can be removed to obtain the encapsulated light module.
Optionally, the optical chip 3 includes: a substrate layer 301, an insulating layer 302, a waveguide layer 303, and an upper cladding layer 304.
Because of the difficulty and cost of the upper cladding 304 of the optical chip 3, the thickness is usually thin, which is only a few micrometers, and in the prior art, the radius of the beam expanding lens is only smaller than the thickness of the waveguide upper cladding 304, so that the beam expanding lens cannot expand the beam spot size radius to a size exceeding the thickness of the upper cladding 304, and the light beam expanding effect is poor.
In order to reduce the alignment error between the optical chip 3 and the first lens assembly 1 in the second direction perpendicular to the carrier plate 4 and pointing away from the carrier plate 4, the optical chip 3 may be disposed upside down on the first region by using the characteristic that the thickness of the upper cladding 304 in the optical chip 3 is relatively thin and the absolute thickness error is small. The upper cladding layer 304 is connected to the first region by the connection member 5, the waveguide layer 303 is disposed on top of the upper cladding layer 304 in a second direction perpendicular to the carrier plate 4 and pointing away from the carrier plate 4, the waveguide layer 303 is used for outputting an optical waveguide beam, the insulating layer 302 is disposed on top of the waveguide layer 303, the substrate layer 301 is disposed on top of the insulating layer 302, and the first lens diameter D2 may exceed the upper cladding layer thickness D1 to achieve beam expansion of a plurality of beam spot sizes.
Alternatively, the upper cladding 304 of the optical chip 3 may be a dielectric material, or may be vacuum or air.
In addition, the parts in the embodiments of the present application may be integrated together to form a single part, or the parts may exist separately, or two or more parts may be integrated to form a single part.
The foregoing is merely exemplary embodiments of the present application and is not intended to limit the scope of the present application, and various modifications and variations may be suggested to one skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of additional identical elements in a process, article or apparatus that comprises the element.
In the several embodiments provided in this application, it should be understood that the disclosed apparatus may be implemented in other ways. The apparatus embodiments described above are merely illustrative, for example, block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of devices according to various embodiments of the present application. In this regard, each block in the block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams, and combinations of blocks in the block diagrams, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Claims (8)
1. An optical beam expanding system, comprising: the optical chip comprises a first lens assembly, a second lens assembly, an optical chip and a carrier plate;
the optical chip is arranged in a first area on the carrier plate; the first lens component is arranged in a second area corresponding to the first area on the carrier plate; the second lens component is arranged in a third area between the first area and the second area on the carrier plate;
the optical chip is used for outputting an optical waveguide beam;
the second lens component is used for refracting the optical waveguide light beam to obtain an offset light beam, and outputting the offset light beam to the central axis position of the first lens component;
the first lens assembly is used for expanding the beam based on the offset beam so as to output an expanded beam;
the light beam expanding system further comprises a connecting piece, wherein the connecting piece is arranged on the connecting surface of the carrier plate; the optical chip is inversely arranged on the first area through the connecting piece; the first lens component is arranged on the second area through the connecting piece; the second lens component is arranged on the third area through the connecting piece;
the optical chip includes: a substrate layer, an insulating layer, a waveguide layer and an upper cladding layer; the upper cladding is connected with the first area through the connecting piece; the waveguide layer is arranged on the top of the upper cladding layer in a second direction perpendicular to the carrier plate and pointing away from the carrier plate, and the waveguide layer is used for outputting the optical waveguide light beam; the insulating layer is arranged on the top of the waveguide layer, and the substrate layer is arranged on the top of the insulating layer; the first lens diameter exceeds the upper cladding thickness.
2. The light beam expanding system of claim 1, wherein the second lens assembly is parallel proximate a first side of the light chip and the second lens assembly is parallel proximate a second side of the first lens assembly;
the second lens component and the carrier plate form a set included angle, and the set included angle comprises any angle from 0 degree to 180 degrees.
3. The light beam expanding system of claim 2, wherein a light transmissive material is filled between the light chip, the second lens assembly and the first lens assembly;
the light-transmitting material is used for transmitting light beams.
4. The light beam expanding system of claim 3, wherein the refractive index of the light transmissive material is a first refractive index and the refractive index of the second lens assembly is a second refractive index different from the first refractive index.
5. The light beam expanding system of claim 4, wherein the offset beam is determined by the set angle, the first refractive index, the second refractive index, and a lens thickness between the first side and the second side of the second lens assembly to input the offset beam horizontally at the central axis position of the first lens assembly in a first direction parallel to the carrier plane.
6. The optical beam expanding system of claim 5, wherein the beam offset of the offset beam is obtained by:
；
；
；
wherein,for the first refractive index +.>For the second refractive index +.>For an angle of incidence determined on the basis of said set angle, < >>For a refraction angle determined based on said set angle, < >>For the lens thickness +.>For the propagation path length of light in the second lens assembly,/for the second lens assembly>For the beam offset.
7. The light beam expanding system of claim 2, wherein the first side of the second lens assembly is provided with a first anti-reflection film;
the second side of the second lens assembly is provided with a second anti-reflection film.
8. An optoelectronic device comprising the optical beam expanding system according to any one of claims 1-7.
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