CN117038832A - LED display module and LED display panel - Google Patents
LED display module and LED display panel Download PDFInfo
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- CN117038832A CN117038832A CN202310927283.3A CN202310927283A CN117038832A CN 117038832 A CN117038832 A CN 117038832A CN 202310927283 A CN202310927283 A CN 202310927283A CN 117038832 A CN117038832 A CN 117038832A
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- 239000000758 substrate Substances 0.000 claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 24
- 230000002093 peripheral effect Effects 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 60
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000002087 whitening effect Effects 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 239000004408 titanium dioxide Substances 0.000 claims description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 238000013461 design Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 36
- 150000001875 compounds Chemical class 0.000 description 21
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000008393 encapsulating agent Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 239000011324 bead Substances 0.000 description 6
- 238000000149 argon plasma sintering Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 239000003086 colorant Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical group [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- -1 lutetium aluminum Chemical compound 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000004767 nitrides Chemical group 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application relates to an LED display module and an LED display panel, wherein the LED display module comprises a substrate (10) and a display device (20) arranged on the upper surface of the substrate (10); the display device (20) comprises a bowl cup (200), the bowl cup (200) comprises a bottom plate (2001) and a peripheral side wall (2002) arranged around the bottom plate (2001), the bottom plate (2001) and the peripheral side wall (2002) are enclosed to form a containing cavity, packaging glue (202) is filled in the containing cavity, the upper surface of the substrate (10) is of a first color, the packaging glue is of a second color, the second color is the same as the first color, or the difference between the whiteness value of the second color and the whiteness value of the first color is smaller than 50. The application has simple design, can greatly improve the display contrast, has obvious effect and good economy.
Description
Technical Field
The application relates to the technical field of LED display, in particular to an LED display module and an LED display panel.
Background
LED technology is a high-efficiency, energy-saving lighting technology, and has been rapidly developed in recent years. The LED display has the advantages of long service life, strong reliability, bright color and the like, and is widely applied to the fields of lamps, screens, televisions, automobiles and the like. Meanwhile, with the push of novel products such as infrared, ultraviolet and visible light LEDs, the LED technology is also increasingly widely applied in the fields of agriculture, medical treatment, communication and the like.
The existing white light LED display device generally adopts a blue light chip, yellow fluorescent powder and red fluorescent powder as illumination light sources, specifically, blue light waves emitted by the blue light chip are absorbed by the red fluorescent powder and the yellow fluorescent powder, and then are excited to generate fluorescent effects, red and yellow light waves are respectively emitted, and white light can be generated after the colors are mixed. Wherein, the yellow fluorescent powder is more in proportion, so that the appearance of the luminous surface of the display device presents yellow. In order to improve the light efficiency, the LED bowl and cup support is usually made of white or highly reflective materials. However, since the surface of the welding substrate for mounting the display device is gray, when the white light display device is used as a display light source, the packaging adhesive which has high light efficiency, high brightness and yellow color, and the surrounding white or high-reflection LED bowl cup bracket highlight the appearance of the display device, and cannot be effectively integrated with the surrounding gray welding substrate, thereby reducing the contrast of the display product.
Disclosure of Invention
Accordingly, in one aspect, the present application provides an LED display module, which reduces the appearance prominence of the display device and improves the contrast ratio.
An LED display module comprises a substrate and a display device arranged on the upper surface of the substrate; the display device comprises a bowl cup, the bowl cup comprises a bottom plate and a peripheral side wall surrounding the bottom plate, a containing cavity is formed by surrounding the bottom plate and the peripheral side wall, packaging glue is filled in the containing cavity, the upper surface of the substrate is of a first color, the packaging glue is of a second color, the second color is the same as the first color, or the difference between the whiteness value of the second color and the whiteness value of the first color is smaller than 50.
Compared with the prior art, the color of the packaging glue luminous surface of the display device is set to be the same as the color of the surface of the substrate, or the whiteness value difference of the two colors is smaller than 50, so that the color of the packaging glue luminous surface of the display device is consistent with the color of the surface of the surrounding substrate, the appearance of the display device is reduced, and the display contrast of the display device is improved.
Further, the first color is black or gray.
Further, the packaging adhesive comprises an adhesive material, fluorescent powder, a whitening scattering material and a black material.
Further, the black material is at least one of carbon powder or graphene.
Further, the whitened scattering material comprises titanium dioxide.
Further, the whitened scattering material further comprises at least one of silica, alumina, zinc oxide, cerium oxide, and calcium carbonate.
Further, the outer surface of the peripheral side wall of the bowl cup is in a third color, the third color is the same as the first color, or the difference between the whiteness value of the third color and the whiteness value of the first color is smaller than 30.
Further, the bowl is made of the material of the third color.
Further, the outer surface of the peripheral side wall of the bowl cup is covered with a layer of coating, and the coating is of the third color.
On the other hand, the application also provides an LED display panel, which comprises any one of the LED display modules.
For a better understanding and implementation, the present application is described in detail below with reference to the drawings.
Drawings
FIG. 1 is a top view of an embodiment of an LED display module according to the present application;
FIG. 2 is a cross-sectional view of one embodiment of an LED display module of the present application;
fig. 3 is an external view of a conventional packaging paste in a white LED display device and a packaging paste with a white light scattering material added thereto (a: an external view of a packaging paste in a conventional white LED display device, b: an external view of a packaging paste with a white light scattering material added thereto);
FIG. 4 is an external view of a display device packaging adhesive (the packaging adhesive is added with black material and whitened scattering material simultaneously) in an LED display module;
FIG. 5 is an external appearance contrast diagram of a display device, a first contrast display device and a second contrast display device in an LED display module;
FIG. 6 is an external appearance contrast diagram of a display device, a first contrast display device and a third contrast display device in an LED display module;
FIG. 7 is a cross-sectional view of another embodiment of a display device in an LED display module according to the present application;
FIG. 8 is a top view of an LED display module including a plurality of display devices according to the present application;
reference numerals:
10. a substrate;
20. a display device; 200. a bowl cup; 2000. coating the outer side surface of the bowl cup; 2001. a bottom plate of the bowl cup; 2002. the peripheral side wall of the bowl cup; 202. packaging glue;
21. a first contrast display device; 22. a second contrast display device; 23. and a third contrast display device.
Detailed Description
It should be understood that the described embodiments are merely some, but not all embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the application, are intended to be within the scope of the embodiments of the present application.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "up," "down," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" or "fixedly connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
The traditional LED white lamp beads are used for exciting fluorescent powder to generate white light through a blue light chip. The yellow fluorescent powder in the fluorescent powder occupies a relatively large area, so that the appearance of the LED lamp bead is yellow. In order to improve the display light efficiency of the LED lamp beads, most of the bowl-cup holders of the conventional display devices are made of white or highly reflective materials, and the lamp beads made of white or highly reflective materials are inconsistent with the welding substrates for mounting the lamp beads in color, so that the contrast of the LED lamp beads is reduced.
Based on the above, the embodiment of the application provides an LED display module, which can effectively provide the contrast of display by making the color of the outer surface of the display device and the appearance color of the packaging glue of the display device the same as or close to the color of the upper surface of the substrate.
As shown in fig. 1 and 2, in the present embodiment, the LED display module includes a substrate 10, and a display device 20 mounted on an upper surface of the substrate 10.
Specifically, the substrate 10 is a rectangular plate or a square plate, and its upper surface is black or gray, and in this embodiment, the surface of the substrate 10 is specifically gray. The display device 20 includes a bowl cup 200, the bowl cup 200 being constituted by a bottom plate 2001 and a peripheral side wall 2002 provided around the bottom plate 2001. The bottom plate 2001 and the peripheral side wall 2002 of the bowl 200 enclose a receiving cavity, and a blue light chip (not shown) is mounted at the bottom of the receiving cavity. In addition, the accommodating cavity is filled with the packaging adhesive 202 to prevent external moisture from contacting the blue light chip (not shown), and the blue light chip (not shown) emits light through the top of the packaging adhesive 202.
Since the encapsulation compound 202 occupies a larger area of the display device 20, the light emission surface of the encapsulation compound 202 has a larger influence on the display effect of the display device 20. To enhance the display contrast, the color of the encapsulant 202 is the same as or similar to the color of the upper surface of the substrate 10, i.e., the encapsulant 202 is also gray. Here, the color "same" means that the whiteness value of the light emitting surface of the encapsulation compound 202 is equal to the whiteness value of the surface of the substrate 10, and the color "close" means that the difference between the whiteness value of the light emitting surface of the encapsulation compound 202 and the whiteness value of the surface of the substrate 10 is less than 50. Thus, the color of the light emitting surface of the encapsulation adhesive 202 of the display device 20 is the same as or similar to the surface color of the substrate 10, so that the appearance prominence of the display device 20 is reduced, and the display contrast is improved.
The conventional packaging adhesive 202 includes an adhesive material and fluorescent powder, wherein the adhesive material may be epoxy resin, silica gel or silicone resin; and the phosphor mainly includes yellow phosphor. Of course, in other embodiments, a small amount of red phosphor is included in addition to the yellow phosphor. Specifically, the yellow phosphor is YAG (yttrium aluminum garnet), or GaAG (gallium aluminum garnet), luAG (lutetium aluminum garnet), silicate or LSN: ce 3+ (La 3 Si 6 N 11 :Ce 3+ ) The method comprises the steps of carrying out a first treatment on the surface of the The red fluorescent powder is nitride red powder, and the proportion of the adhesive material, the yellow fluorescent powder and the red fluorescent powder is as follows: and (3) an adhesive material: yellow fluorescent powder: red phosphor=1 (0.1-2): 0-0.2.
The presence of the yellow phosphor gives the conventional encapsulant a yellow appearance as shown in fig. 3 a. The encapsulant 202 in embodiments of the present application further comprises a white-light scattering material and a black material in order to eliminate the yellow appearance exhibited by the yellow phosphor and to make the encapsulant dark gray. The whitening and scattering material specifically comprises titanium dioxide, which can change the appearance of a yellow light-emitting surface caused by yellow fluorescent powder into the appearance of a off-white light-emitting surface shown in fig. 3 b, and has the effect of scattering and whitening the light-emitting surface. Here, the particle size of the titanium dioxide is 0.5 to 5. Mu.m, preferably 1 to 3. Mu.m, l. If the particle size of the titanium dioxide is too small (smaller than the wavelength of visible light), light is diffracted and penetrated from particles, and no scattering, refraction and reflection occur, so that the effect of scattering and whitening cannot be realized; when the particle diameter is too large (larger than 5 μm), the specific surface area of the titanium dioxide particles decreases, scattering, refraction and reflection of light become small, and the scattering and whitening effect is poor. The black material includes small particle carbon powder, which can reduce the light reflection performance of the encapsulation cement 202, and simultaneously, the appearance of the white luminous surface is converted into the appearance of the dark gray luminous surface as shown in fig. 4, that is, the luminous surface of the encapsulation cement 202 is made to be dark gray by the white scattering material and the black material. Of course, the black material may use small particle carbon powder, graphene, a mixture of small particle carbon powder and graphene, or other black organic materials.
Specifically, the black material accounts for 0.2% -5% of the total mass of the encapsulation adhesive 202, and the excessive addition can absorb light excessively, so that the brightness of the display device 20 is reduced, the excessive addition is low, and the appearance contrast of the light-emitting surface is not high; the weight ratio of the whitening and scattering material to the total weight of the packaging adhesive 202 is 0.1% -5%, and the excessive addition can reduce the light-emitting brightness of the display device 20 and cannot meet the light-emitting requirement; while too little can cause the light emitting surface of the display device 20 to still appear yellow with insignificant color change.
Thus, by adding the whitening and dispersing material and the black material to the encapsulation compound 202 of the display device 20 at the same time, the appearance color of the encapsulation compound 202 of the display device 20 is the same as the color of the surface of the substrate 10. Of course, in actual production, the whiteness value of the appearance color of the encapsulation glue 202 of the display device 20 and the whiteness value of the color of the surface of the gray substrate 10 are difficult to be completely equal due to the existence of chromatic aberration or different requirements on the brightness of the display device 20, but as long as the difference between the whiteness value of the appearance color of the encapsulation glue 202 and the whiteness value of the surface color of the substrate 10 is less than or equal to 50, the consistency of the color of the display device 20 and the color of the substrate 10 can be maintained so as to reduce the appearance prominence of the display device 20, thereby improving the display contrast. Since measurement of whiteness values belongs to the prior art, this is not explained in detail here.
Fig. 5 shows the appearance of the encapsulation compound 202 to which the white and black materials are added in the display device 20 according to the embodiment of the present application, the appearance of the conventional encapsulation compound without the white and black materials added in the first comparative display device 21, and the appearance of the encapsulation compound to which only the white and black materials are added in the second comparative display device 22, wherein the addition amount of the white and black materials in the encapsulation compound of the second comparative display device 22 is equal to the sum of the addition amounts of the white and black materials in the encapsulation compound 202 of the display device 20 according to the embodiment of the present application, and the other components and the mixture ratio thereof in the encapsulation compound are the same as the encapsulation compound 202 according to the embodiment of the present application. As can be seen from fig. 5, the light emitting surface of the encapsulation compound 202 of the display device 20 according to the embodiment of the present application is dark gray, while the light emitting surface of the encapsulation compound of the first comparative display device 21 is yellow, and the light emitting surface of the encapsulation compound of the second comparative display device 22 is off-white.
It should be noted that, the white-light-emitting material and the black-light material in the encapsulation glue 202 not only form a gray material after white and black are overlapped, and then make the yellow encapsulation glue 202 gray, but also change the original yellow appearance formed by the yellow fluorescent powder into a off-white color through the white-light-emitting material, and then the black-light material can form a gray appearance with the off-white material. If gray or black material is added directly to the encapsulant 202 including yellow phosphor, the appearance of the encapsulant 202 will remain yellow or even yellowish green, failing to make the final encapsulant 202 appear dark gray. Referring to fig. 6, the appearance of the light emitting surface of the first comparative display device 21 (i.e. the encapsulation glue is not added with the white-light-scattering material and the black material), the appearance of the light emitting surface of the display device 20 in the LED display module of the present embodiment, and the appearance of the light emitting surface of the third comparative display device 23 (i.e. the encapsulation glue is added with the gray material) are sequentially shown from left to right in fig. 6, wherein the addition amount of the gray material in the encapsulation glue of the third comparative display device 23 is equal to the sum of the addition amounts of the white-light-scattering material and the black material in the encapsulation glue 202 of the display device 20 of the embodiment of the present application, and other components and the mixture ratio thereof in the encapsulation glue are the same as the encapsulation glue 202 of the embodiment of the present application. As can be seen from fig. 6, the luminous surface of the encapsulation compound of the first contrast display device 21 on the left side is yellow, the luminous surface of the encapsulation compound of the third contrast display device 23 on the right side is yellow-green, and the luminous surface of the encapsulation compound 202 of the display device 20 in the middle is dark gray in the embodiment of the present application. It can be seen that if only the gray material is directly added into the encapsulation compound 202, the appearance of the light emitting surface of the encapsulation compound 202 containing the yellow phosphor cannot be changed to dark gray which is the same as or close to that of the substrate 10, and the display contrast of the third contrast display device 23 is affected. When the third comparative display device 23 is mounted on a substrate having a gray or black surface, the display effect thereof is also weaker than that of the LED display module of the embodiment of the present application.
Further, the whitened scattering material further includes at least one of silica, alumina, zinc oxide, cerium oxide, and calcium carbonate, specifically silica in this embodiment. The silicon dioxide can make the light emitted by the blue light chip (not shown) uniformly distributed, and increase the reflection and refraction of the blue light chip (not shown) in the encapsulant of the encapsulation glue 202. The bowl 200 is generally made of plastic, and the silica increases the reflection and refraction of light inside the colloid, so that the bowl 200 made of plastic material can be reduced to directly absorb blue light, so as to reduce the formation of cracking on the surface of the bowl 200, thereby prolonging the service life of plastic inside the bowl 200, reducing the risk of degradation and stripping of glue, and further prolonging the service life of the display device 20. Wherein the mass ratio of the titanium dioxide to the silicon dioxide in the whitened scattering material is 1 (10-100), and is preferably 1:20.
In some embodiments, the color of the outer surface of the bowl 200 is also the same as or similar to the color of the upper surface of the base plate 10, i.e., the outer side of the peripheral side wall 2002 of the bowl 200 and the top are also gray or black. Herein, the color "same" means that the whiteness value of the outer surface of the bowl 200 is equal to the whiteness value of the surface of the substrate 10, and the color "close" means that the difference between the whiteness value of the outer surface of the bowl 200 and the whiteness value of the surface of the substrate 10 is less than 30. The outer surface of bowl 200 may include only the outer side surface of peripheral wall 2002 and the top surface thereof, or may include the portion of the top surface of bottom plate 2001 protruding beyond peripheral wall 2002 and the outer side surface of bottom plate 2001. Thus, the colors of the outer surface of the bowl 200 of the display device 20, the surface of the substrate 10 and the light emitting surface of the packaging adhesive 202 are the same or close to each other, so that the appearance prominence of the display device 20 is further reduced, and the display contrast is improved.
In order to realize the gray outer side surface of the bowl cup 200, the gray bowl cup 200 bracket shown in fig. 2 can be directly made of gray plastic materials. The outer surfaces of the bottom plate 2001 and the peripheral side wall 2002 of the bowl 200 may also be coated with a gray coating 2000 as described in fig. 7. Both the two modes have advantages and disadvantages, and if the bowl cup 200 is directly made of gray plastic materials, the overall bowl cup is gray, and the brightness of the light can be influenced; if the coating is coated, the coating is not brushed in the accommodating cavity inside the bowl cup 200, so that the appearance of the bowl cup 200 is reduced, and the brightness is not influenced.
Of course, in the above-mentioned LED display module, the number of the display devices 20 disposed on the substrate 10 may be one, or may include three display devices 20 as shown in fig. 8, or more, which is not limited only.
In addition, the application also provides an LED display panel, which comprises the LED display module.
Compared with the prior art, the color of the outer surface of the display device and the color of the luminous surface of the packaging glue are the same as or close to the color of the substrate, so that the colors of the outer surface of the display device and the packaging glue are consistent with the color of the surrounding substrate, the appearance of the display device is reduced, and the display contrast of the display device is improved. The application has simple design, can greatly improve the display contrast, has obvious effect and good economy.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the spirit of the application, and the application is intended to encompass such modifications and improvements.
Claims (10)
1. An LED display module, its characterized in that: comprises a substrate (10) and a display device (20) arranged on the upper surface of the substrate (10); the display device (20) comprises a bowl cup (200), the bowl cup (200) comprises a bottom plate (2001) and a peripheral side wall (2002) arranged around the bottom plate (2001), the bottom plate (2001) and the peripheral side wall (2002) are enclosed to form a containing cavity, packaging glue (202) is filled in the containing cavity, the upper surface of the substrate (10) is of a first color, the packaging glue is of a second color, the second color is the same as the first color, or the difference between the whiteness value of the second color and the whiteness value of the first color is smaller than 50.
2. The LED display module of claim 1, wherein:
the first color is black or gray.
3. The LED display module of claim 1, wherein:
the packaging adhesive (202) comprises an adhesive material, fluorescent powder, a whitening scattering material and a black material.
4. The LED display module according to claim 3, wherein:
the black material is at least one of carbon powder and graphene.
5. The LED display module according to claim 3, wherein:
the whitened scattering material comprises titanium dioxide.
6. The LED display module of claim 5, wherein:
the whitened scattering material further comprises at least one of silica, alumina, zinc oxide, cerium oxide, and calcium carbonate.
7. The LED display module of claim 6, wherein:
the outer surface of the peripheral side wall (2002) of the bowl cup (200) is in a third color, the third color is the same as the first color, or the difference between the whiteness value of the third color and the whiteness value of the first color is less than 30.
8. The LED display module of claim 7, wherein:
the bowl (200) is made of the material of the third color.
9. The LED display module of claim 7, wherein:
the outer surface of the peripheral side wall (2002) of the bowl cup (200) is covered with a layer of coating (2000), and the coating (2000) is of the third color.
10. An LED display panel, characterized in that: an LED display module comprising the LED display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310927283.3A CN117038832A (en) | 2023-07-26 | 2023-07-26 | LED display module and LED display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310927283.3A CN117038832A (en) | 2023-07-26 | 2023-07-26 | LED display module and LED display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117038832A true CN117038832A (en) | 2023-11-10 |
Family
ID=88621775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310927283.3A Pending CN117038832A (en) | 2023-07-26 | 2023-07-26 | LED display module and LED display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117038832A (en) |
-
2023
- 2023-07-26 CN CN202310927283.3A patent/CN117038832A/en active Pending
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