CN117039603A - Laser radar packaging structure and forming method thereof - Google Patents

Laser radar packaging structure and forming method thereof Download PDF

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Publication number
CN117039603A
CN117039603A CN202310930633.1A CN202310930633A CN117039603A CN 117039603 A CN117039603 A CN 117039603A CN 202310930633 A CN202310930633 A CN 202310930633A CN 117039603 A CN117039603 A CN 117039603A
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CN
China
Prior art keywords
light
substrate
cavity
convex lens
laser chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310930633.1A
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Chinese (zh)
Inventor
杨先方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN202310930633.1A priority Critical patent/CN117039603A/en
Publication of CN117039603A publication Critical patent/CN117039603A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4817—Constructional features, e.g. arrangements of optical elements relating to scanning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips

Abstract

A lidar package structure and a method of forming the same, the lidar package structure comprising: a substrate including opposed upper and lower surfaces; the laser chip is attached to the upper surface of the substrate, the laser chip is electrically connected with the substrate, and a light emitting area is formed on one surface of the laser chip, which is not contacted with the upper surface of the substrate; a plastic sealing layer which is positioned on the upper surface of the substrate and surrounds the laser chip, wherein a cavity exposing the light-emitting area of the laser chip is arranged in the plastic sealing layer; and the convex lens is attached to the surface of the inner side wall of the cavity, is positioned above the light-emitting area and seals the opening of the cavity. The convex lens can enable the scanning range of laser or laser beams emitted outwards (or towards a target) from the light emitting area of the laser chip to be larger, and the working performance of the laser radar is improved.

Description

Laser radar packaging structure and forming method thereof
Technical Field
The application relates to the field of laser radar packaging, in particular to a laser radar packaging structure and a forming method thereof.
Background
Laser Radar (Laser Radar), which is a Radar system for detecting characteristic quantities such as the position, the speed and the like of a target by emitting Laser beams, is widely applied to the fields of intelligent driving, unmanned aerial vehicles, military industry and the like. The working principle of the laser radar is that a detection signal (laser beam) is emitted to a target, then a received signal (target echo) reflected from the target is compared with the emitted detection signal, and relevant information of the target, such as parameters of the distance, the azimuth, the height, the speed, the gesture, even the shape and the like of the target, can be obtained after corresponding processing.
Existing lidar packaging structures generally include: a substrate; the laser chip is attached to the substrate, and the surface of the laser chip is provided with a luminous area; the packaging body is positioned on the surface of the substrate and is provided with a cavity exposing the light emitting area of the laser chip; and the light-transmitting glass sheet is positioned on the surface of the package body and seals the cavity opening.
However, the laser radar packaging structure has limited scanning range, which affects the working performance.
Disclosure of Invention
Some embodiments of the present application provide a laser radar package structure, including:
a substrate including opposed upper and lower surfaces;
the laser chip is attached to the upper surface of the substrate, the laser chip is electrically connected with the substrate, and a light emitting area is formed on one surface of the laser chip, which is not contacted with the upper surface of the substrate;
a plastic sealing layer which is positioned on the upper surface of the substrate and surrounds the laser chip, wherein a cavity exposing the light-emitting area of the laser chip is arranged in the plastic sealing layer;
and the convex lens is attached to the surface of the inner side wall of the cavity, is positioned above the light-emitting area and seals the opening of the cavity.
In some embodiments, a perpendicular distance between a surface of the light emitting region and an optical center of the convex lens is less than or equal to a focal length of the convex lens.
In some embodiments, a perpendicular distance between an upper surface of the plastic layer and an optical center of the convex lens is less than a focal length of the convex lens.
In some embodiments, the convex lens comprises a light-transmitting part and a supporting part positioned at the periphery of the light-transmitting part and connected with the light-transmitting part, the supporting part is attached to the surface of the inner side wall of the cavity, and the light-transmitting part is suspended above the light-emitting area.
In some embodiments, the upper and lower surfaces of the light-transmitting portion are convex arcuate surfaces, and the size of the light-transmitting portion is greater than the size of the light-emitting region.
In some embodiments, the support is attached to an inner sidewall surface of the cavity by an adhesive.
In some embodiments, the cavity comprises a first portion and a second portion in communication, the first portion being located above the second portion and the first portion having a width greater than the width of the second portion, the inner side wall of the first portion comprising a side surface and a bottom surface connected to the bottom of the side surface, the bottom surface being sloped upward; the supporting part comprises an outer side surface and a lower surface connected with the bottom of the outer side surface, the lower surface is inclined upwards, the outer side surface of the supporting part is attached to the side surface of the first part, and the lower surface of the supporting part is attached to the bottom surface of the first part.
In some embodiments, the bottom surface of the first portion is inclined at the same angle as the bottom surface of the support portion.
In some embodiments, further comprising: the control chip and/or the passive device is/are attached to the upper surface of the substrate and electrically connected with the substrate; and an external protrusion on the lower surface of the substrate.
Some embodiments of the present application further provide a method for forming a laser radar package structure, including:
providing a substrate comprising opposing upper and lower surfaces;
providing a laser chip, mounting the laser chip on the upper surface of the substrate, electrically connecting the laser chip with the substrate, and providing a light-emitting area on one surface of the laser chip, which is not contacted with the upper surface of the substrate;
forming a plastic sealing layer surrounding the laser chip on the upper surface of the substrate, wherein a cavity exposing a light emitting area of the laser chip is formed in the plastic sealing layer;
providing a convex lens, attaching the convex lens on the surface of the inner side wall of the cavity, wherein the convex lens is positioned above the light emitting area and seals the opening of the cavity.
In some embodiments, a perpendicular distance between a surface of the light emitting region and an optical center of the convex lens is less than or equal to a focal length of the convex lens; the vertical distance between the upper surface of the plastic layer and the optical center of the convex lens is smaller than the focal length of the convex lens.
In some embodiments, the convex lens comprises a light-transmitting part and a supporting part positioned at the periphery of the light-transmitting part and connected with the light-transmitting part, the supporting part is attached to the surface of the inner side wall of the cavity, and the light-transmitting part is suspended above the light-emitting area; the upper surface and the lower surface of the light-transmitting part are raised arc-shaped surfaces, and the size of the light-transmitting part is larger than that of the light-emitting area.
In some embodiments, the support is attached to an inner sidewall surface of the cavity by an adhesive.
In some embodiments, the cavity comprises a first portion and a second portion in communication, the first portion being located above the second portion and the first portion having a width greater than the width of the second portion, the inner side wall of the first portion comprising a side surface and a bottom surface connected to the bottom of the side surface, the bottom surface being sloped upward; the supporting part comprises an outer side surface and a lower surface connected with the bottom of the outer side surface, the lower surface is inclined upwards, the outer side surface of the supporting part is attached to the side surface of the first part, and the lower surface of the supporting part is attached to the bottom surface of the first part.
In some embodiments, the bottom surface of the first portion is inclined at the same angle as the bottom surface of the support portion.
In some embodiments, further comprising: mounting a control chip and/or a passive device on the upper surface of the substrate, wherein the control chip and/or the passive device are electrically connected with the substrate; forming external connection bulges on the lower surface of the substrate
The laser radar packaging structure and the forming method thereof in the foregoing embodiments of the present application include: a substrate including opposed upper and lower surfaces; the laser chip is attached to the upper surface of the substrate, the laser chip is electrically connected with the substrate, and a light emitting area is formed on one surface of the laser chip, which is not contacted with the upper surface of the substrate; a plastic sealing layer which is positioned on the upper surface of the substrate and surrounds the laser chip, wherein a cavity exposing the light-emitting area of the laser chip is arranged in the plastic sealing layer; and the convex lens is attached to the surface of the inner side wall of the cavity, is positioned above the light-emitting area and seals the opening of the cavity. The convex lens is attached to the surface of the inner side wall of the cavity and is located above the light-emitting area, so that the overall thickness of the packaging structure can be thinned, a cavity between the convex lens and the light-emitting area is reduced, the air pressure in the cavity is reduced, the convex lens is prevented from being shifted or flushed out of the cavity due to overlarge pressure in the cavity, and compared with a planar light-transmitting glass plate, the convex lens can enable the light-emitting area of the laser chip to emit laser or laser beams to be larger in scanning range, and the working performance of the laser radar is improved.
Further, in some embodiments, the cavity includes a first portion and a second portion in communication, the first portion being located above the second portion and the first portion having a width greater than a width of the second portion, the inner sidewall of the first portion including a side surface and a bottom surface connected to a bottom of the side surface, the bottom surface being sloped upward; the convex lens comprises a light-transmitting part and a supporting part, wherein the supporting part is positioned at the periphery of the light-transmitting part and connected with the light-transmitting part, the supporting part of the convex lens comprises an outer side surface and a lower surface connected with the bottom of the outer side surface, the lower surface is inclined upwards, the outer side surface of the supporting part is attached to the side surface of the first part of the cavity, and the lower surface of the supporting part is attached to the bottom surface of the first part of the cavity. Because the bottom surface of the first part of the cavity is inclined upwards, the lower surface of the supporting part of the corresponding convex lens is inclined upwards, so that the contact area between the supporting part of the convex lens and the first part of the cavity is increased, the adhesive force between the convex lens and the side wall of the cavity is improved, and the convex lens is prevented from being shifted or flushed out of the cavity under the action of pressure difference when the pressure difference exists between the inside and the outside of the cavity of the laser radar; and, because the convex lens is fixed through the adhesive with the lateral wall of cavity, when carrying out the dress of convex lens, because the bottom surface of the first part of cavity is upwards slope, therefore the adhesive is difficult to spill over on the functional surface of laser chip.
Drawings
Fig. 1-6 are schematic structural diagrams illustrating a process for forming a radar package according to some embodiments of the present application.
Detailed Description
The following describes the embodiments of the present application in detail with reference to the drawings. In describing embodiments of the present application in detail, the schematic drawings are not necessarily to scale and are merely illustrative and should not be taken as limiting the scope of the application. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
Some embodiments of the present application provide a method for forming a lidar package structure, which is described in detail below with reference to the accompanying drawings.
Referring to fig. 1, a substrate 101 is provided, the substrate 101 including opposite upper and lower surfaces; a laser chip 201 is provided, the laser chip 201 is mounted on the upper surface of the substrate 101, the laser chip 201 is electrically connected with the substrate 101, and a surface of the laser chip 201, which is not contacted with the upper surface of the substrate 101, is provided with a light emitting region 203.
The substrate 101 serves as a carrier for subsequent processes. The substrate 101 includes opposite upper and lower surfaces, the upper surface of the substrate 101 may have a plurality of first pads (not shown in the drawing) and the lower surface of the substrate may have a plurality of second pads (not shown in the drawing), and the substrate 101 may have a first line (not shown in the drawing) connected to the first and second pads, and the first line may include one or more of a metal line, a metal plug, a via connection structure, and a via connection structure. In some embodiments, the materials of the first pad, the second pad and the first line are metal, and may specifically be one or several of Al, cu, ag, au, pt, ni, ti, tiN, taN, ta, taC, taSiN, W, WN, WSi.
In some embodiments, the substrate 101 may be one of a resin substrate, a ceramic substrate, a glass substrate, a silicon substrate, a metal substrate, a Printed Circuit Board (PCB), or a flexible circuit board (FPC). In some embodiments, the substrate 101 may also be a single layer board or a multi-layer board.
In one embodiment, the laser chip 201 is used only to emit a laser or laser beam for detection outwards (or towards a target). In other embodiments, the laser chip 201 is used to emit a laser or laser beam for detection out of (or towards) the target, and also to receive signals reflected back from the target. In an embodiment, the laser chip 201 includes opposite functional surfaces and a back surface, the back surface of the laser chip 201 is attached to the upper surface of the substrate 101, the functional surface of the laser chip 201 has a light emitting area 203, and the light emitting area 203 is used for emitting laser or laser beam for detection outwards (or towards a target). An external bonding pad (not shown in the figure) is further provided on the functional surface of the laser chip 201, and the external bonding pad is used for transmitting an externally input electric signal into the laser chip 201 and transmitting an internal electric signal generated by the laser chip out of the laser chip. The external bonding pad of the laser chip 201 may be electrically connected to the substrate 101 (a portion of the first bonding pad electrically connected to the upper surface of the substrate 101) through a metal lead 205. In some embodiments, the material of the external bonding pad is one or more of Al, cu, ag, au, pt, ni, ti, tiN, taN, ta, taC, taSiN, W, WN, WSi. The material of the metal lead 205 may be one or more of gold, aluminum, copper, silver, nickel, and palladium.
In other embodiments, the functional surface of the laser chip 201 may further have a receiving area (not shown in the figure), where the receiving area is used to receive the signal reflected by the target. In other embodiments, a receiving chip (not shown in the drawing) is mounted on the upper surface of the substrate 101, where a surface of the receiving chip, which is not in contact with the upper surface of the substrate 101, has a receiving area, and the receiving area of the receiving chip is used for receiving a signal reflected by a target after the laser chip 201 emits a laser beam or a laser beam for detection to the target.
In some embodiments, the back surface of the laser chip 201 is attached to the upper surface of the substrate 101 by an adhesive layer 204.
In some embodiments, further comprising: the control chip 202 and/or the passive device 207 are mounted on the upper surface of the substrate 101, and the control chip 202 and/or the passive device 207 are electrically connected with the substrate 101, specifically, one of the control chip 202 and the passive device 207 can be mounted on the upper surface of the substrate 101, or the control chip 202 and the passive device 207 can be mounted on the upper surface of the substrate 101 at the same time. In some embodiments, the control chip 202 is configured to provide control signals to the laser chip 201 to control and/or drive the operation of the laser chip 201. The control chip 202 may be flip-chip mounted on the upper surface of the substrate 101, and specifically, the bump 206 on the control chip 202 is soldered to a portion of the first bonding pad on the upper surface of the substrate 101. In some embodiments, the passive device 207 may be one or several of a resistor, a capacitor, and an inductor, and a pin of the passive device 207 is soldered with a portion of the first pad on the upper surface of the substrate 101.
Referring to fig. 2, a molding layer 102 surrounding the laser chip 201 is formed on the upper surface of the substrate 101, and the molding layer 102 has a cavity 103 therein exposing a light emitting region 203 of the laser chip 201.
The plastic layer 102 is used for plastic packaging the upper surface of the substrate 101 and the side wall surface of the laser chip 201, and the plastic layer 102 is also used for forming a cavity for subsequently mounting the convex lens suspended on the light emitting area 203.
In some embodiments, the material of the plastic layer 102 may be epoxy resin, polyimide resin, benzocyclobutene resin, or polybenzoxazole resin; or may be polybutylene terephthalate, polycarbonate, polyethylene terephthalate, polyethylene, polypropylene, polyolefin, polyurethane, polyolefin, polyethersulfone, polyamide, polyurethane, ethylene-vinyl acetate copolymer or polyvinyl alcohol.
In some embodiments, the forming process of the plastic layer 102 includes an injection molding process or a transfer molding process.
In some embodiments, the plastic layer 102 may cover a part of the functional surface around the light emitting area 203 of the laser chip 201 in addition to the upper surface of the substrate 101 (including covering the control chip 202 and/or the passive device 207 mounted on the upper surface of the substrate 101) and the side wall surface of the laser chip 201, so as to improve the adhesion between the plastic layer 102 and the laser chip 201 and the substrate 101, thereby preventing the cavity 103 in the plastic layer 102 from being deformed and improving the precision of the convex lens mounted later.
The convex lens is mounted on the inner side wall of the cavity 103, so as to reduce the thickness of the package structure and improve the scanning range of the laser or the laser beam emitted by the laser radar.
In some embodiments, the cavity 103 includes a first portion 11 and a second portion 12 that are connected, where the first portion 11 is located above the second portion 12, and the width of the first portion 11 is greater than that of the second portion 12, the inner side wall of the first portion 11 includes a side 14 and a bottom 13 connected to the bottom of the side 14, and the bottom 13 is inclined upward, and when the convex lens 301 (refer to fig. 4) is subsequently attached to the first portion of the cavity 103, since the bottom 13 of the first portion 11 is inclined upward, the contact area between the convex lens 301 and the side wall of the cavity 103 is increased, so that the adhesion between the convex lens 301 and the side wall of the cavity 103 is improved, and thus, when a pressure difference exists inside and outside the cavity 103 of the laser radar, the convex lens 301 is prevented from being displaced or flushed out of the cavity under the pressure difference; in addition, since the convex lens 301 and the side wall of the cavity 103 are fixed by the adhesive 304 (refer to fig. 4), the adhesive 304 is not likely to overflow onto the functional surface of the laser chip 201 because the bottom surface 13 of the first portion 11 is inclined upward when the convex lens is mounted. In some embodiments, the side 14 of the first portion 11 may be a vertical side or an inclined side, and when the side 14 of the first portion 11 is an inclined side, the side 14 may be inclined inside or outside the opening of the cavity.
In other embodiments, the inner sidewall of the cavity may be a vertical sidewall or an inclined sidewall.
In some embodiments, the vertical distance between the upper surface of the plastic sealing layer 102 and the optical center of the convex lens 301 (refer to fig. 4) mounted later is smaller than the focal length of the convex lens 301, so that the plastic sealing layer 102 does not block the laser or the laser beam emitted outwards (or towards the target) by the light emitting area 203 of the laser chip 201, and the scanning range of the laser radar is further improved.
In other embodiments, when the functional surface of the laser chip 201 further has a receiving area (not shown), the cavity 103 further exposes the receiving area (not shown). In other embodiments, when the receiving chip (not shown in the figure) is further attached to the upper surface of the substrate 101, the plastic layer 102 further has a second cavity (not shown in the figure) exposing the receiving area of the contact chip.
Referring to fig. 3 and 4, a convex lens 301 is provided, the convex lens 301 is attached on the inner side wall surface of the cavity 103, the convex lens 301 is located above the light emitting region 203, and the opening of the cavity 103 is closed.
The convex lens 301 is mounted on the inner side wall surface of the cavity 103 and is located above the light emitting area 203, so that on one hand, the overall thickness of the package structure can be thinned, and a cavity between the convex lens 301 and the light emitting area 203 is reduced, so that the air pressure in the cavity is reduced, and the convex lens 301 is prevented from being displaced or being flushed out of the cavity due to overlarge pressure in the cavity, on the other hand, compared with a planar transparent glass plate, the convex lens 301 can enable the scanning range of laser or a laser beam 21 (refer to fig. 5) emitted by the light emitting area 203 of the laser chip 201 to be larger, and the working performance of the laser radar is improved.
The convex lens 301 has at least a convex upper surface and a convex lower surface, and specifically, the convex lens 301 has a convex arc surface on the upper surface and the convex arc surface on the lower surface.
In some embodiments, with continued reference to fig. 3 or fig. 4, the convex lens 301 includes a light-transmitting portion 302 and a supporting portion 303 connected to the light-transmitting portion 302 at a peripheral edge of the light-transmitting portion 302, the supporting portion 303 is attached to an inner sidewall surface of the cavity 103, and the light-transmitting portion 302 is suspended above the light-emitting region 203; the upper and lower surfaces of the light-transmitting portion 302 are convex arc-shaped surfaces, and the size of the light-transmitting portion 302 is larger than the size of the light-emitting region 203. The supporting portion 303 is attached to the inner side wall surface of the cavity 103 by an adhesive 304.
In a specific embodiment, the supporting portion 303 of the convex lens 301 includes an outer side 34 and a lower surface 33 connected to the bottom of the outer side 34, the lower surface 33 is inclined upward, the outer side 34 of the supporting portion 303 is attached to the side 14 of the first portion 11 of the cavity 103, and the lower surface 33 of the supporting portion 303 is attached to the bottom 13 of the first portion 11 of the cavity 103. Since the bottom surface 13 of the first portion 11 of the cavity 103 is inclined upwards, the lower surface 33 of the supporting portion 303 of the corresponding convex lens 301 is also inclined upwards, so that the contact area between the supporting portion 303 of the convex lens 301 and the first portion of the cavity 103 is increased, the adhesion force between the convex lens 301 and the side wall of the cavity 103 is improved, and the convex lens 301 is prevented from being shifted or flushed out of the cavity under the action of the pressure difference when the pressure difference exists between the inside and the outside of the cavity 103 of the laser radar; in addition, since the convex lens 301 and the side wall of the cavity 103 are fixed by the adhesive 304 (refer to fig. 4), the adhesive 304 is not likely to overflow onto the functional surface of the laser chip 201 because the bottom surface 13 of the first portion 11 of the cavity 103 is inclined upward when the convex lens 301 is attached.
In some embodiments, the inclination angle of the bottom surface 13 of the first portion 11 of the cavity 103 is the same as the inclination angle of the lower surface 33 of the supporting portion 303 of the convex lens 301, and the inclination angle may range from 20 ° to 70 °, specifically from 20 °, 25 °, 30 °, 35 °, 40 °, 45 °, 50 °, 55 °, 60 °, 65 °, 70 °, and further improves the adhesion force between the convex lens 301 and the inner sidewall of the cavity 103 while simplifying the mounting process, and further improves the effect of preventing the overflow of the adhesive 304.
In some embodiments, a vertical distance between the surface of the light emitting region 203 and the optical center of the convex lens 301 (the light transmitting portion 302) is less than or equal to a focal length of the convex lens 301, so as to further increase a scanning range of the laser light or the laser beam emitted from the light emitting region 203.
In other embodiments, when the functional surface of the laser chip 201 further has a receiving area (not shown in the drawing), and the cavity 103 further exposes the receiving area (not shown in the drawing), the convex lens 301 may further include a second light-transmitting area (not shown in the drawing), and when the convex lens 301 is attached to the inner side wall of the cavity 103, the second light-transmitting area is located above the receiving area, and the second light-transmitting area may be in a planar structure. In other embodiments, when a receiving chip (not shown in the drawing) is further attached to the upper surface of the substrate 101, a second cavity (not shown in the drawing) exposing the receiving area of the contact chip is further provided in the plastic sealing layer 102, and a second light transmitting sheet is provided, and the second light transmitting sheet is attached to an inner sidewall of the second cavity, and the second light transmitting sheet may have a planar structure.
Referring to fig. 6, an external protrusion 104 is formed on the lower surface of the substrate 101.
The external bump 104 is used for electrically connecting the laser radar package structure with an external device or substrate. In a specific embodiment, the external protrusion 104 is soldered with a second pad on the lower surface of the substrate 101.
The circumscribing bump 104 may be a solder bump or include a metal bump and a solder bump on a top surface of the metal bump. In some embodiments, the material of the metal bump is one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver, and the material of the solder bump is one or more of tin, tin silver, tin lead, tin silver copper, tin silver zinc, tin bismuth indium, tin gold, tin copper, tin zinc indium, or tin silver antimony.
In some embodiments, passive devices may also be mounted on the lower surface of the substrate 101.
Some embodiments of the present application further provide a laser radar package structure, referring to fig. 6, including:
a substrate 101, the substrate 101 comprising opposing upper and lower surfaces;
a laser chip 201 mounted on the upper surface of the substrate 101, the laser chip 201 being electrically connected to the substrate 101, a surface of the laser chip 201 not contacting the upper surface of the substrate 101 having a light emitting region 203;
a plastic sealing layer 102 located on the upper surface of the substrate 101 and surrounding the laser chip 201, wherein the plastic sealing layer 102 is provided with a cavity 103 exposing the light emitting area 203 of the laser chip 201;
a convex lens 301 attached on the inner side wall surface of the cavity 103, the convex lens 301 being located above the light emitting region 203 and closing the opening of the cavity 103.
In some embodiments, a perpendicular distance between the surface of the light emitting region 203 and the optical center of the convex lens 301 is less than or equal to a focal length of the convex lens 301.
In some embodiments, a perpendicular distance between the upper surface of the plastic layer 102 and the optical center of the convex lens 301 is less than a focal length of the convex lens 301.
In some embodiments, the convex lens 301 includes a light-transmitting portion 302 and a supporting portion 303 disposed at the peripheral edge of the light-transmitting portion 302 and connected to the light-transmitting portion 302, the supporting portion 303 is attached to the inner sidewall surface of the cavity 103, and the light-transmitting portion 302 is suspended above the light-emitting region 203.
In some embodiments, the upper and lower surfaces of the light-transmitting portion 302 are convex arc-shaped surfaces, and the size of the light-transmitting portion 302 is larger than the size of the light-emitting region 203.
In some embodiments, the support 303 is attached to the inner sidewall surface of the cavity 103 by an adhesive 304.
In some embodiments, the cavity 103 includes a first portion 11 and a second portion 12 that are in communication, the first portion 11 is located above the second portion 12, the first portion 11 has a width greater than the width of the second portion 12, the inner sidewall of the first portion 11 includes a side 14 and a bottom 13 connected to the bottom of the side 14, and the bottom 13 is inclined upward; the supporting portion 303 includes an outer side 34 and a lower surface 33 connected to the bottom of the outer side 34, the lower surface 33 is inclined upward, the outer side 34 of the supporting portion 303 is attached to the side 14 of the first portion 11, and the lower surface 33 of the supporting portion 303 is attached to the bottom 13 of the first portion 11.
In some embodiments, the bottom surface 13 of the first portion 11 is inclined at the same angle as the lower surface 33 of the support 303.
In some embodiments, further comprising: a control chip 202 and/or a passive device 207 attached to the upper surface of the substrate 101, wherein the control chip 202 and/or the passive device 207 are electrically connected with the substrate 101; an external protrusion 104 is located on the lower surface of the substrate 101.
It should be noted that the terms "comprising" and "having," and variations thereof, as referred to in this disclosure are intended to cover non-exclusive inclusion. The terms "first," "second," and the like are used to distinguish similar objects and not necessarily to describe a particular order or sequence unless otherwise indicated by context, it should be understood that the data so used may be interchanged where appropriate. In addition, embodiments of the present disclosure and features of embodiments may be combined with each other without conflict. In addition, in the above description, descriptions of well-known components and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure. In the foregoing embodiments, each embodiment is mainly described for the differences from the other embodiments, and the same/similar parts between the embodiments need to be referred to (or referred to) each other.
Although the present application has been described in terms of the preferred embodiments, it is not intended to be limited to the embodiments, and any person skilled in the art can make any possible variations and modifications to the technical solution of the present application by using the methods and technical matters disclosed above without departing from the spirit and scope of the present application, so any simple modifications, equivalent variations and modifications to the embodiments described above according to the technical matters of the present application are within the scope of the technical matters of the present application.

Claims (16)

1. A lidar package structure, comprising:
a substrate including opposed upper and lower surfaces;
the laser chip is attached to the upper surface of the substrate, the laser chip is electrically connected with the substrate, and a light emitting area is formed on one surface of the laser chip, which is not contacted with the upper surface of the substrate;
a plastic sealing layer which is positioned on the upper surface of the substrate and surrounds the laser chip, wherein a cavity exposing the light-emitting area of the laser chip is arranged in the plastic sealing layer;
and the convex lens is attached to the surface of the inner side wall of the cavity, is positioned above the light-emitting area and seals the opening of the cavity.
2. The lidar package structure according to claim 1, wherein a vertical distance between a surface of the light emitting region and an optical center of the convex lens is smaller than or equal to a focal length of the convex lens.
3. The lidar package structure according to claim 1 or 2, wherein a vertical distance between an upper surface of the plastic layer and an optical center of the convex lens is smaller than a focal length of the convex lens.
4. The lidar package structure of claim 3, wherein the convex lens comprises a light-transmitting portion and a supporting portion positioned at the periphery of the light-transmitting portion and connected with the light-transmitting portion, the supporting portion is attached to the inner side wall surface of the cavity, and the light-transmitting portion is suspended above the light-emitting area.
5. The lidar package structure of claim 4, wherein the upper surface and the lower surface of the light-transmitting portion are convex arc-shaped surfaces, and the size of the light-transmitting portion is larger than the size of the light-emitting region.
6. The lidar package structure of claim 4, wherein the support portion is attached to an inner sidewall surface of the cavity by an adhesive.
7. The lidar package structure of claim 5, wherein the cavity comprises a first portion and a second portion that are in communication, the first portion is located above the second portion, the first portion has a width that is greater than a width of the second portion, an inner sidewall of the first portion comprises a side surface and a bottom surface that is connected to a bottom of the side surface, and the bottom surface is sloped upward; the supporting part comprises an outer side surface and a lower surface connected with the bottom of the outer side surface, the lower surface is inclined upwards, the outer side surface of the supporting part is attached to the side surface of the first part, and the lower surface of the supporting part is attached to the bottom surface of the first part.
8. The lidar package structure according to claim 7, wherein an inclination angle of the bottom surface of the first portion is the same as an inclination angle of the lower surface of the supporting portion.
9. The lidar package structure of claim 1, further comprising: the control chip and/or the passive device is/are attached to the upper surface of the substrate and electrically connected with the substrate; and an external protrusion on the lower surface of the substrate.
10. The method for forming the laser radar packaging structure is characterized by comprising the following steps of:
providing a substrate comprising opposing upper and lower surfaces;
providing a laser chip, mounting the laser chip on the upper surface of the substrate, electrically connecting the laser chip with the substrate, and providing a light-emitting area on one surface of the laser chip, which is not contacted with the upper surface of the substrate;
forming a plastic sealing layer surrounding the laser chip on the upper surface of the substrate, wherein a cavity exposing a light emitting area of the laser chip is formed in the plastic sealing layer;
providing a convex lens, attaching the convex lens on the surface of the inner side wall of the cavity, wherein the convex lens is positioned above the light emitting area and seals the opening of the cavity.
11. The method of claim 10, wherein a vertical distance between a surface of the light emitting region and an optical center of the convex lens is less than or equal to a focal length of the convex lens; the vertical distance between the upper surface of the plastic layer and the optical center of the convex lens is smaller than the focal length of the convex lens.
12. The method of claim 11, wherein the convex lens comprises a light-transmitting portion and a supporting portion connected with the light-transmitting portion at the peripheral edge of the light-transmitting portion, the supporting portion is attached to the inner side wall surface of the cavity, and the light-transmitting portion is suspended above the light-emitting area; the upper surface and the lower surface of the light-transmitting part are raised arc-shaped surfaces, and the size of the light-transmitting part is larger than that of the light-emitting area.
13. The method of claim 12, wherein the support is attached to an inner sidewall surface of the cavity by an adhesive.
14. The method of claim 13, wherein the cavity comprises a first portion and a second portion that are in communication, the first portion is located above the second portion, the first portion has a width greater than a width of the second portion, the inner sidewall of the first portion comprises a side surface and a bottom surface connected to the bottom of the side surface, and the bottom surface is sloped upward; the supporting part comprises an outer side surface and a lower surface connected with the bottom of the outer side surface, the lower surface is inclined upwards, the outer side surface of the supporting part is attached to the side surface of the first part, and the lower surface of the supporting part is attached to the bottom surface of the first part.
15. The method of claim 14, wherein the bottom surface of the first portion is inclined at the same angle as the bottom surface of the support portion.
16. The method of forming a lidar package structure of claim 10, further comprising: mounting a control chip and/or a passive device on the upper surface of the substrate, wherein the control chip and/or the passive device are electrically connected with the substrate; an external protrusion is formed on a lower surface of the substrate.
CN202310930633.1A 2023-07-26 2023-07-26 Laser radar packaging structure and forming method thereof Pending CN117039603A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310930633.1A CN117039603A (en) 2023-07-26 2023-07-26 Laser radar packaging structure and forming method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310930633.1A CN117039603A (en) 2023-07-26 2023-07-26 Laser radar packaging structure and forming method thereof

Publications (1)

Publication Number Publication Date
CN117039603A true CN117039603A (en) 2023-11-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310930633.1A Pending CN117039603A (en) 2023-07-26 2023-07-26 Laser radar packaging structure and forming method thereof

Country Status (1)

Country Link
CN (1) CN117039603A (en)

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