CN117055147A - Splitting method of diffraction optical waveguide - Google Patents
Splitting method of diffraction optical waveguide Download PDFInfo
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- CN117055147A CN117055147A CN202311309394.4A CN202311309394A CN117055147A CN 117055147 A CN117055147 A CN 117055147A CN 202311309394 A CN202311309394 A CN 202311309394A CN 117055147 A CN117055147 A CN 117055147A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 138
- 238000000034 method Methods 0.000 title claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 128
- 238000005520 cutting process Methods 0.000 claims abstract description 34
- 230000008569 process Effects 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000000428 dust Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 206010041662 Splinter Diseases 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000003698 laser cutting Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0026—Wavelength selective element, sheet or layer, e.g. filter or grating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a splitting method of a diffraction optical waveguide, which is characterized in that the opening and closing states of each through hole in a substrate are limited, the position of each magnet block is controlled by a control system, so that the magnet block moves to an area which is matched with the diffraction optical waveguide on the substrate, and a negative pressure channel is formed by the magnet block with through holes along the axial direction and the through holes on the substrate, so that cutting or splitting is realized; the method can be applied to cutting or splitting of base materials with different sizes by controlling the position of each magnet block, can be also applied to cutting or splitting of the base materials with the same size and different numbers of diffraction optical waveguides, has good applicability, can improve the stability of cutting or splitting, and has unexpected technical effects; the dust caused by using paper in the cutting process is avoided, the problems of design and replacement of the supporting jig caused by the mold changing in the splitting process are avoided, the design time is greatly shortened, and the cost of the jig is reduced.
Description
Technical Field
The invention relates to the technical field of diffraction optical waveguides, in particular to a splitting method of a diffraction optical waveguide.
Background
In the existing related diffractive optical waveguide splitting technology, different splitting molds are often determined according to the number of diffractive optical waveguides designed on the waveguide, and different molds are required to be replaced according to the actual splitting process, so that more molds are easy to prepare, a certain trouble is caused to the actual work by adapting to different numbers of diffractive optical waveguides, the slicing and/or splitting applicability is improved, the slicing or splitting efficiency is improved, the requirements on the slicing or splitting molds are reduced, and the technical problem which is urgent to be solved is solved for a person skilled in the art.
The invention provides a splitting method of a diffraction optical waveguide, which aims to solve the technical problems existing in the prior art.
Disclosure of Invention
The invention provides a method for splitting a diffraction optical waveguide, which solves the problems in the prior art, reduces the requirements on a slicing or splitting die, improves the stability of slicing or splitting, reduces dust generated in the laser cutting process, can adapt to different numbers of diffraction optical waveguides or different substrate sizes, improves the applicability, and has good economic benefit.
A method of diffracting an optical waveguide fracture comprising the steps of:
1) Providing a substrate, and forming a plurality of through holes on the substrate; a vacuum valve is arranged in a channel of each through hole, each vacuum valve is connected with a control system, and the control system controls the opening and closing states of each vacuum valve; the through holes are all connected with a vacuum negative pressure machine;
2) The method comprises the steps that a plurality of magnet blocks are arranged on the surface of a substrate, the magnet blocks can be adsorbed on the surface of the substrate, each magnet block is connected with a control system, the cross section of each magnet block is matched with the cross section of a diffraction optical waveguide structure, and the magnet blocks are used for supporting the diffraction optical waveguides;
3) Providing a substrate to be fractured, wherein at least one diffraction optical waveguide is arranged on the substrate, and the size of the substrate, the number of the diffraction optical waveguides on the substrate and the area of each diffraction optical waveguide are obtained;
4) Further determining the number of magnet blocks used for supporting the diffraction optical waveguide in the step 2) according to the size of the base material, the number and the area of the diffraction optical waveguide determined in the step 3);
5) Controlling and moving the position of each magnet block determined in the step 4) through the control system, and controlling the position of each magnet block to be matched with the position of the diffraction optical waveguide, namely controlling each magnet block to align with the through hole on the substrate where the diffraction optical waveguide is positioned, so that a negative pressure channel is formed in the through hole and the magnet block;
6) Opening the vacuum valve in the through hole corresponding to the position of each magnet block determined in the step 5), and simultaneously opening a vacuum negative pressure machine;
7) Placing the substrate to be fractured in the step 3) above the position of each magnet block determined in the step 5);
8) Cutting the substrate fixed in step 7), thereby effecting a split;
9) After the splitting is completed, closing the vacuum negative pressure machine, and taking down the diffraction optical waveguide to complete the splitting of the diffraction optical waveguide; in the step 2), the magnet block has a through hole disposed in an axial direction, and a diameter of the through hole is larger than a diameter of the through hole in the step 1).
Further, in the step 1), vacuum valves in the through-hole passages are closed before the subsequent steps are performed.
Further, in the step 1), a plurality of the via arrays may be defined to be sequentially or randomly disposed in the substrate.
Further, the cross-sectional area of the magnet block is smaller than the area of the diffractive optical waveguide.
Alternatively, the substrate in step 3) may be 6 inches, 8 inches, 12 inches; the number of the diffractive optical waveguides is at least 1. The size of the obtained substrate, the number of the diffractive optical waveguides on the substrate, and the area of each diffractive optical waveguide in the step 3) are specifically defined as: the method comprises the steps of obtaining an image of a substrate through a CCD system, and calculating and obtaining the size of the substrate, the number of the diffraction optical waveguides on the substrate and the area of each diffraction optical waveguide or identifying the mark on the surface of the substrate, wherein the mark records the related information of the size of the substrate, the number of the diffraction optical waveguides on the substrate and the area of each diffraction optical waveguide.
Further, in the step 4), the determining the number of the magnet blocks for supporting the diffractive optical waveguide in the step 2) includes the specific steps of: dividing the area of each diffraction optical waveguide in the step 3) by the cross-sectional area of the magnet blocks, and then taking an integer to obtain the number of the magnet blocks.
Still further alternatively, the number of the magnet blocks supporting the diffractive optical waveguide is 1.
Optionally, in step 5), the number of magnet pieces adapted to each of said diffractive optical waveguide areas is at least 1.
In step 6), the vacuum valve in the through hole corresponding to the position of each magnet block determined in step 5) is opened, and the vacuum valve in the through hole channel outside the area where each magnet block is located is kept in a closed state, so that the vacuum air pressure in the partial area is prevented from damaging the structure of the substrate.
Further, in step 8), before the splitting is implemented, a slicing process is further included, and by adjusting the position and the laser power of the laser, the substrate to be split is sliced first, and then the splitting operation is performed.
Further, in step 8), the substrate fixed in the cutting step 7) is specifically defined as: acquiring an image of a substrate or identifying a mark on the surface of the substrate by the CCD system in the step 3), and determining cutting tracks and reference lines of different positions of the substrate according to the image or the mark, wherein the cutting tracks are defined as tracks formed by each diffraction optical waveguide contour line; the reference line is defined as a laser travel path formed outside the diffractive optical waveguide for dividing the diffractive optical waveguide between the sheets.
Further, the laser emitted by the laser cutting machine firstly forms different divided subareas along the path of the datum line, and the laser emitted by the laser cutting machine again travels along the cutting tracks of different diffraction optical waveguides in each divided subarea to form the cut diffraction optical waveguides.
Further, after the step 9), the method further includes a judging process for splitting the subsequent substrate, when it is judged that the subsequent substrate is different from the substrate in size or the number of the diffraction optical waveguides on the same substrate when the splitting is completed in the previous step, the position of each magnet block in the previous step is controlled by the control system, so that each magnet block is restored to the original position, and the steps 3) to 9) are repeated, so that splitting of the substrates in different sizes or splitting of the diffraction optical waveguides in different numbers on the same substrate are realized.
The invention provides a cutting method of a diffraction optical waveguide, which is characterized in that the opening and closing states of each through hole in a substrate are limited, the position of each magnet block is controlled by a control system, so that the magnet block moves to an area which is suitable for the diffraction optical waveguide on the substrate, and a negative pressure channel is formed by the magnet block with a through hole arranged along the axial direction and the through hole on the substrate, so that cutting or splitting is realized; the method can be applied to cutting or splitting of base materials with different sizes by controlling the position of each magnet block, can be also applied to cutting or splitting of the base materials with the same size and different numbers of diffraction optical waveguides, has good applicability, can improve the stability of cutting or splitting, and has unexpected technical effects; the problems of dust caused by using paper in the cutting process and frequent replacement of the paper (the paper is used in the prior art to prevent scratch and the thermal influence of high temperature of laser on a carrying platform) are avoided, and meanwhile, the paper is easy to take and place; the problems of redesign and replacement of the supporting jig caused by the mold change in the splitting process are avoided, the design time is greatly shortened, and the cost of the jig is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed in the description of the embodiments will be briefly described below, it will be apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art;
FIG. 1 is a schematic diagram of a diffractive optical waveguide splinter structure according to the present invention;
FIG. 2 is a schematic diagram II of a diffractive optical waveguide splinter structure according to the present invention;
FIG. 3 is a schematic diagram of a diffractive optical waveguide substrate structure according to the present invention;
FIG. 4 is a schematic diagram III of a diffractive optical waveguide splinter structure according to the present invention;
FIG. 5 is a schematic cross-sectional view of a diffractive optical waveguide splinter structure provided by the present invention;
FIG. 6 is a flow chart of a method for splitting a diffractive optical waveguide provided by the present invention;
the attached drawings are identified:
100: a diffractive optical waveguide splinter structure; 10: a substrate; 11: a through hole; 12: a magnet block;
200: a diffractive optical waveguide substrate structure; 20: a substrate; 30: a diffractive optical waveguide; 301: a contour line; 201: a reference line; 40, identification.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
A method of diffractive optical waveguide splintering, as shown in fig. 1, provides a schematic diagram of a diffractive optical waveguide splinter structure 100 comprising a substrate 10 and a plurality of magnet blocks 12, comprising the steps of:
1) Providing a substrate 10, and forming a plurality of through holes 11 on the substrate 10; a vacuum valve (not shown in the figure) is arranged in the passage of each through hole 11, each vacuum valve is connected with a control system (not shown in the figure), and the opening and closing states of each vacuum valve are controlled by the control system; the through holes 11 are all connected with a vacuum negative pressure machine;
as shown in fig. 1, the array of through holes 11 is orderly arranged in the substrate 10, and it is known that the through holes may be orderly arranged in the substrate 10, and the number of the through holes 11 is not limited in the present invention.
2) A plurality of magnet blocks 12 are arranged on the surface of the substrate 10, the magnet blocks 12 can be adsorbed on the surface of the substrate 10, each magnet block 12 is connected with a control system (not shown in the figure), the cross section of each magnet block 12 is matched with the cross section of the diffraction optical waveguide structure, and the magnet blocks 12 are used for supporting the diffraction optical waveguide;
as shown in fig. 1 and 4, only 6 magnet blocks 12 are shown, although it will be appreciated that the number of magnet blocks may be adjusted based on the number of diffractive optical waveguides in different substrates, such as 4, 8, etc.
In fig. 1, 2 and 4, the magnet block 12 may have through holes disposed in the axial direction, the diameter of the through holes being larger than that of the through holes in the step 1), but the invention is not limited to the number of the through holes disposed in the axial direction, and may be a hollow cylinder structure formed by 1 through hole disposed in the axial direction or a honeycomb structure formed by a plurality of through holes, so long as a negative pressure channel can be formed between the through holes and the substrate; further, the cross section of the magnet block 12 is matched with the cross section of the diffraction optical waveguide 30, namely, the cross section of the magnet block 12 is limited to be smaller than the cross section of the diffraction optical waveguide 30, the top of the magnet block 12 is tightly attached to one side of the diffraction optical waveguide 30, and the functions of supporting the base material and adsorbing the base material are realized through the negative pressure function of the through holes.
3) Providing a substrate 20 to be fractured, wherein at least one diffraction optical waveguide 30 is arranged on the substrate 20, and the size of the substrate, the number of the diffraction optical waveguides on the substrate and the area of the diffraction optical waveguides are obtained;
specifically, as shown in fig. 3, the diffractive optical waveguide substrate structure 200 includes a substrate 20, and the substrate is made of glass, lithium niobate, ceramic, or the like, and at least one diffractive optical waveguide 30 is disposed on the substrate 20, which includes 4 diffractive optical waveguides, and it is known that those skilled in the art can define 1 to 8 diffractive optical waveguides, or even more, and the present invention is not limited thereto.
With continued reference to fig. 3, each piece of diffractive optical waveguide comprises a contour line 301, i.e. in step 8, the contour line 301 of the diffractive optical waveguide acts as a cut track, i.e. the cut track is defined as the track formed by the contour lines of each piece of diffractive optical waveguide; the laser travels along the cutting track to effect a slicing or splintering operation.
Further, the image information of the substrate 20 is obtained by a CCD system (not shown), and the size of the substrate 20, the number of the diffraction optical waveguides 30 on the substrate, and the area S of each diffraction optical waveguide are calculated according to the image; or the mark 40 on the surface of the substrate 20 is identified and acquired by a scanner (not shown), the mark 40 records the related information of the substrate, such as the size of the substrate, the number of the diffraction optical waveguides, the area S of each diffraction optical waveguide, the thickness of the substrate, and the like, and can be set according to the related requirements of slicing and/or splitting, and the invention is not limited herein.
In some embodiments, as shown in fig. 3, the number of the diffractive optical waveguides 30 in the substrate 20 is determined according to the image information of the substrate 20 acquired by the CCD system or through the mark 40, and the cutting tracks and the reference line 201 at different positions of the substrate 20 are determined according to the number of the diffractive optical waveguides 30 and the cutting process requirements, wherein the cutting tracks are defined as tracks formed by the contour lines 301 of each piece of the diffractive optical waveguides 30; the reference line 201 is defined as a laser travel path formed outside each of the diffraction optical waveguides 30 and dividing the diffraction optical waveguides 30 into pieces, for example, the laser travel path may be formed so as not to pass through the diffraction optical waveguides, and may be formed so as to be staggered in the transverse and longitudinal directions around the diffraction optical waveguides, as is apparent from the arrangement of the diffraction optical waveguides 30 in fig. 3;
4) Further determining the number of magnet blocks used for supporting the diffraction optical waveguide in the step 2) according to the size of the base material, the number and the area of the diffraction optical waveguide determined in the step 3);
dividing the area of each diffraction optical waveguide in the step 3) by the cross-sectional area of the magnet blocks, and then taking an integer to obtain the number of the magnet blocks, wherein the number of the magnet blocks supporting each diffraction optical waveguide is not more than 3.
As shown in fig. 4, the number of only one magnet piece is shown to be included under each piece of diffraction optical waveguide, of course, it is known that a plurality of magnet pieces, such as 2 or 3, may be included under each piece of diffraction optical waveguide depending on the area size of the different diffraction optical waveguides and the cross-sectional area of the magnet pieces.
5) Controlling and moving the position of each magnet block determined in the step 4) through the control system, and controlling the position of each magnet block to be matched with the position of the diffraction optical waveguide, namely controlling the through hole on the substrate at the position of each magnet block to Ji Yanshe optical waveguide, so that a negative pressure channel is formed in the through hole and the magnet block;
when determining a certain substrate 20, controlling the number and the positions of the moving magnet blocks 12 in each area through a control system according to the number of the required magnet blocks 12, respectively moving a certain magnet block 12 in each of four quadrants as shown in fig. 2, controlling the moving positions so that the position of each magnet block 12 can be positioned in the area of the diffraction optical waveguide, raising the height of a split, and controlling the alignment of each magnet block with the through hole on the substrate in the area so as to form a negative pressure channel in the through hole and the magnet block; as shown in fig. 4, thereby enabling the preparation of slices and/or splits.
6) Opening the vacuum valve in the through hole corresponding to the position of each magnet block determined in the step 5), and simultaneously opening a vacuum negative pressure machine;
as shown in fig. 4, the vacuum valve in the through hole under each magnet block 12 is controlled to be in an open state, and simultaneously the vacuum valve in the through hole channel outside the area where each magnet block 12 is located is controlled to be kept in a closed state, so that the vacuum pressure in the partial area is prevented from damaging the structure of the substrate, and the vacuum negative pressure machine is opened to realize the integral adsorption of the substrate.
7) Placing the substrate to be fractured in the step 3) above the position of each magnet block determined in the step 5);
as shown in fig. 4, the substrate to be fractured is placed in the region where the magnet pieces have been provided, and the next step is performed.
8) Cutting the substrate fixed in step 7), thereby effecting a split;
in the process of splitting, according to the setting of the control system, the laser is preferentially made to travel along the datum line 201 to form different subareas, then the laser is controlled to cut along the cutting track, and the different subareas are switched, so that splitting can be realized.
Further, in step 8), before the splitting is implemented, a slicing process is further included, and by adjusting the position and the laser power of the laser, the substrate to be split is sliced first, and then the splitting operation is performed. Firstly, cutting the substrate fixed in the step 7) to realize slicing operation; and then adjusting the laser power and/or the laser position, and cutting the substrate in the previous step, thereby realizing the splitting operation.
9) After the splitting is completed, closing the vacuum negative pressure machine, and taking down the diffraction optical waveguide to complete the splitting of the diffraction optical waveguide;
specifically, after slicing or splitting is completed, the vacuum negative pressure machine used in the splitting process is closed, and the diffraction optical waveguide 20 is taken down, so that the splitting process of the whole diffraction optical waveguide is completed;
further, after the step 9), the method further includes a judging process for splitting the subsequent substrate, when it is judged that the subsequent substrate is different from the substrate in size or the number of the diffraction optical waveguides on the same substrate when the splitting is completed in the previous step, the position of each magnet block in the previous step is controlled by the control system, so that each magnet block is restored to the original position, and the steps 3) to 9) are repeated, so that splitting of the substrates in different sizes or splitting of the diffraction optical waveguides in different numbers on the same substrate are realized.
Specifically, after slicing or splitting of the diffractive optical waveguide in the previous process is completed, before the next process is performed, whether the sizes of the subsequent substrate and the substrate completed in the previous process are the same, or whether the number of the diffractive optical waveguides is the same when the sizes are the same is determined, and based on the different sizes of the substrates or the different numbers of the diffractive optical waveguides, the steps 3) to 9) can be repeated, so that splitting operations of the different sizes of the substrates or the different numbers of the diffractive optical waveguides in the substrates are realized.
As shown in fig. 5, which is a schematic cross-sectional view of a substrate structure of a diffractive optical waveguide chip provided by the present invention, based on the foregoing steps, the position of the magnet block 12 is moved, and a substrate is placed on the moving magnet block in preparation for chip or slice.
Fig. 6 is a flowchart of a splitting method of a diffractive optical waveguide according to the present invention.
The invention provides a cutting method of a diffraction optical waveguide, which is characterized in that the opening and closing states of each through hole in a substrate are limited, the position of each magnet block is controlled by a control system, so that the magnet block moves to an area which is suitable for the diffraction optical waveguide on the substrate, and a negative pressure channel is formed by the magnet block with a through hole arranged along the axial direction and the through hole on the substrate, so that cutting splinters are realized; the method can be applied to cutting and splitting of base materials with different sizes by controlling the position of each magnet block, can be also applied to cutting or splitting of the base materials with the same size and different numbers of diffraction optical waveguides, has good applicability, can improve the stability of cutting or splitting, and has unexpected technical effects; the problems of dust caused by using paper in the cutting process and frequent replacement of the paper (the paper is used in the prior art to prevent scratch and the thermal influence of high temperature of laser on a carrying platform) are avoided, and meanwhile, the paper is easy to take and place; the problems of redesign and replacement of the supporting jig caused by the mold change in the splitting process are avoided, the design time is greatly shortened, and the cost of the jig is reduced.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (8)
1. A method of splitting a diffractive optical waveguide, the method comprising the steps of:
1) Providing a substrate, and forming a plurality of through holes on the substrate; a vacuum valve is arranged in a channel of each through hole, each vacuum valve is connected with a control system, and the control system controls the opening and closing states of each vacuum valve; the through holes are all connected with a vacuum negative pressure machine;
2) The method comprises the steps that a plurality of magnet blocks are arranged on the surface of a substrate, the magnet blocks can be adsorbed on the surface of the substrate, each magnet block is connected with a control system, the cross section of each magnet block is matched with the cross section of a diffraction optical waveguide structure, and the magnet blocks are used for supporting the diffraction optical waveguides;
3) Providing a substrate to be fractured, wherein at least one diffraction optical waveguide is arranged on the substrate, and the size of the substrate, the number of the diffraction optical waveguides on the substrate and the area of each diffraction optical waveguide are obtained;
4) Further determining the number of magnet blocks used for supporting the diffraction optical waveguide in the step 2) according to the size of the base material, the number and the area of the diffraction optical waveguide determined in the step 3);
5) Controlling and moving the position of each magnet block determined in the step 4) through the control system, and controlling the position of each magnet block to be matched with the position of the diffraction optical waveguide, namely controlling each magnet block to align with the through hole on the substrate where the diffraction optical waveguide is positioned, so that a negative pressure channel is formed in the through hole and the magnet block;
6) Opening the vacuum valve in the through hole corresponding to the position of each magnet block determined in the step 5), and simultaneously opening a vacuum negative pressure machine;
7) Placing the substrate to be fractured in the step 3) above the position of each magnet block determined in the step 5);
8) Cutting the substrate fixed in step 7), thereby effecting a split;
9) After the splitting is completed, closing the vacuum negative pressure machine, and taking down the diffraction optical waveguide to complete the splitting of the diffraction optical waveguide;
in the step 2), the magnet block has a through hole disposed in an axial direction, and a diameter of the through hole is larger than a diameter of the through hole in the step 1).
2. The method according to claim 1, wherein the size of the substrate, the number of the diffractive optical waveguides on the substrate, and the area of each of the diffractive optical waveguides obtained in the step 3) are specifically defined as: and acquiring an image of the substrate through a CCD system, and calculating to obtain the size of the substrate, the number of the diffraction optical waveguides on the substrate and the area of each diffraction optical waveguide or identifying the mark on the surface of the substrate, wherein the mark records the related information of the size of the substrate, the number of the diffraction optical waveguides on the substrate and the area of each diffraction optical waveguide.
3. The method according to claim 1 or 2, wherein in the step 4), the determining the number of magnet blocks for supporting the diffractive optical waveguide in the step 2) comprises the specific steps of: dividing the area of each diffraction optical waveguide in the step 3) by the cross-sectional area of the magnet blocks, and then taking an integer to obtain the number of the magnet blocks.
4. The method according to claim 1, wherein in step 6), the vacuum valve in the through hole corresponding to the position of each magnet block determined in step 5) is opened, and the vacuum valve in the through hole channel outside the area where each magnet block is located is kept closed.
5. The method according to claim 1, wherein in step 8), before the splitting is performed, the method further comprises a slicing process, wherein the substrate to be split is sliced first and then split is performed by adjusting the position and the laser power of the laser.
6. The method according to claim 2, characterized in that in step 8) the substrate fixed in the cutting step 7) is defined in particular as: acquiring an image of a substrate or identifying a mark on the surface of the substrate by the CCD system in the step 3), and determining cutting tracks and reference lines at different positions of the substrate according to the image or the mark, wherein the cutting tracks are defined as tracks formed by each diffraction optical waveguide contour line; the reference line is defined as a laser travel path formed outside the diffractive optical waveguide and dividing the diffractive optical waveguide into pieces.
7. The method of claim 6, further comprising, in step 8), first forming different segmented sub-regions along the path of the fiducial line with laser light emitted by a laser cutter, and, in each segmented sub-region, again forming a cut diffractive optical waveguide with laser light emitted by the laser cutter along the cut trajectory of a different diffractive optical waveguide.
8. The method of claim 1, further comprising, after the step 9), a determination process for splitting a subsequent substrate, wherein when it is determined that the subsequent substrate is different from the size of the substrate when the splitting has been completed in the previous step or the number of the diffractive optical waveguides on the same substrate is different, the position of each magnet block in the previous step is controlled by the control system so that each magnet block is restored to the original position, and steps 3) to 9) are repeated, thereby realizing splitting of the substrates of different sizes or splitting of the diffractive optical waveguides of different numbers on the same substrate.
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105643819A (en) * | 2016-03-18 | 2016-06-08 | 武汉华工激光工程有限责任公司 | Sapphire wafer cracking device and method based on laser scribing process |
| US20200363583A1 (en) * | 2019-05-16 | 2020-11-19 | Corning Research & Development Corporation | Methods of singulating optical waveguide sheets to form optical waveguide substrates |
| CN110563320A (en) * | 2019-09-26 | 2019-12-13 | 深圳市韵腾激光科技有限公司 | Laser large-breadth glass cutting and splitting device |
| CN212793533U (en) * | 2020-04-13 | 2021-03-26 | 深圳市大族数控科技股份有限公司 | Galvanometer correcting plate clamping table |
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