CN117038622A - Lead frame and packaging structure - Google Patents
Lead frame and packaging structure Download PDFInfo
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- CN117038622A CN117038622A CN202311020484.1A CN202311020484A CN117038622A CN 117038622 A CN117038622 A CN 117038622A CN 202311020484 A CN202311020484 A CN 202311020484A CN 117038622 A CN117038622 A CN 117038622A
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- pin
- lead frame
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- base island
- lead
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000035882 stress Effects 0.000 description 22
- 230000000694 effects Effects 0.000 description 5
- 230000032798 delamination Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/4952—Additional leads the additional leads being a bump or a wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention provides a lead frame, which comprises at least one lead frame unit, wherein the lead frame unit comprises: a base island; the first pin is arranged at the periphery of the base island; the connecting ribs are connected with the first pins and the base island, extend obliquely in the thickness direction of the lead frame, so that the base island and the first pins are located on different planes, an included angle is formed between the connecting ribs and the plane where the lead frame is located, the connecting ribs have a first width when the included angle is located in a first range, the connecting ribs have a second width when the included angle is located in a second range, the angle value in the first range is smaller than the angle value in the second range, the maximum value of the first width is larger than the maximum value of the second width, the at least two connecting ribs are symmetrically arranged on two sides of the first pins, the widths of the at least two connecting ribs are identical, and the included angle between the at least two connecting ribs and the plane where the lead frame is located is identical. The invention can reduce the internal stress of the connecting rib and improve the reliability of the packaging structure.
Description
Technical Field
The present invention relates to the field of semiconductor packaging, and in particular, to a lead frame and a packaging structure.
Background
The MOS semiconductor power device is a grid-control type multi-sub conductive device, has the advantages of low power consumption, high switching speed, strong driving capability, negative temperature coefficient and the like, is widely applied to power supply modules of various power electronic systems, plays a role in power conversion or power conversion, and is one of a power integrated circuit and a core element of the power integrated system.
In order not to affect the die area of the base island of the MOS semiconductor power device, the functional lead of the base island is typically routed to a pin through a tie bar (Tiebar) in the package design. However, the package body of the package structure is prone to layering, so that the reliability of the package structure is low, and the requirements cannot be met.
Disclosure of Invention
The invention aims to solve the technical problem of providing a lead frame and a packaging structure, which can reduce the risk of layering of relevant areas of the packaging structure and improve the reliability of the packaging structure.
In order to solve the above problems, the present invention provides a lead frame comprising at least one lead frame unit, the lead frame unit comprising:
a base island;
the first pins are arranged on the periphery of the base island;
the connecting ribs are connected with the first pins and the base island, the connecting ribs extend obliquely in the thickness direction of the lead frame, so that the base island and the first pins are located on different planes, an included angle is formed between the connecting ribs and the plane where the lead frame is located, the connecting ribs have a first width when the included angle is located in a first range, the connecting ribs have a second width when the included angle is located in a second range, the angle value located in the first range is smaller than the angle value located in the second range, the maximum value of the first width is larger than the maximum value of the second width, the connecting ribs are respectively connected with two sides of the first pins, the widths of the connecting ribs are the same, and the included angles between the connecting ribs and the plane where the lead frame is located are the same.
In an embodiment, the minimum value of the first width is the same as the minimum value of the second width.
In one embodiment, the minimum value is 0.8T, where T is the material thickness.
In one embodiment, the first range is [30 °,45 ° ], and the second range is (45 °,60 ° ].
In an embodiment, the maximum value of the first width is 1.5T, and the maximum value of the second width is 1.0T, wherein T is the material thickness.
In an embodiment, the lead frame unit includes at least two connecting ribs, the two connecting ribs are respectively connected with two sides of the first pin, the widths of the two connecting ribs are the same, and the included angles between the two connecting ribs and the plane where the lead frame is located are the same.
In an embodiment, the lead frame unit further includes a second pin and a third pin, where the second pin and the third pin are disposed at the periphery of the base island and are disposed at two sides of the first pin, respectively.
In an embodiment, the lead frame unit further includes a heat dissipation structure, and the heat dissipation structure is connected to an end of the base island away from the first pin.
The embodiment of the invention also provides a packaging structure, which comprises:
a lead frame as described above;
the chip is arranged on the base island;
a first lead connecting the chip and the first pin;
and the packaging body is used for coating at least one part of the base island, the chip, the first lead, the connecting rib and the first pin.
In an embodiment, the lead frame unit further includes a second pin and a third pin, where the second pin and the third pin are disposed at the periphery of the base island and are disposed at two sides of the first pin respectively;
the packaging structure further comprises a second lead and a third lead, wherein the second lead is connected with the chip and the second pin, and the third lead is connected with the third pin;
the package also encapsulates the second lead, the third lead, and portions of the second pin and the third pin.
In an embodiment, the lead frame unit further includes a heat dissipation structure, the heat dissipation structure is connected to an end of the base island away from the first pin, the package further covers a portion of the heat dissipation structure, and an end of the heat dissipation structure away from the base island protrudes out of the package.
In the lead frame and the packaging structure provided by the embodiment of the invention, at least two connecting ribs are symmetrically arranged on two sides of the first pin so as to disperse the internal stress of each connecting rib, the maximum value of the width of each connecting rib is determined according to the value range of the included angle between the connecting rib and the plane of the lead frame, namely the width of each connecting rib is related to the included angle between the connecting rib and the plane of the lead frame, so that the internal stress of each connecting rib can be further reduced under the condition of considering the supporting strength and the packaging volume, the capability of the connecting rib to recover to the position before deformation from the position after deformation after plastic packaging is reduced, the layering risk of the relevant area of the packaging structure can be further reduced, and the reliability of the packaging structure is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1A is a top view of a prior art leadframe;
FIG. 1B is a schematic cross-sectional view taken along line A-A1 of FIG. 1A;
fig. 2 is a schematic top view of a leadframe unit according to an embodiment of the invention;
FIG. 3 is a schematic cross-sectional view of a leadframe unit along line A-A1 in FIG. 2 according to an embodiment of the invention;
fig. 4 is a simulation result of an effect of an included angle between a connecting rib and a plane of the lead frame and a width of the connecting rib on a package structure according to an embodiment of the present invention;
FIG. 5 is a schematic top view of a package structure according to an embodiment of the present invention;
fig. 6 is a schematic cross-sectional view of a package structure along a line A-A1 in fig. 5 according to an embodiment of the present invention.
Detailed Description
As described in the background art, in the package structure in which the functional leads of the base island are led to the pins through the connecting ribs, the package body is prone to layering, so that the reliability of the package structure is low, and the requirements cannot be met. Specifically, referring to fig. 1A and 1B, fig. 1A is a top view of a conventional lead frame, and fig. 1B is a schematic cross-sectional view taken along line A-A1 in fig. 1A, in the lead frame, a base island 100 is directly connected to a pin 120 through a connecting rib 110, and when the lead frame is used to form a package structure, a chip is disposed on the base island 100, and a package body encapsulates the base island 100, the connecting rib 110 and a part of the pin 120. The inventors have found that at the contact between the connecting rib 110 and the pin 120 (as indicated by the dotted line box B in the figure), the package body is prone to delamination, resulting in low reliability of the package structure.
As a result of further intensive studies, the inventors found that, during the process of forming the package, the encapsulation mold presses the heat dissipation surface (i.e., the surface of the island on which the chip is not disposed), the thermal stress generated by the encapsulation mold causes interference deformation of the connection rib 110 connected to the island 100 at the moment of pressing, the deformation causes an increase in internal stress of the connection rib 110, and in the intersection region between the pin 120 and the connection rib 110, the internal stress caused by the deformation is the largest, and the connection rib 110 tends to recover from the deformed position to the position before the deformation after the plastic encapsulation due to the influence of the internal stress, thereby further increasing the risk of delamination of the relevant region of the package structure and reducing the reliability of the package structure.
In view of this, the present invention provides a lead frame and a package structure, which release the internal stress of the connecting ribs through the structural design of the lead frame, reduce the capability of recovering the connecting ribs from the deformed position to the position before the deformation after plastic packaging, further reduce the risk of delamination of the relevant area of the package structure, and improve the reliability of the package structure.
The following describes in detail the specific embodiments of the lead frame and the package structure provided by the present invention with reference to the accompanying drawings. The lead frame comprises at least one lead frame unit 20, and two adjacent lead frame units 20 are connected together through an outer frame (not shown in the drawing) to form an integral lead frame.
Referring to fig. 2 and 3, fig. 2 is a schematic top view of a lead frame unit 20 according to an embodiment of the present invention, and fig. 3 is a schematic cross-sectional view of the lead frame unit 20 along a line A-A1 in fig. 2 according to an embodiment of the present invention, where the lead frame unit 20 includes: a base island 200; a first pin 210 disposed at the periphery of the base island 200; the connecting ribs 220 connect the first pins 210 and the base 200, the connecting ribs 220 extend obliquely in the thickness direction of the lead frame, so that the base 200 and the first pins 210 are located in different planes, an included angle θ is formed between the connecting ribs 220 and the plane where the lead frame is located (i.e., the plane where the lead frame unit 20 is located), when the included angle θ is located in a first range, the connecting ribs 220 have a first width, when the included angle θ is located in a second range, the connecting ribs 220 have a second width, wherein the angle value included in the first range is smaller than the angle value included in the second range, the maximum value of the first width is larger than the maximum value of the second width, the at least two connecting ribs 220 are symmetrically arranged on two sides of the first pins 210, the widths of the at least two connecting ribs 220 are the same, and the included angle θ between the at least two connecting ribs 220 and the plane where the lead frame is located is the same.
The inventors found that the internal stress of the connecting rib 220 is related to the width W of the connecting rib 220, and the angle θ between the connecting rib 220 and the plane of the lead frame; the smaller the width W of the connecting rib 220, the weaker the capability of the connecting rib 220 to recover to an initial state after deformation (i.e., the smaller the internal stress), but the smaller the width W of the connecting rib 220 has an influence on the supporting strength of the connecting rib 220, and the weaker the supporting strength of the connecting rib 220 is when the included angle θ is fixed; the smaller the included angle θ between the connecting rib 220 and the plane where the lead frame is located, the weaker the capability of the connecting rib 220 to recover to the initial state after deformation (i.e. the smaller the internal stress), but the smaller the included angle θ between the connecting rib 220 and the plane where the lead frame is located, the larger the packaged volume of the package structure is, the influence on the packaged volume of the package structure is caused by the included angle θ between the connecting rib 220 and the plane where the lead frame is located; therefore, in the lead frame provided by the embodiment of the invention, the maximum value of the width W of the connecting rib 220 is determined according to the value range of the included angle θ between the connecting rib 220 and the plane of the lead frame, that is, the included angle θ between the width W of the connecting rib 220 and the plane of the connecting rib 220 and the lead frame is related, so that the internal stress of the connecting rib 220 can be reduced under the condition of considering the supporting strength and the packaging volume, the capability of recovering the connecting rib 220 from the deformed position to the position before the deformation after plastic packaging is reduced, the risk of layering of the relevant region of the packaging structure can be reduced, and the reliability of the packaging structure is improved.
In addition, in the lead frame provided by the embodiment of the invention, at least two connecting ribs 220 are symmetrically arranged at two sides of the first pin 210, the widths W of the at least two connecting ribs 220 are the same, and the included angles θ between the at least two connecting ribs 220 and the plane where the lead frame is located are the same, so that the internal stress is dispersed by arranging a plurality of connecting ribs 220, and the internal stress of each connecting rib 220 is reduced, so that the risk of layering of the relevant region of the packaging structure can be reduced. In this embodiment, the lead frame unit 20 includes two connecting ribs 220, where the two connecting ribs 220 are respectively connected to two sides of the first pin 210 and symmetrically disposed, the widths W of the two connecting ribs 220 are the same, and the included angles θ between the two connecting ribs 220 and the plane where the lead frame is located are the same.
In some embodiments, the first pins 210 are disposed on one side of the base island 200, and the base island 200 and the first pins 210 are located on different planes, so that the lead frame can form a sunken base island 200 to further reduce the lateral area of the package structure.
In some embodiments, the thickness direction of the lead frame is perpendicular to the plane in which the lead frame is located, specifically, in this embodiment, the thickness direction of the lead frame is a Z direction, and the plane in which the lead frame is located is a plane formed by an X direction and a Y direction. The oblique extension of the connecting rib 220 in the thickness direction of the lead frame means that the connecting rib 220 extends in a direction away from the plane where the lead frame is located, and has an included angle θ with the plane where the lead frame is located.
In some embodiments, the plane of the lead frame is parallel to the plane of the base island 200, and the angle θ between the connecting rib 220 and the plane of the lead frame refers to the angle θ between the reverse extension line of the connecting rib 220 and the plane of the base island 200.
In some embodiments, the minimum value of the first width is the same as the minimum value of the second width, that is, the minimum value of the width W of the connecting rib 220 is a certain value, which is not dependent on the included angle θ between the connecting rib 220 and the plane of the lead frame, and if the width W of the connecting rib 220 is smaller than the certain value, the supporting strength of the connecting rib 220 is too small to meet the requirement of the package structure.
In this embodiment, the minimum value of the first width and the minimum value of the second width are both 0.8T, where T is the material thickness. The material thickness refers to the thickness S1 of the lead frame unit 20. If the width W of the connecting rib 220 is smaller than 0.8T, the supporting strength of the connecting rib 220 is too small to effectively support the first pins 210 and the base island 200.
In some embodiments, the first range is [30 °,45 ° ], the second range is (45 °,60 ° ], the tie bar 220 has a first width when an angle θ between the tie bar 220 and a plane in which the lead frame is located is greater than or equal to 30 ° and less than or equal to 45 °, the tie bar 220 has a second width when an angle θ between the tie bar 220 and a plane in which the lead frame is located is greater than 45 ° and less than or equal to 60 °, and a maximum value of the first width is greater than a maximum value of the second width.
In some embodiments, the maximum value of the first width is 1.5T, and the maximum value of the second width is 1.0T, where T is the thickness of the material, so as to further ensure that the internal stress of the connecting rib 220 is reduced while the support strength and the packaging volume are both considered.
For example, in the present embodiment, when the included angle θ between the tie bar 220 and the plane in which the lead frame is located is within the range of [30 °,45 ° ], the width W of the tie bar 220 is selected to be [0.8t,1.5t ], when the included angle θ between the tie bar 220 and the plane in which the lead frame is located is within the range of (45 °,60 ° ], the width W of the tie bar 220 is selected to be [0.8t,1.0t ]. For some package structures, when the space is sufficient, the included angle θ between the tie bar 220 and the plane in which the lead frame is located is selected to be [30 °,45 ° ], the width W of the tie bar 220 is selected to be [0.8t,1.5t ], so as to provide sufficient support strength while reducing the internal stress of the tie bar 220, and when the space is limited, the included angle θ between the tie bar 220 and the plane in which the lead frame is located is selected to be [ 45 °, and the width W of the tie bar 220 is selected to be [ 45 °, and the internal stress of the package structure is selected to be [0.8t ], while the internal stress of the tie bar 220 is selected to be reduced while the package structure is required to be reduced.
In an embodiment of the present invention, an effect of an included angle θ between the connecting rib 220 and a plane where the lead frame is located and a width W of the connecting rib 220 on the package structure are simulated, please refer to fig. 4, which is a simulation result of an effect of an included angle θ between the connecting rib 220 and a plane where the lead frame is located and a width W of the connecting rib 220 on the package structure in the lead frame provided by an embodiment of the present invention, when the included angle θ between the connecting rib 220 and the plane where the lead frame is located is selected to be 30 ° and 45 °, and the width W of the connecting rib 220 is selected to be 0.8T,1.0T and 1.5T, the supporting strength of the connecting rib 220 is good, the internal stress is low, and the effect on the reliability of the package structure is small or no effect is caused; when the included angle θ between the connecting rib 220 and the plane where the lead frame is located is selected to be 60 °, and the width W of the connecting rib 220 is selected to be 0.8T and 1.0T, the supporting strength of the connecting rib 220 is good, the internal stress is low, and the reliability of the packaging structure is less or not affected; when the included angle θ between the connecting rib 220 and the plane where the lead frame is located is selected to be 30 °,45 ° and 60 °, and the width W of the connecting rib 220 is selected to be 0.6T, the internal stress is small, but the supporting strength of the connecting rib 220 is small, the first pin 210 is easy to deform, and the normal operation of the package structure is affected; when the included angle θ between the connecting rib 220 and the plane where the lead frame is located is selected to be 60 °, and the width W of the connecting rib 220 is selected to be 1.5T, the supporting strength of the connecting rib 220 can meet the requirement, but the internal stress is larger, and the reliability of the package structure is more affected.
In some embodiments, the leadframe unit 20 further includes a second pin 230 and a third pin 240, and the second pin 230 and the third pin 240 are disposed at the periphery of the base island 200 and are disposed at two sides of the first pin 210, respectively. The second pin 230 and the third pin 240 are independent from the base 200, i.e. the second pin 230, the third pin 240 are not connected to the base 200, or the second pin 230 and the third pin 240 are isolated from the base 200 by insulating material. In this embodiment, the first pin 210, the second pin 230, and the third pin 240 are located in the same plane.
In some embodiments, the leadframe unit 20 further includes a heat dissipation structure 250, and the heat dissipation structure 250 is connected to an end of the base 200 remote from the first pins 210, for providing a heat dissipation channel. For example, in the present embodiment, the first pin 210, the second pin 230, and the third pin 240 are disposed on one side of the base island 200, and the heat dissipation structure 250 is disposed on the other side of the base island 200 opposite to the one side.
According to the lead frame provided by the embodiment of the invention, the plurality of connecting ribs are symmetrically distributed, and the width W of the connecting rib 220 is related to the included angle theta between the connecting rib 220 and the plane where the lead frame is located, so that the internal stress of the connecting rib 220 can be reduced under the condition of considering the supporting strength and the packaging volume, the capability of recovering the connecting rib 220 from the deformed position to the position before deformation after plastic packaging is reduced, the layering risk of the relevant region of the packaging structure can be reduced, and the reliability of the packaging structure is improved.
Still further embodiments of the present invention provide a package structure, where the package structure uses the lead frame described above. Referring to fig. 2 to 6, fig. 5 is a schematic top view of a package structure according to an embodiment of the invention, and fig. 6 is a schematic cross-sectional view of the package structure along a line A-A1 in fig. 5 according to an embodiment of the invention, where the package structure includes a leadframe, a chip 500, a first lead 510, and a package body 540 as described above. The chip 500 is disposed on the base island 200; the first lead 510 connects the chip 500 with the first pin 210; the package 540 encapsulates at least a portion of the submount 200, the chip 500, the first lead 510, the tie bar 220, and the first pin 210. The package 540 is shown in fig. 5 with dashed lines to illustrate the internal structure of the package structure.
In the package structure provided by the embodiment of the invention, the maximum value of the width W of the connecting rib 220 is determined according to the value range of the included angle θ between the connecting rib 220 and the plane where the lead frame is located, that is, the width W of the connecting rib 220 is related to the included angle θ between the connecting rib 220 and the plane where the lead frame is located, so that the internal stress of the connecting rib 220 can be reduced under the condition of considering the supporting strength and the packaging volume, the capability of restoring the connecting rib 220 from the deformed position to the position before the deformation in the package structure is reduced, the risk of layering of the relevant area of the package structure can be reduced, and the reliability of the package structure is improved.
The chip 500 is disposed on the base island 200, and a bonding pad on the surface of the chip 500 is electrically connected to the first pin 210 through a first lead 510, and is further electrically connected to the base island 200 through the connecting rib 220.
In some embodiments, the leadframe unit 20 further includes a second pin 230 and a third pin 240, the second pin 230 and the third pin 240 being disposed at the periphery of the base island 200 and disposed at both sides of the first pin 210, respectively; the package structure further comprises a second lead 520 and a third lead 530, wherein the second lead 520 connects the chip 500 and the second pin 230, and the third lead 530 connects the chip 500 and the third pin 240; the package 540 also encapsulates the second lead 520, the third lead 530, and portions of the second pin 230 and the third pin 240.
For example, in some package structures, the chip 500 is a MOSFET (metal-oxide semiconductor field effect transistor) having three electrodes, namely, a gate (G), a source (S), and a drain (D), wherein the gate (G) pad and the source (S) pad are electrically connected to the second pin 230 and the third pin 240 through the second wire 520 and the third wire 530, respectively, and the drain (D) pad is electrically connected to the first pin 210 through the first wire 510, and further connected to the base island 200 through the connecting bar 220, and the base island 200 is used as the drain (D) for outputting a large current.
In some embodiments, the leadframe unit 20 further includes a heat dissipation structure 250, the heat dissipation structure 250 is connected to an end of the base island 200 away from the first pins 210, the package 540 further covers a portion of the heat dissipation structure 250, and an end of the heat dissipation structure 250 away from the base island 200 protrudes from the package 540. The heat dissipation structure 250 is not entirely covered by the package 540, which provides a good heat dissipation path.
The package structure provided in the embodiment of the present invention reduces the risk of delamination in the relevant area and improves the reliability by the structural design of the connecting rib 220.
It should be noted that the terms "comprising" and "having" and their variants are referred to in the document of the present invention and are intended to cover non-exclusive inclusion. The terms "first," "second," and the like are used to distinguish similar objects and not necessarily to describe a particular order or sequence unless otherwise indicated by context, it should be understood that the data so used may be interchanged where appropriate. The term "one or more" depends at least in part on the context and may be used to describe a feature, structure, or characteristic in a singular sense or may be used to describe a feature, structure, or combination of features in a plural sense. The term "based on" may be understood as not necessarily intended to express an exclusive set of factors, but may instead, also depend at least in part on the context, allow for other factors to be present that are not necessarily explicitly described. In addition, the embodiments of the present invention and the features in the embodiments may be combined with each other without collision. In addition, in the above description, descriptions of well-known components and techniques are omitted so as to not unnecessarily obscure the present invention. In the foregoing embodiments, each embodiment is mainly described for differences from other embodiments, and the same/similar parts between the embodiments are referred to each other.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (10)
1. A lead frame comprising at least one lead frame unit, the lead frame unit comprising:
a base island;
the first pins are arranged on the periphery of the base island;
the connecting ribs are connected with the first pins and the base island, the connecting ribs extend obliquely in the thickness direction of the lead frame, so that the base island and the first pins are located on different planes, an included angle is formed between the connecting ribs and the plane where the lead frame is located, the connecting ribs have a first width when the included angle is located in a first range, the connecting ribs have a second width when the included angle is located in a second range, the angle value located in the first range is smaller than the angle value located in the second range, the maximum value of the first width is larger than the maximum value of the second width, the at least two connecting ribs are symmetrically arranged on two sides of the first pins, the widths of the at least two connecting ribs are identical, and the included angles between the at least two connecting ribs and the plane where the lead frame is located are identical.
2. The leadframe of claim 1, wherein the minimum value of the first width is the same as the minimum value of the second width.
3. The leadframe of claim 2, wherein the minimum value is 0.8T, wherein T is a material thickness.
4. The leadframe according to claim 1, wherein the first range is [30 °,45 ° ], and the second range is (45 °,60 ° ].
5. The leadframe of any one of claims 1-4, wherein the maximum value of the first width is 1.5T and the maximum value of the second width is 1.0T, wherein T is the material thickness.
6. The lead frame of claim 1, wherein the lead frame unit further comprises a second pin and a third pin, the second pin and the third pin being disposed at the periphery of the base island and disposed at both sides of the first pin, respectively.
7. The leadframe of claim 1, wherein the leadframe unit further comprises a heat dissipation structure connected to an end of the submount remote from the first pin.
8. A package structure, comprising:
the lead frame according to any one of claims 1 to 7;
the chip is arranged on the base island;
a first lead connecting the chip and the first pin;
and the packaging body is used for coating at least one part of the base island, the chip, the first lead, the connecting rib and the first pin.
9. The package structure according to claim 8, wherein the lead frame unit further includes a second pin and a third pin, the second pin and the third pin being disposed at the periphery of the base island and disposed at both sides of the first pin, respectively;
the packaging structure also comprises a second lead and a third lead, wherein the second lead is connected with the chip and the second pin, and the third lead is connected with the chip and the third pin;
the package also encapsulates the second lead, the third lead, and portions of the second pin and the third pin.
10. The package structure according to claim 8 or 9, wherein the lead frame unit further comprises a heat dissipation structure connected to an end of the base island remote from the first pin, and the package further covers a portion of the heat dissipation structure, and an end of the heat dissipation structure remote from the base island protrudes from the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311020484.1A CN117038622A (en) | 2023-08-14 | 2023-08-14 | Lead frame and packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311020484.1A CN117038622A (en) | 2023-08-14 | 2023-08-14 | Lead frame and packaging structure |
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| CN117038622A true CN117038622A (en) | 2023-11-10 |
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| CN202311020484.1A Pending CN117038622A (en) | 2023-08-14 | 2023-08-14 | Lead frame and packaging structure |
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| CN (1) | CN117038622A (en) |
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