CN117038534B - Distance measuring mechanism and pick-and-place device - Google Patents
Distance measuring mechanism and pick-and-place device Download PDFInfo
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- CN117038534B CN117038534B CN202311300863.6A CN202311300863A CN117038534B CN 117038534 B CN117038534 B CN 117038534B CN 202311300863 A CN202311300863 A CN 202311300863A CN 117038534 B CN117038534 B CN 117038534B
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- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 235000017166 Bambusa arundinacea Nutrition 0.000 abstract description 10
- 235000017491 Bambusa tulda Nutrition 0.000 abstract description 10
- 241001330002 Bambuseae Species 0.000 abstract description 10
- 235000015334 Phyllostachys viridis Nutrition 0.000 abstract description 10
- 239000011425 bamboo Substances 0.000 abstract description 10
- 238000005259 measurement Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Abstract
The invention relates to the technical field of wafer ranging, and discloses a ranging mechanism and a picking and placing device. The adjusting part is installed in removing the main part, removes the main part and can drive adjusting part and remove, and adjusting part's output shaft is connected with a range finding section of thick bamboo, and the output shaft rotates and can make measuring part change to the range finding position, and the other end of the range finding contact that is located the range finding position can the butt wafer to acquire the distance between wafer and the removal main part, this range finding mechanism range finding is accurate, can improve wafer production efficiency.
Description
Technical Field
The invention relates to the technical field of wafer ranging, in particular to a ranging mechanism and a picking and placing device.
Background
The precision degree of the semiconductor device manufacturing determines that all links of the manufacturing process must be strict, particularly when the wafer manufacturing process is performed, the distance and the position of the wafer in the reaction cavity have strict rules, when the semiconductor device manufacturing process is performed, the wafer is required to be placed in the reaction cavity by adopting a taking and placing finger, then gas is introduced into the reaction cavity through a gas reaction accessory to coat the wafer, in the process, whether the distance between the wafer and the gas reaction accessory accords with the coating distance directly influences the coating thickness and the coating uniformity of the wafer, and whether the distance between the taking and placing finger and the wafer accords with the safety distance directly influences the taking and placing safety of the wafer. If the measurement of the distance is realized by means of a measuring ruler by means of manpower, the measurement accuracy of the distance is difficult to ensure, so that the production qualification rate of the wafer is reduced.
Therefore, a distance measuring mechanism and a pick-and-place device are needed to solve the above-mentioned problems.
Disclosure of Invention
An object of the present invention is to provide a distance measuring mechanism, which is mounted on a moving body, and can accurately measure a distance between a wafer and the moving body, thereby improving the production efficiency of the wafer.
The technical scheme adopted by the invention is as follows:
ranging mechanism, can install on moving body, ranging mechanism includes:
the measuring assembly comprises a ranging cylinder, a first elastic piece and a ranging contact, wherein the first elastic piece is positioned in the ranging cylinder, one end of the ranging contact is positioned in the ranging cylinder and connected with the first elastic piece, the other end of the ranging contact is positioned outside the ranging cylinder and can be abutted to a wafer, a laser range finder is arranged on the ranging cylinder, and the laser range finder is used for measuring the distance between a ranging platform of the ranging contact and the laser range finder;
the adjusting component is arranged on the moving body, an output shaft of the adjusting component is connected with the ranging cylinder, the output shaft rotates to enable the measuring component to rotate to a ranging position or leave the ranging position, the measuring component is located at the ranging position, and the other end of the ranging contact can be abutted to a wafer.
Optionally, the range finding section of thick bamboo includes the barrel, be provided with the spacing groove on the lateral wall of barrel, the range finding contact has spacing arch, spacing protruding slip is inserted and is located in the spacing groove.
Optionally, the range finding contact includes butt portion and connecting portion, the one end of butt portion with connecting portion are connected and form the step face, the other end of butt portion stretches out outside the barrel, connecting portion are located in the barrel, first elastic component cover is located on the connecting portion, the one end butt of first elastic component the inner wall of barrel, the other end butt of first elastic component the step face.
Optionally, the barrel includes a first section of thick bamboo and a second section of thick bamboo, the first end of a second section of thick bamboo is open end, the second end of a second section of thick bamboo is provided with the through-hole, open end with a section of thick bamboo is dismantled and is connected, first elastic component butt the inner wall of second end, laser of laser range finder can pass the through-hole is launched to the step face, the step face is the range finding platform.
Optionally, the range finding mechanism still includes locating component, locating component with remove the main part and be connected, locating component includes the location body, the location body orientation one side of range finding section of thick bamboo is provided with the extensible member, the end of stretching out of extensible member can be relative the location body is flexible, in order to be in the measuring component is located in the range finding position inserts in the spacing hole of range finding section of thick bamboo.
Optionally, the positioning body is further provided with a stop protrusion, the measuring component rotates to the ranging position, and the stop protrusion abuts against the measuring component.
Optionally, the adjusting component further comprises a second elastic piece, the ranging barrel further comprises a mounting ring, the barrel is arranged on the mounting ring, the mounting ring is sleeved on the output shaft and in clearance fit with the output shaft, and the barrel or the mounting ring is connected with the output shaft through the second elastic piece.
Optionally, the adjusting component further comprises a hanging rod, the hanging rod is arranged on the output shaft, the measuring component further comprises a connecting rod, the connecting rod is arranged on the ranging cylinder, one end of the second elastic piece is connected with the hanging rod, and the other end of the second elastic piece is connected with the connecting rod.
Optionally, the ranging mechanism further includes a display screen, the display screen is electrically connected with the laser range finder, and the display screen is used for displaying the distance between the ranging platform and the laser range finder.
Another object of the present invention is to provide a pick-and-place device, which can accurately measure a distance between a wafer and the pick-and-place device, and improve the production efficiency of the wafer.
The technical scheme adopted by the invention is as follows:
get and put the device, get and put the device and put finger and foretell range finding mechanism including getting, get and put to be provided with on the finger and get and put the platform, get and put the platform and be used for placing the wafer, get and put the platform and concave be equipped with the mounting groove, range finding mechanism set up in the mounting groove.
The beneficial effects of the invention are as follows:
the invention provides a ranging mechanism which comprises a measuring assembly and an adjusting assembly, wherein the measuring assembly comprises a ranging cylinder, a first elastic piece and a ranging contact, the first elastic piece is positioned in the ranging cylinder, one end of the ranging contact is positioned in the ranging cylinder and connected with the first elastic piece, the other end of the ranging contact is positioned outside the ranging cylinder and can be abutted to a wafer, a laser range finder is arranged on the ranging cylinder, and the laser range finder is used for measuring the distance between a ranging platform of the ranging contact and the laser range finder. The adjusting part sets up in removing the main part, and adjusting part's output shaft is connected with a range finding section of thick bamboo, and the output shaft rotates in order to make measuring part rotate to range finding position or leave range finding position, and the other end of range finding contact can the butt wafer when range finding position. The distance measuring mechanism is arranged on the movable main body, and the movable main body with the distance measuring mechanism can automatically acquire the distance between the wafer and the movable main body when contacting the wafer, so that errors caused by manual distance measurement of operators can be effectively reduced, the qualification rate of wafer production is ensured, and the efficiency of wafer production is improved.
The picking and placing device comprises the picking and placing finger and the distance measuring mechanism, wherein the picking and placing platform is arranged on the picking and placing finger and used for placing the wafer, the picking and placing platform is concavely provided with the mounting groove, and the distance measuring mechanism is arranged in the mounting groove so that a distance measuring contact of the distance measuring mechanism can be abutted against the wafer, and therefore accurate distance measurement is achieved. The picking and placing device can accurately measure the distance between the wafer and the picking and placing device, and improves the production efficiency of the wafer.
Drawings
FIG. 1 is a schematic diagram of a ranging mechanism according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a measurement assembly according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a ranging contact according to an embodiment of the present invention;
fig. 4 is a schematic view of a part of a pick-and-place device according to an embodiment of the present invention;
fig. 5 is an assembly diagram of a pick-and-place device for picking and placing a wafer according to an embodiment of the present invention.
In the figure:
1. a measurement assembly; 11. a ranging cylinder; 111. a mounting ring; 1111. a limiting hole; 1112. a stop notch; 112. a cylinder; 1121. a first barrel; 11211. a limit groove; 1122. a second barrel; 113. a connecting rod; 12. a distance measuring contact; 121. an abutting portion; 1211. a ranging platform; 1212. a limit protrusion; 122. a connection part; 13. a first elastic member; 14. a laser range finder;
2. an adjustment assembly; 21. an output shaft; 22. a concentric ring; 23. a second elastic member; 24. a hanging rod;
3. a positioning assembly; 31. a stop protrusion; 32. a positioning ring; 33. a telescoping member; 34. a connecting piece;
4. a display screen;
10. taking and placing the finger; 101. a picking and placing platform; 1011. a mounting groove;
20. a die;
30. a reaction chamber.
Detailed Description
In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the invention more clear, the technical scheme of the invention is further described below by a specific embodiment in combination with the attached drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the drawings related to the present invention are shown.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
As shown in fig. 1 to 3, the present embodiment provides a distance measuring mechanism that can be installed on a moving body, and the moving body can drive the distance measuring mechanism to move to abut against a wafer 20, and obtain a distance between the wafer 20 and the moving body. The distance measurement mechanism is utilized to automatically obtain the distance, so that errors caused by manual distance measurement of an operator can be effectively reduced, the moving main body is a gas reaction accessory, the distance between the wafer 20 and the gas reaction accessory can be accurately obtained, the film coating distance of the wafer 20 is ensured to be accurate, the film coating qualification rate of the wafer 20 is ensured, the moving main body is the picking and placing finger 10, the distance between the wafer 20 and the picking and placing finger 10 can be accurately obtained, the safety of the picking and placing of the wafer 20 is ensured, and the production efficiency of the wafer 20 is effectively improved.
Specifically, the ranging mechanism comprises a measuring assembly 1 and an adjusting assembly 2, wherein the measuring assembly 1 comprises a ranging cylinder 11, a first elastic member 13 and a ranging contact 12. The first elastic piece 13 is located in the range tube 11, one end of the range finding contact 12 is located in the range tube 11 and connected with the first elastic piece 13, and the other end of the range finding contact 12 is located outside the range tube 11 and can be abutted against the wafer 20. That is, when the other end of the ranging contact 12 abuts against the die 20, the force exerted by the die 20 on the ranging contact 12 is conducted to the first elastic member 13, and the first elastic member 13 is compressed, so that the ranging contact 12 and the die 20 can be elastically abutted to avoid damaging the die 20 during ranging. And when the first elastic member 13 is compressed, the ranging contact 12 moves towards the side away from the wafer 20 relative to the ranging barrel 11, the ranging barrel 11 is provided with the laser ranging device 14, the laser ranging device 14 is used for measuring the distance between the ranging platform 1211 of the ranging contact 12 and the laser ranging device 14, and the distance between the laser ranging device 14 fixed on the ranging barrel 11 and the ranging platform 1211 of the ranging contact 12 will change along with the movement of the ranging contact 12 relative to the ranging barrel 11. It can be known that the laser rangefinder 14 measures the distance L0 between the laser rangefinder 14 and the ranging platform 1211 of the ranging contact 12, and the distance L0 between the laser rangefinder 14 and the ranging platform 1211 is variable due to the relative position change between the ranging contact 12 and the ranging barrel 11, and the position of the laser rangefinder 14 on the ranging barrel 11 is fixed, i.e. the distance L1 between the laser rangefinder 14 and the moving body is a fixed value, and in addition, the structure of the ranging contact 12 is unchanged, i.e. the distance L2 between the ranging platform 1211 and the wafer 20 is a fixed value, and the distance between the moving body and the wafer 20 is l0+l1+l2.
The adjusting component 2 is arranged on the moving body, the output shaft 21 of the adjusting component 2 is connected with the ranging cylinder 11, and when the output shaft 21 rotates, the measuring component 1 can be driven to rotate, so that the measuring component 1 rotates to the ranging position or leaves the ranging position. Before the distance between the wafer 20 and the moving body needs to be measured, the adjusting component 2 is utilized to drive the measuring component 1 to rotate to the ranging position, when the wafer 20 is horizontally placed in the reaction cavity 30, the measuring component 1 needs to rotate to the vertical position, and then the moving body is driven to move to be close to the wafer 20 until the other end of the ranging contact 12 abuts against the wafer 20.
Optionally, the ranging barrel 11 includes a barrel 112, a limiting slot 11211 is provided on a side wall of the barrel 112, a limiting protrusion 1212 is provided on the ranging contact 12, and the limiting protrusion 1212 is slidably inserted into the limiting slot 11211. In this embodiment, the cooperation of the limiting slot 11211 and the limiting protrusion 1212 is utilized to ensure that one end of the first elastic element 13 is always located in the ranging barrel 11, so as to ensure the stability of the sliding connection between the ranging contact 12 and the ranging barrel 11, the extending direction of the limiting slot 11211 is the moving direction of the ranging contact 12, and the extending length of the limiting slot 11211 is the maximum moving distance of the ranging contact 12. In specific implementation, the ranging contact 12 is provided with a small hole penetrating radially, the ranging contact 12 can be penetrated into the ranging barrel 11 first, then the limit strip is penetrated into the small hole, and at least one end of the limit strip protrudes out of the outer peripheral surface of the ranging contact 12 to form a limit protrusion 1212.
In other embodiments, the ranging contacts 12 and the ranging barrel 11 may be connected by other structures. For example, the distance measuring contact 12 is provided with a limit protrusion 1212, the end of the distance measuring cylinder 11 is provided with an opening, one end of the distance measuring contact 12 is located in the distance measuring cylinder 11, the other end of the distance measuring contact 12 passes through the opening and extends out of the distance measuring cylinder 11, and the limit protrusion 1212 cannot pass through the opening. When the first elastic member 13 presses the ranging contact 12, the limit protrusion 1212 will abut against the opening, and when the die 20 presses the ranging contact 12 to compress the first elastic member 13, the limit protrusion 1212 will be away from the opening and retract into the ranging barrel 11.
Optionally, the ranging contact 12 includes an abutting portion 121 and a connecting portion 122, one end of the abutting portion 121 is connected with the connecting portion 122 and forms a stepped surface, the other end of the abutting portion 121 extends out of the barrel 112, that is, the other end of the abutting portion 121 is used for abutting against the wafer 20, and the connecting portion 122 is located in the barrel 112 and is used for connecting the first elastic member 13. In particular, when the connecting portion 122 is a connecting rod, the first elastic member 13 is sleeved on the connecting rod, and one end of the first elastic member 13 abuts against the inner wall of the cylinder 112, and the other end of the first elastic member 13 abuts against the step surface, the abutting portion 121 will press the first elastic member 13 to retract the first elastic member 13 when the wafer 20 abuts against the abutting portion 121, and the first elastic member 13 rebounds to return the abutting portion 121 to its initial position when the wafer 20 does not abut against the abutting portion 121. In addition, by providing the limit protrusion 1212 and the limit groove 11211 such that the most distal rebound of the first elastic member 13 against the abutment 121 is limited, the initial position of the first elastic member 13 is not limited to the most distal rebound position, i.e., the limit protrusion 1212 moves in the limit groove 11211, and may not be limited to the end of the limit groove 11211 facing away from the connecting portion 122. Preferably, the limit protrusion 1212 is disposed on the abutment 121.
Preferably, the cylinder 112 includes a first cylinder 1121 and a second cylinder 1122, the first end of the first cylinder 1121 is an open end, the second end of the second cylinder 1122 is provided with a through hole, the open end is detachably connected with the first cylinder 1121, and the first elastic member 13 abuts against the inner wall of the second end. When the distance measuring contact 12 is installed, the first elastic member 13 may be first sleeved on the distance measuring contact 12, then the distance measuring contact 12 is inserted into the first cylinder 1121 and the limiting bar is installed, and finally the second cylinder 1122 is connected with the first cylinder 1121. Preferably, the first cylinder 1121 is provided with internal threads and the open end of the second cylinder 1122 is provided with external threads, the first cylinder 1121 being threadably connected to the second cylinder 1122. Preferably, the laser rangefinder 14 is disposed on the barrel 112, and the laser of the laser rangefinder 14 can be emitted to the step surface, i.e. the ranging platform 1211, through the through hole of the second barrel 1122.
Further, the range finding mechanism further comprises a positioning assembly 3, the positioning assembly 3 comprises a positioning body, a telescopic piece 33 is arranged on the positioning body, the positioning body is connected with the moving body, and the extending end of the telescopic piece 33 can stretch out and draw back relative to the positioning body. The telescopic member 33 is located at a side of the positioning body facing the ranging cylinder 11, and when the measuring assembly 1 is located at the ranging position, the telescopic end extends out to be inserted into the limiting hole 1111 of the ranging cylinder 11. In particular, the extending end of the expansion member 33 is disposed parallel to the output shaft 21 of the adjusting assembly 2, that is, when the measuring assembly 1 rotates around the axial direction of the output shaft 21, the extending end of the expansion member 33 moves and is inserted into the limiting hole 1111 of the ranging barrel 11, so as to limit the movement of the measuring assembly 1 along the axial direction of the output shaft 21, and prevent the measuring assembly 1 from rotating when abutting against the wafer 20, thereby affecting the ranging accuracy.
Optionally, the positioning body is further provided with a stop protrusion 31, and when the measuring assembly 1 rotates to the ranging position, the stop protrusion 31 abuts against the measuring assembly 1. The stop protrusion 31 is used to limit the continued rotation of the measuring assembly 1 to ensure that the measuring assembly 1 must stop in the ranging position, and the stop protrusion 31 is also arranged such that the measuring assembly 1, after being rotated in a predetermined direction to the ranging position, is required to be rotated in a direction opposite to the predetermined direction to leave the ranging position.
On the basis, the adjusting assembly 2 further comprises a second elastic piece 23, the ranging cylinder 11 further comprises a mounting ring 111, the cylinder 112 is arranged on the mounting ring 111, and the mounting ring 111 is sleeved on the output shaft 21 and in clearance fit with the output shaft 21. In this embodiment, the cylinder 112 and the mounting ring 111 are connected to the output shaft 21 through the second elastic member 23, and the second elastic member 23 can elastically deform, so that after the measuring assembly 1 abuts against the stop protrusion 31, the output shaft 21 still has a certain rotation space, that is, the ranging cylinder 11 and the output shaft 21 can not synchronously rotate, so that the accuracy requirement of the adjusting assembly 2 is further reduced while the measuring assembly 1 is ensured to stop at the ranging position. In this embodiment, the adjusting component 2 includes a motor, and the output shaft 21 of the adjusting component 2 is the output shaft 21 of the motor, and the motor may be a stepper motor.
Optionally, the adjusting assembly 2 further includes a hanging rod 24, the hanging rod 24 is disposed on the output shaft 21, the measuring assembly 1 further includes a connecting rod 113, the connecting rod 113 is disposed on the cylinder 112, one end of the second elastic member 23 is connected with the hanging rod 24, the other end of the second elastic member 23 is connected with the connecting rod 113, the second elastic member 23 extends along the radial direction of the output shaft 21 when not subjected to external force, and when the mounting ring 111 is stopped by the stop protrusion 31, if the output shaft 21 continues to rotate, one end of the second elastic member 23 is stretched by the hanging rod 24. Preferably, the output shaft 21 is further provided with a concentric ring 22, the concentric ring 22 is consistent with the outer diameter of the mounting ring 111, and the hanging rod 24 is disposed on the outer circumferential surface of the concentric ring 22.
Preferably, the positioning body is a positioning ring 32, the positioning ring 32 and the mounting ring 111 are coaxially arranged, the end surface of the positioning ring 32 is provided with a mounting hole, the telescopic piece 33 is arranged in the mounting hole, the end surface of the mounting ring 111 is provided with a limiting hole 1111, and when the measuring assembly 1 is positioned at the ranging position, the extending end of the telescopic piece 33 can extend out of the mounting hole and be inserted into the limiting hole 1111. Preferably, the telescoping member 33 is a telescoping cylinder.
Preferably, the stop protrusion 31 is disposed on the outer peripheral surface of the positioning ring 32, and the outer peripheral surface of the mounting ring 111 is provided with a stop notch 1112, and when the stop protrusion 31 abuts against the measuring assembly 1, the stop protrusion 31 is located in the stop notch 1112, so as to ensure that the relative positions of the mounting ring 111 and the positioning ring 32 are unchanged.
Preferably, the positioning assembly 3 further comprises a connecting piece 34, the positioning ring 32 is sleeved on the output shaft 21 and in clearance fit with the output shaft 21, and the positioning ring 32 is connected with the picking and placing finger 10 through the connecting piece 34.
Optionally, the ranging mechanism further comprises a display screen 4, the display screen 4 is electrically connected with the laser range finder 14, and the display screen 4 is used for displaying the distance between the ranging platform 1211 and the laser range finder 14. In practice, the display screen 4 is disposed on the moving body, and its specific position can be determined according to the observation habit of the operator, so as to facilitate the observation of the operator.
As shown in fig. 4 and 5, this embodiment further provides a pick-and-place device, including pick-and-place finger 10 and ranging mechanism, pick-and-place platform 101 is provided on pick-and-place finger 10, pick-and-place platform 101 is used for placing wafer 20, pick-and-place platform 101 is concavely provided with mounting groove 1011, ranging mechanism sets up in mounting groove 1011 to the range finding contact 12 butt wafer 20 of ranging mechanism is convenient, thereby realizes accurate range finding.
Preferably, the picking and placing device further comprises a picking and placing driving member, the picking and placing finger 10 is connected to the output end of the picking and placing driving member, and the picking and placing driving member can drive the picking and placing finger 10 to move.
In the implementation, the finger 10 is moved to the lower side or the upper side of the wafer 20, and the adjusting component 2 drives the measuring component 1 to rotate to the ranging position, at this time, the measuring component 1 is not abutted to the wafer 20, and the position of the finger 10 is recorded as the initial position. And then the picking and placing finger 10 continues to move so as to enable the ranging contact 12 to be abutted against the wafer 20, and the distance L0 measured by the measuring component 1 is obtained, when the sum of L0, L1 and L2 is a preset value, the picking and placing finger 10 stops moving at the moment, the position where the picking and placing finger 10 is located is marked as a termination position, and the distance where the picking and placing finger 10 moves from the initial position to the termination position is obtained as a correction distance. The correction distance may be used to correct the preset path of the picking finger 10 so that the picking finger 10 may be moved directly to the final position the next time the picking finger 10 is moved.
The above embodiments merely illustrate the basic principle and features of the present invention, and the present invention is not limited to the above embodiments, but may be varied and altered without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. Ranging mechanism can install on moving body, its characterized in that, ranging mechanism includes:
the measuring assembly (1) comprises a ranging cylinder (11), a first elastic piece (13) and a ranging contact (12), wherein the first elastic piece (13) is positioned in the ranging cylinder (11), one end of the ranging contact (12) is positioned in the ranging cylinder (11) and connected with the first elastic piece (13), the other end of the ranging contact (12) is positioned outside the ranging cylinder (11) and can be abutted to a wafer (20), a laser range finder (14) is further arranged on the ranging cylinder (11), and the laser range finder (14) is used for measuring the distance between a ranging platform (1211) of the ranging contact (12) and the laser range finder (14);
the adjusting component (2) is arranged on the moving body, an output shaft (21) of the adjusting component (2) is connected with the ranging cylinder (11), the output shaft (21) rotates to enable the measuring component (1) to rotate to a ranging position or leave the ranging position, the measuring component (1) is located at the ranging position, and the other end of the ranging contact (12) can be abutted to the wafer (20).
2. The ranging mechanism as claimed in claim 1, wherein the ranging barrel (11) comprises a barrel (112), a limit groove (11211) is formed in the side wall of the barrel (112), the ranging contact (12) is provided with a limit protrusion (1212), and the limit protrusion (1212) is slidably inserted into the limit groove (11211).
3. The ranging mechanism according to claim 2, wherein the ranging contact (12) comprises an abutting portion (121) and a connecting portion (122), one end of the abutting portion (121) is connected with the connecting portion (122) and forms a stepped surface, the other end of the abutting portion (121) extends out of the cylinder (112), the connecting portion (122) is located in the cylinder (112), the first elastic member (13) is sleeved on the connecting portion (122), one end of the first elastic member (13) abuts against the inner wall of the cylinder (112), and the other end of the first elastic member (13) abuts against the stepped surface.
4. A ranging mechanism as claimed in claim 3 wherein the barrel (112) comprises a first barrel (1121) and a second barrel (1122), the first end of the second barrel (1122) being an open end, the second end of the second barrel (1122) being provided with a through hole, the open end being detachably connected to the first barrel (1121), the first resilient member (13) abutting against an inner wall of the second end, the laser of the laser range finder (14) being capable of being emitted through the through hole to the stepped surface, the stepped surface being the ranging platform (1211).
5. Ranging mechanism according to claim 2, characterized in that it further comprises a positioning assembly (3), said positioning assembly (3) being connected with said mobile body, said positioning assembly (3) comprising a positioning body, one side of said positioning body facing said ranging cylinder (11) being provided with a telescopic element (33), the projecting end of said telescopic element (33) being able to telescope with respect to said positioning body, so as to be inserted in a limit hole (1111) of said ranging cylinder (11) when said measuring assembly (1) is in said ranging position.
6. Ranging mechanism according to claim 5, characterized in that the positioning body is further provided with a stop protrusion (31), the measuring assembly (1) being turned to the ranging position, the stop protrusion (31) abutting the measuring assembly (1).
7. The distance measuring mechanism according to claim 6, wherein the adjusting assembly (2) further comprises a second elastic member (23), the distance measuring cylinder (11) further comprises a mounting ring (111), the cylinder body (112) is arranged on the mounting ring (111), the mounting ring (111) is sleeved on the output shaft (21) and is in clearance fit with the output shaft (21), and the cylinder body (112) or the mounting ring (111) is connected with the output shaft (21) through the second elastic member (23).
8. The distance measuring mechanism according to claim 7, wherein the adjusting assembly (2) further comprises a hanging rod (24), the hanging rod (24) is arranged on the output shaft (21), the measuring assembly (1) further comprises a connecting rod (113), the connecting rod (113) is arranged on the distance measuring cylinder (11), one end of the second elastic piece (23) is connected with the hanging rod (24), and the other end of the second elastic piece (23) is connected with the connecting rod (113).
9. The ranging mechanism of any of claims 1 to 8, further comprising a display screen (4), the display screen (4) being electrically connected to the laser rangefinder (14), the display screen (4) being configured to display a distance between the ranging platform (1211) and the laser rangefinder (14).
10. Get and put device, its characterized in that, get and put device and put finger (10) and the range finding mechanism of any one of claims 1 to 9 including getting, get and put and be provided with on finger (10) and get and put platform (101), get and put platform (101) and be used for placing wafer (20), get and put platform (101) indent and be equipped with mounting groove (1011), range finding mechanism set up in mounting groove (1011).
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| CN202311300863.6A CN117038534B (en) | 2023-10-10 | 2023-10-10 | Distance measuring mechanism and pick-and-place device |
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| CN202311300863.6A CN117038534B (en) | 2023-10-10 | 2023-10-10 | Distance measuring mechanism and pick-and-place device |
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| CN117038534B true CN117038534B (en) | 2023-12-12 |
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