CN117031069A - Triaxial accelerometer and sensing device - Google Patents
Triaxial accelerometer and sensing device Download PDFInfo
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- CN117031069A CN117031069A CN202310846426.8A CN202310846426A CN117031069A CN 117031069 A CN117031069 A CN 117031069A CN 202310846426 A CN202310846426 A CN 202310846426A CN 117031069 A CN117031069 A CN 117031069A
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- 238000001514 detection method Methods 0.000 claims abstract description 76
- 239000003990 capacitor Substances 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims 2
- 210000000438 stratum basale Anatomy 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000001133 acceleration Effects 0.000 description 26
- 238000005259 measurement Methods 0.000 description 12
- 230000035945 sensitivity Effects 0.000 description 10
- 230000009286 beneficial effect Effects 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- 244000126211 Hericium coralloides Species 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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Abstract
The invention relates to a triaxial accelerometer, which comprises a basal layer and a sensitive structure layer, wherein the sensitive structure layer comprises a mass frame, an X-axis detection structure, a Y-axis detection structure and a Z-axis detection structure, and the X-axis detection structure, the Y-axis detection structure and the Z-axis detection structure are tiled in the mass frame in the same layer. And further relates to a sensing device comprising such a triaxial accelerometer. According to the invention, the X-axis detection structure, the Y-axis detection structure and the Z-axis detection structure are tiled in the same layer, so that the space can be saved, and the miniaturized integrated manufacturing of the accelerometer is facilitated.
Description
Technical Field
The invention belongs to the technical field of sensors, and relates to a triaxial accelerometer and sensing equipment comprising the triaxial accelerometer.
Background
The capacitive acceleration sensor can be used for realizing the sensor for measuring the acceleration signal by converting the acceleration signal of the measured object into the variation of the capacitance. Generally, capacitive accelerometers can be classified into comb-tooth type and plate-type, and the principle is that the capacitance signal is further changed by changing the gap between a movable electrode and a fixed electrode when the accelerometer is subjected to acceleration; and C-V conversion is carried out through a rear-end reading circuit, so that the measurement of acceleration signals is realized.
The capacitive accelerometer with the comb tooth structure has high stability, and the triaxial capacitive accelerometer generally adopts a parallel arrangement and integration mode, namely, the sensitive structure of each axis is measured and is independently arranged, the X, Y axis sensitive signal is measured through the comb tooth capacitive structure, and the Z axis sensitive signal is measured through the flat plate capacitive structure.
The MEMS capacitive accelerometer adopts parallel arrangement structures, the process is complex in the manufacturing process, each sensitive structure is required to be provided with a reading circuit, the cost is high, and the arrangement problems are also faced when the circuits are packaged.
In addition, the MEMS capacitive accelerometer comb structure adopts rectangular comb teeth, the front end and the rear end of the comb teeth are the same in size, the problems of uneven etching and the like possibly caused in the processing process are solved, and the original capacitance of the sensitive structure is changed due to thermal expansion of materials in a high-temperature environment, so that measurement errors are caused.
Disclosure of Invention
The present invention relates to a triaxial accelerometer and sensing device comprising such a triaxial accelerometer, which at least solves part of the drawbacks of the prior art.
The invention relates to a triaxial accelerometer, which comprises a basal layer and a sensitive structure layer, wherein the sensitive structure layer comprises a mass frame, an X-axis detection structure, a Y-axis detection structure and a Z-axis detection structure, and the X-axis detection structure, the Y-axis detection structure and the Z-axis detection structure are tiled in the mass frame in the same layer.
As one embodiment, the X-axis detection structures and the Y-axis detection structures are each distributed adjacent to the Z-axis detection structures.
As one of the embodiments, the X-axis detection structure and the Y-axis detection structure each include a movable electrode and a fixed electrode that are in comb teeth fit, wherein the X-axis fixed electrode and the Y-axis fixed electrode are both disposed on an inner frame of the mass frame, and the X-axis movable electrode, the Y-axis movable electrode, and the Z-axis detection structure are all disposed in an in-frame region of the mass frame.
As one embodiment, the Z-axis detection structure includes a mass movably connected to an anchor point of the base layer and configured as a parallel plate capacitance with the base layer.
As one embodiment, the mass is connected to the anchor point of the base layer by a plurality of folded beams.
As one of the embodiments, the Z-axis detection structure further includes a Z-axis fixed electrode and a Z-axis movable electrode that are engaged in a comb, the Z-axis movable electrode being disposed on the periphery of the mass block and the comb arrangement direction being parallel to the X-direction or the Y-direction.
As one embodiment, the Z-axis fixed electrode is adjacent to the X-axis detection structure/Y-axis detection structure and is disposed on the same structural beam.
As one embodiment, the structural beam is a U-beam.
As one implementation mode, the Z-axis fixed electrode and the Z-axis movable electrode are saw-tooth comb teeth electrodes.
The invention also relates to sensing equipment which comprises a packaging shell and a plurality of sensing devices packaged in the packaging shell, wherein at least part of the sensing devices adopt the triaxial accelerometer.
The invention has at least the following beneficial effects:
according to the invention, the X-axis detection structure, the Y-axis detection structure and the Z-axis detection structure are tiled in the same layer, so that the space can be saved, and the miniaturized integrated manufacturing of the accelerometer is facilitated.
In the invention, the X-axis detection structure, the Y-axis detection structure and the Z-axis detection structure are arranged around the same mass frame, so that the structure has high compactness and the space required by the sensor can be further reduced.
The invention further has the following beneficial effects:
according to the invention, the Z-axis detection structure adopts a mode of matching the parallel polar plate capacitor and the comb tooth capacitor, so that the accuracy of Z-axis acceleration measurement can be effectively improved.
The invention further has the following beneficial effects:
in the invention, the Z-axis comb teeth adopt the zigzag comb teeth, compared with the common rectangular comb teeth, the Z-axis comb teeth can cause larger capacitance change, improve the mechanical sensitivity of the accelerometer and have higher sensitivity.
The invention further has the following beneficial effects:
in the invention, the U-shaped beams are used for mounting the X-axis detection structure and the Y-axis detection structure, so that the comprehensive performance of the device can be effectively improved; the folding beam is selected for the installation of the Z-axis detection structure, so that the sensitivity of the device can be effectively improved.
The invention further has the following beneficial effects:
in the invention, only one ASIC circuit is externally connected to measure the triaxial acceleration, so that the cost can be saved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a triaxial accelerometer according to an embodiment of the present invention;
FIG. 2 is a side view of a triaxial accelerometer;
FIG. 3 is a schematic illustration of a three-axis accelerometer fabrication process;
fig. 4 is a schematic structural diagram of a sensing device according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1 and 2, an embodiment of the present invention provides a triaxial accelerometer, including a base layer 200 and a sensitive structure layer 100, where the sensitive structure layer 100 includes a mass frame 11, an X-axis detection structure 12, a Y-axis detection structure 13, and a Z-axis detection structure, and the X-axis detection structure 12, the Y-axis detection structure 13, and the Z-axis detection structure are tiled with the layers and are disposed in the mass frame 11.
In this embodiment, the X-axis detection structure 12, the Y-axis detection structure 13 and the Z-axis detection structure are tiled in the same layer, which can save space and is beneficial to miniaturized integrated manufacturing of the accelerometer.
In one embodiment, the mass frame 11 is attached to an anchor point of the base layer 200.
In one embodiment, as shown in fig. 1, the X-axis detection structure 12 and the Y-axis detection structure 13 are distributed adjacent to the Z-axis detection structure, which can further improve the structural compactness of the sensor.
In one embodiment, the X-axis detecting structure 12 and the Y-axis detecting structure 13 are comb-teeth electrode structures, wherein the X-axis fixed electrode 121 of the X-axis detecting structure 12 and the Y-axis fixed electrode 132 of the Y-axis detecting structure 13 are disposed on the inner frame of the mass frame 11, and the X-axis movable electrode 122 of the X-axis detecting structure 12, the Y-axis movable electrode 131 of the Y-axis detecting structure 13 and the Z-axis detecting structure are disposed in the in-frame region of the mass frame 11.
In one embodiment, the mass frame 11 is a square, and is more preferably a square; the mass frame 11 has two first frames perpendicular to the X-direction and two second frames perpendicular to the Y-direction, the X-axis fixed electrode 121 is disposed on the first frames, and the Y-axis fixed electrode 132 is disposed on the second frames.
The mass frame 11 is used for being matched with the X-axis detection structure 12 and the Y-axis detection structure 13 to realize detection of X-axis acceleration and Y-axis acceleration, and the Z-axis detection structure is arranged in the frame inner area of the mass frame 11, so that the structure is high in compactness and the space required by the sensor can be further reduced.
The X-axis detection structure 12/Y-axis detection structure 13 realizes the measurement of X-axis acceleration/Y-axis acceleration through comb capacitance; taking the measurement of the acceleration of the X axis as an example, the specific principle is as follows: when there is acceleration in the X-axis direction, the X-axis movable electrode 122 moves along the X-axis direction, and at this time, the area between the movable comb teeth and the fixed comb teeth changes, so that the capacitance value of the comb teeth capacitor changes, and further, the measurement of the X-axis acceleration is realized.
In one embodiment, as shown in fig. 1, the Z-axis detection structure includes a mass 15, where the mass 15 is movably connected to an anchor point of the base layer 200 and forms a parallel plate capacitor with the base layer 200. When the Z-axis acceleration exists, the distance between the mass block 15 and the basal layer 200 changes, so that the capacitance value of the parallel polar plate capacitor changes, and the measurement of the Z-axis acceleration is realized.
Further, as shown in fig. 1, the Z-axis detecting structure further includes a Z-axis comb structure 16, the Z-axis comb structure 16 includes a Z-axis fixed electrode 162 and a Z-axis movable electrode 161 in comb-teeth fit, the Z-axis movable electrode 161 is disposed on the periphery of the mass 15 and the comb-teeth arrangement direction is parallel to the X-direction or the Y-direction. Based on the design, on one hand, when detecting the Z-axis acceleration, besides the change of the distance between the mass block 15 and the basal layer 200, the change of the relative distance between the Z-axis movable electrode 161 and the basal layer 200 is also generated, which is equivalent to that the Z-axis movable electrode 161 increases the electrode area of the parallel polar plate capacitor, so that the accuracy of Z-axis acceleration measurement can be improved; on the other hand, the area between the Z-axis movable electrode 161 and the Z-axis fixed electrode 162 also changes, which results in a change in capacitance value of the comb teeth capacitor, so that measurement of the Z-axis acceleration can be realized, and the accuracy of the Z-axis acceleration measurement can be effectively improved by matching with the detection mode of the parallel polar plate capacitor.
In addition, when only the acceleration in the X/Y axis direction occurs, the relative motion in the X direction and the relative motion in the Y direction occur between the Z-axis fixed electrode 162 and the Z-axis movable electrode 161, which can assist in measuring the acceleration in the X axis and the acceleration in the Y axis, that is, increase the logarithm of the capacitance, and further improve the capacitance sensitivity of the acceleration.
Preferably, the mass 15 is connected to the anchor point of the base layer 200 through a plurality of folding beams 18, so as to improve the activity sensitivity of the mass 15 and the Z-axis movable electrode 161, that is, the detection sensitivity of the device.
Preferably, as shown in fig. 1, the mass block 15 is a square block, and more preferably is a square block; the mass 15 is preferably located in the center of the mass frame 11. The mass 15 has two first sides perpendicular to the X-direction and two second sides perpendicular to the Y-direction, and the Z-axis movable electrode 161 may be provided on the first sides or on the second sides.
Preferably, as shown in fig. 1, the Z-axis fixed electrode 162 is adjacent to the X-axis movable electrode 122 and both are disposed on the same structural beam, or the Z-axis fixed electrode 162 is adjacent to the Y-axis movable electrode 131 and both are disposed on the same structural beam. Based on the structure, the structural compactness of the sensor can be effectively improved, and the sensor is miniaturized.
The structural beam is preferably a U-shaped beam 14, so that the comprehensive performance of the device can be effectively improved; meanwhile, the activity sensitivity of the X-axis movable electrode 122 and the Y-axis movable electrode 131 can be improved, namely the detection sensitivity of the device can be improved.
The structural beam may be mounted on the anchor point 17 of the base layer 200 in an cantilever beam structure.
Further, as shown in fig. 1, the Z-axis comb structures 16 have multiple groups, so that the measurement of the Z-axis acceleration signal can be performed simultaneously, thereby effectively improving the measurement accuracy. Wherein a part of the Z-axis fixed electrode 162 is adjacent to the X-axis movable electrode 122, and a part of the Z-axis fixed electrode 162 is adjacent to the Y-axis movable electrode 131; specifically, the Z-axis fixed electrode 162 opposite to the first side is adjacent to the X-axis movable electrode 122, and the Z-axis fixed electrode 162 opposite to the second side is adjacent to the Y-axis movable electrode 131.
In the embodiment shown in fig. 1, the X-axis detection structures 12 have two groups and are distributed oppositely on both sides of the mass 15, and the Y-axis detection structures 13 have two groups and are distributed oppositely on both sides of the mass 15; the Z-axis comb structure 16 has four groups, and two first sides and two second sides are respectively provided with Z-axis movable electrodes 161, wherein two Z-axis fixed electrodes 162 are adjacent to the X-axis movable electrode 122, and the other two Z-axis fixed electrodes 162 are adjacent to the Y-axis movable electrode 131.
In one embodiment, as shown in fig. 1, the Z-axis fixed electrode 162 and the Z-axis movable electrode 161 are both saw-tooth comb electrodes. Compared with the common rectangular comb electrode, the sawtooth-shaped comb electrode can cause larger capacitance change, and the mechanical sensitivity of the accelerometer is improved, so that the accelerometer has higher sensitivity.
The triaxial accelerometer provided by the embodiment can realize the detection of triaxial acceleration by only connecting one ASIC (application specific integrated circuit) circuit (Application SpecificIntegratedCircuit), so that the cost can be saved; correspondingly, the triaxial accelerometer further comprises an ASIC circuit layer, and the sensitive structure layer 100 and the base layer 200 are electrically connected to the ASIC circuit layer respectively. Preferably, the electrical connection between the external ASIC circuit and the triaxial accelerometer is achieved by using TSV technology, and correspondingly, TSV through holes are provided on both the sensitive structure layer 100 and the base layer 200. Alternatively, ASIC circuitry may be integrated on the base layer 200.
As shown in fig. 3, when the triaxial accelerometer is manufactured, the substrate layer 200 and the sensitive structure layer 100 are respectively manufactured, and then bonded, and the target product is obtained after the corresponding thinning treatment.
Example two
An embodiment of the present invention provides a sensing device, which includes a package housing 24 and a plurality of sensing devices encapsulated in the package housing 24, at least some of the sensing devices adopt the triaxial accelerometer provided in the above embodiment one.
Alternatively, a gyroscope may be employed for part of the sensing device in addition to the three-axis accelerometer described above.
In one embodiment, as shown in fig. 4, the sensing device includes a first sensing device 21 and a second sensing device 22, where the first sensing device 21 is the triaxial accelerometer and the second sensing device 22 is a gyroscope; arranged above each other, for example the first sensor means 21 is arranged on top of the second sensor means 22.
The first sensor device 21 and the second sensor device 22 are connected to form an integrated device, and the package housing 24 is used for packaging the integrated device. Wherein, the package housing 24 is provided with a signal pin 241.
In one embodiment, the gyroscope is prepared as follows:
firstly etching a sensitive structure on the wafer A, etching an anchor point on the wafer B, and then bonding two wafers in silicon-silicon mode to obtain the gyroscope sensitive chip.
Preferably, the first sensing device 21 and the second sensing device 22 share one group of ASIC circuits, so that the integration level is high, the number of components can be reduced, the occupied space of the devices can be saved, the wire bonding process can be reduced, the packaging flow can be simplified, and the rapid integrated packaging can be realized; for example, the first sensor device 21 and the second sensor device 22 are electrically connected to the ASIC circuit layer described above, or to the base layer 200 integrated with the ASIC circuit, respectively.
Preferably, the first sensor device 21 and the second sensor device 22 are electrically connected to the ASIC circuit by TSV technology, respectively; in the gyroscope, TSV through holes are etched on two wafers respectively, and wiring etching is performed on the wafer A, so that electrical connection between the sensitive structure and the TSV through holes on the wafer A is achieved.
Further, as shown in fig. 4, the TSV circuit 23 composed of the TSV via on the first sensor device 21 and the TSV via on the second sensor device 22 is connected to the signal pin 241 on the package case 24.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (10)
1. A triaxial accelerometer, includes stratum basale and sensitive structure layer, its characterized in that: the sensitive structure layer comprises a quality frame, an X-axis detection structure, a Y-axis detection structure and a Z-axis detection structure, wherein the X-axis detection structure, the Y-axis detection structure and the Z-axis detection structure are tiled in the quality frame.
2. The triaxial accelerometer according to claim 1, wherein: the X-axis detection structure and the Y-axis detection structure are distributed adjacent to the Z-axis detection structure.
3. The triaxial accelerometer according to claim 1 or 2, wherein: the X-axis detection structure and the Y-axis detection structure comprise movable electrodes and fixed electrodes which are matched with each other through comb teeth, wherein the X-axis fixed electrodes and the Y-axis fixed electrodes are arranged on an inner frame of the mass frame, and the X-axis movable electrodes, the Y-axis movable electrodes and the Z-axis detection structure are arranged in an inner frame area of the mass frame.
4. The triaxial accelerometer according to claim 1, wherein: the Z-axis detection structure comprises a mass block which is movably connected to an anchor point of the basal layer and forms a parallel polar plate capacitor with the basal layer.
5. The triaxial accelerometer according to claim 4, wherein: the mass blocks are connected to anchor points of the base layer through a plurality of folding beams.
6. The triaxial accelerometer according to claim 4, wherein: the Z-axis detection structure further comprises a Z-axis fixed electrode and a Z-axis movable electrode which are matched through comb teeth, wherein the Z-axis movable electrode is arranged on the periphery of the mass block, and the arrangement direction of the comb teeth is parallel to the X direction or the Y direction.
7. The triaxial accelerometer according to claim 6, wherein: the Z-axis fixed electrode is adjacent to the X-axis detection structure/Y-axis detection structure and is arranged on the same structural beam.
8. The triaxial accelerometer according to claim 7, wherein: the structural beam is a U-shaped beam.
9. The triaxial accelerometer according to claim 6, wherein: the Z-axis fixed electrode and the Z-axis movable electrode are saw-tooth comb teeth electrodes.
10. A sensing device comprising an encapsulation housing and a plurality of sensing elements encapsulated within the encapsulation housing, characterized in that: at least part of the sensing device employing a triaxial accelerometer according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310846426.8A CN117031069A (en) | 2023-07-11 | 2023-07-11 | Triaxial accelerometer and sensing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310846426.8A CN117031069A (en) | 2023-07-11 | 2023-07-11 | Triaxial accelerometer and sensing device |
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| Publication Number | Publication Date |
|---|---|
| CN117031069A true CN117031069A (en) | 2023-11-10 |
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|---|---|---|---|
| CN202310846426.8A Pending CN117031069A (en) | 2023-07-11 | 2023-07-11 | Triaxial accelerometer and sensing device |
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| CN (1) | CN117031069A (en) |
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- 2023-07-11 CN CN202310846426.8A patent/CN117031069A/en active Pending
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