CN117038505A - Wafer detection device and method - Google Patents

Wafer detection device and method Download PDF

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Publication number
CN117038505A
CN117038505A CN202310948367.5A CN202310948367A CN117038505A CN 117038505 A CN117038505 A CN 117038505A CN 202310948367 A CN202310948367 A CN 202310948367A CN 117038505 A CN117038505 A CN 117038505A
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China
Prior art keywords
wafer
image
image collector
distance
image acquisition
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CN202310948367.5A
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Chinese (zh)
Inventor
朱浩
许志彬
林保璋
兰海燕
李士昌
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Shengjisheng Precision Technology Ningbo Co ltd
SGS Ningbo Semiconductor Technology Co Ltd
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Shengjisheng Precision Technology Ningbo Co ltd
SGS Ningbo Semiconductor Technology Co Ltd
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Priority to CN202310948367.5A priority Critical patent/CN117038505A/en
Publication of CN117038505A publication Critical patent/CN117038505A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106—General arrangement of respective parts
    • G01N2021/0112—Apparatus in one mechanical, optical or electronic block

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • General Health & Medical Sciences (AREA)
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  • Pathology (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The application provides a wafer detection device and a method, wherein the device comprises an XY mechanism and an image acquisition mechanism which are arranged on a base station, the image acquisition mechanism comprises an image acquisition device and a ranging module, and the ranging module is positioned at one side of the image acquisition device; the XY mechanism is provided with a lifting mechanism, and the lifting end of the lifting mechanism is provided with a wafer carrying platform. The method comprises the steps of measuring the distance between a calibration object and a measuring lens of an image collector in advance, moving a wafer carrying platform loaded with a wafer to be measured according to a serpentine path from a ranging module to the direction formed by the image collector to perform image acquisition detection, and correcting the focusing distance between the wafer to be measured and the image collector in the image acquisition detection process through a focusing distance predicted value. The application can ensure the quality of drawing when the wafer is normally drawn by comparing and correcting the focusing distance value measured in real time with the focusing distance value measured in advance, and the detection device has simple structure, thereby greatly improving the efficiency of drawing detection of the wafer and reducing the drawing detection cost.

Description

Wafer detection device and method
Technical Field
The application relates to the technical field of semiconductor manufacturing detection, in particular to a wafer detection device; in addition, the application also relates to a wafer detection method.
Background
In wafer inspection, high sensitivity to various small defects is required while maintaining high inspection speed. The detection speed must be reduced because smaller defects are detected.
For high-precision wafer surface detection, a stable and constant focusing distance is required between a lens and the wafer surface or a specific layer in the scanning process in the high-precision detection process, and usually the focusing distance deviation cannot exceed the depth of field of the lens, or a shot image is blurred.
To ensure that the lens remains a relatively constant distance from the wafer surface during scanning of the wafer, the apparatus typically requires real-time focusing of the wafer surface by some mechanism and method. In the prior art, some solutions have also been proposed regarding the above problems as follows:
the first scheme is a vertical scan combined image algorithm: for each shooting point on the wafer, the lens can move in the vertical direction to collect a series of pictures, and the sharpest and clear picture is found out through an image algorithm. However, in the above manner, since a plurality of pictures need to be acquired for each shooting point on the wafer, the overall device detection efficiency is low.
The second scheme is a reflective lens coaxial focusing method: the laser sensor vertically and downwards strikes the upper surface of the wafer through the lens, the distance from the lens to the surface of the wafer at the moment is calculated by collecting feedback signals, and then the deviation of the focusing distance is compared, and the height of the lens is photographed after being adjusted once. This approach is much faster than the vertical scan plus image algorithm because the objective lens only needs to be moved once. However, in the above-described method, since the light emitted from the laser sensor is irradiated to the surface of the wafer through the lens, the wavelength of the laser sensor light needs to be avoided from the wavelength for collecting the image by the lens, and otherwise the image captured by the lens may be affected by the flare of the laser sensor. For example, the image captured by the lens captures the entire white light band, the laser sensor uses red light, and the red light spot is captured in the pattern captured by the lens, which interferes with other image details that the lens wants to see. In particular, if a series of complex optical systems are provided behind the lens, such as optical paths for fluorescence excitation of fixed wavelength, the complexity and cost of the overall design of the lens are increased to ensure that the light rays of each path and the light rays of the laser sensor do not interfere.
The third scheme is a pre-sweeping method: the surface of the wafer is pre-collected in a surface shape through the height sensor, and then the height information of each point to be photographed is recorded, so that the response height can be well focused when the lens is used for subsequent collection and photographing. However, the above method requires a pre-scanning step, which results in an additional step in the overall test, and thus, the detection efficiency is affected.
Disclosure of Invention
In order to solve the problems in the prior art, at least one embodiment of the application provides a wafer detection device, which can ensure the quality of drawing when the wafer is normally drawn by comparing and correcting a focusing distance value measured in real time with a focusing distance value measured in advance, has a simple structure, improves the efficiency of drawing detection of the wafer to a great extent, and reduces the drawing detection cost. To this end, at least one embodiment of the present application also provides a wafer inspection method.
In a first aspect, an embodiment of the present application provides a wafer detection apparatus, including a base station, on which an XY mechanism and an image acquisition mechanism are disposed, the image acquisition mechanism includes an image collector and a ranging module, the ranging module is located at one side of the image collector; the XY mechanism is provided with a lifting mechanism, the lifting end of the lifting mechanism is provided with a wafer carrying table, and the image acquisition mechanism is positioned above the wafer carrying table.
In some embodiments, the XY mechanism includes a sliding seat, a first guide rail for sliding the sliding seat laterally, and a second guide rail for sliding the sliding seat longitudinally, wherein the sliding seat is connected to the lifting mechanism.
In some embodiments, a rotation mechanism is disposed between a lifting end of a lifting mechanism and a wafer carrier.
In some embodiments, the ranging module is disposed adjacent to the image collector, and the ranging module and the image collector are perpendicular to the base station.
In some embodiments, the wafer inspection apparatus provided by the present application is provided with a positioning seat on a base, and an image acquisition mechanism is connected to one side above the positioning seat.
In some embodiments, the image acquisition mechanism further comprises a connecting plate, a first connecting seat and a second connecting seat, the image acquisition device is connected to the connecting plate through the first connecting seat, the ranging module is connected to the connecting plate through the second connecting seat, and the connecting plate is connected to one side above the positioning seat.
In some embodiments, the first connecting seat comprises a first upper connecting block and a first lower connecting block, the first lower connecting block is connected to the connecting plate, and the first upper connecting block fixes the image collector to the first lower connecting block through a first connecting hole; the second connecting seat comprises a second upper connecting block and a second lower connecting block, the second lower connecting block is connected to the connecting plate, and the second upper connecting block is used for fixing the ranging module to the second lower connecting block through a second connecting hole.
In some embodiments, the image collector includes a camera, a micro lens and a light source, one end of the micro lens is connected to the camera, and the other end of the micro lens is connected to the light source.
In some embodiments, the wafer inspection apparatus provided by the present application is provided with a vacuum adsorption device on a wafer carrier.
In a second aspect, an embodiment of the present application further provides a wafer inspection method, where the wafer inspection apparatus of the first aspect is applied, and the method includes:
the distance between the calibration object and the measuring lens of the image collector is measured in advance to obtain a focusing distance predicted value;
disassembling the calibration object, loading the wafer to be tested, moving the wafer carrying platform loaded with the wafer to be tested according to the direction formed by the serpentine path from the ranging module to the image collector to perform image acquisition detection, wherein the distance between the ranging module and the image collector is equal to the distance between adjacent branches of the serpentine path;
and correcting the focusing distance between the wafer to be tested and the image collector in the process of image acquisition detection through the focusing distance predicted value.
In some embodiments, in the wafer detection method provided by the application, a calibration object with a flat surface is arranged on the wafer carrying platform, and the distance between the calibration object and the measurement lens of the image collector is adjusted, so that the distance measurement module value is read when the measurement lens is clearly imaged in the image collector.
In some embodiments, the wafer inspection method provided by the present application includes:
and adjusting the position of the wafer to be tested by rotating the wafer carrier.
In some embodiments, the method for detecting a wafer provided by the present application, for correcting a focusing distance between a wafer to be detected and an image collector in a process of image acquisition detection by using a focusing distance predicted value, includes:
the distance measuring module firstly measures a real-time focusing distance value of a wafer to be measured on a longitudinal branch;
after the wafer to be tested transversely moves, the image collector is positioned on the longitudinal branch;
when the wafer to be tested continuously moves longitudinally, the image collector performs image collection detection after correcting the real-time focusing distance value according to the focusing distance predicted value.
In some embodiments, in the wafer inspection method provided by the present application, a direction from the ranging module to the image collector is parallel to a direction in which the wafer to be inspected moves laterally.
Therefore, the device and the method for detecting the wafer can ensure the quality of drawing when the wafer is normally drawn by comparing and correcting the focusing distance value measured in real time with the focusing distance value measured in advance, and the device has a simple structure, so that the efficiency of drawing detection of the wafer is improved to a great extent, and the drawing detection cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a wafer inspection apparatus according to an embodiment of the application;
FIG. 2 is a schematic view of a wafer carrier according to an embodiment of the application;
FIG. 3 is a schematic diagram of an image capturing mechanism according to an embodiment of the present application;
FIG. 4 is a flowchart of a wafer inspection method according to an embodiment of the application;
FIG. 5 is a schematic diagram of a serpentine path according to an embodiment of the present application;
FIG. 6 is a schematic diagram of a measurement calibration object according to an embodiment of the present application;
fig. 7 is a schematic diagram showing a comparison between a real-time focusing distance value and a predicted focusing distance value according to an embodiment of the application.
Reference numerals in the drawings corresponding to the specification are referred to as follows:
base 1, positioning seat 11, xy mechanism 2, first guide rail 21, second guide rail 22, image acquisition mechanism 3, image collector 31, camera 311, micro lens 312, light source 313, ranging module 32, connecting plate 33, first connecting seat 34, first upper connecting block 341, first connecting hole 3411, first lower connecting block 342, second connecting seat 35, second upper connecting block 351, second connecting hole 3511, second lower connecting block 352, lifting mechanism 4, wafer carrier 5, rotation mechanism 6, calibration object 7, serpentine path 8, longitudinal branch 81, lateral branch 82.
Detailed description of the preferred embodiments
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. In this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
[ example 1 ]
The inventor of the scheme finds that in the prior art, the wafer pattern drawing detection efficiency is low and the cost is high. The embodiment of the application provides the following scheme:
as shown in fig. 1, the present embodiment provides a wafer detecting device, which includes a base 1, an XY mechanism 2 and an image capturing mechanism 3 are disposed on the base 1, the image capturing mechanism 3 includes an image capturing device 31 and a ranging module 32, and the ranging module 32 is located at one side of the image capturing device 31. The XY mechanism 2 is provided with a lifting mechanism 4, the lifting end of the lifting mechanism 4 is provided with a wafer carrying platform 5, and the image acquisition mechanism 3 is positioned above the wafer carrying platform 5. The image collector 31 comprises a camera 311, a micro lens 312 and a light source 313, one end of the micro lens 312 is connected to the camera 311, the other end of the micro lens 312 is connected to the light source 313, and the camera 311 can adopt an area-array camera or a linear-array camera.
The position of the image pickup device 31 at the time of picking up a picture is adjusted by moving the wafer stage 5 in the horizontal direction or the vertical direction by the XY mechanism 2, and the focusing distance between the wafer stage 5 and the image pickup device 31 at the time of picking up a picture is adjusted by moving the wafer stage 5 up and down by the lifting mechanism 4.
The ranging module 32 adopts a ranging sensor, the wafer detection precision needs to be in the order of tens of nanometers, the depth of field of the micro lens 312 is only a few micrometers, even 1 micrometer, the ranging repeatability of the ranging sensor is a few tenths of micrometers, and the micro lens 312 can be guaranteed to be focused in real time through the ranging sensor.
Further, the XY mechanism 2 includes a slide holder, a first rail 21 that makes the slide holder slide laterally, and a second rail 22 that makes the slide holder slide longitudinally, the slide holder being connected to the elevating mechanism 4.
It can be understood that the sliding seat drives the lifting mechanism 4 to move transversely simultaneously in the process of moving transversely on the first guide rail 21, and the lifting mechanism 4 drives the wafer carrier 5 to move transversely simultaneously. The sliding seat drives the lifting mechanism 4 to longitudinally move simultaneously in the process of longitudinally moving on the second guide rail 22, and the lifting mechanism 4 drives the wafer carrier 5 to longitudinally move simultaneously.
The ranging module 32 is disposed adjacent to the image collector 31, and both the ranging module 32 and the image collector 31 are perpendicular to the base station 1. It should be noted that, the distance between the ranging module 32 and the image collector 31 determines the distance between each branch in the serpentine path during the subsequent image capturing and detecting, and the distance between each branch in the serpentine path can be reduced by the adjacent arrangement of the ranging module 32 and the image collector 31, so that the image capturing can be performed more densely, and the patterns of more positions in the wafer to be detected can be captured. In addition, when the ranging module 32 and the image collector 31 are perpendicular to the base 1, the wafer to be measured loaded on the wafer carrier 5 is directly mapped vertically downwards, so that the sampling efficiency and the sampling accuracy are improved.
Further, as shown in fig. 2, a rotation mechanism 6 is provided between the lifting end of the lifting mechanism 4 and the wafer stage 5. The rotation mechanism 6 may be controlled to rotate by a rotating disk or by a reducing motor. Specifically, in this embodiment, the rotating mechanism 6 employs a rotating disc, and the contact surface of the rotating end of the rotating disc is larger, so that the wafer carrier is more stable during rotation. The rotating disk drives the wafer carrier 5 to rotate so as to adjust the position of the wafer to be tested loaded by the wafer carrier 5, so that the image collector 31 can find the mark of the wafer to be tested.
Further, a vacuum suction device 51 is provided on the wafer stage 5. It should be noted that, the vacuum adsorption device 51 includes a suction cup installed around the wafer carrier 5 and a vacuum air path installed inside the wafer carrier 5, when the wafer carrier 5 is loaded with the wafer to be tested, the vacuum air path is opened to enable the suction cup to suck the wafer to be tested, so that the stability of the wafer to be tested in the process of picking up the image is improved, and the accuracy of the image picking up detection is improved.
Further, as shown in fig. 3, a positioning seat 11 is provided on the base 1, and the image capturing mechanism 3 is connected to a side above the positioning seat 11. The image acquisition mechanism 3 further comprises a connecting plate 33, a first connecting seat 34 and a second connecting seat 35, the image acquisition device 31 is connected to the connecting plate 33 through the first connecting seat 34, the ranging module 32 is connected to the connecting plate 33 through the second connecting seat 35, and the connecting plate 33 is connected to one side above the positioning seat 11.
Further, for easy disassembly and stable fixation, the first connection base 34 includes a first upper connection block 341 and a first lower connection block 342, the first lower connection block 342 is connected to the connection plate 33, and the first upper connection block 341 fixes the image collector 31 to the first lower connection block 342 through the first connection hole 3411. The second connection seat 35 includes a second upper connection block 351 and a second lower connection block 352, the second lower connection block 352 being connected to the connection plate 33, the second upper connection block 351 fixing the ranging module 32 to the second lower connection block 352 through a second connection hole 3511.
It should be noted that, the first upper connecting block 341, the first lower connecting block 342, the second upper connecting block 351 and the second lower connecting block 352 may be rectangular, round, square, etc., and in this embodiment, the first upper connecting block 341, the first lower connecting block 342, the second upper connecting block 351 and the second lower connecting block 352 all adopt rectangular, the first upper connecting block 341 and the first lower connecting block 342 are all provided with the groove of the adaptive image collector 31, and the second upper connecting block 351 and the second lower connecting block 352 are all provided with the groove of the adaptive ranging module 32, which is simple in structure. It should be understood by those skilled in the art that the above-mentioned structure using a rectangular parallelepiped is merely a simple example to illustrate the feasibility of the present application, and should not be used to limit the scope of the present application only in the above-mentioned embodiments.
The first connecting hole 3411 may be screwed with a bolt to fix the image pickup device 31 between the first upper connecting block 341 and the first lower connecting block 342. A screw may be screwed into the second connection hole 3511 to fix the ranging module 32 between the second upper connection block 351 and the second lower connection block 352. When the maintenance image collector 31 needs to be disassembled, only the bolts in the first connecting holes 3411 need to be loosened, so that the first upper connecting block 341 and the first lower connecting block 342 are separated for disassembly. When the maintenance ranging module 32 is required to be disassembled, only the bolts in the second connection holes 3511 are required to be loosened, so that the second upper connection block 351 is separated from the second lower connection block 352 to be disassembled. It should be understood by those skilled in the art that the above-mentioned manner of fastening by bolts and detaching by unscrewing bolts is merely illustrative of the feasibility and should not be taken as limiting the scope of the application in the above-mentioned embodiments.
[ example 2 ]
As shown in fig. 4, this embodiment further provides a wafer inspection method, and the wafer inspection apparatus of embodiment 1 is applied, where the method includes:
the distance between the calibration object 7 and the measuring lens of the image collector 31 is measured in advance to obtain a focusing distance predicted value;
disassembling the calibration object 7 and loading the wafer to be measured, wherein the wafer carrying platform 5 loaded with the wafer to be measured moves according to the direction formed by the serpentine path 8 from the ranging module 32 to the image collector 31 for image acquisition detection, and the distance between the ranging module 32 and the image collector 31 is equal to the distance between adjacent branches of the serpentine path 8;
the focusing distance between the wafer to be measured and the image collector 31 in the process of image acquisition detection is corrected through the focusing distance predicted value.
It should be noted that, as shown in fig. 5, the serpentine path 8 includes a plurality of longitudinal branches 81 and a plurality of transverse branches 82, and it is understood that the transverse branches 82 are turning portions of the serpentine path 8. Specifically, the distance between the ranging module 32 and the image collector 31 is equal to the distance between adjacent longitudinal branches 81.
It should be noted that, when the wafer carrier 5 on which the wafer to be measured is loaded performs image capturing inspection, the wafer carrier 5 needs to be moved laterally from the direction from the ranging module 32 to the image collector 31 to the position below the image collecting mechanism 3, that is, the wafer to be measured is first moved vertically below the ranging module 32, and then the wafer carrier 5 moves vertically, and the ranging module 32 measures the focusing distance of the wafer to be measured on the vertical branch 81. Then the wafer carrier 5 moves transversely, the wafer to be tested enters the lower part of the image collector 31, namely, the image collector 31 collects images of the wafer to be tested on the longitudinal branch 81, then the focusing distance between the wafer to be tested and the image collector 31 in the image collection detection process is corrected according to the focusing distance predicted value H0, and the whole image collection detection of the wafer to be tested is completed by repeating the steps.
Further, the pre-determining the distance between the calibration object 7 and the measuring lens of the image collector 31 includes: the wafer carrier 5 is provided with a calibration object 7 with a flat surface, and the distance between the calibration object and the measuring lens of the image collector 31 is adjusted so as to read the value of the ranging module when the image collector 31 clearly images.
It should be noted that, the calibration object 7 may be a calibration block with a flatness of 1 μm, for example, a planar plate, a planar metal block, or the like. Specifically, as shown in fig. 6, a calibration object 7 is disposed on the wafer carrier 5, the wafer carrier 5 drives the calibration object 7 to move below the image acquisition mechanism 3 through the XY mechanism 2, the wafer carrier 5 drives the calibration object 7 to adjust the height up and down through the lifting mechanism 4, and the value of the ranging module 32 is read until the imaging in the image collector 31 is sharpest, and the measured value is used as a focusing distance predicted value H0. It will be appreciated that the sharpness determination may be measured by the number of pixels occupied by the features on the calibration object 7.
Further, the direction formed by the ranging module 32 to the image collector 31 is parallel to the direction of the lateral movement of the wafer to be measured. It can be appreciated that the efficiency in image acquisition detection can be improved in the above manner.
Further, the loading of the wafer to be tested includes adjusting the position of the wafer to be tested by rotating the wafer stage 5. It should be noted that, the wafer carrier 5 is driven to rotate to adjust the position of the wafer to be tested loaded by the wafer carrier 5, so that the image collector 31 can find the mark of the wafer to be tested.
Further, correcting the focusing distance between the wafer to be measured and the image collector 31 in the process of image acquisition and detection by the focusing distance predicted value includes:
the ranging module 32 first measures the real-time focusing distance value of the wafer to be measured on one longitudinal branch 81;
after the wafer to be tested moves transversely, the image collector 31 is positioned on the longitudinal branch 81;
when the wafer to be tested continuously moves longitudinally, the image collector 31 performs image collection detection after correcting the real-time focusing distance value according to the focusing distance predicted value.
Specifically, as shown in fig. 7, the ranging module 32 measures the real-time focusing distance value a1 of the first point and the real-time focusing distance value b1 of the second point of the wafer to be measured on one longitudinal branch 81. After the wafer to be tested moves transversely, the image collector 31 is located on the longitudinal branch 81, when the wafer to be tested moves longitudinally continuously to the first point, a1 is compared with the predicted focusing distance value H0, at this time, a1 is smaller than H0, a distance difference value H0-a1 is obtained, the wafer carrier 5 moves downwards to H0-a1 to be corrected to the focusing value, and the image collector 31 performs image collection detection on the point. When the wafer to be tested continuously moves longitudinally to the second point, b1 is compared with the focusing distance predicted value H0, and at the moment, b1 is larger than H0 to obtain a distance difference value b1-H0, the wafer carrying platform 5 moves upwards by b1-H0 to correct the focusing distance value, and the image collector 31 carries out image acquisition detection on the point.
The focusing distance values of all the points on the longitudinal branch 81 are corrected in the above manner, and the image collector 31 performs image acquisition detection on all the points on the longitudinal branch 81, and then performs corrected image acquisition detection on the entire longitudinal branch 81 on the wafer to be measured.
In summary, embodiments 1-2 of the present application provide a wafer detecting device and method, which can ensure the quality of picking up images when picking up images of a wafer normally by comparing and correcting a focus distance value measured in real time with a focus distance value measured in advance, and the detecting device has a simple structure, thereby improving the efficiency of detecting the picking up images of the wafer to a great extent and reducing the cost of detecting the picking up images.
The above is merely an embodiment of the present application, and the scope of the present application is not limited thereto. Those skilled in the art can make changes or substitutions within the technical scope of the present disclosure, and such changes or substitutions should be included in the scope of the present disclosure.
Those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments.
Although embodiments of the present application have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the application, and such modifications and variations fall within the scope of the application as defined by the appended claims.

Claims (14)

1. The wafer detection device is characterized by comprising a base station (1), wherein an XY mechanism (2) and an image acquisition mechanism (3) are arranged on the base station (1), the image acquisition mechanism (3) comprises an image acquisition device (31) and a ranging module (32), and the ranging module (32) is positioned on one side of the image acquisition device (31); the XY mechanism (2) is provided with a lifting mechanism (4), the lifting end of the lifting mechanism (4) is provided with a wafer carrying table (5), and the image acquisition mechanism (3) is located above the wafer carrying table (5).
2. Wafer inspection device according to claim 1, characterized in that the XY mechanism (2) comprises a slide seat, a first guide rail (21) for sliding the slide seat laterally, a second guide rail (22) for sliding the slide seat longitudinally, the slide seat being connected to the lifting mechanism (4).
3. Wafer inspection apparatus according to claim 1, characterized in that a rotation mechanism (6) is provided between the lifting end of the lifting mechanism (4) and the wafer carrier (5).
4. Wafer inspection device according to claim 1, characterized in that the ranging module (32) is arranged adjacent to the image collector (31) and that both the ranging module (32) and the image collector (31) are perpendicular to the base station (1).
5. The wafer inspection apparatus according to claim 1, wherein a positioning seat (11) is provided on the base (1), and the image acquisition mechanism (3) is connected to a side above the positioning seat (11).
6. The wafer inspection apparatus according to claim 5, wherein the image capturing mechanism (3) further comprises a connection board (33), a first connection base (34) and a second connection base (35), the image capturing device (31) is connected to the connection board (33) through the first connection base (34), the ranging module (32) is connected to the connection board (33) through the second connection base (35), and the connection board (33) is connected to a side above the positioning base (11).
7. The wafer inspection apparatus according to claim 6, wherein the first connection base (34) includes a first upper connection block (341) and a first lower connection block (342), the first lower connection block (342) being connected to the connection plate (33), the first upper connection block (341) fixing the image collector (31) to the first lower connection block (342) through a first connection hole (3411); the second connecting seat (35) comprises a second upper connecting block (351) and a second lower connecting block (352), the second lower connecting block (352) is connected to the connecting plate (33), and the second upper connecting block (351) is used for fixing the ranging module (32) to the second lower connecting block (352) through a second connecting hole (3511).
8. The wafer inspection apparatus according to claim 1, wherein the image collector (31) includes a camera (311), a micro lens (312), and a light source (313), one end of the micro lens (312) is connected to the camera (311), and the other end of the micro lens (312) is connected to the light source (313).
9. Wafer inspection apparatus according to claim 1, characterized in that the wafer carrier (5) is provided with a vacuum suction device (51).
10. A wafer inspection method employing the wafer inspection apparatus according to any one of claims 1 to 9, the method comprising:
the distance between the calibration object (7) and the measuring lens of the image collector (31) is measured in advance to obtain a focusing distance predicted value;
the wafer carrying platform (5) loaded with the wafer to be tested moves from the ranging module (32) to the image collector (31) according to the direction formed by the serpentine path (8) to perform image acquisition detection, and the distance between the ranging module (32) and the image collector (31) is equal to the distance between adjacent branches of the serpentine path (8);
and correcting the focusing distance between the wafer to be tested and the image collector (31) in the process of image acquisition detection through the focusing distance predicted value.
11. The wafer inspection method according to claim 10, wherein the pre-determining the distance between the calibration object (7) and the measurement lens of the image collector (31) comprises:
and a calibration object (7) with a flat surface is arranged on the wafer carrying platform (5), and the distance between the calibration object and a measuring lens of the image collector (31) is adjusted so that the distance measuring module can read the value of the distance measuring module when the image collector (31) clearly images.
12. The method of claim 10, wherein loading the wafer to be tested comprises:
and adjusting the position of the wafer to be tested by rotating the wafer carrying table (5).
13. The wafer inspection method according to claim 10, wherein correcting the focus distance of the wafer under test from the image collector (31) in the process of image acquisition inspection by the focus distance prediction value includes:
the distance measuring module (32) firstly measures a real-time focusing distance value of the wafer to be measured on one longitudinal branch (81);
after the wafer to be tested moves transversely, the image collector (31) is positioned on the longitudinal branch (81);
when the wafer to be tested continuously moves longitudinally, after correcting the real-time focusing distance value according to the focusing distance predicted value, the image collector (31) performs image collection detection.
14. The wafer inspection method according to claim 10, characterized in that the direction of the ranging module to the image collector (31) is parallel to the direction of the lateral movement of the wafer to be inspected.
CN202310948367.5A 2023-07-31 2023-07-31 Wafer detection device and method Pending CN117038505A (en)

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CN202310948367.5A CN117038505A (en) 2023-07-31 2023-07-31 Wafer detection device and method

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Application Number Priority Date Filing Date Title
CN202310948367.5A CN117038505A (en) 2023-07-31 2023-07-31 Wafer detection device and method

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